sn65dsi83, sn65dsi84, and sn65dsi85 evm user s manual and

1SLLU221–October 2016Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

SN65DSI83, SN65DSI84, and SN65DSI85 EVM User’s Manual andImplementation Guide

User's GuideSLLU221–October 2016

SN65DSI83, SN65DSI84, and SN65DSI85 EVM User’sManual and Implementation Guide

This document describes how to use and configure the SN65DSI83, SN65DSI84, or SN65DSI85 EVM.Hereafter in this document, the SN65DSI83, SN65DSI84, and SN65DSI85 devices may be referred to asSN65DSI8X.

Contents1 Overview ...................................................................................................................... 2

1.1 What are the SN65DSI83, SN65DSI84, and SN65DSI85? ................................................... 21.2 What is the SN65DSI8X EVM? ................................................................................... 21.3 What is Included in the SN65DSI8X EVM? ..................................................................... 31.4 What Does This EVM Look Like? ................................................................................ 3

2 Hardware Description ....................................................................................................... 42.1 Connectors for DSI8X Input Ports ................................................................................ 42.2 Connectors for DSI85 Output Ports .............................................................................. 42.3 I2C .................................................................................................................... 52.4 Enable or Reset ..................................................................................................... 52.5 Power................................................................................................................. 52.6 Backlight Driver ..................................................................................................... 52.7 Reference CLK Programmability ................................................................................. 62.8 DIP Switch Configuration .......................................................................................... 6

3 Quick Start Guide ............................................................................................................ 64 References ................................................................................................................... 75 EVM Schematics............................................................................................................. 8

List of Figures

1 SN65DSI8XEVM ............................................................................................................. 32 SN65DSI8X EVM Block Diagram.......................................................................................... 43 DSI EVM Example Setup ................................................................................................... 74 SN65DSI8X Schematic 1 ................................................................................................... 85 SN65DSI8X Schematic 2 ................................................................................................... 96 SN65DSI8X Schematic 3 ................................................................................................. 107 SN65DSI8X Schematic 4.................................................................................................. 11

List of Tables

1 SN65DSI8X Features Summary........................................................................................... 22 DIP Switch Setting ........................................................................................................... 6

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLLU221

Overview www.ti.com

2 SLLU221–October 2016Submit Documentation Feedback



1 Overview

1.1 What are the SN65DSI83, SN65DSI84, and SN65DSI85?The SN65DSI8X is a MIPI DSI-to-LVDS bridge device that supports video modes in the forward direction.The SN65DSI8X is primarily targeted for portable applications such as tablets and smart phones thatutilize the MIPI DSI video format. Use the SN65DSI8X between a GPU with DSI output and a video panelwith LVDS inputs.

All three devices share the same pin out and package.

Table 1 is a summary of the feature sets on these devices:

Table 1. SN65DSI8X Features Summary

Part Name Description Max ResolutionSN65DSI83 Single-channel DSI to single-link LVDS Suitable 1366×768/1280×60 fps at 24 bpp/18 bppSN65DSI84 Single-channel DSI to two single-link LVDS 1920×1200 60 fps at 24 bpp/18 bppSN65DSI85 Dual-channel DSI to two single-link LVDS 2560×1600 60 fps, 1920×1080p 120 fps at 24 bpp /18 bpp

NOTE: Each DSI channel has 4 DSI data lanes + 1 CLK lane. Each LVDS link has 4 data lanes + 1CLK lane.

1.2 What is the SN65DSI8X EVM?The SN65DSI8X EVM is a PCB created to help customers implementing SN65DSI83, SN65DSI84, andSN65DSI85 in system hardware. This EVM can be used as a hardware reference design for anyimplementation using the SN65DSI8X. The SN65DSI8X EVM is designed for use across all three versionsof the DSI bridge devices - SN65DSI83, SN65DSI84, and SN65DSI85. PCB design and layout files areprovided upon request to aid PCB design with a SN65DSI8X component. The layout files are used as aguideline to implement the SN65DSI8X with illustrations of the routing and placement rules. Please notethat the EVM design includes test components to evaluate the SN65DSI8X which may not applicable forproduction.

This EVM includes on-board connectors for DSI input and LVDS output signals. These connectorsconnect MIPI DPHY-compliant DSI source and LVDS panels to the EVM. Refer to Section 2.1 andSection 2.2 for more information on the connectors.

CAUTIONA custom translator cable or card is required if this EVM is to be utilized for theevaluation of an implementation from the customer. Any other method ofconnecting to any DSI source or LVDS panel is not supported by this EVM. TIis not responsible for any issues or problems that may occur as a result ofusing connection methods other than what is recommended in this document.

NOTE: Some portions and components in the EVM or in this document may include the referencesto SN65DSI85 instead of addressing all three part numbers. The SN65DSI85 is replaceablewith SN65DSI83 or SN65DSI84.

http://www.ti.com


www.ti.com Overview




1.3 What is Included in the SN65DSI8X EVM?The major components of the EVM follow:• SN65DSI83, SN65DSI84, or SN65DSI85• Backlight driver via J2 and J5• Samtec QSH-type connectors on DSI and LVDS interfaces• Hirose-type connector on DSI Ch A interface• IPEX-type connectors on LVDS interfaces• I2C programming interface for external I2C host connection

1.4 What Does This EVM Look Like?Figure 1 illustrates the EVM.

Figure 1. SN65DSI8XEVM

http://www.ti.com


5V

3.3V

1.8V

9V

DSI85

DSI85 Input LVDS Output

I2C Logic Reset Logic

Backlight Driver

CDC -Optional RefCLKgeneration

HiroseFX Conn

SMA/Samtec

OR

DSI_CHA_CLK

DSI_CHB_CLK

DSI_CHA_DATAP/N[3:0]

DSI_CHB_DATAP/N[3:0]

LVDS_CHA_CLK

LVDS_CHB_CLK

LVDS_CHA_DATAP/N[3:0]

LVDS_CHB_DATAP/N[3:0]

I-PEX20455

SMA/Samtec

OR

Ref_CLK IN

Page 2

Page 3Page 3

Page 3,5

Page 5

Page 4

Page 4


Hardware Description www.ti.com




2 Hardware DescriptionFigure 2 shows the EVM block diagram.

Figure 2. SN65DSI8X EVM Block Diagram

2.1 Connectors for DSI8X Input PortsThe EVM has two input options for DSI video. If a custom breakout board is to be designed using theseoptions, a schematic and an allegro PCB symbol for either connector is provided by TI upon request.(A) J4 - Samtec QSH-type connector (P/N QSH-020-01-H-D-DP-A)

J4 is a Samtec QSH-type connector that can be mated with a matching QTH-type connector on thetop. It provides DSI input connections to both DSI Ch A and Ch B signals. It also provides access toI2C and other miscellaneous signals such as IRQ. XC connections are open vias just in case there is aneed for connection to other signals. The mating connector part number is QTH-020-01-H-D-DP-A. Foran SMA-type connection, use the Samtec HDR-128291-XX breakout board. The HDR-128291-XX is abreakout board with a mating connector to J4 and standard SMA male connectors via cables. Moreinformation on this breakout board is provided upon request.

(B) J1 – Hirose FX-type connector (P/N FX6A-40S-0.8SV2)J1 is a Hirose FX-type connector that can be mated with a matching FX plug on the top. The partnumber for the mating connector is FX6A-40P-0.8SV2. J1 provides DSI input connection only to theDSI Ch A signals. It also provides access to I2C and other miscellaneous signals such as IRQ.

2.2 Connectors for DSI85 Output PortsThere are two output port options available on the EVM for the LVDS output signals. If a custom breakoutboard is to be designed using these options, a schematic and an allegro PCB symbol for either connectorcan be provided by TI.(A) J6 - Samtec QSH-type connector (P/N QSH-020-01-H-D-DP-A)

J6 is a Samtec QSH-type connector that can be mated with a matching QTH-type connector on thetop. It provides DSI input connections to both LVDS Ch A and Ch B signals. It also provides access to

http://www.ti.com


www.ti.com Hardware Description




the backlight power and its related signals. XC connections are open vias, in case there is a need toconnect to other signals. The mating connector part number is QTH-020-01-H-D-DP-A. For an SMA-type connection, use the Samtec HDR-128291-XX breakout board. The HDR-128291-XX is a breakoutboard with a mating connector to J6 and standard SMA male connectors via cables. More informationon this breakout board is provided upon request.

(B) J2 and J5 – I-PEX-type connectors (P/N 20455-040E-12)J2 and J5 are I-PEX connectors widely used in LCD video panels with LVDS receivers. Connect J2and J5 via an SGC-type cable with one-to-one pin mapping to a panel using the I-PEX20455-040E-12connectors. J2 connects to the LVDS Ch A signals while J5 connects to the LVDS CHB signals.

2.3 I2CAccess to I2C signals are provided via DSI input connectors J1 and J4 (as mentioned in Section 2.1) orJ10. Note that I2C signal levels should be at 1.8 V when the I2C interface is accessed through connectorsJ1 or J4. A 3.3-V to 1.8-V voltage translation is provided when an I2C host is connected through J10.

A stand-alone external I2C host can be connected via J10 to debug.

2.4 Enable or ResetThere are three device enable or reset options to use with the EVM:(A) Supervisor circuitry option

This is a default configuration. The enable (EN) signal is held low until the power good (PG) from the1.8-V voltage regulator reaches a stable high voltage level, then it is released high.

(B) RC timing optionThe C10 external capacitor and internal resistor are used to control the EN ramp time after the deviceis powered on. C10 is a DNI (Do Not Install option), by default. C10 needs to be installed and R52needs to be uninstalled to enable this option.

(C) External control optionA push button (SW1) or a DIP switch (SW2.3) is available for the manual control of the EN signal.Install R64 to enable the DIP switch option.

2.5 PowerA 5- to 6-V power supply will operate the SN65DSI8X EVM. A plug to accept a 5- to 6-V wall poweradapter is provided on the EVM (J13). The jumper on position 1-2 of J15 should be placed while J14 isleft open. This should be the default configuration when the board is shipped.The EVM is designed to accommodate up to maximum of 1.5 A current. The current consumption ofthe board without backlight driver enabled is about 70 mA + SN65DSI85 device power. TheSN65DSI85 consumes about 50 mA at power on, approximately 80 mA to approximately 200 mA,depending on the system configuration. The total power consumption of the board could varydepending on LCD panels when the on-board backlight driver is used. When an LCD panel consumesmore current than 1.5 A minus 70 mA + SN65DSI85 device power, an external backlight source shouldbe used.

NOTE: Do not plug in any power source higher than the configured voltage (5 V or 6 V).

2.6 Backlight DriverThe SN65DSI8X EVM incorporates the LED backlight driver circuitry using the TI backlight driver deviceTPS61181A enabling use of the on-board backlight driver source. The default configuration of the EVMenables the on-board backlight driver.

If the external backlight driver is used, a connection is available via J3. Uninstall FB6 if external backlightdriver is used.

http://www.ti.com


Hardware Description www.ti.com




2.7 Reference CLK ProgrammabilityThe SN65DSI8X EVM incorporates a programmable CLK circuitry using a TI-programmable device,CDCEL913. The output of the CDCEL913 is connected to the reference CLK of the SN65DSI8X. Thedefault frequency of the reference CLK is 27 MHz. The CLK can be programmed via I2C signals broughtout to on-board connectors J9, J12, or J10. When J10 is used, place jumpers on J9 and J12. Thereference CLK can be pre-programmed to a desired value, if requested prior to shipping.

2.8 DIP Switch ConfigurationA DIP switch is provided to operate the device or EVM in different configurations. When the switch is in anopen position, the corresponding signal is tied high. When the switch is in the ON (closed) position, thecorresponding signal is tied to GND.

The signals in the greyed out region are not enabled unless a corresponding resistor is installed.

Table 2. DIP Switch Setting

DIP SW No Signal Name DescriptionDefault Configuration

Open(Off)HIGH

Closed(On)LOW

SW2-1 DIP1 – Dimming CTRL orLED_BKLT_EN

Controls LED backlight driver enable in defaultconfiguration.Installing R100 and uninstalling R63 enablescontrol on dimming control of the backlightdriver.Always switch back to closed (ON) positionprior to unplug or plug operation of the panel.

x

SW2-2 I2C_3V3EN Enables 3.3-V voltage translator for the I2Csignals x

SW2-3 BRD_RSTN Controls the EN/RESET signal of theSN65DSI8X high or low x

SW2-4 RSVD1 Reserved xSW2-5 RSVD2 Reserved x

SW2-6 ADDR Controls the ADDR signal of the SN65DSI8Xhigh or low x

SW2-7 PWMIN Controls the PWMIN of J6 high or low x

SW2-8 LED_EN

Controls the LED_EN of J2 or J5 high or lowThis switch should be toggled high to enablethe LED of the connected panel.Always switch back to closed (ON) positionprior to unplug or plug operation of the panel.

x

3 Quick Start GuideQuick-start instructions are provided in the following list:1. Plug in a DSI source to J42. Plug in a LVDS video sink device on J2, J5 or J63. Plug in an I2C host on J10 if an external I2C host is used.4. Make sure the DIP switch setting is in a correct configuration.5. Apply power to the EVM. The following LEDs should light up: D3, D6, and D7. D1 may light up

depending on the configuration.6. Start video streaming on the DSI input7. Configure the device for the desired mode of operation via I2C. Video output should be observed after

configuration is complete.

http://www.ti.com


www.ti.com References




Figure 3 depicts the setup using an external I2C host, Samtec-to-SMA breakout board (HDR-128291-XX)for DSI ChA input and a 1024×600 video panel over an I-PEX connector.

Figure 3. DSI EVM Example Setup

4 References1. SN65DSI8X Datasheets (SN65DSI83 SLLSEC1), (SN65DSI84 SLLSEC2), (SN65DSI85 SLLSEB9)

http://www.ti.com


http://www.ti.com/lit/pdf/SLLSEC1

http://www.ti.com/lit/pdf/SLLSEC2

http://www.ti.com/lit/pdf/SLLSEB9

LEAVEUNCONNECTEDFOR NORMALOPERATION

ADDR = 1, Slave Addr = 0x2DADDR = 0, Slave Addr = 0x2C

Reset(EN) can be implemented with passivecomponents as shown or active circuitry. Incase of using passive components, thevalues of the RC circuitry need to beadjusted to make sure the low to hightransition occurs after the Vcc supply hasreached the minimum recommendedoperating voltage. For this reason, it isrecommended to USE ACTIVE CIRCUITRY forbetter control of the RESET/EN timing.

DSI INPUT LVDS OUTPUT

Optional ref CLKfor LVDS PixelCLK

25MHz-154MHz

1uF is min value.

The number of capacitors and their values may vary depending on the system implementation

R5: Terminate to GNDwith a pull-downresistor if unused

0.2uF

SN65DSI85

Reset Implementation

Note: Bypass caps and FBshould be placed near U1SN65DSI85.

*IMPORTANT*If REFCLK is to beused, the CLK tracelength between theREFCLK terminal andthe source of the REFCLK(OSC or Xtal)should be kept as shortas possble.

IRQSilkScreen:

SilkScreen: IRQ

SilkScreen: REF_CLK

DSI_A0PDSI_A0N

DSI_A1NDSI_A2PDSI_A2NDSI_A3PDSI_A3NDSI_ACLKPDSI_ACLKN

DSI_A1P

FlatChA_Y0NFlatChA_Y0P

FlatChA_Y1PFlatChA_Y2NFlatChA_Y2PFlatChA_Y3NFlatChA_Y3PFlatChA_YCLKNFlatChA_YCLKP

FlatChA_Y1N

ADDR

Test1Test2

BOARD_RESETN

IRQ

DSI_B0PDSI_B0N

DSI_B1NDSI_B2PDSI_B2NDSI_B3PDSI_B3NDSI_BCLKPDSI_BCLKN

DSI_B1PFlatChB_Y0PFlatChB_Y0N

FlatChB_Y1PFlatChB_Y2NFlatChB_Y2PFlatChB_Y3NFlatChB_Y3PFlatChB_YCLKNFlatChB_YCLKP

FlatChB_Y1N

I2C_SCLI2C_SDA

BOARD_RESETN

Vcore_1P1_Out

IRQ_LEDIRQ IRQ_OUT

REFCLK

EXT_REFCLK

Vcc_1P8V

BOARD_1P8V

BOARD_1P8V BOARD_1P8V

Vcc_1P8V


DSI_A0Ppg3DSI_A0Npg3DSI_A1Ppg3DSI_A1Npg3DSI_A2Ppg3DSI_A2Npg3DSI_A3Ppg3DSI_A3Npg3DSI_ACLKPpg3DSI_ACLKNpg3

DSI_B0Ppg3DSI_B0Npg3DSI_B1Ppg3DSI_B1Npg3DSI_B2Ppg3DSI_B2Npg3DSI_B3Ppg3DSI_B3Npg3DSI_BCLKPpg3DSI_BCLKNpg3

I2C_SCL pg3,4I2C_SDA pg3,4

LVDS_RefCLK pg4

FlatChA_Y0N pg3FlatChA_Y0P pg3FlatChA_Y1N pg3FlatChA_Y1P pg3FlatChA_Y2N pg3FlatChA_Y2P pg3FlatChA_Y3N pg3FlatChA_Y3P pg3FlatChA_CLKN pg3FlatChA_CLKP pg3

FlatChB_Y0N pg3FlatChB_Y0P pg3FlatChB_Y1N pg3FlatChB_Y1P pg3FlatChB_Y2N pg3FlatChB_Y2P pg3FlatChB_Y3N pg3FlatChB_Y3P pg3FlatChB_CLKN pg3FlatChB_CLKP pg3

BOARD_RESETNpg2,3,4

BOARD_RESETNpg2,3,4

ADDRpg4

IRQ pg3Test1pg4Test2pg4

R4

4.7K

R32

DNI

J17HDR2X1 M .1

12

C111uF

C110uF

R1

0

C5

10000pF

TP1

T POINT S

C2

1.0uF

R5

10K

C3

10000pF

D1

LED Orange 0805

C7

10000pF

U1

SN65DSI85

DA0PH3

DA1PH4

DA2PH6

DA3PH7

DACPH5

DB0PC2

DB1PD2

DB2PF2

DB3PG2

DBCPE2

DA0NJ3

DA1NJ4

DA2NJ6

DA3NJ7

DACNJ5

DB0NC1

DB1ND1

DB2NF1

DB3NG1

DBCNE1

A_Y0NC9

A_Y1ND9

A_Y2NE9

A_Y3NG9

A_CLKNF9

A_Y0PC8

A_Y1PD8

A_Y2PE8

A_Y3PG8

A_CLKPF8

B_Y0NA3

B_Y0PB3

B_Y1NA4

B_Y1PB4

B_Y2NA5

B_Y2PB5

B_Y3NA7

B_Y3PB7

B_CLKNA6

B_CLKPB6

ADDRA1

SDAJ1SCLH1

ENB1

TEST2B2 TEST1H8

REFCLKH2

IRQJ9

Vcc

A9

Vcc

B8

Vcc

D6

Vcc

E6

Vcc

F6

Vcc

J2

Vcc

E5

GN

DB

9

GN

DA

8

GN

DA

2

GN

DD

5

GN

DE

4

GN

DF

4

GN

DF

5

GN

DH

9

Vcore

J8

C6

0.1uF

R2

348

LP3

LP2LP1

FB1

220 @ 100MHZC4

0.1uF

C9

0.1uF

C8

0.1uF

R33 0

R3

4.7K

C10

DNI

U2SN74LVC1G07DCK

2

35

4

1


EVM Schematics www.ti.com




5 EVM SchematicsFigure 4 through Figure 7 illustrate the EVM schematics.

Figure 4. SN65DSI8X Schematic 1

http://www.ti.com


NOTE:This connector is to interface DSIA Chusing FX64-40P-0.8SV Type plug.

DSI ChA DisplayExpansion Connector

BOTTOM VIEW

NOTE:- Remove R6-R15 for DSI source connected to J4- Populate R6-R15 when a source connected through J1**R6 - R15 to be placed as near as J4 to avoid stub when J1 is not in use**

WARNING20455-040E-12 has nopin1 datum mark.20455-040E-0X seriesis same connectorwith pin1 datum mark,however the datummark is on theopposite end of wherepin 1 is.

Note: This header is for supplying backlightpowerto flat panels with LED backlight. The pinoutmathces the connector definition of the backlight driver TPS61181 EVM.

Samtec to SMA Connector for DSIA and DSIB

NOTE:This connector is to interface DSI interfacewith any source with SMA connectors viaSamtec to SMA cable

Samtec to SMA Connector for Flatlink

NOTE:This connector is to interfaceFlatlink LVDS interfaceto LCDPanels via breakout boards withFlatlink LCD panel connector

Note: Bypasscaps.

Note: Bypasscaps.

Note: Bypasscaps

Note: Bypasscaps.

I-PEX 20455 Flatpanel Connectors

Flat ChASilkScreen:

Flat ChBSilkScreen:

TE

Timer_PWM

GPIO

PWM1FX_CLKPFX_CLKN

FX_P0FX_N0

FX_P1FX_N1

FX_P2FX_N2

FX_P3FX_N3

BL_PWR

IFB1IFB2IFB3

S_PWMIN

FlatA_20455_YP1FlatA_20455_YN1

FlatA_20455_YP2FlatA_20455_YN2

FlatA_20455_CLKPFlatA_20455_CLKN

FlatA_20455_YN3FlatA_20455_YP3

FlatA_20455_YP0FlatA_20455_YN0FlatChA_Y0N

FlatChA_Y0P



FlatChA_CLKNFlatChA_CLKP


IFB6IFB4IFB2

BL_PWR

IFB5IFB3IFB1

BL_PWR BL_PWR

LED_EN

LED_EN

BL_PWR

IFB4IFB5IFB6

S_PWMIN

FlatB_20455_YP1FlatB_20455_YN1

FlatB_20455_YN2

FlatB_20455_CLKPFlatB_20455_CLKN

FlatB_20455_YP3

FlatB_20455_YP0FlatB_20455_YN0FlatChB_Y0N

FlatChB_Y0P

FlatChB_Y1NFlatChB_Y1P


FlatChB_CLKNFlatChB_CLKP


FlatB_20455_YN3

FlatB_20455_YP2

S_PWMIN

IFB6IFB5IFB4IFB3IFB2IFB1

BL_PWR

LED_ENS_PWMIN

J6_3P3VJ6_26

BOARD_3P3V

Panel_3P3V

BOARD_3P3V

Panel_3P3V

Panel_3P3V

I2C_SCL pg2,3,4I2C_SDA pg2,3,4

IRQ pg2,3

LED_ENpg3,4

IFB1 pg5IFB3 pg5IFB5 pg5

BL_PWRpg5

IFB2pg5IFB4pg5IFB6pg5

S_PWMINpg4

LED_ENpg3,4

DSI_ACLKPpg2,3DSI_ACLKNpg2,3

DSI_A0Ppg2,3DSI_A0Npg2,3




FlatChA_Y1N pg2FlatChA_Y1P pg2FlatChA_Y2N pg2FlatChA_Y2P pg2

FlatChA_CLKN pg2FlatChA_CLKP pg2

FlatChA_Y3N pg2FlatChA_Y3P pg2

FlatChA_Y0N pg2FlatChA_Y0P pg2

FlatChB_Y0Npg2FlatChB_Y0Ppg2FlatChB_Y1Npg2FlatChB_Y1Ppg2FlatChB_Y2Npg2FlatChB_Y2Ppg2

FlatChB_CLKNpg2FlatChB_CLKPpg2

FlatChB_Y3Npg2FlatChB_Y3Ppg2

IRQpg2,3I2C_SCLpg2,3,4

DSI_B0Ppg2DSI_B0Npg2


DSI_BCLKPpg2DSI_BCLKNpg2



DSI_A3P pg2,3DSI_A3N pg2,3


DSI_ACLKP pg2,3DSI_ACLKN pg2,3



I2C_SDA pg2,3,4

BOARD_RESETN pg2,4

XC7

C12100uF

R43 0

TOP

J6 QSH-020-01

13579111315171921232527293133353739

2468

10121416182022242628303234363840

G1

G2

G3

G4

R70 0

R17 0

R25 0

R28 0

R30 DNI

R18 0

C13

1.0uF

R42 0

R120

XC11

C14

0.1uF

XC1

R45 0

FB2

220 @ 100MHZ

C21

DNI

R19 0R14

0

R27 DNI

R31

0

J1FX6A-40S-0.8SV2(71)

13579

111315171921232527293133353739

246810121416182022242628303234363840

J5

I-PEX 20455-040E-12

12345678910111213141516171819202122232425262728293031323334353637383940

GND1

GN

D3

GND2 GN

D4

R39 0

XC6

XC9

R20 0

R46 0

R80

XC12

C20

DNI

R50 0

J3

HEADER 7X2 100mil Thru-hole

2468

101214

135791113

R21 0

R130

C18

1.0uF

R40 0

R47 0

R150

C19

0.1uF

R49 DNI

R110

TOP

J4 QSH-020-01

13579111315171921232527293133353739

2468

10121416182022242628303234363840

G1

G2

G3

G4 C17

100uF

R22 0

C16

DNI

XC4

R41 0

R48 0

R23 0

FB3

220 @ 100MHZ

R60

R16DNI

R29 0

XC2

R90

C15

DNI

R44 0

R24 0

R70

XC3

XC5

R100

XC8

J2

I-PEX 20455-040E-12

12345678910111213141516171819202122232425262728293031323334353637383940

GND1

GN

D3

GND2 GN

D4

R26 0


www.ti.com EVM Schematics





http://www.ti.com


RESET

RESET

ADDR

PWMIN

LED_EN

BRD_RSTN

DIP1

I2C_3V3EN

CDC

I2C

DIPSW

SilkScreen:

CDC_S0

CDC_S1

CDC_S2

SilkScreen:

SilkScreen: I2C

CDC_SDA_ON

CDC_SCL_ON

NOTE:SHUNT on CDC_SDA and CDC_SCL pin1 and 2 if external I2C hostvia J10 for I2C programming of CDC device

SilkScreen:

TEST1

TEST2

ADDR

PWMIN

LED_EN

BRD_RSTN

SilkScreen:

DIP1

LED_BKLT_EN

Dim_CTRL

GND

SilkScreen: GND

GNDSilkScreen:

CDC_VDD

CDC_Y3

CDC_S0

CDC_XIN

CDC_Y1

CDC_S1_SDA

CDC_XOUT

CDC_S2_SCL

CDC_Y2

RESET#

CT

BRD_RST_DIPTEST1_DIP

A1_SDA

I2C_3V3EN

GND

I2C_SCL_3P3VI2C_SDA_3P3V

BOARD_RESETN

ADDR_DIPTEST2_DIP

I2C_3V3EN

I2C_SDA

I2C_SCL

GP_DIP

BOARD_RESETN

A1_SCL

LED_EN

LED_BKLT_EN

DimmingCTRLGP_DIPBOARD_RESETN

ADDR

S_PWMIN

CDC_CLKY2

CDC_CLKY3

BOARD_1P8V

BOARD_1P8V

BOARD_1P8V

BOARD_1P8VBOARD_1P8V




BOARD_1P8V

LVDS_RefCLK pg2

PGpg5

BOARD_RESETNpg2,3

LED_ENpg3

I2C_SDA pg2,3I2C_SCL pg2,3

ADDRpg2S_PWMINpg3

TEST2pg2TEST1pg2

DimmingCTRLpg5

LED_BKLT_ENpg5

N.O.

SW1PB_SWITCH

12

43

R544.7K

R574.7K

J16

HEADER 1x10

12345678910

R65 DNI

J12

HDR3X1 M .1

1 2 3

R77

4.7K

R74

10K

R63 0

U6

txs0102dcut

OE6

GND2

A24A15

VCCB7

VCCA3

B21 B18

R71 0

XC10

J10

Header 5x2 0.1" thru-hole

246810

13579

J9

HDR3X1 M .1

1 2 3

J8

HDR2X1 M .1

1 2

U5

CDCEL913PW

XIN_CLK1

S02

VDD3

VCTR4

GN

D5

VDDOUT6

VDDOUT7

Y38

Y29

GN

D1

0

Y111

S2_SCL12 S1_SDA13

XOUT14

C2722uF

R37 DNI

C24

18pF

R72

10K

R594.7K

J11

HDR2X1 M .1

1 2

R520

C55

DNI

C30

0.1uFR73

10K

C32

0.1uF

R64 DNI

XC13

R78

4.7K

R76 0

C33

0.1uF

C31

0.1uF

R614.7K

FB4

220 @ 100MHZ

R66

DNI

R62 DNI

R75 0

C26

DNI

R51

DNI

J7

HDR2X1 M .1

1 2

C25

DNI

R67 18

R604.7K

C29

0.1uF

R53

1K

R584.7K

Vc c

U4SN74LVC1G08DCK

1

24

5

3

U3

TPS3808TPS3808g18DBVT

RESET#1

GND2

MR#3

CT4SENSE5VDD6

R68 18

Y127MHZ _crystal

R564.7K

C22

220pF

R554.7K

C23

0.1uF

SW28-POS 50-MIL SMT

TDA08H0SK1RC&K (ITT-CANNON)

12345678

161514131211109

R69 18C28

1.0uF


EVM Schematics www.ti.com





http://www.ti.com


1.8V REGULATOR

3.3V REGULATOR

9VSilkScreen:

0.01uF

9V

SilkScreen:

5V

NOTE:DO NOT INSTALL.DO NOT USE 9V when Jumper in 2-3 position.

NOTE:WHEN INSTALLED DO NOT INSTALL J15 Power selection header

DNI

SilkScreen:

9V_DIS

NOTE:Tie to 'LOW' if external backlight driver used.

NOTE:DimmingCTRL set to 'LOW' for default config.

GND GND

GND GND

NOTE:Remove FB6 for external power option.Vin = '5V-24V'

5V REGULATOR

Backlight Driver

SilkScreen:

SilkScreen:

SilkScreen:

SilkScreen:

SilkScreen: BKTLGT 5-24V

Power Selection Hdr

NOTE:DNI if external backlight driver used.

3P3VSilkScreen:

1P8VSilkScreen:

3P3VSilkScreen:

5VSilkScreen:

SilkScreen: ON OFF

PG1P8

EN1P8

SS1P8

FB_1PT8V

PGPG3P3

EN3P3

SS3P3

FB_3PT3VLE

D9V

BKLT_FLT

Q1_pin2EXT_BKLT_9V BL_PWR

BKLT_VBAT

BKLT_SW

BKLT_CIN

BKLT_ISET

BKLT_IFB6BKLT_IFB5BKLT_IFB4BKLT_IFB3BKLT_IFB2BKLT_IFB1

5V_AJD

9V_DIODE

EN5V

PG

PWRIN_SW

PG

BOARD_1P8V

BOARD_3P3V

BOARD_5V

BOARD_3P3V

PWR_IN

BOARD_9V

BOARD_5V

PWR_INBOARD_9V BOARD_5V

BOARD_9V BOARD_5V

PWR_IN BOARD_9V

BOARD_1P8V

PG pg4

DimmingCTRLpg4

LED_BKLT_ENpg4

BL_PWR pg3

IFB1 pg3IFB2 pg3IFB3 pg3IFB4 pg3IFB5 pg3IFB6 pg3

R36348

R96 DNI

C48

DNI

U9

TPS74201RGWT

OUT1

NC

2

NC

3

NC

4

IN5

IN6

IN7

IN8

PG9

BIAS10

EN11

GN

D1

2

NC

13

NC

14

SS15

FB16

NC

17

OUT18OUT19OUT20

PA

D2

1

LP5

R9251

R841.15K

C34

DNI

J14HDR2X1 M .1

12

C41

DNI

C43

10000pF

FB6

220 @ 100MHZ

R80 0

R38 DNI

D5FYV0704S

13

2

C3810uF

C4610uF

C4210uF

R81500

SW3TS01CQE

1 2 3

LP6

C3910uF

R8337.4K

R95 DNI

T

S

J13

2.1mm x 5.5mm

1

23

LP7

R9362K

C494.7uF25V

J15

HDR3X1 M .1

123

C52DNI

R86

4.7K

LP4

D2

10V, 3A

12

R98 DNI

U8

TPS74201RGWT

OUT1

NC

2

NC

3

NC

4

IN5

IN6

IN7

IN8

PG9

BIAS10

EN11

GN

D1

2

NC

13

NC

14

SS15

FB16

NC

17

OUT18OUT19OUT20

PA

D2

1

C540.1uF

R893.57K

D4

B150

1 2

R35150

Q1Si8409DB

1

243

C504.7uF

50V

L1

10uHTP5

T POINT S

U10

TPS61181A-QFN16

PGND1

SW2

VBAT3

VO4

ISET5

CIN6

IFB17IFB28IFB39

GND10

DCTRL11

IFB412IFB513IFB614

EN15

FLT16

PAD17

C3722uF

C531uF

C401uF

FB5

DNI

R94 DNI

R8513K

U7

REG104-A

Vin1

Vout2

GND3

NR/Adjust4

Enable5

GND6

C4510uF

R88 0

C510.1uF

C3510uF

D6

LED RED

TP3

T POINT S

D7

LED YLW

R79

4.7K

R97 DNI

R823.57K

D3

LED Green

R87

4.7K

TP4

T POINT S

R3410K

C47

10000pF

C44

DNI

R902.87K

C3622uF

R91100K


www.ti.com EVM Schematics





http://www.ti.com


STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including demonstration software, components, and/or documentation

which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the termsand conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

SPACER

SPACER

SPACER

SPACER

SPACER

http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page


【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER




SPACER6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated

spacer

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated

http://www.ti.com/audio

http://www.ti.com/automotive

http://amplifier.ti.com

http://www.ti.com/communications

http://dataconverter.ti.com

http://www.ti.com/computers

http://www.dlp.com

http://www.ti.com/consumer-apps

http://dsp.ti.com

http://www.ti.com/energy

http://www.ti.com/clocks

http://www.ti.com/industrial

http://interface.ti.com

http://www.ti.com/medical

http://logic.ti.com

http://www.ti.com/security

http://power.ti.com

http://www.ti.com/space-avionics-defense

http://microcontroller.ti.com

http://www.ti.com/video

http://www.ti-rfid.com

http://www.ti.com/omap

http://e2e.ti.com

http://www.ti.com/wirelessconnectivity

sn65dsi83, sn65dsi84, and sn65dsi85 evm user s manual and

Documents