SKiN TechnologyNew packaging technologyNo wire bonds, thermal paste or solder

Standard Technology Wire bond-free

Wire bond-free

Wire bonds replaced by sintered SKiN flex layerDouble-sided chip sintering for excellent thermal and electrical chip characteristicsContinuous sinter layer on top of chips → 25% higher surge currents than with wire bonds

SKiN Technology

Wire bonds

Soldered

Wire bond-free

Solder-free

Standard Technology

5/6/2011 2

Thermal paste-free

30% lower thermal resistance at 0.65 K/WIncreased thermal conductivity results in improved chip cooling and higher inverter currentThermal paste replaced by sinter layer between DCB and heat sink

SKiN Technology

Chip + DCB

Thermal paste

Cooling

0.25

0.25

0.35

Standard Technology Rth[j-a] [K/W]0.85 0.65

0.28

0.37Heat dissipation @ 81mm2 chip size 95W 125W

5/6/2011 3

Current density doubled – 3.0 A/cm2

3 MW inverter 2200 Arms per phaseCompact integration of driver, protection, interfaces, snubbers and semiconductors in SKiN Technology

1.5 A/cm2Module based unit

3.0 A/cm2SKiN based unit

5/6/2011 4

10 x higher power cycling

10 x higher power cycling compared to standard modulesExpected life time: 20 yearsHigh chip junction temperatures ≥ 200 C for SiC and GaN can be exploited thanks to sinter technology

Power cycles to failure

SKiN Technology

Standard Technology

10x higher

2.000.000

200.000

∆Tj [K], Tj,max = 150 C30 40 50 60 70 80 90 100 110 120 130

100.000

1.000.000

5/6/2011 5

For 35% smaller inverters

Wind power

3 MW 4-quadrant inverter, low-voltage Compact integration of driver, fiber optic interfaces, DC-link, capacitors, liquid cooling and power semiconductors in SKiN Technology

Automotive

90 kW in 5.5 l, liquid-cooled8.5 kg, IP6K9K protectionCompact integration of 3-phase IGBT inverter, DC-DC converter, cooling, controller, DC-link and capacitors

5/6/2011 6

Technological evolution

Soldertechnology

1974 1992 1996 2007 2011

Spring contacts

Replaced solder pins

Provides electrical connection to the controller

100% solder-free

Sinter layer between DCB and chip

Replaces solder layers

Sintered SKiN flex layer

Replaces wire bonds and thermal paste

Double-sided chip sintering

Pressure contact technology

Reduced numberof solder layers.

No copper base plate needed

Standard technology

Solder pins and screw terminals

5/6/2011 7

Packaging

The SKiN flex layer replaces the bond wires

Chips are sintered on chip upper and underside

The thermal paste layer is replaced by a sinter layer

Terminals are sintered to the DBC

5/6/2011 8

Flat integration

Interface to driver / controller via the SKiN flex layer welded on the PCB side by sideExample showing flat, sintered terminals

5/6/2011 9

Flexible integration

The connections are flexible and can be bent upwardsThe driver / controller can be placed on the upper above the SKiN flex layer

5/6/2011 10

3D integration

Future integration of driver and protection functions on the upper of the SKiN flex layer possible Advantage: optimum switching control owing to close location of driver and IGBT

5/6/2011 11

Wire bond-free

Thank you