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SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS

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Page 1: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY

CREATING TOMORROW’S SOLUTIONS

Page 2: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

2

Thixotropic low-temperature

gel, specified ion content

Long pot life,

specified ion content

Thixotropic,

specified ion content,

low bleeding,

controlled volatility

Opaque,

distinct tackiness,

good damping properties,

specified ion content

High transparency, pressure-

sensitive primerless adhesion,

good damping properties

High transparency, pressure-

sensitive primerless adhesion,

good damping properties

Very soft

Distinct tackiness,

good damping properties

High transparency,

distinct tackiness,

good damping properties

Transparent,

rapid curing,

good damping properties,

low risk of inhibition

Tough silicone gel

2-Part Addition-Curing

SEMICOSIL® 900 LT

SEMICOSIL® 905

SEMICOSIL® 911

SEMICOSIL® 913

SEMICOSIL® 921

SEMICOSIL® 9212

WACKER SilGel 610

WACKER SilGel 611

white

WACKER SilGel 612

WACKER SilGel 612 EH

WACKER SilGel 614

Transparent

Brownish

Transparent

Black

Transparent

Transparent

Transparent

White

Transparent

Brownish

Transparent

1.00

0.96

1.00

0.97

0.97

0.97

0.96

0.96

0.96

0.96

0.96

15,000

200

8,500

1,000

700

700

7,000

1,000

1,000

1,000

7,000

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

2 h

6 h

1 h

45 min

90 min

8 h

1 h

50 min

2.5 h

30 min

1 h

12 h/23 °C or 10 min/120 °C

48 h/23 °C or 30 min/120 °C

5 min/100 °C or 2 min/130 °C

2 h/23 °C or 2 min/120 °C

24 h/25 °C or 15 min/125 °C

24 h/25 °C or 15 min/125 °C

4 h/23 °C or 5 min/120 °C

6 h/23 °C or 10 min/120 °C

8 h/23 °C or 10 min/120 °C

2 h/23 °C or 3 min/120 °C

4 h/23 °C or 5 min/120 °C

Properties Color DensityMixing ratio

Pot life / skin-over time Curing timeProduct Viscosity

[mPa •s]

These figures are intended as a guide and should not be used in preparing product specifications.

A SUMMARY OF THE PROPERTIES OF SILICONE GELS

[g/cm3]

Page 3: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

3

2-Part Addition-Curing

70

70

60

70

a. A.

a. A.

90

30

75

30

30

3E–04

3E–04

3E–04

3E–04

3E–04

1E–04

3E–04

3E–04

3E–04

3E–04

3E–04

23

23

23

23

22

22

23

23

23

23

23

3.0

2.7

2.7

3.0

2.5

2.5

2.8

2.8

2.7

2.8

2.8

5E–03

1E–03

1E–03

6E–03

1E–03

1E–03

1E–03

1E–03

1E–03

1E–03

1E–03

1E + 16

1E + 16

1E + 16

1E + 16

1E + 14

1E + 14

1E + 16

1E + 16

1E + 16

1E + 16

1E + 16

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

Penetration CTEDielectric strength

Dielectric constant

Dissipation factor

Volume resistivity

Thermal conductivity Shelf life Availability

12

12

12

6

12

12

12

12

12

12

12

On request

On request

On request

On request

On request

On request

On request

On request

Yes

On request

On request

[mm/10] [m/mK] [kV/mm] [ε] [Ω·cm] [W/mK] [Months]

SEMICOSIL®, ELASTOSIL® and WACKER SilGel are registered trademarks of Wacker Chemie AG. Wacker Chemie AG is certified to EN ISO 9001 and EN 14001. The Elastomers Business Unit at Wacker Chemie AG ’s WACKER SILICONES Business Division is certified to ISO/ TS 16949:2002.

Page 4: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

4

Thixotropic,

heat-curing,

specified ion content,

low bleeding,

controlled volatility

UV-fluorescent version

of SEM. 924,

low viscosity

vs. SEM. 924

Ready-to-use,

one-part curing,

good damping properties

Very low viscosity,

specified ion content

Fluorosilicone gel,

thixotropic,

curing,

specified ion content

1-Part Addition-Curing

SEMICOSIL® 924

SEMICOSIL® 9242

SEMICOSIL® 925

SEMICOSIL® 926

SEMICOSIL® 927 F

Translucent

Translucent

Transparent

Translucent

Translucent

1.00

0.98

0.97

0.96

1.27

35,000

20,000

700

150

6,000

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

4 h/100 °C or 10 min/150 °C

4 h/100 °C or 10 min/150 °C

35 min/100 °C or 3 min/150 °C

4 h/100 °C or 10 min/150 °C

4 h/100 °C or 30 min/150 °C

Properties Color DensityMixing ratio

Pot life / skin-over time Curing timeProduct Viscosity

[g/cm3] [mPa •s]

These figures are intended as a guide and should not be used in preparing product specifications.

Page 5: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

5

1-Part Addition-Curing

50

50

60

60

60

3E–04

3E–04

3E–04

3E–04

3E–04

23

23

23

23

23

2.7

2.7

n. a.

2.7

n. a.

1E–03

1E–03

n. a.

1E–03

n. a.

1E + 16

1E + 16

1E + 16

1E + 16

1E + 16

0.2

0.2

0.2

0.2

0.2

3

3

3

3

3

On request

On request

On request

On request

On request

[mm/10] [m/mK] [kV/mm] [ε] [Ω·cm] [W/mK] [Months]

Penetration CTEDielectric strength

Dielectric constant

Dissipation factor

Volume resistivity

Thermal conductivity Shelf life Availability

Page 6: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

6

General-purpose potting compounds

General-purpose potting compounds

General-purpose potting compounds

General-purpose potting compounds

Excellent heat resistance

General-purpose potting compounds,

highly transparent

General-purpose potting compounds,

good heat resistance

Highly transparent

General-purpose potting compounds,

flame-retardant,

good heat resistance

General-purpose potting compounds,

suitable for the manufacture of

technical molded parts,

excellent mechanical properties

Potting compound,

suitable for injection molding

General-purpose potting compounds,

suitable for the manufacture

of technical molded parts,

excellent mechanical properties

Suitable for the manufacture

of technical molded parts,

good mechanical properties

Excellent thermal conductivity

Heat-curing,

very low viscosity,

controlled volatility

Heat-curing,

very low viscosity,

controlled volatility,

low risk of inhibition

2-Part Condensation-Curing

ELASTOSIL® RT 563

ELASTOSIL® RT K

ELASTOSIL® RT 426

ELASTOSIL® RT 428

ELASTOSIL® RT 2100

ELASTOSIL® RT 601

ELASTOSIL® RT 602

ELASTOSIL® RT 604

ELASTOSIL® RT 607

ELASTOSIL® RT 622

ELASTOSIL® RT 624

ELASTOSIL® RT 625

ELASTOSIL® RT 628

ELASTOSIL® RT 675

ELASTOSIL® RT 743LV

ELASTOSIL® RT 743LV-K

Beige

Gray

Reddish brown

Reddish brown

Reddish brown

Transparent

Beige

Transparent

Reddish brown

Reddish brown

Translucent

Translucent

Gray

Reddish brown

Gray

Gray

1.27

1.22

1.44

1.53

1.49

1.02

1.17

0.96

1.43

1.13

1.05

1.10

1.23

2.30

1.45

1.45

3,500

7,000

10,000

10,000

15,000

3,500

3,500

800

10,000

12,000

50,000

35,000

40,000

35,000

1,300

1,300

100 : 4

100 : 4

100 : 4

100 : 4

100 : 0.3

9 : 1

9 : 1

9 : 1

9 : 1

9 : 1

1 : 1

9 : 1

9 : 1

1 : 1

1 : 1

1 : 1

40 min

150 min

60 min

60 min

120 min

90 min

80 min

90 min

80 min

60 min

24 h

60 min

70 min

150 min

8 h

4 h

24 h/23 °C

7 h/23 °C

24 h/23 °C

24 h/23 °C

24 h/23 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 8 min/100 °C

24 h/23 °C

or 5 min/100 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 10 min/100 °C

60 min/70 °C

or 10 min/150 °C

60 min/120 °C

or 20 min/150 °C

40 min/120 °C

or 10 min/150 °C

[mPa •s]

These figures are intended as a guide and should not be used in preparing product specifications.

SILICONES FOR POTTING AND EMBEDDING

Properties Color DensityMixing ratio

Pot life /skin-over time Curing timeProduct Viscosity

2-Part Addition-Curing [g/cm3] [mPa •s]

[g/cm3]

Page 7: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

7

2-Part Condensation-Curing

24 h/23 °C

7 h/23 °C

24 h/23 °C

24 h/23 °C

24 h/23 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 8 min/100 °C

24 h/23 °C

or 5 min/100 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 10 min/100 °C

24 h/23 °C

or 10 min/100 °C

60 min/70 °C

or 10 min/150 °C

60 min/120 °C

or 20 min/150 °C

40 min/120 °C

or 10 min/150 °C

55

45

55

70

60

45

30

25

55

27

40

25

50

80

20

20

120

130

120

90

130

100

130

n. a.

100

550

300

600

230

50

160

160

23

23

23

23

20

23

23

23

23

23

23

23

23

23

23

23

2.8

3.3

3.7

3.5

4.0

2.8

3.1

2.7

3.7

3.2

3.2

3.2

3.2

6.1

3.1

3.1

8E–03

3E–02

2E–02

2E–02

7E–03

1E–03

5E–02

2E–03

4E–02

5E–03

5E–03

5E–03

6E–03

2E–02

1E–02

1E–02

6E + 13

1E + 14

1E + 14

1E + 13

1E + 15

1E + 15

1E + 15

1E + 15

1E + 15

1E + 15

1E + 15

1E + 15

1E + 15

1E + 15

1E + 14

1E + 14

>600

>600

>600

>600

>600

>600

>600

>600

>600

>600

>600

>600

>600

>600

>600

>600

[%] [m/mK] [ε] [Ω·cm] [Months]

4.5

2.0

4.5

6.0

5.2

7.0

1.5

n. a.

3.5

6.5

5.0

6.5

3.5

2.0

1.5

1.5

3.0

On request

5.5

5.0

4.4

3.0

n. a.

n. a.

4.0

30.0

12.0

30.0

11.0

8.0

2.5

2.5

3E–04

3E–04

2E–04

2E–04

2E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

2E–04

3E–04

3E–04

HardnessShore A CTE

Dielectric strength

Dielectric constant

Dissipation factor

Volume resistivity

Thermal conductivity

Shelf life Availability

Tensile strength

Elongation at break

Tear strength CTI

12

12

12

12

12

12

12

12

12

12

12

12

12

12

9

9

0.3

0.3

0.4

0.5

0.3

0.2

0.2

0.2

0.4

0.2

0.2

0.2

0.3

1.1

0.5

0.5

Yes

Yes

Yes

Yes

On request

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

2-Part Addition-Curing

[N/mm2] [N/mm] [kV/mm] [W/mK]

[%] [m/mK] [ε] [Ω·cm] [Months][N/mm2] [N/mm] [kV/mm] [W/mK]

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8

Low viscosity,

low risk of inhibition

Heat-curing,

medium hardness

Low viscosity,

low hardness

Low viscosity,

very low hardness

Low hardness,

rapid curing

Heat-curing,

flame-retardant (UL-94 VO)

Heat-curing,

soft rubber

2-Part Addition-Curing, self-adhesive

ELASTOSIL® RT 615

ELASTOSIL® RT 741

ELASTOSIL® RT 745

ELASTOSIL® RT 745 „S“

ELASTOSIL® RT 746

SEMICOSIL® 205

SEMICOSIL® 210

Brownish

Gray

Brownish

Brownish

Black

Gray

Transparent

0.96

1.35

0.96

0.96

0.98

1.35

0.98

1,000

1,000

1,000

1,000

3,500

1,800

75,000

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

1 : 1

8 h

24 h

8 h

8 h

6 h

2 h

1 h

60 min/70 °C or 10 min/150 °C

60 min/100 °C or 15 min/150 °C

60 min/80 °C or 10 min/120 °C

60 min/80 °C or 10 min/120 °C

6 min/85 °C or 2 min/125 °C

15 min/100 °C

15 min/100 °C

[mPa •s]

These figures are intended as a guide and should not be used in preparing product specifications.

Properties Color Density Mixing ratio

Pot life / skin-over time Curing timeProduct Viscosity

[g/cm3]

Page 9: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

9

2-Part Addition-Curing, self-adhesive

15

45

15

5

18

10

Shore 00

30

200

n. a.

200

650

200

180

n. a.

23

23

23

23

23

16

n. a.

2.8

3.7

2.9

2.9

2.9

2.9

n. a.

3E–04

3E–02

4E–03

4E–03

4E–03

2E–03

n. a.

1E + 15

1E + 14

1E + 15

1E + 15

1E + 15

1E + 15

n. a.

>600

>600

>600

>600

>600

>600

n. a.

[%] [m/mK] [ε] [Ω·cm] [Months]

0.3

n. a.

0.3

0.3

0.3

0.7

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

1.8

n. a.

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

Hardness Shore A CTE

Dielectric strength

Dielectric constant

Dissipation factor

Volume resistivity

Thermal conductivity Shelf life

Availability

Tensile strength

Elongation at break

Tear strength CTI

12

12

12

12

12

12

12

0.2

0.3

0.2

0.2

0.2

0.3

0.2

Yes

Yes

Yes

Yes

On request

On request

On request

[N/mm2] [N/mm] [kV/mm] [W/mK]

Page 10: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

10

Solvent-based,

amine-curing, free-flowing

Oxime-curing,

ready-to-use

Alkoxy-curing,

free-flowing, ready-to-use

Rapid UV curing,

solvent-free,

shadow curing

Amine-curing,

100 % solids content,

rapid curing in

CO2/H2O atmosphere

Amine-curing,

100 % solids content,

rapid UV curing

Ready-to-use,

rapid curing,

self-adhesive

Ready-to-use, rapid

curing, self-adhesive

Low hardness,

low viscosity,

self-adhesive

Low hardness,

low viscosity,

self-adhesive

Long pot life,

self-adhesive,

low risk of inhibition

Heat-curing, 1-part

system, peroxide-curing,

high viscosity

Conformal Coating, 1-Part Condensation-Curing

ELASTOSIL® A 07

ELASTOSIL® N 10

ELASTOSIL® N 2010

SEMICOSIL® 936 UV

SEMICOSIL® 964

SEMICOSIL® 964

UV/Clear

SEMICOSIL® 960 Clear

SEMICOSIL® 960 Red

ELASTOSIL® RT 745

ELASTOSIL® RT 745 „S“

SEMICOSIL® 935

SEMICOSIL® 992 JC

Translucent

Transparent

Transparent

Translucent

Bluish

Transparent

Transparent

Red

Brownish

Brownish

Brownish

White

1.02

1.07

1.01

1.00

1.00

1.00

0.93

0.93

0.98

0.98

0.98

1.40

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

1 : 1

1 : 1

1 : 1

n. a.

20 min

20 min

20 min

120 min

20 min

20 min

20 min

20 min

8 h

8 h

7 d

n. a.

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

UV curing 1 mil /15 sec

5 mil: 20 min at 25 °C/50 % RH

UV curing 1 mil /75 sec

5 mil: 20 min at 25 °C/50 % RH

5 mil: 20 min at 25 °C/50 % RH

60 min/80 °C or 10 min/120 °C

60 min/80 °C or 10 min/120 °C

30 min/80 °C or 5 min/150 °C

2 h/150 °C and 4 h/200 °C

Properties Color Density Mixing ratio

Pot life / skin-over time Curing timeProduct Viscosity

[g/cm3] [mPa •s]

These figures are intended as a guide and should not be used in preparing product specifications.

SILICONES FOR COATING AND VARNISHING

Conformal Coating, 2-Part Addition-Curing

Junction Coating

9,000

10,000

12,000

8,000

800

800

4,000

4,000

1,000

1,000

3,000

150,000

[g/cm3] [mPa •s]

[g/cm3] [mPa •s]

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11

Conformal Coating, 1-Part Condensation-Curing

20

25

25

30

27

27

25

25

15

5

15

50

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

n. a.

2.9

n. a.

n. a.

n. a.

2.6

2.6

2.7

2.7

2.8

2.8

2.8

3.5

4E– 03

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

1E–03

1E–03

1E–03

6E–03

1E + 15

1E + 14

1E + 14

n. a.

1E + 15

1E + 15

1E + 15

1E + 15

1E + 15

1E + 15

1E + 15

1E + 14

Hardness Shore A CTE

Dielectric strength

Dielectric constant

Dissipation factor

Volume resistivity

Thermal conductivity Shelf life Availability

[m/mK] [ε] [Ω·cm] [Months]

15

21

21

n. a.

20

20

18

18

23

23

23

20

6

9

9

6

12

12

12

12

12

12

12

3

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.3

Yes

Yes

Yes

On request

On request

On request

On request

On request

Yes

Yes

On request

On request

Conformal Coating, 2-Part Addition-Curing

[kV/mm] [W/mK]

Junction Coating

[m/mK] [ε] [Ω·cm] [Months][kV/mm] [W/mK]

[m/mK] [ε] [Ω·cm] [Months][kV/mm] [W/mK]

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12

Amine-curing, solvent-based,

free-flowing

Amine-curing, free-flowing,

UL-94 HB (150 °C)

Amine-curing, non-sag

Acetoxy-curing,

low compression set

Acetoxy-curing,

free-flowing, solvent-based

Acetoxy-curing,

self-leveling

Acetoxy-curing, free-flowing

Oxime-curing, free-flowing

Alkoxy-curing

Oxime-curing, oil-resistant

Oxime-curing,

excellent heat resistance

Oxime-curing,

good mechanical properties

Alkoxy-curing, free-flowing

Alcoxy-curing,

self-leveling

Alkoxy-curing, oil-resistant

Alkoxy-curing,

excellent heat resistance

Alkoxy-curing,

excellent heat resistance

Alkoxy-curing,

excellent adhesion

Alkoxy-curing,

flame-retardant (UL-94 V0)

Rapid UV curing,

solvent-free, shadow curing

Thixotropic, soft,

good elongation

Amine-curing,

electrically conductive

1-Part Condensation-Curing

ELASTOSIL® A 07

ELASTOSIL® A 234

ELASTOSIL® A 33

ELASTOSIL® E 4

ELASTOSIL® E 41

ELASTOSIL® E 43

ELASTOSIL® E 50

ELASTOSIL® N 10

ELASTOSIL® N 179

ELASTOSIL® N 189

ELASTOSIL® N 198

ELASTOSIL® N 199

ELASTOSIL® N 2010

ELASTOSIL® N 2034

ELASTOSIL® N 2189

ELASTOSIL® N 2197

ELASTOSIL® N 2198

ELASTOSIL® N 2199

ELASTOSIL® N 9132

SEMICOSIL® 936 UV

ELASTOSIL® A95 gray

SEMICOSIL® 979 EC

Translucent

White

Beige

Transparent

Transparent

Black or

transparent

Transparent

Transparent

Black

Black

Gray or black

Transparent

Transparent

Gray

Black

Gray

Black

Transparent

Gray or white

Translucent

Gray

Black

1.02

1.21

1.16

1.10

1.09

1.09

1.07

1.07

1.25

1.10

1.20

1.10

1.01

1.15

1.30

1.26

1.35

1.05

1.28

1.00

1.30

0.92

9,000

35,000

Non-slump

Non-slump

65,000

350,000

50,000

10,000

Non-slump

Non-slump

Non-slump

Non-slump

10,000

40,000

Non-slump

Non-slump

Non-slump

Non-slump

Non-slump

8,000

Non-slump

Non-slump

10 min

20 min

20 min

15 min

20 min

15 min

10 min

20 min

25 min

30 min

25 min

40 min

20 min

20 min

30 min

25 min

10 min

20 min

15 min

120 min

15 min

10 min

24 h/mm at 23 °C/50 % RH

24 h/mm at 23° C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

24 h/mm at 23 °C/50 % RH

Properties Color Density

Pot life / skin-over time Curing timeProduct Viscosity

[g/cm3] [mPa •s]

These figures are intended as a guide and should not be used in preparing product specifications.

SILICONES FOR BONDING, FIXING AND SEALING

Page 13: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

13

1-Part Condensation-Curing

20

36

25

16

30

30

28

25

45

32

42

35

25

35

44

35

50

40

33

30

18

35

1.1

2.2

2.5

1.5

4.5

4.5

3.5

1.6

3.0

2.0

3.0

4.0

1.0

1.5

2.3

2.5

2.5

2.5

2.4

n. a.

n. a.

1.5

300

200

350

600

500

500

400

200

500

250

300

450

200

200

250

350

250

300

600

n. a.

n. a.

200

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E– 04

n. a.

15

23

17

21

21

21

21

21

21

21

21

21

21

21

21

21

21

21

21

n. a.

n. a.

n. a.

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

n. a.

1E + 14

10

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.2

n. a.

Hardness Shore A

Tensile strength

Elongation at break CTE

Dielectric strength

Volume resistivity

Thermal conductivity Shelf life Availability

6

9

9

12

12

12

9

9

9

9

9

9

6

6

6

6

6

6

9

6

6

12

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

On request

Yes

Yes

Yes

Yes

Yes

Yes

Yes

On request

Yes

Yes

On request

On request

On request

[%] [Ω·cm] [W/mK] [Months][N/mm2] [m/mK] [kV/mm]

Page 14: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

14

Rapid curing at RT,

suitable for FIPG applications

Rapid curing at RT,

UL-94 HB (200 °C),

excellent heat resistance

Rapid curing at RT,

excellent heat resistance

Heat-curing, excellent

heat resistance, UL-94 HB

Heat-curing,

excellent heat resistance

Heat-curing, excellent heat

resistance, UL-94 HB

Heat-curing, excellent heat

resistance, UL-94 HB

Heat-curing, compressible

Heat-curing, compressible

(UL-94 VO)

Heat-curing, compressible

Heat-curing,

high thermal conductivity

Heat-curing,

UV-fluorescent

Heat-curing,

gray version of SEM. 987,

excellent adhesion

Heat-curing,

excellent adhesion

Heat-curing,

gray version of SEM. 987/1K

Heat-curing,

CIPG applications

Heat-curing,

CIPG applications

Heat-curing,

excellent adhesion

2-Part Condensation-Curing

ELASTOSIL® RT 771

ELASTOSIL® RT 772

ELASTOSIL® RT 778

ELASTOSIL® RT 705

ELASTOSIL® RT 705 F

ELASTOSIL® RT 706

ELASTOSIL® RT 707

ELASTOSIL® RT 710

ELASTOSIL® RT 713

ELASTOSIL® RT 715

SEMICOSIL® 971 TC

SEMICOSIL® 986/1K

SEMICOSIL® 987 GR

SEMICOSIL® 987/1K

SEMICOSIL® 987/1K gray

SEMICOSIL® 988/1K

SEMICOSIL® 988/1K gray

SEMICOSIL 989/1K

Gray

Gray

Black

Black

Black

Red

White

White

Gray

Gray

White

Translucent

Gray

Translucent

Gray

Translucent

Gray

Translucent

1.45

1.27

1.30

1.23

1.23

1.23

1.12

0.75

0.75

0.50

2.75

1.10

1.07

1.10

1.07

1.10

1.10

1.10

100,000

30,000

Non-slump

100,000

50,000

80,000

65,000

10,000

Non-slump

Non-slump

Non-slump

Non-slump

Non-slump

Non-slump

Non-slump

Non-slump

Non-slump

Non-slump

15 min

12 min

6 min

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

n. a.

2 h/23 °C

2 h/23 °C

1 h/23 °C

20 min/140 °C or 3 min/200 °C

20 min/140 °C or 3 min/200 °C

10 min/140 °C or 3 min/200 °C

10 min/140 °C or 3 min/200 °C

30 min/130 °C or 10 min/150 °C

30 min/130 °C or 10 min/150 °C

30 min/130 °C or 10 min/150 °C

30 min/125 °C or 10 min/150 °C

1 h/130 °C or 10 min/150 °C

1 h/115 °C or 10 min/150 °C

1 h/130 °C or 10 min/150 °C

1 h/130 °C or 10 min/150 °C

1 h/130 °C or 10 min/150 °C

1 h/130 °C or 10 min/150 °C

1 h/130 °C or 10 min/150 °C

Properties Color Density

Pot life / skin-over time Curing timeProduct Viscosity

[g/cm3] [mPa •s]

These figures are intended as a guide and should not be used in preparing product specifications.

1-Part Addition-Curing [g/cm3] [mPa •s]

Page 15: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

15

2-Part Condensation-Curing

50

35

50

45

36

45

37

10

23

35

75

50

50

50

50

35

35

55

1.0

2.1

3.5

3.0

3.5

3.0

2.5

n. a.

1.5

1.5

3.0

5.0

5.0

5.0

5.0

5.0

5.0

180

250

200

300

220

250

250

n. a.

350

350

70

250

250

250

250

250

250

200

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

n. a.

n. a.

n. a.

0.95E–04

3E–04

3E–04

3E–04

3E–04

3E–04

3E–04

23

23

23

23

23

23

23

23

23

23

17

23

23

23

23

23

23

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

1E + 14

0.2

0.2

0.2

0.2

0.2

0.2

0.2

n. a.

n. a.

n. a.

1.9

0.2

0.2

0.2

0.2

0.2

0.2

0.2

HardnessShore A

Tensile strength

Elongation at break CTE

Dielectric strength

Volume resistivity

Thermal conductivity Shelf life Availability

12

12

12

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

On request

On request

On request

On request

On request

On request

On request

On request

On request

On request

On request

On request

On request

On request

On request

On request

On request

[%] [Ω·cm] [W/mK] [Months][N/mm2] [m/mK] [kV/mm]

1-Part Addition-Curing [%] [Ω·cm] [W/mK] [Months][N/mm2] [m/mK] [kV/mm]

Page 16: SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY … · SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW’S SOLUTIONS. 2 ... Transparent, rapid curing, good damping

6012

e/07

.07

repr

int

6012

e/05

.06

Wacker Chemie AGHanns-Seidel-Platz 481737 München, [email protected]

www.wacker.com