silicon solutions for the real world rohs compliant & green components

Silicon Solutions for the Real WorldSilicon Solutions for the Real World

RoHS Compliant &

Green Components

RoHS Compliant &

Green Components


ContentContent

Environmentally Friendly Materials DriversLegislationAMIS RoHS & Green Component DefinitionHazardous Substances in Current ComponentsRe-Flow Profile for Moisture Sensitivity AssessmentImpact Pb-Free Solder on Package ConstructionAMIS Changes in Bill of Assembly MaterialsQualification Stress Test ConditionsProduct Marking and LabelingAMIS RoHS-Green Qualification Status


Environmentally Friendly Materials DriversEnvironmentally Friendly Materials Drivers

RoHS Directive 2002/95/EC Effective July, 2006Lead Pb < 1000 ppmMercury Hg < 1000 ppmCadmium Cd < 100 ppmHexavalent Chromium Cr+6 < 1000 ppmPolybrominated Biphenyl PBB < 1000 ppmPolybrominated Diphenyl Ether PBDE < 1000 ppm

Market PressureJapanese Consumers Demand Green ComponentsNew Designs for Consumer Products are all Green

High Temperature ApplicationsSolders Required for Harsh Environments

AutomotiveAvionics

High Ambient Temperature Applications for well Defined Duration


Worldwide LegislationWorldwide Legislation

RoHS(Restriction of Hazardous Substances)

Pb, Hg, Cd, Cr+6PBB & PBDE

JGPSSI (Japan Green Procurement Survey Standard Initiative)

Pb, Hg, Cd, Cr+6PBB, PBDE, TBBP-A-bisChlorinated Organic Compound PCB, PCN, CP, MirexOrganic Sn CompoundAsbestosAzoFormaldehydePVC & PVC Blends

Situation of Banned Substances in the World

Different Definitions & Thresholds are being Debated in EU, Japan & US

Whether all Worldwide Brominated Substances or only Specified Types will be Banned is still Unclear


Japanese LegislationJapanese Legislation

JapaneseThe Japanese Ministry of Trade (MITI) Passed a Recycling Law for Electrical Appliances with Effect from April 2001

This Suggests but does not Include Lead Phase-out Timetable

OEM's are Removing Lead from Electronics Mainly due to Market Pressures

The JGPSSI (Japan Green Procurement Survey Standard Initiative) is Followed by many OEM’s


Directive 2002/95/EC (RoHS)

Proposal for an Directive on Eco-Design of End-Use Equipment (EUP) that will have some Regard to Hazardous Materials in Equipment

EU LegislationEU Legislation

Applicable for:Large Household AppliancesSmall Household AppliancesIT & Telecom EquipmentConsumer EquipmentLighting EquipmentElectrical & Electronic ToolsToys, Leisure & Sports EquipmentMedical Equipment SystemsMonitoring & Control InstrumentsAutomatic Dispensers

Who is Exempt:

Medical Implanted & Injected Products

Pb in Servers, Storage & Storage Systems until 2010

Large Stationary Industrial Tools

Pb in High-End Manufacturing & Telecommunications Products

Automotive, Aerospace, Military


United States LegislationUnited States Legislation

United StatesAlthough a Number of States are Heading Towards Lead-Free and/or Recycling Regulation There is not yet a Published Federal Position

In September 2003 California Enacted an E-Waste Recycling Bill

The EPA (Environmental Protection Administration) has Proposed a Crack-down on Lead Emissions from Plants that may Impact the Soldering Industry


AMIS RoHS & Green DefinitionAMIS RoHS & Green Definition

RoHS Compliant = AMIS Pb-FreePb < 1000 ppmHg < 1000 ppmCd < 100 ppmCr+6 < 1000 ppmPolybrominated Biphenyl < 1000 ppmPolybrominated Diphenyl Ether < 1000 ppm

Full Green = AMIS GreenAll of the Above Requirements Plus

Bromine < 900 ppmChlorine < 900 ppmAntimony < 900 ppmTributyltin Oxide Not UsedPhosphorus Not Used


Hazardous Substances in Current CompoundsHazardous Substances in Current Compounds

Pb as Solder Plated Leads or Balls of PackagesPb Content Solder Plated Leads: 0.1 – 0.3% by Weight

Pb Content Solder Balls of BGA Packages: 4.9% by Weight

Bromide &/or Antimonated Flame Retardant of Epoxy Molding Compound

Bromide Content: 0.2 – 1.8% by Weight

Antimony Content: 0.3 – 0.7% by Weight

DIEDIE DIE

Laminated Package

Solder Lead Finish

Leaded Package

Solder Balls


Re-Flow Profile for Moisture Sensitivity AssessmentRe-Flow Profile for Moisture Sensitivity Assessment

AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C

Large Body Small Body Large Body Small Body Large Body Small Body Large Body Small Body

Average ramp-up rate(TL to Tp)

Peak Temperature (Tp)

10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds

Ramp-down Rate

6 Minutes Max. 8 Minutes Max.

IPC/JEDEC J-STD-020B AMIS

Sn-Pb Eutectic Assembly

6 Minutes Max. 8 Minutes Max.

Pb-Free AssemblyProfile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Preheat• Temperature Min. (Tsmin)

• Temperature Max. (Tsmax)

• Time (Min. to Max.)(ts)

Tsmax to TL

• Ramp-up Rate

Time Maintained Above:

• Temperature (TL)

• Time (tL)

3ºC/second Max. 3ºC/second Max. 3ºC/second Max. 3ºC/second Max.

Time Within 5ºC of Actual Peak Temp. (tp)

Time 25ºC to Peak Temp.

100ºC

150ºC

60-120 Seconds

150ºC

200ºC

60-180 Seconds

100ºC

150ºC

60-120 Seconds

150ºC

200ºC

60-120 Seconds

183ºC

60-150 Seconds

217ºC

60-150 Seconds

183ºC

60-150 Seconds

217ºC

60-150 Seconds

225 +0/-5ºC 240 +0/-5ºC 245 +0/-5ºC 250 +0/-5ºC 225 +0/-5ºC 240 +0/-5ºC 260 +0/-5ºC 260 +0/-5ºC

3ºC/second Max. 1-2ºC/second Max. 1.5-2.5ºC/second Max.

6ºC/second Max.6ºC/second Max.6ºC/second Max.6ºC/second Max.


Re-Flow Profile for Moisture Sensitivity AssessmentRe-Flow Profile for Moisture Sensitivity Assessment

Reflow Profiles for SOIC 24 pins @ 260°C

0

50

100

150

200

250

300

1 33 65 97 129

161

193

225

257

289

321

353

385

417

449

Tim e (sec)

Tem

per

atu

re (

°C)

Cycle 1

Cycle 2

Cycle 3

AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C


Impact Pb-Free Solder on Package ConstructionImpact Pb-Free Solder on Package Construction

Exposure to Higher Solder TemperaturesThe Impact from 220 to 240 or 260°C Solder Temperatures

SolderabilityThe Interaction Between the Pb-free Component Finish & Solder Paste

Interface Adhesion Between MaterialsThe Higher Probability that Interfaces will Separate as they are Exposed to the High Solder Temperature

Thermal Stability in Compound/Die Attach/Substrate

Electrical Contact Resistance

DIE

Laminated Package

Solder Balls

DIE DIE

Solder Lead Finish

Leaded Package


Changes in Bill of Assembly MaterialsChanges in Bill of Assembly Materials

Lead Frame Packages = AMIS goes Green

New Materials for Die Attach & MoldMaterials that Withstand 260°C

Halogen Free Materials

Lead FinishPure Sn Plating is Selected as Solution

Pure Sn is the most Mainstream Solution

Post plate bake is part of the AMIS process flow and demonstrated good results as whisker mitigation process

NiPdAu is available as an alterative finish option


Changes in Bill of Assembly MaterialsChanges in Bill of Assembly Materials

Laminate Packages = AMIS goes RoHS Compliant

Existing Substrates are RoHS Compliant & Qualified

Green Substrates are Available but more Expensive & not yet Qualified

New Materials for Die Attach & MoldMaterials that Withstand 260°C

Halogen Free Materials

Lead FinishSn- 4.0Ag- 0.5Cu has been Selected (most std at Subs)


Qualified Stress Test ConditionsQualified Stress Test Conditions

- 65/150°C, 500x

- 65/150°C, 1000x

- 65/175°C, 500x

- 65/175°C, 1000x

- 50/150°C, 500x

- 50/125°C, 1000x

- 65/150°C, 500x

- 50/150°C, 1000x

- 65/175°C, 500x

- 50/175°C, 1000x

- 50/150°C, 2000x

Temp Cycle

Per J-STD-020 for SMD componentsPreconditioning

175°C, 1000 hrs

175°C, 2000 hrs

150°C, 1000 hrs

175°C, 500 hrs

175°C, 1000 hrs

150°C, 2000 hrs

High Temp Storage Life (plastic pkg)

121°C / 100% – 96 hrs

HAST 130°C / 85% – 96 hrs

Autoclave or unbiased HAST

85°C / 85% / Bias – 1000 hrsTHB or HAST

- 40/125°C, 1000x- 40/150°C, 1000x- 40/105°C, 1000x- 40/125°C, 1000x- 40/150°C, 1000xPower Temp Cycle

Grade 2

(- 40 / 105°C)

Grade 1

(- 40 / 125°C)

Grade 0

(- 40 / 150°C)

Part OperatingTemperature Grades

Per J-STD-020 Minimum Level 2260ºC max. Re-Flow Temperature

HAST 130°C / 85% / Bias – 96 hrsFor Product Qualifications

121°C / 100% – 96 hrsFor Package Qualifications

AEC – Q100 REV-F AMIS

150°C, 1000 hrs

150°C, 2000 hrs

125°C, 1000 hrs

150°C, 500 hrs

Grade 0

(- 40 / 150°C)

Grade 1

(- 40 / 125°C)


AMIS RoHS-GreenQualification StatusAMIS RoHS-GreenQualification Status

Pure Sn NiPdAu SnAgCu

LFBGA Taiw. - Philip. - Sing. RoHS Completed 3LQFP Taiw. - Korea - Philip. - Sing. Green Completed ww5005 3LQFP-EP Korea Green 3NQFP Punch Korea Green Completed 3NQFP Saw Taiw - Philip. - Indon. Green Completed ww5005 3PBGA-FPBGA Philip. - Taiw. RoHS Completed 3PDIP Philip. - Indon. RoHS Completed 3PLCC Philip. - Indon. Green Completed 3PQFP Taiw. - Korea - Philip. - Sing. Green Completed ww5005 3SBGA Korea RoHS Completed 3SOIC 150 Philip. - Taiw. - Indon. Green Completed Completed 2SOIC 300 Philip. - Taiw. - Indon. Green Completed ww2905 2SSOP Philip. - Indon. Green Completed ww3505 2TE-PBGA Korea RoHS Completed 3TQFP Korea Green Completed ww5005 3TQFP-EP Korea Green Completed ww5005 3TSSOP Philip. Green Completed Completed 2

MRTLevel

Qualification StatusPackageType

SubconLocation

Green orRoHS


Product Marking & LabelingProduct Marking & Labeling

In Alignment with JESD97Components Contain Pb-Free Category Code

Labels ContainPb Free Category Code

Safe Maximum Temperature

Moisture Sensitivity Level

Pb-FreeCategory

Component terminal material finish description

e1 SnAgCue2 Sn alloys with ni Bi or Zn, excluding SnAgCue3 pure Sne4 Ag, Au, NiPd, NiPdAu and other precious metals containing no Sne5 SnZn, SnZnx containing no Bie6 As e5 but with Bie7 Low temp solders (</- 150C) containing In but not Bi


AMIS RoHS-Green Project StatusAMIS RoHS-Green Project Status

The Majority of the Packages Offered by AMIS are Green or RoHS Qualified

AMIS will Continue to Provide Non-RoHS & Non-Green Products unless Requested Differently

Green & RoHS Compliant Product is Available Upon Request

Contact AMIS Sales for more Information

AMIS Operational Systems have been Adjusted to Recognize & Distinguish Green & RoHS Compliant Product from the Existing Production

silicon solutions for the real world rohs compliant & green components

Documents

silicon solutions

amis pbfree pb

real world content

ppm hg

ppm cr

ppm cd

real world directive

amis green