session 5: projects 1. physical limits of technology scaling : 2 scaling and efficiency
TRANSCRIPT
Introduction to VLSI Interconnect
Design
Session 5: Projects
1
Project TopicsPhysical Limits of Technology Scaling :
2
SCALING AND EFFICIENCY
Project TopicsRLC extraction :
3
Inductance Modeling
Reducing Capacitance
Skin Effect / Anomalous Skin Effect
Project TopicsInterconnect Delay :
4
High Speed Global On-Chip Interconnects
Compact Model for Delay
Near Speed-of-Light On-Chip Electrical Interconnects
Moment-Matching Technique
Project TopicsInterconnect Noise :
5
Moment-Matching Technique
Project TopicsRepeater Insertion:
6
Project TopicsBit Rate Limitation :
7
Data Integrity : maximum data transfer rate.
Digital communication
Throughput-Centric Wave-Pipelined Interconnect
Project TopicsProcess Variations :
8
Project TopicsPower Dissipation :
9
Project TopicsClock Distribution :
10
Project Topics3D Integration:
11
Electrical modeling of Interconnects in 3-D ICs
Project TopicsSpeed/Power/Area Tradeoffs :
12
Project TopicsPower Distribution / Electromigration :
13
• Design / Analysis / Optimization of power distribution network Local power distribution network Global power distribution network
Project TopicsImpact of Cu vs. Al Metallization on Performance :
14
Project TopicsThermal Modeling of Metallic Interconnects :
15
Project TopicsCNTs as Interconnect:
16
PERFORMANCE COMPARISON BETWEEN COPPER, CARBON NANOTUBE, AND OPTICS FOR OFF-CHIP AND ON-CHIP INTERCONNECTS
Project TopicsOptical Interconnects :
17