semicon sp. z o.o. ul. zwoleńska 43/43a, 04-761 warszawa; tel. 22 615 64 31, 22 615 83 81; ...
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SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Innovative productsInnovative technologies
Innovative productsInnovative technologies
www.semicon.com.ple-mail: [email protected]
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
1987 – foundation of SEMICON Sp. z o.o.
1992 – first signed distribution agreement: LEM NORMA
1993 – 1996 – next distribution agreement: Kontakt Chemie, Schurter, Multi-Contact
1997 – SMT assembly line launch
1998 – launch of an electronics store in Warsaw (Wolumen)
2003 – implementation of the ISO 9001:2008 quality system
2009 – starting stencils laser cutting service
SEMICON Sp. z o.o.
History:
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
2004-2007 – project: GreenRose (FP6)
2007-2008 – project: Tele-Ekg (FP6)
2009-2012 – project: Radi-Cal (FP7)
2010-2012 – project: ChipCheck (FP7)
2010-2013 – project: µBGA (FP7)
SEMICON Sp. z o.o.
Participation in EU Framework Programmes:
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Currently, the company employs over 50 people including headquarter, production and shop.
Starting from 1st January 2013 we are participating in a new national project - Innovative advanced surface mount technology (SMT) printed circuit boards.
SEMICON Sp. z o.o.
Source: STATS ChipPAC
Source: PCB-togo.com
Source: code.google.com
Today:
Certificates
ISO 9001:2008 ISO 14001 AQAP 2110
We only work with companies which have UL certificates
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Distribution: Electronic components Electronic materials Measuring equipment and
accesories
SEMICON Sp. z o.o.- business areas
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Subcontracting: PCB assembly (THT, SMT) Laser cut SMT stencils
manufacturing Own production of laser modules
SEMICON Sp. z o.o.- business areas
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
THT and SMT assembly
More than 15 years experience in electronics
Customer support from design to production
Engineering consultancy Direct contact to supply chain ESD control IPC-A-610 trained employees Compliance with RoHS PCB Design possibilities Component supply possibilities
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Production capacity- SMT assembly
4 SMT lines prototypes, small, medium series PCB size: max. 800 x 510 mm Components: 01005 - 74 x 74 mm, PoP PCB thickness: 0.2 mm - 4.0mm, flex PCB
assembly Pitch: ≥ 0.20 mm Selective conformal coating possibilities Glue, solder paste possibilities AOI inspection, functional tests, test
probes, BGA – X-ray measurements Hot Bar technologies (flex, LCD)
Źródło: JU
KI C
o.
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Manual soldering Lead wave soldering PB-free wave soldering in
nitrogen 1.2 mln THT components
monthly/1 shift
Production capacity- THT assembly
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Main customers
Medical Defence Automotive Energoelectronic Lighting Telecomm R&D
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Stencils laser cutting High-speed cutting machine LPKF
Stencil Laser G6060 Frame or frameless stencils Accuracy and repeatability: ±2µ Material: stainless steel, nickel Thickness: up to 600µm (oxygen
cutting) Engineering, modifications, e.g. glue
stencils Aperture inspection – high resolution
scanner Tension inspection
Źródło: LP
KF
Laser & E
lectronics AG
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Laser modules Wavelenghts: 405-850nm
Power input: 0,2 – 500mW
Pointers
Line and cross generators
Customization
Laser displacement sensors: Resolution: up to 10µm
Measurement range: up to 200mm
Measurement distance: up to 50m
System includes: laser module and position detector
Optoelectronic equipment manufacturing
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Pointers Cross-hair pointers Alarm systems, laser
barriers Sensors Positioning systems Textile industry Wood processing:
Wood cutting Stone cutting Metal cutting
Tire industry Mining industry
Laser modules applications
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Miniaturization in electronics
Source: pl.wikipedia.org
Passive Components
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Miniaturization in electronics - ICs
Sou
rce:
Am
kor
Tech
nolo
gy,
Inc
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
SMT challenges
01005 components – paste screenprinting QFN, DFN components – lifting effect, voids Large and fine pitch BGAs – thermal balance,
voids, „head in pillow” effect PoP components – warpage, placing, BGAs
errors Large PCB assembly – bow and twist
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
First generation: multi-level structures
Second generation: PoPs
Next generation: TMV PoPs, BVA PoPs
3D package development
Source: Invensas Co
Source: Amkor Technology, Inc.
Sou
rce:
Am
kor
Tech
nolo
gy,
Inc.
World trends: higher density PoP
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Why PoP? Higher speed, lower energy consumption Memory chips from different vendors Different types of memory chips: speed, capacity, etc Separate inspection of processor and memory chips Lower junction temperatures (at least compared to stacked die)
PoP – Package on Package
Sou
rce:
Ele
ctro
IQ
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
PoP stacking assembly options:
PoP – Package on Package
Sou
rce:
Pan
ason
ic C
o
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
TMV PoP – Thru Mold Via Package on Package
®
Source: Amkor Technology, Inc.
Dimension control vias reduces the distance between the system memory and the TMV after their assembly.
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Why TMV PoP?
Improved warpage control and bottom package thickness. High density stacked (memory) interface. Increased die to package size ratio. TMV can provide over a
30% increase in maximum die size. Improved board level reliability. Improved fine pitch SMT process window. Supports Wirebond, flip chip devices (both area array solder
and fine pitch CuPillar), stacked die and passive components integration.TMV could also be applied to FlipStack® (combo FC+WB) and FC w/ TSV stacks.
TMV PoP – Thru Mold Via Package on Package
®
Sou
rce:
IM
AP
S.
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
BVA PoP – Bond Via Array Package on Package
™
Why BVA PoP?
The increase in the number of connections to the logic circuits from 300 to over 1000.
Reduction of PoP total thickness (lower than TMV PoP).
Source: Invensas Co
Reducing the pitch (up to 0.2mm) of the processor through wire leads increases the number of possible connections in the POP system.
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
BVA PoP – Bond Via Array Package on Package
™
Source: Invensas Co
Copper wires, height of 400µm pitch of 240µm.
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Perspectives for PoP solutions
Source: Gartner, Inc
What next?
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Thank you for attention!
Piotr Ciszewskie-mail: [email protected]