sam da1 datasheet• flexible end-point configuration and management with dedicated dma channels •...
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SAM DA1 32-bit ARM-Based Microcontrollers
Introduction
The SAM DA1 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor,and ranging from 32- to 64-pins with up to 64KB Flash, 8KB of SRAM and up to 2KB Read-While-Write(RWW) Flash section. The SAM DA1 operate at a maximum frequency of 48MHz and reach 2.46CoreMark®/MHz. They are designed for simple and intuitive migration with identical peripheral modules,hex compatible code, identical linear address map and pin compatible migration paths between alldevices in the product series. All devices include intelligent and flexible peripherals, Event System forinter-peripheral signaling, and support for capacitive touch button, slider and wheel user interfaces.
Features
• Processor– ARM Cortex-M0+ CPU running at up to 48MHz
• Single-cycle hardware multiplier• Micro Trace Buffer (MTB)
• Memories– 16/32/64KB in-system self-programmable Flash– 0.5/1/2KB Read-While-Write (RWW) Flash section– 4/4/8KB SRAM memory
• System– Power-on reset (POR) and brown-out detection (BOD)– Internal and external clock options with 48MHz Digital Frequency Locked Loop (DFLL48M)
and 48MHz to 96MHz Fractional Digital Phase Locked Loop (FDPLL96M)– External Interrupt Controller (EIC)– 16 external interrupts– One non-maskable interrupt– Two-pin Serial Wire Debug (SWD) programming, test and debugging interface
• Low Power– Idle and standby sleep modes– SleepWalking peripherals
• Peripherals– 12-channel Direct Memory Access Controller (DMAC)– 12-channel Event System– Up to five 16-bit Timer/Counters (TC), configurable as either:
• One 16-bit TC with two compare/capture channels• One 8-bit TC with two compare/capture channels• One 32-bit TC with two compare/capture channels, by using two TCs
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– Three 24-bit Timer/Counters for Control (TCC), with extended functions:• Up to four compare channels with optional complementary output• Generation of synchronized pulse width modulation (PWM) pattern across port pins• Deterministic fault protection, fast decay and configurable dead-time between
complementary output• Dithering that increase resolution with up to 5 bit and reduce quantization error
– 32-bit Real Time Counter (RTC) with clock/calendar function– Watchdog Timer (WDT)– CRC-32 generator– One full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface controller
• Device 2.0 and reduced-host low speed and full speed• Flexible end-point configuration and management with dedicated DMA channels• On-chip transceivers including pull-ups and serial resistors• Crystal-less operation in device mode
– Up to six Serial Communication Interfaces (SERCOM), each configurable to operate as either:• USART with full-duplex and single-wire half-duplex configuration• I2C up to 3.4MHz• SPI
– One two-channel Inter-IC Sound (I2S) interface– One 12-bit, 350ksps Analog-to-Digital Converter (ADC) with up to 20 channels
• Differential and single-ended input• 1/2x to 16x programmable gain stage• Automatic offset and gain error compensation• Oversampling and decimation in hardware to support 13-, 14-, 15- or 16-bit resolution
– 10-bit, 350ksps Digital-to-Analog Converter (DAC)– Two Analog Comparators (AC) with window compare function– Peripheral Touch Controller (PTC)
• 256-Channel capacitive touch and proximity sensing• I/O
– Up to 52 programmable I/O pins• Packages
– 64-pin TQFP– 48-pin TQFP, QFN– 32-pin TQFP, QFN
• Operating Voltage– 2.7V - 3.63V
• Temperature range– -40°C to +105°C
SAM DA1
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Table of Contents
Introduction......................................................................................................................1
Features.......................................................................................................................... 1
1. Description...............................................................................................................11
2. Configuration Summary...........................................................................................12
3. Ordering Information................................................................................................143.1. Device Variant A.........................................................................................................................143.2. Device Variant B.........................................................................................................................153.3. Device Identification................................................................................................................... 17
4. Block Diagram......................................................................................................... 18
5. Pinout...................................................................................................................... 205.1. SAM DA1J - TQFP64.................................................................................................................205.2. SAM DA1G - QFN48 / TQFP48................................................................................................. 215.3. SAM DA1E - QFN32 / TQFP32..................................................................................................22
6. Signal Descriptions List........................................................................................... 23
7. I/O Multiplexing and Considerations........................................................................257.1. Multiplexed Signals.................................................................................................................... 257.2. Other Functions..........................................................................................................................27
8. Power Supply and Start-Up Considerations............................................................ 308.1. Power Domain Overview............................................................................................................308.2. Power Supply Considerations.................................................................................................... 308.3. Power-Up................................................................................................................................... 328.4. Power-On Reset and Brown-Out Detector.................................................................................32
9. Product Mapping..................................................................................................... 34
10. Automotive Quality Grade....................................................................................... 35
11. Data Retention.........................................................................................................36
12. Memories.................................................................................................................3712.1. Embedded Memories................................................................................................................. 3712.2. Physical Memory Map................................................................................................................3712.3. NVM Calibration and Auxiliary Space........................................................................................ 38
13. Processor And Architecture.....................................................................................4113.1. Cortex M0+ Processor............................................................................................................... 4113.2. Nested Vector Interrupt Controller..............................................................................................4213.3. Micro Trace Buffer......................................................................................................................44
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13.4. High-Speed Bus System............................................................................................................ 4513.5. AHB-APB Bridge........................................................................................................................ 4713.6. PAC - Peripheral Access Controller........................................................................................... 48
14. Peripherals Configuration Summary........................................................................60
15. DSU - Device Service Unit...................................................................................... 6215.1. Overview.................................................................................................................................... 6215.2. Features..................................................................................................................................... 6215.3. Block Diagram............................................................................................................................6315.4. Signal Description...................................................................................................................... 6315.5. Product Dependencies...............................................................................................................6315.6. Debug Operation........................................................................................................................6415.7. Chip Erase..................................................................................................................................6615.8. Programming..............................................................................................................................6615.9. Intellectual Property Protection.................................................................................................. 6715.10. Device Identification...................................................................................................................6815.11. Functional Description................................................................................................................6915.12. Register Summary..................................................................................................................... 7515.13. Register Description...................................................................................................................77
16. Clock System...........................................................................................................9916.1. Clock Distribution....................................................................................................................... 9916.2. Synchronous and Asynchronous Clocks..................................................................................10016.3. Register Synchronization......................................................................................................... 10016.4. Enabling a Peripheral...............................................................................................................10516.5. Disabling a Peripheral.............................................................................................................. 10516.6. On-demand, Clock Requests................................................................................................... 10516.7. Power Consumption vs. Speed................................................................................................10616.8. Clocks after Reset....................................................................................................................106
17. GCLK - Generic Clock Controller.......................................................................... 10717.1. Overview.................................................................................................................................. 10717.2. Features................................................................................................................................... 10717.3. Block Diagram..........................................................................................................................10717.4. Signal Description.................................................................................................................... 10817.5. Product Dependencies.............................................................................................................10817.6. Functional Description..............................................................................................................10917.7. Register Summary....................................................................................................................11417.8. Register Description................................................................................................................. 115
18. PM – Power Manager............................................................................................12618.1. Overview.................................................................................................................................. 12618.2. Features................................................................................................................................... 12618.3. Block Diagram..........................................................................................................................12718.4. Signal Description.................................................................................................................... 12718.5. Product Dependencies.............................................................................................................12718.6. Functional Description..............................................................................................................12918.7. Register Summary....................................................................................................................136
SAM DA1
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18.8. Register Description.................................................................................................................136
19. SYSCTRL – System Controller............................................................................. 15019.1. Overview.................................................................................................................................. 15019.2. Features................................................................................................................................... 15019.3. Block Diagram..........................................................................................................................15219.4. Signal Description.................................................................................................................... 15219.5. Product Dependencies.............................................................................................................15219.6. Functional Description..............................................................................................................15419.7. Register Summary....................................................................................................................17019.8. Register Description.................................................................................................................172
20. WDT – Watchdog Timer........................................................................................ 20720.1. Overview.................................................................................................................................. 20720.2. Features................................................................................................................................... 20720.3. Block Diagram..........................................................................................................................20820.4. Signal Description.................................................................................................................... 20820.5. Product Dependencies.............................................................................................................20820.6. Functional Description..............................................................................................................20920.7. Register Summary....................................................................................................................21420.8. Register Description.................................................................................................................214
21. RTC – Real-Time Counter.....................................................................................22021.1. Overview.................................................................................................................................. 22021.2. Features................................................................................................................................... 22021.3. Block Diagram..........................................................................................................................22121.4. Signal Description.................................................................................................................... 22121.5. Product Dependencies.............................................................................................................22121.6. Functional Description..............................................................................................................22321.7. Register Summary....................................................................................................................22821.8. Register Description.................................................................................................................231
22. DMAC – Direct Memory Access Controller........................................................... 25522.1. Overview.................................................................................................................................. 25522.2. Features................................................................................................................................... 25522.3. Block Diagram..........................................................................................................................25722.4. Signal Description.................................................................................................................... 25722.5. Product Dependencies.............................................................................................................25722.6. Functional Description..............................................................................................................25822.7. Register Summary....................................................................................................................27822.8. Register Description.................................................................................................................27922.9. Register Summary - SRAM......................................................................................................30422.10. Register Description - SRAM................................................................................................... 304
23. EIC – External Interrupt Controller.........................................................................31123.1. Overview...................................................................................................................................31123.2. Features................................................................................................................................... 31123.3. Block Diagram.......................................................................................................................... 31123.4. Signal Description.................................................................................................................... 312
SAM DA1
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23.5. Product Dependencies.............................................................................................................31223.6. Functional Description..............................................................................................................31323.7. Register Summary....................................................................................................................31723.8. Register Description.................................................................................................................318
24. NVMCTRL – Non-Volatile Memory Controller....................................................... 32724.1. Overview.................................................................................................................................. 32724.2. Features................................................................................................................................... 32724.3. Block Diagram..........................................................................................................................32724.4. Signal Description.................................................................................................................... 32824.5. Product Dependencies.............................................................................................................32824.6. Functional Description..............................................................................................................32924.7. Register Summary....................................................................................................................33624.8. Register Description.................................................................................................................336
25. PORT - I/O Pin Controller......................................................................................34625.1. Overview.................................................................................................................................. 34625.2. Features................................................................................................................................... 34625.3. Block Diagram..........................................................................................................................34725.4. Signal Description.................................................................................................................... 34725.5. Product Dependencies.............................................................................................................34725.6. Functional Description..............................................................................................................34925.7. Register Summary....................................................................................................................35425.8. Register Description.................................................................................................................356
26. EVSYS – Event System........................................................................................ 37226.1. Overview.................................................................................................................................. 37226.2. Features................................................................................................................................... 37226.3. Block Diagram..........................................................................................................................37226.4. Signal Description.................................................................................................................... 37326.5. Product Dependencies.............................................................................................................37326.6. Functional Description..............................................................................................................37426.7. Register Summary....................................................................................................................37926.8. Register Description.................................................................................................................379
27. SERCOM – Serial Communication Interface.........................................................39127.1. Overview.................................................................................................................................. 39127.2. Features................................................................................................................................... 39127.3. Block Diagram..........................................................................................................................39227.4. Signal Description.................................................................................................................... 39227.5. Product Dependencies.............................................................................................................39227.6. Functional Description..............................................................................................................394
28. SERCOM USART – SERCOM Universal Synchronous and Asynchronous Receiverand Transmitter......................................................................................................40028.1. Overview.................................................................................................................................. 40028.2. USART Features...................................................................................................................... 40028.3. Block Diagram..........................................................................................................................401
SAM DA1
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28.4. Signal Description.................................................................................................................... 40128.5. Product Dependencies.............................................................................................................40128.6. Functional Description..............................................................................................................40328.7. Register Summary....................................................................................................................41528.8. Register Description.................................................................................................................415
29. SERCOM SPI – SERCOM Serial Peripheral Interface..........................................43229.1. Overview.................................................................................................................................. 43229.2. Features................................................................................................................................... 43229.3. Block Diagram..........................................................................................................................43329.4. Signal Description.................................................................................................................... 43329.5. Product Dependencies.............................................................................................................43329.6. Functional Description..............................................................................................................43529.7. Register Summary....................................................................................................................44429.8. Register Description.................................................................................................................445
30. SERCOM I2C – SERCOM Inter-Integrated Circuit................................................ 45830.1. Overview.................................................................................................................................. 45830.2. Features................................................................................................................................... 45830.3. Block Diagram..........................................................................................................................45930.4. Signal Description.................................................................................................................... 45930.5. Product Dependencies.............................................................................................................45930.6. Functional Description..............................................................................................................46130.7. Register Summary - I2C Slave.................................................................................................47930.8. Register Description - I2C Slave...............................................................................................47930.9. Register Summary - I2C Master...............................................................................................49330.10. Register Description - I2C Master............................................................................................ 494
31. I2S - Inter-IC Sound Controller..............................................................................51031.1. Overview.................................................................................................................................. 51031.2. Features................................................................................................................................... 51031.3. Block Diagram.......................................................................................................................... 51131.4. Signal Description.................................................................................................................... 51231.5. Product Dependencies.............................................................................................................51231.6. Functional Description..............................................................................................................51431.7. I2S Application Examples......................................................................................................... 52531.8. Register Summary....................................................................................................................52831.9. Register Description.................................................................................................................529
32. TC – Timer/Counter...............................................................................................54232.1. Overview.................................................................................................................................. 54232.2. Features................................................................................................................................... 54232.3. Block Diagram..........................................................................................................................54332.4. Signal Description.................................................................................................................... 54332.5. Product Dependencies.............................................................................................................54432.6. Functional Description..............................................................................................................54532.7. Register Summary....................................................................................................................55732.8. Register Description.................................................................................................................559
SAM DA1
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33. TCC – Timer/Counter for Control Applications...................................................... 57533.1. Overview.................................................................................................................................. 57533.2. Features................................................................................................................................... 57533.3. Block Diagram..........................................................................................................................57633.4. Signal Description.................................................................................................................... 57633.5. Product Dependencies.............................................................................................................57733.6. Functional Description..............................................................................................................57833.7. Register Summary....................................................................................................................61133.8. Register Description.................................................................................................................613
34. USB – Universal Serial Bus...................................................................................65034.1. Overview.................................................................................................................................. 65034.2. Features................................................................................................................................... 65034.3. USB Block Diagram..................................................................................................................65134.4. Signal Description.................................................................................................................... 65134.5. Product Dependencies.............................................................................................................65134.6. Functional Description..............................................................................................................65334.7. Register Summary....................................................................................................................67134.8. Register Description.................................................................................................................675
35. ADC – Analog-to-Digital Converter........................................................................72735.1. Overview.................................................................................................................................. 72735.2. Features................................................................................................................................... 72735.3. Block Diagram..........................................................................................................................72835.4. Signal Description.................................................................................................................... 72835.5. Product Dependencies.............................................................................................................72935.6. Functional Description..............................................................................................................73035.7. Register Summary....................................................................................................................73935.8. Register Description.................................................................................................................740
36. AC – Analog Comparators.....................................................................................75736.1. Overview.................................................................................................................................. 75736.2. Features................................................................................................................................... 75736.3. Block Diagram..........................................................................................................................75836.4. Signal Description.................................................................................................................... 75836.5. Product Dependencies.............................................................................................................75836.6. Functional Description..............................................................................................................76036.7. Register Summary....................................................................................................................77036.8. Register Description.................................................................................................................770
37. DAC – Digital-to-Analog Converter........................................................................78137.1. Overview.................................................................................................................................. 78137.2. Features................................................................................................................................... 78137.3. Block Diagram..........................................................................................................................78137.4. Signal Description.................................................................................................................... 78137.5. Product Dependencies.............................................................................................................78137.6. Functional Description..............................................................................................................78337.7. Register Summary....................................................................................................................787
SAM DA1
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37.8. Register Description.................................................................................................................787
38. PTC - Peripheral Touch Controller.........................................................................79538.1. Overview.................................................................................................................................. 79538.2. Features................................................................................................................................... 79538.3. Block Diagram..........................................................................................................................79638.4. Signal Description.................................................................................................................... 79638.5. Product Dependencies.............................................................................................................79638.6. Functional Description..............................................................................................................798
39. Electrical Characteristics....................................................................................... 80039.1. Disclaimer.................................................................................................................................80039.2. Absolute Maximum Ratings......................................................................................................80039.3. Supply Characteristics..............................................................................................................80039.4. Maximum Clock Frequencies...................................................................................................80139.5. Power Consumption.................................................................................................................80339.6. Peripheral Power Consumption................................................................................................80539.7. I/O Pin Characteristics..............................................................................................................80839.8. Injection Current.......................................................................................................................81239.9. Analog Characteristics............................................................................................................. 81339.10. NVM Characteristics................................................................................................................ 82239.11. Oscillators Characteristics........................................................................................................82239.12. PTC Typical Characteristics.....................................................................................................83139.13. USB Characteristics.................................................................................................................83339.14. Timing Characteristics..............................................................................................................834
40. Packaging Information...........................................................................................84140.1. Thermal Considerations........................................................................................................... 84140.2. Package Drawings................................................................................................................... 84240.3. Soldering Profile.......................................................................................................................848
41. Schematic Checklist.............................................................................................. 84941.1. Introduction...............................................................................................................................84941.2. Power Supply........................................................................................................................... 84941.3. External Analog Reference Connections................................................................................. 85041.4. External Reset Circuit...............................................................................................................85141.5. Clocks and Crystal Oscillators..................................................................................................85241.6. Unused or Unconnected Pins...................................................................................................85641.7. Programming and Debug Ports................................................................................................85641.8. USB Interface...........................................................................................................................859
42. Errata.....................................................................................................................86142.1. Die Revision E..........................................................................................................................86142.2. Die Revision F..........................................................................................................................866
43. Conventions...........................................................................................................87043.1. Numerical Notation...................................................................................................................87043.2. Memory Size and Type.............................................................................................................87043.3. Frequency and Time.................................................................................................................870
SAM DA1
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43.4. Registers and Bits.................................................................................................................... 871
44. Acronyms and Abbreviations.................................................................................872
45. Datasheet Revision History................................................................................... 87545.1. Revision B - 03/2017................................................................................................................87545.2. Revision A - 04/2016................................................................................................................876
The Microchip Web Site.............................................................................................. 877
Customer Change Notification Service........................................................................877
Customer Support....................................................................................................... 877
Product Identification System......................................................................................878
Microchip Devices Code Protection Feature............................................................... 878
Legal Notice.................................................................................................................879
Trademarks................................................................................................................. 879
Quality Management System Certified by DNV...........................................................880
Worldwide Sales and Service......................................................................................881
SAM DA1
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1. DescriptionThe SAM DA1 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor,and ranging from 32- to 64-pins with up to 64KB Flash, 8KB of SRAM and up to 2KB Read-While-Write(RWW) Flash section. The SAM DA1 operate at a maximum frequency of 48MHz and reach 2.46CoreMark/MHz. They are designed for simple and intuitive migration with identical peripheral modules,hex compatible code, identical linear address map and pin compatible migration paths between alldevices in the product series. All devices include intelligent and flexible peripherals, Event System forinter-peripheral signaling, and support for capacitive touch button, slider and wheel user interfaces.
The SAM DA1 provide the following features: In-system programmable Flash, 12-channel direct memoryaccess (DMA) controller, 12-channel Event System, programmable interrupt controller, up to 52programmable I/O pins, 32-bit real-time clock and calendar, up to five 16-bit Timer/Counters (TC) andthree 24-bit Timer/Counters for Control (TCC), where each TC can be configured to perform frequencyand waveform generation, accurate program execution timing or input capture with time and frequencymeasurement of digital signals. The TCs can operate in 8- or 16-bit mode, selected TCs can be cascadedto form a 32-bit TC, and three timer/counters have extended functions optimized for motor, lighting andother control applications. The series provide one full-speed USB 2.0 embedded host and deviceinterface; up to six Serial Communication Modules (SERCOM) that each can be configured to act as anUSART, UART, SPI, I2C up to 3.4MHz, SMBus, PMBus, and LIN slave; two-channel I2S interface; up totwenty-channel 350ksps 12-bit ADC with programmable gain and optional oversampling and decimationsupporting up to 16-bit resolution, one 10-bit 350ksps DAC, two analog comparators with window mode,Peripheral Touch Controller supporting up to 256 buttons, sliders, wheels and proximity sensing;programmable Watchdog Timer, brown-out detector and power-on reset and two-pin Serial Wire Debug(SWD) program and debug interface.
All devices have accurate and low-power external and internal oscillators. All oscillators can be used as asource for the system clock. Different clock domains can be independently configured to run at differentfrequencies, enabling power saving by running each peripheral at its optimal clock frequency, and thusmaintaining a high CPU frequency while reducing power consumption.
The SAM DA1 have two software-selectable sleep modes, idle and standby. In idle mode the CPU isstopped while all other functions can be kept running. In standby all clocks and functions are stoppedexpect those selected to continue running. The device supports SleepWalking. This feature allows theperipheral to wake up from sleep based on predefined conditions, and thus allows the CPU to wake uponly when needed, e.g. when a threshold is crossed or a result is ready. The Event System supportssynchronous and asynchronous events, allowing peripherals to receive, react to and send events even instandby mode.
The Flash program memory can be reprogrammed in-system through the SWD interface. The sameinterface can be used for non-intrusive on-chip debug of application code. A boot loader running in thedevice can use any communication interface to download and upgrade the application program in theFlash memory.
The SAM DA1 microcontrollers are supported with a full suite of program and system development tools,including C compilers, macro assemblers, program debugger/simulators, programmers and evaluationkits.
SAM DA1
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2. Configuration SummarySAM DA1J SAM DA1G SAM DA1E
Pins 64 48 32
General Purpose I/O-pins(GPIOs)
52 38 26
Flash 64/32/16KB 64/32/16KB 64/32/16KB
RWW Flash section 2KB/1KB/512B 2KB/1KB/512B 2KB/1KB/512B
SRAM 8/4/4KB 8/4/4KB 8/4/4KB
Timer Counter (TC)instances
5 3 3
Waveform output channelsper TC instance
2 2 2
Timer Counter for Control(TCC) instances
3 3 3
Waveform output channelsper TCC
8/4/2 8/4/2 6/4/2
DMA channels 12 12 12
USB interface 1 1 1
Serial CommunicationInterface (SERCOM)instances
6 6 4
Inter-IC Sound (I2S)interface
1 1 1
Analog-to-Digital Converter(ADC) channels
20 14 10
Analog Comparators (AC) 2 2 2
Digital-to-Analog Converter(DAC) channels
1 1 1
Real-Time Counter (RTC) Yes Yes Yes
RTC alarms 1 1 1
RTC compare values One 32-bit value or
two 16-bit values
One 32-bit value or
two 16-bit values
One 32-bit value or
two 16-bit values
External Interrupt lines 16 16 16
Peripheral Touch Controller(PTC) X and Y lines
16x16 12x10 10x6
Maximum CPU frequency 48MHz
SAM DA1
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SAM DA1J SAM DA1G SAM DA1E
Packages TQFP QFN
TQFP
QFN
TQFP
Oscillators 32.768kHz crystal oscillator (XOSC32K)
0.4-32MHz crystal oscillator (XOSC)
32.768kHz internal oscillator (OSC32K)
32KHz ultra-low-power internal oscillator (OSCULP32K)
8MHz high-accuracy internal oscillator (OSC8M)
48MHz Digital Frequency Locked Loop (DFLL48M)
96MHz Fractional Digital Phased Locked Loop (FDPLL96M)
Event System channels 12 12 12
SW Debug Interface Yes Yes Yes
Watchdog Timer (WDT) Yes Yes Yes
SAM DA1
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3. Ordering Information SAM D A1 E 14 A - A B T
Product FamilySAM D = Baseline Cortex-M0+ MCU
A1 = Automotive basic feature set + DMA,
E = 32 PinsG = 48 PinsJ = 64 Pins
T = Tape and Reel
B = -40OC - 105OC Matte Sn Plating (only DA1)
A = TQFPM = QFN Wettable Flanks
Adv Timers, USB, I2S, PTC
Product Series
Flash Memory Density
Device VariantA = Silicon revision E (Initial revision)B = Silicon revision F
Pin Count
Package Carrier
Package Grade
16 = 64KB15 = 32KB 14 = 16KB
Package Type
3.1 Device Variant A
3.1.1 SAM DA1E
OrderingCode
Flash(Bytes)
SRAM(Bytes)
Package Carrier Type Temp.Grade PTC, USB,I2S
ATSAMDA1E14A-ABT(1)
16K 4K TQFP32 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1E14A-MBT(1)
16K 4K QFN32 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1E15A-ABT(1)
32K 4K TQFP32 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1E15A-MBT(1)
32K 4K QFN32 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1E16A-ABT(1)
64K 8K TQFP32 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1E16A-MBT(1)
64K 8K QFN32 Tape andReel
-40°C to+105°C
Yes
1. Contact your local sales representative for availability.
SAM DA1
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3.1.2 SAM DA1G
OrderingCode
Flash(Bytes)
SRAM(Bytes)
Package Carrier Type Temp.Grade PTC, USB,I2S
ATSAMDA1G14A-ABT(1)
16K 4K TQFP48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G14A-MBT(1)
16K 4K QFN48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G15A-ABT(1)
32K 4K TQFP48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G15A-MBT(1)
32K 4K QFN48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G16A-ABT(1)
64K 8K TQFP48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G16A-MBT(1)
64K 8K QFN48 Tape andReel
-40°C to+105°C
Yes
1. Contact your local sales representative for availability.
3.1.3 SAM DA1J
OrderingCode
Flash(Bytes)
SRAM(Bytes)
Package Carrier Type Temp.Grade PTC, USB,I2S
ATSAMDA1J14A-ABT(1)
16K 4K TQFP64 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1J15A-ABT(1)
32K 4K TQFP64 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1J16A-ABT(1)
64K 8K TQFP64 Tape andReel
-40°C to+105°C
Yes
1. Contact your local sales representative for availability.
3.2 Device Variant B
3.2.1 SAM DA1E
OrderingCode
Flash(Bytes)
SRAM(Bytes)
Package Carrier Type Temp.Grade PTC, USB,I2S
ATSAMDA1E14B-ABT(1)
16K 4K TQFP32 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1E14B-MBT(1)
16K 4K QFN32 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1E15B-ABT(1)
32K 4K TQFP32 Tape andReel
-40°C to+105°C
Yes
SAM DA1
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OrderingCode
Flash(Bytes)
SRAM(Bytes)
Package Carrier Type Temp.Grade PTC, USB,I2S
ATSAMDA1E15B-MBT(1)
32K 4K QFN32 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1E16B-ABT(1)
64K 8K TQFP32 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1E16B-MBT(1)
64K 8K QFN32 Tape andReel
-40°C to+105°C
Yes
1. Contact your local sales representative for availability.
3.2.2 SAM DA1G
OrderingCode
Flash(Bytes)
SRAM(Bytes)
Package Carrier Type Temp.Grade PTC, USB,I2S
ATSAMDA1G14B-ABT(1)
16K 4K TQFP48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G14B-MBT(1)
16K 4K QFN48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G15B-ABT(1)
32K 4K TQFP48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G15B-MBT(1)
32K 4K QFN48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G16B-ABT(1)
64K 8K TQFP48 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1G16B-MBT(1)
64K 8K QFN48 Tape andReel
-40°C to+105°C
Yes
1. Contact your local sales representative for availability.
3.2.3 SAM DA1J
OrderingCode
Flash(Bytes)
SRAM(Bytes)
Package Carrier Type Temp.Grade PTC, USB,I2S
ATSAMDA1J14B-ABT(1)
16K 4K TQFP64 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1J15B-ABT(1)
32K 4K TQFP64 Tape andReel
-40°C to+105°C
Yes
ATSAMDA1J16B-ABT(1)
64K 8K TQFP64 Tape andReel
-40°C to+105°C
Yes
1. Contact your local sales representative for availability.
SAM DA1
© 2017 Microchip Technology Inc. Datasheet Complete 40001895A-page 16
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3.3 Device IdentificationThe DSU - Device Service Unit peripheral provides the Device Selection bits in the Device Identificationregister (DID.DEVSEL) in order to identify the device by software. The SAM DA1 variants have a resetvalue of DID=0x1001drxx, with the LSB identifying the die number ('d'), the die revision ('r') and thedevice selection ('xx').
Table 3-1. SAM DA1 Device Identification Values
Device Variant DID.DEVSEL Device ID (DID)
Reserved 0x00 - 0x28
SAMDA1J16A 0x29 0x10011429
SAMDA1J15A 0x2A 0x1001142A
SAMDA1J14A 0x2B 0x1001142B
SAMDA1G16A 0x2C 0x1001142C
SAMDA1G15A 0x2D 0x1001142D
SAMDA1G14A 0x2E 0x1001142D
SAMDA1E16A 0x2F 0x1001142F
SAMDA1E15A 0x30 0x10011430
SAMDA1E14A 0x31 0x10011431
Reserved 0x32 - 0x63
SAMDA1J16B 0x64 0x10011564
SAMDA1J15B 0x65 0x10011565
SAMDA1J14B 0x66 0x10011566
SAMDA1G16B 0x67 0x10011567
SAMDA1G15B 0x68 0x10011568
SAMDA1G14B 0x69 0x10011569
SAMDA1E16B 0x6A 0x1001156A
SAMDA1E15B 0x6B 0x1001156B
SAMDA1E14B 0x6C 0x1001156C
Reserved 0x6D - 0xFF
Note: The device variant (last letter of the ordering number) is independent of the die revision(DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marksevolution of the die. The device variant denotes functional differences, whereas the die revision marksevolution of the die.
Related LinksDID
SAM DA1
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4. Block Diagram
6 x SERCOM
8 x Timer Counter
REAL TIME COUNTER
AHB-APB BRIDGE C
M
MHIGH SPEED BUS MATRIX
POR
T
PO
RT
WATCHDOG TIMER
SERIAL WIRESWDIO
S
CORTEX-M0+ PROCESSOR Fmax 48 MHz
SWCLK
DEVICE SERVICE
UNIT
AHB-APB BRIDGE A
20-CHANNEL 12-bit ADC 350KSPS
AIN[19..0]
VREFA
AIN[3..0]
S
SRAM CONTROLLER
8/4/4KB RAM
M
RESET CONTROLLER
SLEEP CONTROLLER
CLOCK CONTROLLER
POWER MANAGER
RESETN
5 x TIMER / COUNTER
EVE
NT
SYST
EM
S
6 x SERCOM
2 ANALOG COMPARATORS
SYSTEM CONTROLLER
XOUT XIN
XOUT32 XIN32
OSC32K
OSC8M
DFLL48M
BOD33
XOSC32K
XOSC
VREF
X[15..0]
Y[15..0]
PERIPHERAL TOUCH
CONTROLLER
PERIPHERAL ACCESS CONTROLLER
AHB-APB BRIDGE B
VREFA
VOUT
10-bit DAC
EXTERNAL INTERRUPT CONTROLLER
PERIPHERAL ACCESS CONTROLLER
PERIPHERAL ACCESS CONTROLLER
EXTINT[15..0] NMI
GCLK_IO[7..0]
S
PAD0
WO1
PAD1PAD2PAD3
WO0
VREFB
64/32/16KB NVM
NVM CONTROLLER
Cache
S
DMA
USB FSDEVICE
MINI-HOST
DP
DM
3x TIMER / COUNTERFOR CONTROL
WOn
IOBUS
FDPLL96MDMA
DMA
DMA
DMA
DMA
MCK[1..0]SCK[1..0]INTER-IC
SOUND CONTROLLER
SD[1..0]FS[1..0]
DMA
MIC
RO
TRAC
E BU
FFER
SOF 1KHZ
WO0WO1
(2)
GENERIC CLOCKCONTROLLER
CMP[1..0]
2KB/1KB/512B RWW Flash Section
OSCULP32K
1. Some products have different number of SERCOM instances, Timer/Counter instances, PTCsignals and ADC signals. Refer to the Configuration Summary for details.
SAM DA1
© 2017 Microchip Technology Inc. Datasheet Complete 40001895A-page 18
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2. The three TCC instances have different configurations, including the number of Waveform Output(WO) lines. Refer to the TCC Configuration for details.
Related LinksConfiguration SummaryTCC Configurations
SAM DA1
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5. Pinout
5.1 SAM DA1J - TQFP64
PA00 1PA01 2PA02 3PA03 4PB04 5PB05 6
GNDANA 7VDDANA 8
PB06 9PB07 10PB08 11PB09 12PA04 13PA05 14PA06 15PA07 16
PA08
17PA
0918
PA10
19PA
1120
VDD
IO21
GN
D22
PB10
23PB
1124
PB12
25PB
1326
PB14
27PB
1528
PA12
29PA
1330
PA14
31PA
1532
VDDIO48GND47PA2546PA2445PA2344PA2243PA2142PA2041PB1740PB1639PA1938PA1837PA1736PA1635VDDIO34GND33
PB22
49PB
2350
PA27
51R
ESET
52PA
2853
GN
D54
VDD
CO
RE
55VD
DIN
56PA
3057
PA31
58PB
3059
PB31
60PB
0061
PB01
62PB
0263
PB03
64
DIGITAL PINANALOG PINOSCILLATORGROUNDINPUT SUPPLY REGULATED OUTPUT SUPPLYRESET PIN
SAM DA1
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5.2 SAM DA1G - QFN48 / TQFP48
PA21
PA00 1PA01 2PA02 3PA03 4
GNDANA 5VDDANA 6
PB08 7PB09 8PA04 9PA05 10PA06 11PA07 12
PA08
13PA
0914
PA10
15PA
1116
VDD
IO17
GN
D18
PB10
19PB
1120
PA12
21PA
1322
PA14
23PA
1524
VDDIO36GND35PA2534PA2433PA2332PA2231
30PA2029PA1928PA1827PA1726PA1625
PB22
37PB
2338
PA27
39R
ESET
40PA
2841
GN
D42
VDD
CO
RE
43VD
DIN
44PA
3045
PA31
46PB
0247
PB03
48
DIGITAL PINANALOG PINOSCILLATORGROUNDINPUT SUPPLYREGULATED OUTPUT SUPPLYRESET PIN
SAM DA1
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5.3 SAM DA1E - QFN32 / TQFP32
PA00 1PA01 2PA02 3PA03 4PA04 5PA05 6PA06 7PA07 8
VDD
ANA
9G
ND
10PA
0811
PA09
12PA
1013
PA11
14PA
1415
PA15
16
PA2524PA2423PA2322PA2221PA1920PA1819PA1718PA1617
PA27
25R
ESET
26PA
2827
GN
D28
VDD
CO
RE
29VD
DIN
30PA
3031
PA31
32
DIGITAL PINANALOG PINOSCILLATORGROUNDINPUT SUPPLYREGULATED OUTPUT SUPPLYRESET PIN
SAM DA1
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6. Signal Descriptions ListThe following table gives details on signal names classified by peripheral.
Signal Name Function Type Active Level
Analog Comparators - AC
AIN[3:0] AC Analog Inputs Analog
CMP[:0] AC Comparator Outputs Digital
Analog Digital Converter - ADC
AIN[19:0] ADC Analog Inputs Analog
VREFA ADC Voltage External Reference A Analog
VREFB ADC Voltage External Reference B Analog
Digital Analog Converter - DAC
VOUT DAC Voltage output Analog
VREFA DAC Voltage External Reference Analog
External Interrupt Controller
EXTINT[15:0] External Interrupts Input
NMI External Non-Maskable Interrupt Input
Generic Clock Generator - GCLK
GCLK_IO[7:0] Generic Clock (source clock or generic clock generatoroutput)
I/O
Inter-IC Sound Controller - I2S
MCK[1:0] Master Clock I/O
SCK[1:0] Serial Clock I/O
FS[1:0] I2S Word Select or TDM Frame Sync I/O
SD[1:0] Serial Data Input or Output I/O
Power Manager - PM
RESETN Reset Input Low
Serial Communication Interface - SERCOMx
PAD[3:0] SERCOM I/O Pads I/O
System Control - SYSCTRL
XIN Crystal Input Analog/ Digital
XIN32 32kHz Crystal Input Analog/ Digital
XOUT Crystal Output Analog
XOUT32 32kHz Crystal Output Analog
SAM DA1
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Signal Name Function Type Active Level
Timer Counter - TCx
WO[1:0] Waveform Outputs Output
Timer Counter - TCCx
WO[1:0] Waveform Outputs Output
Peripheral Touch Controller - PTC
X[15:0] PTC Input Analog
Y[15:0] PTC Input Analog
General Purpose I/O - PORT
PA25 - PA00 Parallel I/O Controller I/O Port A I/O
PA28 - PA27 Parallel I/O Controller I/O Port A I/O
PA31 - PA30 Parallel I/O Controller I/O Port A I/O
PB17 - PB00 Parallel I/O Controller I/O Port B I/O
PB23 - PB22 Parallel I/O Controller I/O Port B I/O
PB31 - PB30 Parallel I/O Controller I/O Port B I/O
Universal Serial Bus - USB
DP DP for USB I/O
DM DM for USB I/O
SOF 1kHz USB Start of Frame I/O
SAM DA1
© 2017 Microchip Technology Inc. Datasheet Complete 40001895A-page 24
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7. I/O Multiplexing and Considerations
7.1 Multiplexed SignalsEach pin is by default controlled by the PORT as a general purpose I/O and alternatively it can beassigned to one of the peripheral functions A, B, C, D, E, F, G or H. To enable a peripheral function on apin, the Peripheral Multiplexer Enable bit in the Pin Configuration register corresponding to that pin(PINCFGn.PMUXEN, n = 0-31) in the PORT must be written to one. The selection of peripheral functionA to H is done by writing to the Peripheral Multiplexing Odd and Even bits in the Peripheral Multiplexingregister (PMUXn.PMUXE/O) in the PORT.
This table describes the peripheral signals multiplexed to the PORT I/O pins.
Table 7-1. PORT Function MultiplexingPin I/O Pin Supply A B(1)(2) C D E F G H
SAMDA1E SAMDA1G SAMDA1J EIC REF ADC AC PTC DAC SERCOM(1)(2) SERCOM-ALT TC(3)
/TCC
TCC COM AC/
GCLK
1 1 1 PA00 VDDANA EXTINT[0] SERCOM1/PAD[0]
TCC2/WO[0]
2 2 2 PA01 VDDANA EXTINT[1] SERCOM1/PAD[1]
TCC2/WO[1]
3 3 3 PA02 VDDANA EXTINT[2] AIN[0] Y[0] VOUT
4 4 4 PA03 VDDANA EXTINT[3] ADC/VREFADAC/
VREFA
AIN[1] Y[1]
5 PB04 VDDANA EXTINT[4] AIN[12] Y[10]
6 PB05 VDDANA EXTINT[5] AIN[13] Y[11]
9 PB06 VDDANA EXTINT[6] AIN[14] Y[12]
10 PB07 VDDANA EXTINT[7] AIN[15] Y[13]
7 11 PB08 VDDANA EXTINT[8] AIN[2] Y[14] SERCOM4/PAD[0]
TC4/WO[0]
8 12 PB09 VDDANA EXTINT[9] AIN[3] Y[15] SERCOM4/PAD[1]
TC4/WO[1]
5 9 13 PA04 VDDANA EXTINT[4] ADC/VREFB
AIN[4] AIN[0] Y[2] SERCOM0/PAD[0]
TCC0/WO[0]
6 10 14 PA05 VDDANA EXTINT[5] AIN[5] AIN[1] Y[3] SERCOM0/PAD[1]
TCC0/WO[1]
7 11 15 PA06 VDDANA EXTINT[6] AIN[6] AIN[2] Y[4] SERCOM0/PAD[2]
TCC1/WO[0]
8 12 16 PA07 VDDANA EXTINT[7] AIN[7] AIN[3] Y[5] SERCOM0/PAD[3]
TCC1/WO[1] I2S/SD[0]
11 13 17 PA08 VDDIO NMI AIN[16] X[0] SERCOM0/PAD[0]
SERCOM2/PAD[0]
TCC0/WO[0] TCC1/WO[2]
I2S/SD[1]
12 14 18 PA09 VDDIO EXTINT[9] AIN[17] X[1] SERCOM0/PAD[1]
SERCOM2/PAD[1]
TCC0/WO[1] TCC1/WO[3]
I2S/MCK[0]
13 15 19 PA10 VDDIO EXTINT[10] AIN[18] X[2] SERCOM0/PAD[2]
SERCOM2/PAD[2]
TCC1/WO[0] TCC0/WO[2]
I2S/SCK[0]
GCLK_IO[4]
14 16 20 PA11 VDDIO EXTINT[11] AIN[19] X[3] SERCOM0/PAD[3]
SERCOM2/PAD[3]
TCC1/WO[1] TCC0/WO[3]
I2S/FS[0] GCLK_IO[5]
19 23 PB10 VDDIO EXTINT[10] SERCOM4/PAD[2]
TC5/WO[0] TCC0/WO[4]
I2S/MCK[1]
GCLK_IO[4]
20 24 PB11 VDDIO EXTINT[11] SERCOM4/PAD[3]
TC5/WO[1] TCC0/WO[5]
I2S/SCK[1]
GCLK_IO[5]
25 PB12 VDDIO EXTINT[12] X[12] SERCOM4/PAD[0]
TC4/WO[0] TCC0/WO[6]
I2S/FS[1] GCLK_IO[6]
26 PB13 VDDIO EXTINT[13] X[13] SERCOM4/PAD[1]
TC4/WO[1] TCC0/WO[7]
GCLK_IO[7]
27 PB14 VDDIO EXTINT[14] X[14] SERCOM4/PAD[2]
TC5/WO[0] GCLK_IO[0]
SAM DA1
© 2017 Microchip Technology Inc. Datasheet Complete 40001895A-page 25
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Pin I/O Pin Supply A B(1)(2) C D E F G H
SAMDA1E SAMDA1G SAMDA1J EIC REF ADC AC PTC DAC SERCOM(1)(2) SERCOM-ALT TC(3)
/TCC
TCC COM AC/
GCLK
28 PB15 VDDIO EXTINT[15] X[15] SERCOM4/PAD[3]
TC5/WO[1] GCLK_IO[1]
21 29 PA12 VDDIO EXTINT[12] SERCOM2/PAD[0]
SERCOM4/PAD[0]
TCC2/WO[0] TCC0/WO[6]
AC/CMP[0]
22 30 PA13 VDDIO EXTINT[13] SERCOM2/PAD[1]
SERCOM4/PAD[1]
TCC2/WO[1] TCC0/WO[7]
AC/CMP[1]
15 23 31 PA14 VDDIO EXTINT[14] SERCOM2/PAD[2]
SERCOM4/PAD[2]
TC3/WO[0] TCC0/WO[4]
GCLK_IO[0]
16 24 32 PA15 VDDIO EXTINT[15] SERCOM2/PAD[3]
SERCOM4/PAD[3]
TC3/WO[1] TCC0/WO[5]
GCLK_IO[1]
17 25 35 PA16 VDDIO EXTINT[0] X[4] SERCOM1/PAD[0]
SERCOM3/PAD[0]
TCC2/WO[0] TCC0/WO[6]
GCLK_IO[2]
18 26 36 PA17 VDDIO EXTINT[1] X[5] SERCOM1/PAD[1]
SERCOM3/PAD[1]
TCC2/WO[1] TCC0/WO[7]
GCLK_IO[3]
19 27 37 PA18 VDDIO EXTINT[2] X[6] SERCOM1/PAD[2]
SERCOM3/PAD[2]
TC3/WO[0] TCC0/WO[2]
AC/CMP[0]
20 28 38 PA19 VDDIO EXTINT[3] X[7] SERCOM1/PAD[3]
SERCOM3/PAD[3]
TC3/WO[1] TCC0/WO[3]
I2S/SD[0] AC/CMP[1]
39 PB16 VDDIO EXTINT[0] SERCOM5/PAD[0]
TC6/WO[0] TCC0/WO[4]
I2S/SD[1] GCLK_IO[2]
40 PB17 VDDIO EXTINT[1] SERCOM5/PAD[1]
TC6/WO[1] TCC0/WO[5]
I2S/MCK[0]
GCLK_IO[3]
29 41 PA20 VDDIO EXTINT[4] X[8] SERCOM5/PAD[2]
SERCOM3/PAD[2]
TC7/WO[0] TCC0/WO[6]
I2S/SCK[0]
GCLK_IO[4]
30 42 PA21 VDDIO EXTINT[5] X[9] SERCOM5/PAD[3]
SERCOM3/PAD[3]
TC7/WO[1] TCC0/WO[7]
I2S/FS[0] GCLK_IO[5]
21 31 43 PA22 VDDIO EXTINT[6] X[10] SERCOM3/PAD[0]
SERCOM5/PAD[0]
TC4/WO[0] TCC0/WO[4]
GCLK_IO[6]
22 32 44 PA23 VDDIO EXTINT[7] X[11] SERCOM3/PAD[1]
SERCOM5/PAD[1]
TC4/WO[1] TCC0/WO[5]
USB/SOF1kHz
GCLK_IO[7]
23 33 45 PA24(5) VDDIO EXTINT[12] SERCOM3/PAD[2]
SERCOM5/PAD[2]
TC5/WO[0] TCC1/WO[2]
USB/DM
24 34 46 PA25(5) VDDIO EXTINT[13] SERCOM3/PAD[3]
SERCOM5/PAD[3]
TC5/WO[1] TCC1/WO[3]
USB/DP
37 49 PB22 VDDIO EXTINT[6] SERCOM5/PAD[2]
TC7/WO[0] GCLK_IO[0]
38 50 PB23 VDDIO EXTINT[7] SERCOM5/PAD[3]
TC7/WO[1] GCLK_IO[1]
25 39 51 PA27 VDDIO EXTINT[15] GCLK_IO[0]
27 41 53 PA28 VDDIO EXTINT[8] GCLK_IO[0]
31 45 57 PA30 VDDIO EXTINT[10] SERCOM1/PAD[2]
TCC1/WO[0] SWCLK GCLK_IO[0]
32 46 58 PA31 VDDIO EXTINT[11] SERCOM1/PAD[3]
TCC1/WO[1] SWDIO(4)
59 PB30 VDDIO EXTINT[14] SERCOM5/PAD[0]
TCC0/WO[0] TCC1/WO[2]
60 PB31 VDDIO EXTINT[15] SERCOM5/PAD[1]
TCC0/WO[1] TCC1/WO[3]
61 PB00 VDDANA EXTINT[0] AIN[8] Y[6] SERCOM5/PAD[2]
TC7/WO[0]
62 PB01 VDDANA EXTINT[1] AIN[9] Y[7] SERCOM5/PAD[3]
TC7/WO[1]
47 63 PB02 VDDANA EXTINT[2] AIN[10] Y[8] SERCOM5/PAD[0]
TC6/WO[0]
48 64 PB03 VDDANA EXTINT[3] AIN[11] Y[9] SERCOM5/PAD[1]
TC6/WO[1]
1. All analog pin functions are on peripheral function B. Peripheral function B must be selected todisable the digital control of the pin.
2. Only some pins can be used in SERCOM I2C mode.
SAM DA1
© 2017 Microchip Technology Inc. Datasheet Complete 40001895A-page 26
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3. Note that not all TC6 and TC7 waveform outputs are available on SAM DA1E and G devices butmay still be used for internal counting/timing applications.
4. This function is only activated in the presence of a debugger.5. If the PA24 and PA25 pins are not connected, it is recommended to enable a pull-up on PA24 and
PA25 through input GPIO mode. The aim is to avoid an eventually extract power consumption(
-
7.2.4 GPIO ClustersTable 7-5. GPIO Clusters
PACKAGE CLUSTER GPIO SUPPLIESPINSCONNECTEDTO THECLUSTER
64pins 1 PB31 PB30 PA31 PA30 VDDINpin56/GNDpin54
2 PA28 PA27 PB23 PB22 VDDINpin56/GNDpin54 andVDDIO pin48/GND pin47
3 PA25 PA24 PA23 PA22 PA21 PA20 PB17 PB16 PA19 PA18 PA17 PA16 VDDIO pin48/GND pin47and VDDIOpin34/GNDpin33
4 PA15 PA14 PA13 PA12 PB15 PB14 PB13 PB12 PB11 PB10 VDDIO pin34/GND pin33and VDDIOpin21/GNDpin22
5 PA11 PA10 PA09 PA08 VDDIOpin21/GNDpin22
6 PA07 PA06 PA05 PA04 PB09 PB08 PB07 PB06 VDDANA pin8/GNDANApin7
7 PB05 PB04 PA03 PA02 PA01 PA00 PB03 PB02 PB01 PB00 VDDANA pin8/GNDANApin7
48pins 1 PA31 PA30 VDDINpin44/GNDpin42
2 PA28 PA27 PB23 PB22 VDDINpin44/GNDpin42 andVDDIOpin36/GNDpin35
3 PA25 PA24 PA23 PA22 PA21 PA20 PA19 PA18 PA17 PA16 PA15 PA14 PA13 PA12 PB11 PB10 VDDIOpin36/GNDpin35 andVDDIOpin17/GNDpin18
4 PA11 PA10 PA09 PA08 VDDIOpin17/GNDpin18
5 PA07 PA06 PA05 PA04 PB09 PB08 VDDANA pin6/GNDANA pin5
6 PA03 PA02 PA01 PA00 PB03 PB02 VDDANA pin6/GNDANA pin5
32pins 1 PA31 PA30 VDDINpin30/GND pin28
SAM DA1
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PACKAGE CLUSTER GPIO SUPPLIESPINSCONNECTEDTO THECLUSTER
2 PA28 PA27 PA25 PA24 PA23 PA22 PA19 PA18 PA17 PA16 PA15 PA14 PA11 PA10 PA09 PA08 VDDINpin30/GND pin28 andVDDANApin9/GNDpin10
3 PA07 PA06 PA05 PA04 PA03 PA02 PA01 PA00 VDDANApin9/GNDpin10
7.2.5 TCC ConfigurationsThe SAM DA1 has three instances of the Timer/Counter for Control applications (TCC) peripheral, ,TCC[2:0]. The following table lists the features for each TCC instance.
Table 7-6. TCC Configuration Summary
TCC# Channels(CC_NUM)
WaveformOutput
(WO_NUM)
Countersize
Fault Dithering Outputmatrix
Dead TimeInsertion
(DTI)
SWAP Patterngeneration
0 4 8 24-bit Yes Yes Yes Yes Yes Yes
1 2 4 24-bit Yes Yes Yes
2 2 2 16-bit Yes
Note: The number of CC registers (CC_NUM) for each TCC corresponds to the number of compare/capture channels, so that a TCC can have more Waveform Outputs (WO_NUM) than CC registers.
SAM DA1
© 2017 Microchip Technology Inc. Datasheet Complete 40001895A-page 29
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8. Power Supply and Start-Up Considerations
8.1 Power Domain Overview
VOLTAGEREGULATOR
VDD
IN
VDD
CO
RE
GN
DADC
AC
DAC
PTC
XOSC32K
OSC32K
VDD
ANA
GN
DAN
A
PA[7:2]
PB[9:0]
PA[1:0]
Digital Logic(CPU, peripherals)
DFLL48M
VDD
IO
OSC8M
XOSC
OSCULP32K
PA[31:16]
PB[31:10]
PA[15:14]
BOD33
POR
PA[13:8]BOD12
FDPLL96M
8.2 Power Supply Considerations
8.2.1 Power SuppliesThe device has several different power supply pins:
• VDDIO: Powers I/O lines, OSC8M and XOSC. Voltage is 2.7V to 3.63V.• VDDIN: Powers I/O lines and the internal regulator. Voltage is 2.7V to 3.63V.• VDDANA: Powers I/O lines and the ADC, AC, DAC, PTC, OSCULP32K, OSC32K, XOSC32K.
Voltage is 2.7V to 3.63V.• VDDCORE: Internal regulated voltage output. Powers the core, memories, peripherals, FDPLL96M,
and DFLL48M. Voltage is 1.2V.
The same voltage must be applied to both VDDIN, VDDIO and VDDANA. This common voltage isreferred to as VDD in the datasheet.
The ground pins, GND, are common to VDDCORE, VDDIO and VDDIN. The ground pin for VDDANA isGNDANA.
SAM DA1
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For decoupling recommendations for the different power supplies. Refer to Schematic Checklist fordetails.
Related LinksSchematic Checklist
8.2.2 Voltage RegulatorThe voltage regulator has two different modes:
• Normal mode: To be used when the CPU and peripherals are running• Low Power (LP) mode: To be used when the regulator draws small static current. It can be used in
standby mode
8.2.3 Typical Powering SchematicsThe device uses a single main supply with a range of 2.7V - 3.63V.
The following figure shows the recommended power supply connection.
Figure 8-1. Power Supply Connection
(2.7V — 3.63V)Main Supply VDDIO
VDDANA
VDDIN
VDDCORE
GND
GNDANA
DEVICE
8.2.4 Power-Up Sequence
8.2.4.1 Minimum Rise RateThe integrated power-on reset (POR) circuitry monitoring the VDDANA power supply requires a minimumrise rate. Refer to the Electrical Characteristics for details.
Related LinksElectrical Characteristics
8.2.4.2 Maximum Rise RateThe rise rate of the power supply must not exceed the values described in Electrical Characteristics.Refer to the Electrical Characteristics for details.
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Related LinksElectrical Characteristics
8.3 Power-UpThis section summarizes the power-up sequence of the device. The behavior after power-up is controlledby the Power Manager. Refer to PM – Power Manager for details.
Related LinksPM – Power Manager
8.3.1 Starting of ClocksAfter power-up, the device is set to its initial state and kept in reset, until the power has stabilizedthroughout the device. Once the power has stabilized, the device will use a 1MHz clock. This clock isderived from the 8MHz Internal Oscillator (OSC8M), which is divided by eight and used as a clock sourcefor generic clock generator 0. Generic clock generator 0 is the main clock for the Power Manager (PM).
Some synchronous system clocks are active, allowing software execution.
Refer to the “Clock Mask Register” section in PM – Power Manager for the list of default peripheral clocksrunning. Synchronous system clocks that are running are by default not divided and receive a 1MHz clockthrough generic clock generator 0. Other generic clocks are disabled except GCLK_WDT, which is usedby the Watchdog Timer (WDT).
Related LinksPM – Power Manager
8.3.2 I/O PinsAfter power-up, the I/O pins are tri-stated.
8.3.3 Fetching of Initial InstructionsAfter reset has been released, the CPU starts fetching PC and SP values from the reset address, whichis 0x00000000. This address points to the first executable address in the internal flash. The code readfrom the internal flash is free to configure the clock system and clock sources. Refer to PM – PowerManager, GCLK – Generic Clock Controller and SYSCTRL – System Controller for details. Refer to theARM Architecture Reference Manual for more information on CPU startup (http://www.arm.com).
Related LinksPM – Power ManagerSYSCTRL – System ControllerClock System
8.4 Power-On Reset and Brown-Out DetectorThe SAM DA1 embeds three features to monitor, warn and/or reset the device:
• POR: Power-on reset on VDDANA• BOD33: Brown-out detector on VDDANA• BOD12: Voltage Regulator Internal Brown-out detector on VDDCORE. The Voltage Regulator
Internal BOD is calibrated in production and its calibration configuration is stored in the NVM UserRow. This configuration should not be changed if the user row is written to assure the correctbehavior of the BOD12.
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8.4.1 Power-On Reset on VDDANAPOR monitors VDDANA. It is always activated and monitors voltage at startup and also during all thesleep modes. If VDDANA goes below the threshold voltage, the entire chip is reset.
8.4.2 Brown-Out Detector on VDDANABOD33 monitors VDDANA. Refer to SYSCTRL – System Controller for details.
Related LinksSYSCTRL – System Controller
8.4.3 Brown-Out Detector on VDDCOREOnce the device has started up, BOD12 monitors the internal VDDCORE.
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9. Product MappingFigure 9-1. Atmel SAM DA1 Product Mapping
Code
SRAM
Undefined
Peripherals
Reserved
Undefined
Global Memory Space0x00000000
0x20000000
0x20008000
0x40000000
0x43000000
0x60000000
Internal SRAM
SRAM
AHB-APB Bridge A
AHB-APB Bridge B
AHB-APB Bridge C
AHB-APB
Code
0x20000000 0x20007FFF
0x40000000
0x41000000
0x42000000
0x42FFFFFF
Reserved
PAC0
PM
SYSCTRL
GCLK
WDT
RTC
EIC
AHB-APB Bridge A0x40000000
0x40000400
0x40000800
0x40000C00
0x40001000
0x40001400
0x40001800
0x40FFFFFF 0x40001C00
AHB-APB Bridge B
Reserved
PAC1 DSU
NVMCTRL PORT
0x41000000 0x41002000 0x41004000 0x41004400
0x41FFFFFF 0x41007000
SERCOM5
PAC2
EVSYS
SERCOM0
SERCOM1
SERCOM2
SERCOM3
SERCOM4
AHB-APB Bridge C
TC7
TCC0
TCC1
TCC2
TC3
TC4
TC5
TC6
ADC
AC
0x42000000
0x42000400
0x42000800
0x42000C00
0x42001000
0x42001400
0x42001800
0x42002000
0x42001C00
0x42003000
0x42003400
0x42003800
0x42003C00
0x42004000
0x42004400
0x42004800
Reserved
0x60000200
0xFFFFFFFF
Reserved
System
0xE0000000
DAC0x42004C00
0x42002400
0x42002800
0x42002C00
PTC
0x42005400
0x42005000I2S
DMAC
USB
MTB
0x41004800 0x41005000 0x41006000
0xE0000000 0xE000E000 0xE000F000 0xE00FF000 0xE0100000 0xFFFFFFFF
System
Reserved SCS
Reserved
ROMTable Reserved
Internal Flash
Internal RWW section
0x42FFFFFF
0x00400000
0x00000000
0x1FFFFFFF
This figure represents the full configuration of the SAM DA1 with maximum flash and SRAM capabilitiesand a full set of peripherals.
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10. Automotive Quality GradeThe SAM DA1 have been developed and manufactured according to the most stringent requirements ofthe international standard ISO-TS 16949. This data sheet contains limit values extracted from the resultsof extensive characterization (temperature and voltage). The quality and reliability of the SAM DA1 havebeen verified during regular product qualification as per AEC-Q100 grade 1.
As indicated in the ordering information paragraph, the product is available in only one temperaturegrade. Refer to the table below.
Table 10-1. Temperature Grade Identification for Automotive Products
Temperature Temperature Identifier Comments
-40°C to +105°C B Full automotive temperaturerange.
Related LinksOrdering Information
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11. Data RetentionReliability qualification results show that the projected data retention failure rate is much less than 1 PPMover 20 years at 105°C or 100 years at 25°C.
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12. Memories
12.1 Embedded Memories• Internal high-speed flash with Read-While-Write (RWW) capability on section of the array.• Internal high-speed RAM, single-cycle access at full speed
12.2 Physical Memory MapThe High-Speed bus is implemented as a bus matrix. All High-Speed bus addresses are fixed, and theyare never remapped in any way, even during boot. The 32-bit physical address space is mapped asfollow:
Table 12-1. Physical memory map(1)
Memory Start address Size
SAMDA1x16 SAMDA1x15 SAMDA1x14
Internal Flash 0x00000000 64Kbytes 32Kbytes 16Kbytes
Internal RWW section 0x00400000 2Kbytes 1Kbytes 512bytes
Internal SRAM 0x20000000 8Kbytes 4Kbytes 4Kbytes
Peripheral Bridge A 0x40000000 64Kbytes 64Kbytes 64Kbytes
Peripheral Bridge B 0x41000000 64Kbytes 64Kbytes 64Kbytes
Peripheral Bridge C 0x42000000 64Kbytes 64Kbytes 64Kbytes
1. x = G, J or E.
Table 12-2. Flash memory parameters(1)
Device Flash size Number of pages Page size
SAMDA1x16 64Kbytes 1024 64 bytes
SAMDA1x15 32Kbytes 512 64 bytes
SAMDA1x14 16Kbytes 256 64 bytes
1. x = G, J or E.2. The number of pages (NVMP) and page size (PSZ) can be read from the NVM Pages and Page
Size bits in the NVM Parameter register in the NVMCTRL (PARAM.NVMP and PARAM.PSZ,respectively). Refer to NVM Parameter (PARAM) register for details.
Table 12-3. RWW section parameters
Device Flash size Number of pages Page size
SAMDA1x16 2Kbytes 32 64 bytes
SAMDA1x15 1Kbytes 16 64 bytes
SAMDA1x14 512 bytes 8 64 bytes
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Related LinksPARAMOrdering Information
12.3 NVM Calibration and Auxiliary SpaceThe device calibration data are stored in different sections of the NVM calibration and auxiliary spacepresented in Figure.Calibration and Auxiliary Space.
Figure 12-1. Calibration and Auxiliary Space
0x00800000
AUX0 offse t address
Automatic ca libra tion row Calibra tion and auxilia ry
space address offse t
AUX0 – NVM User Row
AUX1
0x00804000
0x00806000 AUX1 offse t address
0x00806000
Area 3 offse t address
Area 1: Reserved (64 bits )
Area 2: Device configura tion a rea (64 bits )
Area 1 address offse t
Area 2 offse t address
Area 3: Reserved (128bits )
Area 4: Software ca libra tion a rea (256bits )
0x00806008
0x00806010
0x00806020 Area 4 offse t address
AUX10x00806040
0x00000000
NVM base address + NVM s ize
NVM main address space
NVM Base Address
Calibra tion and auxilia ry space
0x00800000
NVM base address + 0x00800000
The values from the automatic calibration row are loaded into their respective registers at startup.
12.3.1 NVM User Row MappingThe NVM User Row contains calibration data that are automatically read at device power on.
The NVM User Row can be read at address 0x804000.
To write the NVM User Row refer to NVMCTRL – Non-Volatile Memory Controller.
Note that when writing to the user row the values do not get loaded by the other modules on the deviceuntil a device reset occurs.
Table 12-4. NVM User Row Mapping
Bit Position Name Usage
2:0 BOOTPROT Used to select one of eight different bootloader sizes. Refer toNVMCTRL – Non-Volatile Memory Controller. Default value = 7except for WLCSP (Default value = 3).
3 Reserved
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Bit Position Name Usage
6:4 EEPROM Used to select one of eight different EEPROM sizes. Refer toNVMCTRL – Non-Volatile Memory Controller. Default value = 7.
7 Reserved
13:8 BOD33 Level BOD33 Threshold Level at power on. Refer to SYSCTRL BOD33register.Default value = 7.
14 BOD33 Enable BOD33 Enable at power on . Refer to SYSCTRL BOD33 register.Default value = 1.
16:15 BOD33 Action