s6sap413a6bda1001 reference board for fpga power solution
TRANSCRIPT
S6SAP413A6BDA1001
Reference Board for FPGA Power Solution Designed by XC7Z015, Using Cypress PMIC
S6AP413A, MB39C031 and MB39C504
Doc. No. 002-08684 Rev. *A
Cypress Semiconductor
198 Champion Court
San Jose, CA 95134-1709
Phone (USA): 800.858.1810
Phone (Intnl): +1 408.943.2600
www.cypress.com
Copyrights
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 2
© Cypress Semiconductor Corporation, 2014-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document, including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress’s patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage (“Unintended Uses”). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 3
Preface
This manual explains how to use the evaluation board. Be sure to read this manual before using the product. For this product, please consult with sales representatives or support representatives.
Handling and Use
Handling and use of this product and notes regarding its safe use are described in the manuals.
Follow the instructions in the manuals to use this product.
Keep this manual at hand so that you can refer to it anytime during use of this product.
Notice on this Document
All information included in this document is current as of the date it is issued. Such information is subject to change without any prior notice.
Please confirm the latest relevant information with the sales representatives.
Caution of the Products Described in this Document
The following precautions apply to the product described in this manual.
WARNING Indicates a potentially hazardous situation which could result in death or serious injury and/or a fault in the user’s system if the product is not used correctly.
Electric Shock, Damage
Before performing any operation described in this manual, turn off all the power supplies to the system. Performing such an operation with the power on may cause an electric shock or device fault.
Electric Shock, Damage
Once the product has been turned on, do not touch any metal part of it. Doing so may cause an electric shock or device fault.
CAUTION Indicates the presence of a hazard that may cause a minor or moderate injury, damages to this product or devices connected to it, or may cause to loose software resources and other properties such as data, if the device is not used appropriately.
Cuts, Damage
Before moving the product, be sure to turn off all the power supplies and unplug the cables. Watch your step when carrying the product. Do not use the product in an unstable location such as a place exposed to strong vibration or a sloping surface. Doing so may cause the product to fall, resulting in an injury or fault.
Cuts The product contains sharp edges that are left unavoidably exposed, such as jumper plugs. Handle the product with due care not to get injured with such pointed parts.
Damage Do not place anything on the product or expose the product to physical shocks. Do not carry the product after the power has been turned on. Doing so may cause a malfunction due to overloading or shock.
Damage
Since the product contains many electronic components, keep it away from direct sunlight, high temperature, and high humidity to prevent condensation. Do not use or store the product where it is exposed to much dust or a strong magnetic or electric field for an extended period of time. Inappropriate operating or storage environments may cause a fault.
Damage Use the product within the ranges given in the specifications. Operation over the specified ranges may cause a fault.
Preface
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 4
Damage To prevent electrostatic breakdown, do not let your finger or other object come into contact with the metal parts of any of the connectors. Before handling the product, touch a metal object (such as a door knob) to discharge any static electricity from your body.
Damage
When turning the power on or off, follow the relevant procedure as described in this document. Before turning the power on, in particular, be sure to finish making all the required connections. Furthermore, be sure to configure and use the product by following the instructions given in this document. Using the product incorrectly or inappropriately may cause a fault.
Damage Because the product has no casing, it is recommended that it be stored in the original packaging. Transporting the product may cause a damage or fault. Therefore, keep the packaging materials and use them when re-shipping the product.
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 5
Contents
1. Component and Wiring Layout .................................................................................................................................... 6
1.1 Component Layout ................................................................................................................................................ 6 1.2 Wiring Layout ......................................................................................................................................................... 8
2. Circuit Schematic ........................................................................................................................................................ 20
3. Component List ........................................................................................................................................................... 28
4. Evaluation Board Picture ............................................................................................................................................ 34
5. Ordering Information ................................................................................................................................................... 36
Revision History ................................................................................................................................................................... 37
Document Revision History ........................................................................................................................................... 37
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 6
1. Component and Wiring Layout
1.1 Component Layout
Figure 1-1 Component Layout (Layer 1)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 7
Figure 1-2 Component Layout (Layer 8)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 8
1.2 Wiring Layout
Figure 1-2 Wiring Layout (Layer 1)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 9
Figure 1-3 Wiring Layout (Layer 2)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 10
Figure 1-4 Wiring Layout (Layer 3)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 11
Figure 1-5 Wiring Layout (Layer 4)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 12
Figure 1-7 Wiring Layout (Layer 5)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 13
Figure 1-8 Wiring Layout (Layer 6)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 14
Figure 1-9 Wiring Layout (Layer 7)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 15
Figure 1-10 Wiring Layout (Layer 8)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 16
Figure 1-11 Wiring Layout (Layer 1 Resist)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 17
Figure 1-12 Wiring Layout (Layer 8 Resist)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 18
Figure 1-13 Wiring Layout (Layer 1 Silk)
Component and Wiring Layout
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 19
Figure 1-14 Wiring Layout (Layer 8 Silk)
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 20
2. Circuit Schematic
Figure 2-1 Circuit Schematic (POWER)
Circuit Schematic
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 21
Figure 2-2 Circuit Schematic (DDR3)
Circuit Schematic
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 22
Figure 2-3 Circuit Schematic (SD/QSPI/JX/PMOD)
Circuit Schematic
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 23
Figure 2-4 Circuit Schematic (USB/Ethernet)
Circuit Schematic
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 24
Figure 2-5 Circuit Schematic (HDMI/UART)
Circuit Schematic
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 25
Figure 2-6 Circuit Schematic (FPGA_CFG/PL)
Circuit Schematic
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 26
Figure 2-7 Circuit Schematic (FPGA_PS)
Circuit Schematic
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 27
Figure 2-8 Circuit Schematic (FPAG_POWER)
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 28
3. Component List
Table 3-1 Component List
NO.
Circuits Reference Name Parts Number Manufact
urer Qty. PKG Valu
e Rati
o Error TC Tempera
ture Range
Description No
Mount
1 CN5 10104111-0001LF FCI 1 SMD - - - - –55 to 85°C
CONN RCPT MICRO USB TYPE AB
2 CN4 46765-1001 Molex 1 SMD - - - - - CONN RCPT HDMI MICRO TYPE-D R/A
3 CN2 502570-0893 Molex 1 SMD - - - - –25 to 85°C
CONN MICRO SD R/A PUSH-PUSH
4 CN3 0821-1X1T-43-F Bel Fuse 1 Through
Hole - - - - -
CONN MAGJACK 2PORT 1000 BASE-T
5 CN6 87832-1420 Molex 1 SMD - - - - –55 to 105°C
CONN HEADER 14POS 2MM VERT
8 D3,D6 BAT54LT1G ON Semiconductor
2 SOT23-
3 - - - -
–55 to 125°C
DIODE SCHOTTKY 30V 0.2A
9 JP1,JP2,JP3,JP5 XG8S-0331 Omron 4 Through
Hole - - - -
–55 to 105°C
Pin Header
10 JX1,JX2 61082-101400LF FCI 2 SMD - - - - –40 to 85°C
RECEPTACLE 0.8MM 100WAY
11 J1 BCS-106-L-D-TE Samtec 1 Through
Hole - - - -
–55 to 125°C
CONN RCPT 12POS .100" DUAL VERT
12 J2,J3,J4,J5 U.FL-R-SMT-1(01) Hirose 4 SMD - - - - –40 to 90°C
Coaxial connector
13 U11,U18 CDSOT23-SR208 Bourns 2 SOT-23-
6 - - - -
–55 to 150°C
TVS DIODE 20VWM
14 U9 SN74LVC1G08DCKR
TI 1 SC-70-5 - - - - –40 to 125°C
IC GATE AND 1CH 2-INP
15 U17 CP2104-F03-GM Silicon Laboratories
1 24-QFN - - - - –40 to 85°C
IC SGL USB-TO-UART BRIDGE
16 U10 TXS0102DQER TI 1 8-
XFDFN - - - -
–40 to 85°C
IC TRANSLATOR VOLTAGE
17 D4 ZEN056V130A24LS
TE 1 3-SMD - - - - –40 to 85°C
POLYZEN 5.6V PPTC/ZENER
18 U4,U5 MT41K256M16HA-125:E
Micron 2 96-
TFBGA - - - - 0 to 95°C
DDR3L SDRAM 4GBIT 800MHZ
19 U14 ADV7511KSTZ Analog Devices
1 100-
LQFP - - - - 0 to 70°C
C XMITTER HDMI 12BIT
20 U7 S25FL512SAGBHIC10
Spansion 1 BGA-24 - - - - –40 to 85°C
NOR Flash Parallel/Serial 3V/3.3V 512Mbit
21 U6 TXS02612RTWR TI 1 24-
WQFN - - - -
–40 to 85°C
IC SDIO PORT EXPANDER 24WQFN
Component List
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 29
NO.
Circuits Reference Name Parts Number Manufact
urer Qty. PKG Valu
e Rati
o Error TC Tempera
ture Range
Description No
Mount
22 U8 88E1512-A0-NNP2I000
MARVELL 1 56-QFN - - - - - EHTERNET PHY
23 U12 USB3320C-EZK Microchip 1 32-QFN - - - - –40 to 85°C
MULTI-FREQ USB 2.0 ULPI PHY
24 U19 XC7Z015-1CLG485C
Xilinx 1 485BGA - - - - 0 to 85°C FPGA
25 X2 DSC1001DI2-024.0000
Micrel 1 SMD 24MH
z 1.8V
±25ppm
- –40 to 85°C
Oscillator
26 X1 DSC1001DI2-025.0000
Micrel 1 SMD 25MH
z 1.8V
±25ppm
- –40 to 85°C
Oscillator
27 X4 DSC1001DI2-033.3300
Micrel 1 SMD 33MH
z 3.3V
±25ppm
- –40 to 85°C
Oscillator
28 X3 KC3225A12.0000C30E00
AVX 1 SMD 12MH
z 3.3V
±50ppm
- –10 to 70°C
OSC XO 12.000MHZ CMOS
29 U2 MB39C504WQN-G-AMERE1
Spansion 1 - - - - - - DC/DC converter
30 U1 S6AP413A6BGN1C000
Spansion 1 - - - - - - DC/DC converter
31 U3 MB39C031WQN-G-142-JNEFE1
Spansion 1 - - - - - - DC/DC converter
32 U21 NC7WZ07FHX Fairchild 1 6-
UFDFN - - - -
–40 to 85°C
IC BUFFER UHS DUAL OD 6-MICROPAK
33 CN1 PJ-002AH-SMT-TR CUI 1 2.1X5.5
MM - - - -
–25 to 85°C
CONN POWER JACK
34 U20 CL584BA-148.500MHz
TamaDevice
1 SMD 148.500MH
z 3.3V
±50ppm
- –20 to 70°C
Oscillator
35 C1,C12,C22,C46,C47,C53, C54,C198,C214,C86,C87, C95,C96
C2012X5R1A476M125AC
TDK 13 2012 47uF 10V ±20% X5R –55 to 85°C
Ceramic Capacitors
36
C2,C3,C4,C5,C19,C23,C24,C29,C93,C102,C104,C124,C162,C169,C191,C195,C199,C202,C205,C209,C216,C226,C227,C229,C236,C237,C239,C246,C247,C256
C1005X5R1A475K050BC
TDK 30 1005 4.7uF 10V ±10% X5R –55 to 85°C
Ceramic Capacitors
37
C6,C25,C31,C33,C35,C36,C37,C38,C39,C40,C41,C42,C43,C44,C45,C48,C49,C50,C51,C52,C81,C82,C83,C84,C85,C90,C91,C94,C99,C100,C103,C105,C106,C107,C108,C109,C111,C112,C113,C114,C116,C117,C118,C119,C120,C121,C122,C123,C127,C128,C129,C131,C133,C134,C135,C136,C142,C145,C146,C147,C151,C153,C154,C157,C158,C159,C161,C163,C164,C165,C166,C167,C170,C174,C175,C176,C177,C178,C180,C181,C182,C183,C192,C193,C196,C197,C186,C258,C264,C265,C266,C267,C268
C1005JB1H104K050BB
TDK 93 1005 0.1uF 50V ±10% JB –25 to 85°C
Ceramic Capacitors
38 C7 16TQC100MYF Panasonic 1 7343 100uF 16V ±20% - –55 to 105°C
POSCAP
39 C9,C130,C168,C263 GRM188R6YA225KA12D
Murata 4 1608 2.2uF 35V ±10% X5R –55 to 85°C
Ceramic Capacitors
Component List
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 30
NO.
Circuits Reference Name Parts Number Manufact
urer Qty. PKG Valu
e Rati
o Error TC Tempera
ture Range
Description No
Mount
40
C10,C55,C56,C57,C58,C59,C60,C61,C62,C63,C64,C65,C66,C67,C68,C69,C70,C71, C72,C137,C138,C139,C140,C143,C148,C149,C150,C155,C156,C160,C179,C248,C249,C269
GRM155R71E103KA01D
Murata 34 1005 0.01u
F 25V ±10% X7R
–55 to 125°C
Ceramic Capacitors
41 C11,C126 C2012X5R1A226K125AB
TDK 2 2012 22uF 10V ±10% X5R –55 to 85°C
Ceramic Capacitors
42 C13 GRM32DR60J336ME19L
Murata 1 3225 33uF 6.3V ±20% X5R –55 to 85°C
Ceramic Capacitors
43 C14,C17,C18,C20 C1005X5R1V105K050BC
TDK 4 1005 1uF 35V ±10% X5R –55 to 85°C
Ceramic Capacitors
44 C8,C15,C16,C26,C28,C32, C115,C132,C141,C144,C152,C213
C1608X5R1E106M080AC
TDK 12 1608 10uF 25V ±20% X5R –55 to 85°C
Ceramic Capacitors
45
C21,C34,C110,C173,C187, C188,C189,C190,C194,C200,C203,C206,C207,C210,C211,C212,C217,C218,C219,C220,C222,C223,C224,C225,C230,C232,C233,C234,C235,C240,C242,C243,C244,C245
GRM155R61A474KE15J
Murata 34 1005 0.47u
F 10V ±10% X5R
–55 to 85°C
Ceramic Capacitors
46 C27 6TPE220MAPB Panasonic 1
3.5 X 2.8 X
1.9mm(L X W X
H)
220uF 6.3V ±20% - –55 to 105°C
POSCAP
48 C92,C101,C125,C201,C204,C208,C215,C221,C228,C231,C238,C241
C1210C107M4PAC7800
Kemet 12 3225 100uF 16V ±20% X5R –55 to 85°C
Ceramic Capacitors
49 C172 C1005X5R1A475K050BC
TDK 1 1005 4.7uF_NMT
10V ±10% X5R –55 to 85°C
Ceramic Capacitors
50 C184 T525D337M006ATE025
Kemet 1 7343 330uF 6.3V ±20% - –55 to 125°C
Tantalum Capacitors
51 D1 SMBJ12CA Littelfuse 1 DO-
214AA 12V - - -
–55 to 150°C
TVS DIODE 12VWM 19.9VC
52 D7 BAS21 Fairchild 1 SOT23-
3 - - - -
–55 to 150°C
DIODE SML SIG 250V 0.2A
54 LED1,LED2,LED3,LED5,LED6
LTST-C191TBKT Lite-On 5 1608 - - - - –55 to 85°C
LED BLUE CLEAR THIN
55 LED4 LTST-C191KRKT Lite-On 1 1608 - - - - –55 to 85°C
LED SUPER RED CLR THIN
56 L1,L2,L3,L4 1276AS-H-1R0M TOKO 4 SMD 1uH 3.9A ±20% - –40 to 85°C
Inductor
57 L6,L7 1276AS-H-1R5M TOKO 2 SMD 1.5uH 3.2A ±20% - –40 to 85°C
Inductor
58 L5 GLMC2R203A ALPS 1 SMD 2.2uH 7.1A ±20% - - Inductor
59 L8,L9,L10,L11,L12,L13, L14,L15,L16,L17,L18,L19
BLM18EG221SN1 Murata 12 1608 - 2A - - –55 to 125°C
FERRITE CHIP 220 OHM
60 Q1,Q7,Q9,Q10 2N7002,215 NXP 4 SOT23 - - - - –65 to 150°C
MOSFET N-CH 60V 300MA
61 Q2 FDMC8200S Fairchild 1 8-MLP - - - - –55 to 150°C
MOSFET N-CH DUAL 30V
62 Q3,Q4,Q5,Q6 BSS138 Fairchild 4 SOT-23 - - - - –55 to 150°C
MOSFET N-CH 50V 220MA
63
R113,R115,R117,R123,R131,R146,R147,R148,R168,R176,R201,R163,,R208,R210
RK73Z1ETTP KOA 14 1005 0 1A - - –55 to 155°C
Chip resistors
64 R2 RK73H1ETTP1501F
KOA 1 1005 1.5K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
Component List
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 31
NO.
Circuits Reference Name Parts Number Manufact
urer Qty. PKG Valu
e Rati
o Error TC Tempera
ture Range
Description No
Mount
65 R4,R5,R19,R21,R136,R138
RK73H1ETTP1003F
KOA 6 1005 100K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
66 R7,R8,R9,R13,R28,R30, R189,R190,R191
RK73H1ETTP1002F
KOA 9 1005 10K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
Component List
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 32
NO.
Circuits Reference Name Parts Number Manufact
urer Qty. PKG Valu
e Rati
o Error TC Tempera
ture Range
Description No
Mount
67 R10,R11,R27,R29 RK73H1ETTP2201F
KOA 4 1005 2.2K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
68 R12,R32,R33,R124,R129, R159,R177,R183,R185,R193,R240,R241,R242,R243
RK73H1ETTP2400F
KOA 14 1005 240 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
69 R15 RK73H1ETTP10R0F
KOA 1 1005 10 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
70 R17 RK73H1ETTP3303F
KOA 1 1005 330K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
71 R18 KRL2012E-M-R004-F-T5
Susumu 1 2012 0.004 1W ±1% ±50ppm/°
C
–55 to 155°C
Precision Current Sensing resistors
72 R20 RK73H1ETTP2203F
KOA 1 1005 220K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
73 R156 RK73H1ETTP1002F
KOA 1 1005 10K_NMT
0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
74 R31,R199,R200 RK73H1ETTP80R6F
KOA 3 1005 80.6 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
75 R149,R166,R182,R236,R237
RK73H1ETTP1000F
KOA 5 1005 100 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
76
R127,R133,R184,R209,R195,R212,R213,R214,R215,R216,R217,R218,R219,R220,R221,R222,R223,R224,R225,R226,R227,R228,R229,R230,R231,R232,R233,R234,R235
RK73H1ETTP40R2F
KOA 29 1005 40.2 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
77
R61,R71,R121,R125,R128, R130,R132,R178,R180,R181,R188
RK73H1ETTP1001F
KOA 11 1005 1k 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
78 R112,R116,R122,R126,R192
RK73H1ETTP4991F
KOA 5 1005 4.99K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
79
R86,R114,R143,R144,R152, R153,R169,R170,R171,R172,R173,R174,R175,R207,R238,R239
RK73H1ETTP4701F
KOA 16 1005 4.7K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
80 R118,R119,R120,R194,R196,R197,R198
RK73H1ETTP2002F
KOA 7 1005 20K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
81 R134 RK73Z1JTTD KOA 1 1608 0 1A - - –55 to 155°C
Chip resistors
82 R137 RK73H1ETTP8061F
KOA 1 1005 8.06k 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
83 R139 RK73H1ETTP1502F
KOA 1 1005 15K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
84 R140,R141,R142,R145 RK73H1ETTP4702F
KOA 4 1005 47K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
85 R150 RK73H1ETTP2702F
KOA 1 1005 27K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
86 R151 RK73H1ETTP22R0F
KOA 1 1005 22 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
Component List
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 33
NO.
Circuits Reference Name Parts Number Manufact
urer Qty. PKG Valu
e Rati
o Error TC Tempera
ture Range
Description No
Mount
87 R154,R155 RK73H1ETTP2001F
KOA 2 1005 2K 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
88 R157 RK73H1ETTP33R0F
KOA 1 1005 33 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
89 R158,R161,R162,R165,R167,R164,R186,R211
RK73Z1ETTP KOA 8 1005 0_NM
T 1A - -
–55 to 155°C
Chip resistors
90 R160 RK73H1ETTP8870F
KOA 1 1005 887 0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
91 R179,R187 RK73H1ETTP1001F
KOA 2 1005 1K_NMT
0.063W
±1% ±100ppm/°C
–55 to 155°C
Chip resistors
92 SW1,SW2 7914J-1-000E Bourns 2
5.0X5.0X4.19mm(L X W
X H)
- - - - –55 to 125°C
SWITCH TACTILE SPST-NO 0.1A 24V
93 U13 TPS2051BDBVT TI 1 SOT23-
5 - - - -
–40 to 85°C
IC PWR DIST SWITCH SNGL
94 U15 CM2020-01TR ON Semiconductor
1 38TSSO
P - - - -
–40 to 85°C
IC HDMI XMITTER PORT P/I
96 D5 BAT54LT1G_NMT ON Semiconductor
1 SOT23-
3 - - - -
–55 to 125°C
DIODE SCHOTTKY 30V 0.2A
97 C88,C89,C97,C98 C1608JB1V475K080AC
TDK 4 1608 4.7uF 35V ±10% JB –25 to 85°C
Ceramic Capacitors
98 TP1,TP2 LC-22-G-BLACK MAC8 2 DIP - - - - - TEST POINT
100 SW3 CHS-02B Copal 1 SMD - - - - –40 to 85°C
DIP Switch
101 F1 045101.5MRL Littelfuse 1 SMD 1.5A 125V
- - –55 to 125°C
Fuse
102 JP4 XG8S-0231 Omron 1 Through
Hole - - - -
–55 to 105°C
Pin Header
103 SH1,SH2,SH3,SH4,SH5 XJ8A-0241 Omron 5 - - - - - –55 to 105°C
JUMPER
104 PS1,PS2,PS3,PS4
4
Pattern short
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 34
4. Evaluation Board Picture
Figure 4-1 Picture (Top)
Evaluation Board Picture
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 35
Figure 4-2 Picture (Back)
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 36
5. Ordering Information
Table 5-1 Ordering Information
Part Number EVB Revision Note S6SAP413A6BDA1001 Rev 0.1 ---
S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 37
Revision History
Document Revision History
Document Title: S6SAP413A6BDA1001 Reference Board for FPGA Power Solution Designed by XC7Z015, Using Cypress PMIC
S6AP413A, MB39C031 and MB39C504
Document Number: 002-08684
Revision Issue Date Origin of
Change
Description of Change
** 03/06/2015 ATTS Initial release.
*A 04/29/2016 ATTS Migrated to Cypress format.