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Applying Lean Six Sigma in Manufacturing (Printed Circuit Board Assembly) Authors: Celine YC Chong, Marvin Mamac Ortega, Michael Russell Uy Gonzales and Ai Kiar Ang

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  • Applying Lean Six Sigma in Manufacturing(Printed Circuit Board Assembly)

    Authors: Celine YC Chong, Marvin Mamac Ortega, Michael Russell Uy Gonzales and Ai Kiar Ang

  • 2 Lean Six Sigma Background D-M-A-I-C Improvement Process Methodology Case Study

    Define Phase Measure Phase Analyze Phase Improve Phase Control Phase

    Summary and Conclusions A Look Forward Acknowledgement

    AGENDA

  • 3 Six Sigma emerged in 1987 when Motorola published their Six Sigma quality program. It is a metric that demonstrates quality levels at 99.997% performance for products, processes and services. Six Sigma is a vision and an approach to achieving the highest customer satisfaction through offering products, processes and services at the highest quality and lowest costs. It is an integrated approach to process excellence. Six Sigma is a business concept in response to customers demand for high quality. Six Sigma demands competence in statistics to ensure decisions based on facts. Lean focuses on eliminating non-value added steps and activities in a process. Lean Sigma is an evolutionary improvement to Six Sigma for transactional processes common e.g. in services but also manufacturing. It develops a deep process understanding in terms of value flow dependencies and tries to improve efficiency in processes. Lean Six Sigma combines proven methods from best practices based on years of industry experience. Lean Six Sigma leverages a fundamental problem solving methodology that is common regardless of business unit or processes supported.

    Lean Six Sigma Background

  • 4What is D-M-A-I-C?The DMAIC methodology is a structured way to improve processes. 5 approach in the DMAIC methodology. The Lean Sigma DMAIC roadmap uses a data-based scientific approach and statistical tools to validate root causes and find solutions to problems.

    D-M-A-I-C Improvement Process Methodology

  • 5D EFINE define project objective, stakeholders, scope, resources and constraints. Identify Customers requirements and CTQs (Critical to Quality). Translate CTQs into process specifications and identify success measures.M EASURE baseline the process and obtain data to quantify process performance. Measure the system analysis and Value Chain Analyses (Yield, Cycle Time). A NALYZE analyze data to identify tangible root causes of defects. Identify sources of variation. Screen and validate potential causes, and identify waste. analyze data to identify tangible root causes of defects. Identify sources of variation. Screen and validate potential causes, and identify waste. I MPROVE brainstorm on solutions and determine variable relationship Y = f(X). Confirm results and validate improvements. Reduce Waste and streamlining Processes.C ONTROL develop control plan and implement process controls. Lesson learned and project closure.

    D-M-A-I-C Improvement Process Methodology

  • 6D-M-A-I-C Improvement Process Methodology

  • The Case Study:

    Identify the Business Problem & Background. The rolled-first-pass-yield (RFPY) of product A was decreased from 98.4% to 94.1%. This decrease in RFPY resulted in Unit Hour reduction and impact to the ramp-up demand.

    RFPY = FPY1 x FPY2 x x FPYk, where k = number of sub-processes with defect detection & recording. First Pass Yield (FPY) - used when our manufacturing process has just one step or in one sub-process. FPY = 1- (total number of defectives or rejects/total number of assemblies through the process).

    Objective is to increase the RFPY from Base Line Level at 94.6% to Goal Level 97.3% (Goal Level = 70% improvement from Base Line Level).

    7

  • The Case Study:

    Figure 1: Reported8

  • 9Define the problem by starting a Project Charter. Project Charter included the project scope and project objective. The scope will be the process framework and description and end to end process. Then work on a SIPOC (Supplier Inputs Process Outputs Customers). Start and end boundary for end to end process.

    DEFINE Phase

    Project Charter

  • 10

    SIPOC

  • 11

    Measure the performance by including these steps. Process and functional deployment map, value stream mapping, identify improvement areas, data collection plan, Gage R&R study (attribute agreement analysis).

    MEASURE Phase

    Figure 2: Process and Functional Deployment Map

  • 12

    Figure 3: Value Stream Mapping

    MEASURE Phase

  • 13

    Figure 4: Pareto % Defect

    MEASURE Phase

  • 14

    Figure 5: Data Collection Base On GR&R Study

    ICTMEASURE Phase

  • 15

    Figure 6: Data Collection Base On GR&R Study

    FCTMEASURE Phase

  • 16

    Analyze Phase

    Figure 7: A set of ICT FPY is approximately normally distributed Figure 8: A set of FCT FPY is approximately normally distributed

    Identify opportunities for Improvement at ICT Identify opportunities for Improvement at FCT

  • 17

    Analyze Phase Identify possible root causes at ICT using Fishbone diagram

    Figure 9: ICT Fishbone Diagram.

  • 18

    Analyze Phase

    Identify possible root causes at FCT using Fishbone diagram

    Figure 10: FCT Fishbone Diagram.

  • 19

    Analyze Phase Validate potential causes for ICT low FPY Validate potential causes for FCT low FPY

    Figure 11: Pareto Chart Figure 12: Pareto Chart

  • 20

    Improve Phase

    Figure 13: Model Surface Plot

    DOE for solder paste printing to improve ICT FPY

  • 21

    Improve Phase

    Figure 14: Monitor Chart before and after DOE

    Solder paste printing before & after the DOE study

  • 22

    Improve Phase

    Figure 15: Monitor Chart before and after re-design

    Effectiveness of the FCT process redesign solution

  • 23

    Control Phase

    Control the performance by integrating and managing control solutions & implementation plan through

    Process control system template for solder paste printing at SMT and for FCT I-MR chart for solder paste printing at SMT Perform U-chart for IB external wrap failure at FCT

  • 24

    Summary & Conclusions

    IBMs Global Engineering team continues to drive best practices for an integrated & interoperable Design for Operational Excellence (DOX) transformation, which consists of DOX Design for Six Sigma (DFSS), Engineering Lean Six Sigma (LSS), and SMART Lean components.

    This globally integrated transformation maximizes product and process performance while avoiding and/or minimizing cost to correct quality and reliability problems. An ancillary benefit that IBM enjoys is a highly trained, skilled, and proactive work force with involvement at all levels of process execution.

  • 25

    A Look Forward

    As globalization progresses, there are areas we can improve in applying Lean Six Sigma in Manufacturing. As such, continuous improvement through Lean Six Sigma methodology is a necessary approach that should be ingrained in every corporate vision and culture to achieve outstanding operational excellence.

  • 26

    ACKNOWLEDGEMENTS

    The authors would like to thank the following people for their help and support

    Marie Cole Matt Kelly Justin GilbertHock Keng Neo Chin Meng Tan Casey KC NgLee Leng Tey Stephen SL Chong Kok Yin LohKenneth EH Koh

  • Questions ?

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