rtn 910 idu hardware description-(v100r003c03_02)
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OptiX RTN 910 Radio Transmission System
V100R003C03
IDU Hardware Description
Issue 02
Date 2012-01-30
HUAWEI TECHNOLOGIES CO., LTD.
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Copyright Huawei Technologies Co., Ltd. 2012. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written
consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and the
customer. All or part of the products, services and features described in this document may not be within the
purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,and recommendations in this document are provided "AS IS" without warranties, guarantees or representations
of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute the warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: http://www.huawei.com
Email: [email protected]
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About This Document
Related Versions
The following table lists the product versions related to this document.
Product Name Version
OptiX RTN 910 V100R003C03
iManager U2000 V100R006C00
Intended Audience
This document is intended for:
l Network planning engineer
l Hardware installation engineer
l Installation and commissioning engineer
l Field maintenance engineer
l Data configuration engineer
l System maintenance engineer
Before reading this document, you need to be familiar with the following:
l Basics of digital microwave communication
l Basics of the OptiX RTN 910
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol Description
Indicates a hazard with a high level of risk,
which if not avoided, will result in death or
serious injury.
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Symbol Description
Indicates a hazard with a medium or low level
of risk, which if not avoided, could result in
minor or moderate injury.
Indicates a potentially hazardous situation,
which if not avoided, could result in
equipment damage, data loss, performance
degradation, or unexpected results.
Indicates a tip that may help you solve a
problem or save time.
Provides additional information to emphasize
or supplement important points of the main
text.
General Conventions
The general conventions that may be found in this document are defined as follows.
Convention Description
Times New Roman Normal paragraphs are in Times New Roman.
Boldface Names of files, directories, folders, and users are in
boldface. For example, log in as user root.
Italic Book titles are in italics.
Courier New Examples of information displayed on the screen are in
Courier New.
Command ConventionsThe command conventions that may be found in this document are defined as follows.
Convention Description
Boldface The keywords of a command line are in boldface.
Italic Command arguments are in italics.
[ ] Items (keywords or arguments) in brackets [ ] are optional.
{ x | y | ... } Optional items are grouped in braces and separated by
vertical bars. One item is selected.
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Convention Description
[ x | y | ... ] Optional items are grouped in brackets and separated by
vertical bars. One item is selected or no item is selected.
{ x | y | ... }* Optional items are grouped in braces and separated byvertical bars. A minimum of one item or a maximum of all
items can be selected.
[ x | y | ... ]* Optional items are grouped in brackets and separated by
vertical bars. Several items or no item can be selected.
GUI Conventions
The GUI conventions that may be found in this document are defined as follows.
Convention Description
Boldface Buttons, menus, parameters, tabs, window, and dialog titles
are in boldface. For example, click OK.
> Multi-level menus are in boldfaceand separated by the ">"
signs. For example, choose File> Create> Folder.
Update History
Updates between document issues are cumulative. Thus, the latest document issue contains all
updates made in previous issues.
Updates in Issue 02 (2012-01-30) Based on Product Version V100R003C03
This document is the second issue for the V100R003C03 product version.
Compared with the first issue, the content updates are as follows.
Update Description
Heading "Application" for each board Added board application information.
Heading "Front Panel" for each system
control, switching, and timing board
Added alarm input/output principles.
A Differences Between General-Purpose
IF Boards
Added function comparison between general
IF boards.
Entire document Fixed known bugs.
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Updates in Issue 01 (2011-10-30) Based on Product Version V100R003C03
This document is the first issue for the V100R003C03 product version.
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Contents
About This Document.....................................................................................................................ii
1 Introduction....................................................................................................................................1
1.1 Network Application..........................................................................................................................................2
1.2 Components........................................................................................................................................................31.3 Configuration Modes..........................................................................................................................................7
2 Chassis.............................................................................................................................................8
2.1 Chassis Structure................................................................................................................................................9
2.2 Installation Mode................................................................................................................................................9
2.3 Air Flow..............................................................................................................................................................9
2.4 IDU Labels.......................................................................................................................................................10
3 Boards............................................................................................................................................13
3.1 Board Appearance............................................................................................................................................15
3.2 Board List.........................................................................................................................................................16
3.3 CSTA................................................................................................................................................................23
3.3.1 Version Description.................................................................................................................................23
3.3.2 Application..............................................................................................................................................23
3.3.3 Functions and Features............................................................................................................................24
3.3.4 Working Principle....................................................................................................................................28
3.3.5 Front Panel...............................................................................................................................................31
3.3.6 DIP Switches and CF Card......................................................................................................................41
3.3.7 Valid Slots...............................................................................................................................................43
3.3.8 Board Feature Code.................................................................................................................................433.3.9 Types of SFP Modules............................................................................................................................44
3.3.10 Board Parameter Settings......................................................................................................................44
3.3.11 Technical Specifications........................................................................................................................44
3.4 CSHA/CSHB/CSHC........................................................................................................................................48
3.4.1 Version Description.................................................................................................................................48
3.4.2 Application..............................................................................................................................................48
3.4.3 Functions and Features............................................................................................................................49
3.4.4 Working Principle....................................................................................................................................59
3.4.5 Front Panel...............................................................................................................................................62
3.4.6 DIP Switches and CF Card......................................................................................................................77
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3.4.7 Valid Slots...............................................................................................................................................79
3.4.8 Board Feature Code.................................................................................................................................80
3.4.9 Types of SFP Modules............................................................................................................................80
3.4.10 Board Parameter Settings......................................................................................................................82
3.4.11 Technical Specifications........................................................................................................................83
3.5 CSHD/CSHE....................................................................................................................................................91
3.5.1 Version Description.................................................................................................................................91
3.5.2 Application..............................................................................................................................................91
3.5.3 Functions and Features............................................................................................................................92
3.5.4 WorkingPrinciple..................................................................................................................................100
3.5.5 Front Panel.............................................................................................................................................104
3.5.6 DIP Switches and CF Card....................................................................................................................118
3.5.7 Valid Slots.............................................................................................................................................120
3.5.8 Board Feature Code...............................................................................................................................121
3.5.9 Types of SFP Modules..........................................................................................................................121
3.5.10 Board Parameter Settings....................................................................................................................123
3.5.11 Technical Specifications......................................................................................................................123
3.6 IF1...................................................................................................................................................................130
3.6.1 Version Description...............................................................................................................................130
3.6.2 Application............................................................................................................................................130
3.6.3 Functions and Features..........................................................................................................................131
3.6.4 WorkingPrinciple and Signal Flow......................................................................................................133
3.6.5 Front Panel.............................................................................................................................................1383.6.6 Valid Slots.............................................................................................................................................140
3.6.7 Board Parameter Settings......................................................................................................................140
3.6.8 Technical Specifications........................................................................................................................141
3.7 IFU2................................................................................................................................................................142
3.7.1 Version Description...............................................................................................................................142
3.7.2 Application............................................................................................................................................143
3.7.3 Functions and Features..........................................................................................................................143
3.7.4 WorkingPrinciple and Signal Flow......................................................................................................146
3.7.5 Front Panel.............................................................................................................................................150
3.7.6 Valid Slots.............................................................................................................................................152
3.7.7 Board Parameter Settings......................................................................................................................152
3.7.8 Technical Specifications........................................................................................................................153
3.8 IFX2................................................................................................................................................................155
3.8.1 Version Description...............................................................................................................................155
3.8.2 Application............................................................................................................................................155
3.8.3 Functions and Features..........................................................................................................................156
3.8.4 WorkingPrinciple and Signal Flow......................................................................................................159
3.8.5 Front Panel.............................................................................................................................................163
3.8.6 Valid Slots.............................................................................................................................................165
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3.8.7 Board Parameter Settings......................................................................................................................166
3.8.8 Technical Specifications........................................................................................................................167
3.9 ISU2................................................................................................................................................................169
3.9.1 Version Description...............................................................................................................................169
3.9.2 Application............................................................................................................................................169
3.9.3 Functions and Features..........................................................................................................................171
3.9.4 Working Principle and Signal Flow......................................................................................................174
3.9.5 Front Panel.............................................................................................................................................178
3.9.6 Valid Slots.............................................................................................................................................180
3.9.7 Board Parameter Settings......................................................................................................................181
3.9.8 Technical Specifications........................................................................................................................181
3.10 ISX2..............................................................................................................................................................185
3.10.1 Version Description.............................................................................................................................185
3.10.2 Application..........................................................................................................................................185
3.10.3 Functions and Features........................................................................................................................187
3.10.4 Working Principle and Signal Flow....................................................................................................190
3.10.5 Front Panel...........................................................................................................................................194
3.10.6 Valid Slots...........................................................................................................................................197
3.10.7 Board Parameter Settings....................................................................................................................197
3.10.8 Technical Specifications......................................................................................................................198
3.11 EM6T/EM6TA/EM6F/EM6FA....................................................................................................................203
3.11.1 Version Description.............................................................................................................................203
3.11.2 Application..........................................................................................................................................2033.11.3 Functions and Features........................................................................................................................205
3.11.4 Working Principle and Signal Flow....................................................................................................209
3.11.5 Front Panel...........................................................................................................................................211
3.11.6 Valid Slots...........................................................................................................................................218
3.11.7 Types of SFP Modules........................................................................................................................218
3.11.8 Board Parameter Settings....................................................................................................................220
3.11.9 Technical Specifications......................................................................................................................221
3.12 EMS6............................................................................................................................................................226
3.12.1 Version Description.............................................................................................................................226
3.12.2 Application..........................................................................................................................................226
3.12.3 Functions and Features........................................................................................................................227
3.12.4 Working Principle and Signal Flow....................................................................................................232
3.12.5 Front Panel...........................................................................................................................................234
3.12.6 Valid Slots...........................................................................................................................................239
3.12.7 Types of SFP Modules........................................................................................................................240
3.12.8 Board Parameter Settings....................................................................................................................240
3.12.9 Technical Specifications......................................................................................................................241
3.13 EFP8.............................................................................................................................................................243
3.13.1 Version Description.............................................................................................................................243
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3.13.2 Application..........................................................................................................................................243
3.13.3 Functions and Features........................................................................................................................245
3.13.4 Working Principle and Signal Flow....................................................................................................248
3.13.5 Front Panel...........................................................................................................................................251
3.13.6 Valid Slots...........................................................................................................................................254
3.13.7 Board Parameter Settings....................................................................................................................255
3.13.8 Technical Specifications......................................................................................................................255
3.14 SL1D/SL1DA...............................................................................................................................................256
3.14.1 Version Description.............................................................................................................................256
3.14.2 Application..........................................................................................................................................256
3.14.3 Functions and Features........................................................................................................................258
3.14.4 Working Principle and Signal Flow....................................................................................................260
3.14.5 Front Panel...........................................................................................................................................262
3.14.6 Valid Slots...........................................................................................................................................264
3.14.7 Board Feature Code.............................................................................................................................265
3.14.8 Board Parameter Settings....................................................................................................................265
3.14.9 Technical Specifications......................................................................................................................265
3.15 ML1/MD1.....................................................................................................................................................267
3.15.1 Version Description.............................................................................................................................267
3.15.2 Application..........................................................................................................................................267
3.15.3 Functions and Features........................................................................................................................268
3.15.4 Working Principle and Signal Flow....................................................................................................270
3.15.5 Front Panel...........................................................................................................................................2733.15.6 Valid Slots...........................................................................................................................................276
3.15.7 Board Feature Code.............................................................................................................................277
3.15.8 Board Parameter Settings....................................................................................................................277
3.15.9 Technical Specifications......................................................................................................................277
3.16 SP3S/SP3D...................................................................................................................................................278
3.16.1 Version Description.............................................................................................................................278
3.16.2 Application..........................................................................................................................................279
3.16.3 Functions and Features........................................................................................................................279
3.16.4 Working Principle and Signal Flow....................................................................................................280
3.16.5 Front Panel...........................................................................................................................................283
3.16.6 Valid Slots...........................................................................................................................................287
3.16.7 Board Feature Code.............................................................................................................................288
3.16.8 Board Parameter Settings....................................................................................................................288
3.16.9 Technical Specifications......................................................................................................................288
3.17 PIU................................................................................................................................................................289
3.17.1 Version Description.............................................................................................................................289
3.17.2 Functions and Features........................................................................................................................290
3.17.3 Working Principle................................................................................................................................290
3.17.4 Front Panel...........................................................................................................................................291
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3.17.5 Valid Slots...........................................................................................................................................293
3.17.6 Technical Specifications......................................................................................................................293
3.18 FAN..............................................................................................................................................................293
3.18.1 Version Description.............................................................................................................................293
3.18.2 Functions and Features........................................................................................................................294
3.18.3 Working Principle................................................................................................................................294
3.18.4 Front Panel...........................................................................................................................................295
3.18.5 Valid Slots...........................................................................................................................................296
3.18.6 Technical Specifications......................................................................................................................297
4 Accessories..................................................................................................................................298
4.1 E1 Panel..........................................................................................................................................................299
4.2 PDU................................................................................................................................................................301
4.2.1 Front Panel.............................................................................................................................................301
4.2.2 Functions and Working Principle..........................................................................................................302
4.2.3 Power Distribution Mode......................................................................................................................303
5 Cables...........................................................................................................................................305
5.1 Power Cable....................................................................................................................................................307
5.2 PGND Cable...................................................................................................................................................307
5.2.1 IDUPGND Cable..................................................................................................................................307
5.2.2 E1 Panel PGND Cable...........................................................................................................................308
5.3 IF Jumper........................................................................................................................................................309
5.4 XPIC Cable.....................................................................................................................................................310
5.5 Fiber Jumper...................................................................................................................................................311
5.6 STM-1 Cable............................................................................................................... ...................................313
5.7 E1 Cables........................................................................................................................................................314
5.7.1 E1 Cable Connected to the External Equipment...................................................................................314
5.7.2 E1 Cable Connected to the E1 Panel.....................................................................................................318
5.8 Orderwire Cable........................................................................... ..................................................................320
5.9 Network Cable................................................................................................................................................320
A Differences Between General-Purpose IF Boards..............................................................324
B Board Loopback Types............................................................................................................325C Indicators of Boards.................................................................................................................327
D Weight and Power Consumption of Each Board................................................................347
E Parameters Description............................................................................................................349
E.1 Parameters for Network Management............................................................................................................350
E.1.1 Parameters for NE Management...........................................................................................................350
E.1.1.1 Parameter Description: NE Searching..........................................................................................350
E.1.1.2 Parameter Description: NE Creation............................................................................................355
E.1.1.3 Parameter Description: Attribute_Changing NE IDs...................................................................357
E.1.1.4 Parameter Description: NE Time Synchronization......................................................................358
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E.1.1.5 Parameter Description: Localization Management of the NE Time............................................361
E.1.1.6 Parameter Description: Standard NTP Key Management............................................................362
E.1.1.7 Parameter Description: License Management..............................................................................363
E.1.1.8 Parameter Description: Automatic Disabling of the Functions of NEs.......................................364
E.1.2 Parameters for Communications Management.....................................................................................365
E.1.2.1 Parameter Description: NE Communication Parameter Setting..................................................365
E.1.2.2 Parameter Description: DCC Management_DCC Rate Configuration........................................366
E.1.2.3 Parameter Description: DCC Management_DCC Transparent Transmission Management.......368
E.1.2.4 Parameter Description: ECC Management_Ethernet Port Extended ECC..................................370
E.1.2.5 Parameter Description: NE ECC Link Management...................................................................371
E.1.2.6 Parameter Description: ECC Link Management_Availability Test.............................................372
E.1.2.7 Parameter Description: IP Protocol Stack Management_IP Route Management........................374
E.1.2.8 Parameter Description: IP Protocol Stack Management_IP Route Management Creation.........375
E.1.2.9 Parameter Description: IP Protocol Stack Management_Availability Test.................................376E.1.2.10 Parameter Description: IP Protocol Stack Management_OSPF Parameter Settings.................377
E.1.2.11 Parameter Description: IP Protocol Stack_Proxy ARP.............................................................382
E.1.2.12 Parameter Description: Management of Multiple OSPF Areas.................................................383
E.1.2.13 Parameter Description: Management of Multiple OSPF Areas_Adding OSPF Areas..............384
E.1.2.14 Parameter Description: Management of Multiple OSPF Areas_Adding Routes to Be Manually
Aggregated................................................................................................................................................385
E.1.2.15 Parameter Description: Port OSPF Setting................................................................................386
E.1.2.16 Parameter Description: OSI Management_Network Layer Parameter......................................386
E.1.2.17 Parameter Description: OSI Management_Routing Table.........................................................387
E.1.2.18 Parameter Description: OSI Management_OSI Tunnel.............................................................388
E.1.2.19 Parameter Description: OSI Management_OSI Port Parameters...............................................392
E.1.2.20 Parameter Description: DCN Management_Bandwidth Management......................................393
E.1.2.21 Parameter Description: DCN Management_Port Setting..........................................................394
E.1.2.22 Parameter Description: DCN Management_Access Control.....................................................394
E.1.2.23 Parameter Description: DCN Management_Packet Control......................................................395
E.1.2.24 Parameter Description: L2 DCN Management..........................................................................396
E.1.2.25 Parameter Description: Access Control.....................................................................................397
E.1.3 Parameters for Network Security Management....................................................................................398
E.1.3.1 Parameter Description: NE User Management............................................................................398E.1.3.2 Parameter Description: NE User Management_Creation............................................................399
E.1.3.3 Parameter Description: LCT Access Control...............................................................................401
E.1.3.4 Parameter Description: RADIUS Configuration_Creation..........................................................402
E.1.3.5 Parameter Description: RADIUS Configuration_RADIUS Server.............................................403
E.1.3.6 Parameter Description: Enabling/Disabling the RADIUS Function............................................404
E.2 Radio Link Parameters...................................................................................................................................405
E.2.1 Parameter Description: Link Configuration_XPIC Workgroup_Creation............................................405
E.2.2 Parameter Description: Link Configuration_XPIC...............................................................................410
E.2.3 Parameter Description: N+1 Protection_Create....................................................................................417
E.2.4 Parameter Description: N+1 Protection................................................................................................418
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E.2.5 Parameter Description: IF 1+1 Protection_Create................................................................................420
E.2.6 Parameter Description: IF 1+1 Protection.............................................................................................423
E.2.7 Parameter Description: Link Configuration_Creating a PLA Group....................................................427
E.2.8 Parameter Description: Link Configuration_PLA................................................................................427
E.2.9 Parameter: Link Configuration_IF/ODU Configuration.......................................................................428
E.3 Multiplex SectionProtection Parameters.......................................................................................................438
E.3.1 Parameter Description: Linear MSP_Creation......................................................................................438
E.3.2 Parameter Description: Linear MSP.....................................................................................................442
E.4 SDH/PDH Service Parameters.......................................................................................................................446
E.4.1 Parameter Description: SDH Service Configuration_Creation.............................................................446
E.4.2 Parameter Description: SDH Service Configuration_SNCP Service Creation.....................................448
E.4.3 Parameter Description: SDH Service Configuration_Converting Normal Services Into SNCP Services
........................................................................................................................................................................452
E.4.4 Parameter Description: SDH Service Configuration............................................................................456E.4.5 Parameter Description: SNCP Service Control.....................................................................................458
E.4.6 Parameter Description: TU_AIS Insertion............................................................................................461
E.5 Parameters for Board Interfaces.....................................................................................................................462
E.5.1 Parameter Description: Working Modes of Ports.................................................................................462
E.5.2 PDH Port Parameters............................................................................................................................463
E.5.2.1 Parameter Description: PDH Ports_Basic Attributes...................................................................463
E.5.2.2 Parameter Description: PDH Ports_Advanced Attributes...........................................................464
E.5.3 Parameters for the Ports on Ethernet Boards........................................................................................468
E.5.3.1 Parameter Description: Ethernet Interface_Basic Attributes.......................................................468
E.5.3.2 Parameter Description: Ethernet Interface_Flow Control............................................................473
E.5.3.3 Parameter Description: Ethernet Interface_Layer 2 Attributes....................................................475
E.5.3.4 Parameter Description: Ethernet Port_Layer 3 Attributes...........................................................479
E.5.3.5 Parameter Description: Ethernet Interface_Advanced Attributes................................................480
E.5.4 Serial Port Parameters...........................................................................................................................483
E.5.4.1 Parameter Description: Serial Port_Basic Attributes...................................................................483
E.5.4.2 Parameter Description: Serial Port_Creation of Serial Ports.......................................................484
E.5.5 Microwave Interface Parameters...........................................................................................................485
E.5.5.1 Parameter Description: Microwave Interface_Basic Attributes...................................................485
E.5.5.2 Parameter Description: Microwave Interface_Layer 2 Attributes...............................................486E.5.5.3 Parameter Description: Microwave Interface_Layer 3 Attributes...............................................488
E.5.5.4 Parameter Description: Microwave Interface_Advanced Attributes...........................................490
E.5.6 IF Board Parameters..............................................................................................................................493
E.5.6.1 Parameter Description: IF Interface_IF Attribute........................................................................493
E.5.6.2 Parameter Description: IF Interface_ATPC Attribute.................................................................501
E.5.6.3 Parameter Description: Hybrid_AM Configuration_Advanced Attributes.................................503
E.5.6.4 Parameter Description: ATPC Adjustment Records....................................................................504
E.5.6.5 Parameter Description: PRBS Test..............................................................................................505
E.5.7 ODU Parameters...................................................................................................................................506
E.5.7.1 Parameter Description: ODU Interface_Radio Frequency Attribute...........................................506
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E.5.7.2 Parameter Description: ODU Interface_Power Attributes...........................................................507
E.5.7.3 Parameter Description: ODU Interface_Equipment Information................................................511
E.5.7.4 Parameter Description: ODU Interface_Advanced Attributes.....................................................512
E.5.8 Parameters for SDH Interface Boards...................................................................................................513
E.5.8.1 Parameter Description: SDH Interfaces.......................................................................................514
E.5.8.2 Parameter Description: Automatic Laser Shutdown....................................................................515
E.5.9 Parameters for PDH Interface Boards...................................................................................................516
E.5.9.1 Parameter Description: PDH Ports...............................................................................................516
E.5.9.2 Parameter Description: PRBS Test..............................................................................................519
E.5.10 Parameters for Overhead.....................................................................................................................520
E.5.10.1 Parameter Description: Regenerator Section Overhead.............................................................520
E.5.10.2 Parameter Description: VC-4 POHs..........................................................................................521
E.5.10.3 Parameter Description: VC-12 POHs........................................................................................523
E.5.11 Parameter Description: Ethernet Virtual Interfaces............................................................................524
E.6 Parameters for Ethernet Services and Ethernet Features on the Packet Plane...............................................527
E.6.1 Parameters for Ethernet Services..........................................................................................................527
E.6.1.1 Parameter Description: E-Line Service_Creation........................................................................527
E.6.1.2 Parameter Description: E-Line Service........................................................................................548
E.6.1.3 Parameter Description: VLAN Forwarding Table Items for E-Line Services_Creation.............559
E.6.1.4 Parameter Description: E-LAN Service_Creation.......................................................................560
E.6.1.5 Parameter Description: E-LAN Service.......................................................................................566
E.6.1.6 Parameter Description: QinQ Link_Creation...............................................................................577
E.6.1.7 Parameter Description: E-AGGR Services_Creation..................................................................577E.6.1.8 Parameter Description: E-AGGR Services..................................................................................585
E.6.2 Parameters for Ethernet Protocols.........................................................................................................590
E.6.2.1 Parameter Description: ERPS Management_Creation.................................................................590
E.6.2.2 Parameter Description: ERPS Management................................................................................593
E.6.2.3 Parameter Description: MSTP Configuration_Port Group Creation...........................................599
E.6.2.4 Parameter Description: MSTP Configuration_Port Group Configuration...................................601
E.6.2.5 Parameter Description: MSTP Configuration_ Bridge Parameters.............................................601
E.6.2.6 Parameter Description: MSTP Configuration_CIST Parameters................................................607
E.6.2.7 Parameter Description: MSTP Configuration_Running Information About the CIST...............609
E.6.2.8 Parameter Description: Ethernet Link Aggregation Management_LAG Creation......................617
E.6.2.9 Parameter Description: Ethernet Link Aggregation_Link Aggregation......................................625
E.6.2.10 Parameter Description: LPT Management_Point-to-Point LPT................................................626
E.6.2.11 Parameter Description: LPT Management_Creating Point-to-Point LPT.................................628
E.6.2.12 Parameter Description: LPT Management_Point-to-Multipoint LPT.......................................628
E.6.2.13 Parameter Description: LPT Management_Creating Point-to-Multipoint LPT.........................631
E.6.3 Parameters for the Ethernet OAM.........................................................................................................635
E.6.3.1 Parameter Description: Ethernet Service OAM Management_Maintenance Domain Creation
..................................................................................................................................................................635
E.6.3.2 Parameter Description: Ethernet Service OAM Management_Maintenance Association Creation..................................................................................................................................................................636
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E.6.3.3 Parameter Description: Ethernet Service OAM Management_MEP Creation............................637
E.6.3.4 Parameter Description: Ethernet Service OAM Management_Remote MEP Creation...............638
E.6.3.5 Parameter Description: Ethernet Service OAM Management_MIP Creation.............................639
E.6.3.6 Parameter Description: Ethernet Service OAM Management_LB Enabling...............................639
E.6.3.7 Parameter Description: Ethernet Service OAM Management_LT Enabling...............................641
E.6.3.8 Parameter Description: Ethernet Service OAM_Enabling Service Loopback Detection............643
E.6.3.9 Parameter Description: Ethernet Port OAM Management_OAM Parameter..............................644
E.6.3.10 Parameter Description: Ethernet Port OAM Management_OAM Error Frame Monitoring
..................................................................................................................................................................646
E.6.4 QoS Parameters.....................................................................................................................................647
E.6.4.1 Parameter Description: Diffserv Domain Management...............................................................647
E.6.4.2 Parameter Description: DiffServ Domain Management_Create..................................................653
E.6.4.3 Parameter Description: DiffServ Domain Applied Port_Modification........................................660
E.6.4.4 Parameter Description: Policy Management................................................................................662E.6.4.5 Parameter Description: Port Policy..............................................................................................668
E.6.4.6 Parameter Description: Port Policy_Traffic Classification Configuration..................................675
E.6.4.7 Parameter Description: Port Shaping Management_Creation.....................................................686
E.7 Parameters for Ethernet Services and Ethernet Features on the EoS/EoPDH Plane.....................................687
E.7.1 Parameters for Ethernet Services..........................................................................................................688
E.7.1.1 Parameter Description: Ethernet Line Service_Creation.............................................................688
E.7.1.2 Parameter Description: Ethernet Line Service_Creating QinQ-Based Ethernet Line Services
..................................................................................................................................................................691
E.7.1.3 Parameter Description: Ethernet Line Service.............................................................................695
E.7.1.4 Parameter Description: Ethernet LAN Service_Creation of Ethernet LAN Services Based on IEEE802.1d/802.1qBridge...............................................................................................................................698
E.7.1.5 Parameter Description: Ethernet LAN Service_Creating IEEE 802.1ad Bridge-Based Ethernet LAN
Service......................................................................................................................................................701
E.7.1.6 Parameter Description: Ethernet LAN Service............................................................................706
E.7.1.7 Parameter Description: VLAN Filtering Table_Creation............................................................712
E.7.1.8 Parameter Description: Aging Time of MAC Address Table Entries.........................................713
E.7.2 Parameters for Ethernet Protocols.........................................................................................................714
E.7.2.1 Parameter Description: ERPS Management_Creation.................................................................714
E.7.2.2 Parameter Description: ERPS Management................................................................................717
E.7.2.3 Parameter Description: Spanning Tree_Protocol Enabling.........................................................723
E.7.2.4 Parameter Description: Spanning Tree_Bridge Parameters.........................................................724
E.7.2.5 Parameter Description: Spanning Tree_Port Parameters.............................................................725
E.7.2.6 Parameter Description: Spanning Tree_Bridge Running Information.........................................727
E.7.2.7 Parameter Description: Spanning Tree_Port Running Information.............................................728
E.7.2.8 Parameter Description: Spanning Tree_Point-to-Point Attribute................................................729
E.7.2.9 Parameter Description: IGMP Snooping Protocol_Enabling......................................................730
E.7.2.10 Parameter Description: IGMP Snooping Protocol_Creation of Static Multicast Table Entries
..................................................................................................................................................................731
E.7.2.11 Parameter Description: IGMP Snooping Protocol_Aging Time of Multicast Table Entries..................................................................................................................................................................732
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E.7.2.12 Parameter Description: Ethernet Link Aggregation_Creation of LAGs....................................733
E.7.2.13 Parameter Description: Ethernet Link Aggregation_Link Aggregation....................................735
E.7.2.14 Parameter Description: LPT Management_Creation of Point-to-Point Service LPT................736
E.7.2.15 Parameter Description: LPT Management_Creation of Point-to-Multipoint Service LPT.......737
E.7.2.16 Parameter Description: Port Mirroring_Creation.......................................................................738
E.7.3 Parameters for the Ethernet OAM.........................................................................................................739
E.7.3.1 Parameter Description: Ethernet Service OAM_Creation of MDs..............................................739
E.7.3.2 Parameter Description: Ethernet Service OAM_Creation of MAs..............................................740
E.7.3.3 Parameter Description: Ethernet Service OAM_Creation of MPs...............................................741
E.7.3.4 Parameter Description: Ethernet Service OAM_Enabling LB....................................................743
E.7.3.5 Parameter Description: Ethernet Service OAM_Enabling LT.....................................................744
E.7.3.6 Parameter Description: Ethernet Port OAM_OAM Parameter....................................................745
E.7.3.7 Parameter Description: Ethernet Port OAM_OAM Error Frame Monitoring.............................746
E.7.3.8 Parameter Description: Ethernet Port OAM_Remote OAM Parameter......................................747
E.7.4 QoS Parameters.....................................................................................................................................748
E.7.4.1 Parameter Description: QoS Management_Creation of Flows....................................................748
E.7.4.2 Parameter Description: QoS Management_Creation of CAR......................................................750
E.7.4.3 Parameter Description: QoS Management_Creation of CoS.......................................................752
E.7.4.4 Parameter Description: QoS Management_Creation of CAR/CoS.............................................754
E.7.4.5 Parameter Description: QoS Management_Shaping Management of Egress Queues.................754
E.7.4.6 Parameter Description: QoS Management_Port Shaping............................................................756
E.7.5 Parameters for the Ports on Ethernet Boards........................................................................................757
E.7.5.1 Parameter Description: Ethernet Port_External Port...................................................................757E.7.5.2 Parameter Description: Ethernet Port_Internal Port.....................................................................764
E.7.5.3 Parameter Description: Type Field of QinQ Frames...................................................................770
E.8 RMON Parameters.........................................................................................................................................771
E.8.1 Parameter Description: RMON Performance_Statistics Group............................................................771
E.8.2 Parameter Description: RMON Performance_History Group..............................................................772
E.8.3 Parameter Description: RMON Performance_History Control Group.................................................773
E.8.4 Parameter Description: RMON Performance_RMON Setting.............................................................774
E.9 Parameters for MPLS/PWE3 Services...........................................................................................................776
E.9.1 MPLS Tunnel Parameters.....................................................................................................................776
E.9.1.1 Parameter Description: Basic Configurations of MPLS Tunnels................................................776
E.9.1.2 Parameter Description: Unicast Tunnel Management_Static Tunnel..........................................777
E.9.1.3 Parameter Description: Unicast Tunnel Management_Creation of Unidirectional Tunnels.......782
E.9.1.4 Parameter Description: Unicast Tunnel Management_Creation of Bidirectional Tunnels..........786
E.9.1.5 Parameter Description: Unicast Tunnel Management_OAM Parameters...................................790
E.9.1.6 Parameter Description: Unicast Tunnel Management_FDI.........................................................796
E.9.1.7 Parameter Description: Unicast Tunnel Management_LSP Ping................................................796
E.9.1.8 Parameter Description: Unicast Tunnel Management_LSP Traceroute......................................799
E.9.1.9 Parameter Description: PW Management_PW Management......................................................802
E.9.1.10 Parameter Description: PW Management_MS-PW Creation....................................................807
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E.9.1.11 Parameter Description: PW Management_PW OAM................................................................818
E.9.1.12 Parameter Description: PW Management_PW Ping..................................................................822
E.9.1.13 Parameter Description: PW Management_PW Traceroute........................................................825
E.9.1.14 Parameter Description: MPLS APS Protection Management....................................................827
E.9.1.15 Parameter Description: Tunnel Protection Group_Creation......................................................830
E.9.1.16 Parameter Description: PW APS Protection Group_Creation...................................................835
E.9.1.17 Parameter Description: Slave Protection Pair of a PW APS Protection Group_Creation.........846
E.9.2 CES Parameters.....................................................................................................................................852
E.9.2.1 Parameter Description: CES Service Management......................................................................852
E.9.2.2 Parameter Description: CES Service Management_Creation......................................................861
E.9.3 ATM Parameters...................................................................................................................................874
E.9.3.1 Parameter Description: ATM IMA Management_IMA Group Management.............................874
E.9.3.2 Parameter Description: ATM IMA Management_Bound Path Configuration............................879
E.9.3.3 Parameter Description: ATM IMA Management_IMA Group Status.........................................881E.9.3.4 Parameter Description: ATM IMA Management_IMA Link Status...........................................882
E.9.3.5 Parameter Description: ATM IMA Management_ATM Interface Management........................882
E.9.3.6 Parameter Description: Configuration of ATM Service Class Mapping Table...........................884
E.9.3.7 Parameter Description: Configuration of ATM Service Class Mapping Table_Creation...........886
E.9.3.8 Parameter Description: ATM Policy Management......................................................................887
E.9.3.9 Parameter Description: ATM Policy Management_Creation......................................................892
E.9.3.10 Parameter Description: ATM Service Management..................................................................897
E.9.3.11 Parameter Description: ATM Service Management_Creation..................................................907
E.9.3.12 Parameter Description: ATM OAM Management_Segment and End Attributes......................919
E.9.3.13 Parameter Description: ATM OMA Management_CC Activation Status.................................923
E.9.3.14 Parameter Description: ATM OAM Management_Remote End Loopback Status...................926
E.9.3.15 Parameter Description: ATM OAM Management_LLID..........................................................929
E.10 Clock Parameters.........................................................................................................................................930
E.10.1 Parameter Description: Frequency Selection Mode............................................................................930
E.10.2 Physical Clock Parameters..................................................................................................................931
E.10.2.1 Parameter Description: Clock Source Priority Table.................................................................931
E.10.2.2 Parameter Description: Priority Table for the PLL Clock Source of the External Clock Port
..................................................................................................................................................................933
E.10.2.3 Parameter Description: Clock Subnet Setting_Clock Subnet....................................................935E.10.2.4 Parameter Description: Clock Subnet Setting_Clock Quality...................................................938
E.10.2.5 Parameter Description: Clock Subset Setting_SSM Output Control.........................................941
E.10.2.6 Parameter Description: Clock Subset Setting_Clock ID Enabling Status.................................942
E.10.2.7 Parameter Description: Clock Source Switching_Clock Source Restoration Parameters.........943
E.10.2.8 Parameter Description: Clock Source Switching_Clock Source Switching..............................945
E.10.2.9 Parameter Description: Clock Source Switching_Clock Source Switching Conditions...........946
E.10.2.10 Parameter Description: Output Phase-Locked Source of the External Clock Source..............947
E.10.2.11 Parameter Description: Clock Synchronization Status............................................................950
E.10.3 CES ACRClock Parameters...............................................................................................................951
E.10.3.1 Parameter Description: ACR Clock Source...............................................................................952
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E.10.3.2 Parameter Description: Clock Domain......................................................................................952
E.10.3.3 Parameter Description: Clock Domain_Creation.......................................................................953
E.10.4 PTP Clock Parameters.........................................................................................................................954
E.10.4.1 Parameter Description: Clock Synchronization Attribute..........................................................954
E.10.4.2 Parameter Description: Clock Synchronization Attribute_Creation of PTP Clock Ports..........964
E.10.4.3 Parameter Description: Setting of a PTP Clock Subnet_Clock Subnet.....................................965
E.10.4.4 Parameter Description: Setting of a PTP Clock Subnet_BMC..................................................966
E.10.4.5 Parameter Description: External Time Port_Basic Attributes...................................................967
E.10.4.6 Parameter Description: External Time Port_BMC....................................................................968
E.10.4.7 Parameter Description: External Time Port_Cable Transmission Distance..............................970
E.10.5 Parameter Description: Auxiliary Ports..............................................................................................971
E.11 Parameters for the Orderwire and Auxiliary Interfaces...............................................................................972
E.11.1 Parameter Description: Orderwire_General........................................................................................972
E.11.2 Parameter Description: Orderwire_Advanced....................................................................................974
E.11.3 Parameter Description: Orderwire_F1 Data Port................................................................................975
E.11.4 Parameter Description: Orderwire_Broadcast Data Port....................................................................975
E.11.5 Parameter Description: Environment Monitoring Interface................................................................976
F Glossary.......................................................................................................................................980
F.1 0-9...................................................................................................................................................................981
F.2 A-E.................................................................................................................................................................981
F.3 F-J...................................................................................................................................................................990
F.4 K-O.................................................................................................................................................................995
F.5 P-T................................................................................................................................................................1001
F.6 U-Z...............................................................................................................................................................1010
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1IntroductionAbout This Chapter
The OptiX RTN 910 is a product in the OptiX RTN 900 radio transmission system series.
1.1 Network Application
The OptiX RTN 900 is a new generation TDM/Hybrid/Packet integrated microwave
transmission system developed by Huawei. It provides a seamless microwave transmission
solution for mobile communication network or private networks.
1.2 Components
The OptiX RTN 910 adopts a split structure. The system consists of the IDU 910 and the ODU.
Each ODU isconnected to the IDU through an IF cable.
1.3 Configuration Modes
The OptiX RTN 910 supports different configuration modes in which different system control,
switching, and timing boards, IF boards, and ODUs are configured, suited for various microwave
application scenarios.
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1.1 Network ApplicationThe OptiX RTN 900 is a new generation TDM/Hybrid/Packet integrated microwave
transmission system developed by Huawei. It provides a seamless microwave transmission
solution for mobile communication network or private networks.
OptiX RTN 900 Product Family
There are three types of OptiX RTN 900 products: OptiX RTN 910, OptiX RTN 950, and OptiX
RTN 980. Users can choose the product best suited for their site.
l The IDU of the OptiX RTN 910 is 1U high and supports one or two IF boards.
l The IDU of the OptiX RTN 950 is 2U high and supports one to six IF boards.
l The IDU of the OptiX RTN 980 is 5U high and supports one to fourteen IF boards.
NOTE
All the products in the OptiX RTN 900 series use the same types of IF and service interface boards.
The OptiX RTN 900 series provide a variety of service interfaces and can be installed easily and
configured flexibly. The OptiX RTN 900 series provide a solution that can integrate TDM
microwave, Hybrid microwave, and Packet microwave technologies according to the
networking scheme for the sites, achieving smooth upgrade from TDM microwave to Hybrid
microwave, and from Hybrid microwave to Packet microwave. This solution is able to adapt to
changing service scenarios brought about by evolutions in radio mobile networks. Therefore,
this solution meets the transmission requirements of 2G and 3G networks while also allowing
for integration with future LTE and 4G networks.
OptiX RTN 910The OptiX RTN 910 is microwave equipment deployed at the access layer. Figure 1-1shows
the microwave transmission solution provided by the OptiX RTN 910.
Figure 1-1Microwave transmission solution provided by the OptiX RTN 910
OptiX RTN 910 BTSNodeB BSCRNC
FE
E1
FEE1
E1
E1
FE
E1
E1
FE
FE/GE
E1/
STM-1
Regional TDM
Network
E1/
STM-1
FE/GE
FE/GE
Regional Packet
Network
MSTP
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NOTE
l In this solution, the OptiX RTN 910 is connected to an RNC and BSC directly or through a regional backhaul
network.
l The OptiX RTN 910 provides a wide range of interfaces and service bearer technologies to adapt to the
regional backhaul network. The regional backhaul network can be a time-division multiplexing (TDM)
network or packet switching network (PSN).
l The OptiX RTN 910 supports the Ethernet over SDH (EoSDH) function and Ethernet over PDH
(EoPDH) function. Therefore, packet services can be backhauled through a TDM network.
l The OptiX RTN 910 supports the pseudo wire emulation edge-to-edge (PWE3) technology. Therefore,
TDM, ATM, and Ethernet services can be backhauled through a PSN.
l The OptiX RTN 910 supports the VLAN sub-interface function. Therefore, MPLS packet services can
be backhauled through a Layer 2 network.
l When three or more microwave directions are required, cascade several sets of the OptiX RTN 910 or use
the OptiX RTN 950 or OptiX RTN 980 that provides more powerful functions and supports more microwave
directions.
1.2 Components
The OptiX RTN 910 adopts a split structure. The system consists of the IDU 910 and the ODU.
Each ODU is connected to the IDU through an IF cable.
IDU 910
The IDU 910 is the indoor unit for an OptiX RTN 910 system. It receives and multiplexes
services, performs service processing and IF processing, and provides the system control and
communications function.
Table 1-1lists the basic features of the IDU 910.
Table 1-1Features of the IDU 910
Item Description
Chassis height 1U
Pluggable Supported
Number of microwave
directions
1 or 2
RF configuration mode 1+0 non-protection configuration
2+0 non-protection configuration
1+1 protection configuration
N+1 protection configuration (N = 1)
XPIC configuration
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Figure 1-2Appearance of the IDU 910
ODU
The ODU is the outdoor unit for the OptiX RTN 900. It converts frequencies and amplifies
signals.
The OptiX RTN 900 product series can use the RTN 600 ODU and RTN XMC ODU, covering
the entire frequency band from 6 GHz to 42 GHz.
NOTE
Unlike the other frequency bands that use 14 MHz, 28 MHz, or 56 MHz channel spacing, the 18 GHz
frequency band uses 13.75 MHz, 27.5 MHz, or 55 MHz channel spacing.
Table 1-2RTN 600 ODUs that the OptiX RTN 910 supports
Item Description
Standard PowerODU
High-Power ODU Low Capacity forPDH ODU
ODU type SP, SPA HP, HPA LP
Frequency band 7/8/11/13/15/18/23/
26/38 GHz (SP
ODU)6/7/8/11/13/15/18/2
3 GHz (SPA ODU)
6/7/8/10/10.5/11/13/
15/18/23/26/28/32/3
8 GHz (HP ODU)7/8/11/13/15/18/23
GHz (HPA ODU)
7/8/11/13/15/18/23
GHz (LP ODU)
Microwave
modulation scheme
QPSK/16QAM/
32QAM/64QAM/
128QAM/256QAM
QPSK/16QAM/
32QAM/64QAM/
128QAM/256QAM
QPSK/16QAM
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Item Description
Standard PowerODU
High-Power ODU Low Capacity forPDH ODU
Channel spacing 3.5/7/14/28 MHz 7/14/28/40/56 MHz(6/7/8/10/11/13/15/1
8/23/26/28/32/38
GHz)
7/14/28 MHz (10.5
GHz)
3.5/7/14/28 MHz
Table 1-3RTN XMC ODUs that the OptiX RTN 910 supports
Item DescriptionHigh-Power ODU Low Capacity for PDH
ODU
ODU type XMC-2 XMC-1
Frequency band 7/8/11/13/15/18/23/26/28/32
/38/42 GHz
7/8/11/13/15/18/23 GHz
Microwave modulation
scheme
QPSK/16QAM/32QAM/
64QAM/128QAM/256QAM
QPSK/16QAM
Channel spacing 7/14/28/40/56 MHz 3.5/7/14/28 MHz
There are two methods for mounting the ODU and the antenna: direct mounting and separate
mounting.
l The direct mounting method is generally adopted when a small- or medium-diameter and
single-polarized antenna is used. In this situation, if one ODU is configured for one antenna,
the ODU is directly mounted at the back of the antenna. If two ODUs are configured for
one antenna, an RF signal combiner/splitter (hence referred to as a hybrid coupler) must
be mounted to connect the ODUs to the antenna. Figure 1-3illustrates the direct mounting
method.
The direct mounting method can also be adopted when a small- or medium-diameter and
dual-polarized antenna is used. Two ODUs are mounted onto an antenna using an
orthogonal mode transducer (OMT). The method for installing an OMT is similar to that
for installing a hybrid coupler.
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Figure 1-3Direct mounting
l The separate mounting method is adopted when a large- or medium-diameter and single-
or dual-polarized antenna is used. Figure 1-4shows the separate mounting method. In this
situation, a hybrid coupler can be mounted (two ODUs share one feed boom).
Figure 1-4Separate mounting
NOTE
The OptiX RTN 910 provides an antenna s