rohs - seoul semiconductor · sz8-y15-xx-xx - high-power led 3 product data sheet rev4.2, apr 13,...
TRANSCRIPT
Product Brief
Description
Key Applications
Features and Benefits
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SZ8-Y15-XX-XX - High-power LED
1Rev42 Apr 13 2017
Product Data Sheet
SZ8-Y15-XX-XX (Cool Neutral Warm)
High-Power LED - Z8 Y15
bull The WICOP2 series is designed for high
flux output applications with high current
operation capability
bull Compact footprint(141x141mm)
enables system level cost saving
bull It incorporates state of the art SMD
design and low thermal resistant
material
bull The WICOP2 is ideal light sources for
directional lighting applications such as
Spot Lights various outdoor
applications automotive lightings and
high performance torches
bull Designed for high current operation
bull Low Thermal Resistance
bull A wide CCT range of 2600~7000K
bull ANSI compliant Binning
bull RoHS compliant
bull Phosphor film directly attached to
chip surface
Part NumberCCT CRI
Color Min Max Min
SZ8-Y15-W0-C7 Cool White 4700K 7000K 70
SZ8-Y15-W0-C8 Cool White 4700K 7000K 80
SZ8-Y15-W0-C9 Cool White 4700K 7000K 90
SZ8-Y15-WN-C7 Neutral White 3700K 4700K 70
SZ8-Y15-WN-C8 Neutral White 3700K 4700K 80
SZ8-Y15-WN-C9 Neutral White 3700K 4700K 90
SZ8-Y15-WW-C7 Warm White 2600K 3700K 70
SZ8-Y15-WW-C8 Warm White 2600K 3700K 80
SZ8-Y15-WW-C9 Warm White 2600K 3700K 90
Table 1 Product Selection Table
New Generation of WICOP
bull Residential - Replacement lamps
bull CommercialIndustrial ndash Retail Display
bull Outdoor area - FloodStreet light High Bay
RoHS
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SZ8-Y15-XX-XX - High-power LED
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Product Data Sheet
Rev42 Apr 13 2017
Table of Contents
Index
bull Product Brief `
bull Table of Contents 2
bull Performance Characteristics 3
bull Characteristics Graph 7
bull Color bin structure 12
bull Mechanical Dimensions 21
bull Material Structure 22
bull Reflow Soldering Characteristics 23
bull Emitter Tape amp Reel Packaging 24
bull Handling of Silicone Resin for LEDs 26
bull Precaution For Use 27
bull Company Information 30
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Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C7 4700 7000
W3 152 167 271 357
70W2 142 156 254 335
W1 133 146 237 313
V3 125 137 223 294
SZ8-Y15-WN-C7 3700 4700
W3 152 167 271 357
70W2 142 156 254 335
W1 133 146 237 313
V3 125 137 223 294
SZ8-Y15-WW-C7 2600 3700
V3 125 137 223 294
70V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
Table 2 Electro Optical Characteristics IF = 350mA (CRI 70)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
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Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C8 4700 7000
W2 142 156 254 335
80W1 133 146 237 313
V3 125 137 223 294
V2 116 128 208 274
SZ8-Y15-WN-C8 3700 4700
W2 142 156 254 335
80W1 133 146 237 313
V3 125 137 223 294
V2 116 128 208 274
SZ8-Y15-WW-C8 2600 3700
V3 125 137 223 294
80V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
Table 2 Electro Optical Characteristics IF = 350mA (CRI 80)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
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Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C9 4700 7000
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WN-C9 3700 4700
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WW-C9 2600 3700
V1 109 120 195 257
90U3 102 112 182 240
U2 96 106 172 227
U1 89 98 160 211
Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
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Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Parameter SymbolValue
UnitMin Typ Max
Forward Current [1] IF - -10 [4]
12 [3]A
Power Dissipation PD - - 47 W
Junction Temperature Tj - - 145 ordmC
Operating Temperature Topr - 40 - 125 ordmC
Storage Temperature Tstg - 40 - 125 ordmC
Viewing angle θ 140 degree
Forward voltage (350mA 85) VF 284 V
Forward voltage (700mA 85) VF 300 V
Thermal resistance (J to S) [2] RθJ-S -6 [3]
75 [4]- KW
ESD Sensitivity(HBM) Class 2 JESD22-A114-E
Table 3 Absolute Maximum Ratings
Notes
(1) At Junction Temperature 85 condition
(2) RθJ-S is tested at 700mA
(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)
(4) Using Metal PCB (Normal type)
bull Thermal resistance can be increased substantially depending on the heat sink designoperating
condition and the maximum possible driving current will decrease accordingly
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 1 Color Spectrum
Fig 2 Typical Spatial Distribution
350 400 450 500 550 600 650 700 750 800
0
20
40
60
80
100
Re
lati
ve
Ra
dia
nt
Po
we
r [
]
Wavelength [nm]
Cool white
Neutral white
Warm white
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
0
10
20
30
40
50
60
70
80
90
100
110
Re
lati
ve
Lu
min
ou
s In
ten
sit
y [
]
Angular Displacement [degrees]
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 3 Forward Voltage vs Forward Current Tj=85
Fig 4 Forward Current vs Relative Luminous Flux Tj=85
24 26 28 30 32 34 3600
02
04
06
08
10
12
14
Fo
rwa
rd C
urr
en
t [A
]
Forward Voltage [V]
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
0
20
40
60
80
100
120
140
160
Re
lati
ve
Lu
min
ou
s F
lux
[
]
Forward Current [mA]
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
25 50 75 100 125
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
Junction Temperature [oC]
CIE X
CIE Y
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
0010
Forward Current [mA]
CIE X
CIE Y
Fig 5 Forward Current vs CIE X Y Shift Tj=85
Fig 6 Junction Temp vs CIE X Y Shift IF=700mA
145
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
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Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
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Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
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Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
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SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
2
Product Data Sheet
Rev42 Apr 13 2017
Table of Contents
Index
bull Product Brief `
bull Table of Contents 2
bull Performance Characteristics 3
bull Characteristics Graph 7
bull Color bin structure 12
bull Mechanical Dimensions 21
bull Material Structure 22
bull Reflow Soldering Characteristics 23
bull Emitter Tape amp Reel Packaging 24
bull Handling of Silicone Resin for LEDs 26
bull Precaution For Use 27
bull Company Information 30
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
3
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C7 4700 7000
W3 152 167 271 357
70W2 142 156 254 335
W1 133 146 237 313
V3 125 137 223 294
SZ8-Y15-WN-C7 3700 4700
W3 152 167 271 357
70W2 142 156 254 335
W1 133 146 237 313
V3 125 137 223 294
SZ8-Y15-WW-C7 2600 3700
V3 125 137 223 294
70V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
Table 2 Electro Optical Characteristics IF = 350mA (CRI 70)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
4
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C8 4700 7000
W2 142 156 254 335
80W1 133 146 237 313
V3 125 137 223 294
V2 116 128 208 274
SZ8-Y15-WN-C8 3700 4700
W2 142 156 254 335
80W1 133 146 237 313
V3 125 137 223 294
V2 116 128 208 274
SZ8-Y15-WW-C8 2600 3700
V3 125 137 223 294
80V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
Table 2 Electro Optical Characteristics IF = 350mA (CRI 80)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
5
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C9 4700 7000
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WN-C9 3700 4700
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WW-C9 2600 3700
V1 109 120 195 257
90U3 102 112 182 240
U2 96 106 172 227
U1 89 98 160 211
Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
6
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Parameter SymbolValue
UnitMin Typ Max
Forward Current [1] IF - -10 [4]
12 [3]A
Power Dissipation PD - - 47 W
Junction Temperature Tj - - 145 ordmC
Operating Temperature Topr - 40 - 125 ordmC
Storage Temperature Tstg - 40 - 125 ordmC
Viewing angle θ 140 degree
Forward voltage (350mA 85) VF 284 V
Forward voltage (700mA 85) VF 300 V
Thermal resistance (J to S) [2] RθJ-S -6 [3]
75 [4]- KW
ESD Sensitivity(HBM) Class 2 JESD22-A114-E
Table 3 Absolute Maximum Ratings
Notes
(1) At Junction Temperature 85 condition
(2) RθJ-S is tested at 700mA
(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)
(4) Using Metal PCB (Normal type)
bull Thermal resistance can be increased substantially depending on the heat sink designoperating
condition and the maximum possible driving current will decrease accordingly
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
7
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 1 Color Spectrum
Fig 2 Typical Spatial Distribution
350 400 450 500 550 600 650 700 750 800
0
20
40
60
80
100
Re
lati
ve
Ra
dia
nt
Po
we
r [
]
Wavelength [nm]
Cool white
Neutral white
Warm white
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
0
10
20
30
40
50
60
70
80
90
100
110
Re
lati
ve
Lu
min
ou
s In
ten
sit
y [
]
Angular Displacement [degrees]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
8
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 3 Forward Voltage vs Forward Current Tj=85
Fig 4 Forward Current vs Relative Luminous Flux Tj=85
24 26 28 30 32 34 3600
02
04
06
08
10
12
14
Fo
rwa
rd C
urr
en
t [A
]
Forward Voltage [V]
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
0
20
40
60
80
100
120
140
160
Re
lati
ve
Lu
min
ou
s F
lux
[
]
Forward Current [mA]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
9
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
25 50 75 100 125
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
Junction Temperature [oC]
CIE X
CIE Y
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
0010
Forward Current [mA]
CIE X
CIE Y
Fig 5 Forward Current vs CIE X Y Shift Tj=85
Fig 6 Junction Temp vs CIE X Y Shift IF=700mA
145
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
10
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
11
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
3
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C7 4700 7000
W3 152 167 271 357
70W2 142 156 254 335
W1 133 146 237 313
V3 125 137 223 294
SZ8-Y15-WN-C7 3700 4700
W3 152 167 271 357
70W2 142 156 254 335
W1 133 146 237 313
V3 125 137 223 294
SZ8-Y15-WW-C7 2600 3700
V3 125 137 223 294
70V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
Table 2 Electro Optical Characteristics IF = 350mA (CRI 70)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
4
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C8 4700 7000
W2 142 156 254 335
80W1 133 146 237 313
V3 125 137 223 294
V2 116 128 208 274
SZ8-Y15-WN-C8 3700 4700
W2 142 156 254 335
80W1 133 146 237 313
V3 125 137 223 294
V2 116 128 208 274
SZ8-Y15-WW-C8 2600 3700
V3 125 137 223 294
80V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
Table 2 Electro Optical Characteristics IF = 350mA (CRI 80)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
5
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C9 4700 7000
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WN-C9 3700 4700
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WW-C9 2600 3700
V1 109 120 195 257
90U3 102 112 182 240
U2 96 106 172 227
U1 89 98 160 211
Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
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SZ8-Y15-XX-XX - High-power LED
6
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Parameter SymbolValue
UnitMin Typ Max
Forward Current [1] IF - -10 [4]
12 [3]A
Power Dissipation PD - - 47 W
Junction Temperature Tj - - 145 ordmC
Operating Temperature Topr - 40 - 125 ordmC
Storage Temperature Tstg - 40 - 125 ordmC
Viewing angle θ 140 degree
Forward voltage (350mA 85) VF 284 V
Forward voltage (700mA 85) VF 300 V
Thermal resistance (J to S) [2] RθJ-S -6 [3]
75 [4]- KW
ESD Sensitivity(HBM) Class 2 JESD22-A114-E
Table 3 Absolute Maximum Ratings
Notes
(1) At Junction Temperature 85 condition
(2) RθJ-S is tested at 700mA
(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)
(4) Using Metal PCB (Normal type)
bull Thermal resistance can be increased substantially depending on the heat sink designoperating
condition and the maximum possible driving current will decrease accordingly
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 1 Color Spectrum
Fig 2 Typical Spatial Distribution
350 400 450 500 550 600 650 700 750 800
0
20
40
60
80
100
Re
lati
ve
Ra
dia
nt
Po
we
r [
]
Wavelength [nm]
Cool white
Neutral white
Warm white
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
0
10
20
30
40
50
60
70
80
90
100
110
Re
lati
ve
Lu
min
ou
s In
ten
sit
y [
]
Angular Displacement [degrees]
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 3 Forward Voltage vs Forward Current Tj=85
Fig 4 Forward Current vs Relative Luminous Flux Tj=85
24 26 28 30 32 34 3600
02
04
06
08
10
12
14
Fo
rwa
rd C
urr
en
t [A
]
Forward Voltage [V]
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
0
20
40
60
80
100
120
140
160
Re
lati
ve
Lu
min
ou
s F
lux
[
]
Forward Current [mA]
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
25 50 75 100 125
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
Junction Temperature [oC]
CIE X
CIE Y
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
0010
Forward Current [mA]
CIE X
CIE Y
Fig 5 Forward Current vs CIE X Y Shift Tj=85
Fig 6 Junction Temp vs CIE X Y Shift IF=700mA
145
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SZ8-Y15-XX-XX - High-power LED
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
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Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
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Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
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Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
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Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
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SZ8-Y15-XX-XX - High-power LED
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
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SZ8-Y15-XX-XX - High-power LED
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
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SZ8-Y15-XX-XX - High-power LED
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
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SZ8-Y15-XX-XX - High-power LED
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
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SZ8-Y15-XX-XX - High-power LED
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Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
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SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
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SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
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SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
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SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
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SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
4
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C8 4700 7000
W2 142 156 254 335
80W1 133 146 237 313
V3 125 137 223 294
V2 116 128 208 274
SZ8-Y15-WN-C8 3700 4700
W2 142 156 254 335
80W1 133 146 237 313
V3 125 137 223 294
V2 116 128 208 274
SZ8-Y15-WW-C8 2600 3700
V3 125 137 223 294
80V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
Table 2 Electro Optical Characteristics IF = 350mA (CRI 80)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
5
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C9 4700 7000
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WN-C9 3700 4700
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WW-C9 2600 3700
V1 109 120 195 257
90U3 102 112 182 240
U2 96 106 172 227
U1 89 98 160 211
Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
6
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Parameter SymbolValue
UnitMin Typ Max
Forward Current [1] IF - -10 [4]
12 [3]A
Power Dissipation PD - - 47 W
Junction Temperature Tj - - 145 ordmC
Operating Temperature Topr - 40 - 125 ordmC
Storage Temperature Tstg - 40 - 125 ordmC
Viewing angle θ 140 degree
Forward voltage (350mA 85) VF 284 V
Forward voltage (700mA 85) VF 300 V
Thermal resistance (J to S) [2] RθJ-S -6 [3]
75 [4]- KW
ESD Sensitivity(HBM) Class 2 JESD22-A114-E
Table 3 Absolute Maximum Ratings
Notes
(1) At Junction Temperature 85 condition
(2) RθJ-S is tested at 700mA
(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)
(4) Using Metal PCB (Normal type)
bull Thermal resistance can be increased substantially depending on the heat sink designoperating
condition and the maximum possible driving current will decrease accordingly
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
7
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 1 Color Spectrum
Fig 2 Typical Spatial Distribution
350 400 450 500 550 600 650 700 750 800
0
20
40
60
80
100
Re
lati
ve
Ra
dia
nt
Po
we
r [
]
Wavelength [nm]
Cool white
Neutral white
Warm white
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
0
10
20
30
40
50
60
70
80
90
100
110
Re
lati
ve
Lu
min
ou
s In
ten
sit
y [
]
Angular Displacement [degrees]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
8
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 3 Forward Voltage vs Forward Current Tj=85
Fig 4 Forward Current vs Relative Luminous Flux Tj=85
24 26 28 30 32 34 3600
02
04
06
08
10
12
14
Fo
rwa
rd C
urr
en
t [A
]
Forward Voltage [V]
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
0
20
40
60
80
100
120
140
160
Re
lati
ve
Lu
min
ou
s F
lux
[
]
Forward Current [mA]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
9
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
25 50 75 100 125
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
Junction Temperature [oC]
CIE X
CIE Y
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
0010
Forward Current [mA]
CIE X
CIE Y
Fig 5 Forward Current vs CIE X Y Shift Tj=85
Fig 6 Junction Temp vs CIE X Y Shift IF=700mA
145
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
10
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
11
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
5
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Part Number
CCT [K] [1] Min Luminous Flux [2]
ФV [3] [lm]
Min Luminous Flux [2] ФV
[3] [lm] 85 degC
CRI [4]
Ra
Min Max Group
Flux
[lm]
85 degC
Flux
[lm]
25 degC700mA 10A Min
SZ8-Y15-W0-C9 4700 7000
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WN-C9 3700 4700
V3 125 137 223 294
90V2 116 128 208 274
V1 109 120 195 257
U3 102 112 182 240
SZ8-Y15-WW-C9 2600 3700
V1 109 120 195 257
90U3 102 112 182 240
U2 96 106 172 227
U1 89 98 160 211
Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram
Color coordinate 0005 CCT 5 tolerance
(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements
(3) ФV is the total luminous flux output as measured with an integrating sphere
(4) Tolerance is 20 on CRI measurements
Notes
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
6
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Parameter SymbolValue
UnitMin Typ Max
Forward Current [1] IF - -10 [4]
12 [3]A
Power Dissipation PD - - 47 W
Junction Temperature Tj - - 145 ordmC
Operating Temperature Topr - 40 - 125 ordmC
Storage Temperature Tstg - 40 - 125 ordmC
Viewing angle θ 140 degree
Forward voltage (350mA 85) VF 284 V
Forward voltage (700mA 85) VF 300 V
Thermal resistance (J to S) [2] RθJ-S -6 [3]
75 [4]- KW
ESD Sensitivity(HBM) Class 2 JESD22-A114-E
Table 3 Absolute Maximum Ratings
Notes
(1) At Junction Temperature 85 condition
(2) RθJ-S is tested at 700mA
(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)
(4) Using Metal PCB (Normal type)
bull Thermal resistance can be increased substantially depending on the heat sink designoperating
condition and the maximum possible driving current will decrease accordingly
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
7
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 1 Color Spectrum
Fig 2 Typical Spatial Distribution
350 400 450 500 550 600 650 700 750 800
0
20
40
60
80
100
Re
lati
ve
Ra
dia
nt
Po
we
r [
]
Wavelength [nm]
Cool white
Neutral white
Warm white
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
0
10
20
30
40
50
60
70
80
90
100
110
Re
lati
ve
Lu
min
ou
s In
ten
sit
y [
]
Angular Displacement [degrees]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
8
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 3 Forward Voltage vs Forward Current Tj=85
Fig 4 Forward Current vs Relative Luminous Flux Tj=85
24 26 28 30 32 34 3600
02
04
06
08
10
12
14
Fo
rwa
rd C
urr
en
t [A
]
Forward Voltage [V]
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
0
20
40
60
80
100
120
140
160
Re
lati
ve
Lu
min
ou
s F
lux
[
]
Forward Current [mA]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
9
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
25 50 75 100 125
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
Junction Temperature [oC]
CIE X
CIE Y
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
0010
Forward Current [mA]
CIE X
CIE Y
Fig 5 Forward Current vs CIE X Y Shift Tj=85
Fig 6 Junction Temp vs CIE X Y Shift IF=700mA
145
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
10
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
11
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
6
Product Data Sheet
Rev42 Apr 13 2017
Performance Characteristics
Parameter SymbolValue
UnitMin Typ Max
Forward Current [1] IF - -10 [4]
12 [3]A
Power Dissipation PD - - 47 W
Junction Temperature Tj - - 145 ordmC
Operating Temperature Topr - 40 - 125 ordmC
Storage Temperature Tstg - 40 - 125 ordmC
Viewing angle θ 140 degree
Forward voltage (350mA 85) VF 284 V
Forward voltage (700mA 85) VF 300 V
Thermal resistance (J to S) [2] RθJ-S -6 [3]
75 [4]- KW
ESD Sensitivity(HBM) Class 2 JESD22-A114-E
Table 3 Absolute Maximum Ratings
Notes
(1) At Junction Temperature 85 condition
(2) RθJ-S is tested at 700mA
(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)
(4) Using Metal PCB (Normal type)
bull Thermal resistance can be increased substantially depending on the heat sink designoperating
condition and the maximum possible driving current will decrease accordingly
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
7
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 1 Color Spectrum
Fig 2 Typical Spatial Distribution
350 400 450 500 550 600 650 700 750 800
0
20
40
60
80
100
Re
lati
ve
Ra
dia
nt
Po
we
r [
]
Wavelength [nm]
Cool white
Neutral white
Warm white
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
0
10
20
30
40
50
60
70
80
90
100
110
Re
lati
ve
Lu
min
ou
s In
ten
sit
y [
]
Angular Displacement [degrees]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
8
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 3 Forward Voltage vs Forward Current Tj=85
Fig 4 Forward Current vs Relative Luminous Flux Tj=85
24 26 28 30 32 34 3600
02
04
06
08
10
12
14
Fo
rwa
rd C
urr
en
t [A
]
Forward Voltage [V]
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
0
20
40
60
80
100
120
140
160
Re
lati
ve
Lu
min
ou
s F
lux
[
]
Forward Current [mA]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
9
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
25 50 75 100 125
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
Junction Temperature [oC]
CIE X
CIE Y
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
0010
Forward Current [mA]
CIE X
CIE Y
Fig 5 Forward Current vs CIE X Y Shift Tj=85
Fig 6 Junction Temp vs CIE X Y Shift IF=700mA
145
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
10
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
11
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
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SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
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SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
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SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
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SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
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SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
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SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
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SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
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SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
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SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
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SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
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SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
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SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
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SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
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SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
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SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
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SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
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SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
7
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 1 Color Spectrum
Fig 2 Typical Spatial Distribution
350 400 450 500 550 600 650 700 750 800
0
20
40
60
80
100
Re
lati
ve
Ra
dia
nt
Po
we
r [
]
Wavelength [nm]
Cool white
Neutral white
Warm white
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
0
10
20
30
40
50
60
70
80
90
100
110
Re
lati
ve
Lu
min
ou
s In
ten
sit
y [
]
Angular Displacement [degrees]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
8
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 3 Forward Voltage vs Forward Current Tj=85
Fig 4 Forward Current vs Relative Luminous Flux Tj=85
24 26 28 30 32 34 3600
02
04
06
08
10
12
14
Fo
rwa
rd C
urr
en
t [A
]
Forward Voltage [V]
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
0
20
40
60
80
100
120
140
160
Re
lati
ve
Lu
min
ou
s F
lux
[
]
Forward Current [mA]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
9
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
25 50 75 100 125
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
Junction Temperature [oC]
CIE X
CIE Y
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
0010
Forward Current [mA]
CIE X
CIE Y
Fig 5 Forward Current vs CIE X Y Shift Tj=85
Fig 6 Junction Temp vs CIE X Y Shift IF=700mA
145
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
10
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
11
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
8
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 3 Forward Voltage vs Forward Current Tj=85
Fig 4 Forward Current vs Relative Luminous Flux Tj=85
24 26 28 30 32 34 3600
02
04
06
08
10
12
14
Fo
rwa
rd C
urr
en
t [A
]
Forward Voltage [V]
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
0
20
40
60
80
100
120
140
160
Re
lati
ve
Lu
min
ou
s F
lux
[
]
Forward Current [mA]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
9
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
25 50 75 100 125
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
Junction Temperature [oC]
CIE X
CIE Y
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
0010
Forward Current [mA]
CIE X
CIE Y
Fig 5 Forward Current vs CIE X Y Shift Tj=85
Fig 6 Junction Temp vs CIE X Y Shift IF=700mA
145
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
10
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
11
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
9
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
25 50 75 100 125
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
Junction Temperature [oC]
CIE X
CIE Y
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
-0008
-0006
-0004
-0002
0000
0002
0004
0006
0008
0010
Forward Current [mA]
CIE X
CIE Y
Fig 5 Forward Current vs CIE X Y Shift Tj=85
Fig 6 Junction Temp vs CIE X Y Shift IF=700mA
145
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
10
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
11
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
10
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
Fig 7 Relative Light Output vs Junction Temperature IF=700mA
Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA
145
145
25 50 75 100 125
0
20
40
60
80
100
120
Re
lati
ve
lu
min
ou
s f
lux
[
]
Junction Temperature [oC]
25 50 75 100 125
-015
-010
-005
000
005
010
015
020
025
030
V
F
Junction Temperature [oC]
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
11
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
11
Product Data Sheet
Rev42 Apr 13 2017
Characteristics Graph
0 20 40 60 80 100 1200
200
400
600
800
1000
1200
1400
Ma
xim
um
Cu
rre
nt [m
A]
Ambient Temperature [oC]
Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=12A
Rth(j-a)=15W
Rth(j-a)=20W
Rth(j-a)=25W
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
12
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C7
V3 223 237
Refer to page
15
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WN-C7
V3 223 237
Refer to page
16~17
G 275 300W1 237 254
W2 254 271H 300 325
W3 271 288
SZ8-Y15-WW-C7
V2 208 223
Refer to page
18~20
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
13
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C8
V2 208 223
Refer to page
15
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WN-C8
V2 208 223
Refer to page
16~17
G 275 300V3 223 237
W1 237 254H 300 325
W2 254 271
SZ8-Y15-WW-C8
U3 182 195
Refer to page
18~20
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U3 V1 V2 V3 W1 W2 W3
5300 ndash 6000K B U3 V1 V2 V3 W1 W2 W3
4700 ~ 5300K C U3 V1 V2 V3 W1 W2 W3
4200 ~ 4700K D U3 V1 V2 V3 W1 W2 W3
3700 ~ 4200K E U3 V1 V2 V3 W1 W2 W3
3200 ~ 3700K F U3 V1 V2 V3 W1 W2 W3
2900 ~ 3200K G U3 V1 V2 V3 W1 W2 W3
2600 ~ 2900K H U3 V1 V2 V3 W1 W2 W3
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
14
Product Data Sheet
Rev42 Apr 13 2017
Performance CharacteristicsTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)
Table 5 Luminous Flux rank distribution
Part Number Luminous Flux [lm] Color
Chromaticity
Coordinate
Typical Forward Voltage [VF] [1]
Bin Code Min Max Bin Code Min Max
SZ8-Y15-W0-C9
U3 182 195
Refer to page
15
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WN-C9
U3 182 195
Refer to page
16~17
G 275 300V1 195 208
V2 208 223H 300 325
V3 223 237
SZ8-Y15-WW-C9
U1 160 172
Refer to page
18~20
G 275 300U2 172 182
U3 182 195H 300 325
V1 195 208
(1) Tolerance is 006V on forward voltage measurements
(2) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability single color rank will not be orderable
Notes
CCT CIE Luminous Flux Rank
6000 ~ 7000K A U1 U2 U3 V1 V2 V3 W1
5300 ndash 6000K B U1 U2 U3 V1 V2 V3 W1
4700 ~ 5300K C U1 U2 U3 V1 V2 V3 W1
4200 ~ 4700K D U1 U2 U3 V1 V2 V3 W1
3700 ~ 4200K E U1 U2 U3 V1 V2 V3 W1
3200 ~ 3700K F U1 U2 U3 V1 V2 V3 W1
2900 ~ 3200K G U1 U2 U3 V1 V2 V3 W1
2600 ~ 2900K H U1 U2 U3 V1 V2 V3 W1
Available Rank
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
15
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA
030 032 034 036
030
032
034
036
038 4700K
5000K
5300K
5600K
6000K
6500KB0
C1
C3
C5
C0
C2
C4
B1
B3
B57000K
B4
B2A1
A3
A5
A0
A4
A2
CIE
(y
)
CIE (x)
A0 A1 A2 A3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03028 03304 03115 03393 03041 03240 03126 03324
03041 03240 03126 03324 03055 03177 03136 03256
03126 03324 03210 03408 03136 03256 03216 03334
03115 03393 03205 03481 03126 03324 03210 03408
A4 A5 B0 B1
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03055 03177 03136 03256 03207 03462 03292 03539
03068 03113 03146 03187 03212 03389 03293 03461
03146 03187 03221 03261 03293 03461 03373 03534
03136 03256 03216 03334 03292 03539 03376 03616
B2 B3 B4 B5
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03212 03389 03293 03461 03217 03316 03293 03384
03217 03316 03293 03384 03222 03243 03294 03306
03293 03384 03369 03451 03294 03306 03366 03369
03293 03461 03373 03534 03293 03384 03369 03451
C0 C1 C2 C3
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03376 03616 03463 03687 03373 03534 03456 03601
03373 03534 03456 03601 03369 03451 03448 03514
03456 03601 03539 03669 03448 03514 03526 03578
03463 03687 03552 03760 03456 03601 03539 03669
C4 C5
CIE x CIE y CIE x CIE y
03369 03451 03448 03514
03366 03369 03440 03428
03440 03428 03514 03487
03448 03514 03526 03578
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
16
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
0350 0355 0360 0365 0370 0375034
035
036
037
038
039
D44
D43
4200K
4500K
4700K
D41
D31
D21
D11
CIE
Y
CIE X
D32
D42
D22
D12 D33
D23D13 D34
D24
D14
D11 D21 D31 D41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03548 03736 03595 03770 03641 03804 03689 03839
03539 03668 03584 03701 03628 03733 03674 03767
03584 03701 03628 03733 03674 03767 03720 03800
03595 03770 03641 03804 03689 03839 03736 03874
D12 D22 D32 D42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03539 03668 03584 03701 03628 03733 03674 03767
03530 03601 03573 03632 03616 03663 03659 03694
03573 03632 03616 03663 03659 03694 03703 03726
03584 03701 03628 03733 03674 03767 03720 03800
D13 D23 D33 D43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03530 03601 03573 03632 03616 03663 03659 03694
03520 03533 03562 03562 03603 03592 03645 03622
03562 03562 03603 03592 03645 03622 03687 03652
03573 03632 03616 03663 03659 03694 03703 03726
D14 D24 D34 D44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03520 03533 03562 03562 03603 03592 03645 03622
03511 03465 03551 03493 03590 03521 03630 03550
03551 03493 03590 03521 03630 03550 03670 03578
03562 03562 03603 03592 03645 03622 03687 03652
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
17
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA
036 037 038 039 040035
036
037
038
039
040
041
E44
E43
3700K
4000K
4200K
E41
E31
E21
E11
CIE
Y
CIE X
E32
E42
E22
E12 E33
E23E13 E34
E24
E14
E11 E21 E31 E41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03736 03874 03804 03917 03871 03959 03939 04002
03720 03800 03784 03841 03849 03881 03914 03922
03784 03841 03849 03881 03914 03922 03979 03962
03804 03917 03871 03959 03939 04002 04006 04044
E12 E22 E32 E42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03720 03800 03784 03841 03849 03881 03914 03922
03703 03726 03765 03765 03828 03803 03890 03842
03765 03765 03828 03803 03890 03842 03952 03880
03784 03841 03849 03881 03914 03922 03979 03962
E13 E23 E33 E43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03703 03726 03765 03765 03828 03803 03890 03842
03687 03652 03746 03689 03806 03725 03865 03762
03746 03689 03806 03725 03865 03762 03925 03798
03765 03765 03828 03803 03890 03842 03952 03880
E14 E24 E34 E44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03687 03652 03746 03689 03806 03725 03865 03762
03670 03578 03727 03613 03784 03647 03841 03682
03727 03613 03784 03647 03841 03682 03898 03716
03746 03689 03806 03725 03865 03762 03925 03798
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
18
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
039 040 041 042 043
037
038
039
040
041
042
F44
F43
3200K
3500K
3700K
F41
F31
F21
F11
CIE
Y
CIE X
F32
F42
F22
F12 F33
F23F13
F34
F24F14
F11 F21 F31 F41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03996 04015 04071 04052 04146 04089 04223 04127
03969 03934 04042 03969 04114 04005 04187 04041
04042 03969 04114 04005 04187 04041 04261 04077
04071 04052 04146 04089 04223 04127 04299 04165
F12 F22 F32 F42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03969 03934 04042 03969 04114 04005 04187 04041
03943 03853 04012 03886 04082 03920 04152 03955
04012 03886 04082 03920 04152 03955 04223 03990
04042 03969 04114 04005 04187 04041 04261 04077
F13 F23 F33 F43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03943 03853 04012 03886 04082 03920 04152 03955
03916 03771 03983 03803 04049 03836 04117 03869
03983 03803 04049 03836 04117 03869 04185 03902
04012 03886 04082 03920 04152 03955 04223 03990
F14 F24 F34 F44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
03916 03771 03983 03803 04049 03836 04117 03869
03889 03690 03953 03721 04017 03751 04082 03783
03953 03721 04017 03751 04082 03783 04147 03814
03983 03803 04049 03836 04117 03869 04185 03902
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
19
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
041 042 043 044 045 046
038
039
040
041
042
043
G44
G43
2900K
3000K
3200K G41G31
G21G11
CIE
Y
CIE X
G32G42
G22
G12
G33G23
G13
G34G24
G14
G11 G21 G31 G41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04299 04165 04364 04188 04430 04212 04496 04236
04261 04077 04324 04099 04387 04122 04451 04145
04324 04100 04387 04122 04451 04145 04514 04168
04365 04189 04430 04212 04496 04236 04562 04260
G12 G22 G32 G42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04261 04077 04324 04100 04387 04122 04451 04145
04223 03990 04284 04011 04345 04033 04406 04055
04284 04011 04345 04033 04406 04055 04468 04077
04324 04100 04387 04122 04451 04145 04515 04168
G13 G23 G33 G43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04223 03990 04284 04011 04345 04033 04406 04055
04185 03902 04243 03922 04302 03943 04361 03964
04243 03922 04302 03943 04361 03964 04420 03985
04284 04011 04345 04033 04406 04055 04468 04077
G14 G24 G34 G44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04243 03922 04302 03943 04302 03943 04361 03964
04203 03834 04259 03853 04259 03853 04316 03873
04147 03814 04203 03834 04316 03873 04373 03893
04185 03902 04243 03922 04361 03964 04420 03985
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
20
Product Data Sheet
Rev42 Apr 13 2017
Color Bin Structure
CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA
043 044 045 046 047 048038
039
040
041
042
043
044
H44
H43
2600K2700K
2900K
H41H31H21H11
CIE
Y
CIE X
H32H42
H22H12
H33H23H13
H34H24H14
H11 H21 H31 H41
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04562 04260 04625 04275 04687 04289 04750 04304
04515 04168 04575 04182 04636 04197 04697 04211
04575 04182 04636 04197 04697 04211 04758 04225
04625 04275 04687 04289 04750 04304 04810 04319
H12 H22 H32 H42
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04515 04168 04575 04182 04636 04197 04697 04211
04468 04077 04526 04090 04585 04104 04644 04118
04526 04090 04585 04104 04644 04118 04703 04132
04575 04182 04636 04197 04697 04211 04758 04225
H13 H23 H33 H43
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04468 04077 04526 04090 04585 04104 04644 04118
04420 03985 04477 03998 04534 04012 04591 04025
04477 03998 04534 04012 04591 04025 04648 04038
04526 04090 04585 04104 04644 04118 04703 04132
H14 H24 H34 H44
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
04420 03985 04477 03998 04534 04012 04591 04025
04373 03893 04428 03906 04483 03919 04538 03932
04428 03906 04483 03919 04538 03932 04593 03944
04477 03998 04534 04012 04591 04025 04648 04038
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
21
Product Data Sheet
Rev42 Apr 13 2017
Mechanical Dimensions
(1) All dimensions are in millimeters
(2) Scale none
(3) Undefined tolerance is plusmn02mm
Cathode Anode
Cathode
Cathode
lt Top gt
lt Side gt
lt Bottom gt
lt Recommended Solder Pattern gt
lt Inner circuit gt
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
22
Product Data Sheet
Rev42 Apr 13 2017
Material Structure
No List Material
① Encapsulation Silicone Phosphor
② Chip Source GaN ON SAPPHIRE
③ Solder-PAD Metal (Au)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
23
Product Data Sheet
Rev42 Apr 13 2017
Reflow Soldering Characteristics
IPCJEDEC J-STD-020
Profile Feature Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3deg Csecond max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 degC180 degC80-120 seconds
Time maintained above
- Temperature (TL)
- Time (tL)217~220degC80-100 seconds
Peak Temperature (Tp) 250~255
Time within 5degC of actual Peak
Temperature (tp)220-40 seconds
Ramp-down Rate 6 degCsecond max
Time 25degC to Peak Temperature 8 minutes max
Atmosphere Nitrogen (O2lt1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times When 24 hours passed after
first soldering following reflow soldering will make LEDs damaged
(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is unavoidable
LED`s characteristics should be carefully checked on before and after such repair
(3) Do not put stress on the LEDs during heating
(4) After reflow do not clean PCB with either water or solvent
SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV
(3) We recommend TOV Test 18v~28v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
24
Product Data Sheet
Rev42 Apr 13 2017
Emitter Tape amp Reel Packaging
(1) Quantity 1500pcsReel
(empty slot possible in taping reel)
(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm
(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover
tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape
(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp
proof Package
Notes
( Tolerance plusmn02 Unit mm )
180
13
60
2
22
114plusmn10
9plusmn03
Size
A0 155plusmn005
B0 150plusmn005
K0 070plusmn005
B
Brsquo
A Arsquo
K0
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
25
Product Data Sheet
Rev42 Apr 13 2017
Packaging Information
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
26
Product Data Sheet
Rev42 Apr 13 2017
Handling of Silicone Resin for LEDs
(1) During processing mechanical stress on the surface should be minimized as much as possible
Sharp objects of all types should not be used to pierce the sealing compound
(2) Do not use tweezers to pick up or handle WICOP2 LEDs
A vacuum pick up should only be used
(3) When populating boards in SMT production there are basically no restrictions regarding the form
of the pick and place nozzle except that mechanical pressure on the surface of the resin must be
prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos
area
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These
conditions must be considered during the handling of such devices Compared to standard
encapsulants silicone is generally softer and the surface is more likely to attract dust As
mentioned previously the increased sensitivity to dust requires special care during processing
(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this
product with acid or sulfur material in sealed space
(6) Avoid leaving fingerprints on silicone resin parts
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
27
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(1) Storage
To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The
recommended storage temperature range is 5 to 30 and a maximum humidity of RH50
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency
Pay attention to the following
a Recommend conditions after opening the package
- Sealing Temperature 5 ~ 30 Humidity less than RH60
b If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes components should be dried for 10-24hr at 65plusmn5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering
(4) Do not rapidly cool device after soldering
(5) Components should not be mounted on warped (non coplanar) portion of PCB
(6) Radioactive exposure is not considered for the products listed here in
(7) Gallium arsenide is used in some of the products listed in this publication These products are
dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of
(8) This device should not be used in any type of fluid such as water oil organic solvent and etc
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature
(10) The appearance and specifications of the product may be modified for improvement without
notice
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
28
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T
he result can be a significant loss of light output from the fixture Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues
(13) The slug is electrically isolated
(14) Attaching LEDs do not use adhesives that outgas organic vapor
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev
erse voltage is applied to LED migration can be generated resulting in LED damage
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects
a ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact While most ESD events are considered harmless it can be an expensive problem in
many industrial environments during production and storage The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event
One or more recommended work area suggestions
- Ionizing fan setup
- ESD tableshelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls
- Humidity control (ESD gets worse in a dry environment)
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
29
Product Data Sheet
Rev42 Apr 13 2017
Precaution for Use
b EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device
The effects from an EOS event can be noticed through product performance like
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary but there are some
common signs that will indicate an EOS event has occurred
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice
wwwseoulsemiconcom
SZ8-Y15-XX-XX - High-power LED
30
Product Data Sheet
Rev42 Apr 13 2017
Company Information
Published by
Seoul Semiconductor copy 2013 All Rights Reserved
Company Information
Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage
and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than
10000 patents globally while offering a wide range of LED technology and production capacity in
areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -
Multi-Junction Technology a proprietary family of high-voltage LEDs
The companyrsquos broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type
LEDs as well as custom modules displays and sensors
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products With
respect to any examples or hints given herein any typical values stated herein andor any information
regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind including without limitation warranties of non-infringement of intellectual
property rights of any third party The appearance and specifications of the product can be changed
to improve the quality andor performance without notice