rhp-technology - indico€¦ · workplan /timeline outlook/future applications of metal diamond...

SOLUTION PROVIDER IN POWDER TECHNOLOGY AND HOT PRESSING page 1 WERKSTOFFE. PERFEKT. KOMPONIERT. page 1

ERICHNEUBAUER

RHP-Technology

Inves&ga&onofnewmethodsforthemanufacturingofCopper-DiamondCompositeswithtailoredthermo-physicalproper&es


Background: RHP & Metal Diamond Composites

Motivation for using Blown Powder Processes

Objectives & Challenges

Workplan /Timeline

Outlook/Future applications of metal diamond composites mady by blown

powder processes

Contents


ABOUT RHP

RHP-Technology is located @ CAMPUS Seibersdorf

  Activities started in 1996   RHP-Technology founded 2010   Privately owned   40 employees (~15 researchers)

RHP-Technology


Company History

1996201020132016

think-addi)ve.comBlownpowder,wirefeed&STL

HOTPRESSING(1996)

SPS/FAST(2009)

RSP(2012)

XXL3DPRINTING(2014/15)

POWDERINJECTIONMOLDING(2013)

FilamentPrinPng(2017)

Spin-Off(2018)

FeedstockPrinPng(2018)


AGENDA

PROCESSING TECHNOLOGIES

RAPID SINTER PRESSING

NEW MATERIALS

POWDER INJECTION MOULDING

RAPID SINTER PRESSING ADDITIVE MANUFACTURING

HOT PRESSING

SPS/FAST SINTERING

SINTERING / SINTER HIP


PRODUCTS

PIM PARTS & DEVELOPMENT

AEROSPACE & SPACE PARTS

PERFORMANCE COOLING INNOVATIVE CERAMICS

TIGER METAL PRODUCTS SPUTTERTARGETS


MAIN ACTIVITIES

Advanced Materials Multi-Materials, Composites Space and Aerospace Thermal management

Sputtering Targets Development and Manufacturing customized composition

 New Processes Powder Technology, Rapid Hot Pressing, Powder Injection Moulding (Ceramics/Metals) Multi-Material-Manufacturing (3M) Additive Manufacturing


METAL-DIAMONDCOMPOSITES


Metal-Diamond Composites with tailored properties

Silver-Diamond Composites Ag-Diamond

Al/Cu-Diamond

Stateoftheartmaterials

Cu-/Al - Diamond Composites

ElectronicPackaging

HighPowerModule(SSPA)


Metal-Diamond Composites with tailored properties

RHP was involved in the previous EUCARD I/II project led by CERN as well in the ongoing ARIES project Activities are linked to the development of different grades of copper- diamond which have been tested for the application as a collimator. For the collimator material the properties which are needed are a basically a high thermal conductivity, a low coefficient of thermal expansion and excellent electrical conductivity. Additional issue is the shaping/machining of the components to meet the requirements


Manufacturing Process

DC (dHP)

Graphite Punch

Powder

Graphite Electrode

Graphite tool

Hydraulic pressure

Vacu

um c

ham

ber

diamonds nm-coaPng/interfacedesign

mixing

Metalpowder(Al/Ag/Cu)

hotpressing


Copper-diamond composites: impact of diamond size

0

100

200

300

400

500

600

FACTOR 10 in size

Ther

mal

Cond

uctiv

ity [W

/mK]

Diamond diameter [µm]

Cu-50 vol.% diamondTradeoff:§  HighestthermalproperPescanbe

obtainedwithlargediamonds=>butpoorsurfacequality

§  HighestsurfacequalitybutlowerthermalproperPesareobtainedwithsmalldiamondsize

§  Sandwichorgradientstructuresallowabebersurfacefinish

=>Claddinglayerisrequired


PROOFOFCONCEPT


Manufacturing method which does not require tooling Large sizes possible (actually limit of hot pressing at RHP is a length of 300 mm) Possibility to build/shape 3D structures Direct deposition on „substrates“ /carriers possible High building rate (several kg/hour) Possibility for Gradient and multilayers

New concept for manufacturing: Blown powder methods

Die Kerne wurden fertig gefräst und vermessen.

5

DIE KERNE


Additive Manufacturing using Plasma Metal Deposition

4MSystem

•  MulP-MaterialBuild-up•  Buildingpladormtoday1.5x1.8m•  Shieldinggas&closedprotecPonwith

argongaspossible


Objective Nr 1: Demonstration of copper-diamond composite manufacturing with a content of up to 50 volume percent of diamonds with a particle size of > 100 micron by using blown powder methods Blown powder methods allows manufacturing of large structures including 3D shapes (near net shape)

Goal is to manufacture parts with size of 200mm x 40 mm x 25 mm for demonstration

Objective


Objective Nr 2: Demonstration of high thermal Conductive/Low Coefficient of Thermal Expansion in composites made from a blown powder process. Proper Design of the interface/ improving the wetting

Goal is to demonstrate the suitability of the process to obtain a thermal conductivity of > 400 W/mK and a coefficient of thermal expansion of < 8 ppm/K in a copper-composite, at least on a test coupon level.

Objectives


WORKPLAN


Task 1.1 Feedstock selection and Feedstock preparation (RHP) 3 different types of feedstock concepts are used 2 different diamond size/3 different volume content Especially the used of completely encapsulated diamond particles

Task 1.2 Screening of Plasma Transferred Arc Technology (RHP)

Parameter variation during the deposition process Investigation of single & multiseams

Task 1.3 Screening of Cold gas Spraying Testing of different feedstocks Additional thermal treatment required

WP 1: Screening of Blown Powder Technologies (Month 1 – Month 8)


MS 1.1 (M3): Feedstocks prepared MS 1.2 (M8): Selection of most promising method/feedstock

D1.1 (M8): Summary/Report on experimental results achieved by blown powder methods

Possible risks/minimization of risks: 3 different types of feedstock concepts are used Different volume contents of diamonds are used. Investigation of two different blown powder methods

one of them is based on a liquid phase processing (PTA) one is linked to a solid state processing (cold gas spraying)

Milestones/Deliverables & Risk


Task 2.1: Preparation of test structure from selected process

Preparation of a test structure (e.g. with size of approx. 200 mm x 40 mm x 25 mm) made from the most promising method selected from WP 1

MS 2.1 (M10): Test structure finalized D 2.1 (M10): Report on Test part manufacturing

Possible risk and minimisation of risks:

Density issues on the test part or irregular surface might appear when the metal diamond composite is deposited => „hot shaping“ Warpage might be an issue => symmetric building of structures

WP 2: Preparation of a test structure from selected process (M9 - M10)


Task 3.1 Feedstock characterisation Analysis of the feedstocks /flowability/distribution etc

Task 3.2 Test coupon characterisation

Preparation of test coupons /cutting/machining and testing of thermophysical properties (partner: GSI)

Task 3.3 Material Investigation and characterisation Microstructure analysis/fracture analysis to identify porosities, inhomogenities

Task 3.4: Lessons learned Exploitation/follow up activities

WP 3: Characterisation, Analysis and Assessment (M2 – M12)

κ [m×/s]

5 10 15 20 25 30 35 40

5

10

15

20

25

30

0.95

1

1.05

1.1

1.15

1.2

1.25

1.3x 10-4


MS 3.1 (M8) Results from Test coupons available

MS 3.2 (M12): Results from characterisation of demonstrator

D3.1 (M12): Summary of characterisation and lessons learned

Possible risk and minimisation of risks: Extraction of samples might be an issue; Two different type of processes will be applied (wire cutting and water jet)

WP 3: Characterisation, Analysis and Assessment (M2 – M12)


Task 4.1 Project Management Take care on administrative issues Meeting with project partners Technical and Financial Reporting

MS 4.1 (M1): Kick-off MS 4.2 (M6): Progress Meeting /Telco MS 4.3 (M12): Final Meeting

D4.1 (M6): Progress Report D4.2 (M12): Final Report

WP 4: Management


Components used at CERN: Collimators/Cooling Plates used at CERN (e.g.LHC)

Electronic Packaging Power electronics, Semiconductor industry Cooling systems for high power lasers and laser diodes (e.g. Trumpf, Jenoptik,...)

Industrial applications High thermal conductive materials applied in heavy machinery for removing of heat in high temperature extrusion processes (application of ASMAG) Cooling Plates/Backing plates for thin film deposition (new concept) Grinding wheels/general wear resistant applications (diamond loading between 10-30 vol%)

OUTLOOK: Applications of Metal Diamond Composites


THANKYOUFORYOURATTENTION

Forschungs-u.TechnologiezentrumGebäudeCA2444Seibersdorf,AUSTRIA

ErichNeubauer

rhp-technology - indico€¦ · workplan /timeline outlook/future applications of metal diamond...

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