Email: henrytc@gmail.com Tel: (310) 962-0799 Address: 2203 Glendon Ave, Los Angeles, CA90064

. Objective: full-time opportunities related to semiconductor or electronic packaging industry . Education: . University of California, Los Angeles (UCLA) September 2011 - March 2016 Ph.D. in Material Science and Engineering, GPA: 3.95/4.00 � Thesis: Chemical Effects on Diffusion in Intermetallic Compounds for Electronic Packaging (Advisor: Dr. King-Ning Tu) � Specialized in 3DIC packaging materials, diffusion analysis and advanced data inferences � Awarded GSSA Scholarship from Taiwanese government (11 people per year in engineering field for entire country) National Taiwan University, Taipei, Taiwan (NTU) September 2006 - June 2010 B.S. in Chemical Engineering, GPA: 3.91/4.00; Rank: top 3% � Awarded Presidential Award (honor roll), TASCO Chemical Corporation Fellowship (1person per year in department) . Skills: . Instrumental skills: SEM, EDX, XRD, XPS, NMR, FTIR, GCMS Computer skills: C++, PYTHON, R, MATLAB, HTML, CSS, PHP. . Experience: . Intel Corporation July - December 2013 Packaging Technology Development Engineer Intern � Developed Sb-free LSC solder materials and low temperature FLI solder materials for future products � Interacted with suppliers and internal assembly teams to eliminate the potential manufacturing issue � Researched on the relationship between tin grain orientation and electromigration in various processes Taiwan Semiconductor Manufacturing Company (TSMC) Summer 2012 R&D Engineer Intern in advanced packaging research group � Researched on the promising polymer materials used in 3DICs and wafer-level-packaging � Cooperated with manufacturers to develop high thermal conductive underfills for 3DICs packaging Second Lieutenant, the Army of Republic of China August 2010 – July 2011 � Developed strong leadership by leading over 100 people transferring from island to island as a commander Zhen Ding Technology (Top 2 in the global PCB industry, one of the largest vendors of Apple Inc.) Summer 2010 Manufacturing and R&D Engineering Intern � Learned to optimized the efficiency and the cost of PCB manufacturing process � Researched on the carbon coated inks on PCB to increase the reliability of keyboard contacts . Engineering Projects: . Qualcomm Inc. and University of California, Los Angeles January 2012 - June 2013 Metallurgical Study in 3D IC Microbumps Technology � Controlled the formation of microbumps to have uniform microstructure � Studied the trade off in various solder alloys and UBM systems on thermal budget and reliability issues Strengthening mechanical properties of microbump via composite materials � Used SiC nanowire to strengthen the IMCs inside micro-bumps in 3D IC packaging National Taiwan University July 2009 – June 2010 Synthesis and Characterization of Composite Electrodes � Synthesized and coated polypyrrole onto LiFeO4 as a positive electrode � Increased 30% of Li-ion battery’s stability in 100 cycles at high temperature National Taiwan University and Saudi Arabia Government July 2008 - June 2009 Capacity Deionization Technology � Developed a system to desalinate brine into pure water by using multilayer titanium plates as electrodes along with conductive carbon fibers to absorb the ions in the brine

Yi-Ting (Henry) Chen