requirements of industry for the education of printed circuit board designers

REQUIREMENTS OF INDUSTRY FOR THE EDUCATION OF PRINTED CIRCUIT BOARD

DESIGNERS

(ANFORDERUNGEN DER INDUSTRIE AN DIE AUSBILDUNG VON LEITERPLATTEN

DESIGNER

Paul Svasta and Norocel Codreanu“Politehnica University of Bucharest

Faculty of Electronics, Telecommunications and Information Technology Center for Technological Electronics and Interconnection Techniques

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

1. Introduction2. Multi-disciplinary approach in education3. Knowledge evaluation4. TIE Triple Helix Model5. Conclusions

“TIE”, THE “INTERCONNECTION TECHNIQUES IN ELECTRONICS” PROFESSIONAL STUDENT CONTEST



A=>„….Universitäten und Hochschulen müssen für steten und guten ausgebildeten Nachwuchs sorgen, wobei neben den Grundlagen für einen Layouter viele weitere Kenntnisse praxisnah vermittelt werden müssen.“………………………………………………………………..

B=>„…Einem wesentlichen Beitrag für den Erfolg (oder auch Misserfolg) von elektronischen Produkten leisten die Layouter. Es ist ihre Aufgabe, die Vorgaben der Schaltungsentwickler in ein Produkt umsetzen, welches nicht nur funktioniert, sondern auch zuverlässig, kostengünstig und mit höchsten Ausbeuten zu fertigen ist.“

__________________Produktion von Leiterplatten und Systemen, August 2012 Seite 1750, Band 14Dr.-Ing. Habil. Heinz Wohlrabe, Zentrum mikrotechnischer Produktion der TU Dresden

“The human resource needs of the 21st century will be dramatically different from the past and fall into two categories:

(1) the educational background and skills of these new engineers (quality); and

(2) the number of skilled engineers (quantity).

Undergraduate Microsystems Packaging Education: Needs, Status and Challenges, Rao Tummala and Leyla Conrad, Packaging Research Center, Georgia Institute of Technology, Proceedings of Electronic Components & Technology Conference (ECTC), Orlando, Florida, 2001, pag 1276-1282

Skills Quality Need(a)Deep fundamental, system-

level and manufacturing knowledge;

(b) Global knowledge of the marketplace such as markets, business, economics, foreign language and culture.

The gap in skills between what industry would like in tomorrow's engineering

workforce vs. what the universities are currently producing


DESIGN OF ELECTRONICMODULES & ASSEMBLIES

Student Professional Contest

The “TIE” contest- since 1992!“A way to turn your hobby into profession”

In 1992 the authors had the idea to create a professional student contest, named TIE (Interconnection Technologies in Electronics). The contest has to established a solid bridge between the innovative companies in electronics industry and universities, with emphasis on professional PCB design, based on IPC standards.

For correlating all the activities around the TIE event, a university network, EPETRUN (Electronic Packaging Education Research Training Network University), has been created in Romania.

Today, also Hungary (based on the enthusiastic team from Budapest University of Technology and Economics) has joint the network.

Subsequently, in context of TIE and EPETRUN, with support of industry professionals, an Industrial Advisor Committee (IAC) was created.

The current state of the TIE competition, reached after twenty years of experience, in accordance with the electronics industry applications, can be considered mature, being already “crystallised” in a solid structure, with subjects very similar with the design requirements which are found in the electronics industry, which topics taken from real industrial projects.

The aim of TIE is to verify that students understand the PCB design chain and are able to follow all the necessary steps to design printed circuits with constraints.


Participant universities

20132014

2015

To train a student, who will be involved in PCB design as part of his/her job, it is necessary to be able to offer him/her a broad range of knowledge, as:

analogue electronics; digital electronics; power and switching electronics (linear and switched mode power supplies); testing of electronic circuits (testing interfaces, specific equipment, testing steps); various world standards (IPC, IEEE, etc.); thermal management (virtual and real, evaluation of the current capacity of PCB

traces); fabrication processes for conventional and special printed circuits, as HDI, RF,

microwave, etc. (technological processes and their limits); assembling processes of electronic modules (assembling technologies and their

limits, inspection technologies); signal/power integrity, EMC/EMI (modelling and simulation of transmission lines,

cross-talk, ringing, computation of controlled impedances, estimation of the propagation time, choosing the proper materials).


Future PCB designer Know How

Electronic packaging oriented knowledge curriculumin the frame of university education


PCB design criteria

The relevance of DFX (X – manufacturing, testing, environment, etc.) rules increases and students need to be faced with projects that enable them to design small electronic products

from their very first step in university education


“TIE”– Design Contest of electronic modules and assemblies

INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) Objective : promoting computer aided design (CAE-CAD-CAM) of electronic modules and assemblies among students in electronics.

21 editions, since 1992.

The TIE map


TIE Committees

Steering Committee (SC); Technical Committee (TC); European Consultants Committee; Industrial Advisor Committee (IAC); Advertising Committee; Student Committee; Local Organizing Committee.


IAC & TIE Industry

Representative of electronics industry;

Involved in subject conception;

Evaluation and certification.

TIE Engineering

students; Trained human

resource for the future.

Some IAC members are former TIE participants!


Industrial Advisor Committee 2012


Chairman:Cosmin Moisa, Continental Automotive, TimişoaraCo- Chairman:Gabriel Chindriş, Ph.D., Technical University of Cluj-Napoca, Members:

Members:Cosmin Frecia, Kuhnke Production Romania SRL, RomaniaZsolt Mathe, Tehnologistic SRL, Cluj-NapocaGabriel Neagu, Electronica Azi, BucharestCatalin Negrea, Continental Automotive, Timişoara Mugurel Niculescu, Sytron Technologies Overseas, BucharestFlaviu Nistor, Continental Automotive System SRL, SibiuMihai Petculescu, Maquardt Schaltsystems SCS, SibiuEmil Popa, Wenglor Electronic SRL, SibiuMariana Poparlan, Simea, SibiuMihai Savu, Samway, BucharestCristian Codreanu, Kromberg & Schubert Romania Me SRL, SibiuEmilian Stoica, Simea, Sibiu

Technical Committee-2012


Chairman:Assoc. Prof. Norocel Codreanu, Ph.D., “Politehnica” University of Bucharest, Co-Chairman:Assist.Eng. Emanoil Toma, “Lucian Blaga” University of Sibiu

Members:Constantin Barabaşa, Ph.D., “Gh. Asachi” Technical University of IaşiMarius Carp, Ph.D., “Transilvania” University of Braşov, Emilian Ceuca, Ph.D., “1 Decembrie 1918” University of Alba IuliaAssoc. Prof. Eugen Coca, Ph.D., “Ştefan cel Mare” University of SuceavaAssist. Eng. Cristinel Crăciun, University of “Dunărea de Jos” GalaţiAssist Eng. Silviu Epure, University of “Dunărea de Jos” Galaţi, Assoc. Prof. Tecla Goraş, Ph.D., “Gh. Asachi” Technical University of IaşiAssist Eng. Claudiu Lung, University of Baia MareLect. Eng. Alin Mazăre, Ph.D., University of PiteştiAttila Géczy, Budapest University of Technology and EconomicsLect. Eng. Marius Rangu, Ph.D., “Politehnica” University of Timişoara Eng. Liviu Viman, Ph.D., Technical University of Cluj-Napoca

TIE 2012 IAC&TC Family Picture



Some examples of TIE subjects

TIE subject example 1The project goal is to design and generate layout and fabrication files

for a single board portable MP3 player.


Block diagram a single board MP3 player


The single board MP3 player PCB should follow the exploded view presented below

TIE subject example 1


TIE subject example 1The single board MP3 player schematic

TIE subject example 2The project goal is to design and generate layout and fabrication files

for the electronic system of a vehicle instrument cluster.


Vehicle instrument cluster


TIE subject example 2Block diagram of the instrument cluster system



Mechanical drawing for back panel aluminum housing


Instrument cluster schematic 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

TIE subject example 3The project goal is to design and generate layout and fabrication files for the PCB panel of a temperature control unit.


Block diagram of the temperature controller

Temperature Control Unit


Mechanical drawing for back aluminum housing (internal)



Temperature controller schematic 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

Topics CAD of electronic circuits (SCH); creation of virtual components (parts); SCH post-processing (generation of netlists, reports, export/import files,

post-processing files for technical documentation); CAD of the on-board interconnection structure (PCB); creation of PCB footprints; professional inter-tool communication techniques between SCH and PCB

environments; PCB post-processing (generation of netlists, reports, export/import files,

post-processing files for technical documentation and manufacturing); standardization aspects for PCB design; elements of analogue, digital and mixed design; elements of signal integrity and electromagnetic compatibility at the PCB

level.


Evaluation team Name SignatureEvaluator 1

Evaluator 2

Student/I agree with the evaluation of my subject and I accept my final score.


Issue Description of checking Grading, examples [points]

Points

max stud

Schematics Correctness of the schematic project, components, signals,

1/terminal, 10/IC, 5/discrete comp.,

80

PCB Layout Correctness of number /type of layers, spacing, footprints, etc. placement, routing, solder and silk mask, other PCB restrictions

1/pad size, number, spacing 5/differential routing,

168

Mechanical Correctness of mechanical holes, board geometry and shape, etc.

4/mechanical holes 6/global fiducials

32

Fabrication Manufacturing (Gerber/Drill) files, NPT/PTH (holes), PnP file,

11/Gerber/Drill files 2/PnP file, 1/TST file

14

TOTAL 294

On-going regulations

All subjects are in English; The amount of time for the qualification session is of 90 – 180

minutes and for the final session is of 240 minutes; Subjects are generated in accordance to IPC requirements; After handing-in the subjects, the students have 30 minutes to

study the contest subjects; The students who participate at the final stage are awarded with

diplomas and prizes: three prizes and five mentions; The contest rules can be found on the web-page of the contest (

www.tie.ro), in English and Romanian, and on the web-pages of the EPETRUN university network, depending on the specific of their web-pages.


http://www.tie.ro/

Example of TIE requirement given to students as bibliography

Example of a requirement reflected in the TIE subject

Example taken from the evaluation grid to match the requirement in the subject

TIE subject example


“Certificate of Competence” in PCB design awarded by IAC to the best students


“TIE”– Design Contest of electronic modules and assemblies The TIE map


TIE participants


Overview during the TIE contest 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

The two authors, Prof. Paul Svasta, general chair of TIE (right picture) and Assoc. Prof. Norocel Codreanu, technical chair (left picture), supervising the competition


4 hours of contest = 240 minutes of hard work!!!


Student at work during the TIE contest 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

EVALUATION – hard work, too!(Evaluators: members of TC & IAC)


Awarding cups


Awarding cups

Two winners’ cups are awarded.

The small cup is of the winner student!

The large cup is of the university, being transferred, from one year to another, to the winner university.

The names of all TIE winners, since 1992, are written on the large cup! Of coarse, on printed circuit boards!!!


Image from the awarding ceremony


Image from the awarding ceremony sponsored by Continental 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

Image from the awarding ceremony 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

Image from the workshop presentations 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

Image from the workshop Q&A session 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

Some of the attendees at the workshop 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

Prof. Zsolt Illyefalvi-Vitez making a presentation 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden

Triple Helix model


Some of sponsors


In an era when all surrounding products are controlled by electronics, the industry demand for PCB designers is very high;

In this global context, TIE has become an international event in 2009; As Prof. Zsolt Illyefalvi- Vitéz (BUTE) said, TIE is a „one day hands-on real-

time competition and is really an unrivalled Component Packaging and Manufacturing Technology event in Europe, best for undergraduates in electronics”;

The TIE contest presented in this work is not necessarily a competition between students and universities, but a certification event in the rapidly developing computer aided design techniques and systems;

The TIE event wants to train and support skilled designers for the European industry, not only for the local/Central European industry;

Based on the solid concept of training students in accordance to the actual requirements of the industry, TIE has answered a long-awaited issue, making the bridge between the theoretical approach and the practical engineering.


Future editions

TIE 2013, Brasov, Romania, April 24-27, 2013; TIE 2014, Alba Iulia, Romania; TIE 2015, Timisoara, Romania.


ANY EUROPEAN UNIVERSITY IS WELCOMED TO “TIE 2013”!

Vielen Dank für Ihre Aufmerksamkeit !


requirements of industry for the education of printed circuit board designers

Documents

the gap

maritim hotel

the interconnection

the contest has to established

solid bridge between

packaging research center

status and challenges

foreign language and