reduction of dielectric constant of ltcc

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Reduction of dielectric constant of LTCC with use of controlled porosity Beata Synkiewicz PBS Research Project - ActiSkan

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Page 1: Reduction of dielectric constant of ltcc

Reduction of dielectric constant of LTCC

with use of controlled porosity

Beata SynkiewiczPBS Research Project - ActiSkan

Page 2: Reduction of dielectric constant of ltcc

To examine the effect of controlled porosity on LTCC parameters, two experimental glass-ceramic powders were performed.

First composition based on glass type E with low content of alkali substrates (mainly SiO2, Al2O3, CaO, B2O3) and on Al2O3 ceramics.

Second composition was created basing on first one but doped in a weight ratio of 1:1 with starch powder (for porosity obtainment during co-firing process).

Glass ceramic powders were a basis for slurries, which in the next step were tape casted to get LTCC green tapes.

METHODOLOGY

Page 3: Reduction of dielectric constant of ltcc

During co-firing (in 900 °C), starch component was burnt out with other organic ingredients, leaving empty spaces in the structure. The sintered samples were of good quality, without deformations and delamination.

EFFECT OF CO-FIRING

The porosity is shown on SEM images of materialcross-section

1. Cross-section of LTCC multilayer structure made of glass-ceramic tape

with porosity caused by graphite (SEM images)

2. The structures after co-firing

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Page 4: Reduction of dielectric constant of ltcc

For examination of electric permittivity, in the final step, silver electrodes were manually printed at both sides of experimental samples. The parallel capacitance was measured at frequency of 1 KHz -2 MHz (in room temperature) using RLC Quad Tech device. In the next step, dielectric constant was calculated.

RESULTS

Page 5: Reduction of dielectric constant of ltcc

The percentage decrease of dielectric constant after applying a 50% admixture of starch powder in the internal layers of the LTCC, was about 56%.

Application of non-porous glass-ceramic covers resulted in greater mechanical strength of the structure and its smooth surface, allowing printing with conductive paste at both sides of the sample

CONCLUSIONS