r&d of equipment
TRANSCRIPT
![Page 1: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/1.jpg)
【【 Resume Slide on Automation ProjectResume Slide on Automation Project 】】
SCADA Basis Automation SystemSCADA Basis Automation System
Jul. 9Jul. 9thth, 2015, 2015Tomoya ItoTomoya Ito
![Page 2: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/2.jpg)
A. Examples of Automation Projects lead. - 1. Semiconductor Life Cycle - 2. Sapphire Crystalize Automation, Trial experiment - 3. SAW Evaluation, Tool for Data Mining
(B. Reference) will be added.
![Page 3: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/3.jpg)
Wire Connection, System Configuration '2005/ 3/ 16 Planned
ⒸLX4411B
Ⓑ型式不
ⒶLX4411B
ⓂLX4411B Ⓖセ
ⒹLX4411BⒺLX4411BⒻLX4411A ⒼLX4411A
スイッチ基盤
P C
OUT BOX
ⓁLX4411B
ⒿLX4411B
ⓀLX4411B
ⒽLX4411B
ⒾLX4411B
INPUT BOX
ⒻセⒺセⒹセ
ⒸセⒶセ Ⓑセ
ⒽセⒾセ ⓀセⒿセ
Ⓜ
1-1. System Configuration1-1. System Configuration
![Page 4: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/4.jpg)
1340.50
7:12
①Switch ON by manual
②Record the measurements by
manual.③Put the data to
Excel files.
1. Took time to press the manufacturing cost.2. Couldn’t set additional points to measure.3. Evaluation Accuracy couldn’t be increased any more due to the restriction of measurement points.
Life CycleEvaluation System
1-2. Issue Analysis1-2. Issue Analysis
![Page 5: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/5.jpg)
設備別 負荷率一覧
0%
20%
40%
60%
80%
100%
120%
設
備負
荷率
(%)
10 月度 実績 11 月度 実績 12 月度 計画 1 月度 計画 2 月度 計画 3 月度 計画
OverviewOverview
1. Lot Management possibly reduced the yield of whole process
2. Manual/Labor works took time than the proper level on labor cost.
3. Prober Equipment Capacity was close to 100%.
Most Heavily Loaded in Process
1-2A. Issue Analysis before carried out Development1-2A. Issue Analysis before carried out Development
![Page 6: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/6.jpg)
(49086 sample1)信頼性
0%
1%
10%
100%0.1 1 10 100 1000
[min]経過時間
発光
強度
変化
率
実測値予測値
《 Objective 》 Life Cycle measurement was designed with the for 1000 minutes(16.7 hours) measurement.《 Target 》 1) Measurement points’ reduction. 2) Shorten Measurement Time1000mi1000min→240minn→240min
★Method Evaluation Algorithm designed by Weibulll Distribution Weibull Distribution: λ(t)=1-exp(-t^m/b) Iteration through the equation D=|y(t)-λ(t)|2<ε(=1e-6
2 点測定により関数内挿
●GraphBefore
Development
Improved
1-3. Evaluation Algorithm1-3. Evaluation Algorithm
★Overview
![Page 7: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/7.jpg)
1-4. System Figuration on the monitor1-4. System Figuration on the monitor
While measurement,
Update expected target.
![Page 8: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/8.jpg)
制御プログラム実装載せるアプリケーション: VB6 、 LabVIEW
Controller I/O: 2 Analogue Inputs 2 Analogue
Load Cell
0-10V/0-80Hz0-38mm/min
Frequency 1 ~ 10HzInput: Crystal weight via Road Cell 《 CCD Camera Vision 》
Output: Inverter 0-10V/0-80Hz Pull up speed, motor driver, 0-xxV/0-38mm/min
Control SpecificationControl Specification
サファイア基板
Seed(種)
るつぼ
引上げ速度
引上げ位置
荷重変化
温度
金型
製品引上げ中
2-1. Sapphire Crystal Process Automation2-1. Sapphire Crystal Process Automation
![Page 9: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/9.jpg)
production Technology centerproduction Technology center
2-2. Control Algorithm2-2. Control Algorithm
X [mm]X [mm]
Lim [mm]Lim [mm]
0.800
0.500
0.550
0.600
0.650
0.700
0.750
60-10 0 10 20 30 40 50
X-RCFit CurvePw_INFitCurveDiff
X-RC相関
0カーソル 5.307261.05926
Weight value RC can be obtained by the followingEquation,
RC(X) = A ・ X2 + B ・ X + C ・・・・ (1)
Thus, Derivation of the former Equation can beExpressed as following,
Lim(X) = K*D{RC(X)}/Dx = K(2A ・ X + B) ・・・・ (2)
2.000
-0.123
0.2500.5000.7501.0001.2501.5001.750
800 10 20 30 40 50 60 70
X-RCLinear Fit CurveSpeedFixed Curve
Lim - INV_Pw
0カーソル 5.307261.05926
VelocityControl Zone
Heat ControlZone
![Page 10: R&D of Equipment](https://reader035.vdocuments.site/reader035/viewer/2022081520/5880ffd31a28abc3368b707f/html5/thumbnails/10.jpg)
TEOSロット別 膜厚誤差推移(1号機)
-30.0%
-20.0%
-10.0%
0.0%
10.0%
20.0%
30.0%
06-0
7206
-073
S060
220F
EX06
0224
S060
220A
S060
221D
S060
218F
S060
221E
S060
220E
S060
220D
S060
222B
S060
221B
S060
220B
S060
S060
222D
S060
222C
S060
222E
S060
227A
S060
227E
S060
227F
S060
227G
S060
227C
S060
227B
S060
227H
S060
227D
S060
228I
S060
228G
06-0
78S0
6012
4CEX
0602
28S0
6022
2F
10投入ロット(投入順・過去 日間)
膜厚
誤差
0K
10K
20K
30K
40K
50K
60K平均膜厚誤差 R Total膜厚の先頭
SAW Data Analyze System
Mapping on the surface- Early detection of failure on tipHistogramSurface Data AnalyzingAverage on zone and sigma-Detection of the process Fluctuation
SAW Evaluation DB
Zone/Tip oriented Analysis data
Feedback to the equipmentTimesheet management
Data storage
3-1. System Line up3-1. System Line up
SAW Process ManagementAverage Value ControlChart Management- Failure Detection In Excel
In Access
In LABVIEW