r&d of equipment

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Resume Slide on Automation Project Resume Slide on Automation Project SCADA Basis Automation System SCADA Basis Automation System Jul. 9 Jul. 9 th th , 2015 , 2015 Tomoya Ito Tomoya Ito

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Page 1: R&D of Equipment

【【 Resume Slide on Automation ProjectResume Slide on Automation Project 】】

SCADA Basis Automation SystemSCADA Basis Automation System

Jul. 9Jul. 9thth, 2015, 2015Tomoya ItoTomoya Ito

Page 2: R&D of Equipment

A. Examples of Automation Projects lead.   - 1. Semiconductor Life Cycle    - 2. Sapphire Crystalize Automation, Trial experiment    - 3. SAW Evaluation, Tool for Data Mining

(B. Reference) will be added.

Page 3: R&D of Equipment

Wire Connection, System Configuration '2005/ 3/ 16 Planned

ⒸLX4411B

Ⓑ型式不

ⒶLX4411B

ⓂLX4411B Ⓖセ

ⒹLX4411BⒺLX4411BⒻLX4411A ⒼLX4411A

スイッチ基盤

P C

OUT BOX

ⓁLX4411B

ⒿLX4411B

ⓀLX4411B

ⒽLX4411B

ⒾLX4411B

INPUT BOX

ⒻセⒺセⒹセ

ⒸセⒶセ Ⓑセ

ⒽセⒾセ ⓀセⒿセ

1-1. System Configuration1-1. System Configuration

Page 4: R&D of Equipment

1340.50

7:12

①Switch ON by manual

②Record the measurements by

manual.③Put the data to

Excel files.

1. Took time to press the manufacturing cost.2. Couldn’t set additional points to measure.3. Evaluation Accuracy couldn’t be increased any more due to the restriction of measurement points.

Life CycleEvaluation System

1-2. Issue Analysis1-2. Issue Analysis

Page 5: R&D of Equipment

設備別 負荷率一覧

0%

20%

40%

60%

80%

100%

120%

備負

荷率

(%)

10 月度 実績 11 月度 実績 12 月度 計画 1 月度 計画 2 月度 計画 3 月度 計画

OverviewOverview

1. Lot Management possibly reduced the yield of whole process

2. Manual/Labor works took time than the proper level on labor cost.

3. Prober Equipment Capacity was close to 100%.                                

Most Heavily Loaded in Process

1-2A. Issue Analysis before carried out Development1-2A. Issue Analysis before carried out Development

Page 6: R&D of Equipment

(49086 sample1)信頼性

0%

1%

10%

100%0.1 1 10 100 1000

[min]経過時間

発光

強度

変化

実測値予測値

《 Objective 》       Life Cycle measurement was designed with the for 1000 minutes(16.7 hours) measurement.《 Target 》  1) Measurement points’ reduction.      2) Shorten Measurement Time1000mi1000min→240minn→240min

★Method   Evaluation Algorithm designed by Weibulll Distribution     Weibull Distribution:   λ(t)=1-exp(-t^m/b)   Iteration through the equation D=|y(t)-λ(t)|2<ε(=1e-6

2 点測定により関数内挿

●GraphBefore

Development

Improved

1-3. Evaluation Algorithm1-3. Evaluation Algorithm

★Overview

Page 7: R&D of Equipment

1-4. System Figuration on the monitor1-4. System Figuration on the monitor

While measurement,

Update expected target.

Page 8: R&D of Equipment

制御プログラム実装載せるアプリケーション: VB6 、 LabVIEW

Controller I/O: 2 Analogue Inputs 2 Analogue

Load Cell

0-10V/0-80Hz0-38mm/min

Frequency 1 ~ 10HzInput: Crystal weight via Road Cell 《 CCD Camera Vision 》

Output: Inverter   0-10V/0-80Hz    Pull up speed, motor driver, 0-xxV/0-38mm/min

Control SpecificationControl Specification

サファイア基板

Seed(種)

るつぼ

引上げ速度

引上げ位置

荷重変化

温度

金型

製品引上げ中

2-1. Sapphire Crystal Process Automation2-1. Sapphire Crystal Process Automation

Page 9: R&D of Equipment

production Technology centerproduction Technology center

2-2. Control Algorithm2-2. Control Algorithm

X [mm]X [mm]

Lim [mm]Lim [mm]

0.800

0.500

0.550

0.600

0.650

0.700

0.750

60-10 0 10 20 30 40 50

X-RCFit CurvePw_INFitCurveDiff

X-RC相関

0カーソル 5.307261.05926

Weight value RC can be obtained by the followingEquation,

RC(X) = A ・ X2 + B ・ X + C           ・・・・ (1)

Thus, Derivation of the former Equation can beExpressed as following,

Lim(X) = K*D{RC(X)}/Dx = K(2A ・ X + B) ・・・・ (2)

2.000

-0.123

0.2500.5000.7501.0001.2501.5001.750

800 10 20 30 40 50 60 70

X-RCLinear Fit CurveSpeedFixed Curve

Lim - INV_Pw

0カーソル 5.307261.05926

VelocityControl Zone

Heat ControlZone

Page 10: R&D of Equipment

TEOSロット別 膜厚誤差推移(1号機)

-30.0%

-20.0%

-10.0%

0.0%

10.0%

20.0%

30.0%

06-0

7206

-073

S060

220F

EX06

0224

S060

220A

S060

221D

S060

218F

S060

221E

S060

220E

S060

220D

S060

222B

S060

221B

S060

220B

S060

S060

222D

S060

222C

S060

222E

S060

227A

S060

227E

S060

227F

S060

227G

S060

227C

S060

227B

S060

227H

S060

227D

S060

228I

S060

228G

06-0

78S0

6012

4CEX

0602

28S0

6022

2F

10投入ロット(投入順・過去 日間)

膜厚

誤差

0K

10K

20K

30K

40K

50K

60K平均膜厚誤差 R Total膜厚の先頭

SAW Data Analyze System  

Mapping on the surface- Early detection of failure on tipHistogramSurface Data AnalyzingAverage on zone and sigma-Detection of the process Fluctuation

SAW Evaluation DB

Zone/Tip oriented Analysis data

Feedback to the equipmentTimesheet management

Data storage

3-1. System Line up3-1. System Line up

SAW Process ManagementAverage Value ControlChart Management- Failure Detection In Excel

In Access

In LABVIEW