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Rapid Prototyping & Manufacturing ENGI 7962 Computer-Aided Engineering

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Page 1: Rapid Prototyping & Manufacturing

Rapid Prototyping & Manufacturing

ENGI 7962 Computer-Aided Engineering

Page 2: Rapid Prototyping & Manufacturing

OutlineOutline• Why RP&M Technology?Why RP&M Technology?• Basic Principles

C tl A il bl /D l i S t• Currently Available/Developing Systems• Directions for RP&M Research

ENGI 7962 Computer-Aided Engineering

Page 3: Rapid Prototyping & Manufacturing

R&D Directions in Manufacturing

• Intelligent Manufacturing Control• Equipment Reliability & MaintenanceEquipment Reliability & Maintenance• Advanced Materials

P d t R li ti• Product Realization• Education & Training

ENGI 7962 Computer-Aided Engineering

Page 4: Rapid Prototyping & Manufacturing

Product RealizationProduct Realization• MultidisciplinaryMultidisciplinary• Concurrent, life cycle design teams

I t lli t d t d l• Intelligent product models• Common databases across all functions

(eg. engineering, planning, marketing, ...)• Management of PRPg• Time to market is critical and prototypes

used to aid communicationENGI 7962 Computer-Aided Engineering

used to aid communication

Page 5: Rapid Prototyping & Manufacturing

History of PrototypingHistory of Prototyping• Artist/Craftsperson created modelArtist/Craftsperson created model• Development of CAD

CAD d t b d t t CNC• CAD databases used to generate CNC programs. Subtractive processes.

• Development of additive processes ... generally called “Rapid Prototyping”.

ENGI 7962 Computer-Aided Engineering

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DefinitionDefinition

• A process by which a solid physical modelA process by which a solid physical model of a part is made directly from a 3-D CAD drawing without unique tooling or fixturesdrawing without unique tooling or fixtures.

• Referred to asD kt M f t i– Desktop Manufacturing

– Automated FabricationT l l M f i– Tool-less Manufacturing

– Free-form Fabrication

ENGI 7962 Computer-Aided Engineering

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Goals of Rapid PrototypingGoals of Rapid Prototyping• Substantially reduce product developmentSubstantially reduce product development

time, through rapid creation of 3D models.• Improve communication (visualization)• Improve communication (visualization)

within multidisciplinary design teams.Add i f i d fl ibilit &• Address issues of increased flexibility & small batch sizes, while remaining

titi ( id f t )competitive (rapid manufacture).

ENGI 7962 Computer-Aided Engineering

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BasicsBasics• Require a geometric modelRequire a geometric model.• Must include surface information.

U ll lid d li t• Usually solid modeling system:• CATIA, I-DEAS, Pro/Engineer, SolidWorks, etc

• Surface models require completely bound volume and internal detail.

ENGI 7962 Computer-Aided Engineering

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Basics (continued)Basics (continued)• 3D geometric model is mathematically3D geometric model is mathematically

sectioned into parallel cross-sections.• Each cross section creates a 2D binding• Each cross-section creates a 2D binding

or curing path for model construction.M d l t t d l t ti• Models are constructed one layer at a time until complete. Supports may be required.

• Two stages: Data preparation and model production.

ENGI 7962 Computer-Aided Engineering

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Data PreparationData Preparation• CAD data converted to STL formatCAD data converted to .STL format.• .STL designed for 3D Systems Inc.

Stereolithography Apparatus (SLA)Stereolithography Apparatus (SLA).• Triangular facets are used to describe the

h f l d 3D d lshape of a closed 3D model.• Faceted surface must be completely

bound.• Curved surfaces are approximated.

ENGI 7962 Computer-Aided Engineering

pp

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.STL Format.STL Format• Developed by Albert Consulting Group

C i t f & di t f t i l• Consists of x, y & z coordinates of triangles• Example:

solidsolid...

facet normal 0.00 0.00 1.00outer loopoute oop

vertex 2.00 2.00 0.00vertex -1.00 1.00 0.00vertex 0.00 -1.00 0.00

endloopendfacet

...endsolid

ENGI 7962 Computer-Aided Engineering

endsolid

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STL Format (continued).STL Format (continued)• All adjacent triangles must share twoAll adjacent triangles must share two

vertices.• Translation software is either included in• Translation software is either included in

CAD package or third party.T l t h ld id bilit t dj t• Translator should provide ability to adjust chordal deviation (ie. trade-off accuracy vs fil i d i ti )file size and processing time).

ENGI 7962 Computer-Aided Engineering

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VRML vs STLVRML vs .STL• Virtual Reality Modeling LanguageVirtual Reality Modeling Language• Developed through Silicon Graphics using their

Open Inventor (.iv) standard.p ( )• Lead to “Tele-Manufacturing” as proposed by

Michael Bailey, U. of C., San Diegoy, , g• Take advantage of greater development effort

and utilize other features (e.g.. colour, colour gradient, texture).

• STL still the dominant RP format

ENGI 7962 Computer-Aided Engineering

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RP Production TechnologiesRP Production Technologies• Stereolithography Apparatus presented atStereolithography Apparatus presented at

Autofact show in November, 1987. • Currently upwards of twenty different• Currently upwards of twenty different

technologies being developed/marketed.M j diff i t i l d d• Major differences in materials used and build techniques.

• Various RP technologies outlined in following slides.

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Page 15: Rapid Prototyping & Manufacturing

Stereolithography Apparatus (SLA) - 3D Systems

• Laser generated ultraviolet beam traces out cross-section & solidifies liquid polymer.

• Component is built in vat of liquid resin.• Vat size limits prototype

• SLA-190 (7.9 x 7.9 x 9.8”) US$105,000( ) $ ,• SLA-250 (10 x 10 x 10”) US$210,000• SLA-250 (20 x 20 x 24”) US$420,000

ENGI 7962 Computer-Aided Engineering

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Stereolithography ApparatusStereolithography Apparatus

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Stereolithography (cont )Stereolithography (cont.)• Materials – at least five currently availableMaterials at least five currently available.

All are acrylates (non-reusable thermosets)thermosets).

• Accuracy - ranges from 0.1% to 0.5% of overall dimension from small to largeoverall dimension from small to large parts. A very accurate RP technology.C i t bilit d t t t• Curing stability and support structures remain challenges.

ENGI 7962 Computer-Aided Engineering

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Solid Ground Curing / Photo-masking - Cubital Ltd.

• Uses photo-masking to solidify whole layers of photopolymer at one time.

• Solider 5600 (20 x 14 x 20”) US$550,000 with machine dimensions 13.5’ x 5.5’ x 5’

• Layer thicknesses of .004-.006” and dimensional accuracy of 0.02”, building updimensional accuracy of 0.02 , building up to 100 layers/hour.

ENGI 7962 Computer-Aided Engineering

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Solid Ground Curing (cont.)Solid Ground Curing (cont.)

ENGI 7962 Computer-Aided Engineering

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Solid Ground Curing (cont )Solid Ground Curing (cont.)• Full cure as built minimizes shrinkage andFull cure as built minimizes shrinkage and

eliminates post-curing.• Wax eliminates need for supports• Wax eliminates need for supports.• Fly cutter provides for “undo” operation.• System produces a lot of waste. Can’t

reuse material picked up during milling, and uncured resin is a hazardous material.

ENGI 7962 Computer-Aided Engineering

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Selective Laser Sintering -DTM Corp

• Developed at U. of Texas at Austin• Utilizes powder, rather that liquid polymer.y• Potential exists for different materials

including polycarbonate, PVC, ABS, nylon,including polycarbonate, PVC, ABS, nylon, polyester, polyurethane and casting wax.

• Sinterstation 2000 (12” dia x 15” dp)• Sinterstation 2000 (12 dia. x 15 dp) US$425,000. Builds .4 - 2” per hour.

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Selective Laser Sintering (cont )Selective Laser Sintering (cont.)

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Selective Laser Sintering (cont )Selective Laser Sintering (cont.)• Layers from 003 - 02” thick AccuracyLayers from .003 .02 thick. Accuracy

from .005 to .015” depending on size.• Components can be recycled by crushing• Components can be recycled by crushing

and converting back to powder.R h i i i t t i l h• Research is going into materials such as powdered metals, ceramics and

itcomposites.

ENGI 7962 Computer-Aided Engineering

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Laminated Object Manufacturing

• Process uses bonded sheet material. Normally paper, but metals, plastics and y p p , , pcomposites are possible.

• LOM-1015 (14 x 15 x 10”) US$95 000LOM 1015 (14 x 15 x 10 ) US$95,000 LOM-2030 (30 x 20 x 20”) US$180,000

• Sheets of 002 02” thick• Sheets of .002 - .02 thick.• Accuracy of +/- 0.005” achievable.

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Laminated Object Manuf (cont )Laminated Object Manuf. (cont.)

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Laminated Object Manuf (cont )Laminated Object Manuf. (cont.)• Support provided by remainder of sheetSupport provided by remainder of sheet.• Prototypes less fragile than polymers.

N i t l t i h i k• No internal stresses or curing shrinkage.• Paper waste is non-hazardous.• Machine can be operated in an office

environment.• Cannot build hollow cavities as single part.

ENGI 7962 Computer-Aided Engineering

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Three Dimensional Printing -MIT

Utili d d t i l d t• Utilizes powdered material, spread out one layer at a time.

• Adhesive is applied in droplets through a device similar to an inkjet printer head.

• Limited quantitative data available on accuracy.y

• 3DP licensed to Soligen Inc. for Direct Shell Production Casting process.

ENGI 7962 Computer-Aided Engineering

Shell Production Casting process.

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Three Dimensional Printing ( t)(cont)

ENGI 7962 Computer-Aided Engineering

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Three Dimensional Printing ( t )(cont.)

• Internal supports not requiredInternal supports not required.• May require post processing, depending

on material and binderon material and binder.• Work continues on limiting impact of

bi d d d i j d “ i t”binder drops, reducing jagged “print” edges and flow control for the binder.

• Consortium includes Boeing, Hasbro, Johnson & Johnson, 3M & United Tech.

ENGI 7962 Computer-Aided Engineering

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Other RP SystemsOther RP Systems• Fused Deposition Modeling - StratasysFused Deposition Modeling Stratasys

• uses .050” dia. thermoplastic filament

• Ballistic Particle Manufacturing - BPM g• uses three axis robotic system controlling an ink jet like deposition

head. Low cost, easy to operate system.

• Electrosetting U S Navy• Electrosetting - U.S. Navy• 2D profiles are used to “plot” electrode shapes which are attached

to foil. Multi-layer foil sandwich is immersed in liquid and energized. M t i l i id l t d lidifi S t l t ll bl ltMaterial inside electrode solidifies. Separately controllable voltage and current provides for programmable density, hardness, etc.

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Other RP Systems (cont )Other RP Systems (cont.)• Masking & Depositing - Carnegie MellonMasking & Depositing Carnegie Mellon

• robotic control of metal spraying through a disposable, laser cut, mask. A complementary mask is used to spray low melting point support alloy.support alloy.

• Shape Melting - Babcock & Wilcox• controlled placement of gas metal arc welding wire weld deposit. p g g p

Very closely controlled and monitored thermal conditions with localized cooling allow for control over material properties.

• Innumerable Variations

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R & D in Rapid PrototypingR & D in Rapid Prototyping• Part Accuracy ImprovementPart Accuracy Improvement

• mathematical– use of CSG and ray tracing vs .STL– improved facet approximations

• process related– z step resolution– layer registration

• material related– material selection/developmentp– stress relief, alternate build techniques to reduce deformation– additional processing (eg. shot peening)

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R & D in Rapid Prototyping ( t )R & D in Rapid Prototyping (cont.)

• MaterialsMaterials• improvements to current materials

– current materials weak and fragile– development of low-shrink, less brittle plastics– introduction of glass, carbon or graphite fibre– mixtures including ceramics are being tested

f d t i l i t• focus on end-use material requirement– develop techniques to build with metal– low melting point, binary metal powders

d iti f d l t f lt t l f i l– deposition of droplets of molten metal from a moving nozzle– breakthrough RP design based on materials knowledge

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R & D in Rapid Prototyping ( t )R & D in Rapid Prototyping (cont.)

• SystemsSystems• improvements to current technologies

– incremental improvements to specific RP technologies– generic improvements, applicable to several RP types

• development of new RP technology• development of implementation knowledgedevelopment of implementation knowledge

– desktop manufacturing, automated fabrication, tool-less manufacturing, free form fabrication

– workplace implications– application identification and development

• virtual manufacturing, communications• the personal factory

ENGI 7962 Computer-Aided Engineering

• the personal factory

Page 35: Rapid Prototyping & Manufacturing

Examples of RP in ResearchExamples of RP in Research• Molecular ModelingMolecular Modeling

• Protein Kinase• Molecular Docking SitesMolecular Docking Sites

• Earth Science• BathymetryBathymetry• Fault modeling• Terrain surfaces• Hurricane / meteorological modeling• Ozone Hole over Antarctica

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Examples of RP in ResearchExamples of RP in Research• MechanicalMechanical

• Specific component models• Clearance, fit, function verificationClearance, fit, function verification• Design process development

• MedicalMedical• Creation of mold blanks• Customized devices for specific patientsp p

• Mathematical Surface Visualization

ENGI 7962 Computer-Aided Engineering

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Introduction to Rapid ToolingIntroduction to Rapid Tooling

• Defn: A process by which RP technology is used to allow manufacturers to speed pup the prototype tooling process without committing to costly and time consuming g y ghard tooling.

ENGI 7962 Computer-Aided Engineering

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Rapid ToolingRapid Tooling

• Evolved dramatically in 1996Evolved dramatically in 1996• RT allows user to build a tool that can

produce 100s 1000s or even 1000000sproduce 100s, 1000s, or even 1000000s of parts quickly and at a lower cost.

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The Evolution of RTThe Evolution of RT

Rapid Soft Tooling (RST)

Rapid Bridge Tooling (RBT)

Rapid Hard Tooling (RHT)p g ( )

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The Evolution of RTThe Evolution of RT

ENGI 7962 Computer-Aided Engineering

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Rapid Soft Tooling (RST)Rapid Soft Tooling (RST)

• Tools are made using RPTools are made using RP• Parts are molded using

R T t V l i ti (RTV)– Room Temperature Vulcanization (RTV)– Vacuum Casting

O– NOT Injection Molded• NOT fabricated from end use material• Typically less than 30 parts per mold

ENGI 7962 Computer-Aided Engineering

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Rapid Bridge Tooling (RBT)Rapid Bridge Tooling (RBT)

• Utilizes advanced RP techniquesUtilizes advanced RP techniques• Accurate Clear Epoxy Resins (ACES)

I j ti ld d t• Injection molded parts• Use of ACES allows entire project from

CAD design to 100 molded prototypes in 5 days.

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Rapid Hard Tooling (RHT)Rapid Hard Tooling (RHT)

• Fabricate the RP partFabricate the RP part• Cover part with flexible silicon rubber

B k t d d t l l f d• Break apart and send to local foundry• Ceramic part replica of RP part• Aluminum tooling cast from ceramic part• Parts can be “shot” in real productionParts can be shot in real production

material

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ENGI 7962 Computer-Aided Engineering