r & d english generalbook 2009

40
WA Series Wafer Baking Plants R&D Engineers An ISO 9001:2000 Company ZA Series Cone Baking Machine RS-Series Cup/Cone Making Machine Profitable Ideas for Cone & Wafers ZWA Series Wafer Baking Plants

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Page 1: R & D English GeneralBook 2009

WA Series Wafer Baking Plants

R&D EngineersAn ISO 9001:2000 Company

ZA SeriesCone Baking Machine

RS-SeriesCup/Cone Making Machine

Profitable Ideas for Cone & Wafers

ZWA Series Wafer Baking Plants

Page 2: R & D English GeneralBook 2009

C o n t e n t s

1.3

1.4

2.1

ZE Series Ice Cream Cone Machine

ZA-1 Lab Model for Ice Cream Cone

2.0 Ice Cream Cone (Rolled)Baking Machine

Rolled Sugar Cone Machine

10

11

12

13

4.3

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

3.11

3.12

4.1

4.2 RS Tube Rolling Station

3.0 Wafer Biscuit Plants

Wafer Biscuit Introduction & Process Chart

Wafer Design Selection Guide

Wafer Plant Sample Lay Outs

Wafer Biscuit Plant - WA Series

Wafer Biscuit Plant - ZWA Series

Wafer Biscuit Plant - ZWT Series

Wafer Biscuit Plant - ZW Series

Wafer Biscuit Machine - WT Series

Wafer Sheet Coolers - SC Series

Creaming Machine Series - CR Series

Wafer Book Cooler - BC Series

Wafer Cutting Machine - WC Series

4.0 Supporting Equipment

Batter Mixers / Mix Plant

Replacement Moulds & Dies offered for all plants 36

15

17

18

19

20

22

24

25

26

27

29

31

33

34

35

5.1

5.2

Waffle Cone Maker

Belgian Waffle Maker

37

38

5.0 Others

1.1

1.2

1.0 Ice Cream Cone Baking Machine (Moulded)

Cone Selection Guide

Ice Cream Cone Baking Machine - ZAW / ZA Series

05

06

07

02

Page 3: R & D English GeneralBook 2009

About us

Our clientele are market leaders from food, bakery, chocolates, and confectionery to hotel and restaurant industry.

R&D Engineers team of engineers guarantee a high quality of production. The professional team works with the aim of customer satisfaction by implementing new technical developments, giving optimum solutions, which increase the competitiveness of professional manufacturers and allow them to make attractive and quality products at a reasonable

Established in 1991, R&D Engineers is India's foremost manufacturer of baking machines for Wafer Biscuits, Ice CreamCones and Rolled Sugar Cones.

We are located in Hyderabad India.

03

price.

Page 4: R & D English GeneralBook 2009

Facilities

04

High Quality precision machining is possible on our CNC Machine.

We use the latest application of CAD / CAM Solution for meeting customer demands

Dedicated Staff to answer all your queries

Page 5: R & D English GeneralBook 2009

ZE SeriesSemi- Automatic

Ice Cream Cone Baking Machine

05

ZA W SeriesAutomatic

ZA SeriesAutomatic

Page 6: R & D English GeneralBook 2009

I. MOULDED CONES - Standard Cone Designs

II. Premium Cone Designs

Z-25R10 ** Z-5212 * Z-8200 *

Za-6073 Z-3303 ** Z-30a70 *

Ze-29G73 Za-4515 Za-56d20 Z-49S10_v3

Z-5225a Za-36b00a Za-7230a Z-5200e

III. Special Cone Designs

Z-93d32 *

Z-5227*

Only possible with ‘ZE’ series plant**

Only possible with ‘ZA’ series plant*

These designs are intended to illustrate the various die possibilities.This is a short representation of the vast selection possible.

ICE CREAM CONE Design Selection Guide:

06

Page 7: R & D English GeneralBook 2009

Automated Ice Cream Cone Baking Machine

07

nt esAdva ag !

Advanced Control Panel

Eu o a G air pe n as Tr n

a e o r s t nAdv nc D o in ula io

r lo eEu opean B w r

& aModular Ground Tr cks

ZA-W Series

ZA Series

Page 8: R & D English GeneralBook 2009

The baking moulds are mounted on carriages fitted on to an endless chain. Thesemoulds pass under an automatic batter depositor at a selected speed between 90sec. to 3 minutes. The batter pump is synchronized with the movement of the moulds to ensure accurate injection of the batter into the center of the mould. On emerging from the oven an automatic stripping device removes the waste batter. These moulds automatically open and the baked cones are ejected onto the stacking conveyor and are subsequently packed.

The baking moulds are manufactured from special quality cast alloy to ensuredimensional stability, homogenous and dense surface, to enable thermal stability andheat accumulation and excellent thermal conductivity. The diameter of cones decidesthe number of cavities in the moulds. The mould carriages is so designedto give a quick changeover from one set of moulds to another for the production of adifferent size of cone.

The efficient insulation of the baking chamber gives a minimum loss of heat and efficientutilization of energy.

Workers required

One skilled and two unskilled workers are required to complete all operations.

Operational Area required

The total operational area required is about 1000 to 15000 Sq.ft.(100-150 sq.meter)

The ‘ZA’ Series are efficient ovens for the large scale production of all kinds of ice creamcones, moulded sugar cones, cups and hollow wafers. According to the output requiredthese machines are supplied with 12,18,24 30, 36 baking moulds or higher. These ovens can be heated by Liquid Petroleum Gas(LP Gas) or Electricity. An automatic stacking device can be supplied as an extra. The machine is driven by motor with a variable speed attachment.

‘ZA-W / ZA’ Series Automatic Ice Cream Cone Baking Machine

08

Batter Depositor

The depositing head of the Batter depositormoves at the same speed as the baking moulds and so deposits the liquid batter centrally in the mould engravings.

Our efficiently designed burners ensureuniform heat for even baking characteristics. Italso ensures an optimal gas consumption.

Gas Burners

Page 9: R & D English GeneralBook 2009

** Small plant may have longer baking cycle

* The capacities indicated above are maximum values. The exact capacity depends on baking time, recipe and cone size

Modifications reserved

Technical DataThis data given underneath describes for baking machines on LP Gas heating (Baking cycle 1.5 minutes)

09

*** If Sugar is used in the batter recipe, the production capacity would reduce.

Stripping Device

The cam-operated stripping knife, removesthe small lumps of the batter that form on theoutside of the moulds at the steam slots duringthe process.

Cone Ejector

The ejector mandrel, synchronized with the speed of the passing moulds, move into loosen the cones from the open baking mould. The cones then drop into the chutesfeeding onto the conveyor of the stacking device.

Max.Hourly output at cone diameter of Cones Cones Cones Cones Cones

Up to 36mm (9 cones/mould) 3240 6500 8600 10800 12900

Up to 29mm (11 cones/mould) 3900 7900 10500 13200 16000

Up to 32mm (10 cones/mould) 3600 7200 9600 12000 14400

Up to 41mm (8 cones/mould) 2880 5800 7700 9600 11500

Up to 47mm (7 cones/mould) 2520 5000 6700 8400 10100

Up to 56mm (6 cones/mould) 2160 4300 5700 7200 8600

Up to 68mm (5 cones/mould) 1800 3600 4800 6000 7200

Type

ZAW 12 / ZA 12**

‘ZAW 18 / ZA 18

ZAW 24 / ZA24

ZAW 30 / Za30

‘ZAW 36 / ZA 36

358011001700

480011001700

601511001700

720511001700

841511001700

Electrical load in KW* 45 10865 87 130

(without automatic staking device)

Net Weight Kg 3000 4000 5000 6000 7000

Weight includung seaworthy packing 5250 6500 7500 8500

3Shipping space approx. In Cubic feet/m 18 25 36 47

LP Gas consumption Kg. Per hour approx 4-8 8-12 12-15 15-18 18-21

IF GAS HEATING*

IF ELECTRIC HEATING*

DIMENSIONS IN MM

WEIGHT & SHIPPING DETALS

4250

11

LengthWidthHeight

Electrical load in KW* (for LP Gas heated plant) 3.2 4.03.2 3.2 4.0

35 7746 62 92Consumption in KW (Approx.)

Page 10: R & D English GeneralBook 2009

Technical Data

The upper section of the machine holds the male portion of the moulds. The lower section holds the female portion of the moulds. The two side pillars are used as guides for vertical opening and closing of the baking moulds. Depending on the diameter of the product, the moulds sections consists of four to six rows of dies.

Procedure & Machine Operation

Batter preparation: A mixture of wheat flour, maize starch, vegetable fat, preservative colors etc., is churned into a paste in a suitable batter mixer.

The batter is infused by means of a very exact, adjustable batter depositing device on the preheated moulds.

The mould is opened and closed by levers. The moulds are provided with a special closing device. Heating is by electricity. Cones are automatically ejected into a container at the end of the baking cycle when the lower mould is opened. These baking machines can be operated by an unskilled worker performing a few simple actions.

The “ZE” series of semi-automatic machines are used for baking ice cream cones, sugar cone and cups. These machines are easy to use and robust. The heating is by electrical heaters designed to optimize energy use and thermal distribution; still flexible for high production on nonstop basis for 24 hours.

* The capacities indicated above are maximum values. The exact capacity depends on baking time, recipe and cone size etc.,

10

‘ZE’ Series Semi-AutomaticIce Cream Cone Baking Machine

** If Sugar is used in the batter recipe, the production capacity would reduce.

Dimensions in mmDiameter

of cone (mm)Output

per hour

20

24

27

31

32

33

38

42

46

56

60

4,300

3,800

3,400

3,000

2,900

2,900

2,500

1,900

1,400

1,200

800

Length

Width

Height

Width (approx. In Kg.)

Net Weight

Packed for shipping

Electrical Connected

Load (approx. In KW)

Hourly Power

1,200

1,300

1,700

450

530

9-12

Consumption with electric heating (approx. In KW)

7-10

Page 11: R & D English GeneralBook 2009

ZA1 LAB Model Cone Baking Machine

The ZA1 Series is an efficient test baking tong for laboratory scale production of all kinds of ice cream cones, cups and hollow wafers. They are characterized by the highest standards in precision, operating ease and utmost durability. They are easy to use and

Heating System

The baking moulds are manufactured from a very special quality cast alloy to ensure dimensional stability and a homogeneous and dense surface to enable excellent

Baking Moulds

These Machines are supplied only with electrical heating. They are mainly used as a laboratory equipment, for the purpose of product development. The temperatures for the upper and lower plates can be adjusted by means of a thermostat.

Machine for Ice Cream Cone(ZA-1) Lab Model

robust.

thermal stability and conductivity.

11

ZA-K-1Special Edition

ZA-1Std. Edition

Technical Data

Dimensions in MM

1030800

1200

Electrical Load Kw 4.0*

Weight in Kgs

NetGross

150 250

Shipping Volume m 1.03

LengthWidthHeight

ZA-1 ZAK-1

1250800

1200

4.0*

175 275

1.0

* May Vary with Cone Design

Special Products

Page 12: R & D English GeneralBook 2009

Natural Flat Top Heart Tulip Cup

Automated Rolled Sugar Cone Machine

Rolled Sugar Cone Design Selection Guide

This is a sort representation of the Vast Selection Posssible

RS-SeriesWith Rolled Cone attachment

RS-SeriesWith Cup making attachment

Roll

12

Page 13: R & D English GeneralBook 2009

The ‘RS-Series’ of machines are designed with latest technical standards for economical results. These machines are clearly laid out and easily accessible. The bearings and lubricants used are of long life and the links between the baking plate

Procedure The prepared batter mix is put into a holding tank. A measured volume of batter mix is pumped through dosing pipes, which deposit it onto each of the baking plates, these plates move continuously through the oven. The lower baking plates have a grid-patterned surface that imprints its pattern on the outside of the cones. The hingedtop baking plates have a limiting ring for giving a thick ring on the top of the cone.

As the top plates close down onto the bottom ones, the limiting ring enters the groove toform a barrier as the batter mix spreads over the plate - this boundary forms the top rim of the cones. The lower plates are heated from underneath by a gas burner. As the baking plates return on the underside, a lower gas strip burner heats the other baking plate.

As the baking approaches the take-off point, the top plates are lifted up. A knife edge lifts the baked wafer sheets off the bottom plates, then they are swept around the transfertable by spring-loaded remover heads to the cone-rolling unit.

Wafer thickness is determined by the distance between the closed baking plates, and is fixed during machine manufacturing. Batter dosing determines the final wafer size and shape. The deposit is normally directed into the center of the baking plate, but then has

Batter dosing

to be adjusted for the wafer length.

Rolled Sugar Cone Machine (RS - series)

13

are also maintenance free.

Page 14: R & D English GeneralBook 2009

120 s cycle time *

Types of rolling

possibilities

Size of Plate(approx.)

<Mm’mm>

Type of Heating[all types of gas,propane, butane,

natural gas]

Number of tongs/multiple

usage

Productioncapacity<pcs/h>

Possibleproducts

L.P.Gas Consumption

per hour

Electrical load in

KW

RS 24

RS 36

RS 48

RS 60

250 * 250 all types of gas

24

36

48

60

700-750

1080-1100

1440-1500

1800-1900

rolled sugar cones, waffle cones, wafflebowls, waffle

sheets

250 * 250

250 * 250 all types of gas

all types of gas

7-10

10-14

15-18

5

5

5

The wafer is taken off the lower plate and handed over to the horizontally formatted rolling device. The rolling which results from this principle is the requirement for a wafer with a distinct squared pattern and an even thickness of the wafer which allows a slow and careful turning of the rolling core.

Control panel contains all units for the Automatic BakingMachine and incorporate the following functions :Safety switches with over load and over voltage relays, fault current circuit breaker and automatic burner. Optional temperature measurement by sensor can be provided.

Technical data

Rolling device

* The capacities indicated above are suggested values. The exact capacity depends on baking time, recipe and cone size

Cup making device

The wafer is taken off the lower plate & moves over to cup punching station, that resultsin the cup formation. These are used to produce cups of different sizes.

Conveyor

Baked cup and cone are gently dropped to a transfer conveyor.

R&D engineers developed new cup presses. Mechanically guided pressing tools lead to precise product results. The tools can also be changed very easily which shortens the changeover time noticeably. Different products can be produced on one single cup press.

14

Control panel

250 * 250 all types of gas 5-7 5

Page 15: R & D English GeneralBook 2009

Wafer Products

15

Page 16: R & D English GeneralBook 2009

ZW Series Plate Size 230 X 290

WA Series Plate size 350 X 470

R&D

ZWA Series Plate size 290 X 460

ZWT Series Plate Size 270 X 370

16

Wafer Biscuit Production Oven

Page 17: R & D English GeneralBook 2009

The sheets so formed are typically thin but may bear intricate surface patterns with deep relief. Wafers which are sold in biscuit markets are usually formed as large flat sheets, which are subsequently cream sandwiched before cutting and may be chocolate enrobed.

The majority of wafer biscuits are based on the large flat sheets, and the techniques and technology involved in the production of these will be the basis of account given here.

The wafer sheet itself is generally baked from a simple batter containing little orno sugar. It is a tasteless product which has a smooth surface(though patternedby virtue of the engraving on the plates between which it was baked) and a veryopen cellular structure within.

Sandwiched wafers are rich in cream filling (approx to 70% by weight). When filled wafers are chocolate enrobed or form part of a chocolate moulded bar, the wafer components becomes the crisp & crunchy center for the product.

Wafer is a specialized type of biscuit in that they are formed from a batter which is baked between pairs of heated metal wafer tongs.

Hollow Wafer Designs/Sample Die Photographs

Process Chart

4

5 6 7

8 9

1 3

2

1. Wafer Oven

2. Batter Mixer

3. Wafer Sheet Cooler

4. Planetary Cream Mixer*

5. Cream Spreading Machine

6. Book Cooler

7. Wafer Cutting Process

8. Wafer Fanning Device*

9. Packing Process*

17

Wafer Biscuit : An Introduction

* Out of Our Scope of Offer

Page 18: R & D English GeneralBook 2009

Sp

ec

ial D

es

ign

s

Round shell Design

Heart Design

Canape Design

Wafer Design Selection Guide

18

A - Angle of ReedingB - BodyC - Depth of EngravingD - Depth of EngravingP - Pitch of reedingT - Total Thickness

Re

gu

lar

De

sig

ns

Tray Design Design Requirements

02.5 X 0.4 (90 ) 02.5 X 0.4 (45 ) 04.0 X 0.6 (90 )

06.0 X 1.0 (45 ) 08.0 X 2.0 (90 ) 08.0 X 2.0 (60 )

010 X 2.5 (60 ) 0 010 X 2.0 (45 & 0 ) 012 X 3.0 (90 )

012 X 3.0 (60 ) 012 X 3.0 (45 ) 0 012 X 3.0 (45 & 0 )

A

P

T

D

BC

Page 19: R & D English GeneralBook 2009

ZWA Plant Lay out

1.ZWA24-SERIES2.MIX TUB3.SHEET COOLER

4.CREAMING M/c5.BOOK COOLER6.WAFER CUTTING

2

1. WA 72- OVEN2. MIX PLANT3. SHEET COOLER

4. CREAMING MACHINE5. BOOK COOLER6. WAFER CUTTING M/C

WA - 72 Lay out

7. WAFER DISTRIBUTION DEVICE

19

Wafer Plant Layouts - Suggestions

LEGEND

LEGEND

Page 20: R & D English GeneralBook 2009

Heating

High Efficiency triangular burners can be adjusted for an extremely even application of heat over the entire surface of the baking plates.

WA series baking plant

The machine features a sturdy and torsion resistant steel frame work.The tong chain is extremely strong and almost maintenance free.

Features

When the batter gets deposited, the upper and lower baking plates are pressed together and locked. The high closing pressure isabsorbed by large size closing rollers located above and below the tongs. Locking is effected by means of hook, and bearing clearance which has no effect on the closing mechanism or on the thickness of the wafer sheet. Batter depositing system ensures uniform sheet weights and waste free and optimum batter usage.

Operation

The WA Series of Wafer Biscuit Baking Machine aredesigned for fully automatic production of wafer sheets with fine medium or deep-reeding, as well as wafer sheets with hollow forms for all types of shapes. According to the out put required it may be equipped with 48, 60 and 72 baking plates. The standard platesize is 470 x 350. These baking machines can be heated by L.P.G. (Or if preferred by Electricity).Universal triangular burners are used for baking effect in gas plant by using twin row method. This brochure details gas heated plants.

20

WA Series Wafer Biscuit Plants Plate Size 350 x 470 mm

Page 21: R & D English GeneralBook 2009

11250 13500

40 46

Output of wafer sheets/hour 1440 1800 2160

Gas Heating:L.P.Gas consumption Kgs/hr (approx)Electric load in Kw.

30-359Kw

38-429Kw

44-489Kw

Dimensions in mm.LengthWidthHeight

1000013502450

1200013502450

1400013502450

Weight in Kg.(approx.)

Shipping space in cubic meters(approx.)

9000

32

Cream filler Wafers/hour (Kgs) 200-225 250-275 300-325

BASED ON 120 Sec. Baking cycle

Type WA48 WA60 WA72

21

Technical data

Insulation

Fully opened hinged doors run along the entire length on both the sides of the baking machine & permit total access to the interior for ease of cleaning and maintenance. Heat loss is made minimum by a special protection and insulation.

Control panel

Control panel contains all units for the Automatic BakingMachine and incorporate the following functions :Safety switches with over load and over voltage relays, fault current circuit breaker and automatic burner. Optional temperature measurement by sensor can be provided.

Plate Size : 350 mm x 470 mm

* The capacities indicated above are suggested values. The exact capacity depends on baking time, recipe and cone size

Page 22: R & D English GeneralBook 2009

The plates are made of special alloy. The selection of alloy and casting procedure ensures dimensional stability, a homogenous and dense surface, thermal stability, good heat accumulation characteristics and excellent thermal conductivity. Special finishing is done to ensure trouble free release of wafer sheets. The wafer thickness is quickly and easily adjusted by applying spacing shims.

The standard size of the baking plates is 290mm x 460mm (about 11 ½” x 18”). Also special size of baking plates can be supplied on request.

Heating (either by liquified petroleum gas or electricity)

By Electricity : On electrically heated baking plates, the current is conveyed via copper conductors and by spring loaded contacts to the individual baking plates. The heating elements are fixed into the baking plates and insulated.

Baking plates

Batter

Wheat flour, Maize starch, Vegetable fat, preservatives etc are mixed with water to form the wafer batter.

The batter is discharged onto the baking plates by a cam operated pump. The pump can be very accurately set to give an efficient distribution of batter with maximum economy and minimum wastage. Adjustment, clearing and maintenance of the pump is simple and quick.

‘ZWA’ Series Semi AutomaticWafer Baking Machines

The semi automatic wafer baking machines of the ZWA series are suitable for the production of first class quality flat wafers. These machines can be Equipped with 12, 18, 24 30 & 36 baking plates(tongs)according to the required output. The machine is built with a steel frame of rigid construction. An endless chain conveys the baking plates on their carriers through the baking chamber, driven by a chain drive infinitely variable

ZWA Series Wafer Biscuit Plants

By Gas : The gas heating system has automatic ignition with safety devices. In case of gas, air or power failure, a automatic cutout device on the heating system will operate. The oven is equipped with special burners. Precise controls for the mixture of gas and air gives high efficiency combustion. On gas heated machines, the exterior of baking plates have pyramidal shapes cast-on, to give increased surface area and thus better heat exchange.

These baking plates can easily be exchanged to produce wafers of different designs. The oven can be heated by L.P.Gas or if preferred by Electricity.

in speed through its range.

22

Plate Size 290 X 460mm

Page 23: R & D English GeneralBook 2009

* Based on 100 Sec baking cycle.

Drive and controls

The control panel can be mounted at the discharge end of the oven or at a distance of up to one meter for ease of operation. This provides control for the drive, batter pump,

Sheet take-off

The batter is discharged onto the baking plates by a cam operated pumps. The precision-built pump gives an efficientdistribution of batter. Air blowing facility for simple removalof the wafer sheet from the baking plates.

No.of Baking Plates (tongs)

Output of Wafer Sheets/Hr*

Cream filled Wafer Biscuits in Kg/Hr* (Approx)

IF GAS HEATING*

L.P.Gas consumption Kgs/hr

Electrical load in KW

IF ELECTRIC HEATING*

Load in KW

Consumption in Kw (approx)

DIMENSIONS IN MMLength

Width

Height

WEIGHT & SHIPPING DETALS

Net Weight in kg.(approx.)

Including export packing kg. (Approx.)

Shipping space in Cubic Meters approx.

12 18 24 30 36

360 640 860 1080 1300

40-42 72-75 96-100 120-125 145-150

8 10-12 14-16 18-20 20-23

3.5 3.5 3.5 3.5 3.5

47 70 94 118 141

37 56 75 94 100

4,250 5,750 7,250 8,750 10,250

1500

2000

1500 1500 1500 1500

2000 2000 2000 2000

3,500 5,500 7,000 8,500 10,000

4,500 6,750 8,500 10,000 12,500

20 25 3630 42

TYPE ZWA12 ZWA18 ZWA24 ZWA30 ZWA36

Technical data Plate Size : 290 mm x 460 mm

Heating

High Efficiency triangular burners can be adjusted for an extremely even application of heat over the entire surface of the baking plates.

The drive is by an electric motor through a gear box and chain drive protected by an overload safety clutch. Baking time is adjustable between 1.5 and 3 minutes by means of potentiometer on the control panel, provided suitable batter is used.

blowers and ignition.

* The capacities indicated above are suggested values. The exact capacity depends on baking time, recipe and cone size** Shorter oven required longer baking cycles.

23

Page 24: R & D English GeneralBook 2009

“ZWT” Wafer Baking Machine

The Automatic wafer Baking Machine ZWT Series is designed for fully automatic production of wafer sheets with fine, medium or deep reeding as well as hollow wafer sheets. It may be equipped with 12, 18, 24,30,36,42 baking tongs.

Heating system

The automatic baking machine is equipped with high efficiency burners that can be adjusted for an extremely even application of heat over the entire surface of the baking plates.

Heating (By Liquified Gas(LPG) / Natural Gas)

By Gas : The heating system has automatic ignition. In case of gas, or power failure, an automatic cutout device on the heating system will operate.

Baking plates

The plates are made of special alloy. The selection of alloy and the casting procedure ensures dimensional stability, a homogenous and dense surface, thermal stability, good heat accumulation characteristics and excellent thermal conductivity. Special finishing is done to ensure trouble free release of wafer sheets. The wafer thickness is quickly and easily adjusted by applying spacing shims.

Special Design

Regular Design

Technical Data

ZWT AUTOMATIC WAFER BAKING MACHINE

Output of wafer sheets/Hr

GAS HEATING: LP Gas Consumption/Hr

DIMENSIONS (approx in mm.)Length

Width

Height

Net Weight in Kgs

Weight incl. Seaworthy packing

Shipping space in m

Cream filled wafers/Hour (Kgs.approx.)*

ZWT12 ZWT18 ZWT24

360 640 860

4-5 6-8 8-10

3400 4600 5800

1100

2000

1300 1900 2500

1100 1100

2000 2000

1800 2500 3250

4.5 5.5 7.0

18-20 36-40 48-50

ELECTRIC LOAD (Kw) 3.5 3.5 3.5

3

ZWT30 ZWT36 ZWT42

1080 1300 1500

65-70 80-85 90-95

12-14 16-18 18-20

3.5 3.5 3.5

7000

1500

2000

8200

1500

2000

9400

1500

2000

3100 3700 4300

3900 4600 5000

15.0 18.0 20.0

“ZWT” Series Wafer Biscuit Plants

Plate Size : 270 mm x 370 mm

* The capacities indicated above are suggested values. The exact capacity depends on baking time, recipe and cone size

24

Plate Size 270 X 370 mm

Page 25: R & D English GeneralBook 2009

The Automatic Wafer Baking Machine “ZW Series” is constructed for the production of first class quality flat wafers. According to the output required, it may be

The Machine consists of a solid steel frame of angle works and has adjustable legs. An endless link chain carries the baking plant, mounted on the baking tongs.

The batter is discharged onto the baking plates by a cam operated pump. This pump can be very accurately set to give an efficient distribution of batter with maximum economy and minimum wastage. Adjustment, clearing and maintenance of the pump is simple and quick. The baking machines can be heated by L.P.Gas or if preferred by Electricity. The baking chamber is effectivly insulated, ensuring efficient use of energy.

Heating (Either by liquified Gas or electricity)

By Gas : The heating system has automatic ignition. In case of gas, air or power failure,an automatic cutout device on the heating system will operate.

By Electric : On electrically heated baking plates the current is conveyed via copper conductors and by spring contacts to the individual baking plates. The heating elements are fixed into the baking plates and insulated from external environment.

‘ZW’ Semi Automatic Wafer Baking Machine

Baking plates

The plates are made of special alloy. The selection of alloy and the casting procedure ensures dimensional stability, a homogenous and dense surface, thermal stability, good heat accumulation characteristics and excellent thermal conductivity. Special finishing is done to ensure trouble free release of wafer sheets. The wafer thickness is quickly and easily adjusted by applying spacing shims.

Technical Data Plate Size : 230 mm X 290 mm

“ZW” Series Wafer Biscuit Plants

equipped with 12, 18, or 24 baking tongs.

ZW AUTOMATIC WAFER BAKING MACHINE

Output of wafer sheets/Hr*

ZW12** ZW18 ZW24

360 640 860

ZW30 ZW36

* The capacities indicated above are suggested values. The exact capacity depends on baking time, recipe and cone size

1070 1280

25

Plate Size 230 x 290 mm

IF GAS HEATING:

4 6 8

ELECTRIC LOAD (Kw) for LPG Heated Plants 3.5 3.5 3.5

10

3.5

12

3.5

LP Gas Consumption/Hr

Connected load in KW

Current Consumption in KW/Hr (Electrical)

DIMENSIONS (approx in mm.) LengthWidthHeight

Net Weight in Kgs

Weight incl. Seaworthy packing

Cream filled wafers/Hour (Kgs.approx.)

27 40 51

20 32 40

410011001500

250011001500

1300 1900 2500

330011001500

1800 2500 3250

4.5 5.5 7.0

18-20 36-40 48-50

Shipping space in m3

63

50

520011001500

3250

4100

9.0

60

75

60

630011001500

4050

5000

11.0

75

IF ELECTRIC HEATING

Page 26: R & D English GeneralBook 2009

Technical Specifications

Plate Size 270 mm X 370 mm approx. No. of Wafer Tongs ‘WT’ =6 Nos.

‘WT’6

Output of wafer sheets/Hr 240

ELECTRIC HEATING: Connected load in KW

15

Current consumption in KW/Hr 12

DIMENSIONS (in mm)

Six Tongs are packed as 3 Stations x 2 Cases

Length

Width

Height

Net Weight in Kgs

Weight incl. Seaworthy packing

Shipping space in m

Cream filled wafers/hour* (Kgs. Approx.)

1420x2

440x2

750x2

640

900

2.0

20-25

Baking Plates

Machine Operation

The batter is fed to pre-heated wafer tongs by a special dosing device. Baking takes1.5-3* minutes. The baked sheets are cooled. Subsequent operations are creaming, sandwiching &cutting. The wafers are then packed.

Workers required : Six unskilled workers are required to complete the production.Operational area required : The total operational area required is about 750 Sq. Ft.Capacity & output details : Production from 100 to 125 kgs* can be made in 8 hrs.(using 6WT)

‘WT’ Manual Cream Wafer Plants

WT Series Cream wafer plants are used for the manually operated production of cream wafer biscuits. The machine is characterized by a simple mechanism that is sturdy and flexible. These machines are low cost and economical in operation, depending on the output required;they can be supplied with 6, 9 or 12 Wafer baking tongs. This Brochure details a set of six

Wafer tongs (6WT) production and Capacities. Cream spreading table, cutting machine, batter mixer, cream mixer & packing machines ensure that production is continuous.

The plates are made of special alloy. The selection of alloy and casting procedure ensures dimensional stability, a homogenous and dense surface, thermal stability, good heat accumulation characteristics and excellent thermal conductivity. Special finishing is done to ensure trouble free release of wafer sheets.

WT - 1 - Splfor Special Product

3

WT-6 Mountedon Special Stand

Wafer Biscuit Tongs - WT Series

The wafer thickness is quickly and easily adjusted by applying spacing shims.

WT - 1Mounted on a Stand

* The capacities indicated above are suggested values. The exact capacity depends on baking time, recipe and cone size

26

Plate Size 270 x 370 mm

Technical Data

Page 27: R & D English GeneralBook 2009

Technical Details

WAFER SHEET COOLER - SC Series

Different Sizes of wafer sheet in mm SC6- 470X350

DimensionsLengthWidthHeight

4000 mm1100 mm2800 mm

Passage Height

0.12 IN

Stainless steel / All over

Net WeightGross Weight

Shipping Volume

Connected Load (Kw)

Frame Constructed

0.37 OUT

Sheet Coolers are used to cool the baked wafer sheets in ambient air. The baked wafer sheets enter the Arch Sheet Cooler. Where uniform cooling & stress relieving takes place. They are then fed to the creaming machine for further process.

The wafer sheet cooler is designed in the form of an arch so that operator can supervise several machines and move from one to other with out hindrance.

The carrier brackets, guide plates, and all other components of the unit coming into contact with the product are fabricated from stainless steel. Wear-resistant plastic rails are used to

The cooler is fabricated from modular components thus allowing the length, width and carrying capacity to be varied easily and as required.

27

Model SC-6

700 Kgs900 Kgs

12 CBM

1700 mm

Wafer Sheets up to a size of 470 X 290 mm can be handled by these type of arch coolers and can be custom designed as per client’s requirement.

The wafer sheets are fed into pairs of metallic wire brackets which are positioned to each other. The wire brackets are fastened to a pair of endless roller chains forming an endless chain of holders. Sensing device notes when a sheet has been placed in a bracket and signals the motor to advance the chain one step so that an empty bracket awaits the next wafer sheet.

guide the carrier chain.

Page 28: R & D English GeneralBook 2009

SC4 SeriesSheet Cooler

SC SeriesSheet Cooler

Technical Details

28

Different Sizes of wafer sheet in mm

SC5- 470X350

Over all LengthWidthHeight

4150 mm1000 mm2650 mm

Passage Height 1700 mm - -

0.6 Kw

Stainless steel /MS Frame work / Cladding

Net WeightGross Weight

510 Kgs710 Kgs

Shipping Volume 8 CBM

Connected Load

Frame Constructed

SC4- 350X470

0.5 Kw

210 Kg

5.5 CBM

2400 mm1020 mm 2250 mm

5.5 CBM

300 Kg

0.5 Kw

2700mm820-1020mm1900mm

SC5 Sheet Cooler

SC0-230X290SC1-270X370SC2-290X460SC3-350X470

SS SS

Page 29: R & D English GeneralBook 2009

Cream spreading machines can apply a wide range of creams to all kinds of wafer sheets. Normally these machines operate either on contact system or film system.

CR6 Machine - With Spiral book maker

The uncreamed top sheet passes the spreading roller without contact due to cam-controlled lowering of the spreading table. After spreading, wafer blocks are formed out of two to seven wafer sheets with the spiral stacker. There the wafer sheets get maximum support and are stacked. Even delicate wafer sheets with heavy creams can be processed. Exact block formation guarantees a minimum of cutting residue in the following cutting process. The requested number of cream layers is set by a selector switch and electronically controlled by light barriers.

Spreading machines spread an exact amount of fat cream onto the wafer sheets and automatically stackthe requested number of spread sheets together with the un creamed top sheet into a wafer block. A thermostat allows to heat the cream spreading roller as well as the counter-roller up to an exact temperature. The speed of the two rollers and of the spreading belt can be variably adjusted,

The desired thickness of the individual cream layers is obtained by regulating the speed and the distance between the rollers. It prevents the cream from being spread in front of the wafer(cream wedge), which allows efficient spreading of cream. A paddle in the cream hopper provides for uniform distribution of the cream on the spreading roller. Flexible sealing lips in the cream hopper prevent leakage of liquid creams when the

CR5 is a high efficient machine.

Contact system allows the application of very thin layers of cream and the processing of liquid cream. The spreaderhead is lowered so far by means of a hand wheel, so that the fluted spreading roller touches the wafer sheet to be spread. The swinging pressure roller located below the conveyor belt is adjusted in such a way that the conveyor belt presses the wafer sheet against the spreading roller.

The spreading rollers are heated by electricity and the heating is accurately adjustable. The number of revolutions made by the spreading rollers as well as the speed of conveyor belt are infinitely variable independent of each other.

The CR5 is a high-efficiency machine. 300 books can be spread and put together to make wafer blocks, of up to five sheets; in one hour. The desired quantity of the cream layers can be adjusted by means of a counting device. A stacking device puts the spread sheets together to make a wafer block.The machine has a spreading unit which operates using a contact system (3).

WAFER CREAMING MACHINE

independently of each other.

machines is out operation.

Pressure must be equal from both sides.

CR5 Machine - With Linear book maker

29

Page 30: R & D English GeneralBook 2009

Technical Data

455mm

1.5

2135X615X1370

450

550

4.25

Wafer Sheets per minute( max)

Electrical Load (Kw)

Net weight (appr.kg)

Net export packing (kg)

Shipping space (appr.m3)

Width of spreading roller

Size of the machine (approx)Length X Width X Height

285mm

2.5

2900x650x1400

650

3.0

36-40 (Max) 36-40 (Max)

3.5 5

1950x1250x1550

2700x1250x1550

900

700700

900 1200

4.0 4.0

18 (Max)15

Size of the Wafer Sheet273x373 290x460 290x460 350x500

2135x615x1370

600

290x460

462mm 462mm330mm

15

1.5

800

1.8

CR4 CR6-1* CR6-2*ACR

1 2 3 4

1. Film Method 2. Reverse Film Method3. Contact Method 4. Film Method for Hollow Wafers

ACR - Semi Automatic

This machine is used for the automatic spreading of wafer sheets with fat cream by the contact system, for the manual wafer block formation & for the automatic wafer sheets with the sizes 230mm X 240mm.

CR4 Machine - Semi Automatic

Cream Spreading Machines type CR4 can apply a wide range of creams to all kinds of wafer sheets up to a width of 480 mm. Normally these machines operate on the contact system but can also be supplied with an additional device for creaming by the film system. The spreading head contains a grooved spreading roller and a counter roller. Spreading roller are heated and thermostatically controlled. These two rollers are driven by an infinitely variable speed motor in opposite directi-ons to obtain the desired quantity of cream, Spreading

30

CR5*

*Pneumatic connection required

270x370

360mm

Page 31: R & D English GeneralBook 2009

“WC5” Machine

“WC4” Machine“WC3” Machine

WAFER CUTTING MACHINE

Operation

A number of wafer blocks having together a height of about 70 mm are put between pressing piece and cutting frame of the first table and lightly pressed to the pressing piece as well as to the striking point. It is necessary that the block lie at the striking point if both sides of the block are to be cut evenly. If after the first cut, it shows that the two waste strips are not equally wide; this can be corrected by adjusting the striking point.During practical operations it has shown that the width of the waste strip should be about 5mm, which is absolutely necessary if the entire block is to be cut cleanly.

We manufacture a series of cutting machines, WC machine can handle different sizes of wafer sheets (230 mm x 290 mm, or larger). These are fully automatic machines for cutting flat and Hollow wafers filled with cream. These machine take over the cooled-down wafer blocks coming from the cooling device or creaming machine and cut them into required number of blocks. In the cutting operation the wafer book are first pushed through one set of cutters and then at a right angle (perpendicular) through a second set of cutters. Fixed and tensioned cutting wires in removable frames are used. Changeover to other cutting sizes is facilitated by quickly and easily changing the cutting frames and pushers. These machines are designed for high-capacity plants.

They occupy less space.

Wafer Distributor

For chocolate enrobed products we could also offer as an option of Wafer Distributor for our wafer cutting machines

31

“WCM” Machine

Page 32: R & D English GeneralBook 2009

Machine Variables

Size of the Wafer (Possible)

Stack Height (mm)

Minimum Cutting Width (mm)

Cutting Wire (spring steel in mm)

Connected load (Kw)

Dimensions (mm)

Length

Width

Height

Net weight (appx. Kgs)

Shipping volume (CBM)

290x460350x470230x290 270x370

10 to 70 10 to 70 70

16 16 16

0.5

1.5

0.5

1.5

0.5

1.5

1700 1700 1700

940 940 1600

1150 1150 1200

650 650 310

2 2 4

70

16

0.5

1.5

1700

1600

1200

310

4.5

Technical Data

470x350

70

18

0.5

1.5

2400

1700

1200

480

4.5

290x460350x470

Wafer cutting Machines with feeding deviceWafer cutting Machines without feeding device

WC1 WC4*WC2 WC3 WC5*

A-1 A-2

A-3 A-4

B-1 B-2

B-3 B-4

32

WCM

270x370

10 to 70

16

0.5

1450

1130

675

110

1

*Pneumatic connection required

Possible Cutting Layouts

Page 33: R & D English GeneralBook 2009

Cooling Process

The cooling unit is a refrigerated system, designed for continuous duty cycle working. The system consists of air-cooled single stage Hermitically sealed compressor based cooling unit. Refrigeration gas is ozone friendly (min ODP); HCFC R-22 and with forced air circulation. The compressor is mounted on vibration isolators.

Cooling Unit

Book Cooler is a machine used for cooling the cream between the wafer books before they enter the cutting machine. The cooling capacity can be changed according to the product requirement & capacity required. The wafer book cooler BC-Series machine is a compact design, fabricated from modular sections. This unit is developed by a combination of a number of modules & will provide required cooling time and also fit in the space available. The bracket, guide plates, and all other parts coming into contact with the product are fabricated from stainless steel. After spreading the cream on the wafers and completing the preparation of wafer book, it must be cooled in order to harden and set the cream prior to cutting. Partially setting the cream is required for clean cutting & in turn clean cutting is required for clean packing. The movement of wafer books can be watched through the windows provided on the inlet and outlet of the tunnel. The wafers are passed for following process either to a cutting device or to an intermediate container.

Technical Details

WAFER BOOK COOLER

33

Wafer Book Sizes (mm) 230X290270X370

290x460

Electrical Load (Kw) 10Kw 10Kw

Refregiration (kcal/hr) 5000 5000

LengthHeightWidth

3700780

2050

4850780

2050

Shipping Space in CBM 7 8

Machine Variables BC1 BC2 BC5

290X460470X350

18.5Kw

10000

6000780

205010

Dimensions (mm)

Page 34: R & D English GeneralBook 2009

TM0 (standard) TM2 (standard) TM3 (standard) TM3 Sp(with control panel)

SUPPORTING EQUIPMENTBATTER MIXER

BM- 3 RS

Features of MP100

MP100 is a sophisticated mixing plant in which an extra intermediate holding tank is provided along with the mixer.The selector Switch is provided for a variable mixing time. When mixing is complete the mixer shuts it self off autom-atically and the batter is pumped into an intermediated holding tank. A stirring device is supplied in the holding tank also. From this holding tank the batter can be contin-uously pumped to the batter depositing station. Batter Pump is easily accessible, easy to clean, made of Stainless Steel.

Batter Mixing

Batter mixer TM0 TM2 TM3 MP100

Tank Capacity 25 lts 65 lts 95 lts 100 lts

Connected load in Kw (3 phase) 0.75 1.2 2.2 4.5

Length (mm)

Width (mm)

Height (mm)

450 780 900 1625

600 740450 780

1000 1600 1400 1690

Technical Details

R&D Engineers has a series of mixing plant depending on the capacity of batter required to be made. Primary requirement for the production of quality batter is that all ingredients must be fully mixed together so that the batter will be homogeneous. The particularly carefully mixing procedure is achieved by the strong vertical currents induced in the batter. In the mixer center, the batter is induced to flow in the downward direction; on the periphery, the batter then flows in the upward direction. The batter mixer is used for the fully automatic production of batter for feeding one or more Baking Plants either manual/automatic. Consistent batter is required for quality products (cones/wafers). The age of the batter, or the time between mixing and use, has also a marked and effect on the sheet quality. Thus, to insure that the Automatic Wafer Baking Machines are being supplied with batter that is always fresh, it is important to prepare smaller batches at a time.

Net Weight (apprx) 50Kgs 70 Kgs 90 Kgs 200 Kgs

BM-3 RS

100 lts

3.2

1170

660

1270

115 Kgs

Mix Plant - MP 100

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Page 35: R & D English GeneralBook 2009

RS - TUBE ROLLING STATION

We supplies automatic Tube Rolling Station for best quality and precise rolled sugar wafer tubes. The Rolling machines are designed with latest technical standards for an economical results.

Technical Data:

**Variable Cutting Length

35

Used along with RS / RSCM Series Machines

Automatic Ejection

Cutting Device

Dimensions(MM)

Length

Width

Height

Shipping Weight (Gross)

Weight (Net)

No. Of Stations

Size of Cuts

Connected Load in KW

Speed

1

16 X 35 MM

0.37

138 RPM

1100.0

600.0

1020.0

90.0 Kg

138.0 Kg

Sheet Diameter

Tube Diameter

Rolling Time

Max 175 MM

Min 16 MM

8 - 10 Seconds

Page 36: R & D English GeneralBook 2009

Replacement Moulds & Dies offered for all plants

Exchange baking plate for Wafer Plants

Exchange baking moulds for Cone Plants

* Submit actual plant specimen or detailed drawing.** A huge library of international designs in our database.

36

Page 37: R & D English GeneralBook 2009

Batter PreparationWheat Flour,Sugar,Emusified Oil and

Water make the batter in a couple of minutes.

Pouring the BatterPour the batter on the heated plate and shut

it.The baking takes about 45-120* seconds.

Remove with the knifeRemove the hot waffle sheet and roll it on the

Wooden roller or Nylon roller

Manual RollingWooden roller

for manual rolling.Ideal to try new sizes

How to Make ?

Waffle Cone probably the hottest item in the ice cream business today. Whether its Vanilla or Chocolate with Ice Cream, Yogurt or soft server; waffle cone increases frozen desserts sales 25% to 50%.

To maximize sales of Ice Cream / Sundaes you need both a great taste in cone itself, plus good aroma to attract people tobuy this freshly baked Ice Cream Cone. You’ll probably sell twiceas many certainly more, when you have the ACTION and AROMA. The aroma of freshly baked waffle attract the

WAFFLE CONE MAKER (RSCM)

RSCM: Model 100Single Plate220v, 1.5kwCapacity:

50 cones* per hour

That’s the key.

customer’s attention immediately.

Manual Cup Punching Machine

Exciting Possibilities . . .

37

Page 38: R & D English GeneralBook 2009

Belgian Waffle probably the hottest item in the ice cream business today. Whether its Vanilla or Chocolate with Ice Cream, Yogurt or soft server; waffle cone increases frozen desserts sales 25% to 50%.

To maximize sales of Ice Cream / Sundaes you need both a great taste in cone itself, plus good aroma to attract people to buy this freshly baked Ice Cream Cone. You’ll probably sell twice as many certainly more, when you have the ACTION and AROMA. The aroma of freshly baked waffle attract the customer’s attention immediately.

BELGIAN WAFFLE BAKER (RSCM)

Exciting Possibilities . . .

38

Batter PreparationWheat Flour, Sugar,

Emulsified Oil and Water make the batter

in a couple of minutes.

Heating

.

The initial heating of the plates

takes about 15-20 minutesLightly Brush with Fat.

Pouring the BatterPour the batter on the heated

plate and shut it.The baking takes

about 60-120* seconds.

Remove with the knifeRemove the hot waffle sheet.

How to Make ?

Design 01(Round)

Design 02(Heart)

Page 39: R & D English GeneralBook 2009

Export Excellence Performance Award

CE Certified

ISO 9000:2001 Certified

39

Page 40: R & D English GeneralBook 2009

R & D Engineers

An ISO 9001:2000 Company

‘R&D’ Family World Wide

A-41, IDA Kukatpally, Phase II, Road No.4,

Via I.E.Gandhi Nagar, Hyderabad - 500037. INDIA.

Phone : +91-40-23079121 / 7985

Fax : +91-40-23078668

E-Mail : in fo@rndwafers .com

The technical data and illustrations are subject to change without notice

Quality Policy

The company is committed to achieve customer satisfaction &market leadership by

Timely delivery and quality product.

Reliable and cost effective product.

Ultimate quality service and competitive prices.

Spontaneous changes as per customer feedback.

Team work and continual improvement.

Effective utilization of resources.

En

glis

h -

V_

5.0

- 2

00

9

We are here

All rights reserved. No part of this brochure may be reproduced or transmitted in any form or by any means, electrical or mechanical including photocopying, recording or by any other form of information storage or retrieval system without permission in writing from the publisher.R&D Engineers adopts a policy of continues improvement and whilst every effort has been made to provide accurateand up to date information, the information contained in this brochure should be used for guidance purpose only and does not form part of any contract.