R_115_IPS2200_12X30_OD97_ID66

Date:Project:VersionContent:

R_115_V10_IPS2200_12X30_OD97_ID66.PrjPcb1.0SchematicSensor PCB LayoutSensor PCB 3D ModelBill of MaterialsPCB Manifacturing Requirements

20.11.2020

Sensor PCB Layer Stack

Target PCB LayoutTarget PCB 3D Model

Sensor PCB Placement

1

1

2

2

3

3

4

4

5

5

6

6

7

7

8

8

D D

C C

B B

A A

Sheet title

Project name

Size A3

Sheet 1 of 1

Version 1.0

Date 16.12.2020

File name R_115_V10_IPS2200_12X30_OD97_ID66.SchDoc

R_115_V10_IPS2200_12X30_OD97_ID66

R_115_V10_IPS2200_12X30_OD97_ID66.PrjPcb

B.GOMBORDrawn bySystem Application Team

SIN 14

SINN 13

COS 12RX34RX23RX12CSN_IRQ1

VDD 10

RX45

TX16

TX27

VDDA8

COSN 11

GND 9

IPS2

200

SCK_SCL 15SIO_SDA 16

U1

IPS2200

DGND

22RR4

22RR5

100pFC5

100pFC6

100pFC3

100pFC4

DGNDDGNDDGNDDGND

4K7R1

VDD_U1

1.6nFC1

DGND

47nFC12

47nFC13

47nFC14

47nFC15

VDD_U1

4K7R2

VDD_U1

4K7R3

VDD_U1

DGND DGND DGND DGND

SCK_SCL_U1

SIN_U1

SINN_U1

COS_U1

COSN_U1

VDD_U1

SIO_SDA_U1

470nFC8

100pFC9

RX12_U1

RX34_U1

TX_U1

CSN_IRQ_U1

1nFC7

DGND

TX2_U1

TX1_U1

LEGENDComponent Size 0603Component Size 0402Net Name

1nFC16

DGND

1nFC17

DGND

470nFC11

100pFC10

DGNDDGND

1.6nFC2

DGND

HS2X5M

12

34

56

78

910

J1

3

12D1

ESDCAN0X

100pFC19

100pFC18

100pFC21

100pFC20

DGND DGND DGND DGND

Component Placement Suggestion

Place close to IPS pins Place close to IPS pins

DGND

3

12D2

ESDCAN0X

DGND

3

12D3

ESDCAN0X

DGND

Place close to Header pins

1uFC22

5R6

R6

DGND DGND

VDD_IN1

SIN_U1 SINN_U1 COS_U1 COSN_U1 VDD_IN1VDD_IN1

Optional Component

Place next to Header pins

TP1

TP2

TP3

TP4

C_ADJ = To be adjusted according to coil incductivity. Calculate C_TX with the given formula.

Use dielectric strength Vr >= 50V capacitors for C7 + (C10 .. C22)

C_ADJ = 2 x C_TXIt´s recommended to use C0G or NP0 ceramic capacitors

C_ADJ C_ADJ

Designator Value Quantity FootprintD1, D2, D3 3 SOT23-BAT54XC7, C16, C17 1nF 3 C0402 3DC22 1uF 1 C0603 3DC1, C2 1.6nF 2 C0603 3DR1, R2, R3 4K7 3 R0402 3DR6 5R6 1 R0402 3DR4, R5 22R 2 R0402 3DC12, C13, C14, C15 47nF 4 C0603 3DC3, C4, C5, C6, C18, C19, C20, C21

100pF 8 C0402 3D

C9, C10 100pF 2 C0603 3DC8, C11 470nF 2 C0603 3DJ1 HS2X5M 1 T821M110A1S100CEU-BU1 IPS2200 1 TSSOP16_NVT02006

PCB Manufacturing requirements

PCB Base materialFinal PCB Thickness

Number of copper layers

Thickness of copper coatingFinal coverMinimal copper width

Slotted holes

Project Name R_115_V10_IPS2200_12X30_OD97_ID66.PrjPcb

FR-41.55mm +/-10%

4

35umENIG0.2mm

Yes, see milling paths

Solder mask color GreenSilk screen color White on TOPPanel size 142x98mm

Via hole/pad diameter 0.3/0.6mmMinimal copper to copper distance 0.15mm

Layer Board Layer Stack Name Material Thickness Constant1 Top Paste2 Top Overlay3 Top Solder Solder Resist 0,030mm 3,54 Top Layer Copper 0,035mm5 Dielectric 2 PP-006 0,110mm 4,296 Layer 1 Copper 0,035mm7 Dielectric 3 PP-006 1,130mm 3,968 Layer 2 Copper 0,035mm9 Dielectric 1 FR-4 0,110mm 4,29

10 Bottom Layer Copper 0,035mm11 Bottom Solder Solder Resist 0,030mm 3,512 Bottom Overlay13 Bottom Paste

Height : 1,550mm

Board Stack ReportLayer StackStack Up