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Quality and Reliability Report

First Quarter 2018

Document ID : 18Q1_QR_Report.doc

Quarterly Quality & Reliability Report | 18Q1_QR_Report-01

Pg. 2/80

Table of Contents

Quality and Reliability Report Overview .............................................................. 3

Average Outgoing Quality (AOQ) ......................................................................... 4

Part Numbers by Fab Technology ........................................................................ 6

Failure Rate Estimation by Fab Technology ..................................................... 14

Flash Reliability Summary by Fab Technology ................................................. 51

Reliability Monitors .............................................................................................. 60

Revision History ................................................................................................... 80


Pg. 3/80

Quality and Reliability Report Overview

Silicon Labs is pleased to share this Quality and Reliability Report with our customers. It provides the latest quality

performance data along with failure rate estimates and reliability monitor data (Integrated Circuit only. Target to add

Module by Q3,2018). These data are collected on a continual basis as qualification, production and reliability monitors

are completed. The report is published and updated quarterly to provide customers visibility to the most recent

information. The Quality Trend charts on page 5 are shown on a rolling five-year basis. All other reports include data

from the previous four quarters on a rolling, one-year basis.

The report provides data covering:

Estimates of shipped product quality

Long-term operating life estimates

Mean time to failure estimates

Data retention life estimates

Reliability monitor results

Silicon Labs is registered to ISO 9001:2015, ISO14001:2015 and maintained certification to ISO/TS 16949:2009 from

January 2008 to January 2015. Due to a change in the ISO/TS 16949 certification eligibility requirements in 2013,

fabless semiconductor companies are no longer eligible for certification. Silicon Labs will remain compliant to ISO/TS

16949 and continues to be audited to this standard during both internal and external annual audit cycles. Silicon Labs

only uses ISO/TS 16949 certified suppliers.

Silicon Labs is committed to quality excellence. That commitment is demonstrated by extensive product and process

qualification. Each product undergoes extensive qualification testing prior to production release. Silicon Labs qualifies

integrated circuit products using JEDEC JESD47, Stress-Test-Driven Qualification of Integrated Circuits or AEC-Q100,

Stress Test Qualification for Integrated Circuits, as appropriate.

Once a product is qualified, on-going product quality and reliability is verified through monitoring programs. Monitors

are scheduled to periodically sample wafer fab technologies and package technologies. The results are published in

this report. Any failures are used to drive corrective action and process and product improvement.

We hope you find this report useful. Please let us know if you have any specific questions or suggestions.

All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs.


Pg. 4/80

Average Outgoing Quality (AOQ)

Overview

Two elements of product quality are reported – electrical quality and mechanical/visual quality. We measure electrical

quality by taking a sample (monitor) of production parts and retesting the sample to the datasheet limits (see Figure 1).

The sample electrical test may be performed at an alternate test temperature to verify part performance across the

datasheet temperature range. This sample method identifies defects introduced at the test process step or that have

escaped the test process. Any failures drive corrective actions and product/process improvements.

Visual/Mechanical quality is estimated by sample inspection of the completed product prior to final pack. Inspection

items cover a broad range of characteristics and include mark, count, label, cover tape workmanship, moisture barrier

bag integrity, lead location, part placement, and many other general workmanship items required for customer

satisfaction and product protection during shipment. Any failures drive corrective actions and process improvements.

Figure 1 – Quality Monitor Flow

Test Scan FGI Ship

Order Fulfillment

Mechanical DPPM Electrical DPPM

Assembly


Pg. 5/80

Electrical and Visual / Mechanical Outgoing Quality Graphs


Pg. 6/80

Part Numbers by Fab Technology

Part Number Technology

5302X 55 nm

5XX 0.13 um

BGM11X 90 nm, embedded flash

BGM12X 90 nm, embedded flash

C8051F0XX 0.35 um, embedded flash



C8051F30X 0.35 um, embedded flash








C8051F37X 0.35 um, EEPROM








C8051TXXX 0.18 um, OTP

CF0XX 0.35 um, embedded flash



CF30X 0.35 um, embedded flash
















CP2101 0.35 um, embedded flash


CP2102N 0.18 um, embedded flash


CP2104 0.18 um, OTP

CP2105 0.18 um, OTP

CP2107 0.18 um, OTP


CP2109 0.18 um, OTP

CP211X 0.18 um, OTP


CP213X 0.18 um, OTP

CP22XX 0.35 um, embedded flash

CP240X 0.18 um

CP250X 0.35 um, embedded flash

CP254X 0.18 um, OTP

CP26XX 0.18 um, embedded flash

CP4000 0.13 um

CPTXXXX 0.18 um, embedded flash

CTXXX 0.18 um, OTP

CY2815 0.6 um - 1.0 um

CYWXXX 0.45 um - 0.5 um

EFM32G2X 0.18 um, embedded flash



EFM32GG1X 90 nm, embedded flash

EFM32GG2X 0.18 um, embedded flash





Pg. 7/80


EFM32HG 0.18 um, embedded flash

EFM32JG 90 nm, embedded flash

EFM32LG 0.18 um, embedded flash

EFM32PG 90 nm, embedded flash

EFM32TG108X 0.18 um, embedded flash


EFM32TG11BX 90 nm, embedded flash



EFM32WG 0.18 um, embedded flash

EFM32ZG 0.18 um, embedded flash

EFM8X 0.18 um, embedded flash

EFR32BGX 90 nm, embedded flash

EFR32FGX 90 nm, embedded flash

EFR32MG12PX 90 nm, embedded flash

EFR32MG13P6X 90 nm, embedded flash



EFR32MG13P8X 90 nm, flash

EFR32MG14PX 90 nm, embedded flash

EFR32MG1B1X 90 nm, embedded flash



EFR32MG1B6X 90 nm, flash


EFR32MG1B7X 90 nm, flash







EFR32MG1V1X 90 nm, embedded flash

EM25X 0.18 um, embedded flash


EM31X 0.11 um





EZR32X 0.11 um

EZR32X 0.18 um, embedded flash

IA10XX Diode

IA12XX 0.6 um - 0.8 um BiCMOS



IAP4XX 0.6 um - 0.8 um BiCMOS

IAP6XX 0.6 um - 1.0 um

IAP7XX 0.6 um - 1.0 um

IAP86X 0.6 um - 0.8 um BiCMOS

IAP87X 0.315 um - 0.35 um

IAP90X 0.6 um - 1.0 um

IAP91X 0.6 um - 0.8 um BiCMOS

IAP93X 0.6 um - 1.0 um

S3CX 0.18 um, embedded flash

S3UX 0.18 um, embedded flash

Si100X 0.18 um, embedded flash

Si100X 0.18 um, RF


Si101X 0.18 um, RF


Si102X 0.18 um, RF


Si103X 0.18 um, RF

Si106X 0.11 um


Si108X 0.11 um


Si1102 0.6 um - 0.8 um BiCMOS

Si1102 Diode

Si1120 0.6 um - 0.8 um BiCMOS

Si1120 Diode

Si1132 0.18 um, OTP

Si1133 0.18 um

Si114X 0.18 um, OTP

Si115X 0.18 um

Si117X 0.18 um


Pg. 8/80


Si118X 0.18 um

Si210X 0.13 um

Si2111 0.11 um

Si2113 0.11 um

Si2115 0.11 um

Si2124 55 nm

Si2127 55 nm

Si2128 55 nm

Si2136 0.11 um

Si2137 55 nm

Si2138 55 nm

Si2140 0.11 um

Si2141 55 nm

Si2143 0.11 um

Si2144 55 nm

Si2145 0.11 um

Si2146 0.11 um

Si2147 55 nm

Si2148 55 nm

Si2150 55 nm

Si2151 55 nm

Si2153 0.11 um

Si2155 0.11 um

Si2156 0.11 um

Si2157 55 nm

Si2158 55 nm

Si2159 55 nm

Si2160-X 55 nm

Si2161-X 0.11 um

Si2162-X 55 nm

Si2163-X 0.11 um

Si2164-X 55 nm

Si2165-X 0.11 um

Si2166-AXX 0.11 um

Si2166-BXX 55 nm

Si2166-CXX 55 nm

Si2166-DXX 55 nm

Si2167-AXX 0.11 um


Si2167-BXX 55 nm

Si2167-CXX 55 nm

Si2167-DXX 55 nm

Si2168-X 55 nm

Si2169-X 55 nm

Si216XX-X 55 nm

Si2170 0.11 um

Si2171 0.11 um

Si2172 0.11 um

Si2173 0.11 um

Si2176 0.11 um

Si2177 55 nm

Si2178 55 nm

Si2180 55 nm

Si2181 55 nm

Si2182 55 nm

Si2183 55 nm

Si2185 0.11 um

Si2190 55 nm

Si2191 55 nm

Si2196 0.11 um

Si220X 0.315 um - 0.35 um

Si221X 0.25 um

Si2400 0.45 um - 0.5 um

Si2401 0.18 um

Si2403 0.18 um

Si2404-C 0.18 um

Si2404-D 0.11 um

Si2415-D 0.11 um

Si2417-D 0.18 um

Si2417-E 0.11 um

Si241X-A 0.18 um

Si241X-B 0.18 um

Si241X-C 0.18 um

Si241X-F 0.18 um

Si241X-G 0.18 um

Si241X-H 0.18 um

Si242X 0.18 um


Pg. 9/80


Si2433 0.18 um

Si2434-C 0.18 um

Si2434-D 0.11 um

Si2435-B 0.18 um

Si2435-C 0.18 um

Si2435-D 0.18 um

Si2435-E 0.11 um

Si2435-F 0.11 um

Si2436 0.18 um

Si2437 0.18 um

Si2438 0.18 um

Si2439 0.11 um

Si2456 0.18 um

Si2457-C 0.18 um

Si2457-D 0.11 um

Si2457-FT 0.18 um

Si2493-C 0.18 um

Si2493-D 0.11 um

Si2494 0.11 um

Si2535 0.25 um

Si3000 0.45 um - 0.5 um

Si3005 0.25 um

Si3006 0.25 um

Si3007 0.25 um

Si3008 0.25 um

Si3009 0.25 um

Si3010 0.25 um

Si3011 0.25 um

Si3012 0.45 um - 0.5 um

Si3014 0.45 um - 0.5 um

Si3015 0.45 um - 0.5 um

Si3016 0.45 um - 0.5 um

Si3017 0.25 um

Si3018 0.25 um

Si3019 0.25 um

Si302X 0.45 um - 0.5 um

Si3050-D 0.25 um

Si3050-E 0.18 um


Si3052 0.25 um

Si3054 0.25 um

Si3056 0.25 um

Si306X 0.25 um

Si307X 0.25 um

Si308X 0.25 um

Si31XX 0.25 um

Si320X High Voltage

Si3210 0.45 um - 0.5 um

Si3211 0.45 um - 0.5 um

Si3215 0.45 um - 0.5 um

Si3216 0.45 um - 0.5 um

Si3217X 0.18 um

Si3217X High Voltage

Si3218X 0.18 um


Si3219X 0.18 um


Si3220 0.45 um - 0.5 um

Si3225 0.45 um - 0.5 um

Si3226-X 0.18 um

Si3226X-C 0.18 um

Si3226X-C High Voltage

Si3227 0.18 um

SI3228X 0.18 um

SI3228X High Voltage

Si3230 0.45 um - 0.5 um

Si3232 0.45 um - 0.5 um

Si3233 0.45 um - 0.5 um

Si3238 High Voltage


Si324X 0.18 um

Si3291X 0.25 um

Si340X High Voltage

Si3450 0.18 um

Si3452 0.18 um, OTP

Si3452 High Voltage

Si3453 0.18 um, OTP


Pg. 10/80


Si3453 High Voltage

Si3454 0.18 um, OTP

Si3454 High Voltage

Si3455 High Voltage

Si3456 0.35 um, embedded flash

Si3456 High Voltage

Si3457 0.18 um, OTP

Si3457 High Voltage

Si3458 0.18 um, OTP

Si3458 High Voltage

Si3459 0.18 um, OTP

Si3459 High Voltage

Si346X 0.18 um, OTP


Si35XX High Voltage

Si401X 0.13 um

Si402X 0.6 um - 0.8 um BiCMOS

Si403X 0.18 um, RF

Si405X 0.11 um

Si406X 0.11 um

Si41XX 0.315 um - 0.35 um

Si4310 0.13 um

Si4311 0.13 um

Si4312 0.13 um

Si4313 0.18 um, RF


Si433X 0.18 um, RF

Si435X 0.11 um

Si436X 0.11 um


Si4430 0.18 um, RF

Si4431 0.18 um, RF

Si4432 0.18 um, RF

Si4438 0.11 um

Si445X 0.11 um

Si446X 0.11 um

Si46XX 55 nm

Si4708 0.11 um


Si4709 0.11 um

Si470X-C19 0.11 um

Si4732-AXX 0.11 um

Si474X 0.13 um

Si475X 0.11 um

Si476X 0.11 um

Si477X 0.11 um

Si4780 0.13 um


Si479XX 55 nm

Si47XX-B1X 0.13 um

Si47XX-B2X 0.13 um

Si47XX-B3X 0.13 um

Si47XX-C3X 0.13 um

Si47XX-C4X 0.13 um

Si47XX-D 0.11 um

Si482X 0.11 um

Si4830 0.13 um

Si4834 0.13 um

Si4836 0.11 um

Si483X-B 0.11 um

Si484X 0.11 um

Si49XX 0.6 um - 0.8 um BiCMOS

Si500 0.13 um

Si5010 0.25 um

Si50122 0.13 um

Si50122 0.18 um

Si5013 0.25 um

Si502X 0.25 um

Si504X 0.13 um

Si510X 0.15 um

Si511X 0.15 um

Si512X 0.18 um

Si5211X 0.18 um

Si5213X 0.18 um, RF

Si5214X 0.18 um, RF

Si5216X 0.18 um, RF

SI522X 0.18 um


Pg. 11/80


Si53019 0.18 um, RF

Si5301C 0.13 um

Si5306 0.13 um

Si53102 0.18 um

Si53106 0.18 um, RF

Si53108 0.18 um, RF

Si5310-C 0.25 um

Si5311X 0.18 um, RF

Si5315X-A 0.18 um, RF

Si5315X-C 0.13 um

Si5316 0.13 um

Si5317 0.13 um

Si5319 0.13 um

Si5320 0.18 um

SI53212X 0.18 um

SI5321-H 0.25 um

SI5322 0.13 um

SI5323 0.13 um

SI5324 0.13 um

SI5325 0.13 um

SI5326 0.13 um

SI5327 0.13 um

SI5328 0.13 um

Si5330X 0.13 um

Si5331X 0.13 um

Si5332X 0.13 um

Si5334X 0.13 um

Si5335X 0.13 um

Si5336X 0.13 um

Si5338X 0.13 um

SI5339X 0.13 um

Si534X 55 nm

Si535X 0.13 um

Si5364 0.25 um

Si5365 0.13 um

Si5366 0.13 um

Si5367 0.13 um

Si5368 0.13 um


Si5369 0.13 um

Si537X 0.13 um

Si5380X 55 nm

Si5381X 55 nm

Si5382X 55 nm


Si5383X 55 nm


Si5384X 55 nm

SI5386X 55 nm

Si5409X 0.18 um, OTP

Si7005 0.18 um, RF






Si703X 0.18 um, OTP

Si705X-A10 0.18 um, OTP

Si705X-A20 0.18 um, embedded flash

Si72X 0.18 um

Si803X 0.25 um

Si804X 0.25 um

Si805X 0.25 um

Si806X 0.25 um

Si822X 0.25 um

Si822X High Voltage

Si823X 0.25 um

Si823X High Voltage

Si824X 0.25 um

Si824X High Voltage


Si826X 0.25 um

Si826X High Voltage

SI8271-D-YDI 0.25 um

SI8273-D-IDI High Voltage

Si827X 0.25 um

Si827X High Voltage


Pg. 12/80


Si828X 0.25 um

Si828X High Voltage

Si83XX 0.25 um

Si84XX 0.25 um

Si850X 0.315 um - 0.35 um

Si851X 0.315 um - 0.35 um

Si854X 0.6 um - 1.0 um

Si86XX 0.25 um

SI8700-A1-IDI 0.25 um

SI8702-A1-IDI High Voltage

SI8711-IDI 0.25 um

SI8713-IDI High Voltage



Si87XX 0.25 um

Si87XX High Voltage

Si88XX 0.25 um

Si890X 0.18 um, OTP

Si890X 0.25 um

Si892X 0.25 um

SI8SX 0.25 um

SI8SX High Voltage

SiM3XXXX 0.18 um, embedded flash

SL151 0.18 um, RF

SL15100CZC-1 0.35 um, EEPROM

SL153 0.18 um, RF

SL15300DZC-56 0.35 um, EEPROM

SL15300EZC-70 0.35 um, EEPROM

SL15300EZC-75 0.35 um, EEPROM

SL158 0.18 um, RF

SL16XX 0.18 um, RF

SL188X 0.18 um, RF

SL2304 0.18 um, RF

SL2305 0.18 um, RF

SL2309 0.18 um, RF

SL23EP 0.18 um, RF

SL281XX 0.18 um

SL2850 0.25 um


SL2854 0.25 um

SL2861 0.18 um, RF

SL2864 0.25 um

SL2874 0.18 um

SL28770 0.18 um

SL28773 0.18 um

SL28774 0.18 um

SL28775 0.18 um, RF

SL28776 0.18 um, RF

SL28779 0.18 um

SL28DB 0.25 um

SL28EB636 0.18 um

SL28EB717 0.18 um

SL28EB719 0.18 um

SL28EB720 0.18 um

SL28EB721 0.18 um

SL28EB725 0.18 um, RF

SL28EB731 0.18 um, RF

SL28EB735 0.18 um, RF

SL28EB740 0.18 um

SL28EB742 0.18 um

SL28EB745 0.18 um

SL28EB774 0.18 um

SL28EB781 0.18 um, RF

SL28EB797 0.18 um, RF

SL28PCIE06 0.18 um

SL28PCIE10 0.18 um

SL28PCIE14 0.18 um, RF

SL28PCIE16 0.18 um


SL28PCIE2 0.18 um

SL28PCIE30 0.18 um


SL28SR 0.18 um

SL3800 0.18 um, RF

SL38020 0.18 um, OTP

SL3816 0.18 um, RF

SL38160CZC-30B 0.35 um, EEPROM


Pg. 13/80


TS1001 High Voltage

TS1002 High Voltage

TS1003 0.18 um

TS1004 High Voltage

TS1005 0.18 um

TS11XX 0.6 um - 1.0 um

TS12XX High Voltage

TS3001 0.18 um

TS3002 0.18 um

TS3003 High Voltage

TS3004 High Voltage

TS3005 High Voltage

TS3006 High Voltage

TS3300 High Voltage

TS331X 0.18 um

TS4XXX High Voltage


TS6XXX 0.6 um - 1.0 um

TS7XXX 0.18 um

TS9XXX 0.18 um

TSAXXXX 0.18 um

TSM12XX 0.18 um

TSM60XX 0.6 um - 1.0 um

TSM91XX 0.18 um

TSM92XX 0.18 um

TSM93XX 0.18 um

TSM96XX 0.6 um - 1.0 um

TSM97XX 0.18 um

TSM98XX 0.18 um

TSM99XX 0.6 um - 1.0 um


Pg. 14/80

Failure Rate Estimation by Fab Technology

Failure in Time (FIT)

A long-term, steady-state failure rate is often required by circuit and system engineers for allocations of the failure rates

at the component level during system design. FIT, which stands for failure-in-time, is a widely-used term to describe

failure rates of electronic components, and as used here, represents the number of failures in a billion hours of

operation. FIT rates are reported in the following section as curves and in tables for specific temperatures and

assumptions.

Mean Time to Failure (MTTF)

Another way to express failure rates is by mean time to failure (MTTF). MTTF is the inverse of the FIT rate and is useful

for repair and maintenance planning. This relationship can be seen by examining the units of each measure: MTTF is

given in time/failure; FIT is given in failure/time. MTTF is reported in the tables following the FIT rate curves for each

specific fab technology.

Failure Rate Calculation Method

Long-term failure rates are estimated by applying the Arrhenius equation to data collected from long term operating life

tests. A confidence factor is applied based upon the sample size and number of failures to estimate the maximum

failure rate at a specific confidence level. The calculation details are provided in the table below each of the following

FIT rate curves.


Pg. 15/80

FIT Rate Curves and Data

Process – 55 nm


Pg. 16/80

Reliability FIT Calculations for temperature acceleration

Single Point Calculation for 55 nm

Variables: 90% 60% Confidence Level

Tja [C] 50 50 Junction Temperature at operating condition

Tsa [C] 125 125 Ambient Temperature at stress

Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise)

Ea 0.7 0.7 Energy Activation

D 1512 1512 Equivalent Devices stressed (Assuming 1000hrs per device)

H 1000 1000 Number of hours on stress

F 1 1 Number of failures

P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%]

Constants:

k 8.61E-05 8.61E-05 Boltzman's constant [eV/K]

Calculated Values:

Af 239.4 239.4 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))]

v 4.0 4.0 degrees of freedom [2(F+1)]

DH 1511904 1511904 Total device hours D*H

X2 7.8 4.0 Chi-Square Distribution Value

FIT 10.7 5.6 Failures in time [failures / 1xE9 hours]

=[X2/(2*AF*D*H)*1E9]

MTTF 9.3E+07 1.8E+08 Mean Time To Failure [hours] (Note: MTTF is 1/FIT)

MTTF 10621.3 20429.0 Mean Time To Failure [years] (Note: MTTF is 1/FIT)

FIT Estimation Curves for 55 nm

MTTF MTTF

Tja Af FIT (90%) FIT (60%) 90% (yrs) 60% (yrs)

25 1971.6 1.3 0.7 87484 168267

30 1257.7 2.0 1.1 55808 107341

35 814.1 3.2 1.6 36124 69481

40 534.4 4.8 2.5 23710 45604

45 355.4 7.2 3.8 15769 30331

50 239.4 10.7 5.6 10621 20429

55 163.2 15.8 8.2 7241 13926

60 112.5 22.9 11.9 4993 9603

65 78.5 32.8 17.0 3481 6696

70 55.3 46.5 24.2 2453 4718

75 39.3 65.4 34.0 1746 3357

80 28.3 91.0 47.3 1254 2413

85 20.5 125.5 65.2 910 1750

90 15.0 171.5 89.2 666 1280

95 11.1 232.4 120.8 491 945

100 8.2 312.4 162.4 365 703

105 6.2 416.6 216.6 274 527

110 4.7 551.5 286.7 207 398

115 3.5 724.8 376.8 158 303

120 2.7 945.9 491.8 121 232


Pg. 17/80

Process – 90 nm w/ embedded flash


Pg. 18/80


Single Point Calculation for 90 nm w/ embedded flash










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for 90 nm w/ embedded flash

MTTF MTTF


25 1971.6 1.0 0.5 114494 220217

30 1257.7 1.6 0.8 73038 140481

35 814.1 2.4 1.3 47277 90932

40 534.4 3.7 1.9 31030 59683

45 355.4 5.5 2.9 20638 39695

50 239.4 8.2 4.3 13900 26736

55 163.2 12.0 6.3 9476 18226

60 112.5 17.5 9.1 6534 12568

65 78.5 25.1 13.0 4556 8763

70 55.3 35.6 18.5 3210 6174

75 39.3 50.0 26.0 2285 4394

80 28.3 69.5 36.2 1642 3157

85 20.5 95.9 49.9 1191 2290

90 15.0 131.0 68.1 871 1676

95 11.1 177.6 92.3 643 1236

100 8.2 238.7 124.1 478 920

105 6.2 318.4 165.5 359 690

110 4.7 421.4 219.1 271 521

115 3.5 553.8 287.9 206 396

120 2.7 722.8 375.8 158 304


Pg. 19/80

Process - 0.11 micron


Pg. 20/80


Single Point Calculation for 0.11 micron










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for 0.11 micron

MTTF MTTF


25 1971.6 0.2 0.1 652224 1639002

30 1257.7 0.3 0.1 416067 1045552

35 814.1 0.4 0.2 269318 676780

40 534.4 0.6 0.3 176766 444203

45 355.4 1.0 0.4 117566 295436

50 239.4 1.4 0.6 79185 198988

55 163.2 2.1 0.8 53981 135650

60 112.5 3.1 1.2 37224 93542

65 78.5 4.4 1.8 25953 65218

70 55.3 6.2 2.5 18286 45951

75 39.3 8.8 3.5 13014 32703

80 28.3 12.2 4.9 9352 23500

85 20.5 16.8 6.7 6782 17043

90 15.0 23.0 9.2 4962 12470

95 11.1 31.2 12.4 3662 9202

100 8.2 41.9 16.7 2724 6846

105 6.2 55.9 22.2 2043 5133

110 4.7 74.0 29.4 1543 3878

115 3.5 97.2 38.7 1174 2951

120 2.7 126.9 50.5 900 2261


Pg. 21/80



Pg. 22/80












Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]




MTTF MTTF


25 1971.6 0.3 0.1 435980 838565

30 1257.7 0.4 0.2 278121 534937

35 814.1 0.6 0.3 180026 346262

40 534.4 1.0 0.5 118160 227268

45 355.4 1.5 0.8 78587 151154

50 239.4 2.2 1.1 52931 101808

55 163.2 3.2 1.6 36083 69403

60 112.5 4.6 2.4 24883 47859

65 78.5 6.6 3.4 17348 33368

70 55.3 9.3 4.9 12223 23510

75 39.3 13.1 6.8 8699 16732

80 28.3 18.3 9.5 6251 12023

85 20.5 25.2 13.1 4534 8720

90 15.0 34.4 17.9 3317 6380

95 11.1 46.6 24.2 2448 4708

100 8.2 62.7 32.6 1821 3503

105 6.2 83.6 43.5 1365 2626

110 4.7 110.7 57.5 1032 1984

115 3.5 145.4 75.6 785 1510

120 2.7 189.8 98.7 601 1157


Pg. 23/80



Pg. 24/80












Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]




MTTF MTTF


25 1971.6 11.2 4.5 10180 25581

30 1257.7 17.6 7.0 6494 16319

35 814.1 27.2 10.8 4203 10563

40 534.4 41.4 16.5 2759 6933

45 355.4 62.2 24.8 1835 4611

50 239.4 92.4 36.8 1236 3106

55 163.2 135.5 53.9 843 2117

60 112.5 196.5 78.2 581 1460

65 78.5 281.8 112.1 405 1018

70 55.3 400.0 159.2 285 717

75 39.3 562.0 223.6 203 510

80 28.3 782.1 311.2 146 367

85 20.5 1078.4 429.1 106 266

90 15.0 1473.9 586.5 77 195

95 11.1 1997.3 794.8 57 144

100 8.2 2684.7 1068.4 43 107

105 6.2 3580.6 1424.8 32 80

110 4.7 4739.6 1886.1 24 61

115 3.5 6228.7 2478.6 18 46

120 2.7 8128.9 3234.8 14 35


Pg. 25/80



Pg. 26/80












Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]




MTTF MTTF


25 1971.6 0.1 0.0 1660642 4173097

30 1257.7 0.1 0.0 1059357 2662101

35 814.1 0.2 0.1 685716 1723163

40 534.4 0.3 0.1 450068 1130994

45 355.4 0.4 0.2 299337 752216

50 239.4 0.6 0.2 201615 506647

55 163.2 0.8 0.3 137441 345381

60 112.5 1.2 0.5 94777 238170

65 78.5 1.7 0.7 66079 166054

70 55.3 2.5 1.0 46558 116997

75 39.3 3.4 1.4 33135 83266

80 28.3 4.8 1.9 23810 59834

85 20.5 6.6 2.6 17268 43394

90 15.0 9.0 3.6 12635 31751

95 11.1 12.2 4.9 9324 23430

100 8.2 16.5 6.5 6936 17431

105 6.2 21.9 8.7 5201 13070

110 4.7 29.1 11.6 3929 9873

115 3.5 38.2 15.2 2990 7513

120 2.7 49.8 19.8 2291 5757


Pg. 27/80

Process - 0.18 micron w/ embedded flash


Pg. 28/80


Single Point Calculation for 0.18 micron w/ embedded flash










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for 0.18 micron w/ embedded flash

MTTF MTTF


25 1971.6 0.2 0.1 649370 1631830

30 1257.7 0.3 0.1 414246 1040977

35 814.1 0.4 0.2 268139 673818

40 534.4 0.6 0.3 175993 442259

45 355.4 1.0 0.4 117051 294143

50 239.4 1.4 0.6 78839 198117

55 163.2 2.1 0.8 53744 135056

60 112.5 3.1 1.2 37061 93133

65 78.5 4.4 1.8 25839 64933

70 55.3 6.3 2.5 18206 45750

75 39.3 8.8 3.5 12957 32560

80 28.3 12.3 4.9 9311 23397

85 20.5 16.9 6.7 6752 16969

90 15.0 23.1 9.2 4941 12416

95 11.1 31.3 12.5 3646 9162

100 8.2 42.1 16.7 2712 6816

105 6.2 56.1 22.3 2034 5111

110 4.7 74.3 29.6 1536 3861

115 3.5 97.6 38.9 1169 2938

120 2.7 127.4 50.7 896 2251


Pg. 29/80

Process - 0.18 micron w/ OTP


Pg. 30/80


Single Point Calculation for 0.18 micron w/ OTP










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for 0.18 micron w/ OTP

MTTF MTTF


25 1971.6 0.3 0.1 338853 851517

30 1257.7 0.5 0.2 216161 543200

35 814.1 0.8 0.3 139920 351610

40 534.4 1.2 0.5 91836 230779

45 355.4 1.9 0.7 61079 153489

50 239.4 2.8 1.1 41139 103381

55 163.2 4.1 1.6 28045 70475

60 112.5 5.9 2.3 19339 48598

65 78.5 8.5 3.4 13483 33883

70 55.3 12.0 4.8 9500 23873

75 39.3 16.9 6.7 6761 16990

80 28.3 23.5 9.4 4858 12209

85 20.5 32.4 12.9 3524 8855

90 15.0 44.3 17.6 2578 6479

95 11.1 60.0 23.9 1902 4781

100 8.2 80.7 32.1 1415 3557

105 6.2 107.6 42.8 1061 2667

110 4.7 142.4 56.7 802 2015

115 3.5 187.1 74.5 610 1533

120 2.7 244.2 97.2 467 1175


Pg. 31/80

Process - 0.18 micron w/ RF


Pg. 32/80


Single Point Calculation for 0.18 micron w/ RF










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for 0.18 micron w/ RF

MTTF MTTF


25 1971.6 0.6 0.2 192482 483696

30 1257.7 0.9 0.4 122788 308559

35 814.1 1.4 0.6 79480 199729

40 534.4 2.2 0.9 52167 131091

45 355.4 3.3 1.3 34696 87188

50 239.4 4.9 1.9 23369 58724

55 163.2 7.2 2.9 15931 40032

60 112.5 10.4 4.1 10985 27606

65 78.5 14.9 5.9 7659 19247

70 55.3 21.2 8.4 5396 13561

75 39.3 29.7 11.8 3841 9651

80 28.3 41.4 16.5 2760 6935

85 20.5 57.0 22.7 2002 5030

90 15.0 77.9 31.0 1464 3680

95 11.1 105.6 42.0 1081 2716

100 8.2 142.0 56.5 804 2020

105 6.2 189.4 75.4 603 1515

110 4.7 250.7 99.7 455 1144

115 3.5 329.4 131.1 347 871

120 2.7 429.9 171.1 266 667


Pg. 33/80



Pg. 34/80












Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]




MTTF MTTF


25 1971.6 0.1 0.0 1075023 2701470

30 1257.7 0.2 0.1 685779 1723321

35 814.1 0.3 0.1 443901 1115496

40 534.4 0.4 0.2 291353 732154

45 355.4 0.6 0.2 193777 486950

50 239.4 0.9 0.3 130516 327980

55 163.2 1.3 0.5 88973 223584

60 112.5 1.9 0.7 61354 154180

65 78.5 2.7 1.1 42777 107495

70 55.3 3.8 1.5 30139 75738

75 39.3 5.3 2.1 21450 53903

80 28.3 7.4 2.9 15414 38734

85 20.5 10.2 4.1 11179 28091

90 15.0 14.0 5.6 8179 20554

95 11.1 18.9 7.5 6036 15167

100 8.2 25.4 10.1 4490 11284

105 6.2 33.9 13.5 3367 8461

110 4.7 44.9 17.9 2543 6392

115 3.5 59.0 23.5 1935 4864

120 2.7 77.0 30.6 1483 3727


Pg. 35/80



Pg. 36/80












Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]




MTTF MTTF


25 1971.6 0.6 0.2 188609 473963

30 1257.7 0.9 0.4 120317 302350

35 814.1 1.5 0.6 77881 195710

40 534.4 2.2 0.9 51117 128454

45 355.4 3.4 1.3 33997 85434

50 239.4 5.0 2.0 22899 57543

55 163.2 7.3 2.9 15610 39227

60 112.5 10.6 4.2 10764 27050

65 78.5 15.2 6.1 7505 18860

70 55.3 21.6 8.6 5288 13288

75 39.3 30.3 12.1 3763 9457

80 28.3 42.2 16.8 2704 6796

85 20.5 58.2 23.2 1961 4929

90 15.0 79.5 31.7 1435 3606

95 11.1 107.8 42.9 1059 2661

100 8.2 144.9 57.7 788 1980

105 6.2 193.3 76.9 591 1484

110 4.7 255.8 101.8 446 1121

115 3.5 336.2 133.8 340 853

120 2.7 438.7 174.6 260 654


Pg. 37/80

Process – 0.315 - 0.35 micron


Pg. 38/80


Single Point Calculation for 0.315 um - 0.35 um










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for 0.315 um - 0.35 um

MTTF MTTF


25 1971.6 1.1 0.4 103447 259957

30 1257.7 1.7 0.7 65991 165832

35 814.1 2.7 1.1 42716 107342

40 534.4 4.1 1.6 28036 70454

45 355.4 6.1 2.4 18647 46858

50 239.4 9.1 3.6 12559 31561

55 163.2 13.3 5.3 8562 21515

60 112.5 19.3 7.7 5904 14836

65 78.5 27.7 11.0 4116 10344

70 55.3 39.4 15.7 2900 7288

75 39.3 55.3 22.0 2064 5187

80 28.3 77.0 30.6 1483 3727

85 20.5 106.1 42.2 1076 2703

90 15.0 145.0 57.7 787 1978

95 11.1 196.5 78.2 581 1460

100 8.2 264.2 105.1 432 1086

105 6.2 352.4 140.2 324 814

110 4.7 466.4 185.6 245 615

115 3.5 612.9 243.9 186 468

120 2.7 799.9 318.3 143 359


Pg. 39/80



Pg. 40/80












Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]




MTTF MTTF


25 1971.6 1.0 0.6 111211 190605

30 1257.7 1.6 0.9 70944 121590

35 814.1 2.5 1.5 45921 78705

40 534.4 3.8 2.2 30140 51658

45 355.4 5.7 3.3 20046 34357

50 239.4 8.5 4.9 13502 23141

55 163.2 12.4 7.2 9204 15775

60 112.5 18.0 10.5 6347 10878

65 78.5 25.8 15.1 4425 7584

70 55.3 36.6 21.4 3118 5344

75 39.3 51.4 30.0 2219 3803

80 28.3 71.6 41.8 1595 2733

85 20.5 98.7 57.6 1156 1982

90 15.0 134.9 78.7 846 1450

95 11.1 182.8 106.7 624 1070

100 8.2 245.7 143.4 465 796

105 6.2 327.8 191.2 348 597

110 4.7 433.8 253.1 263 451

115 3.5 570.2 332.7 200 343

120 2.7 744.1 434.1 153 263


Pg. 41/80



Pg. 42/80












Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]




MTTF MTTF


25 1971.6 1.7 1.0 66457 113900

30 1257.7 2.7 1.6 42394 72659

35 814.1 4.2 2.4 27441 47032

40 534.4 6.3 3.7 18011 30869

45 355.4 9.5 5.6 11979 20531

50 239.4 14.1 8.3 8068 13828

55 163.2 20.8 12.1 5500 9427

60 112.5 30.1 17.6 3793 6501

65 78.5 43.2 25.2 2644 4532

70 55.3 61.3 35.7 1863 3193

75 39.3 86.1 50.2 1326 2273

80 28.3 119.8 69.9 953 1633

85 20.5 165.2 96.4 691 1184

90 15.0 225.8 131.7 506 867

95 11.1 305.9 178.5 373 639

100 8.2 411.2 239.9 278 476

105 6.2 548.5 320.0 208 357

110 4.7 726.0 423.6 157 269

115 3.5 954.1 556.7 120 205

120 2.7 1245.2 726.5 92 157


Pg. 43/80

Process - 0.45 - 0.5 um SPTM


Pg. 44/80


Single Point Calculation for 0.45 - 0.5 um SPTM










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for 0.45 - 0.5 um SPTM

MTTF MTTF


25 1971.6 3.2 1.3 35782 89918

30 1257.7 5.0 2.0 22826 57361

35 814.1 7.7 3.1 14775 37129

40 534.4 11.8 4.7 9698 24370

45 355.4 17.7 7.0 6450 16208

50 239.4 26.3 10.5 4344 10917

55 163.2 38.5 15.3 2961 7442

60 112.5 55.9 22.2 2042 5132

65 78.5 80.2 31.9 1424 3578

70 55.3 113.8 45.3 1003 2521

75 39.3 159.9 63.6 714 1794

80 28.3 222.5 88.5 513 1289

85 20.5 306.8 122.1 372 935

90 15.0 419.3 166.9 272 684

95 11.1 568.2 226.1 201 505

100 8.2 763.8 303.9 149 376

105 6.2 1018.7 405.4 112 282

110 4.7 1348.4 536.6 85 213

115 3.5 1772.0 705.2 64 162

120 2.7 2312.6 920.3 49 124


Pg. 45/80

Process - 0.6 - 1.0um


Pg. 46/80


Single Point Calculation for 0.6 - 1.0um










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for 0.6 - 1.0um

MTTF MTTF


25 1971.6 2.0 0.8 56937 143079

30 1257.7 3.1 1.3 36321 91273

35 814.1 4.9 1.9 23511 59081

40 534.4 7.4 2.9 15431 38777

45 355.4 11.1 4.4 10263 25791

50 239.4 16.5 6.6 6913 17371

55 163.2 24.2 9.6 4712 11842

60 112.5 35.1 14.0 3250 8166

65 78.5 50.4 20.1 2266 5693

70 55.3 71.5 28.5 1596 4011

75 39.3 100.5 40.0 1136 2855

80 28.3 139.8 55.6 816 2051

85 20.5 192.8 76.7 592 1488

90 15.0 263.5 104.9 433 1089

95 11.1 357.1 142.1 320 803

100 8.2 480.0 191.0 238 598

105 6.2 640.2 254.8 178 448

110 4.7 847.4 337.2 135 339

115 3.5 1113.6 443.2 103 258

120 2.7 1453.4 578.4 79 197


Pg. 47/80

Process – Diode


Pg. 48/80


Single Point Calculation for Diode










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for Diode

MTTF MTTF


25 1971.6 6.2 2.5 18348 46107

30 1257.7 9.8 3.9 11704 29412

35 814.1 15.1 6.0 7576 19038

40 534.4 23.0 9.1 4973 12496

45 355.4 34.5 13.7 3307 8311

50 239.4 51.2 20.4 2228 5598

55 163.2 75.2 29.9 1519 3816

60 112.5 109.0 43.4 1047 2631

65 78.5 156.4 62.2 730 1835

70 55.3 221.9 88.3 514 1293

75 39.3 311.8 124.1 366 920

80 28.3 433.9 172.7 263 661

85 20.5 598.3 238.1 191 479

90 15.0 817.7 325.4 140 351

95 11.1 1108.2 441.0 103 259

100 8.2 1489.6 592.8 77 193

105 6.2 1986.6 790.6 57 144

110 4.7 2629.7 1046.5 43 109

115 3.5 3455.9 1375.2 33 83

120 2.7 4510.2 1794.8 25 64


Pg. 49/80

Process - High Voltage


Pg. 50/80


Single Point Calculation for High Voltage










Constants:


Calculated Values:






=[X2/(2*AF*D*H)*1E9]



FIT Estimation Curves for High Voltage

MTTF MTTF


25 1971.6 0.3 0.2 382834 736343

30 1257.7 0.5 0.2 244217 469728

35 814.1 0.7 0.4 158081 304052

40 534.4 1.1 0.6 103756 199564

45 355.4 1.7 0.9 69007 132729

50 239.4 2.5 1.3 46479 89398

55 163.2 3.6 1.9 31685 60943

60 112.5 5.2 2.7 21849 42025

65 78.5 7.5 3.9 15234 29300

70 55.3 10.6 5.5 10733 20644

75 39.3 14.9 7.8 7639 14692

80 28.3 20.8 10.8 5489 10558

85 20.5 28.7 14.9 3981 7657

90 15.0 39.2 20.4 2913 5602

95 11.1 53.1 27.6 2149 4134

100 8.2 71.4 37.1 1599 3076

105 6.2 95.2 49.5 1199 2306

110 4.7 126.0 65.5 906 1742

115 3.5 165.6 86.1 689 1326

120 2.7 216.2 112.4 528 1016


Pg. 51/80

Flash Reliability Summary by Fab Technology


Pg. 52/80

90 nm Flash Reliability Summary

Effective Dev-Hrs

at 150°C

Chargeable

Failures

Typical Case:

Predicted FIT

@Ta=50°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=50°C

60% UCL

Worst Case:

Predicted FIT

@Ta=85°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=85°C

60% UCL

2,151,664 0 3.0 0.026% 23.2 0.203%

0%

0%

0%

1%

10%

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

5 Y

ea

r C

on

tin

uo

us

Us

e F

allo

ut

(%)

Use Temperature [C]

Data Retention ReliabilityContinuous Use Fallout

10

100

1000

10000

100000

1000000

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

MT

TF

(Y

ea

rs)

Use Temperature [C]

Data Retention Reliability


Pg. 53/80

0.11um OTP Reliability Summary

Effective Dev-Hrs

at 150°C

Chargeable

Failures

Typical Case:

Predicted FIT

@Ta=50°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=50°C

60% UCL

Worst Case:

Predicted FIT

@Ta=85°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=85°C

60% UCL

3,363,000 0 1.9 0.017% 14.8 0.130%

0%

0%

0%

0%

1%

10%

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

5 Y

ea

r C

on

tin

uo

us

Us

e F

allo

ut

(%)

Use Temperature [C]


10

100

1000

10000

100000

1000000

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

MT

TF

(Y

ea

rs)

Use Temperature [C]



Pg. 54/80


Effective Dev-Hrs

at 150°C

Chargeable

Failures

Typical Case:

Predicted FIT

@Ta=50°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=50°C

60% UCL

Worst Case:

Predicted FIT

@Ta=85°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=85°C

60% UCL

2,676,000 0 2.4 0.021% 18.7 0.163%

0%

0%

0%

1%

10%

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

5 Y

ea

r C

on

tin

uo

us

Us

e F

allo

ut

(%)

Use Temperature [C]


10

100

1000

10000

100000

1000000

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

MT

TF

(Y

ea

rs)

Use Temperature [C]



Pg. 55/80

0.18um Flash Reliability Summary

Effective Dev-Hrs

at 150°C

Chargeable

Failures

Typical Case:

Predicted FIT

@Ta=50°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=50°C

60% UCL

Worst Case:

Predicted FIT

@Ta=85°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=85°C

60% UCL

25,628,808 6 2.0 0.018% 15.6 0.137%

0%

0%

0%

1%

10%

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

5 Y

ea

r C

on

tin

uo

us

Us

e F

allo

ut

(%)

Use Temperature [C]


10

100

1000

10000

100000

1000000

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

MT

TF

(Y

ea

rs)

Use Temperature [C]



Pg. 56/80


Effective Dev-Hrs

at 150°C

Chargeable

Failures

Typical Case:

Predicted FIT

@Ta=50°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=50°C

60% UCL

Worst Case:

Predicted FIT

@Ta=85°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=85°C

60% UCL

15,002,512 0 0.4 0.004% 3.3 0.029%

0%

0%

0%

0%

1%

10%

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

5 Y

ea

r C

on

tin

uo

us

Us

e F

allo

ut

(%)

Use Temperature [C]


10

100

1000

10000

100000

1000000

10000000

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

MT

TF

(Y

ea

rs)

Use Temperature [C]



Pg. 57/80

0.25um HDR Flash Reliability Summary

Effective Dev-Hrs

at 150°C

Chargeable

Failures

Typical Case:

Predicted FIT

@Ta=50°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=50°C

60% UCL

Worst Case:

Predicted FIT

@Ta=85°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=85°C

60% UCL

5,515,033 0 1.2 0.010% 9.1 0.079%

0%

0%

0%

0%

1%

10%

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

5 Y

ea

r C

on

tin

uo

us

Us

e F

allo

ut

(%)

Use Temperature [C]


10

100

1000

10000

100000

1000000

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

MT

TF

(Y

ea

rs)

Use Temperature [C]



Pg. 58/80

0.35um Non-HE Flash Reliability Summary

Effective Dev-Hrs

at 150°C

Chargeable

Failures

Typical Case:

Predicted FIT

@Ta=50°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=50°C

60% UCL

Worst Case:

Predicted FIT

@Ta=85°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=85°C

60% UCL

7,872,366 0 0.8 0.007% 6.3 0.056%

0%

0%

0%

0%

1%

10%

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

5 Y

ea

r C

on

tin

uo

us

Us

e F

allo

ut

(%)

Use Temperature [C]


10

100

1000

10000

100000

1000000

10000000

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125

MT

TF

(Y

ea

rs)

Use Temperature [C]



Pg. 59/80

0.35um HE Flash Reliability Summary

Effective Dev-Hrs

at 150°C

Chargeable

Failures

Typical Case:

Predicted FIT

@Ta=50°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=50°C

60% UCL

Worst Case:

Predicted FIT

@Ta=85°C,

60% UCL

10 Year Predicted

Failure Rate

Ta=85°C

60% UCL

2,770,053 0 2.3 0.020% 18.0 0.158%

0%

0%

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Pg. 60/80

Reliability Monitors

Overview

Once a product is qualified, we verify continued product reliability with a reliability monitor program. The monitor

program is scheduled to periodically sample wafer fab and package technologies. The results are published in this

report. Any failures are used to drive corrective action and product and process improvement.

Stress Descriptions

Silicon Labs follows JEDEC as the preferred industry standard. The most common reliability tests and conditions are

listed in the following table. The specific JEDEC documents are available on the Internet at www.jedec.org.

Reliability Tests, Procedures and Conditions Table

Stress Name Stress Procedure Standard Conditions

DR Data Retention Bake AEC_Q100 150°C (pkg form); 250C (wafer)

ELFR Early Life Failure Rate JEDEC JESD22-A108 125°C; Max operating voltage

HAST Highly-Accelerated Temperature

and Humidity Stress Test JEDEC JESD22-A110 130°C; 85%rh; 22.2 psia; biased

HTB High Temperature Bake JEDEC JESD22-A103 150°C

LTOL Low Temperature Operating Life JEDEC JESD22-A108 -10°C; Max operating voltage

HTOL High Temperature Operating Life JEDEC JESD22-A108 125°C; Max operating voltage

PC Preconditioning JEDEC JESD22-A113 According to MSL level prior to package

stresses (listed below)

TC Temperature Cycle JEDEC JESD22-A104 Condition C: -65 to 150°C

U-HAST Unbiased HAST JEDEC JESD22-A118 130°C; 85%rh

THB Temperature Humidity Bias JEDEC JESD22-A101 85°C; 85%RH; Max operating voltage

Qualification

Guideline Stress Test Driven Qualification of Integrated Circuits; EIA / JEDEC EIA/JESD47 / AEC-Q100


Pg. 61/80

Silicon Reliability Test Method and Conditions

Early Life Failure Rate (ELFR)

The purpose of this test is to simulate the user operation over the first portion of the product lifetime, also called early

life. Silicon Labs typically uses dynamic conditions, meaning the device is powered up, and the inputs are toggled to

exercise a maximum number of transistors and circuit area. Reliability acceleration is accomplished primarily by

temperature and secondarily by voltage.

High Temperature Operating Life (HTOL)

The purpose of this test is to simulate the user part operation over the expected life of the product. We typically use

dynamic conditions, meaning the device is powered up, and the inputs are toggled to exercise a maximum number of

transistors and circuit area. Reliability acceleration is accomplished primarily by temperature and secondarily by

voltage.

High Temperature Storage Life (HTSL) / High Temperature Bake (HTB)

The purpose of this test is to determine the effect of storage at elevated temperature. This is performed to assess the

stability of semiconductor device materials and interfaces.

Low Temperature Operating Life (LTOL)

The purpose of this test is to simulate the user operation at low temperature. This is a specialized test to address

specific fab failure mechanisms, such as hot-carrier injection. Wafer level reliability tests are more effective for this

characterization and are the primary qualification method. Silicon Labs typically uses dynamic conditions, meaning the

device is powered up, and the inputs are toggled to exercise a maximum number of transistors and circuit area.

Nonvolatile Memory Data Retention (DR)

The purpose of this test is to measure the ability of a nonvolatile memory cell to retain its charge state at elevated

temperature in the absence of applied external bias. This test can be done either in wafer form or on packaged units.


Pg. 62/80

Reliability Monitor Report – Silicon Stresses

QLotNum Stress Fab Process Read Date Sample Size Read Pt Fails ºC

Q042474 HTOL 0.11 um 07-Sep-17 80 1000 0 125

Q042479 HTOL 0.11 um 21-Nov-17 80 1000 0 125

Q041212 HTSL 0.11 um 25-Apr-17 80 1000 0 150

Q041248 HTSL 0.11 um 25-Apr-17 80 1000 0 150

Q041737 HTSL 0.11 um 28-Jul-17 80 1000 0 150

Q041018 ELFR 0.13 um 03-Apr-17 504 48 0 85

Q041238 ELFR 0.13 um 18-May-17 504 48 0 85

Q040841 HTOL 0.13 um 20-Apr-17 80 1000 0 125

Q041408 HTOL 0.13 um 07-Jul-17 80 1000 0 85

Q041566 HTOL 0.13 um 21-Aug-17 80 1000 0 85

Q042477 HTOL 0.13 um 07-Sep-17 80 1000 0 125

Q041338 HTSL 0.13 um 27-Apr-17 75 1000 0 125

Q040843 HTSL 0.13 um 02-May-17 25 1000 0 150

Q040847 HTSL 0.13 um 02-May-17 25 1000 0 150

Q040851 HTSL 0.13 um 02-May-17 25 1000 0 150

Q040869 HTSL 0.13 um 03-May-17 80 1000 0 125

Q041318 HTSL 0.13 um 04-May-17 80 1000 0 150

Q041226 HTSL 0.13 um 11-May-17 80 1000 0 150

Q041306 HTSL 0.13 um 11-May-17 80 1000 0 150

Q041187 HTSL 0.13 um 14-Jun-17 27 1000 0 150

Q041745 HTSL 0.13 um 28-Jul-17 80 1000 0 150

Q042393 HTSL 0.13 um 02-Oct-17 80 1000 0 150

Q042424 HTSL 0.13 um 25-Oct-17 80 1000 0 125

Q042404 HTSL 0.13 um 27-Oct-17 80 1000 0 150

Q041900 HTSL 0.13 um 10-Nov-17 80 1000 0 125

Q042365 HTSL 0.13 um 03-Dec-17 80 1000 0 150

Q042167 HTSL 0.13 um 15-Dec-17 27 1000 0 150

Q042168 HTSL 0.13 um 15-Dec-17 27 1000 0 150

Q042169 HTSL 0.13 um 15-Dec-17 27 1000 0 150

Q042170 HTSL 0.13 um 15-Dec-17 27 1000 0 150

Q042435 HTSL 0.13 um 09-Jan-18 80 1000 0 150

Q042580 HTSL 0.13 um 21-Mar-18 25 1000 0 150

Q042581 HTSL 0.13 um 21-Mar-18 25 1000 0 150

Q042582 HTSL 0.13 um 21-Mar-18 25 1000 0 150

Q042589 HTSL 0.13 um 21-Mar-18 25 1000 0 150

Q042590 HTSL 0.13 um 21-Mar-18 25 1000 0 150


Pg. 63/80


Q042591 HTSL 0.13 um 21-Mar-18 25 1000 0 150

Q041373 ELFR 0.18 um 26-May-17 809 48 0 125

Q041721 ELFR 0.18 um 03-Sep-17 560 48 0 125

Q041999 ELFR 0.18 um 30-Sep-17 313 48 0 90

Q041962 ELFR 0.18 um 03-Oct-17 400 48 0 125

Q042006 ELFR 0.18 um 12-Oct-17 240 48 0 125

Q041094 HTOL 0.18 um 19-May-17 90 1000 0 125

Q041163 HTOL 0.18 um 14-Jun-17 98 1000 0 125

Q041387 HTOL 0.18 um 11-Jul-17 80 1000 0 125

Q041326 HTSL 0.18 um 12-Apr-17 80 1000 0 150

Q040901 HTSL 0.18 um 17-Apr-17 50 1000 0 150

Q040814 HTSL 0.18 um 19-Apr-17 50 1000 0 150

Q041334 HTSL 0.18 um 25-Apr-17 80 1000 0 150

Q041456 HTSL 0.18 um 27-Jul-17 26 1000 0 150

Q041741 HTSL 0.18 um 28-Jul-17 80 1000 0 150

Q042381 HTSL 0.18 um 26-Sep-17 80 1000 0 150

Q042384 HTSL 0.18 um 27-Sep-17 80 1000 0 150

Q042420 HTSL 0.18 um 09-Oct-17 80 1000 0 150

Q042369 HTSL 0.18 um 19-Oct-17 80 1000 0 150

Q042075 HTSL 0.18 um 09-Jan-18 30 2000 0 150

Q042076 HTSL 0.18 um 09-Jan-18 30 2000 0 150

Q042077 HTSL 0.18 um 09-Jan-18 30 2000 0 150

Q041222 HTSL 0.18 um, embedded flash 07-May-17 80 1000 0 150

Q040966 HTSL 0.18 um, embedded flash 14-Jun-17 200 2000 0 150

Q040967 HTSL 0.18 um, embedded flash 25-Jul-17 200 2000 0 150

Q042396 HTSL 0.18 um, embedded flash 26-Sep-17 80 1000 0 150

Q042388 HTSL 0.18 um, embedded flash 02-Oct-17 80 1000 0 150

Q042447 HTSL 0.18 um, embedded flash 10-Jan-18 80 1000 0 150

Q042358 HTSL 0.18 um, OTP 16-Nov-17 80 1500 0 150

Q041717 HTOL 0.18 um, RF 31-Aug-17 77 1000 0 125

Q041718 HTOL 0.18 um, RF 22-Sep-17 77 1000 0 125

Q041719 HTOL 0.18 um, RF 22-Sep-17 77 1000 0 125

Q042475 HTOL 0.18 um, RF 21-Nov-17 80 1000 0 125

Q041698 HTOL 0.25 um 20-Sep-17 90 1000 0 125

Q041697 HTOL 0.25 um 23-Sep-17 90 100 0 125

Q042614 HTOL 0.25 um 29-Mar-18 80 1000 0 125

Q040805 HTSL 0.25 um 03-Apr-17 92 1000 0 150

Q040831 HTSL 0.25 um 03-Apr-17 92 1000 0 150


Pg. 64/80


Q040882 HTSL 0.25 um 18-Apr-17 92 1000 0 150

Q041234 HTSL 0.25 um 10-May-17 80 1000 0 150

Q041230 HTSL 0.25 um 24-May-17 80 1000 0 150

Q042042 HTSL 0.25 um 28-Aug-17 92 1000 0 150

Q042043 HTSL 0.25 um 28-Aug-17 92 1000 0 150

Q042044 HTSL 0.25 um 28-Aug-17 92 1000 0 150

Q042349 HTSL 0.25 um 28-Oct-17 80 1000 0 150

Q042345 HTSL 0.25 um 27-Nov-17 80 1000 0 150

Q042432 HTSL 0.25 um 12-Feb-18 80 1000 0 150

Q042476 HTOL 0.25 um, embedded flash 07-Sep-17 78 1000 0 125

Q041302 HTSL 0.25 um, embedded flash 04-May-17 80 1000 0 150

Q042361 HTSL 0.25 um, embedded flash 03-Dec-17 80 1000 0 150

Q042428 HTSL 0.25 um, embedded flash 12-Feb-18 80 1000 0 150

Q041239 HTSL 0.315 um - 0.35 um 05-May-17 40 168 0 150

Q041240 HTSL 0.315 um - 0.35 um 05-May-17 47 168 0 150

Q041242 HTSL 0.315 um - 0.35 um 05-May-17 47 168 0 150

Q042009 HTSL 0.315 um - 0.35 um 15-Sep-17 76 168 0 150

Q042010 HTSL 0.315 um - 0.35 um 15-Sep-17 25 168 0 150

Q042011 HTSL 0.315 um - 0.35 um 15-Sep-17 77 168 0 150

Q042021 HTSL 0.315 um - 0.35 um 29-Sep-17 50 168 0 150

Q042022 HTSL 0.315 um - 0.35 um 29-Sep-17 50 168 0 150

Q042023 HTSL 0.315 um - 0.35 um 29-Sep-17 50 168 0 150



Q041216 HTSL 0.35 um, embedded flash 23-Apr-17 80 1000 0 150




Q042478 HTOL 0.45 um - 0.5 um 07-Sep-17 80 1000 0 125

Q041344 ELFR 55 nm 26-May-17 430 48 0 70

Q041720 ELFR 55 nm 24-Aug-17 356 48 0 75

Q041819 ELFR 55 nm 31-Aug-17 66 48 0 75

Q042149 ELFR 55 nm 16-Nov-17 566 48 0 75

Q042471 HTOL 55 nm 07-Sep-17 79 1000 0 90

Q041587 HTOL 55 nm 06-Oct-17 79 2000 0 75

Q041426 HTSL 55 nm 13-Jul-17 26 1000 0 150

Q041464 HTSL 55 nm 27-Jul-17 26 1000 0 150

Q041749 HTSL 55 nm 28-Jul-17 80 1000 0 150


Pg. 65/80


Q041728 HTSL 55 nm 12-Aug-17 25 1000 0 150

Q041729 HTSL 55 nm 12-Aug-17 25 1000 0 150

Q041730 HTSL 55 nm 12-Aug-17 25 1000 0 150

Q041862 HTSL 55 nm 30-Aug-17 25 1000 0 150

Q041889 HTSL 55 nm 30-Aug-17 25 1000 0 150

Q041890 HTSL 55 nm 30-Aug-17 25 1000 0 150

Q041891 HTSL 55 nm 30-Aug-17 25 1000 0 150

Q041892 HTSL 55 nm 30-Aug-17 25 1000 0 150

Q041893 HTSL 55 nm 30-Aug-17 25 1000 0 150

Q041763 HTSL 55 nm 03-Oct-17 26 1000 0 150

Q042400 HTSL 55 nm 27-Oct-17 80 1000 0 150

Q042341 HTSL 55 nm 28-Oct-17 80 1000 0 150

Q041953 HTSL 55 nm 06-Nov-17 26 1000 0 150

Q042196 HTSL 55 nm 15-Jan-18 25 1000 0 150

Q042197 HTSL 55 nm 15-Jan-18 25 1000 0 150

Q042198 HTSL 55 nm 15-Jan-18 25 1000 0 150

Q042439 HTSL 55 nm 31-Jan-18 80 1000 0 150

Q040944 ELFR 90 nm, embedded flash 11-Apr-17 518 48 0 125

Q041279 ELFR 90 nm, embedded flash 05-Jun-17 507 48 0 125



Q041637 ELFR 90 nm, embedded flash 31-Jul-17 518 48 0 125

Q041617 ELFR 90 nm, embedded flash 11-Aug-17 609 48 0 125

Q042112 ELFR 90 nm, embedded flash 04-Nov-17 510 48 0 125

Q042177 ELFR 90 nm, embedded flash 18-Nov-17 510 48 0 125

Q040961 HTDR 90 nm, embedded flash 03-Apr-17 40 96 0 100

Q041092 HTDR 90 nm, embedded flash 17-May-17 40 1000 0 150

Q041533 HTDR 90 nm, embedded flash 12-Aug-17 40 1000 0 150

Q041534 HTDR 90 nm, embedded flash 12-Aug-17 39 1000 0 150

Q040650 HTOL 90 nm, embedded flash 05-Apr-17 79 1200 0 125

Q040471 HTOL 90 nm, embedded flash 02-May-17 80 1200 0 125

Q040945 HTOL 90 nm, embedded flash 05-Jun-17 89 1000 0 125

Q041124 HTOL 90 nm, embedded flash 06-Jun-17 80 1200 0 125

Q041280 HTOL 90 nm, embedded flash 02-Aug-17 85 1000 0 125

Q041560 HTOL 90 nm, embedded flash 21-Aug-17 80 1000 0 125

Q041680 HTOL 90 nm, embedded flash 15-Sep-17 90 1000 0 125

Q041681 HTOL 90 nm, embedded flash 20-Sep-17 90 1000 0 125

Q042111 HTOL 90 nm, embedded flash 16-Dec-17 80 1000 0 125


Pg. 66/80


Q042230 HTOL 90 nm, embedded flash 03-Jan-18 80 1000 0 125

Q041322 HTSL 90 nm, embedded flash 24-Apr-17 80 1000 0 150

Q041314 HTSL 90 nm, embedded flash 04-May-17 80 1000 0 150



Q041413 HTSL 90 nm, embedded flash 06-Jul-17 27 1000 0 150




Q041552 HTSL 90 nm, embedded flash 17-Aug-17 27 1000 0 150






Q041907 HTSL 90 nm, embedded flash 28-Sep-17 30 500 0 150

Q041635 HTSL 90 nm, embedded flash 03-Oct-17 27 1000 0 150










Q042443 HTSL 90 nm, embedded flash 31-Jan-18 80 1000 0 150

Q042325 HTSL 90 nm, embedded flash 01-Feb-18 30 1000 0 150



Q040960 LTDR 90 nm, embedded flash 18-Apr-17 40 500 0 25

Q041577 LTDR 90 nm, embedded flash 01-Aug-17 39 500 0 25

Q041578 LTDR 90 nm, embedded flash 01-Aug-17 39 500 0 25

Q041638 ELFR High Voltage 31-Jul-17 500 48 0 85

Q042001 ELFR High Voltage 09-Oct-17 499 48 1 85

Q042090 ELFR High Voltage 23-Oct-17 604 48 0 95

Q042114 ELFR High Voltage 01-Nov-17 509 48 0 95



Pg. 67/80




Q041682 HTOL High Voltage 15-Sep-17 90 1000 0 115

Q042062 HTOL High Voltage 26-Nov-17 90 1000 0 115

Q041298 HTSL High Voltage 04-May-17 80 1000 0 150


Pg. 68/80

Package Reliability Test Method and Conditions

Preconditioning (PC)

This test method is performed to simulate the various shipping conditions, the end use environment and customer

board mounting process for a given packaging system. Preconditioning is an industry standard flow for non-hermetic

(plastic) integrated circuit packages that is representative of a typical industry solder reflow operation. The test parts are

subject to bake, moisture soak and three reflow cycles prior to being submitted to package reliability testing.

Temperature Cycling (TC)

This test evaluates potential reliability degradation due to thermal cycling effects. Devices are placed in a chamber

using forced air to cycle devices between the specified temperature extremes. This test is conducted to determine the

ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low

temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these

mechanical stresses.

Temperature Humidity and Bias (THB)

This test evaluates the reliability of non-hermetic packaged integrated circuits in humid environments. It employs

severe conditions of temperature, humidity and bias to accelerate the penetration of moisture through the external

protective material (encapsulant) or along the interface between the external protective material and the metallic

conductors passing through it. This test is less accelerated than autoclave and unbiased HAST and takes longer to

complete. It provides more realistic results in line with actual field performance. The dominant failure mechanism is

aluminum corrosion accelerated by moisture, bias and contamination.

Highly-Accelerated Temperature and Humidity Stress Test (HAST)

This test evaluates the reliability of non-hermetic packaged integrated circuits in humid environments. It employs severe

conditions of temperature, humidity, and bias which accelerate the penetration of moisture through the external

protective material (encapsulant or seal) or along the interface between the external protective material and the metallic

conductors which pass through it. The stress usually activates the same failure mechanisms as the “85/85”

Temperature Humidity and Bias (THB) test.

Unbiased Highly-Accelerated Stress Test (U-HAST)

This test is performed to evaluate the reliability of non-hermetic packaged integrated circuits in humid environments. It

is an alternate to Autoclave and tests for the same failure mechanisms. It employs severe conditions of temperature,

humidity, and pressure to accelerate the penetration of moisture through the external protective material (encapsulant)

or along the interface between the external protective material and the metallic conductors passing through it. UHAST

is preferred over the autoclave stress method due to the reduction in artifacts induced by the 100%rh environment of

autoclave, such as lead corrosion or contamination transfer by liquid water. The dominant failure mechanism is

corrosion of internal materials.


Pg. 69/80

Reflow Profile and Moisture Sensitivity Level

Overview

Non-hermetic (plastic) integrated circuit packages are classified by moisture sensitivity level per IPC/JEDEC J-Std-020.

It is critical for final product quality that the board assembly process account for package moisture sensitivity, especially

the peak reflow temperature and the maximum manufacturing expose time (MET).

Reflow Profile

Non-hermetic integrated circuit SMD (surface mount devices) are qualified in compliance to the applicable reflow

profiles provided in IPC/JEDEC J-Std-020. The board assembler should not exceed the limits defined in the reflow

profile tables of IPC/JEDEC J-Std-020.

Moisture Sensitivity Level

The Moisture Sensitivity Level (MSL) and peak reflow temperature are indicated on each product packing label.


Pg. 70/80

Reliability Monitor Report – Package Stresses

QLotNum Stress Package Type Read Date Sample Size Read Point Fails

Q041382 HAST 3-SOT23-2.9x1.6-LF 31-May-17 80 96 0

Q041850 HAST 3-TO-92-3.2x4.0-LF 06-Sep-17 80 96 0

Q041852 Temp Cycle 3-TO-92-3.2x4.0-LF 07-Sep-17 80 500 0

Q041851 UHAST 3-TO-92-3.2x4.0-LF 06-Sep-17 82 96 0

Q041186 HAST 6-DFN-2.5x3.2-LF 09-May-17 27 96 0

Q042163 HAST 6-LGA-2.5x3.2-LF 14-Nov-17 27 96 0

Q042164 HAST 6-LGA-2.5x3.2-LF 14-Nov-17 27 96 0

Q042165 HAST 6-LGA-2.5x3.2-LF 21-Nov-17 27 96 0

Q042166 HAST 6-LGA-2.5x3.2-LF 21-Nov-17 27 96 0

Q041339 Temp Cycle 6-CLCC-5x3.2-LF 27-Apr-17 80 700 0

Q041976 Temp Cycle 6-TDFN-1.2x1.4-LF 11-Jun-17 77 500 0

Q042419 Temp Cycle 6-TDFN-1.2x1.4-LF 03-Sep-17 80 500 0

Q042084 Temp Cycle 6-DFN-3.2x4.0-LF 26-Sep-17 25 500 0

Q042085 Temp Cycle 6-DFN-3.2x4.0-LF 26-Sep-17 25 500 0

Q041954 Temp Cycle 6-CLCC-5x7-LF 27-Sep-17 26 500 0

Q042423 Temp Cycle 6-CLCC-5x3.2-LF 25-Oct-17 80 700 0

Q042181 Temp Cycle 6-LGA-2.5x3.2-LF 17-Nov-17 26 700 0




Q042210 Temp Cycle 6-CLCC-5x3.2-LF 20-Nov-17 27 500 0

Q041337 UHAST 6-CLCC-5x3.2-LF 27-Apr-17 80 96 0

Q042421 UHAST 6-TDFN-1.2x1.4-LF 26-Aug-17 80 96 0

Q041955 UHAST 6-CLCC-5x7-LF 02-Oct-17 26 192 0

Q042425 UHAST 6-CLCC-5x3.2-LF 25-Oct-17 80 96 0

Q041899 Temp Cycle 8-CLCC-5x7-LF 08-Oct-17 80 700 0

Q041898 UHAST 8-CLCC-5x7-LF 24-Oct-17 162 96 0

Q042356 Temp Cycle 10-OLGA-2.85X4.90-LF 26-Oct-17 80 1500 0

Q042357 THB 10-OLGA-2.85X4.90-LF 27-Oct-17 80 1000 0

Q041792 HAST 14-GQFN-5x5-LF 02-Oct-17 91 96 0



Q041227 Temp Cycle 14-SOIC-150mils-LF 11-Apr-17 80 500 0

Q041529 Temp Cycle 14-SOIC-300mils-LF 10-Jul-17 92 500 0

Q041531 Temp Cycle 14-SOIC-300mils-LF 12-Jul-17 92 500 0

Q042038 Temp Cycle 14-GQFN-5x5-LF 24-Jul-17 91 500 0


Pg. 71/80




Q041571 Temp Cycle 14-SOIC-300mils-LF 14-Sep-17 92 500 0

Q042268 Temp Cycle 14-LGA-5x5-LF 02-Nov-17 77 500 0



Q041225 UHAST 14-SOIC-150mils-LF 01-Apr-17 80 96 0

Q041527 UHAST 14-SOIC-300mils-LF 06-Jul-17 92 96 0

Q041795 UHAST 14-GQFN-5x5-LF 02-Oct-17 92 96 0



Q042264 UHAST 14-LGA-5x5-LF 05-Oct-17 77 96 0



Q041249 Temp Cycle 16-UQFN-2.5x2.5-LF 05-Apr-17 80 500 0

Q041235 Temp Cycle 16-TSSOP-5x4.4-LF 10-Apr-17 80 500 0

Q041231 Temp Cycle 16-SOIC-300mils-LF 24-Apr-17 80 500 0

Q041932 Temp Cycle 16-SOIC-150mils-LF 21-Aug-17 77 500 0

Q041934 Temp Cycle 16-SOIC-150mils-LF 21-Aug-17 77 500 0

Q042350 Temp Cycle 16-TSSOP-5x4.4-LF 28-Sep-17 80 500 0

Q042346 Temp Cycle 16-SOIC-300mils-LF 03-Nov-17 80 500 0

Q042433 Temp Cycle 16-SOIC-300mils-LF 12-Feb-18 80 500 0

Q041229 UHAST 16-SOIC-300mils-LF 14-Apr-17 80 96 0

Q042348 UHAST 16-TSSOP-5x4.4-LF 18-Sep-17 80 96 0

Q042344 UHAST 16-SOIC-300mils-LF 19-Oct-17 80 96 0

Q042431 UHAST 16-SOIC-300mils-LF 12-Feb-18 80 96 0

Q042415 Temp Cycle 20-SLP-4x4-LF 08-Sep-17 80 500 0

Q042370 Temp Cycle 20-TSSOP-6.5x4.4-LF 19-Sep-17 80 500 0

Q042448 Temp Cycle 20-TQFN-3x3-LF 25-Dec-17 80 500 0

Q042462 Temp Cycle 20-QFN-4x4-LF 28-Dec-17 30 500 0

Q042417 UHAST 20-SLP-4x4-LF 08-Sep-17 80 96 0

Q042368 UHAST 20-TSSOP-6.5x4.4-LF 09-Sep-17 80 96 0

Q042449 UHAST 20-TQFN-3x3-LF 19-Dec-17 80 96 0

Q041319 Temp Cycle 24-MQFN-4x4-LF 04-May-17 80 500 0

Q041746 Temp Cycle 24-MQFN-4x4-LF 28-Jul-17 80 500 0

Q042391 Temp Cycle 24-QFN-4x4-LF 05-Sep-17 80 500 0

Q042405 Temp Cycle 24-MQFN-4x4-LF 27-Oct-17 80 500 0

Q042436 Temp Cycle 24-QFN-4x4-LF 28-Nov-17 80 500 0


Pg. 72/80


Q041023 THB 24-ODFN-3x3 19-May-17 28 1000 0

Q041024 THB 24-ODFN-3x3 19-May-17 26 1000 0

Q041025 THB 24-ODFN-3x3 19-May-17 30 1000 0

Q041317 UHAST 24-MQFN-4x4-LF 04-May-17 80 96 0

Q041744 UHAST 24-MQFN-4x4-LF 28-Jul-17 79 96 0

Q042392 UHAST 24-QFN-4x4-LF 24-Aug-17 80 96 0

Q042403 UHAST 24-MQFN-4x4-LF 27-Oct-17 80 96 0

Q042437 UHAST 24-QFN-4x4-LF 23-Nov-17 80 96 0

Q041866 HAST 28-QFN-4x4-LF 11-Aug-17 25 96 0

Q041867 HAST 28-QFN-4x4-LF 11-Aug-17 25 96 0

Q041859 HAST 28-QFN-4x4-LF 30-Aug-17 25 96 0

Q041860 HAST 28-QFN-4x4-LF 30-Aug-17 25 96 0

Q041861 HAST 28-QFN-4x4-LF 30-Aug-17 25 96 0

Q041865 HAST 28-QFN-4x4-LF 30-Aug-17 25 96 0

Q041669 Temp Cycle 28-QFN-4x4-LF 25-Jul-17 25 500 0







Q042340 UHAST 28-QFN-4x4-LF 18-Sep-17 80 96 0

Q040965 HAST 32-QFN-5x5-LF 18-Apr-17 120 192 0

Q040964 HAST 32-QFN-5x5-LF 03-May-17 120 192 0

Q041347 HAST 32-QFN-5x5-LF 13-Jun-17 27 96 0

Q041352 HAST 32-QFN-5x5-LF 13-Jun-17 27 96 0

Q041357 HAST 32-QFN-5x5-LF 13-Jun-17 26 96 0

Q042327 HAST 32-RQFN-5x5-LF 02-Jan-18 30 264 0



Q041307 Temp Cycle 32-LGA-5x5-LF 11-Apr-17 80 500 0

Q041303 Temp Cycle 32-LQFP-7x7-LF 04-May-17 80 500 0

Q041315 Temp Cycle 32-QFN-5x5-LF 04-May-17 80 500 0

Q041268 Temp Cycle 32-VQFN-6x6-LF 15-May-17 30 500 0

Q041346 Temp Cycle 32-QFN-5x5-LF 14-Jun-17 30 500 0



Q042407 Temp Cycle 32-LQFP-7x7-LF 27-Oct-17 80 500 0


Pg. 73/80


Q042362 Temp Cycle 32-QFN-5x5-LF 03-Nov-17 80 500 0


Q042494 Temp Cycle 32-QFN-5x5-LF 09-Jan-18 27 500 0

Q042326 Temp Cycle 32-RQFN-5x5-LF 18-Jan-18 30 1500 0




Q042429 Temp Cycle 32-QFN-5x5-LF 12-Feb-18 80 500 0

Q042592 Temp Cycle 32-LGA-MCM-5x5 26-Feb-18 25 500 0



Q041305 UHAST 32-LGA-5x5-LF 01-Apr-17 80 96 0

Q041301 UHAST 32-LQFP-7x7-LF 04-May-17 80 96 0

Q041313 UHAST 32-QFN-5x5-LF 04-May-17 80 96 0

Q041348 UHAST 32-QFN-5x5-LF 13-Jun-17 27 96 0



Q042360 UHAST 32-QFN-5x5-LF 25-Oct-17 80 96 0


Q042409 UHAST 32-LQFP-7x7-LF 27-Oct-17 80 96 0

Q042329 UHAST 32-RQFN-5x5-LF 02-Jan-18 30 264 0



Q042495 UHAST 32-QFN-5x5-LF 09-Jan-18 27 96 0

Q042445 UHAST 32-QFN-5x5-LF 31-Jan-18 80 96 0

Q042427 UHAST 32-QFN-5x5-LF 12-Feb-18 80 96 0

Q042627 Temp Cycle 36-QFN-5X6 05-Mar-18 30 1000 0



Q041740 UHAST 36-MQFN-5X6-LF 28-Jul-17 80 96 0

Q042630 UHAST 36-QFN-5X6 26-Feb-18 30 192 0

Q042631 UHAST 36-QFN-5X6 26-Feb-18 30 192 0

Q042632 UHAST 36-QFN-5X6 26-Feb-18 30 192 0




Q042621 UHAST 38-QFN-4X6 26-Feb-18 30 192 0

Q042622 UHAST 38-QFN-4X6 26-Feb-18 30 192 0


Pg. 74/80


Q042623 UHAST 38-QFN-4X6 26-Feb-18 30 192 0


Q041736 UHAST 40-QFN-6x6-LF 28-Jul-17 80 96 0

Q042383 Temp Cycle 42-LGA-5x7-LF 30-Aug-17 80 500 0

Q042385 UHAST 42-LGA-5x7-LF 19-Aug-17 80 96 0


Q042244 Temp Cycle 47-LGA-6x8-LF 01-Sep-17 25 500 0







Q041725 HAST 48-QFN-7x7-LF 22-Jul-17 25 96 0

Q041726 HAST 48-QFN-7x7-LF 22-Jul-17 25 96 0

Q041727 HAST 48-QFN-7x7-LF 22-Jul-17 25 96 0

Q041768 HAST 48-QFN-7x7-LF 13-Sep-17 80 264 0

Q041983 HAST 48-QFN-7x7-LF 11-Oct-17 80 264 0

Q041984 HAST 48-QFN-7x7-LF 11-Oct-17 80 264 0

Q042193 HAST 48-QFN-7x7-LF 15-Dec-17 25 96 0

Q042194 HAST 48-QFN-7x7-LF 22-Dec-17 25 96 0

Q042195 HAST 48-QFN-7x7-LF 23-Dec-17 25 96 0

Q042577 HAST 48-LGA-MCM-6x6 26-Feb-18 25 264 0



Q041223 Temp Cycle 48-QFN-7x7-LF 06-Apr-17 80 500 0

Q041311 Temp Cycle 48-MQFN-7x7-LF 04-May-17 80 500 0






Q041750 Temp Cycle 48-MQFN-7x7-LF 28-Jul-17 80 500 0

Q041772 Temp Cycle 48-QFN-7x7-LF 29-Aug-17 82 500 0






Pg. 75/80



Q042496 Temp Cycle 48-TQFP-7x7-LF 15-Jan-18 27 500 0




Q041309 UHAST 48-MQFN-7x7-LF 04-May-17 80 96 0

Q041748 UHAST 48-MQFN-7x7-LF 28-Jul-17 80 96 0





Q040850 HAST 56-QFN-8x8-LF 04-May-17 25 528 0

Q041446 HAST 56-QFN-8x8-LF 14-Jul-17 25 528 0

Q041447 HAST 56-QFN-8x8-LF 14-Jul-17 25 528 0

Q041973 HAST 56-MQFN-8x8-LF 10-Oct-17 75 192 0

Q042078 HAST 56-QFN-8x8-LF 20-Nov-17 28 528 0

Q042501 HAST 56-QFN-8x8-LF 31-Jan-18 27 528 0

Q042502 HAST 56-QFN-8x8-LF 27-Feb-18 28 528 0




Q041130 Temp Cycle 56-SiP-6.5X6.5-LF 18-Apr-17 30 500 0




Q042072 Temp Cycle 56-QFN-8x8-LF 31-Oct-17 30 1000 0





Q041297 UHAST 56-QFN-8x8-LF 04-May-17 80 96 0

Q042071 UHAST 56-MQFN-8x8-LF 06-Nov-17 60 264 0




Q041454 HAST 64-QFN-9x9-LF 21-Jun-17 27 96 0

Q041463 HAST 64-LGA-9x9-LF 18-Jul-17 26 264 0

Q041628 HAST 64-LGA-9x9-LF 15-Aug-17 26 264 0


Pg. 76/80


Q041908 HAST 64-VQFN-9x9-LF 18-Sep-17 28 96 0

Q041764 HAST 64-LGA-9x9-LF 19-Sep-17 26 264 0

Q041916 HAST 64-TQFP-10x10-LF 19-Sep-17 28 96 0

Q041920 HAST 64-TQFP-10x10-LF 19-Sep-17 28 96 0

Q041912 HAST 64-VQFN-9x9-LF 25-Sep-17 27 96 0

Q042007 HAST 64-QFN-9x9-LF 16-Oct-17 27 192 0

Q041161 Temp Cycle 64-TQFP-10x10-LF 04-May-17 26 500 0

Q041427 Temp Cycle 64-LGA-9x9-LF 06-Jun-17 26 500 0


Q041465 Temp Cycle 64-LGA-9x9-LF 26-Jun-17 26 500 0


Q042389 Temp Cycle 64-VQFN-S-9x9-LF 05-Sep-17 80 500 0

Q041910 Temp Cycle 64-VQFN-9x9-LF 15-Sep-17 27 500 0

Q041918 Temp Cycle 64-TQFP-10x10-LF 18-Sep-17 27 500 1


Q041914 Temp Cycle 64-VQFN-9x9-LF 25-Sep-17 27 500 0

Q042493 Temp Cycle 64-TQFP-10x10-LF 08-Jan-18 27 500 0

Q041162 UHAST 64-TQFP-10x10-LF 02-May-17 26 96 0

Q042387 UHAST 64-VQFN-S-9x9-LF 24-Aug-17 80 96 0

Q041909 UHAST 64-VQFN-9x9-LF 18-Sep-17 28 96 0

Q041917 UHAST 64-TQFP-10x10-LF 19-Sep-17 28 96 0


Q041913 UHAST 64-VQFN-9x9-LF 25-Sep-17 28 96 0

Q040981 HAST 68-QFN-8x8-LF 19-May-17 25 96 0






Q041016 HAST 72-LGA-MCM-10x10-LF 26-Apr-17 75 528 0

Q042319 HAST 72-LGA-MCM-10x10-LF 14-Dec-17 88 264 0

Q042315 HAST 72-LGA-MCM-10x10-LF 01-Feb-18 87 264 0

Q042321 Temp Cycle 72-LGA-MCM-10x10-LF 11-Dec-17 88 500 0

Q042317 Temp Cycle 72-LGA-MCM-10x10-LF 12-Dec-17 88 500 0

Q041412 HAST 80-TQFP-12x12-LF 30-May-17 27 96 0

Q041554 HAST 80-TQFP-12x12-LF 12-Jul-17 25 96 0


Q041940 HAST 80-QFN-9x9-LF 29-Sep-17 30 264 0


Pg. 77/80


Q041941 HAST 80-QFN-9x9-LF 11-Oct-17 30 264 0

Q041942 HAST 80-QFN-9x9-LF 23-Oct-17 30 264 0

Q041410 Temp Cycle 80-TQFP-12x12-LF 31-May-17 27 500 0

Q041556 Temp Cycle 80-TQFP-12x12-LF 13-Jul-17 27 500 0





Q041411 UHAST 80-TQFP-12x12-LF 30-May-17 27 96 0

Q041559 UHAST 80-TQFP-12x12-LF 11-Jul-17 27 96 0





Q041450 HAST 84-QFN-12x12-LF 06-Jul-17 73 528 0

Q042483 HAST 84-QFN-12x12-LF 15-Jan-18 143 192 0

Q042401 Temp Cycle 84-MQFN-12x12-LF 27-Oct-17 80 500 0

Q042440 Temp Cycle 84-MQFN-12x12-LF 31-Jan-18 80 500 0

Q042399 UHAST 84-MQFN-12x12-LF 27-Oct-17 80 96 0

Q042441 UHAST 84-MQFN-12x12-LF 31-Jan-18 80 96 0

Q041842 Temp Cycle 88-MQFN-12x12-LF 23-Sep-17 75 1000 0





Q042636 Temp Cycle 92-LGA-7x7 28-Dec-17 35 500 0

Q042276 UHAST 92-LGA-7x7-LF 28-Sep-17 25 96 0




Q041116 HAST 100-TQFP-14x14-LF 18-Apr-17 27 96 0


Q041621 HAST 100-TQFP-14x14-LF 01-Aug-17 27 96 0

Q041118 Temp Cycle 100-TQFP-14x14-LF 18-Apr-17 28 500 0




Q041119 UHAST 100-TQFP-14x14-LF 18-Apr-17 28 96 0


Pg. 78/80





Q042294 Temp Cycle 112-LFBGA-10x10-LF 13-Aug-17 25 500 0





Q042208 Temp Cycle 112-LFBGA-10x10-LF 22-Nov-17 27 500 0

Q042285 UHAST 112-LFBGA-10x10-LF 09-Aug-17 25 96 0





Q042301 HAST 120-VFBGA-7x7-LF 08-Sep-17 25 96 0




Q042305 Temp Cycle 120-VFBGA-7x7-LF 14-Aug-17 25 500 0




Q042227 Temp Cycle 120-VFBGA-7x7-LF 30-Nov-17 27 500 0

Q042457 Temp Cycle 152-LFBGA-8x8-LF 02-Jan-18 30 500 0



Q040951 HAST 192-VFBGA-7x7-LF 25-Apr-17 28 264 0


Q041807 HAST 192-VFBGA-7x7-LF 11-Oct-17 28 264 0

Q040949 Temp Cycle 192-VFBGA-7x7-LF 13-Apr-17 27 500 0

Q041801 Temp Cycle 192-VFBGA-7x7-LF 01-Sep-17 27 500 0

Q041805 Temp Cycle 192-VFBGA-7x7-LF 05-Sep-17 27 500 0

Q040950 UHAST 192-VFBGA-7x7-LF 18-Apr-17 28 96 0

Q041802 UHAST 192-VFBGA-7x7-LF 07-Sep-17 28 96 0

Q041806 UHAST 192-VFBGA-7x7-LF 07-Sep-17 28 96 0

Q041218 Temp Cycle 229-TCP-35mm-LF 05-May-17 48 100 1




Pg. 79/80



Q042012 Temp Cycle 229-TCP-35mm-LF 15-Sep-17 77 100 0






Q041264 THB 229-TCP-35mm-LF 05-May-17 50 168 0

Q041265 THB 229-TCP-35mm-LF 05-May-17 48 168 1

Q041266 THB 229-TCP-35mm-LF 05-May-17 49 168 0

Q042034 THB 229-TCP-35mm-LF 29-Sep-17 50 168 0

Q042035 THB 229-TCP-35mm-LF 29-Sep-17 50 168 0

Q042036 THB 229-TCP-35mm-LF 29-Sep-17 50 168 0


Pg. 80/80

Revision History

Rev No Description Effective Date

01 Original 13-Apr-2018

quality and reliability report - silicon labs · pdf filequality and reliability report...

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