proposed 1x device binding solution based on sx40-20130321-002 & sx40-20130321-004 3gpp2 tsg-sx...

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Proposed 1x Device Binding Solution Based on SX40-20130321-002 & SX40-20130321- 004 3GPP2 TSG-SX WG4 SX40-20130321-008 Source(s): Qualcomm Incorporated Alcatel-Lucent (TBC) Contact(s): Anand Palanigounder, [email protected] Aram Perez, [email protected] Simon Mizikovsky, [email protected] (TBC) Recommendation: For Discussion & Agreement Notice The contributors grants a free, irrevocable license to 3GPP2 and its Organizational Partners to incorporate text or other copyrightable material contained in the contribution and any modifications thereof in the creation of 3GPP2 publications; to copyright and sell in Organizational Partner’s name any Organizational Partner’s standards publication even though it may include all or portions of this contribution; and at the Organizational Partner’s sole discretion to permit others to reproduce in whole or in part such contribution or the resulting Organizational Partner’s standards publication. The contributors are also willing to grant licenses under such contributor copyrights to third parties on reasonable, non- discriminatory terms and conditions for purpose of practicing an Organizational Partner’s standard which incorporates this contribution. This document has been prepared by the contributors to assist the development of specifications by 3GPP2. It is proposed to the Committee as a basis for discussion and is not to be construed as a binding proposal on the contributors. The contributors specifically reserves the right to amend or modify the material contained herein and nothing herein shall be construed as conferring or offering licenses or rights with respect to any intellectual property of the contributors other

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Page 1: Proposed 1x Device Binding Solution Based on SX40-20130321-002 & SX40-20130321-004 3GPP2 TSG-SX WG4 SX40-20130321-008 Source(s): Qualcomm Incorporated

Proposed 1x Device Binding SolutionBased on SX40-20130321-002 & SX40-20130321-004

3GPP2 TSG-SX WG4SX40-20130321-008

Source(s): Qualcomm Incorporated Alcatel-Lucent (TBC)

Contact(s):Anand Palanigounder, [email protected]

Aram Perez, [email protected] Simon Mizikovsky, [email protected] (TBC)

Recommendation: For Discussion & Agreement

NoticeThe contributors grants a free, irrevocable license to 3GPP2 and its Organizational Partners to incorporate text or other copyrightable material contained in the contribution and any modifications thereof in the creation of 3GPP2 publications; to copyright and sell in Organizational Partner’s name any Organizational Partner’s standards publication even though it may include all or portions of this contribution; and at the Organizational Partner’s sole discretion to permit others to reproduce in whole or in part such contribution or the resulting Organizational Partner’s standards publication. The contributors are also willing to grant licenses under such contributor copyrights to third parties on reasonable, non-discriminatory terms and conditions for purpose of practicing an Organizational Partner’s standard which incorporates this contribution.This document has been prepared by the contributors to assist the development of specifications by 3GPP2. It is proposed to the Committee as a basis for discussion and is not to be construed as a binding proposal on the contributors. The contributors specifically reserves the right to amend or modify the material contained herein and nothing herein shall be construed as conferring or offering licenses or rights with respect to any intellectual property of the contributors other than provided in the copyright statement above.

Page 2: Proposed 1x Device Binding Solution Based on SX40-20130321-002 & SX40-20130321-004 3GPP2 TSG-SX WG4 SX40-20130321-008 Source(s): Qualcomm Incorporated

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Background

• This proposal attempts to merge key concepts from proposals in SX40-20130321-002 & SX40-20130321-004 for 1x Device Binding– This is a based on offline discussions among the

contributors of these proposals

• We propose that WG4 discuss and approve the solution concepts– This concept solution will be used as a baseline for

further discussions & contributions

Page 3: Proposed 1x Device Binding Solution Based on SX40-20130321-002 & SX40-20130321-004 3GPP2 TSG-SX WG4 SX40-20130321-008 Source(s): Qualcomm Incorporated

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1x Device Binding Message Flow

Adapted from SX40-20130321-004 & modified

Page 4: Proposed 1x Device Binding Solution Based on SX40-20130321-002 & SX40-20130321-004 3GPP2 TSG-SX WG4 SX40-20130321-008 Source(s): Qualcomm Incorporated

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Description of New Terms (1)

• MEID_SIG_REQ: this new item is an indication to the MS to return validated MEID ( MEID_SIG)– Whether it is a new record type in the 1x Status

Request or a new IE is FFS• If a new IE, can it include a nonce from MSC is FFS; • In no new IE, then the 1x RAND is used in MEID_SIG

calculation

Page 5: Proposed 1x Device Binding Solution Based on SX40-20130321-002 & SX40-20130321-004 3GPP2 TSG-SX WG4 SX40-20130321-008 Source(s): Qualcomm Incorporated

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Description of New Terms (2)• MEID_SIG: this new IE contains digital signature / HMAC

– If MS has KME (a key shared between MS & HLR)provisioned, MEID_SIG should contain HMAC

– If MS has a certificate (private / public key pairs) provisioned, MEID_SIG should contain digital signature

• FFS: Is there a need to indicate to MS whether to use KME / certificate for MEID_SIG calculation?

• Profile for digital signature/HMAC calculation is FFS• ECC is a likely candidate for digital signature because of its size

Page 6: Proposed 1x Device Binding Solution Based on SX40-20130321-002 & SX40-20130321-004 3GPP2 TSG-SX WG4 SX40-20130321-008 Source(s): Qualcomm Incorporated

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Assumptions

• An MSC that supports device binding will always include MEID_SIG_REQ in the Status Request (MEID_ME) message irrespective of whether the binding check is required for a given MS

• An MS that does not support device binding will ignore the MEID_SIG_REQ field and only return MEID_ME in the (Extended) Status Response

Page 7: Proposed 1x Device Binding Solution Based on SX40-20130321-002 & SX40-20130321-004 3GPP2 TSG-SX WG4 SX40-20130321-008 Source(s): Qualcomm Incorporated

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Open Issues• If the MNO is known, KME can be pre-provisioned at

manufacturing time and the MNO provisions it in their network– Whether there is a need to specify OTA KME provisioning / change after

ME manufacturing is FFS

• A certificate, associated with the MEID, is pre-provisioned at manufacturing time– How HLR gets the MS’s certificate for MEID_SIG validation is FFS

• HLR can obtain it based on the MEID – e.g., from a database

• MS could include it in the MEID_SIG along with digital signature– introduces additional overhead in message size

• If TSG-SX WG2 does not prefer adding new IE to X.S0008, then message flow in Fig. 1 of 20130321-004 needs to be reconsidered

Page 8: Proposed 1x Device Binding Solution Based on SX40-20130321-002 & SX40-20130321-004 3GPP2 TSG-SX WG4 SX40-20130321-008 Source(s): Qualcomm Incorporated

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Proposal

• Discuss & Adopt