product specification of wm-bg-mr-03 wlan + bluetooth 2.1...

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Wireless Products BU

Product Specification

of WM-BG-MR-03

WLAN + Bluetooth 2.1 EDR

Combo SiP Module

SOURCE ORGANIZATION: USI WP/RD/WM/HW1

Document No. Rev. 1.8 Product Code WM-BG-MR-03 Product No.

HW Prepared by︰ Camus Chen Date: 2008/12/17

Checked by︰ Date:

Approved by︰ Date:

Concurrence (MD): Date:

Concurrence (PM): Date:


Universal Scientific Industrial Corp. Doc No. Rev 1.8 Date. 2008/12/17 Description Product Specification – WM-BG-MR-03

INDEX

1 REVERSION HISTORY ......................................................................................................................... 3

2 PURPOSE............................................................................................................................................... 4

3 INTRODUCTION .................................................................................................................................... 4

4 FEATURES ............................................................................................................................................. 5

5 ELECTRICAL SPECIFICATION ........................................................................................................... 6

5.1 SUPPLY VOLTAGE.................................................................................................................................. 6 5.2 RECOMMENDED OPERATION CONDITIONS ............................................................................................. 6 5.3 POWER CONSUMPTION ......................................................................................................................... 6 5.4 WIRELESS SPECIFICATIONS .................................................................................................................. 6 5.5 RADIO SPECIFICATIONS 802.11B/G WLAN............................................................................................ 7 5.6 RADIO SPECIFICATIONS 802.15 BLUETOOTH ......................................................................................... 8 5.7 PIN DEFINITION ..................................................................................................................................... 8 5.8 MODULE PIN-OUT AND RECOMMEND FOOTPRINT ............................................................................... 11

Module Pin-Out ..................................................................................................................................... 11 Recommend Footprint .......................................................................................................................... 12

5.9 OTHER SPECIFICATION ........................................................................................................................ 13 5.9.1 External Sleep Clock Timing ................................................................................................ 13 5.9.2 External Reset Specification ................................................................................................. 13 5.9.3 SDIO Host Interface .............................................................................................................. 14 5.9.4 G-SPI Host Interface ............................................................................................................. 16 5.9.5 UART Host Interface ............................................................................................................. 17 5.9.6 PCM Interface ........................................................................................................................ 18 5.9.7 Audio Interface Signals ......................................................................................................... 19

6 MECHANICAL SPECIFICATION ....................................................................................................... 20

7 LASER MARK ...................................................................................................................................... 21

8 RECOMMANDED REFLOW PROFILE ............................................................................................. 21



1 REVERSION HISTORY

Version No.

Revised Date Revised by Description Notes

1.0 2007-03-12 Jaddy Chen Preliminary Specification Released

1.1 2007-11-23 Camus Chen Block Diagram, Voltage, Pin Definition, Recommend Footprint

1.2 2007-11-23 Camus Chen Block Diagram, Radio Specification

1.3 2007-12-21 Camus Chen Bottom Pin-out Dimension, Recommend Footprint

1.4 2008-08-01 Camus Chen Revise type of formation

1.5 2008-09-05 Camus Chen Feature of Bluetooth Standard, Operation Temperature

1.6 2008-10-08 Camus Chen Module Footprint & Pin-out drawing; Module height; Current consumption

1.7 2008-10-14 Camus Chen TDO, BRF_TR_N & BRF_TR_P pin description Pin VDD_BT rename to VDD_1.8

1.8 2008-12-17 Camus Chen

Output Power: 13dBm for WLAN 802.11g 15dBm for WLAN 802.11b 4dBm for Bluetooth

Current Consumption: 200mA for WLAN Tx & Rx 260mA for Bluetooth

Rx Sensitivity: WLAN: -74dBm@54M; -91dBm@6M; -89dBm@11M; -97dBm@1M Bluetooth: -90dBm



2 PURPOSE The purpose of this document is to define the product specification for 802.11b/g WiFi + Bluetooth 2.1 EDR SiP module WM-BG-MR-03.

3 INTRODUCTION The wireless module WM-BG-MR-03 which refers as “SiP combo module” is a small size module that provides full function of 802.11g/b and Bluetooth class 2.1 EDR in a tiny module via 52 pins LGA Foot Print. This multi- functionality and board to board physical interface provides SDIO/SPI interface for WiFi and UART/SDIO interface for Bluetooth. The small size & low profile physical design make it easier for system design to enable high performance wireless connectivity without space constrain. The low power consumption and excellent radio performance make it the best solution for OEM customers who require embedded 802.11g Wi-Fi + Bluetooth features, such as, Wireless PDA, Smart phone, MP3, PMP, slim type Notebook, VoIP phone etc. The module is based on Marvell 88W8688 chipset which is a WiFi+BT SOC. The Radio architecture & high integration MAC/BB chip provide excellent sensitivity with rich system performance. The module is designed as single antenna for WiFi and Bluetooth for the application of small size hand held device. For the software and driver development, USI provides extensive technical document and reference software code for the system integration under the agreement of Marvell International Ltd. Hardware evaluation kit and development utilities will be released base on listed OS and processors to OEM customers.



4 FEATURES Item Description Notes Chip Set Marvell 88W8688 Module Interface Type SDIO (1bit and 4 bit) , G-SPI, UART Module Connection 52pin LGA

Applications

WLAN/Bluetooth enabled cellular handsets WLAN/Bluetooth headsets Portable audio/video devices and accessories Gaming platforms WLAN/Bluetooth enabled digital still cameras and printers

Standard

IEEE 802.11 WLAN:802.11 data rates of 1 and 2 Mbps 802.11b data rates of 5.5 and 11 Mbps 802.11a/g data rates of 6, 9, 12, 18, 24, 36, 48, and 54 Mbps for multimedia content transmission 802.11e Quality of Service (QoS) 802.11h DFS statistics processing 802.11h transmit power control 802.11j channels (Japan) 802.11s mesh networking Bluetooth: Bluetooth 2.1+EDR Baseband and radio basic data rate and EDR packet types—1 Mbps (GFSK), 2 Mbps ( /4-DQPSK), and 3Mbps (8DPSK) Bluetooth Class 2

Data Rate 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps, auto rate

802.11b: 11, 5.5, 2, 1 Mbps, auto rate Bluetooth: 3, 2, 1 Mbps

Modulation

WLAN:

OFDM (54, 48, 36, 24, 18, 12, 9, 6Mbps) CCK (11Mbps, 5.5Mbps) DQPSK (2Mbps) DBPSK (1Mbps) Bluetooth: 8DPSK (3Mbps) π/4-DQPSK (2Mbps) GFSK (1Mbps)

WLAN Encryption

AES-CCMP hardware implementation as part of 802.11i security standard WPA (Wi-Fi Protected Access) encryption WEP 64- and 128-bit encryption with hardware TKIP processing IPSEC security acceleration in hardware

Operating Frequency 2.4GHz ISM band

Operating Channels

WLAN: Channels 1–14 (depending on Regulatory Domain settings)

Bluetooth: Channels 0-78



5 ELECTRICAL SPECIFICATION

5.1 SUPPLY VOLTAGE Symbol Parameter Min Typ Max Unit

VDD_3.3 3.3V Power Supply 3.0 3.3 3.6 V

VDD_HOST_IO Host Interface Power Supply 1.62 1.8 1.98 V 2.97 3.3 3.63 V

Voltage ripple (Not exceeding Operating voltage) -2 +2 %

5.2 RECOMMENDED OPERATION CONDITIONS Temperature, humidity Symbol Parameter Min Typ Max UnitTo Operation Temperature -20 - 65 0C Ts Storage Temperature -40 85 0CHumidity (Non Condensing, Relative Humidity) 95 %

5.3 POWER CONSUMPTION Voltage : VDD_3.3 Operating Voltage 3.0~3.6 Volt Current Consumption (WLAN & Bluetooth are both turned on)

Condition Typical (3.3V, 25 degree C)

Maximum (3.0~3.6V, -20~65 degree C)

WLAN Transmit(54Mbps, duty-cycle, 13 dBm) 200mA 250mA WLAN Transmit(54Mbps, continuous, 13 dBm) 200mA 250mA WLAN Transmit(11Mbps, duty-cycle, 15 dBm) 200mA 250mA WLAN Transmit(11Mbps, continuous, 15 dBm) 200mA 250mA WLAN Receive(54Mbps, -70 dBm) 200mA 250mA WLAN Receive(11Mbps, -70 dBm) 200mA 250mA PDn Asserted <1.0mA 1.5mA Bluetooth Continuous Tx EDR Mode 260mA 300mA Bluetooth Continuous Rx EDR Mode 260mA 300mA

5.4 WIRELESS SPECIFICATIONS The WM-BG-MR-03 module complies with the following features and standards: Features DescriptionWLAN Standards IEEE 802 Part 11b/g (802.11b/g) Bluetooth Standards BluetoothTM 2.1 + EDR Antenna Port Support Single Antenna for WLAN + Bluetooth Frequency Band 2.4GHz ISM Band



5.5 RADIO SPECIFICATIONS 802.11B/G WLAN Over full range of values specified in the “Recommended Operation Condition” unless specified otherwise. Features DescriptionFrequency Band 2.4000 – 2.4835 GHz (2.4 GHz ISM Band) Number of selectable Sub channels

14 channels (f=2412+n*5 MHz, n=0,…,12; channel 14=2484MHz)

Modulation OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK, DQPSK, CCK , 16QAM, 64QAM

Supported rates 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 36, 48, 54 Mbps Maximum receive level - 10dBm (with PER < 8%) Output Power 15 dBm +2.0 /-1.5 dBm for 1, 2, 5.5, 11Mbps

13 dBm +2.0 /-1.5 dBm for 6 , 9 and > 12Mbps Carrier Frequency Accuracy +/- 25ppm

(crystal: +/-5ppm in 250C) Transmitter 802.11g EVM Requirement Item Data Rate (Mbps) Relative Constellation Error (dB) EVM (%RMS)

1 6 (BPSK) -5 56.2 2 9 (BPSK) -8 39.8 3 12 (QPSK) -10 31.6 4 18 (QPSK) -13 22.4 5 24 (16-QAM) -16 15.8 6 36 (16-QAM) -19 11.2 7 48 (64-QAM) -22 7.9 8 54 (64-QAM) -25 5.6

802.11b EVM

Item Data Rate (Mbps) EVM (%RMS) 1 1 (BPSK) 35% 2 2 (QPSK) 35% 3 5.5 (QPSK) 35% 4 11 (QPSK) 35%

Receiver Receiver Characteristics ( 3.3V, 25 degree C )

Typical Maximum Unit

PER <8%, Rx Sensitivity @ 1 Mbps -97 -93 dBm






5.6 RADIO SPECIFICATIONS 802.15 BLUETOOTH Over full range of values specified in the “Recommended Operation Condition” unless specified otherwise. Features DescriptionFrequency Band 2.4000 – 2.4835 GHz (2.4 GHz ISM Band) Number of selectable Sub channels

79 channels (f=2402+k MHz, k=0,…,78)

Modulation FHSS (Frequency Hopping Spread Spectrum) GFSK

Supported rates 1, 2, 3 Mbps Maximum receive level 3dBm Output Power -6dBm~4dBm (Typical 4dBm, module will set to 2dBm) Sensitivity – Single Slot Package 1Mbps: 90dBm @ 0.1% BER (Typical in 250C)

(maximum -86dBm)

5.7 PIN DEFINITION No Pin Name Type Description 1 GND GND Ground 2 TDO I/O No Connection 3 GND GND Ground 4 ANT I/O Antenna Port (50ohm) 5 GND GND Ground

6 PDN I Pull up by 100Kohm, Full Power Down (Active Low)

7 RESETn I Reset (Active Low), leave open if no use

8 GPIO_8 I/O General I/O Port, Leave open if no use Bluetooth Interface: UART_CTS

9 GPIO_7 I/O General I/O Port, Leave open if no use Bluetooth Interface: UART_SINT

10 GPIO_6 I/O

General I/O Port, Leave open if no use Bluetooth Interface: UART_SOUT For External Reference Clock Frequency Configure

11 GPIO_5 I/O General I/O Port, Leave open if no use Bluetooth Interface: UART_DTR

12 GND I/O Ground

13 SLEEP_CLK I Clock Input for External Sleep Clock (+/-250ppm)

14 GND GND Ground

15 SD_D3 I/O SDIO 4-bit Mode: Data Line Bit [3] G-SPI Mode: G-SPI Clock Request

16 SD_D2 I/O SDIO 4-bit Mode: Data Line Bit [2] G-SPI Mode: G-SPI Interrupt Output (Active Low)

17 SD_D1 I/O SDIO 4-bit Mode: Data Line Bit [1] G-SPI Mode: G-SPI Data Output

18 SD_D0 I/O SDIO 4-bit Mode: Data Line Bit [0] G-SPI Mode: G-SPI Chip Select Input (Active Low)



19 SD_CMD I/O SDIO 4-bit Mode: Command / Response G-SPI Mode: G-SPI Data Input

20 SD_CLK I/O SDIO 4-bit Mode: Clock Input G-SPI Mode: G-SPI Clock Input

21 GND GND Ground

22 VDD_HOST_IO POWER

Host I/F Voltage: 3.3VConnect to 3.3V power supply Host I/F Voltage: 1.8V Connect to 1.8V power supply Not need to prepare external 1.8V power supply by connecting #22 and #48 (1.8V terminal)

23 GND GND Ground

24 GPIO_4 I/O General I/O Port, Leave open if no use WLAN MAC wake-up input

25 GPIO_3 I/O General I/O Port, Leave open if no use Bluetooth Interface: UART_DSR

26 GPIO_2 I/O General I/O Port, Leave open if no use Bluetooth Interface: RTS

27 GND GND Ground

28 GPIO_1 I/O General I/O Port, Leave open if no use WLAN Status LED output

29 GPIO_0 I/O General I/O Port, Leave open if no use External Oscillator Control

30 ANT_SEL_N I/O WLAN Host Interface Select Pin SDIO Mode: No Connect G-SPI Mode: No Connect

31 BRF_TR_N I/O No Connection 32 BRF_TR_P I/O No Connection

33 GPIO_9 I/O General I/O Port, Leave open if no use AIU: AIU_TWSI_CLK

34 GPIO_10 I/O General I/O Port, Leave open if no use AIU: AIU_TWSI_DATA

35 GPIO_11 I/O General I/O Port, Leave open if no use PCM: PCM_DIN AIU: I2S_DIN

36 GPIO_12 I/O General I/O Port, Leave open if no use PCM: PCM_DOUT AIU: I2S_DOUT

37 GPIO_13 I/O General I/O Port, Leave open if no use PCM: PCM_CLK AIU: I2S_BCLK

38 GND GND Ground 39 GND GND Ground 40 GND GND Ground

41 GPIO_17 I/O

WLAN Host Interface Select Pin WLAN Status LED output SDIO Mode: No Connect G-SPI Mode: Pull Down by 100Kohm

42 GPIO_16 I/O General I/O Port, Leave open if no use AIU: AIU_SPDIF



43 GPIO_15 I/O General I/O Port, Leave open if no use PCM: PCM_MCLK AIU: I2S_CCLK

44 GPIO_14 I/O General I/O Port, Leave open if no use PCM: PCM_SYNC AIU: I2S_LRCLK

45 GND GND Ground 46 VDD_3.3 POWER Connect to 3.3V DC supply 47 VDD_3.3 POWER Connect to 3.3V DC supply

48 VDD_1.8 POWER 1.8V DC monitor terminal , need 1uF decoupling capacitor

49 VDD_1.8 POWER 1.8V DC monitor terminal , need 1uF decoupling capacitor

50 GND GND Ground

51 ECSn I/O Boot from SPI EEPROM: Pull down by 100Kohm Boot from Host Interface: NC

52 SCLK I/O NC This is for Boot setting of ROM.



5.8 MODULE PIN-OUT AND RECOMMEND FOOTPRINT MODULE PIN-OUT



RECOMMEND FOOTPRINT



5.9 OTHER SPECIFICATION 5.9.1 EXTERNAL SLEEP CLOCK TIMING External Sleep Clock is powered from VDD_HOST_IO voltage supply. Note: Limited to within 10℃ variance. Symbol Parameter Min Typ Max Units CLK Clock Frequency

Range 32 or 32.768 – 50 ppm 32 or

32.768 32 or 32.768 + 50 ppm kHz

THIGH Clock high time 40 -- -- ns TLOW Clock low time 40 -- -- ns TRISE Clock rise time -- -- 5 ns TFALL Clock fall time -- -- 5 ns 5.9.2 EXTERNAL RESET SPECIFICATION



5.9.3 SDIO HOST INTERFACE



5.9.4 G-SPI HOST INTERFACE



5.9.5 UART HOST INTERFACE WM-BG-MR-03 supports a high speed Universal Asynchronous Receiver/Transmitter (UART) interface, compliant to the industry standard 16550 specification. High speed baud rates are supported to provide the physical transport between the device and the host for exchanging Bluetooth data. Below shows the rates supported.



The UART interface features include: FIFO mode permanently selected for transmit and receive operations Two pins for transmit and receive operations Additional flow controls available through the GPIO pins The UART interface operation includes: Upload boot code to the internal CPU (for debug purposes) Support diagnostic tests Support data input/output operations for peripheral devices connected through a standard UART interface (runs concurrently with the WLAN function)

5.9.6 PCM INTERFACE The 88W8688 supports a Pulse Code Modulation (PCM) interface that provides: Master or slave mode PCM bit width size of 8 bits or 16 bits Up to 4 slots with configurable bit width and start positions Short frame and long frame synchronization



5.9.7 AUDIO INTERFACE SIGNALS



6 MECHANICAL SPECIFICATION Dimension : 9.5x9.5x1.3 mm



7 LASER MARK

8 RECOMMANDED REFLOW PROFILE

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