preventing pad cratering during ict using sherlock
DESCRIPTION
Pad cratering is defined as cracking which initiates within the laminate during a dynamic mechanical event such as In Circuit Testing (ICT), board depanelization, connector insertion, and other shock and vibration inducing activities. Simulation can be used to prevent this serious but prevalent failure. Pad cratering was first recognized in BGA packages but newer leadless, bottom termination components are also vulnerable.TRANSCRIPT
![Page 1: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/1.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com © 2004 – 2010
Preventing Pad Cratering During ICT Using Sherlock
DfR Solutions Webinar
November 21, 2013
![Page 2: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/2.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Pad cratering is defined as cracking which initiates within the
laminate during a dynamic mechanical event such as In Circuit
Testing (ICT), board depanelization, connector insertion, and
other shock and vibration inducing activities.
Simulation can be used to prevent this serious but prevalent
failure. Pad cratering was first recognized in BGA packages
but newer leadless, bottom termination components are also
vulnerable.
Pad Cratering
![Page 3: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/3.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
o Cracking initiating within the PCB laminate during a
dynamic mechanical event
o In circuit testing (ICT), board depanelization, connector insertion,
shock and vibration, etc.
Pad Cratering: Strain & Flexure
![Page 4: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/4.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Laminate Cracking Leads to Trace Fracture
Bending
Force
Functional failure
will occur
Trace routed externally
![Page 5: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/5.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com 5
Pad Cratering
Drivers
Finer pitch components
More brittle laminates
Stiffer solders (SAC vs. SnPb)
Presence of a large heat sink
Location
PCB thickness
Component size & rigidity
Temperatures & cooling rates
Difficult to detect using standard procedures
X-ray, dye-n-pry, ball shear, and ball pull
Intel (2006)
![Page 6: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/6.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com 6
Is Pad Cratering a Pb-Free Issue? No, but…
Paste Solder BallAverage Fracture
Load (N)Std Dev (N)
SnPb SnPb 692 93
SnPb 656 102
Sn4.0Ag0.5Cu 935 190Sn4.0Ag0.5Cu
35x35mm, 388 I/O BGA; 0.76 mm/min
Roubaud, HPAPEX 2001
![Page 7: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/7.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Weakest link in the system fails first
BGA Mechanical Loading Failure Modes
![Page 8: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/8.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
o Failure
Modes Defined
IPC 9708
![Page 9: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/9.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
No pass / fail limits
3 strain limit
approaches
Component supplier
provided
Customer specified
Rate limited
Maximum
allowable strain
versus rate and
PCB thickness
IPC 9704
![Page 10: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/10.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
o CalPoly study showing failure of electrical testing to
capture all defects
Detecting Pad Cratering
Board Level Failure Analysis of Chip Scale Package Drop
Test Assemblies, 2008 International Microelectronics And
Packaging Society.
![Page 11: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/11.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
o Majority of failures occur at corners of packages: locations of
stress & strain concentrations
Electrical Failure Pareto from CalPoly Study
Board Level Failure Analysis of Chip Scale Package Drop
Test Assemblies, 2008 International Microelectronics And
Packaging Society.
![Page 12: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/12.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Difficult to detect using standard procedures
Companies frequently unaware of pad cratering until failure
happens
Recalls have been common and painful!
Potential warning signs:
Excessive BGA repair rate
High percentage of “defective” BGAs
High rate of “retest to pass” at in circuit test (ICT)
New X-ray potential with 3D m-CT inspection
Precision cross-sections are required to confirm
Pad Cratering Failure Analysis
![Page 13: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/13.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Design Non-critical pads Solder mask defined vs. non-solder mask defined Pad Geometry Layout & PCB thickness
Corner Glue
More compliant solder SAC305 is relatively rigid, SAC105 and SNC are possible alternatives
New laminate acceptance criteria and materials
Best Mitigation! – Avoid the problem by not overstressing the interconnect
Limitations on board flexure Simulation to predict the strains induced during ICT and highlight
potential probles 750 to 500 microstrain, component and layout dependent Process Control & Validation
Potential Mitigations to Pad Cratering
![Page 14: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/14.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
o Review/perform ICT strain evaluation at fixture supplier and in process:
o 500 µs rule of thumb, critical for BTCs, CSP, and BGA packages
o To reduce the pressures exerted on the PCB:
o First and simplest solution: reduce the probe forces when possible.
o Secondly, optimize position of the fingers/stoppers to control probe forces.
o Often difficult to achieve. Mechanically, the stoppers must be located exactly under the pressure fingers to avoid the creation of shear points
ICT Strain: Fixture & Process Analysis
![Page 15: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/15.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Eliminate potential bed of nails (ICT) damage by:
Identifying components on the circuit card that could experience
cracking or failure during bed of nails testing.
Prior to the ICT, the designer can optimize the process:
Change test points
Change pogo pin pressure, or
Add /move board supports
Sherlock analysis is component-specific, allowing for more
precise identification of at-risk areas
Sherlock Software
![Page 16: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/16.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Designers can identify
potential bed of nails
damage early in the
layout process, before a
bed of nails tester is
ever designed
Allows for tradeoff
analyses, saving costly
board damage and
redesign.
Sherlock – Automated Design Analysis Software
![Page 17: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/17.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
o Test points are automatically loaded if defined in pick and place or the odb++ archive
o Fixture locations can also be imported
Setup Test Points and Fixtures
![Page 18: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/18.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Test Point Modification
![Page 19: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/19.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
o Guide Pins (mount hole) constrained
in-plane (x,y) but can move up and
down
o Support pin just constrained in the Z
direction
ICT Fixtures
![Page 20: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/20.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Finite Element Mesh
![Page 21: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/21.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Displacement
![Page 22: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/22.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Strain Results
![Page 23: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/23.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Component Risk
![Page 24: Preventing Pad Cratering During ICT Using Sherlock](https://reader033.vdocuments.site/reader033/viewer/2022052600/557b2cf8d8b42a4e048b53fa/html5/thumbnails/24.jpg)
© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Pad Cratering is an increasingly common failure mode
Catastrophic and non-reworkable
Easy to avoid detection and difficult to diagnose
Partial cracks riskiest since they escape and expand in the field
Multiple paths for mitigation
Few for true prevention
Best mitigation is to reduce board level strains
No hard, fast rules for avoidance
Dependent on design, component, layout, process…
Simulation can be used to quantify the strains associated with ICT
Pad Cratering Conclusions