1 21 June 2012

SNS SECURITIES SMALL & MIDCAP SEMINAR,

21 JUNE 2012

2 21 June 2012

SAFE HARBOR STATEMENT

This presentation contains statements about management's future expectations, plans and prospects of our business that

constitute forward-looking statements, which are found in various places throughout the press release, including, but not

limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of

purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use

of words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,

“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward looking

statements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitute forward

looking statements. While these forward looking statements represent our judgments and expectations concerning the

development of our business, a number of risks, uncertainties and other important factors could cause actual developments

and results to differ materially from those contained in forward looking statements, including our inability to maintain

continued demand for our products; the impact on our business of potential disruptions to European economies from Euro

zone sovereign credit issues; failure of anticipated orders to materialize or postponement or cancellation of orders,

generally without charges; the volatility in the demand for semiconductors and our products and services; failure to

adequately decrease costs and expenses as revenues decline, loss of significant customers, lengthening of the sales cycle,

incurring additional restructuring charges in the future, acts of terrorism and violence; risks, such as changes in trade

regulations, currency fluctuations, political instability and war, associated with substantial foreign customers, suppliers and

foreign manufacturing operations; potential instability in foreign capital markets; the risk of failure to successfully manage

our diverse operations; those additional risk factors set forth in Besi's annual report for the year ended December 31,

2011 and other key factors that could adversely affect our businesses and financial performance contained in our filings and

reports, including our statutory consolidated statements. We are under no obligation to (and expressly disclaim any such

obligation to) update or alter our forward-looking statements whether as a result of new information, future events or

otherwise.

3 21 June 2012

AGENDA

I. Company Overview

II. Market

III. Strategy

IV. Financial Review

V. Summary

4 21 June 2012

I. COMPANY OVERVIEW

5 21 June 2012

I. COMPANY OVERVIEW

• Leading assembly equipment supplier with #1 and #2 positions in key products. 27% addressable market share

• Broad portfolio: die attach, packaging, plating, wire bond

• Strategic positioning in wafer level and substrate packaging

• Global manufacturing operations in 7 countries; 1,618 employees worldwide. HQ in Duiven, the Netherlands

Corporate Profile

• 2011 revenue and net income of € 326.9 and € 26.7 million

• Cash at 3/31/12: € 93.5 million

• Total debt at 3/31/12: € 23.1 million Financial Highlights

• 2009 acquisition, restructuring and Asian production transfer have transformed company and earnings potential

• Advanced packaging, smart phone/tablet growth and Asian production transfer offer significant upside potential

• Stock market valuation at significant discount to peers

Investment Considerations

6 21 June 2012

Dicing

Back-end Semiconductor Assembly Process

Die Attach Wire Bond Packaging Plating

Leadframe Assembly

Substrate

Wire Bond Assembly

Substrate

Flip Chip Assembly

Wafer Level Packaging

Flip Chip Assembly

Wire Bond

Die Bond

FC Die Bond

FC Die Bond

Molding

Molding

Molding

Trim & Form

Singulation

Singulation

Singulation

Plating

Ball Grid Array

Ball Grid Array

Die Sort

Die Sort

Die Sort

Die Attach Packaging Ball Attach

I. BESI PRODUCT POSITIONING

7 21 June 2012

I. BESI EQUIPMENT PORTFOLIO

Die Attach

• Die Bonding

- 2100 xP

- 2009 series

- 2100 hS

- 2100 sD

• Component

Packaging

- 2200 evo

• Flip Chip - 8800 Quantum

- 8800 Chameo

- "Smart Line"

- 2100FC

Packaging & Plating Wire Bonding

• Die Sorting

- DS 9000E

- CS 1250

- DS 11000

• 3100

• 3100

Smart Card

• 3200 Smart

Card

• Molding

- AMS series

- AMS Foil

- AMS WLM

• Trim & Form

- Compact series

- Power series

- Compact Line

XHD

• Singulation

- FSL

• Plating

- Leadframe

- Solar

- Film & foil

New

New

New

In Development

• Common die attach platform

• Common packaging platform

New

New

New

8 21 June 2012

0

50

100

150

200

250

300

350

400

2003 2004 2005 2006 2007 2008 2009 2010 2011

Re

ve

nu

e (

€ m

illio

n)

I. CORPORATE TRANSFORMATION

Restructuring

Asian Production Transfer

Dragon I

complete:

€ 6 million

cost savings

Dragon II

complete:

€ 15 million

cost savings

Die Attach Acquisitions

Record Revenue:

€ 351 million

Record Profit:

€ 47 million

Standard packaging and DC die bonding

systems transferred to Malaysia

Dutch tooling & Hungarian

die bonding transferred

Initial

shipments

of Esec

2100 from

Malaysia

Expanding

Asian

capacity in

‘12/’13

€ 14 million spent to build, expand and equip Malaysian system and Chinese

tooling operations

Asian headcount increased from 34% in ‘06 to 51% in ‘11

Esec 2100

transfer

completed

€ 8.5 million

cost savings

plan

initiated

9 21 June 2012

Customers End Products End Use

I. CUSTOMER ECOSYSTEM

• Blue chip customer base, top 10 customers represent 44.7% of 2011 revenue

• Leading IDMs and Asian Subcontractors. 41%/59% split in 2011

• Long term relationships, some exceeding 45 years

10 21 June 2012

Computer, PCs50%

Tablets & Wireless Devices

22%

Auto13%

Industrial10%

LED

3%

Service2%

2008

I. PRODUCT SHIFT TO ADVANCED PACKAGING

END USER APPLICATIONS

Computer, PCs21%

Tablets &

Wireless Devices

35%

Auto

17%

Industrial10%

LED

5%

Service12%

2011

Source: 2011 Company Estimates

• Tablets and

wireless devices

now represent

35% of estimated

end user revenue

• Automotive has

also grown

significantly in

recent years

• Service/spare

parts has grown

to 12%. Less

cyclical revenue

stream

11 21 June 2012

II. MARKET

12 21 June 2012

2,9

2,1

4,5

4,24,0

4,4

4,8

4,3

5,0

-26,2% -28,2%

120,5%

-7,8% -5,3%

11,7%7,4%

-9,2%

15,6%

0

1

2

3

4

5

6

2008 2009 2010 2011 2012E 2013E 2014E 2015E 2016E

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

140%

160%

Assembly Equipment Market Size (Apr 2012 VLSI) YoY Growth Rate (Apr 2012 VLSI)

CAGR

‘11-’16: 3.6%

II. ASSEMBLY EQUIPMENT MARKET FORECAST

• 2011 assembly market revised growth revised downwards by VLSI to -7.8%

• 2012 looks much better than initial forecasts. -5% vs. initial forecast of -21%

Source: VLSI April 2012

13 21 June 2012

(In US$ millions)

2011

Market Size

2011

Market

Share

2010

Market

Share

2009

Market

Share

2008

Market

Share

Competition

Company

Position

Die Attach 1,015.2 32% 29% 29% 27%

Die Bonding 749.7 33% 28% 27% N/A ASM-PT, Shinkawa,

Panasonic, Renesas, K/S

#1

Multi Module N/A N/A N/A N/A N/A Panasonic #1

Flip Chip 207.7 29% 33% 32% N/A Panasonic, ASM-PT #1

Die Sorting 57.8 30% 26% 11% N/A Muhlbauer, ASM-PT #2

Packaging 668.0 12% 10% 13% 12%

Molding 407.2 15% 9% 13% 13% Towa, ASM-PT, Yamada, Dai

Ichi Seiko

#2

T&F 113.9 11% 19% 17% 12% ASM-PT, Gallant #2

Saw/Laser Singulation 138.2 4% 4% 8% 13% Hanmi, Rocco #3

Plating 25.9 92% 90% 98% 38% AGM, Technic #1

Total Addressable Mkt 1,700 27% 24% 27% 21% ASM-PT, Panasonic #1

Total Assembly Mkt 4,192 14% 14% 11% 12% ASM-PT, K/S #3

• Gained market share in 2011 particularly in molding, die sorting and die bonding products

• 27% addressable market share. Well positioned in highest growth areas

• Accuracy, precision and speed distinguishes Besi vs. competition, particularly for mainstream market

Source: VLSI January 2012

II. BESI COMPETITIVE POSITION

14 21 June 2012

II. ADVANCED PACKAGING IS THE FUTURE

Greater Miniaturization

Greater Complexity

Increased Density

Higher Performance

Lower Power Consumption

Higher Accuracy

• High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower energy usage.

• <40 nanometer geometry will be the standard chip design over the next 3-5 years

• System on Chip or System in Package via substrate and wafer level packaging process is the only answer

• Besi has full range of AP systems. 2011E revenue: 70% substrate/wafer level vs. 30% leadframe

Die Attach

• Die Sorting: DS 9000

• Die Bonding: ES 2009, 2100

• Flip Chip: DC 8800 FC

• Multi Module: DC EVO 2200

Packaging

• Molding: AMS-W

• Singulation: FCL

High Growth End

User Areas:

Media Tablets,

Smart phones,

Digital set top

boxes, Autos, Mems

15 21 June 2012

Source: Prismark

1,050 900 850 600

400 650 850 1,500

0

500

1,000

1,500

2,000

2,500

2011 2012 2013 2014 2015 2016

mill

ion

ph

on

es

Smart Phones 2011-2016

Basic Phones Smart Phones

62.5%

30.8%

76.4%

Tablets 2011 - 2014

II. SMART PHONE / TABLET MARKET TRENDS

• Rapid unit growth in smart

phones and tablets forecast

over next 5 years

• Estimated unit growth rates:

• Smart phones:

• 2012: 62.5%

• 2016: 3.5x

• Tablets:

• 2012: 120%

• 2014: 4x

• Significant potential revenue

growth driver

16 21 June 2012

II. SMART PHONE ILLUSTRATION

Main Components Manufacturer Country Besi Systems Utilized

Processor Samsung South Korea 8800FCQ, AMS-W, Singulation

DRAM Memory Samsung South Korea 2100sD, AMS-W, Singulation

Flash Memory Chip Samsung South Korea 2100sD, AMS-W, Singulation

Battery Samsung South Korea N/A

Power Management Dialog Germany 2100sD, 2009

Compass AKM Japan N/A

Accelerator/Gyroscope ST Micro Italy/France 2100sD

Communications

Radio Frequency Memory Intel USA 8800FCQ, Singulation

Wi-Fi/Bluetooth/GPS Broadcom USA 2200 evo, AMS-W, Singulation

Receiver/Transceiver Infineon Germany 8800FCQ, AMS-I, Singulation

PA Module Skyworks, Triquint USA

2200 evo, AMS-W, Singulation, 8800 Chameo

Video/Audio

Touch Screen Control TI USA 2100sD, AMS-W, Singulation

Audio Codec Cirrus Logic USA 2100sD, AMS-W, Singulation

LCD Display LG South Korea N/A

Touch Screen Wintek USA N/A

Camera – 5/8 megapixel/VGA LG, Foxconn, CoWell

South Korea, China 2200 evo

Besi systems are capable of assembling components representing up to 50% of smart phone content

17 21 June 2012

III. STRATEGY

18 21 June 2012

III. BUSINESS STRATEGY

Vision

Technology-led, mainstream supplier of substrate and wafer level

packaging solutions

How to win

Market

positioning Fast growing, leading edge market segments

World class assembly

equipment manufacturer

Actions

Leverage "One Besi" Strategy

Enter selected

markets with

leading technology

Maximize product

value with transfer

into mainstream

Exit when

technology becomes

“commoditized”

(II) Accelerate revenue growth

(III) Reduce structural costs

(IV) Transfer production to Asia

(V) Acquire complementary companies

(I) Maintain leading edge technology

19 21 June 2012

III. STRUCTURAL TRANSFORMATION CONTINUES

2011 2012 2013

Key Operational Objectives

ES 2100 production transfer to Malaysia

ES 2009 production transfer to Malaysia

50% MY/100% China capacity expansion

12% HC reduction plan

• Keys: transfer of production and personnel to Asia. Increased efficiency of euro operations

• Asian production transfer on schedule • 32% YOY increase in Malaysian shipments in 2011. 2x increase in direct shipments • Transfer of ES 2100 production from Switzerland to Malaysia completed in 2011

• 12% headcount reduction plan initiated October 2011: € 8.5 million savings targeted. On

hold given Q1 order ramp

• € 60 million quarterly break even revenue target bettered in Q1-12

20 21 June 2012

III. AQUISITION STRATEGY

1993 1995 1997 2000 2002 2005 2010

• € 50 million packaging company has become € 327 million assembly

equipment supplier

• Acquisitions since 2000 totaling € 80 million, net have created Die Attach leader

• Seeking technology led companies which increase advanced packaging

presence and can be incorporated into One Besi platform

Packaging Plating Leadframes Flip Chip Chip Sorting Flip Chip/

Multi Chip

Single Chip

Packaging & Plating Die Attach

21 21 June 2012

IV. FINANCIAL REVIEW

22 21 June 2012

IV. SUMMARY FINANCIAL HIGHLIGHTS

• Financial transformation since 2008

• Scale and market presence have changed

due to Esec acquisition:

• Expanded mainstream presence

• Leveraged revenue potential

• Strategic positioning in advanced

packaging has yielded benefits:

• Enhanced top line growth

• Increased gross margins

• Solid gross margins and profits in 2011

despite downturn due to:

• Advanced packaging presence

• Ongoing Asian production transfer

• 2010 product line restructurings

• Solid liquidity base. Expanding net cash

• Dividend initiated in 2010

Year Ended December 31,

(€ millions, except share data) 2009 2010 2011

Revenue

147.9

351.1 326.9

Orders 162.5 376.5 301.1

Gross margin 28% 39% 40%

EBITDA 17.9 60.5 45.8

Pretax income 4.9 47.4 34.6

Net income 5.4 47.3 26.7

EPS (diluted) 0.16 1.25 0.73

Net margin 4% 13% 8%

Adj. net income (loss) (28.0) 41.6 27.4

Adj. EPS (diluted) (0.85) 1.11 0.75

Net Cash 19.6 22.9 62.7

Dividend per share - 0.20 0.22

23 21 June 2012

47.7 48.1

55.0

69.3

65.5

61.8

76.6

87.5

93.5

46.8

49.4 49.9

46.4 45.9

16.1

27.0 24.8

23.1

0

10

20

30

40

50

60

70

80

90

100

Q1-10 Q2-10 Q3-10 Q4-10 Q1-11 Q2-11 Q3-11 Q4-11 Q1-12

(euro

in m

illio

ns)

Cash Debt

IV. LIQUIDITY TRENDS

Net Cash 0.9 (1.3) 5.1 22.9 19.6 45.7 49.6 62.7 70.4

• Net cash position has grown to

€ 70.4 million from € 19.6

million at year end 2009

• Significant increase in

profitability

• Redemption and share

conversion of 5.5% convertible

notes in Q2 2011

• Improved inventory

management

• Includes € 20.2 million for

share repurchases and cash

dividends in 2011

• € 1.92 per share relative to

share price of € 5.70 at end of

Q1-12

• Strong balance sheet supports

future organic growth and

acquisition strategy

24 21 June 2012

V. SUMMARY

25 21 June 2012

V. SUMMARY

• Leading semi assembly equipment supplier with #1 or #2 positions in fastest

growing segments (smart phones/tablets). Gaining share

• Structural transformation continues. Scalability of business model seen in

recent industry cycle

• Solid profit in 2011 in challenging environment. Shareholder value enhanced

through € 20.2 million share repurchases and dividends

• Strong liquidity. € 70.4 million net cash at 3/31/12 (€ 1.92 per share)

• Business outlook for 2012 improving. 50% sequential revenue growth and

substantial profit improvement forecast for Q2-12

• Advanced packaging presence, smart phone/tablet growth and Asian

production transfer offer significant upside potential

• Attractive stock market valuation relative to peers