precision oven thermal design

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Precision Oven Thermal [Yanari] Page MI Preliminary Design Review – Nov. 18 &19, 2003 Precision Oven Thermal Design Carl Yanari HMI Thermal Control [email protected] 650-424-2942 HMI00385

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HMI00385. Precision Oven Thermal Design. Carl Yanari HMI Thermal Control [email protected] 650-424-2942. Precision Oven Thermal – Agenda. Driving Requirements Thermal Design Approach Design Trades Thermal Model Status Future Work. Driving Requirements. Oven Temperature - PowerPoint PPT Presentation

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Page 1: Precision Oven Thermal Design

Precision Oven Thermal [Yanari] Page 1HMI Preliminary Design Review – Nov. 18 &19, 2003

Precision Oven Thermal Design

Carl Yanari

HMI Thermal Control

[email protected]

650-424-2942

HMI00385

Page 2: Precision Oven Thermal Design

Precision Oven Thermal [Yanari] Page 2HMI Preliminary Design Review – Nov. 18 &19, 2003

Precision Oven Thermal – Agenda

• Driving Requirements

• Thermal Design Approach

• Design Trades

• Thermal Model Status

• Future Work

Page 3: Precision Oven Thermal Design

Precision Oven Thermal [Yanari] Page 3HMI Preliminary Design Review – Nov. 18 &19, 2003

Driving Requirements

• Oven Temperature

– Operating range 28 to 35°C

– Actively controlled to a target temperature of 30±0.1°C

– Temperature dependency of science data drives oven temperature requirement

• Oven Temperature Stability

– Temperature transients limited to 0.01°C/Hr

– Science sensitive to rapid temperature transients in Michelsons

Page 4: Precision Oven Thermal Design

Precision Oven Thermal [Yanari] Page 4HMI Preliminary Design Review – Nov. 18 &19, 2003

Thermal Design Approach

• Based on improvements to heritage MDI thermal control design

• Proportional heater control

– Vary heater power to maintain temperature rather than on-off, duty cycle control to minimize thermal transients

• Conductive thermal isolation from optical bench

– Use fiberglass (or other low conductivity material) supports

• Radiative thermal isolation from environment

– Use Multi-Layer Insulation (MLI) blanket or Aluminum tape

• Michelson thermal isolation

– Low conductance standoffs

– Thermal cover/shield

– Dampens thermal transients

MLI or Al Tapeon outside

Thermal shieldaround MichelsonMichelson on low

conductance standoffs

Oven Wall 0.1 in thickfor radiation shielding

and temperature uniformityLow conductancesupport legs

Controller pre-ampboards mounted

on oven wall

Page 5: Precision Oven Thermal Design

Precision Oven Thermal [Yanari] Page 5HMI Preliminary Design Review – Nov. 18 &19, 2003

Thermal Design Trades

• MLI Blanket vs. Al Tape– MLI provides more radiative thermal isolation than aluminum tape

– Degree of MLI benefit dependent on conductive thermal isolation provided by support legs and on stability of the Optics Package

• Level of heat leaks through legs, harnesses, and grounding strap can cause thermal coupling to be conduction dominated whereby a blanket would provide little benefit

– Contamination concerns with MLI within the optics package• Particulate generation and outgassing

• MLI used on heritage, contamination sensitive Spacecraft

– Clearance issues for MLI• Currently insufficient clearance to accommodate a blanket

– Aluminum tape was used on MDI

• Titanium vs. Fiberglass legs– Titanium thermal conductivity 16X that of fiberglass

– Requires titanium legs to be smaller diameter or thinner tube wall thickness than fiberglass legs of the same length to achieve the same degree of isolation

– Fiberglass used on MDI

– Evaluation in progress

Page 6: Precision Oven Thermal Design

Precision Oven Thermal [Yanari] Page 6HMI Preliminary Design Review – Nov. 18 &19, 2003

Precision Oven Thermal Model

• Initial MDI oven detailed thermal model developed to investigate MDI Michelson temperature transient effects observed during flight

– 1800 nodes, 4500 conduction hook-ups, and 31600 radiation hook-ups

– Investigation on-going

• Standalone HMI precision oven thermal model being developed

– Boundary conditions from HMI thermal model

– Includes Michelson detail developed for MDI model to determine transient effects

Detailed MichelsonMichelson thermal shield

Motor housing to be modified to reflect true shapeHeater Controller preampboard to be added

Support legs tobe added

Page 7: Precision Oven Thermal Design

Precision Oven Thermal [Yanari] Page 7HMI Preliminary Design Review – Nov. 18 &19, 2003

Future Work

• Understand observed MDI Michelson transient after motor activation

– HMI oven thermal design includes transient temperature mitigation

• Continue to develop detailed precision oven thermal model

– Required to determine transient effects on Michelsons

– Required for determining optimum temperature sensor location

– Thermal model validated during engineering test unit thermal vacuum test

– Reduced model will be developed for integration into the HMI thermal model

• Complete trade studies

– MLI trade will be finalized once support leg design is determined

• Design heater locations and heater control subsystem

– Size heater for cold case plus added margin

– Use MDI heritage thermal control algorithm

– Use MDI heritage temperature sensor averaging design for control

• Locate temperature sensors

– Location of sensors critical for heater operation