powerpoint presentation · •panelists presented their companies current capabilities and...

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Page 1: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 2: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 3: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 4: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 5: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 6: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 7: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 8: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 9: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 10: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 11: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 12: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design
Page 13: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design

• Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed

• Audience asked primarily IC design related questions !

• 2.5/3D technology with TSV interconnects allows integration of

entire systems --- as soon as the 2.5/3D Ecosystem is in place: - Standards, die-level building blocks, bottoms-up & top down design flows - Clearly defined hand-off points in manufacturing, COST-effective flows

Page 14: PowerPoint Presentation · •Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed • Audience asked primarily IC design