Power Management

System Integration

Research strategy 2007 - 2010ISGE & M2D Research Groups

Marise BAFLEUR

Manager of ISGE Research Group

October 2006 2

Society Needs

MiniaturizationPower efficiency

X-by-wire challengesAutomotive & avionic : ESD/EMI reliability and robustness

Challenges of emerging microsystem applicationsAmbient Intelligence : Energy autonomy

Embedded Systems & Mobile Electronic

- Generalization of electronic solutions- Increase of embedded computing power

Challenge : power generation and distribution

October 2006 3

Passivedevices

Driving and protections

Power system Integration

New devices

Systems for electrical power

conversion Modeling and Design

Architectures and Technologies

Characterization

Reliability

ISGE

October 2006 4

Scientific Goals

Three research areas:- Power management system integration

- New control, driving and protections architectures- Advanced power devices

Increase efficiency and reliabilityof power management systems

for embedded systems

A typical challenge: Microprocessor Power Supply : 0,8V-150A

Area reduction and performance improvement in terms of losses

October 2006 5

Methodology & Approach

Integrated DC-DCMicroconverter

Power Management System Integration

Integration New power devices frequency L, C

New Materials :• Magnetic

• High-K dielectric• Varistances

3D Technologies :• Deep trenches

• Double side• Use of Si volume• Original physical

mechanisms

high density capacitors

Oxide -nitride

3D capacitors110nF/mm2

October 2006 6

Use of silicon volume

Bi-directional IGBT

Dedicated ESD/EMI Protection

A

Innovative Devices

MOS

•RON - VDBR Trade-off

• Frequency increase• New SC: GaN, SiC, diamond

Pushing the physical limits

New functionalities

P+

P+

P

P

P

P

N+

P+

P+

P+

G2

G1K

N-

N+

N+N+

Oxi

de

P N

GateSource

N+ Drain

October 2006 7

New Driving Architectures

New Integrated architectures One example: multi-phase converter

DC/DC

DC/DC

DC/DC

DC/DC

DC/DC

Vin Vout IIN/N

Vout Distribution of losses Low RippleReduced EMI Emissions

Interleaved micro-inductors

October 2006 8

Alternative ESD/EMI Protections

Substrat

Métal

L

E

I

VVT1

IT2

Above IC ESD ProtectionsIntegration of new materials with

varistance properties

• Material Synthesis : coll. LCC• Above IC Integration

SIP/WLP Generic ESD/EMI Protections

• Co-design of ESD/EMI protections• Use of silicon volume • Integrated passive devices

EMI Protection

October 2006 9

ESD Characterization Platform

TLP

Parameter Extraction and modeling

VF-TLP

EMMIESD gun

October 2006 10

Towards the Power Management SiP

2006

2010

DC-DC

L , C, ESD,EMI Challenges: • f ≥ 1MHz • Deep Trenches• Magnetic Materials• Generic ESD/EMI•ESD/EMI co-design

Challenges : • f ≥ 5MHz • New DC-DC architectures• High-K Dielectric• Varistance properties materials (ESD)

DC-DCCLESD

Challenges : • f ≥ 10 MHz • New conversion functions • New storage materials• Energy scavenging (piezo, RF…)• ESD/EMI co-design

DC-DCCLµ-source ESD

October 2006 11

LAAS International Position

18 permanent researchers (ISGE & M2D groups) Support of technology platform

Leadership position among international community: CPES-Virginia Tech, TYNDALL-Cork, Cambridge University, CNM-Barcelone,…

Collaborations: TYNDALL-Cork, Cambridge University, CNM-Barcelona, Tarragona University

Leadership:

• 18 Patents (FLIMOS; protections: ESD, short-circuit, substrate current, ...; partial SOI process, …),

• Diffusion of software & models (LAASTHERM), process transfer (thermomigration),

• Program committees and organisation of main conferences (ISPSD, ISPS, EPE, EPF, BCTM, EOS/ESD, SAEEI, ESREF, EOS/ESD/EMI Workshop )