polymer capacitor
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Polymer capacitor
This article is about the polymer electrolytic capacitors
with conducting polymer as electrolyte. For the poly-
mer capacitors with insulating polymer as dielectric,
seefilm capacitor.
A polymer capacitor, or more accurately a polymer
Rectangular-shaped polymer aluminum (black) and tantalum
(brown) electrolytic chip capacitors
Cylindrical (wound) polymer Al-caps
electrolytic capacitor, isan electrolytic capacitor (e-cap)
with a solid electrolytemade of a conductive polymer.
The three different types are:
PolymerTa-cap
PolymerAl-cap
Hybrid polymer/liquid e-cap
A fourth type, polymerniobium e-caps, are not in pro-
duction.
Polymer e-caps are available in rectangular surface-
mounted device (SMD) chip style or in cylindrical SMDs
(V-chips) style or as radial leaded versions (single-ended).
Polymer capacitors are characterized by low internal
equivalent series resistances(ESR) and high ripple cur-
rent ratings. Their electrical parameters have similar
temperature dependence, reliability and service life com-
pared to solid Ta-caps, but much better temperature inde-
pendence and a longer service life than Al-caps with liq-
uid electrolytes. In general polymer e-caps have a higher
leakage current rating than others.
Polymer e-caps are mainly used as power suppliesof in-
tegrated electronic circuits as buffer, bypass and decou-
pling capacitors, especially in devices with flat or com-
pact design. Thus they compete withmulti-layer ceramic
chip (MLCC)capacitors, with highercapacitancevalues.
They display nomicrophoniceffect.
1 History
Aluminum capacitors (Al-caps) with liquid electrolyteswere invented in 1896 byCharles Pollak.
Tantalum e-caps (Ta-caps) with solid manganese diox-
ide(MnO2) electrolytes were invented by Bell Labora-
toriesin the early 1950s, as a miniaturized and more re-
liable low-voltage support capacitor to complement the
newly invented transistor.[1][2] The first Ta-caps with solid
MnO2 electrolytes had 10 times betterconductivityand
a higher ripple current load than earlier types of liquid e-
caps. Additionally, unlike standard e-caps, theequivalent
series resistance (ESR) of Ta-caps is stable in varying
temperatures.
During the 1970s the increasing digitization of electroniccircuits came with decreasing operating voltages and in-
creasing switching frequencies and ripple current loads.
This had consequences for power supplies and their e-
caps. Capacitors with lowerESRand lowerequivalent
series inductance (ESL) for bypass and decoupling ca-
pacitors used in power supply lines were needed.[3]
A breakthrough came in 1973, with the discov-
ery by Heeger and Wudl of an organic conduc-
tor, the charge-transfer salt TCNQ.[4] TCNQ (7,7,8,8-
tetracyanoquinodimethane or N-n-butyl isoquinolinium
in combination with TTF (Tetrathiafulvalene)) is a chain
molecule of almost perfect one-dimensional structure thathas 10-fold better conductivity along the chains than does
MnO2and has 100-fold better conductivity than liquid
1
https://en.wikipedia.org/wiki/Manganese_dioxidehttps://en.wikipedia.org/wiki/Tetrathiafulvalenehttps://en.wikipedia.org/wiki/7,7,8,8-tetracyanoquinodimethanehttps://en.wikipedia.org/wiki/7,7,8,8-tetracyanoquinodimethanehttps://en.wikipedia.org/wiki/Alan_J._Heegerhttps://en.wikipedia.org/wiki/Equivalent_series_inductancehttps://en.wikipedia.org/wiki/Equivalent_series_inductancehttps://en.wikipedia.org/wiki/Equivalent_series_resistancehttps://en.wikipedia.org/wiki/Equivalent_series_resistancehttps://en.wikipedia.org/wiki/Equivalent_series_resistancehttps://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivityhttps://en.wikipedia.org/wiki/Transistorhttps://en.wikipedia.org/wiki/Bell_Laboratorieshttps://en.wikipedia.org/wiki/Bell_Laboratorieshttps://en.wikipedia.org/wiki/Manganese_dioxidehttps://en.wikipedia.org/wiki/Manganese_dioxidehttps://en.wikipedia.org/wiki/Tantalum_capacitorhttps://en.wikipedia.org/wiki/Karol_Pollakhttps://en.wikipedia.org/wiki/Electrolytehttps://en.wikipedia.org/wiki/Microphonicshttps://en.wikipedia.org/wiki/Capacitancehttps://en.wikipedia.org/wiki/Ceramic_capacitor#multilayer_ceramic_chip_capacitorshttps://en.wikipedia.org/wiki/Ceramic_capacitor#multilayer_ceramic_chip_capacitorshttps://en.wikipedia.org/wiki/Power_supplyhttps://en.wikipedia.org/wiki/Equivalent_series_resistancehttps://en.wikipedia.org/wiki/Niobium_capacitorhttps://en.wikipedia.org/wiki/Aluminum_electrolytic_capacitorhttps://en.wikipedia.org/wiki/Tantalum_capacitorhttps://en.wikipedia.org/wiki/Conductive_polymerhttps://en.wikipedia.org/wiki/Electrolytehttps://en.wikipedia.org/wiki/Electrolytic_capacitorhttps://en.wikipedia.org/wiki/Film_capacitor -
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2 2 APPLICATION BASICS
Conductivities of some electrolytes
electrolytes.
OS-CON capacitors with solid TCNQ electrolyte had a typical
lilac insulation sleeve
The first Al-cap to use TTF-TCNQ was the OS-CON
series offered in 1983 by Sanyo. These were wound,
cylindrical capacitors with 10x increased electrolyte con-
ductivity compared with MnO2.[5][6][7] These capaci-
tors were used in devices for applications that required
the lowest possible ESR or highest possible ripple cur-
rent. One OS-CON e-cap could replace three more
bulky wet e-caps or two Ta-caps. By 1995, the Sanyo
OS-CON became the preferred decoupling capacitor for
Pentium processor-based personal computers.
The Sanyo OS-CON e-cap product line was sold in 2010to Panasonic. Panasonic then replaced the TCNQ salt
with a conducting polymer under the same brand.
Conducting polymers were invented by Heeger,
MacDiarmid and Shirakawa in 1975,[8] including
polypyrrole(PPy) [9] orPEDOT.[10] These lowered ESR
by a factor of 100 to 500 versus TCNQ, approaching the
conductivity of metals.
In 1988 the first polymer electrolyte e-cap, APY-CAP with PPy polymer electrolyte, was launched by
Nitsuko.[11] The product was not successful, in part be-
cause it was not available in SMD configurations.
In 1991 Panasonic launched its SP-Cap,[12] a polymer
Al-cap. These used polymer electrolytes to achieve ESR
values that were directly comparable to ceramic multi-
layer capacitors (MLCCs). They were less expensive than
Ta-caps and with their flat design were useful in compact
devices such aslaptopsandcell phones.
Ta-caps with PPy polymer electrolyte followed three
years later. In 1993 NEC introduced its SMD de-
vices, called NeoCap. In 1997 Sanyo followed with itsPOSCAP polymer Ta-caps.
Kemet presented a new conductive polymer for poly-
mer Ta-caps at the 1999 Carts conference.[13] This ca-
pacitor used the conductive polymer PEDT (Poly(3,4-
ethylenedioxythiophene)), also known asPEDOT(trade
name Baytron).[14]
Two years later at the 2001 APEC Conference, Kemet
introduced PEDOT polymer Al-caps.[15] Its AO-Cap se-
ries included SMD capacitors with stacked anode in D
size with heights from 1.0 to 4.0 mm, competing with
Panasonic.
Around the millennium hybrid polymer capacitors were
developed, which add a liquid electrolyte to the polymer
electrolyte.[16][17] The liquid electrolyte provides oxygen
that allows self-healing processes to reduce the leakage
current in damaged devices. In 2001, NIC launched a
hybrid polymer e-cap at a lower price andwith lower leak-
age current. As of 2015 hybrid polymer capacitors were
available from multiple manufacturers.
2 Application basics
2.1 Role of ESR, ESL and capacitance
The predominant application set for e-caps and polymer
capacitors is power supplies. They cause behind the rec-
tifying smoothing of the rectified AC voltage or interfer-
ence suppression and buffer or stabilize the DC voltage at
a sudden power demand of the subsequent circuit. They
are called backup-, bypass- ordecoupling capacitors.[18]
In addition to the size, the capacitance, the impedance Z,
the ESR and the inductance ESL offer important electri-
cal characteristics.
The change to digital electronic equipment led to the de-velopment of switching power supplies with higher fre-
quencies and on-boardDC/DC converter, lower supply
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3.1 Anodic oxidation 3
For a sudden power demand of a subsequent circuit, the supply
voltage drops by ESL, ESR and capacitance charge loss
voltages and higher supply currents. Decoupling capaci-
tors needed lower ESR values, which at that time could
only be realized with larger case sizes or much more ex-
pensive solid Ta-caps.
ESRs influence onintegrated circuitfunction is that un-
der a sudden power demand, the supply voltage drops:
U = ESR I
For example:[3]
Given a supply voltage of 3 V, with a tolerance of 10%
(200 mV) and supply current of a maximum of 10 A, a
sudden power demand drops the voltage by:
ESR = U / I = 0.3 V / 10 A = 30 milliohms.
This means that the ESR in aCPUpower supply must be
less than 30 m, otherwise the circuit malfunctions.
3 Electrolytic capacitors
Main article:Electrolytic capacitor
3.1 Anodic oxidation
Electrolytic capacitors use a chemical feature of some
special metals, earlier called valve metals that by anodic
oxidationform an insulating oxide layer. By applying a
positive voltage to the anode, an oxide barrier layer with
a thickness corresponding to the applied voltage forms.
This oxide layer acts as the dielectric in an e-cap. The
cathode must conform to the oxide surface. This is ac-
complished by the electrolyte, which acts as the cathode.The main difference between the polymer capacitor fam-
ilies is the anode material and its oxide:
Basic principle of anodic oxidation (forming), in which, by ap-
plying a voltage with a current source, an oxide layer is formed
on a metallic anode
Polymer Ta-caps use high purity sintered tantalum
powder as an anode with tantalum pentoxide
(Ta2O5) as the dielectric.
Polymer Al-caps use a high purity and electrochem-
ically roughened aluminum foil as an anode with
aluminum oxide(Al2O3) as the dielectric.
Conductive plates
Dielectric
dA
A dielectric material is placed between two conducting plates
(electrodes), each of areaA and with a separation ofd.
Every e-cap in principle forms a plate capacitor whose
capacitance is an increasing function of the electrode area
A, thepermittivity and the thinner the dielectric (d).
C = A
d
Capacitance is proportional to the product of the area of
one plate multiplied by the permittivity and divided by
the dielectric thickness.
This thickness is in the range of nanometers per volt.
Etched or sintered anodes have a higher surface area com-
pared to a smooth surface of the same areal dimension.
The capacitance value, depending on the rated voltage,increases by a factor of up to 200 for liquid Al-caps and
solid Ta-caps.[20][21][22]
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4 3 ELECTROLYTIC CAPACITORS
Because the forming voltage defines the oxide thickness,
the voltage proof can be produced simply for the desired
rated value. Therefore, the volume of a capacitor is de-
fined by the product of capacitance and voltage, the so-
called CV product.
Comparing the dielectric constants of tantalum and alu-minum oxides, Ta2O5 has permittivity approximately 3-
fold higher than Al2O3. Ta-caps therefore theoretically
can be smaller than Al-caps with the same capacitance
and rated voltage. Ta-cap oxide layers are much thicker
than the rated voltage requires. This is done for safety
reasons to avoid shorts from field crystallization,[23] but
reduces the size advantage.
3.2 Electrolytes
The most important electrical property of an electrolyte
is its electrical conductivity. The electrolyte forms thecounter electrode of thee-cap, thecathode. The rough-
ened structures of the anode surface continue in the struc-
ture of the oxide layer, the dielectric. The cathode must
adapt precisely to the roughened structure. With a liq-
uid, as in the conventional wet e-caps this is easy to
achieve. In polymer e-caps in which a solid conductive
polymer forms the electrolyte, this is much more difficult
to achieve, because its conductivity comes by a chemi-
cal process of polymerization. However, the benefits of
a solid polymer electrolyte, the significantly lower ESR
and the low temperature dependence of the electrical pa-
rameters, in many cases justify the additional productionsteps and higher costs.
3.2.1 Conducting salt TCNQ electrolyte
The original Samsung TCNQ e-caps with TCNQ as elec-
trolyte were not polymer capacitors, unlike the modified
Panasonic devices marketed under the same name[24] that
use a conductive polymer electrolyte (PPy).[25]
3.2.2 Polymer electrolyte
Polymers are formed by a chemical reaction,
polymerization. In this reactionmonomersare continu-
ously attached to a growing polymer strand.[26] Usually
polymers are electrical insulators or semiconductors. In
e-caps,conductivepolymers are employed. Conductivity
is provided byconjugated double bondsthat permit free
movement of charge carriers in the doped state. The
charge carriers areelectron holes. Conducting polymer
conductivity is nearly comparable with metallic conduc-
tors. The polymers must be oxidatively or reductively
doped.
A polymer electrolyte must be able to penetrate the an-odes finest crevices to form a complete, homogeneous
layer, because only anode oxide sections covered by the
Structural formula of TCNQ
electrolyte contribute capacitance. The precursors of the
polymer must consist of small base materials that can
penetrate the smallest pores. The size of the precursors
implicitly limit the size of the pores in the aluminum
anode foils or tantalum powder. The rate of polymer-
ization must be controlled for capacitor manufacturing.
Too rapid polymerization does not lead to complete an-
ode coverage, while too slow polymerization increases
production costs. The oxide must not chemically or me-
chanically attack either the precursors, the polymer or its
residues. The electrolyte must have high stability over a
wide temperature range and a long interval. The polymer
film is the capacitors counter electrode and protects the
dielectric against external influences such as direct con-
tact with graphite in the cathode.
Polymer e-caps employ either polypyrrole (PPy)[27] or
polythiophene(PEDOTor PEDT).[28][29]
3.2.3 Polypyrrole PPy
Polypyrrole(PPy) is a conducting polymer formed by
oxidative polymerization ofpyrrole. A suitable oxidiz-
ing agent isiron (III) chloride(FeCl3). Water, methanol,ethanol, acetonitrile and other polar solvents may be used
for PPy synthesis.[31] As a solid conducting polymer elec-
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3.2 Electrolytes 5
Structural formula ofpolypyrrole, doped withp-Toluenesulfonic
acid
Pyrrole can be polymerized electrochemically to control the rate
of polymerizion.[30]
trolyte it achieves conductivity up to 100S/m. Polypyr-
role was the first conductive polymer used in polymer e-
caps and the first in polymer Al-caps, followed by poly-
mer Ta-caps.
In situ polymerization of PPy features a slow rate of poly-
merization. When pyrrole is mixed with the desired oxi-
dizing agents at room temperature, polymerization begins
immediately. Thus polypyrrole begins to form before the
chemical solution enters the anodes pores. The poly-merization rate can be controlled by cryogenic cooling or
electrochemical polymerization. The cooling method is
delicate and is unfavorable for mass production. In elec-
trochemical polymerization an auxiliary electrode layer
has to be applied on the dielectric and connected to the
anode.[29] For this purpose, ionic dopants are added to
the polymer, forming a conductive surface layer during
the first impregnation. During subsequent impregnations,
the in-situ polymerization can be time-controlled by the
current flow after applying a voltage between the anode
and cathode.[32] Both methods are complex and require
repetitive polymerization steps that increase manufactur-ing costs.
The polypyrrole electrolyte has two fundamental disad-
vantages. It is toxic and becomes unstable at the temper-
atures required for lead-free soldering.[29]
3.2.4 Polythiopene PEDOT and PEDOT:PSS
Poly(3,4-ethylenedioxythiophene), abbreviated PEDOT
or PEDT[28] is a conducting polymer based on 3,4-
ethylenedioxythiophene or EDOT monomer. PEDOT
is polarized by the oxidation of EDOT with catalyticamounts of iron (III) sulfate. The re-oxidation of iron is
given bySodium persulfate.[33] Its advantages areoptical
Structural formula of PEDOT
Structural formula of PEDOT:PSS
transparency in its conducting state, non-toxicity, stability
up to 280 C and conductivity up to 500S/m.[29] Its heat
resistance allows polymer capacitors to be manufacturedthat withstand the higher temperatures required for lead-
free soldering. These capacitors also have better ESR
values.[29]
Pre-polymerized dispersions of PEDOT allow the anodes
to be dipped and dried at room temperature. Sodium
polystyrene sulfonate (PSS) is dissolved in water with
PEDOT precursors.[34] The complete polymer layer is
then composed of pre-polymerized particles from the dis-
persion. These dispersions are known as PEDOT: PSS
(trade names Baytron P[35] and Clevius),[36] protecting
PEDOTs valuable properties.[37][38]
PEDOT:PSS dispersions are available in different vari-ants. High capacitance capacitors with roughened alu-
minum anode foils or fine-grained tantalum powders can
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6 5 PACKAGING
use small particle sizes. The average size of these parti-
cles is about 30 nm, small enough to penetrate the finest
anode capillaries. Another variant offers larger particles
leading to a relatively thick polymer layer to envelop and
protect rectangular Ta and Al polymer capacitors against
mechanical and electrical stress.[29][36]
PEDOT:PSS polymer Al-caps reach voltages of 200 V[39]
and 250 V.[40] Leakage current values are significantly
lower than for polymer capacitors having in-situ poly-
merized layers. This approach offers better ESR values,
higher temperature stability, lower leakage current and
ease of manufacture, requiring only three immersions,[34]
significantly reducing costs.
3.2.5 Hybrid electrolyte
Hybrid polymer Al-caps coat the anode with a conduc-
tive polymer and add a liquid electrolyte. The liquid con-nects the polymer layers covering the dielectric and the
cathode. The liquid electrolyte supplies oxygen for self-
healing processes, which restores the oxide layer and re-
duces the leakage current, so that values common to con-
ventional wet e-caps can be achieved. The safety mar-
gin for the oxide thickness for a desired rated voltage can
be reduced.
The detrimental effects of the liquid electrolyte on ESR
and temperature characteristics are relatively minor. Ap-
propriate organic electrolytes and good sealing allow a
long service life.[17][41]
4 Types
Based on the used anode metal and the combination of a
polymer electrolyte together with a liquid electrolyte, the
three different types are:
PolymerTa-cap
PolymerAl-cap
Hybrid polymer Al-cap
These types or families are produced in two different
styles:
Rectangular SMD chip, usually molded with a plas-
tic case, available with sintered tantalum anode or
with stacked aluminum anode foils and
SMD cylinder with a wound cell in a metal case, ei-
ther V-chips style or radial leaded versions (single-
ended)
Styles of polymer electrolytic capacitors
Rectangular
Cylindrical
5 Packaging
5.1 Rectangular style
In the early 1990s polymer Ta-caps coincided with the
emergence of flat devices such as mobile phones and lap-tops using SMD assembly technology. The rectangu-
lar base surface achieves the maximum mounting space,
which is not possible with round base surfaces. The sin-
tered cell can be manufactured so that the finished com-
ponent has a desired height, typically the height of other
components. Typical heights range from about 0.8 to 4
mm.
5.1.1 Ta-caps
Polymer Ta-caps are Ta-caps in which the electrolyte
is a conductive polymer instead of MnO2. Ta-caps aremanufactured from a powder of relatively pure elemental
tantalummetal.[42][43][44]
The powder is compressed around a tantalum wire, the
anode connection, to form a pellet. This pellet/wire
combination is vacuum sintered at 1200 to 1800 C, mak-
ing it mechanically strong. During sintering, the powder
takes on a sponge-like structure, with all the particles con-
necting as a monolithic spatial lattice. The result is highly
porous, offering a large surface area.
The dielectric layer is formed covering the tantalum parti-
cle surfaces viaanodizationor forming. The pellet is sub-
merged into a weak solution of acid and DC voltage is ap-
plied, creating theoxide layer. After theoxide layer is im-
pregnated with the polymer precursors, they are polymer-
ized. This polymerized pellet now is successively dipped
into conductinggraphiteand thensilverto provide a good
connection to the conducting polymer. These layers form
the cathode connection. The capacitive cell then is gen-
erally molded by a synthetic resin.
Basic construction of a polymer tantalum capacitor
Layer structure of a polymer tantalumcapacitor with
graphit/silver cathode connection
Basic cross-section of a rectangular polymer tanta-
lum chip capacitor
Rectangular polymer tantalum chip capacitor
Next multiple anode blocks are connected in parallel in
one case, to further reduce the ESR value and lower
ESL. Polymer Ta-caps have ESR values approximately
1/10 that of MnO2 Ta-caps. Three parallel capacitors
with an ESR of 60 m each have a resulting ESR of 20
m.[45][46] In this construction up to six anodes in one de-vice are connected. Multi-anode polymer Ta-caps have
ESR values in the single-digit milliohm range.
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5.2 Cylindrical (radial) style 7
The disadvantage of polymer Ta-caps is the higher leak-
age current, higher by a factor of 10 higher compared to
MnO2 Ta-caps. Polymer SMD Ta-caps are available up
to a size of 7.3 x 4.3 x 4.3 mm (length x width x height)
with a capacity of 1000 F at 2.5 V. They cover temper-
ature ranges from 55 C to +125 C and are available in
rated voltage values from 2.5 to 63 V.
5.1.2 Lowering ESR and ESL
Multi-anode construction: sintered tantalum anodes are con-
nected in parallel, reducing both ESR and ESL.
Lowering ESR and ESL remains a major research and de-
velopment objective. Directions include low ohmic poly-
mer electrolytes and parallel connection of conventional
capacitor cells in one case.
ESL can be reduced by shortening the internal leads, by
asymmetric sintering of the anode lead since ESL is a
positive function of the lead length. This technique iscalled face-down construction. The lower ESL shifts
the resonance to higher frequencies, which handle the
faster load changes of digital circuits with higher switch-
ing frequencies.[47]
Face-down construction: the internal current path is shortened,which reduces parasitic impedance, shifting the resonance to
higher frequencies.
.
These enhancements bring Ta-caps ever closer to MLCC
capacitors.
5.1.3 Al-caps
Rectangular polymer Al-caps have one or more layered
aluminum anode foils and a conductive polymer elec-
trolyte. The layered anode foils are at one side contact
each other. After the dielectric is created and polymer-
ized, it is successively dipped into conducting graphite
and thensilverto connect to the conducting polymer and
then to the cathode. The capacitive cell then generally is
molded by a synthetic resin.
Basic construction of a polymer aluminum capacitor
with layered anode stripes
Layer structure
Cross-section
Assembled device
The layered anode foils are parallel-connected single ca-
pacitors, reducing ESR and ESL and allowing them to
operate at higher frequencies.
These Al-caps are available in the D"-case form factor
with 7,3x4,3 mm and heights of 24 mm. They provide
a competitive alternative to Ta-caps.[48]
Comparing the two chip capacitor types shows that thedifferent permittivities of aluminum oxide and tantalum
pentoxide have little impact onspecific capacitydue to
different safety margins in oxide layers. Ta-caps use an
oxide layer thickness that corresponds to approximately
four times the rated voltage, while the polymer Al-caps
have about twice the rated voltage.
5.2 Cylindrical (radial) style
Cylindrical polymer Al-caps use liquid electrolytes. They
are available only with aluminum as the anode material.They are intended for larger capacitance values compared
to rectangular polymer capacitors. Due to their design,
they may vary in height on a given surface mounting area
so that larger capacitance values can be achieved by a
taller case without increasing the mounting surface. This
is primarily useful for printed circuit boards without a
height limit.
Cylindrical capacitors are made of two rolled up alu-
minum foils, an etched and formed anode and a cath-
ode foil that are mechanically separated by a separator
and wound together. The winding is impregnated with
the polymer precursors, which are then polymerized toform the conductive polymer as a layer between the di-
electric and the cathode foil, electrically connecting both
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8 6 COMPARISON
layers. The winding is built into an aluminum case and
sealed with rubber. For the SMD version (Vertical chip=
V-chip) the case is provided with a bottom plate.
5.2.1 Polymer aluminum
These capacitors use a solid polymer electrolyte as the
dielectric. They are less expensive than polymer Ta-caps
for a given CV. They are available up to a size of 10x13
mm (diameter x height) with a CV value of 3900 F/2.5
V[49] They can cover temperature ranges from 55 C to
+125 C and are available in nominal voltage values from
2.5 to 200 V.[39]
Unlike wet Al e-caps the cases of polymer Al capacitors
dont have a vent (notch) in the bottom of the case, since
a short circuit does not form gas, which would increase
pressure in the case.
Design principles of cylindrical polymer aluminum
capacitors
Winding of an aluminum electrolytic capacitor
Cross-sectional view of a wound polymer aluminum
capacitor
Cylindrical polymer aluminum capacitors with
wound cell in cylindrical metal case, in radial leaded
(single-ended) and SMD style (V-chip)
5.2.2 Hybrid polymer Al-caps
Cross-sectional view
Hybrid polymer capacitors are available only in the cylin-
drical style. The anode and cathode foils are separated
by a spacer, leaded in the radial (single-ended) design or
with a base plate in the SMD version (V-chip). The sepa-
rator is impregnated with a liquid electrolyte as in a con-
ventional wet Al-cap. The liquid electrolyte delivers the
oxygen that is necessary for defect self-healing.The current that flows through a defect results in selective
heating, which normally destroys the overlying polymer
film, isolating, but not healing, the defect. In hybrid poly-
mer capacitors liquid can flow to the defect, delivering
oxygen and healing the dielectric by generating new ox-
ides, decreasing the leakage current. Hybrid polymer Al
capacitors have a much lower leakage current than non-
hybrids.
6 Comparison
6.1 Benchmarks
The polymer electrolyte, the anode materials, together
with design differences led to multiple polymer e-cap
families with different specifications.
(As of April 2015)
6.2 Electrical parameters
Electrical properties of polymer capacitors can best be
compared, using consistent capacitance, rated voltage
and dimensions. The leakage current is significant, be-
cause it is higher than that of e-caps with non-polymer
electrolytes. The respective values of Ta-caps with MnO2electrolyte and wet Al e-caps are included.
1) Manufacturer, Series, Capacitance/Rated voltage, 2)
rectangular style (Chip), 3) cylindrical style, 4) Leakage
current, calculated for a capacitor with 100 F/10 V,
(As of June 2015)
6.3 Advantages and disadvantages
Advantages against wet e-caps:
articulately lower ESR values.
articulately higher ripple current capability
articulately lower temperature depending character-
istics
no evaporation of electrolyte, longer service life
no burning or exploding in case of shorts
Disadvantages against wet e-caps:
more expensive
higher leakage current
damageable by transients and higher voltages spikes
Advantages of hybrid polymer Al-caps:
less expensive
-
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7.3 Rated and category voltage 9
lower leakage current
impassible against transients
Disadvantage of hybrid polymer e-caps:
limited service life due to evaporation
Advantages against MLCCs:
no voltage dependent capacitance
no microphonic
higher capacitance values
7 Electrical characteristics
7.1 Series-equivalent circuit
R leakage
C
R ESR L ESL
Series-equivalent circuit model of an electrolytic capacitor
Capacitor electrical characteristics are harmonized by the
international generic specification IEC 60384-1. In this
standard, characteristics are described by an idealized
series-equivalent circuit with electrical components that
model all ohmic losses, capacitive and inductive param-
eters:
C, capacitance
RESR, the equivalent series resistancewhich sum-marizes all ohmic losses, usually abbreviated as
ESR
LESL, the equivalent series inductance which is
the effective self-inductance, usually abbreviated as
ESL.
R, the resistance representing theleakage current
7.2 Rated capacitance, standard values
and tolerances
Capacitance depends on frequency and temperature.
Electrolytic capacitors with liquid electrolytes show
Typical capacitance capacitor as a function of temperature for
a polymer Al e-cap and two liquid Al e-caps
a broader variability over frequency and temperature
ranges than polymer capacitors.
The standardized measuring condition for polymer Al-
caps is an AC measuring method with 0.5 V at a fre-
quency of 100/120 Hz and a temperature of 20 C. For
polymer Ta-caps a DC bias voltage of 1.1 to 1.5 V for
types with a rated voltage 2.5 V, or 2.1 to 2.5 V for
types with a rated voltage of >2.5 V, may be applied dur-
ing the measurement to avoid reverse voltage.
The capacitance measured at the frequency of 1 kHz is
about 10% less than the 100/120 Hz value. Therefore,
the capacitance values are not directly comparable and
differ from those of film capacitors or ceramic capacitors,whose capacitance is measured at 1 kHz or higher.
The basic unit of capacitance is themicrofarad(F). The
value specified in manufacturer data sheets is called the
rated capacitance CR or nominal capacitance CN. It is
given according to IEC 60063 in values corresponding to
theE series. These values are specified with a tolerance
in accordance with IEC 60062, preventing overlaps.
The actual measured capacitance value must be within the
tolerance limits.
7.3 Rated and category voltage
Referring to IEC 60384-1, the allowed operating voltage
for polymer e-caps is called the rated voltage UR". The
rated voltage UR is the maximum DC voltage or peak
pulse voltage that may be applied continuously at any tem-
perature within the rated temperature range TR.
The voltage proof of e-caps decreases with increasing
temperature. Some applications require a higher tem-
perature range. Lowering the voltage applied at a higher
temperature maintains safety margins. For some capac-
itor types, IEC specifies a temperature derated voltage
for a higher temperature, the category voltage UC". Thecategory voltage is the maximum DC voltage or peak
pulse voltage that may be applied continuously to a capac-
https://en.wikipedia.org/wiki/Preferred_numberhttps://en.wikipedia.org/wiki/Faradhttps://en.wikipedia.org/wiki/Ceramic_capacitorhttps://en.wikipedia.org/wiki/Film_capacitorhttps://en.wikipedia.org/wiki/Leakage_(electronics)https://en.wikipedia.org/wiki/Equivalent_series_inductancehttps://en.wikipedia.org/wiki/Equivalent_series_resistance -
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10 7 ELECTRICAL CHARACTERISTICS
Relation between rated voltage UR and category voltage UC and
rated temperature TR and category temperature TC
itor at any temperature within the category temperaturerange TC. The relation between voltage and temperature
is given in the figure at right.
Applying a higher than specified voltage may destroy an
e-cap. Applying a lower voltage may have a positive in-
fluence. A lower applied voltage can extend hybrid Al-
caps lifetimes.[20] Lowering the voltage applied increases
the reliability and reduces the expected failure rate of Ta-
caps.[50]
7.4 Rated and category temperature
The relation between rated temperature TR and rated
voltage UR as well as higher category temperature TC and
derated category voltage UC is given in figure at right.
7.5 Surge voltage
Polymer e-cap oxid layers are formed for safety reasons
at higher than the rated voltage, called a surge voltage, for
a limited number of cycles.
The surge voltage indicates the maximum peak voltage
value that may be applied to capacitors for a limited num-
ber of cycles.[20] The surge voltage is standardized in IEC
60384-1.
For polymer Al-caps the surge voltage is 1.15 times the
rated voltage. For Ta-caps the surge voltage can be 1.3
times the rated voltage, rounded off to the nearest volt.
The surge voltage may influence the capacitors failure
rate.[51][52][53]
7.6 Transient voltage
Transients are fast, high voltage spikes. Al-caps and
Ta-caps cannot withstand transients or peak voltages
higher than surge voltage. Transients may destroy the
components.[51][52]
Hybrid Al-caps are relatively insensitive to short-term,
transient voltages higher than surge voltage, if the fre-
quency and the energy content of the transients are
low.
[17][41]
This ability depends on rated voltage and com-ponent size. Low energy transient voltages lead to a volt-
age limitation similar to azener diode.[54] An unambigu-
ous and general specification of tolerable transients or
peak voltages is not possible. Transient voltage use cases
must be individually assessed.
7.7 Reverse voltage
Polymer e-caps are polarized and generally require the
anode voltage to be positive relative to the cathode volt-
age. Nevertheless, they can withstand a reverse voltage
for limited cycles.[55][56] A reverse voltage applied for too
long leads to short-circuit and destruction.
7.8 Impedance and ESR
See also: Electrolytic capacitor Impedance, and
Electrolytic capacitor ESR and dissipation factor tan
Theimpedanceis thecomplex ratioof the voltage to the
current in anAC circuitand expresses asAC resistance
both magnitude andphase at a particular frequency. Indata sheets only the impedance magnitude |Z| is specified.
Regarding the IEC 60384-1 standard, the impedance val-
ues are measured and specified at 100 kHz.
In the special case ofresonance, in which the both reac-
tiveresistances XCand XL have thesame value(XC=XL),
impedance will be determined by only ESR, which totals
all resistive losses. At 100 kHz impedance and ESR have
nearly the same value for polymer e-caps with capaci-
tance values in the F range. With frequencies above the
resonance, impedance increases again due to ESL, turn-
ing the capacitor into an inductor.
Impedance and ESR, as shown in the curves, depends onthe electrolyte. The curves show the progressively lower
impedance and ESR values of wet Al, MnO2 tantalum,
Al /TCNQ and tantalum polymer e-caps. The curve of
a ceramic Class 2 MLCC capacitor, with still lower Z
and ESR values is also shown, but whose capacitance is
voltage-dependent.
An advantage of polymer over Al-caps with liquid elec-
trolyte is low temperature dependence and almost linear
ESR curve over the specified temperature range. This
applies to all three polymer e-cap types. Impedance and
ESR are also dependent on design and materials. Cylin-
drical e-caps have higher inductance resonant frequencythan rectangular e-caps. This effect is amplified by multi-
anode construction, in which individual inductances are
https://en.wikipedia.org/wiki/Resonancehttps://en.wikipedia.org/wiki/Phase_(waves)https://en.wikipedia.org/wiki/Electrical_resistancehttps://en.wikipedia.org/wiki/Electronic_circuithttps://en.wikipedia.org/wiki/Alternating_currenthttps://en.wikipedia.org/wiki/Ratiohttps://en.wikipedia.org/wiki/Complex_numberhttps://en.wikipedia.org/wiki/Electrical_impedancehttps://en.wikipedia.org/wiki/Electrolytic_capacitor#ESR_and_dissipation_factor_tan_%CE%B4https://en.wikipedia.org/wiki/Electrolytic_capacitor#Impedancehttps://en.wikipedia.org/wiki/Zener_diodehttps://en.wikipedia.org/wiki/Voltage_spikehttps://en.wikipedia.org/wiki/Transient_(oscillation) -
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7.10 Current surge, peak or pulse current 11
Typical impedance characteristics over the frequency range for
100 F e-caps compared with a 100 F ceramic Class 2 -MLCC
- capacitor.
Typical curve of the ESR as a function of temperature for poly-
mer capacitors and wet Al e-caps
reduced by their parallel connection[45][46] and the face-
down technique.[47]
7.9 Ripple current
The superimposed (DC biased) AC ripple current flow across the
smoothing capacitor C1 of a power supply causes internal heat
generation corresponding to the capacitorsESR.
A ripple current is theroot mean square(RMS) value
of a superimposed AC current of any frequency and any
waveformof the current curve for continuous operation
within the specified temperature range. It arises mainly inpower supplies (including switched-mode power supplies)
after rectifying an AC voltage and flows as charge and
discharge current through the decoupling or smoothing
capacitor.[57]
Ripple currents generates heat inside the capacitor body.
This dissipation power loss PL is caused by ESR and is
the squared value of the effective (RMS) ripple current
IR.
PL =I2
R ESR
This internally generated heat, above the ambient temper-
ature and other external heat sources, leads to a tempera-
ture differential of Tover the ambient. This heat has to
be distributed as thermal losses Pth over the capacitors
surfaceAagainst the thermal resistanceto the ambient.
Pth = T A
This heat is distributed bythermal radiation,convectionandthermal conduction. The temperature must not ex-
ceed the maximum specified temperature.
The ripple current for polymer e-caps is specified as an
effective value at 100 kHz at upper category temper-
ature. Polymer capacitors ESR stability over the fre-
quency range allows the 100 kHz-value to apply across
the frequency range. Typically, the specified value for
maximum ripple current in datasheets is calculated for a
core temperature differential of 20 C. Use of polymer
capacitors at higher temperature reduces the ripple cur-
rent.
Non-sinusoidal ripple currents have to be analyzed and
separated into their individual sinusoidal frequencies by
means ofFourier analysis and summarized by squared
addition.[58]
IR =
i12
+ i22
+ i32
+ in2
In polymer Ta-caps the heat generated by the ripple
current influences reliability.[59][60][61][62] Exceeding the
limit can result in catastrophic failures with short circuits
and burning components.
Ripple current heat affects the lifetimes of all three poly-mer e-cap types.[57][63]
7.10 Current surge, peak or pulse current
Polymer Ta-caps are sensitive to peak or pulse
currents.[51][52] Solid Ta-caps that are exposed to
surge, peak or pulse currents, for example, in highly
inductive circuits, require voltage derating. If possible
the voltage profile should be a ramp turn-on, as this
reduces the peak current.
Polymer Al-caps have no restrictions on current surge,peak or pulse currents. However, the summarized cur-
rents must not exceed the specified ripple current.
https://en.wikipedia.org/wiki/Fourier_analysishttps://en.wikipedia.org/wiki/Thermal_conductionhttps://en.wikipedia.org/wiki/Convectionhttps://en.wikipedia.org/wiki/Thermal_radiationhttps://en.wikipedia.org/wiki/Switched-mode_power_supplyhttps://en.wikipedia.org/wiki/Waveformhttps://en.wikipedia.org/wiki/Root_mean_squarehttps://en.wikipedia.org/wiki/Multi-Layer_Ceramic_Capacitor -
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12 8 RELIABILITY AND LIFETIME
7.11 Leakage current
The general leakage current behavior of electrolytic capacitors
depend on the kind of electrolyte
TheDC leakage current (DCL) is a unique characteris-
tic for e-caps. It is theDCcurrent that flows when a DC
voltage of correct polarity is applied. This current is rep-
resented by the resistorRleakin parallel with the capac-
itor in the series-equivalent circuit of e-caps. The main
causes of DCL for solid polymer capacitors are points of
electrical dielectric breakdown after soldering, unwanted
conductive paths due to impurities or to poor anodization
and for rectangular types, dielectric bypass due to excess
MnO2, due to moisture paths or cathode conductors (car-
bon, silver).[64]
Datasheet leakage current specification is given by multi-
plication of the rated capacitance valueCRwith the value
of the rated voltage UR together with an added figure,
measured after 2 or 5 minutes:
ILeak = 0.01 A
V F UR CR+ 3A
Leakage current in solid polymer e-caps generally drops
fast but then remains steady. The value depends on the
voltage applied, temperature, measuring time and mois-
ture allowed by case sealing conditions.Polymer e-caps have relatively high leakage current val-
ues. In solid polymer e-caps this cannot be reduced by
healing in the sense of generating new oxide, because
under normal conditions solid electrolytes cannot deliver
oxygen for forming processes. Annealing of dielectric
defects can only be carried out through local overheat-
ing and polymer evaporation. The leakage current values
for polymer e-caps are between0.2 CRURto0.04 CRUR.
Thus the value of the leakage current for polymer capac-
itors is higher than for wet aluminum and MnO2 Ta-
caps.
This higher leakage current disadvantage is avoided byhybrid Al-caps. Their liquid electrolyte provides the oxy-
gen that is necessary for the reforming of oxide defects,
so that the hybrids achieve the same values as wet Al or
Ta-caps.[17][57]
7.12 Dielectric absorption (soakage)
Main article:Dielectric absorption
Dielectric absorption occurs when a capacitor charged
for a long time discharges only incompletely. Although
an ideal capacitor would reach zero volts after discharge,
real capacitors develop a small voltage from time-delayed
dipole discharging, a phenomenon that is also called
dielectric relaxation, soakage or battery action.
No figures for dielectric absorption are available for poly-
mer capacitors.
8 Reliability and lifetime
8.1 Reliability (failure rate)
Main article:Reliability engineering
Reliabilityis a property that indicates how consistently
Bathtub curvewith times of early failures, random failures
and wear-out failures. The time of random failures is the time
of constant failure rate
a component performs its function over a time interval.
It is subject to astochastic processand can be describedqualitatively and quantitatively, but is not directly mea-
surable. Eurance testsreveal thefailure rate. Reliability
normally is shown as abathtub curvean(figure on right)
d is divided into three areas: early failures, constant ran-
dom failures and wear out failures. Failure rates are the
sum of short circuit, open circuit and degradation failures
(exceeding electrical parameters). For Ta-caps the fail-
ure rate is influenced by the circuit series resistor, which
is not required for Al-caps.
Billions of test unit-hours are needed to verify acceptable
failure rates. This requires about a million units tested
over a long period.[65] Test failure rates are often com-plemented with feedback from large users (field failure
rate), which mostly lowers failure rate estimates.
https://en.wikipedia.org/wiki/Bathtub_curvehttps://en.wikipedia.org/wiki/Failure_ratehttps://en.wikipedia.org/wiki/Endurance_testhttps://en.wikipedia.org/wiki/Stochastic_processhttps://en.wikipedia.org/wiki/Bathtub_curvehttps://en.wikipedia.org/wiki/Reliability_engineeringhttps://en.wikipedia.org/wiki/Reliability_engineeringhttps://en.wikipedia.org/wiki/Dielectric_relaxationhttps://en.wikipedia.org/wiki/Dielectric_absorptionhttps://en.wikipedia.org/wiki/Direct_currenthttps://en.wikipedia.org/wiki/Leakage_(electronics) -
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8.2 Lifetime, service life 13
For historical reasons the failure rate units of Ta-caps and
Al-caps are different. For Al-caps thereliabilitypredic-
tion is generally expressed in afailure rate, with the unit
Failures In Time (FIT) at standard operating conditions
40 C and 0.5 UR during the period of constant random
failures. This is the number of failures that can be ex-
pected in one billion (109) component-hours of operation(e.g., 1000 components for 1 million hours, or 1 million
components for 1000 hours which is 1 ppm/1000 hours)
at standard operating conditions. This failure rate model
implicitly assumes that failures are random. Individual
components fail at random times but at a predictable rate.
The reciprocal value of FIT is Mean Time Between Fail-
ure (MTBF).
For Ta-caps the failure rate FT" is specified with the
unit n % failures per 1000 hours at 85 C, U = UR and
a circuit resistance of 0.1 /V. This is the failure percent-
age that can be expected in 1000 hours of operation at
much more demanding operational conditions comparedwith the FIT model. The failure rates "" and FT" de-
pend on operating conditions including temperature, volt-
age applied and environmental factors such as humidity,
shocks or vibrations and capacitance.[50] Failure rates are
an increasing function of temperature and applied volt-
age.
Solid tantalum and wet Al-caps failure rates can be
recalculated with acceleration factors standardized for
industrial[66] or military[67] contexts. The latter is estab-
lished in industry and often used for industrial applica-
tions. However, for polymer aluminum and Ta-caps no
acceleration factors had been published as of 2015. Anexample of a recalculation from a Ta-cap failure rate FTa
into a failure rate therefore only can be given by com-
paring standard capacitors. Example:
A failure rate FTa= 0.1%/1000 h at 85 C and U= UR
shall be recalculated into a failure rate at 40 C andU
= 0,5UR.
The following acceleration factors from MIL-HDBK
217F are used:
FU = voltage acceleration factor, for U= 0,5
URisFU= 0.1FT= temperature acceleration factor, forT=
40 C isFT= 0.1
FR = acceleration factor for the series resis-
tanceRV, at the same value it is = 1
It follows
= FTa x FU x FT x FR
= (0.001/1000 h) x 0.1 x 0.1 x 1 =
0.00001/1000 h = 1109/h = 1 FIT
As of 2015 the published failure rate figures for polymer
tantalum and polymer Al-caps are in the range of 0.5
to 20 FIT. These reliability levels are comparable with
other electronic components and achieve safe operation
for decades under normal conditions.
8.2 Lifetime, service life
The lifetime,service life, load life or useful life of e-caps
is a special characteristic of liquid e-caps, especially liq-
uid Al-caps whose liquid electrolyte can evaporate, lead-
ing to wear-out failures. MnO2Ta-caps have no wear-out
mechanism so that the failure rate is constant up to the
point all capacitors have failed. They dont have a life-
time specification like liquid Al-caps.
Polymer Ta-caps and Al-caps do have a lifetime specifica-
tion. The polymer electrolyte has a small conductivity de-
terioration by thermal polymer degradation. The electri-
cal conductivity decreases as a function of time, in agree-
ment with a granular metal type structure, in which agingis due to polymer grain shrinkage.[63]
The useful life (load life, service life) is tested with a
time accelerating endurance test according to IEC 60384-
24/25/26[68] with rated voltage at the upper category
temperature. Passing the test requires no total failures
(short circuit, open circuit) and degradation failures and
capacitance loss by less than 20% and increased ESR and
impedance by more than a factor of 2 compared to the ini-
tial value. These limits for degradation failures are much
closer than for wet Al-caps. That means that lifetime be-
havior is much more stable than for wet Al-caps.
The lifetime for maximum voltage and temperature isspecified in similar terms to the liquid electrolytic e-caps,
but uses less stressful operational conditions that lead to
much longer operational lifetimes.[69][70][71] Polymer ca-
pacitor lifetimes for different operational conditions can
be estimated by:
Lx =LSpec 10T0TA
20
Lx= lifetime to be estimated
LSpec= specified lifetime
T0= upper category temperature
TA= temperature of the e-cap case or ambient tem-
perature near the capacitor
This rule characterizes the change of thermic polymer re-
action speeds within the specified degradation limits. Ac-
cording to this formula the theoretical expected service
life of a 2000 h/105 C polymer capacitor, operated at
65 C, can be calculated (estimated) with 200,000 hours
or more than 20 years.
For liquid hybrids, the 20-degree rule does not apply. Theexpected life of these hybrid e-caps can be calculated us-
ing the10-degree rule.
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14 10 COMMERCIAL INFORMATION
8.2.1 Field crystallization
Polymer capacitors are reliable at the same level as other
electronic components with low failure rates. How-
ever, all Ta-caps have a unique failure mode called field
crystallization.[72] Field crystallization is the major rea-son for degradation and catastrophic failures of solid Ta-
caps.[73] More than 90% of (rare) Ta-cap failures are
caused by short circuits or leakage current due to this fail-
ure mode.[74]
The oxide film must be formed in an amorphous struc-
ture. Changing the amorphous structure into a crys-
tallized structure increases conductivity reportedly 1000
times along with an enlarged oxide volume.[23][75]
After application of a voltage at weakened spots in the oxide a
localized higher leakage current is formed, which leads to a local
heating of the polymer, whereby the polymer either oxidized and
becomes highly resistive or evaporates.
Field crystallization followed by adielectric breakdownis
characterized by a sudden rise in leakage current, within
a few milliseconds, from nano-ampere to ampere mag-
nitude in low-impedance circuits. Increasing current
flow can produce an avalanche effect, rapidly spread-ing through the metal/oxide. This can result in damage
ranging from small, burned areas on the oxide to zigzag
burned streaks covering large areas of the pellet or com-
plete oxidation of the metal.[76][77] If the current source is
unlimited, field crystallization may cause a short circuit.
However, if the current source is limited, in Ta-caps with
solid MnO2electrolyte a self-healing process takes place,
reoxidizing MnO2into insulating Mn2O.
In polymer Ta-caps combustion is not a risk. Field crys-
tallization may occur, but the polymer layer is selectively
heated and burned away by the leakage current, so that
the faulty point is isolated. Without the polymer mate-rial, the leakage current cant accelerate. The faulty area
no longer contributes to the capacitance.
8.2.2 Self-healing
Polymer Al-caps exhibit the same self-healing mecha-
nism as polymer Ta-caps. After application of a voltage
at weakened spots in the oxide a localized higher leakage
current is formed, which leads to localized polymer heat-
ing, whereby the polymer either oxidizes and becomeshighly resistive or evaporates. Hybrids show this self-
healing mechanism. Faulty spots not covered with a poly-
mer film allow liquid electrolyte to deliver oxygen to build
up new oxide.
9 Standards
Electronic componentand related technology standard-
ization follow rules given by the International Elec-
trotechnical Commission (IEC),[79] a non-profit, non-
governmental internationalstandards organization.[80][81]
The definition of the characteristics and the procedure
of the test methods for capacitorsfor use in electronic
equipment are set out in the generic specification:
IEC/EN 60384-1Fixed capacitors for use in elec-
tronic equipment
The tests and requirements to be met by aluminum and
Ta-caps for use in electronic equipment for approval as
standardized types are set out in the sectional specifica-
tions:
IEC/EN 60384-24Surface mount fixed Ta-caps
with conductive polymer solid electrolyte
IEC/EN 60384-25Surface mount fixed aluminium
e-caps with conductive polymer solid electrolyte
IEC/EN 60384-26Fixed aluminium e-caps with
conductive polymer solid electrolytec
10 Commercial information
10.1 Capacitor symbol
Electrolytic capacitor symbols
10.2 Polarity marking
Polarity marking
10.3 Imprinted markings
Polymer e-caps, given sufficient space, have coded im-
printed markings to indicate:
https://en.wikipedia.org/wiki/Capacitorhttps://en.wikipedia.org/wiki/Standards_organizationhttps://en.wikipedia.org/wiki/Non-profit_organizationhttps://en.wikipedia.org/wiki/International_Electrotechnical_Commissionhttps://en.wikipedia.org/wiki/International_Electrotechnical_Commissionhttps://en.wikipedia.org/wiki/Electronic_componenthttps://en.wikipedia.org/wiki/Dielectric_breakdown -
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15
manufacturers name or trademark
manufacturers type designation
polarity
rated capacitance
tolerance on rated capacitance
rated voltage
climatic category or rated temperature
year and month (or week) of manufacture
For small capacitors no marking is possible.
The code of the markings vary by manufacturer.
10.4 Technological competition
ESR and ESL characteristics are converging to those of
MLCC capacitors. Conversely, the specific capacitance
of Class 2-MLCC capacitors is approaching that of tan-
talum chip capacitors.[82][83] Other characteristics favor
one or another type.[84][85] e.g., Al-Polymer e-caps versus
MLCC: Panasonic,[86] MLCC versus Polymer and wet
e-caps:Murata,[87][88] Al-Polymer e-caps versus wet e-
caps: NCC[18] NIC[16] andTa-Polymer e-caps against
standard solid Ta-MnO2 e-caps: |publisher=Kemet[89]
10.5 Manufacturers and products
As of July 2015
11 See also
Aluminum electrolytic capacitor
Electrolytic capacitor
Niobium capacitor
SAL electrolytic capacitor
Tantalum capacitor
Capacitor types
12 References
[1] Taylor, R. L.; Haring, H. E. (November 1956). A metal
semi-conductor capacitor. J. Electrochem. Soc. 103 611.
[2] McLean, D. A.; Power, F. S. (1956). Proc. Inst. Radio
Engrs. p. 872.
[3] Mosley, Larry E. (2006-04-03). Capacitor Impedance
Needs For Future Microprocessors. Orlando, FL: Intel
Corporation CARTS USA.
[4] Wudl, F. (1984). From organic metals to super-
conductors: managing conduction electrons in organic
solids.Accounts of Chemical Research17(6): 227232.
doi:10.1021/ar00102a005.
[5] Niwa, Shinichi; Taketani, Yutaka (June 1996).
Development of new series of aluminium solid
capacitors with organic Semiconductive electrolyte
(OS-CON)". Journal of Power Sources60 (2): 165171.
[6] Kuch. Investigation of charge transfer complexes:
TCNQ-TTF"(PDF).
[7] OS-CON Technical Book Ver. 15(PDF). Sanyo. 2007.
[8] About the Nobel Prize in Chemistry 2000, Advanced In-
formation(PDF). October 10, 2000.
[9] Zhang, Y. K.; Lin, J.; Chen, Y. Polymer Aluminum
Electrolytic Capacitors with Chemically-Polymerized
Polypyrrole (PPy) as Cathode Materials Part I. Effect of
Monomer Concentration and Oxidant on Electrical Prop-
erties of the Capacitors(PDF).
[10] Merker, U.; Wussow, K.; Lvenich, W.; Starck, H. C.
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13 External links
http://www.evox-rifa.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/F0B2667A13FEB75A85257225006AC85C/$file/1999%2520CARTS%2520Replacing%2520MnO2%2520with%2520Polymer.pdfhttp://www.evox-rifa.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/F0B2667A13FEB75A85257225006AC85C/$file/1999%2520CARTS%2520Replacing%2520MnO2%2520with%2520Polymer.pdfhttp://www.mouser.com/pdfdocs/MurataECASPolymerFAQ3.pdfhttp://www.tecnoimprese.it/user/file/PLENARIA_IPE/MURATA.PDFhttp://www.ndb.com.tw/files/panasonic/others/ENG04_SP-ALvsMLCC0301.pdfhttp://www.ndb.com.tw/files/panasonic/others/ENG04_SP-ALvsMLCC0301.pdfhttp://www.ndb.com.tw/files/panasonic/others/ENG04_SP-ALvsMLCC0301.pdfhttp://www.analog.com/static/imported-files/application_notes/AN-1099.pdfhttp://www.analog.com/static/imported-files/application_notes/AN-1099.pdfhttp://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/0CBE2E5238A759A385256A8700515CCD?OpenDocumenthttp://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/0CBE2E5238A759A385256A8700515CCD?OpenDocumenthttp://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/0CBE2E5238A759A385256A8700515CCD?OpenDocumenthttp://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/0CBE2E5238A759A385256A8700515CCD?OpenDocumenthttp://www.kemet.com/Lists/TechnicalArticles/Attachments/57/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25202.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/57/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25202.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/57/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25202.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/58/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25201.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/58/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25201.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/58/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25201.pdfhttp://www.beuth.de/de/http://webstore.iec.ch/?ref=menuhttp://www.iec.ch/http://www.iec.ch/http://www.eetimes.com/document.asp?doc_id=1279739http://www.eetimes.com/document.asp?doc_id=1279739http://www.avx.com/docs/techinfo/voltaged.pdfhttp://www.avx.com/docs/techinfo/voltaged.pdfhttp://www.vishay.com/docs/49268/tn0003.pdfhttps://nepp.nasa.gov/files/21705/11_005_gsfc_Liu_Failure_Modes_in_Capacitors.pdfhttps://nepp.nasa.gov/files/21705/11_005_gsfc_Liu_Failure_Modes_in_Capacitors.pdfhttps://nepp.nasa.gov/files/21705/11_005_gsfc_Liu_Failure_Modes_in_Capacitors.pdfhttp://www.elna-america.com/tech_tan_failurerates.phphttp://old.passivecomponentmagazine.com/files/archives/2005/PCI_05_01Jan-Feb.pdfhttp://old.passivecomponentmagazine.com/files/archives/2005/PCI_05_01Jan-Feb.pdfhttp://www.jourlib.org/paper/2327093http://www.jourlib.org/paper/2327093http://www.low-esr.com/endurance.asphttp://bbs.dianyuan.com/bbs/u/68/1111231219375672.pdfhttp://www.nichicon.co.jp/english/products/pdf/2012fpcap_catalog_05.pdfhttp://www.beuth.de/en/http://www.everyspec.com/MIL-HDBK/MIL-HDBK-0200-0299/MIL-HDBK-217F_NOTICE-2_14590/http://www.everyspec.com/MIL-HDBK/MIL-HDBK-0200-0299/MIL-HDBK-217F_NOTICE-2_14590/http://www.niccomp.com/Products/smt/NTCRel-FR71399.pdfhttp://www.interstatemarketing.com/Papers/TechArticles/Tant-Niobium/leakage.pdfhttp://www.sciencedirect.com/science/article/pii/S1566119908001791http://www.sciencedirect.com/science/article/pii/S1566119908001791http://www.newark.com/pdfs/techarticles/kemet/Ripple-Current-Capabilities-Technical-Update.pdfhttp://www.vishay.com/docs/40031/apprippl.pdfhttp://www.vishay.com/docs/40031/apprippl.pdfhttp://www.avx.com/docs/techinfo/ripptant.pdfhttp://www.avx.com/docs/techinfo/ripptant.pdfhttp://www.avx.com/docs/techinfo/thrmtant.pdfhttp://www.avx.com/docs/techinfo/thrmtant.pdfhttp://www.vishay.com/docs/28356/alucapsintroduction.pdfhttp://www.vishay.com/docs/28356/alucapsintroduction.pdf -
7/26/2019 Polymer Capacitor
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18 14 TEXT AND IMAGE SOURCES, CONTRIBUTORS, AND LICENSES
14 Text and image sources, contributors, and licenses
14.1 Text
Polymer capacitor Source: https://en.wikipedia.org/wiki/Polymer_capacitor?oldid=722858451 Contributors: Pol098, Bgwhite, Gaius
Cornelius, Chris the speller, Lfstevens, KenShirriff, Mild Bill Hiccup, Niceguyedc, Elcap, Addbot, Yobot, AnomieBOT, VladislavPogorelov, Ripchip Bot, John of Reading, Checkingfax, Access Denied, Sbmeirow, NTox, Mikhail Ryazanov, Frietjes, BG19bot, Bat-
tyBot, ChrisGualtieri, RuiGSa, Ceramic123, Monkbot, JamesP, Bel017, OUYALING and Anonymous: 14
14.2 Images
File:Al-Elkos-OSCON-Wiki-P1040347-07-02-18.jpg Source: https://upload.wikimedia.org/wikipedia/commons/b/b6/
Al-Elkos-OSCON-Wiki-P1040347-07-02-18.jpg License: CC-BY-SA-3.0 Contributors: Own work Original artist: Elcap JensBoth
File:Anodic_oxidation.jpg Source: https://upload.wikimedia.org/wikipedia/commons/8/83/Anodic_oxidation.jpg License: CC0 Con-
tributors:Own workOriginal artist:Elcap
File:Commons-logo.svgSource:https://upload.wikimedia.org/wikipedia/en/4/4a/Commons-logo.svgLicense:CC-BY-SA-3.0Contribu-tors:? Original artist:?
File:E-cap-capacitance_versus_temperature.jpgSource: https://upload.wikimedia.org/wikipedia/commons/3/3b/E-cap-capacitance_
versus_temperature.jpgLicense:CC0 Contributors:Own workOriginal artist:Elcap
File:E-cap-construction-principle-3-hybrid-polymer.png Source: https://upload.wikimedia.org/wikipedia/commons/9/9b/E-cap-construction-principle-3-hybrid-polymer.png License:CC0 Contributors:Own work Original artist:Elcap
File:ESR-comparison-Wet_e-cap-Polymer.tif Source: https://upload.wikimedia.org/wikipedia/commons/b/be/
ESR-comparison-Wet_e-cap-Polymer.tif License:CC0 Contributors:Ow