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    Polymer capacitor

    This article is about the polymer electrolytic capacitors

    with conducting polymer as electrolyte. For the poly-

    mer capacitors with insulating polymer as dielectric,

    seefilm capacitor.

    A polymer capacitor, or more accurately a polymer

    Rectangular-shaped polymer aluminum (black) and tantalum

    (brown) electrolytic chip capacitors

    Cylindrical (wound) polymer Al-caps

    electrolytic capacitor, isan electrolytic capacitor (e-cap)

    with a solid electrolytemade of a conductive polymer.

    The three different types are:

    PolymerTa-cap

    PolymerAl-cap

    Hybrid polymer/liquid e-cap

    A fourth type, polymerniobium e-caps, are not in pro-

    duction.

    Polymer e-caps are available in rectangular surface-

    mounted device (SMD) chip style or in cylindrical SMDs

    (V-chips) style or as radial leaded versions (single-ended).

    Polymer capacitors are characterized by low internal

    equivalent series resistances(ESR) and high ripple cur-

    rent ratings. Their electrical parameters have similar

    temperature dependence, reliability and service life com-

    pared to solid Ta-caps, but much better temperature inde-

    pendence and a longer service life than Al-caps with liq-

    uid electrolytes. In general polymer e-caps have a higher

    leakage current rating than others.

    Polymer e-caps are mainly used as power suppliesof in-

    tegrated electronic circuits as buffer, bypass and decou-

    pling capacitors, especially in devices with flat or com-

    pact design. Thus they compete withmulti-layer ceramic

    chip (MLCC)capacitors, with highercapacitancevalues.

    They display nomicrophoniceffect.

    1 History

    Aluminum capacitors (Al-caps) with liquid electrolyteswere invented in 1896 byCharles Pollak.

    Tantalum e-caps (Ta-caps) with solid manganese diox-

    ide(MnO2) electrolytes were invented by Bell Labora-

    toriesin the early 1950s, as a miniaturized and more re-

    liable low-voltage support capacitor to complement the

    newly invented transistor.[1][2] The first Ta-caps with solid

    MnO2 electrolytes had 10 times betterconductivityand

    a higher ripple current load than earlier types of liquid e-

    caps. Additionally, unlike standard e-caps, theequivalent

    series resistance (ESR) of Ta-caps is stable in varying

    temperatures.

    During the 1970s the increasing digitization of electroniccircuits came with decreasing operating voltages and in-

    creasing switching frequencies and ripple current loads.

    This had consequences for power supplies and their e-

    caps. Capacitors with lowerESRand lowerequivalent

    series inductance (ESL) for bypass and decoupling ca-

    pacitors used in power supply lines were needed.[3]

    A breakthrough came in 1973, with the discov-

    ery by Heeger and Wudl of an organic conduc-

    tor, the charge-transfer salt TCNQ.[4] TCNQ (7,7,8,8-

    tetracyanoquinodimethane or N-n-butyl isoquinolinium

    in combination with TTF (Tetrathiafulvalene)) is a chain

    molecule of almost perfect one-dimensional structure thathas 10-fold better conductivity along the chains than does

    MnO2and has 100-fold better conductivity than liquid

    1

    https://en.wikipedia.org/wiki/Manganese_dioxidehttps://en.wikipedia.org/wiki/Tetrathiafulvalenehttps://en.wikipedia.org/wiki/7,7,8,8-tetracyanoquinodimethanehttps://en.wikipedia.org/wiki/7,7,8,8-tetracyanoquinodimethanehttps://en.wikipedia.org/wiki/Alan_J._Heegerhttps://en.wikipedia.org/wiki/Equivalent_series_inductancehttps://en.wikipedia.org/wiki/Equivalent_series_inductancehttps://en.wikipedia.org/wiki/Equivalent_series_resistancehttps://en.wikipedia.org/wiki/Equivalent_series_resistancehttps://en.wikipedia.org/wiki/Equivalent_series_resistancehttps://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivityhttps://en.wikipedia.org/wiki/Transistorhttps://en.wikipedia.org/wiki/Bell_Laboratorieshttps://en.wikipedia.org/wiki/Bell_Laboratorieshttps://en.wikipedia.org/wiki/Manganese_dioxidehttps://en.wikipedia.org/wiki/Manganese_dioxidehttps://en.wikipedia.org/wiki/Tantalum_capacitorhttps://en.wikipedia.org/wiki/Karol_Pollakhttps://en.wikipedia.org/wiki/Electrolytehttps://en.wikipedia.org/wiki/Microphonicshttps://en.wikipedia.org/wiki/Capacitancehttps://en.wikipedia.org/wiki/Ceramic_capacitor#multilayer_ceramic_chip_capacitorshttps://en.wikipedia.org/wiki/Ceramic_capacitor#multilayer_ceramic_chip_capacitorshttps://en.wikipedia.org/wiki/Power_supplyhttps://en.wikipedia.org/wiki/Equivalent_series_resistancehttps://en.wikipedia.org/wiki/Niobium_capacitorhttps://en.wikipedia.org/wiki/Aluminum_electrolytic_capacitorhttps://en.wikipedia.org/wiki/Tantalum_capacitorhttps://en.wikipedia.org/wiki/Conductive_polymerhttps://en.wikipedia.org/wiki/Electrolytehttps://en.wikipedia.org/wiki/Electrolytic_capacitorhttps://en.wikipedia.org/wiki/Film_capacitor
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    2 2 APPLICATION BASICS

    Conductivities of some electrolytes

    electrolytes.

    OS-CON capacitors with solid TCNQ electrolyte had a typical

    lilac insulation sleeve

    The first Al-cap to use TTF-TCNQ was the OS-CON

    series offered in 1983 by Sanyo. These were wound,

    cylindrical capacitors with 10x increased electrolyte con-

    ductivity compared with MnO2.[5][6][7] These capaci-

    tors were used in devices for applications that required

    the lowest possible ESR or highest possible ripple cur-

    rent. One OS-CON e-cap could replace three more

    bulky wet e-caps or two Ta-caps. By 1995, the Sanyo

    OS-CON became the preferred decoupling capacitor for

    Pentium processor-based personal computers.

    The Sanyo OS-CON e-cap product line was sold in 2010to Panasonic. Panasonic then replaced the TCNQ salt

    with a conducting polymer under the same brand.

    Conducting polymers were invented by Heeger,

    MacDiarmid and Shirakawa in 1975,[8] including

    polypyrrole(PPy) [9] orPEDOT.[10] These lowered ESR

    by a factor of 100 to 500 versus TCNQ, approaching the

    conductivity of metals.

    In 1988 the first polymer electrolyte e-cap, APY-CAP with PPy polymer electrolyte, was launched by

    Nitsuko.[11] The product was not successful, in part be-

    cause it was not available in SMD configurations.

    In 1991 Panasonic launched its SP-Cap,[12] a polymer

    Al-cap. These used polymer electrolytes to achieve ESR

    values that were directly comparable to ceramic multi-

    layer capacitors (MLCCs). They were less expensive than

    Ta-caps and with their flat design were useful in compact

    devices such aslaptopsandcell phones.

    Ta-caps with PPy polymer electrolyte followed three

    years later. In 1993 NEC introduced its SMD de-

    vices, called NeoCap. In 1997 Sanyo followed with itsPOSCAP polymer Ta-caps.

    Kemet presented a new conductive polymer for poly-

    mer Ta-caps at the 1999 Carts conference.[13] This ca-

    pacitor used the conductive polymer PEDT (Poly(3,4-

    ethylenedioxythiophene)), also known asPEDOT(trade

    name Baytron).[14]

    Two years later at the 2001 APEC Conference, Kemet

    introduced PEDOT polymer Al-caps.[15] Its AO-Cap se-

    ries included SMD capacitors with stacked anode in D

    size with heights from 1.0 to 4.0 mm, competing with

    Panasonic.

    Around the millennium hybrid polymer capacitors were

    developed, which add a liquid electrolyte to the polymer

    electrolyte.[16][17] The liquid electrolyte provides oxygen

    that allows self-healing processes to reduce the leakage

    current in damaged devices. In 2001, NIC launched a

    hybrid polymer e-cap at a lower price andwith lower leak-

    age current. As of 2015 hybrid polymer capacitors were

    available from multiple manufacturers.

    2 Application basics

    2.1 Role of ESR, ESL and capacitance

    The predominant application set for e-caps and polymer

    capacitors is power supplies. They cause behind the rec-

    tifying smoothing of the rectified AC voltage or interfer-

    ence suppression and buffer or stabilize the DC voltage at

    a sudden power demand of the subsequent circuit. They

    are called backup-, bypass- ordecoupling capacitors.[18]

    In addition to the size, the capacitance, the impedance Z,

    the ESR and the inductance ESL offer important electri-

    cal characteristics.

    The change to digital electronic equipment led to the de-velopment of switching power supplies with higher fre-

    quencies and on-boardDC/DC converter, lower supply

    https://en.wikipedia.org/wiki/DC-to-DC_converterhttps://en.wikipedia.org/wiki/Decoupling_capacitorhttps://en.wikipedia.org/wiki/PEDOThttps://en.wikipedia.org/wiki/Poly(3,4-ethylenedioxythiophene)https://en.wikipedia.org/wiki/Poly(3,4-ethylenedioxythiophene)https://en.wikipedia.org/wiki/KEMET_Corporationhttps://en.wikipedia.org/wiki/NEChttps://en.wikipedia.org/wiki/Cell_phonehttps://en.wikipedia.org/wiki/Laptophttps://en.wikipedia.org/wiki/Ceramic_capacitorhttps://en.wikipedia.org/wiki/Ceramic_capacitorhttps://en.wikipedia.org/wiki/PEDOThttps://en.wikipedia.org/wiki/Polypyrrolehttps://en.wikipedia.org/wiki/Hideki_Shirakawahttps://en.wikipedia.org/wiki/Alan_MacDiarmidhttps://en.wikipedia.org/wiki/Conducting_polymerhttps://en.wikipedia.org/wiki/Pentiumhttps://en.wikipedia.org/wiki/Sanyo
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    3.1 Anodic oxidation 3

    For a sudden power demand of a subsequent circuit, the supply

    voltage drops by ESL, ESR and capacitance charge loss

    voltages and higher supply currents. Decoupling capaci-

    tors needed lower ESR values, which at that time could

    only be realized with larger case sizes or much more ex-

    pensive solid Ta-caps.

    ESRs influence onintegrated circuitfunction is that un-

    der a sudden power demand, the supply voltage drops:

    U = ESR I

    For example:[3]

    Given a supply voltage of 3 V, with a tolerance of 10%

    (200 mV) and supply current of a maximum of 10 A, a

    sudden power demand drops the voltage by:

    ESR = U / I = 0.3 V / 10 A = 30 milliohms.

    This means that the ESR in aCPUpower supply must be

    less than 30 m, otherwise the circuit malfunctions.

    3 Electrolytic capacitors

    Main article:Electrolytic capacitor

    3.1 Anodic oxidation

    Electrolytic capacitors use a chemical feature of some

    special metals, earlier called valve metals that by anodic

    oxidationform an insulating oxide layer. By applying a

    positive voltage to the anode, an oxide barrier layer with

    a thickness corresponding to the applied voltage forms.

    This oxide layer acts as the dielectric in an e-cap. The

    cathode must conform to the oxide surface. This is ac-

    complished by the electrolyte, which acts as the cathode.The main difference between the polymer capacitor fam-

    ilies is the anode material and its oxide:

    Basic principle of anodic oxidation (forming), in which, by ap-

    plying a voltage with a current source, an oxide layer is formed

    on a metallic anode

    Polymer Ta-caps use high purity sintered tantalum

    powder as an anode with tantalum pentoxide

    (Ta2O5) as the dielectric.

    Polymer Al-caps use a high purity and electrochem-

    ically roughened aluminum foil as an anode with

    aluminum oxide(Al2O3) as the dielectric.

    Conductive plates

    Dielectric

    dA

    A dielectric material is placed between two conducting plates

    (electrodes), each of areaA and with a separation ofd.

    Every e-cap in principle forms a plate capacitor whose

    capacitance is an increasing function of the electrode area

    A, thepermittivity and the thinner the dielectric (d).

    C = A

    d

    Capacitance is proportional to the product of the area of

    one plate multiplied by the permittivity and divided by

    the dielectric thickness.

    This thickness is in the range of nanometers per volt.

    Etched or sintered anodes have a higher surface area com-

    pared to a smooth surface of the same areal dimension.

    The capacitance value, depending on the rated voltage,increases by a factor of up to 200 for liquid Al-caps and

    solid Ta-caps.[20][21][22]

    https://en.wikipedia.org/wiki/Meterhttps://en.wikipedia.org/wiki/Permittivityhttps://en.wikipedia.org/wiki/Aluminum_oxidehttps://en.wikipedia.org/wiki/Aluminumhttps://en.wikipedia.org/wiki/Tantalum_pentoxidehttps://en.wikipedia.org/wiki/Tantalumhttps://en.wikipedia.org/wiki/Oxidationhttps://en.wikipedia.org/wiki/Anodizinghttps://en.wikipedia.org/wiki/Electrolytic_capacitorhttps://en.wikipedia.org/wiki/CPUhttps://en.wikipedia.org/wiki/Integrated_circuit
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    4 3 ELECTROLYTIC CAPACITORS

    Because the forming voltage defines the oxide thickness,

    the voltage proof can be produced simply for the desired

    rated value. Therefore, the volume of a capacitor is de-

    fined by the product of capacitance and voltage, the so-

    called CV product.

    Comparing the dielectric constants of tantalum and alu-minum oxides, Ta2O5 has permittivity approximately 3-

    fold higher than Al2O3. Ta-caps therefore theoretically

    can be smaller than Al-caps with the same capacitance

    and rated voltage. Ta-cap oxide layers are much thicker

    than the rated voltage requires. This is done for safety

    reasons to avoid shorts from field crystallization,[23] but

    reduces the size advantage.

    3.2 Electrolytes

    The most important electrical property of an electrolyte

    is its electrical conductivity. The electrolyte forms thecounter electrode of thee-cap, thecathode. The rough-

    ened structures of the anode surface continue in the struc-

    ture of the oxide layer, the dielectric. The cathode must

    adapt precisely to the roughened structure. With a liq-

    uid, as in the conventional wet e-caps this is easy to

    achieve. In polymer e-caps in which a solid conductive

    polymer forms the electrolyte, this is much more difficult

    to achieve, because its conductivity comes by a chemi-

    cal process of polymerization. However, the benefits of

    a solid polymer electrolyte, the significantly lower ESR

    and the low temperature dependence of the electrical pa-

    rameters, in many cases justify the additional productionsteps and higher costs.

    3.2.1 Conducting salt TCNQ electrolyte

    The original Samsung TCNQ e-caps with TCNQ as elec-

    trolyte were not polymer capacitors, unlike the modified

    Panasonic devices marketed under the same name[24] that

    use a conductive polymer electrolyte (PPy).[25]

    3.2.2 Polymer electrolyte

    Polymers are formed by a chemical reaction,

    polymerization. In this reactionmonomersare continu-

    ously attached to a growing polymer strand.[26] Usually

    polymers are electrical insulators or semiconductors. In

    e-caps,conductivepolymers are employed. Conductivity

    is provided byconjugated double bondsthat permit free

    movement of charge carriers in the doped state. The

    charge carriers areelectron holes. Conducting polymer

    conductivity is nearly comparable with metallic conduc-

    tors. The polymers must be oxidatively or reductively

    doped.

    A polymer electrolyte must be able to penetrate the an-odes finest crevices to form a complete, homogeneous

    layer, because only anode oxide sections covered by the

    Structural formula of TCNQ

    electrolyte contribute capacitance. The precursors of the

    polymer must consist of small base materials that can

    penetrate the smallest pores. The size of the precursors

    implicitly limit the size of the pores in the aluminum

    anode foils or tantalum powder. The rate of polymer-

    ization must be controlled for capacitor manufacturing.

    Too rapid polymerization does not lead to complete an-

    ode coverage, while too slow polymerization increases

    production costs. The oxide must not chemically or me-

    chanically attack either the precursors, the polymer or its

    residues. The electrolyte must have high stability over a

    wide temperature range and a long interval. The polymer

    film is the capacitors counter electrode and protects the

    dielectric against external influences such as direct con-

    tact with graphite in the cathode.

    Polymer e-caps employ either polypyrrole (PPy)[27] or

    polythiophene(PEDOTor PEDT).[28][29]

    3.2.3 Polypyrrole PPy

    Polypyrrole(PPy) is a conducting polymer formed by

    oxidative polymerization ofpyrrole. A suitable oxidiz-

    ing agent isiron (III) chloride(FeCl3). Water, methanol,ethanol, acetonitrile and other polar solvents may be used

    for PPy synthesis.[31] As a solid conducting polymer elec-

    https://en.wikipedia.org/wiki/Iron_(III)_chloridehttps://en.wikipedia.org/wiki/Pyrrolehttps://en.wikipedia.org/wiki/Oxidationhttps://en.wikipedia.org/wiki/Polypyrrolehttps://en.wikipedia.org/wiki/Polythiophenehttps://en.wikipedia.org/wiki/Polypyrrolehttps://en.wikipedia.org/wiki/Electron_holehttps://en.wikipedia.org/wiki/Doping_(semiconductor)https://en.wikipedia.org/wiki/Charge_carrierhttps://en.wikipedia.org/wiki/Conjugated_systemhttps://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivityhttps://en.wikipedia.org/wiki/Monomershttps://en.wikipedia.org/wiki/Polymerizationhttps://en.wikipedia.org/wiki/Chemical_reactionhttps://en.wikipedia.org/wiki/Anodehttps://en.wikipedia.org/wiki/Cathodehttps://en.wikipedia.org/wiki/Electrolytic_capacitorhttps://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivityhttps://en.wikipedia.org/wiki/Electrolyte
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    3.2 Electrolytes 5

    Structural formula ofpolypyrrole, doped withp-Toluenesulfonic

    acid

    Pyrrole can be polymerized electrochemically to control the rate

    of polymerizion.[30]

    trolyte it achieves conductivity up to 100S/m. Polypyr-

    role was the first conductive polymer used in polymer e-

    caps and the first in polymer Al-caps, followed by poly-

    mer Ta-caps.

    In situ polymerization of PPy features a slow rate of poly-

    merization. When pyrrole is mixed with the desired oxi-

    dizing agents at room temperature, polymerization begins

    immediately. Thus polypyrrole begins to form before the

    chemical solution enters the anodes pores. The poly-merization rate can be controlled by cryogenic cooling or

    electrochemical polymerization. The cooling method is

    delicate and is unfavorable for mass production. In elec-

    trochemical polymerization an auxiliary electrode layer

    has to be applied on the dielectric and connected to the

    anode.[29] For this purpose, ionic dopants are added to

    the polymer, forming a conductive surface layer during

    the first impregnation. During subsequent impregnations,

    the in-situ polymerization can be time-controlled by the

    current flow after applying a voltage between the anode

    and cathode.[32] Both methods are complex and require

    repetitive polymerization steps that increase manufactur-ing costs.

    The polypyrrole electrolyte has two fundamental disad-

    vantages. It is toxic and becomes unstable at the temper-

    atures required for lead-free soldering.[29]

    3.2.4 Polythiopene PEDOT and PEDOT:PSS

    Poly(3,4-ethylenedioxythiophene), abbreviated PEDOT

    or PEDT[28] is a conducting polymer based on 3,4-

    ethylenedioxythiophene or EDOT monomer. PEDOT

    is polarized by the oxidation of EDOT with catalyticamounts of iron (III) sulfate. The re-oxidation of iron is

    given bySodium persulfate.[33] Its advantages areoptical

    Structural formula of PEDOT

    Structural formula of PEDOT:PSS

    transparency in its conducting state, non-toxicity, stability

    up to 280 C and conductivity up to 500S/m.[29] Its heat

    resistance allows polymer capacitors to be manufacturedthat withstand the higher temperatures required for lead-

    free soldering. These capacitors also have better ESR

    values.[29]

    Pre-polymerized dispersions of PEDOT allow the anodes

    to be dipped and dried at room temperature. Sodium

    polystyrene sulfonate (PSS) is dissolved in water with

    PEDOT precursors.[34] The complete polymer layer is

    then composed of pre-polymerized particles from the dis-

    persion. These dispersions are known as PEDOT: PSS

    (trade names Baytron P[35] and Clevius),[36] protecting

    PEDOTs valuable properties.[37][38]

    PEDOT:PSS dispersions are available in different vari-ants. High capacitance capacitors with roughened alu-

    minum anode foils or fine-grained tantalum powders can

    https://en.wikipedia.org/wiki/Polystyrene_sulfonatehttps://en.wikipedia.org/wiki/Sodiumhttps://en.wikipedia.org/wiki/Siemens_(unit)https://en.wikipedia.org/wiki/Electrical_conductionhttps://en.wikipedia.org/wiki/Transparency_and_translucencyhttps://en.wikipedia.org/wiki/Transparency_and_translucencyhttps://en.wikipedia.org/wiki/Transparency_and_translucencyhttps://en.wikipedia.org/wiki/Transparency_and_translucencyhttps://en.wikipedia.org/wiki/Sodium_persulfatehttps://en.wikipedia.org/wiki/Thiophenehttps://en.wikipedia.org/wiki/Thiophenehttps://en.wikipedia.org/wiki/PEDThttps://en.wikipedia.org/wiki/PEDOThttps://en.wikipedia.org/wiki/Poly(3,4-ethylenedioxythiophene)https://en.wikipedia.org/wiki/Siemens_(unit)https://en.wikipedia.org/wiki/P-Toluenesulfonic_acidhttps://en.wikipedia.org/wiki/P-Toluenesulfonic_acidhttps://en.wikipedia.org/wiki/Polypyrrole
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    6 5 PACKAGING

    use small particle sizes. The average size of these parti-

    cles is about 30 nm, small enough to penetrate the finest

    anode capillaries. Another variant offers larger particles

    leading to a relatively thick polymer layer to envelop and

    protect rectangular Ta and Al polymer capacitors against

    mechanical and electrical stress.[29][36]

    PEDOT:PSS polymer Al-caps reach voltages of 200 V[39]

    and 250 V.[40] Leakage current values are significantly

    lower than for polymer capacitors having in-situ poly-

    merized layers. This approach offers better ESR values,

    higher temperature stability, lower leakage current and

    ease of manufacture, requiring only three immersions,[34]

    significantly reducing costs.

    3.2.5 Hybrid electrolyte

    Hybrid polymer Al-caps coat the anode with a conduc-

    tive polymer and add a liquid electrolyte. The liquid con-nects the polymer layers covering the dielectric and the

    cathode. The liquid electrolyte supplies oxygen for self-

    healing processes, which restores the oxide layer and re-

    duces the leakage current, so that values common to con-

    ventional wet e-caps can be achieved. The safety mar-

    gin for the oxide thickness for a desired rated voltage can

    be reduced.

    The detrimental effects of the liquid electrolyte on ESR

    and temperature characteristics are relatively minor. Ap-

    propriate organic electrolytes and good sealing allow a

    long service life.[17][41]

    4 Types

    Based on the used anode metal and the combination of a

    polymer electrolyte together with a liquid electrolyte, the

    three different types are:

    PolymerTa-cap

    PolymerAl-cap

    Hybrid polymer Al-cap

    These types or families are produced in two different

    styles:

    Rectangular SMD chip, usually molded with a plas-

    tic case, available with sintered tantalum anode or

    with stacked aluminum anode foils and

    SMD cylinder with a wound cell in a metal case, ei-

    ther V-chips style or radial leaded versions (single-

    ended)

    Styles of polymer electrolytic capacitors

    Rectangular

    Cylindrical

    5 Packaging

    5.1 Rectangular style

    In the early 1990s polymer Ta-caps coincided with the

    emergence of flat devices such as mobile phones and lap-tops using SMD assembly technology. The rectangu-

    lar base surface achieves the maximum mounting space,

    which is not possible with round base surfaces. The sin-

    tered cell can be manufactured so that the finished com-

    ponent has a desired height, typically the height of other

    components. Typical heights range from about 0.8 to 4

    mm.

    5.1.1 Ta-caps

    Polymer Ta-caps are Ta-caps in which the electrolyte

    is a conductive polymer instead of MnO2. Ta-caps aremanufactured from a powder of relatively pure elemental

    tantalummetal.[42][43][44]

    The powder is compressed around a tantalum wire, the

    anode connection, to form a pellet. This pellet/wire

    combination is vacuum sintered at 1200 to 1800 C, mak-

    ing it mechanically strong. During sintering, the powder

    takes on a sponge-like structure, with all the particles con-

    necting as a monolithic spatial lattice. The result is highly

    porous, offering a large surface area.

    The dielectric layer is formed covering the tantalum parti-

    cle surfaces viaanodizationor forming. The pellet is sub-

    merged into a weak solution of acid and DC voltage is ap-

    plied, creating theoxide layer. After theoxide layer is im-

    pregnated with the polymer precursors, they are polymer-

    ized. This polymerized pellet now is successively dipped

    into conductinggraphiteand thensilverto provide a good

    connection to the conducting polymer. These layers form

    the cathode connection. The capacitive cell then is gen-

    erally molded by a synthetic resin.

    Basic construction of a polymer tantalum capacitor

    Layer structure of a polymer tantalumcapacitor with

    graphit/silver cathode connection

    Basic cross-section of a rectangular polymer tanta-

    lum chip capacitor

    Rectangular polymer tantalum chip capacitor

    Next multiple anode blocks are connected in parallel in

    one case, to further reduce the ESR value and lower

    ESL. Polymer Ta-caps have ESR values approximately

    1/10 that of MnO2 Ta-caps. Three parallel capacitors

    with an ESR of 60 m each have a resulting ESR of 20

    m.[45][46] In this construction up to six anodes in one de-vice are connected. Multi-anode polymer Ta-caps have

    ESR values in the single-digit milliohm range.

    https://en.wikipedia.org/wiki/Silverhttps://en.wikipedia.org/wiki/Graphitehttps://en.wikipedia.org/wiki/Anodizinghttps://en.wikipedia.org/wiki/Dielectrichttps://en.wikipedia.org/wiki/Sinteringhttps://en.wikipedia.org/wiki/Tantalumhttps://en.wikipedia.org/wiki/Tantalum_capacitorhttps://en.wikipedia.org/wiki/Aluminum_electrolytic_capacitorhttps://en.wikipedia.org/wiki/Tantalum_capacitor
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    5.2 Cylindrical (radial) style 7

    The disadvantage of polymer Ta-caps is the higher leak-

    age current, higher by a factor of 10 higher compared to

    MnO2 Ta-caps. Polymer SMD Ta-caps are available up

    to a size of 7.3 x 4.3 x 4.3 mm (length x width x height)

    with a capacity of 1000 F at 2.5 V. They cover temper-

    ature ranges from 55 C to +125 C and are available in

    rated voltage values from 2.5 to 63 V.

    5.1.2 Lowering ESR and ESL

    Multi-anode construction: sintered tantalum anodes are con-

    nected in parallel, reducing both ESR and ESL.

    Lowering ESR and ESL remains a major research and de-

    velopment objective. Directions include low ohmic poly-

    mer electrolytes and parallel connection of conventional

    capacitor cells in one case.

    ESL can be reduced by shortening the internal leads, by

    asymmetric sintering of the anode lead since ESL is a

    positive function of the lead length. This technique iscalled face-down construction. The lower ESL shifts

    the resonance to higher frequencies, which handle the

    faster load changes of digital circuits with higher switch-

    ing frequencies.[47]

    Face-down construction: the internal current path is shortened,which reduces parasitic impedance, shifting the resonance to

    higher frequencies.

    .

    These enhancements bring Ta-caps ever closer to MLCC

    capacitors.

    5.1.3 Al-caps

    Rectangular polymer Al-caps have one or more layered

    aluminum anode foils and a conductive polymer elec-

    trolyte. The layered anode foils are at one side contact

    each other. After the dielectric is created and polymer-

    ized, it is successively dipped into conducting graphite

    and thensilverto connect to the conducting polymer and

    then to the cathode. The capacitive cell then generally is

    molded by a synthetic resin.

    Basic construction of a polymer aluminum capacitor

    with layered anode stripes

    Layer structure

    Cross-section

    Assembled device

    The layered anode foils are parallel-connected single ca-

    pacitors, reducing ESR and ESL and allowing them to

    operate at higher frequencies.

    These Al-caps are available in the D"-case form factor

    with 7,3x4,3 mm and heights of 24 mm. They provide

    a competitive alternative to Ta-caps.[48]

    Comparing the two chip capacitor types shows that thedifferent permittivities of aluminum oxide and tantalum

    pentoxide have little impact onspecific capacitydue to

    different safety margins in oxide layers. Ta-caps use an

    oxide layer thickness that corresponds to approximately

    four times the rated voltage, while the polymer Al-caps

    have about twice the rated voltage.

    5.2 Cylindrical (radial) style

    Cylindrical polymer Al-caps use liquid electrolytes. They

    are available only with aluminum as the anode material.They are intended for larger capacitance values compared

    to rectangular polymer capacitors. Due to their design,

    they may vary in height on a given surface mounting area

    so that larger capacitance values can be achieved by a

    taller case without increasing the mounting surface. This

    is primarily useful for printed circuit boards without a

    height limit.

    Cylindrical capacitors are made of two rolled up alu-

    minum foils, an etched and formed anode and a cath-

    ode foil that are mechanically separated by a separator

    and wound together. The winding is impregnated with

    the polymer precursors, which are then polymerized toform the conductive polymer as a layer between the di-

    electric and the cathode foil, electrically connecting both

    https://en.wikipedia.org/wiki/Printed_circuit_boardshttps://en.wikipedia.org/wiki/Specific_capacityhttps://en.wikipedia.org/wiki/Silverhttps://en.wikipedia.org/wiki/Graphite
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    8 6 COMPARISON

    layers. The winding is built into an aluminum case and

    sealed with rubber. For the SMD version (Vertical chip=

    V-chip) the case is provided with a bottom plate.

    5.2.1 Polymer aluminum

    These capacitors use a solid polymer electrolyte as the

    dielectric. They are less expensive than polymer Ta-caps

    for a given CV. They are available up to a size of 10x13

    mm (diameter x height) with a CV value of 3900 F/2.5

    V[49] They can cover temperature ranges from 55 C to

    +125 C and are available in nominal voltage values from

    2.5 to 200 V.[39]

    Unlike wet Al e-caps the cases of polymer Al capacitors

    dont have a vent (notch) in the bottom of the case, since

    a short circuit does not form gas, which would increase

    pressure in the case.

    Design principles of cylindrical polymer aluminum

    capacitors

    Winding of an aluminum electrolytic capacitor

    Cross-sectional view of a wound polymer aluminum

    capacitor

    Cylindrical polymer aluminum capacitors with

    wound cell in cylindrical metal case, in radial leaded

    (single-ended) and SMD style (V-chip)

    5.2.2 Hybrid polymer Al-caps

    Cross-sectional view

    Hybrid polymer capacitors are available only in the cylin-

    drical style. The anode and cathode foils are separated

    by a spacer, leaded in the radial (single-ended) design or

    with a base plate in the SMD version (V-chip). The sepa-

    rator is impregnated with a liquid electrolyte as in a con-

    ventional wet Al-cap. The liquid electrolyte delivers the

    oxygen that is necessary for defect self-healing.The current that flows through a defect results in selective

    heating, which normally destroys the overlying polymer

    film, isolating, but not healing, the defect. In hybrid poly-

    mer capacitors liquid can flow to the defect, delivering

    oxygen and healing the dielectric by generating new ox-

    ides, decreasing the leakage current. Hybrid polymer Al

    capacitors have a much lower leakage current than non-

    hybrids.

    6 Comparison

    6.1 Benchmarks

    The polymer electrolyte, the anode materials, together

    with design differences led to multiple polymer e-cap

    families with different specifications.

    (As of April 2015)

    6.2 Electrical parameters

    Electrical properties of polymer capacitors can best be

    compared, using consistent capacitance, rated voltage

    and dimensions. The leakage current is significant, be-

    cause it is higher than that of e-caps with non-polymer

    electrolytes. The respective values of Ta-caps with MnO2electrolyte and wet Al e-caps are included.

    1) Manufacturer, Series, Capacitance/Rated voltage, 2)

    rectangular style (Chip), 3) cylindrical style, 4) Leakage

    current, calculated for a capacitor with 100 F/10 V,

    (As of June 2015)

    6.3 Advantages and disadvantages

    Advantages against wet e-caps:

    articulately lower ESR values.

    articulately higher ripple current capability

    articulately lower temperature depending character-

    istics

    no evaporation of electrolyte, longer service life

    no burning or exploding in case of shorts

    Disadvantages against wet e-caps:

    more expensive

    higher leakage current

    damageable by transients and higher voltages spikes

    Advantages of hybrid polymer Al-caps:

    less expensive

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    7.3 Rated and category voltage 9

    lower leakage current

    impassible against transients

    Disadvantage of hybrid polymer e-caps:

    limited service life due to evaporation

    Advantages against MLCCs:

    no voltage dependent capacitance

    no microphonic

    higher capacitance values

    7 Electrical characteristics

    7.1 Series-equivalent circuit

    R leakage

    C

    R ESR L ESL

    Series-equivalent circuit model of an electrolytic capacitor

    Capacitor electrical characteristics are harmonized by the

    international generic specification IEC 60384-1. In this

    standard, characteristics are described by an idealized

    series-equivalent circuit with electrical components that

    model all ohmic losses, capacitive and inductive param-

    eters:

    C, capacitance

    RESR, the equivalent series resistancewhich sum-marizes all ohmic losses, usually abbreviated as

    ESR

    LESL, the equivalent series inductance which is

    the effective self-inductance, usually abbreviated as

    ESL.

    R, the resistance representing theleakage current

    7.2 Rated capacitance, standard values

    and tolerances

    Capacitance depends on frequency and temperature.

    Electrolytic capacitors with liquid electrolytes show

    Typical capacitance capacitor as a function of temperature for

    a polymer Al e-cap and two liquid Al e-caps

    a broader variability over frequency and temperature

    ranges than polymer capacitors.

    The standardized measuring condition for polymer Al-

    caps is an AC measuring method with 0.5 V at a fre-

    quency of 100/120 Hz and a temperature of 20 C. For

    polymer Ta-caps a DC bias voltage of 1.1 to 1.5 V for

    types with a rated voltage 2.5 V, or 2.1 to 2.5 V for

    types with a rated voltage of >2.5 V, may be applied dur-

    ing the measurement to avoid reverse voltage.

    The capacitance measured at the frequency of 1 kHz is

    about 10% less than the 100/120 Hz value. Therefore,

    the capacitance values are not directly comparable and

    differ from those of film capacitors or ceramic capacitors,whose capacitance is measured at 1 kHz or higher.

    The basic unit of capacitance is themicrofarad(F). The

    value specified in manufacturer data sheets is called the

    rated capacitance CR or nominal capacitance CN. It is

    given according to IEC 60063 in values corresponding to

    theE series. These values are specified with a tolerance

    in accordance with IEC 60062, preventing overlaps.

    The actual measured capacitance value must be within the

    tolerance limits.

    7.3 Rated and category voltage

    Referring to IEC 60384-1, the allowed operating voltage

    for polymer e-caps is called the rated voltage UR". The

    rated voltage UR is the maximum DC voltage or peak

    pulse voltage that may be applied continuously at any tem-

    perature within the rated temperature range TR.

    The voltage proof of e-caps decreases with increasing

    temperature. Some applications require a higher tem-

    perature range. Lowering the voltage applied at a higher

    temperature maintains safety margins. For some capac-

    itor types, IEC specifies a temperature derated voltage

    for a higher temperature, the category voltage UC". Thecategory voltage is the maximum DC voltage or peak

    pulse voltage that may be applied continuously to a capac-

    https://en.wikipedia.org/wiki/Preferred_numberhttps://en.wikipedia.org/wiki/Faradhttps://en.wikipedia.org/wiki/Ceramic_capacitorhttps://en.wikipedia.org/wiki/Film_capacitorhttps://en.wikipedia.org/wiki/Leakage_(electronics)https://en.wikipedia.org/wiki/Equivalent_series_inductancehttps://en.wikipedia.org/wiki/Equivalent_series_resistance
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    10 7 ELECTRICAL CHARACTERISTICS

    Relation between rated voltage UR and category voltage UC and

    rated temperature TR and category temperature TC

    itor at any temperature within the category temperaturerange TC. The relation between voltage and temperature

    is given in the figure at right.

    Applying a higher than specified voltage may destroy an

    e-cap. Applying a lower voltage may have a positive in-

    fluence. A lower applied voltage can extend hybrid Al-

    caps lifetimes.[20] Lowering the voltage applied increases

    the reliability and reduces the expected failure rate of Ta-

    caps.[50]

    7.4 Rated and category temperature

    The relation between rated temperature TR and rated

    voltage UR as well as higher category temperature TC and

    derated category voltage UC is given in figure at right.

    7.5 Surge voltage

    Polymer e-cap oxid layers are formed for safety reasons

    at higher than the rated voltage, called a surge voltage, for

    a limited number of cycles.

    The surge voltage indicates the maximum peak voltage

    value that may be applied to capacitors for a limited num-

    ber of cycles.[20] The surge voltage is standardized in IEC

    60384-1.

    For polymer Al-caps the surge voltage is 1.15 times the

    rated voltage. For Ta-caps the surge voltage can be 1.3

    times the rated voltage, rounded off to the nearest volt.

    The surge voltage may influence the capacitors failure

    rate.[51][52][53]

    7.6 Transient voltage

    Transients are fast, high voltage spikes. Al-caps and

    Ta-caps cannot withstand transients or peak voltages

    higher than surge voltage. Transients may destroy the

    components.[51][52]

    Hybrid Al-caps are relatively insensitive to short-term,

    transient voltages higher than surge voltage, if the fre-

    quency and the energy content of the transients are

    low.

    [17][41]

    This ability depends on rated voltage and com-ponent size. Low energy transient voltages lead to a volt-

    age limitation similar to azener diode.[54] An unambigu-

    ous and general specification of tolerable transients or

    peak voltages is not possible. Transient voltage use cases

    must be individually assessed.

    7.7 Reverse voltage

    Polymer e-caps are polarized and generally require the

    anode voltage to be positive relative to the cathode volt-

    age. Nevertheless, they can withstand a reverse voltage

    for limited cycles.[55][56] A reverse voltage applied for too

    long leads to short-circuit and destruction.

    7.8 Impedance and ESR

    See also: Electrolytic capacitor Impedance, and

    Electrolytic capacitor ESR and dissipation factor tan

    Theimpedanceis thecomplex ratioof the voltage to the

    current in anAC circuitand expresses asAC resistance

    both magnitude andphase at a particular frequency. Indata sheets only the impedance magnitude |Z| is specified.

    Regarding the IEC 60384-1 standard, the impedance val-

    ues are measured and specified at 100 kHz.

    In the special case ofresonance, in which the both reac-

    tiveresistances XCand XL have thesame value(XC=XL),

    impedance will be determined by only ESR, which totals

    all resistive losses. At 100 kHz impedance and ESR have

    nearly the same value for polymer e-caps with capaci-

    tance values in the F range. With frequencies above the

    resonance, impedance increases again due to ESL, turn-

    ing the capacitor into an inductor.

    Impedance and ESR, as shown in the curves, depends onthe electrolyte. The curves show the progressively lower

    impedance and ESR values of wet Al, MnO2 tantalum,

    Al /TCNQ and tantalum polymer e-caps. The curve of

    a ceramic Class 2 MLCC capacitor, with still lower Z

    and ESR values is also shown, but whose capacitance is

    voltage-dependent.

    An advantage of polymer over Al-caps with liquid elec-

    trolyte is low temperature dependence and almost linear

    ESR curve over the specified temperature range. This

    applies to all three polymer e-cap types. Impedance and

    ESR are also dependent on design and materials. Cylin-

    drical e-caps have higher inductance resonant frequencythan rectangular e-caps. This effect is amplified by multi-

    anode construction, in which individual inductances are

    https://en.wikipedia.org/wiki/Resonancehttps://en.wikipedia.org/wiki/Phase_(waves)https://en.wikipedia.org/wiki/Electrical_resistancehttps://en.wikipedia.org/wiki/Electronic_circuithttps://en.wikipedia.org/wiki/Alternating_currenthttps://en.wikipedia.org/wiki/Ratiohttps://en.wikipedia.org/wiki/Complex_numberhttps://en.wikipedia.org/wiki/Electrical_impedancehttps://en.wikipedia.org/wiki/Electrolytic_capacitor#ESR_and_dissipation_factor_tan_%CE%B4https://en.wikipedia.org/wiki/Electrolytic_capacitor#Impedancehttps://en.wikipedia.org/wiki/Zener_diodehttps://en.wikipedia.org/wiki/Voltage_spikehttps://en.wikipedia.org/wiki/Transient_(oscillation)
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    7.10 Current surge, peak or pulse current 11

    Typical impedance characteristics over the frequency range for

    100 F e-caps compared with a 100 F ceramic Class 2 -MLCC

    - capacitor.

    Typical curve of the ESR as a function of temperature for poly-

    mer capacitors and wet Al e-caps

    reduced by their parallel connection[45][46] and the face-

    down technique.[47]

    7.9 Ripple current

    The superimposed (DC biased) AC ripple current flow across the

    smoothing capacitor C1 of a power supply causes internal heat

    generation corresponding to the capacitorsESR.

    A ripple current is theroot mean square(RMS) value

    of a superimposed AC current of any frequency and any

    waveformof the current curve for continuous operation

    within the specified temperature range. It arises mainly inpower supplies (including switched-mode power supplies)

    after rectifying an AC voltage and flows as charge and

    discharge current through the decoupling or smoothing

    capacitor.[57]

    Ripple currents generates heat inside the capacitor body.

    This dissipation power loss PL is caused by ESR and is

    the squared value of the effective (RMS) ripple current

    IR.

    PL =I2

    R ESR

    This internally generated heat, above the ambient temper-

    ature and other external heat sources, leads to a tempera-

    ture differential of Tover the ambient. This heat has to

    be distributed as thermal losses Pth over the capacitors

    surfaceAagainst the thermal resistanceto the ambient.

    Pth = T A

    This heat is distributed bythermal radiation,convectionandthermal conduction. The temperature must not ex-

    ceed the maximum specified temperature.

    The ripple current for polymer e-caps is specified as an

    effective value at 100 kHz at upper category temper-

    ature. Polymer capacitors ESR stability over the fre-

    quency range allows the 100 kHz-value to apply across

    the frequency range. Typically, the specified value for

    maximum ripple current in datasheets is calculated for a

    core temperature differential of 20 C. Use of polymer

    capacitors at higher temperature reduces the ripple cur-

    rent.

    Non-sinusoidal ripple currents have to be analyzed and

    separated into their individual sinusoidal frequencies by

    means ofFourier analysis and summarized by squared

    addition.[58]

    IR =

    i12

    + i22

    + i32

    + in2

    In polymer Ta-caps the heat generated by the ripple

    current influences reliability.[59][60][61][62] Exceeding the

    limit can result in catastrophic failures with short circuits

    and burning components.

    Ripple current heat affects the lifetimes of all three poly-mer e-cap types.[57][63]

    7.10 Current surge, peak or pulse current

    Polymer Ta-caps are sensitive to peak or pulse

    currents.[51][52] Solid Ta-caps that are exposed to

    surge, peak or pulse currents, for example, in highly

    inductive circuits, require voltage derating. If possible

    the voltage profile should be a ramp turn-on, as this

    reduces the peak current.

    Polymer Al-caps have no restrictions on current surge,peak or pulse currents. However, the summarized cur-

    rents must not exceed the specified ripple current.

    https://en.wikipedia.org/wiki/Fourier_analysishttps://en.wikipedia.org/wiki/Thermal_conductionhttps://en.wikipedia.org/wiki/Convectionhttps://en.wikipedia.org/wiki/Thermal_radiationhttps://en.wikipedia.org/wiki/Switched-mode_power_supplyhttps://en.wikipedia.org/wiki/Waveformhttps://en.wikipedia.org/wiki/Root_mean_squarehttps://en.wikipedia.org/wiki/Multi-Layer_Ceramic_Capacitor
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    12 8 RELIABILITY AND LIFETIME

    7.11 Leakage current

    The general leakage current behavior of electrolytic capacitors

    depend on the kind of electrolyte

    TheDC leakage current (DCL) is a unique characteris-

    tic for e-caps. It is theDCcurrent that flows when a DC

    voltage of correct polarity is applied. This current is rep-

    resented by the resistorRleakin parallel with the capac-

    itor in the series-equivalent circuit of e-caps. The main

    causes of DCL for solid polymer capacitors are points of

    electrical dielectric breakdown after soldering, unwanted

    conductive paths due to impurities or to poor anodization

    and for rectangular types, dielectric bypass due to excess

    MnO2, due to moisture paths or cathode conductors (car-

    bon, silver).[64]

    Datasheet leakage current specification is given by multi-

    plication of the rated capacitance valueCRwith the value

    of the rated voltage UR together with an added figure,

    measured after 2 or 5 minutes:

    ILeak = 0.01 A

    V F UR CR+ 3A

    Leakage current in solid polymer e-caps generally drops

    fast but then remains steady. The value depends on the

    voltage applied, temperature, measuring time and mois-

    ture allowed by case sealing conditions.Polymer e-caps have relatively high leakage current val-

    ues. In solid polymer e-caps this cannot be reduced by

    healing in the sense of generating new oxide, because

    under normal conditions solid electrolytes cannot deliver

    oxygen for forming processes. Annealing of dielectric

    defects can only be carried out through local overheat-

    ing and polymer evaporation. The leakage current values

    for polymer e-caps are between0.2 CRURto0.04 CRUR.

    Thus the value of the leakage current for polymer capac-

    itors is higher than for wet aluminum and MnO2 Ta-

    caps.

    This higher leakage current disadvantage is avoided byhybrid Al-caps. Their liquid electrolyte provides the oxy-

    gen that is necessary for the reforming of oxide defects,

    so that the hybrids achieve the same values as wet Al or

    Ta-caps.[17][57]

    7.12 Dielectric absorption (soakage)

    Main article:Dielectric absorption

    Dielectric absorption occurs when a capacitor charged

    for a long time discharges only incompletely. Although

    an ideal capacitor would reach zero volts after discharge,

    real capacitors develop a small voltage from time-delayed

    dipole discharging, a phenomenon that is also called

    dielectric relaxation, soakage or battery action.

    No figures for dielectric absorption are available for poly-

    mer capacitors.

    8 Reliability and lifetime

    8.1 Reliability (failure rate)

    Main article:Reliability engineering

    Reliabilityis a property that indicates how consistently

    Bathtub curvewith times of early failures, random failures

    and wear-out failures. The time of random failures is the time

    of constant failure rate

    a component performs its function over a time interval.

    It is subject to astochastic processand can be describedqualitatively and quantitatively, but is not directly mea-

    surable. Eurance testsreveal thefailure rate. Reliability

    normally is shown as abathtub curvean(figure on right)

    d is divided into three areas: early failures, constant ran-

    dom failures and wear out failures. Failure rates are the

    sum of short circuit, open circuit and degradation failures

    (exceeding electrical parameters). For Ta-caps the fail-

    ure rate is influenced by the circuit series resistor, which

    is not required for Al-caps.

    Billions of test unit-hours are needed to verify acceptable

    failure rates. This requires about a million units tested

    over a long period.[65] Test failure rates are often com-plemented with feedback from large users (field failure

    rate), which mostly lowers failure rate estimates.

    https://en.wikipedia.org/wiki/Bathtub_curvehttps://en.wikipedia.org/wiki/Failure_ratehttps://en.wikipedia.org/wiki/Endurance_testhttps://en.wikipedia.org/wiki/Stochastic_processhttps://en.wikipedia.org/wiki/Bathtub_curvehttps://en.wikipedia.org/wiki/Reliability_engineeringhttps://en.wikipedia.org/wiki/Reliability_engineeringhttps://en.wikipedia.org/wiki/Dielectric_relaxationhttps://en.wikipedia.org/wiki/Dielectric_absorptionhttps://en.wikipedia.org/wiki/Direct_currenthttps://en.wikipedia.org/wiki/Leakage_(electronics)
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    8.2 Lifetime, service life 13

    For historical reasons the failure rate units of Ta-caps and

    Al-caps are different. For Al-caps thereliabilitypredic-

    tion is generally expressed in afailure rate, with the unit

    Failures In Time (FIT) at standard operating conditions

    40 C and 0.5 UR during the period of constant random

    failures. This is the number of failures that can be ex-

    pected in one billion (109) component-hours of operation(e.g., 1000 components for 1 million hours, or 1 million

    components for 1000 hours which is 1 ppm/1000 hours)

    at standard operating conditions. This failure rate model

    implicitly assumes that failures are random. Individual

    components fail at random times but at a predictable rate.

    The reciprocal value of FIT is Mean Time Between Fail-

    ure (MTBF).

    For Ta-caps the failure rate FT" is specified with the

    unit n % failures per 1000 hours at 85 C, U = UR and

    a circuit resistance of 0.1 /V. This is the failure percent-

    age that can be expected in 1000 hours of operation at

    much more demanding operational conditions comparedwith the FIT model. The failure rates "" and FT" de-

    pend on operating conditions including temperature, volt-

    age applied and environmental factors such as humidity,

    shocks or vibrations and capacitance.[50] Failure rates are

    an increasing function of temperature and applied volt-

    age.

    Solid tantalum and wet Al-caps failure rates can be

    recalculated with acceleration factors standardized for

    industrial[66] or military[67] contexts. The latter is estab-

    lished in industry and often used for industrial applica-

    tions. However, for polymer aluminum and Ta-caps no

    acceleration factors had been published as of 2015. Anexample of a recalculation from a Ta-cap failure rate FTa

    into a failure rate therefore only can be given by com-

    paring standard capacitors. Example:

    A failure rate FTa= 0.1%/1000 h at 85 C and U= UR

    shall be recalculated into a failure rate at 40 C andU

    = 0,5UR.

    The following acceleration factors from MIL-HDBK

    217F are used:

    FU = voltage acceleration factor, for U= 0,5

    URisFU= 0.1FT= temperature acceleration factor, forT=

    40 C isFT= 0.1

    FR = acceleration factor for the series resis-

    tanceRV, at the same value it is = 1

    It follows

    = FTa x FU x FT x FR

    = (0.001/1000 h) x 0.1 x 0.1 x 1 =

    0.00001/1000 h = 1109/h = 1 FIT

    As of 2015 the published failure rate figures for polymer

    tantalum and polymer Al-caps are in the range of 0.5

    to 20 FIT. These reliability levels are comparable with

    other electronic components and achieve safe operation

    for decades under normal conditions.

    8.2 Lifetime, service life

    The lifetime,service life, load life or useful life of e-caps

    is a special characteristic of liquid e-caps, especially liq-

    uid Al-caps whose liquid electrolyte can evaporate, lead-

    ing to wear-out failures. MnO2Ta-caps have no wear-out

    mechanism so that the failure rate is constant up to the

    point all capacitors have failed. They dont have a life-

    time specification like liquid Al-caps.

    Polymer Ta-caps and Al-caps do have a lifetime specifica-

    tion. The polymer electrolyte has a small conductivity de-

    terioration by thermal polymer degradation. The electri-

    cal conductivity decreases as a function of time, in agree-

    ment with a granular metal type structure, in which agingis due to polymer grain shrinkage.[63]

    The useful life (load life, service life) is tested with a

    time accelerating endurance test according to IEC 60384-

    24/25/26[68] with rated voltage at the upper category

    temperature. Passing the test requires no total failures

    (short circuit, open circuit) and degradation failures and

    capacitance loss by less than 20% and increased ESR and

    impedance by more than a factor of 2 compared to the ini-

    tial value. These limits for degradation failures are much

    closer than for wet Al-caps. That means that lifetime be-

    havior is much more stable than for wet Al-caps.

    The lifetime for maximum voltage and temperature isspecified in similar terms to the liquid electrolytic e-caps,

    but uses less stressful operational conditions that lead to

    much longer operational lifetimes.[69][70][71] Polymer ca-

    pacitor lifetimes for different operational conditions can

    be estimated by:

    Lx =LSpec 10T0TA

    20

    Lx= lifetime to be estimated

    LSpec= specified lifetime

    T0= upper category temperature

    TA= temperature of the e-cap case or ambient tem-

    perature near the capacitor

    This rule characterizes the change of thermic polymer re-

    action speeds within the specified degradation limits. Ac-

    cording to this formula the theoretical expected service

    life of a 2000 h/105 C polymer capacitor, operated at

    65 C, can be calculated (estimated) with 200,000 hours

    or more than 20 years.

    For liquid hybrids, the 20-degree rule does not apply. Theexpected life of these hybrid e-caps can be calculated us-

    ing the10-degree rule.

    https://en.wikipedia.org/wiki/Aluminum_electrolytic_capacitorhttps://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivityhttps://en.wikipedia.org/wiki/Service_lifehttps://en.wikipedia.org/wiki/Mean_Time_Between_Failureshttps://en.wikipedia.org/wiki/Lambdahttps://en.wikipedia.org/wiki/Failure_ratehttps://en.wikipedia.org/wiki/Reliability_engineering
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    14 10 COMMERCIAL INFORMATION

    8.2.1 Field crystallization

    Polymer capacitors are reliable at the same level as other

    electronic components with low failure rates. How-

    ever, all Ta-caps have a unique failure mode called field

    crystallization.[72] Field crystallization is the major rea-son for degradation and catastrophic failures of solid Ta-

    caps.[73] More than 90% of (rare) Ta-cap failures are

    caused by short circuits or leakage current due to this fail-

    ure mode.[74]

    The oxide film must be formed in an amorphous struc-

    ture. Changing the amorphous structure into a crys-

    tallized structure increases conductivity reportedly 1000

    times along with an enlarged oxide volume.[23][75]

    After application of a voltage at weakened spots in the oxide a

    localized higher leakage current is formed, which leads to a local

    heating of the polymer, whereby the polymer either oxidized and

    becomes highly resistive or evaporates.

    Field crystallization followed by adielectric breakdownis

    characterized by a sudden rise in leakage current, within

    a few milliseconds, from nano-ampere to ampere mag-

    nitude in low-impedance circuits. Increasing current

    flow can produce an avalanche effect, rapidly spread-ing through the metal/oxide. This can result in damage

    ranging from small, burned areas on the oxide to zigzag

    burned streaks covering large areas of the pellet or com-

    plete oxidation of the metal.[76][77] If the current source is

    unlimited, field crystallization may cause a short circuit.

    However, if the current source is limited, in Ta-caps with

    solid MnO2electrolyte a self-healing process takes place,

    reoxidizing MnO2into insulating Mn2O.

    In polymer Ta-caps combustion is not a risk. Field crys-

    tallization may occur, but the polymer layer is selectively

    heated and burned away by the leakage current, so that

    the faulty point is isolated. Without the polymer mate-rial, the leakage current cant accelerate. The faulty area

    no longer contributes to the capacitance.

    8.2.2 Self-healing

    Polymer Al-caps exhibit the same self-healing mecha-

    nism as polymer Ta-caps. After application of a voltage

    at weakened spots in the oxide a localized higher leakage

    current is formed, which leads to localized polymer heat-

    ing, whereby the polymer either oxidizes and becomeshighly resistive or evaporates. Hybrids show this self-

    healing mechanism. Faulty spots not covered with a poly-

    mer film allow liquid electrolyte to deliver oxygen to build

    up new oxide.

    9 Standards

    Electronic componentand related technology standard-

    ization follow rules given by the International Elec-

    trotechnical Commission (IEC),[79] a non-profit, non-

    governmental internationalstandards organization.[80][81]

    The definition of the characteristics and the procedure

    of the test methods for capacitorsfor use in electronic

    equipment are set out in the generic specification:

    IEC/EN 60384-1Fixed capacitors for use in elec-

    tronic equipment

    The tests and requirements to be met by aluminum and

    Ta-caps for use in electronic equipment for approval as

    standardized types are set out in the sectional specifica-

    tions:

    IEC/EN 60384-24Surface mount fixed Ta-caps

    with conductive polymer solid electrolyte

    IEC/EN 60384-25Surface mount fixed aluminium

    e-caps with conductive polymer solid electrolyte

    IEC/EN 60384-26Fixed aluminium e-caps with

    conductive polymer solid electrolytec

    10 Commercial information

    10.1 Capacitor symbol

    Electrolytic capacitor symbols

    10.2 Polarity marking

    Polarity marking

    10.3 Imprinted markings

    Polymer e-caps, given sufficient space, have coded im-

    printed markings to indicate:

    https://en.wikipedia.org/wiki/Capacitorhttps://en.wikipedia.org/wiki/Standards_organizationhttps://en.wikipedia.org/wiki/Non-profit_organizationhttps://en.wikipedia.org/wiki/International_Electrotechnical_Commissionhttps://en.wikipedia.org/wiki/International_Electrotechnical_Commissionhttps://en.wikipedia.org/wiki/Electronic_componenthttps://en.wikipedia.org/wiki/Dielectric_breakdown
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    15

    manufacturers name or trademark

    manufacturers type designation

    polarity

    rated capacitance

    tolerance on rated capacitance

    rated voltage

    climatic category or rated temperature

    year and month (or week) of manufacture

    For small capacitors no marking is possible.

    The code of the markings vary by manufacturer.

    10.4 Technological competition

    ESR and ESL characteristics are converging to those of

    MLCC capacitors. Conversely, the specific capacitance

    of Class 2-MLCC capacitors is approaching that of tan-

    talum chip capacitors.[82][83] Other characteristics favor

    one or another type.[84][85] e.g., Al-Polymer e-caps versus

    MLCC: Panasonic,[86] MLCC versus Polymer and wet

    e-caps:Murata,[87][88] Al-Polymer e-caps versus wet e-

    caps: NCC[18] NIC[16] andTa-Polymer e-caps against

    standard solid Ta-MnO2 e-caps: |publisher=Kemet[89]

    10.5 Manufacturers and products

    As of July 2015

    11 See also

    Aluminum electrolytic capacitor

    Electrolytic capacitor

    Niobium capacitor

    SAL electrolytic capacitor

    Tantalum capacitor

    Capacitor types

    12 References

    [1] Taylor, R. L.; Haring, H. E. (November 1956). A metal

    semi-conductor capacitor. J. Electrochem. Soc. 103 611.

    [2] McLean, D. A.; Power, F. S. (1956). Proc. Inst. Radio

    Engrs. p. 872.

    [3] Mosley, Larry E. (2006-04-03). Capacitor Impedance

    Needs For Future Microprocessors. Orlando, FL: Intel

    Corporation CARTS USA.

    [4] Wudl, F. (1984). From organic metals to super-

    conductors: managing conduction electrons in organic

    solids.Accounts of Chemical Research17(6): 227232.

    doi:10.1021/ar00102a005.

    [5] Niwa, Shinichi; Taketani, Yutaka (June 1996).

    Development of new series of aluminium solid

    capacitors with organic Semiconductive electrolyte

    (OS-CON)". Journal of Power Sources60 (2): 165171.

    [6] Kuch. Investigation of charge transfer complexes:

    TCNQ-TTF"(PDF).

    [7] OS-CON Technical Book Ver. 15(PDF). Sanyo. 2007.

    [8] About the Nobel Prize in Chemistry 2000, Advanced In-

    formation(PDF). October 10, 2000.

    [9] Zhang, Y. K.; Lin, J.; Chen, Y. Polymer Aluminum

    Electrolytic Capacitors with Chemically-Polymerized

    Polypyrrole (PPy) as Cathode Materials Part I. Effect of

    Monomer Concentration and Oxidant on Electrical Prop-

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    [10] Merker, U.; Wussow, K.; Lvenich, W.; Starck, H. C.

    New Conducting Polymer Dispersions for Solid Elec-

    trolyte Capacitors(PDF).

    [11] APYCAP Series, Function Polymer Capacitor. Nit-

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    [12] Electronic Components - Panasonic Industrial Devices.

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    [13] Prymak, John. Replacing MnO2 with Polymers, 1999

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    [14] Jonas, F.; Starck, H.C. Basic chemical and physical prop-

    erties, Prsentation 2003. Baytron.

    [15] Prymak, John (2001).Performance Improvements with

    Polymer (Ta and Al)"(PDF). Kemet.

    [16] Hybrid Construction, Aluminum Electrolytic Capaci-

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    [17] Understanding Polymer & Hybrid Capacitors [Whitepa-

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    [18] Conductive Polymer Aluminum Solid Capacitors Appli-

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    [19] Stevens, J.L.; Geiculescu, A.C.Strange, Dielectric Alu-

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    [20] Albertsen, A. Keep your distance Voltage Proof of

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    [21] Specifications for Etched Foil for Anode, Low Voltage

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    13 External links

    http://www.evox-rifa.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/F0B2667A13FEB75A85257225006AC85C/$file/1999%2520CARTS%2520Replacing%2520MnO2%2520with%2520Polymer.pdfhttp://www.evox-rifa.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/F0B2667A13FEB75A85257225006AC85C/$file/1999%2520CARTS%2520Replacing%2520MnO2%2520with%2520Polymer.pdfhttp://www.mouser.com/pdfdocs/MurataECASPolymerFAQ3.pdfhttp://www.tecnoimprese.it/user/file/PLENARIA_IPE/MURATA.PDFhttp://www.ndb.com.tw/files/panasonic/others/ENG04_SP-ALvsMLCC0301.pdfhttp://www.ndb.com.tw/files/panasonic/others/ENG04_SP-ALvsMLCC0301.pdfhttp://www.ndb.com.tw/files/panasonic/others/ENG04_SP-ALvsMLCC0301.pdfhttp://www.analog.com/static/imported-files/application_notes/AN-1099.pdfhttp://www.analog.com/static/imported-files/application_notes/AN-1099.pdfhttp://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/0CBE2E5238A759A385256A8700515CCD?OpenDocumenthttp://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/0CBE2E5238A759A385256A8700515CCD?OpenDocumenthttp://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/0CBE2E5238A759A385256A8700515CCD?OpenDocumenthttp://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/0CBE2E5238A759A385256A8700515CCD?OpenDocumenthttp://www.kemet.com/Lists/TechnicalArticles/Attachments/57/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25202.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/57/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25202.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/57/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25202.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/58/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25201.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/58/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25201.pdfhttp://www.kemet.com/Lists/TechnicalArticles/Attachments/58/2007%2520CARTS-Europe%2520The%2520Battle%2520for%2520Max%2520CV%2520-%2520Part%25201.pdfhttp://www.beuth.de/de/http://webstore.iec.ch/?ref=menuhttp://www.iec.ch/http://www.iec.ch/http://www.eetimes.com/document.asp?doc_id=1279739http://www.eetimes.com/document.asp?doc_id=1279739http://www.avx.com/docs/techinfo/voltaged.pdfhttp://www.avx.com/docs/techinfo/voltaged.pdfhttp://www.vishay.com/docs/49268/tn0003.pdfhttps://nepp.nasa.gov/files/21705/11_005_gsfc_Liu_Failure_Modes_in_Capacitors.pdfhttps://nepp.nasa.gov/files/21705/11_005_gsfc_Liu_Failure_Modes_in_Capacitors.pdfhttps://nepp.nasa.gov/files/21705/11_005_gsfc_Liu_Failure_Modes_in_Capacitors.pdfhttp://www.elna-america.com/tech_tan_failurerates.phphttp://old.passivecomponentmagazine.com/files/archives/2005/PCI_05_01Jan-Feb.pdfhttp://old.passivecomponentmagazine.com/files/archives/2005/PCI_05_01Jan-Feb.pdfhttp://www.jourlib.org/paper/2327093http://www.jourlib.org/paper/2327093http://www.low-esr.com/endurance.asphttp://bbs.dianyuan.com/bbs/u/68/1111231219375672.pdfhttp://www.nichicon.co.jp/english/products/pdf/2012fpcap_catalog_05.pdfhttp://www.beuth.de/en/http://www.everyspec.com/MIL-HDBK/MIL-HDBK-0200-0299/MIL-HDBK-217F_NOTICE-2_14590/http://www.everyspec.com/MIL-HDBK/MIL-HDBK-0200-0299/MIL-HDBK-217F_NOTICE-2_14590/http://www.niccomp.com/Products/smt/NTCRel-FR71399.pdfhttp://www.interstatemarketing.com/Papers/TechArticles/Tant-Niobium/leakage.pdfhttp://www.sciencedirect.com/science/article/pii/S1566119908001791http://www.sciencedirect.com/science/article/pii/S1566119908001791http://www.newark.com/pdfs/techarticles/kemet/Ripple-Current-Capabilities-Technical-Update.pdfhttp://www.vishay.com/docs/40031/apprippl.pdfhttp://www.vishay.com/docs/40031/apprippl.pdfhttp://www.avx.com/docs/techinfo/ripptant.pdfhttp://www.avx.com/docs/techinfo/ripptant.pdfhttp://www.avx.com/docs/techinfo/thrmtant.pdfhttp://www.avx.com/docs/techinfo/thrmtant.pdfhttp://www.vishay.com/docs/28356/alucapsintroduction.pdfhttp://www.vishay.com/docs/28356/alucapsintroduction.pdf
  • 7/26/2019 Polymer Capacitor

    18/19

    18 14 TEXT AND IMAGE SOURCES, CONTRIBUTORS, AND LICENSES

    14 Text and image sources, contributors, and licenses

    14.1 Text

    Polymer capacitor Source: https://en.wikipedia.org/wiki/Polymer_capacitor?oldid=722858451 Contributors: Pol098, Bgwhite, Gaius

    Cornelius, Chris the speller, Lfstevens, KenShirriff, Mild Bill Hiccup, Niceguyedc, Elcap, Addbot, Yobot, AnomieBOT, VladislavPogorelov, Ripchip Bot, John of Reading, Checkingfax, Access Denied, Sbmeirow, NTox, Mikhail Ryazanov, Frietjes, BG19bot, Bat-

    tyBot, ChrisGualtieri, RuiGSa, Ceramic123, Monkbot, JamesP, Bel017, OUYALING and Anonymous: 14

    14.2 Images

    File:Al-Elkos-OSCON-Wiki-P1040347-07-02-18.jpg Source: https://upload.wikimedia.org/wikipedia/commons/b/b6/

    Al-Elkos-OSCON-Wiki-P1040347-07-02-18.jpg License: CC-BY-SA-3.0 Contributors: Own work Original artist: Elcap JensBoth

    File:Anodic_oxidation.jpg Source: https://upload.wikimedia.org/wikipedia/commons/8/83/Anodic_oxidation.jpg License: CC0 Con-

    tributors:Own workOriginal artist:Elcap

    File:Commons-logo.svgSource:https://upload.wikimedia.org/wikipedia/en/4/4a/Commons-logo.svgLicense:CC-BY-SA-3.0Contribu-tors:? Original artist:?

    File:E-cap-capacitance_versus_temperature.jpgSource: https://upload.wikimedia.org/wikipedia/commons/3/3b/E-cap-capacitance_

    versus_temperature.jpgLicense:CC0 Contributors:Own workOriginal artist:Elcap

    File:E-cap-construction-principle-3-hybrid-polymer.png Source: https://upload.wikimedia.org/wikipedia/commons/9/9b/E-cap-construction-principle-3-hybrid-polymer.png License:CC0 Contributors:Own work Original artist:Elcap

    File:ESR-comparison-Wet_e-cap-Polymer.tif Source: https://upload.wikimedia.org/wikipedia/commons/b/be/

    ESR-comparison-Wet_e-cap-Polymer.tif License:CC0 Contributors:Ow