pixel atsushi taketani riken riken brookhaven research center 1.overview of pixel subsystem 2.test...
DESCRIPTION
33 Specification Collision Rate ~ 10MHz -> Timing Resolution < 100nsec Trigger Rate Max 20KHz Occupancy < 1% for pixel detector Pixel size 50 * 425 m 2 Tracking Resolution 50micron for displacement High precision at mechanical construction ~ 25 micron for internal Material Budget ~ 1% of radiation length Technology: Pixel detector developed for ALICE experiment at LHC. Budget: –RIKEN : Ladders and Front End Module –DOE: Mechanical and infrastructure –Ecole Polytechnique :SPIRO boardTRANSCRIPT
PixelAtsushi Taketani
RIKENRIKEN Brookhaven Research Center
1. Overview of Pixel subsystem
2. Test beam
3. Each Components
4. Schedule
5. Summary
2
Full ladder
~4mm
Pixel bus
Pixel sensor modules
Pixel stave (with cooling)
Pixel detector = inner 2 layers of VTX1st layer: 10 full pixel ladders = 20 half ladders = 40 sensor modules2nd layer: 20 full pixel ladders = 40 half ladders = 80 sensor modules
Pixel DetectorPixel Detector
SPRIO
57mm (32 x 4 pixel)13mm256 pixel
Sensor module 50m x 425m
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Specification• Collision Rate ~ 10MHz -> Timing Resolution < 100nsec• Trigger Rate Max 20KHz• Occupancy < 1% for pixel detector • Pixel size 50 * 425m2 • Tracking Resolution 50micron for displacement • High precision at mechanical construction ~ 25 micron for internal• Material Budget ~ 1% of radiation length
• Technology: Pixel detector developed for ALICE experiment at LHC.
• Budget: – RIKEN : Ladders and Front End Module– DOE: Mechanical and infrastructure– Ecole Polytechnique :SPIRO board
44
PIXEL (Sensor and Readout)
Pixel size( x z ) 50 µm x 425 µmSensor Thickness 200mr = 1.28cm, z = 1.36 cm (Active area)256 x 32 = 8192 channel / sensor4 chip / sensor4 sensor / stave
Readout by ALICE_LHCB1 chip
• Amp + Discriminator / channel
•Bump bonded to each pixel
•Running 10MHz clock ( RHIC 106nsec )
•Digital buffer for each channel > 4sec depth
•Trigger capability > FAST OR logic for each crossing
•4 event buffer after L1 trigger
55
PIXEL (Sensor and Readout)
Readout by ALICE_LHCB1 chip
• Amp + Discriminator / channel
•Bump bonded to each pixel
•Running 10MHz clock ( RHIC 106nsec )
•Digital buffer for each channel > 4sec depth
•Trigger capability > FAST OR logic for each crossing
•4 event buffer after L1 trigger
66
Pixel detector ladder• Sensor module consists of 4 ALICE Pixel readout chips
Bump-bonded to silicon sensor
Sensor
Thermo plate + coolingALICE LHCB1 chip
SensorSensor Module
77
Pixel detector ladder• Sensor module consists of 4 ALICE Pixel readout chips
Bump-bonded to silicon sensor
Sensor
Thermo plate + cooling
• One readout unit, half stave, made from two sensor modules
ALICE LHCB1 chip
SensorSensor Module
88
Pixel detector ladder• Sensor module consists of 4 ALICE Pixel readout chips
Bump-bonded to silicon sensor
Sensor
• Half stave is mounted on the support structure
Thermo plate + cooling
• One readout unit, half stave, made from two sensor modules
ALICE LHCB1 chip
SensorSensor Module
99
Pixel detector ladder• Sensor module consists of 4 ALICE Pixel readout chips
Bump-bonded to silicon sensor
Sensor
• Half stave is mounted on the support structure
Thermo plate + cooling
• Pixel BUS to bring data out and send control signal into the readout chip is mounted on the half stave
Half stavePixel BUS
Data
• One readout unit, half stave, made from two sensor modules
ALICE LHCB1 chip
SensorSensor Module
1010
Pixel detector ladder• Sensor module consists of 4 ALICE Pixel readout chips
Bump-bonded to silicon sensor
Sensor
• Half stave is mounted on the support structure
Thermo plate + cooling
• Pixel BUS to bring data out and send control signal into the readout chip is mounted on the half stave
• Each detector module is built of two half staves,read out on the barrel ends
Half stavePixel BUS
Data
• One readout unit, half stave, made from two sensor modules
Full stave
22cm
1.4cm
ALICE LHCB1 chip
SensorSensor Module
1111
Bus structure
Power 50 m Al
GND 50 m Al
• 6 layers structure• GND, Power and 4 signal lines
Signal 2; (Vertical line)line connected withpixel chip with wire bonding
Signal 4; (for manufacture reason)
Signal-4 3 m Cu
Signal-3 3 m Cu
Signal-2 3 m Cu
Signal 1; (for Surface Mount Device)Signal-1 to Signal-4are connected with through hole
Signal lines; 60 m pitchMaterial Budget; Total ~ 0.26 %
Final configuration
Signal-1 3 m Cu
Signal 3; (Horizontal line) send signal to Pilot Module connected with vertical line with through hole
Thermo-plateSensor module
Wire bonding
Al Power Al GND
Through hole
Signal layer
Total 188 lines
25cm long
1.4cm wide
1212
Pixel Readout Overview
Half stave
11cm
60cm
Bus (25cm ) + Extender (<35cm)
13
Major components StatusComponent Status #delivered (needed)
Sensor Module Ordering new module and rework
69 good one (128)
Bus Under Production 5 sets of R/L (64)
Extender FPC production doneUnder SMD parts population
80 (80)
SPIRO board Under Production Summer 2009(66)
FEM Under production Ready by end of Aug.(33)
Stave Under production 5 are tested and delivered(32)
Ladder Assembly
Production started 1st :manual assemble2nd : using assembly fixture(32)
14
Test beam at 120GeV Proton
Stripixel Pixel
Proton
FERMILAB Meson Test area
120 GeV Proton
5-30mm beam spot
4.5 sec spil per 1 min.
2×1010 proton / spil
Independent DAQ for Pixel and Stripixel.
Using trigger scintillation counters
Stripixel
3 Prototype ROC
Trigger: Beam defining Scinti.
DAQ : SVX4+ ROC+RCC
Pixel
3 Prototype pixel ladder
Trigger: Scinti * FAST_OR (3layer)
DAQ: Prototype Readout + PHENIX DAQ
15
Pixel performanceResidual
res = 6.1m res = 57m
Row direction Column direction
Residual [m] Residual [m]
coun
t
coun
t
Intrinsic resolution row : 14m column : 152m
3
1
2)(i
iXFit
Un-convolute
Fit include all 3 layers hit position
Multiple scattering effect
16
Sensor Module Status
• We need 120 sensor module for 30 ladder plus spares.
• 69 Useable Class I sensor Modules.• 51 Class III sensor module will be
reworked until September 2009 and probed for 2 months.
• 55 brand new sensor module will be purchased under paper work going.
17
Class I 702chipsClass II 175 chipsClass III 538chips
•We need 271 chips for reworking and new sensor modules.
Readout Chip
18
Readout Bus
Sensor
10cm
Bus
Extender
Total < 60cm (70cm)
Line/space are 30 /30 micron
Bus and extender are connected by the fine pitch connectors.
Type
Bus: Left and Right
Extender: 34cm long
30cm long
29cm long
19
Bus Production Status
• All process for bus productions has been established.
• 40 Left and 40 Right plus are needed.• 5 set of Bus was fabricated as pre-
production.• Left version is fine for production, Right
version is under confirmation. • 1st Production is starting.
20
Extender
• 80 extenders are needed in total.• 5 extender was produced as pre-
production and confirmed with ladder, SPIRO and FEM.
• Production of total 80 extender was done except trivial surface mount connecters implementation.
21
Stave• Finalized the specification on Feb 2009.• 32 staves plus spares are needed.• LBNL delivered to RIKEN 5 staves.• 20 staves are waiting for survey.• Remainders will be delivered end of June 2009.
22
Spread glue on stave with mask
take 0.2 hourswill be reduced measuring point
Paint glue using mask and manual paddle.
Glue thickness are well controlled 80 micron +-10micron
Assembly procedure: (1) gluing
23
Assembly procedure : (2) aligned sensors on stave
X[mm]
Y[m
m]
+-10 micron
24
Assembly procedure: (3) wire bonding
25
Assembly procedure: (4) Encapsulation of wire
Wire vibrates in magnetic field due to the intermittent current associated with level 1 trigger and may break
stavesensor
Bonding wire
barrier
Potting glue 1mm
No encap
~ 5.9KHz
Resonance
26
Ladder assembly Status
• Prototyping is completed.• Production is started
– Ladder 1 : Class II sensors and real stave/bus Manual assemble for fall back solution. Finished gluing stave-sensor-bus. Under wire bonding– Ladder 2 : Class II sensors and real stave/bus Sensors are glued on the stave by using
assembly fixtures. Bus will be glued by manually.
27
•Multiplex data from ladder and control readout chip
•Reference voltage
•Serial data transmission to FEM by optical link
•Radiation hard for all components.
•Low jitter crystal for high speed link.
•Voltage regulator for ladder.
•Production just started and will be finished before 2009/08.
SPIRO Board by Ecole Polytechnique
Front End Module by Stony Brook University
•Receiving data from SPIRO and transmit to PHENIX DAQ with specified format
•VME base board for slow control/diagnostic.
•Not Radiation hard.
•1st production board is under exhaustive tests.
•All boards are under assembly and will be ready by end of 2009/08.
28
ScheduleSensor module
Ladder Assembly
Readout Electronics
•SPIRO board: Production done before 2009/08
•FEM : Under production and tested until 2009/08
29
Issue
• Sensor module reworking and additional production.– Long lead time. We already discussed with
VTT/CERN.– May impact schedule.
• Ladder assembly had some technical difficulties and has been resolved.– Manual gluing for bus is established.
30
Summary
• Production of pixel ladder has been started.– Technical issues on the ladder assembly was
resolved.– More sensor modules are ordered.
• Readout electronics will be ready by 2009 Fall.