pilot-4d-v8-hf-uk-2016 layout 1 - seica

FLYING PROBE SYSTEM

Pilot4D Line

Pilot4D V8HF

Current electronics trend shows a major direction for the board production:

miniaturization. More products have now very small dimensions and test

engineers have no possibility to allocate the necessary test points for the

validation. Today a new challenge is connected to this situation: the

requirement to test HF signals before final product assembly.

The solution for this application is the Flying probe technology, integrating

the high accuracy of positioning 8 probes on the UUT and the capability to

measure very high frequency signals.

Based on the consolidated and complete solution of the Seica Flying Probes

line, the Pilot4D V8HF includes the performance to test up to 1.6 GHz and

locate probes on 008004 pad size. The Pilot4D V8HF vertical architecture is the

optimum solution for probing both sides of the UUT simultaneously. This

increases test accessibility and flexibility, while guarantees fast, precise, reliable

and repeatable probing: full availability of all the mobile resources for testing the

UUT. This solution represents an important technological innovation in double-

sided flying probe test, overcoming the intrinsic limitations of horizontal

systems. The requirement for standard ICT & Functional testing of the

DUT is still part of the basic requirement and is realized using the Seica

proprietary hardware, so that the implemented resources are used for the DUT

validation. All power supply, DUT enable signals, current consumption control

are realized with the 18 bit resolution ACL measuring card and switching matrix

which allows future expansion capabilities.

Flylab and National Instruments Software Tools

To make the solution easier to use, as an unique tool in the market, the

complete solution is driven by LabViewTM/TestStandTM interface. Engineers

are now able to move probes on a specific target (down to 008004

components) and perform the highest definition test by using a graphical

and user-friendly SW interface. The Flying Probe system still integrates

Seica native capabilities but can be completely driven by LabViewTM

functionalities and makes the technology available for all NI software users

to implement new and additional features. All system resources are open

and easy to manage. The DUT functionality can be tested under critical

environmental conditions: the ability to implement a thermal stress test

(from 0° to 70°C) is reached integrating a cooling and heating system in the

testing area. Managed frequency can be implemented to reach the coverage

of BT and WI-FI ranges to make the solution ever more performing.

The test tools and techniques of the PILOT4D V8HF include:• FNODE signature analysis on the nets of the UUT

• Standard analog and digital in-circuit test

• Vectorless tests (JSCAN and OPENFIX), to test ICs for opens and shorts

• PWMON net analysis for power on the boards

• Continuity test to detect open tracks on the PCB

• Visual tests for component presence/absence and rotation

• Optional Thermal Scan Resources

• ALI: Automatic Laser Inspection for presence/absence and warpage

• compensation

• Up to 4 HF channels with variable pitch ground probe

• Up to 1.6 GHz bandwidth with S-parameters compensation

• Up to 20 GSa/s depending of the instrument selected

• Active probe amplifier

TECHNICAL TABLE PROBES AND CAMERASProbes Position - Test Side Front/RearNumber of “ICT Test Probes” 4 (2 front, 2 rear)Number of “High Frequency / Electrical Probes” 4 (2 front, 2 rear)Number of Fixed Probes up to 192Maximum Digital Embedded Channels 4Thermal Scan Module (option) 2 (1 front, 1 rear)Number of CCD HR 5Mpixel Colour Cameras 2 (1 front, 1 rear)Number of CCD view probes Colour Cameras 2 (1 front, 1 rear)Automatic Marker Recognition Automatic UUT Planarity Compensation Cooler and Heater system (option)

BOARD CLAMPING SYSTEM, UUT SIZES AND WORK AREA (*)Board Clamping System Manual (Dual Action)Active Test Area 560 x 480 mm (22.1 X 18.9")Minimum Board Size (*) 20 x 20 mm (0.78 x 0.78")Minimum Board Thickness 0.3 mm (0.00118")Maximum Board Thickness 5 mm (0.19")UUT Edge Clearance 2 mm manualUniversal Carrier for clamping not-regular shape PCB (option)

PITCHMinimum Pad Pitch 150 μm (6 mil) (**)Minimum Pad Size 75 μm (3 mil)2.5 μm XY axis resolution, brushless motorOptionally 1µm XY resolution

PROBE FEATURESZ-axis Travel -3.0 mm to 40 mm programmable1 µm Z axis resolution, linear motorContact Force 10 g – 100 g programmable

TESTS AND MEASUREMENTS (INSTRUMENTS DSP)Voltage Generator 1 DC/AC (DRA) ±1 mV to ±10 V (±0.1%)Voltage Generator 2 DC/AC (DRB) ±1 mV to ±10 V (±0.1%)Voltage Generator 3 DC/AC (DRC) ±25 mV to ±100 V (±0.2%)Current Generator DC/AC ±1 nA to ±0.5 A (±0.1%)Waveform Generator 1 Sin, Tri, Arbitrary (DRA) 1 Hz to 3 MHz (±1 mHz ) - ±10 V maxWaveform Generator 2 Sin, Tri, Arbitrary (DRC) 1 Hz to 10 kHz (±10 mHz ) - ±100 VmaxVoltage Measurements DC/AC ±200 μV to ±100 VCurrent Measurements DC/AC ±3 nA to ±0.5 AFrequency Measurement 0.1 Hz to 50 MHzDigital Embedded Channel ±12 V - 500 mA - 10 MHzResistance Measurement 1 mΩ to 100 MΩCapacitance Measurement 1 pF to 1 FInductor Measurement 1 μH to 1 HZener Measurement up to 100 V (200V option)Automatic Visual Inspection

HIGH FREQUENCY Bandwidth up to 1.6 GHz (based on selected instrument)Sampling rate up to 20 GSa/s (based on selected instrument)

GENERAL REQUIREMENTS Temperature Range 23°C ± 5°CHumidity 30 - 80 %Power Consumption 3.5 kW max 1.0 kW maxAir Flow 0.35 CFM – 10 l/min. 0.3 CFM – 6 l/min.Weight 1400 kg (3086 Ibs) 200 Kg (441 lbs)Depth 1265 mm (49.8”) 2165 mm open doors (85.3”)Width 1750 mm (68.9”) 3374 mm open doors (132.8”)Height 1800 mm (70.9”) 2230 mm (87.8”) with light-tower

SOFTWARE FEATURESPC/Operating System Windows 7 Software VIVAAutomatic Test Generation YesAutodebug YesData Input Format CAD Data/ManualParallel Test Capabilities Yes

* Universal carrier for unique board configurations** With limited numer of probes.

SEICA WORLDWIDE

SEICA SpA

via Kennedy 24

10019 Strambino - TO

ITALY

Tel: +39 0125 6368.11

Fax: +39 0125 6368.99

Email: [email protected]

PROXIMAS.r.l.


SEICA Inc.


SEICA FRANCE SARL


SEICA DEUTSCHLAND GmbH


SEICA ELECTRONICS

(Suzhou) Co.Ltd.


Seica reserves the right to change the

technical specifications without notice

TDS Pilot V8HF vers. 01 EN 07/2016

pilot-4d-v8-hf-uk-2016 layout 1 - seica

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