perovskite-type transition metal oxide interfaces m. matvejeff 7.2.2011
TRANSCRIPT
Perovskite-type transition metal oxide interfaces
M. Matvejeff7.2.2011
• Perovskites - Chemistry and properties
• Properties of perovskite interfaces - CMR and Magnetic Tunnel Junctions (MTJs)
• Charge transfer at perovskite interfaces
Contents
Perovskites – Structure
AO + BO2 = ABO3
SrTiO3
(La,Sr)MnO3 (LSMO)
1 u.c.ABO
AO
AO
AO
BO2
BO2
Highly flexible cation stoichiometry
Wide variety of functional properties through changes in
cation stoichiometry
(La1-xSrx)MnO3 (LSMO)
Imada et al. Rev. Mod. Phys. 70
Perovskites – The Good
Highly flexible cation stoichiometry
Wide variety of functional properties through changes in
cation stoichiometry
Highly flexible oxygen content
Properties can be fine-tuned after synthesis
AO1- + BO2 = ABO3-
SrTiO3-
(La,Sr)MnO3- (LSMO)
1 u.c.
ABO
AO
AO
AO
BO2
BO2
Perovskites – The Good
The flexibility of perovskite structure and the easy tunability of the functional properties are definite bonuses as long as bulk
material is suitable for applications
For example capacitors, catalytic converters and superconductors
However, significant number of industrial applications rely on device structures consisting of several different functional
material layers, in some cases only few atomic layers in thickness
In these structures, such as field-effect transistors (FETs), the properties of the interface are often significantly more important
to the correct function of the device than the properties of the bulk material
Highly 3-dimensional structure
+Strong hybridization of 3d orbital
of the transition metal B to neighboring oxygen 2p orbitals
+Highly sensitive to small changes
in transition metal oxidation state
Properties at interfaces?
Perovskites – The Bad1 u.c.
ABO
AO
AO
AO
BO2
BO2
• Perovskites - Chemistry and properties
• Properties of perovskite interfaces - CMR and Magnetic Tunnel Junctions (MTJs)
• Charge transfer at perovskite interfaces
Contents
R. von Helmholt APL 1993
Colossal MR (CMR) in La2/3Ba1/3MnO3
Manganites exhibit CMR i.e. strong change
in resistivity under applied magnetic field
The CMR effect can be used for example for
magnetic sensor applications
As the most properties of transition metal
oxides, CMR is highly dependent on transition
metal (Mn) oxidation state
CMR in manganites
General formulaAMnO3
A = divalent and/or trivalent cation (Ca, Sr, La, Nd...)
(La,Sr)MnO3 (LSMO)
Mn3+
t2g
eg
Mn4+
t2g
eg
Itinerantelectron
Localelectrons
Electronic structure of manganites
To understand the origin of CMR
phenomenon we need to first understand the electronic structure of
manganites
Mn3+
t2g
eg
Mn4+
t2g
eg
Itinerantelectron
Localelectrons
LaMnO3
+3 +3 -2
SrMnO3
+2 +4 -2
(La,Sr)MnO3 (LSMO)
La1-xSrxMnO3
+3 +2 3...4 -2
x Mn4+
1-x Mn3+
General formulaAMnO3
A = divalent and/or trivalent cation (Ca, Sr, La, Nd...)
Chemical substitution means we’re directly playing with the average
valence of Mn
In double-exchange (DE) modelItinerant eg electron is the charge carrierwhereas the t2g electrons are localized
Mn3+
t2g
eg
Mn4+
t2g
eg
Itinerantelectron
Localelectrons
Mn3+/Mn4+-ratio (doping) has strong impact on
magnetotransport properties
LaMnO3
+3 +3 -2
SrMnO3
+2 +4 -2
La1-xSrxMnO3
+3 +2 3...4 -2
x Mn4+
1-x Mn3+
(La,Sr)MnO3 (LSMO)
Bulk CMR is not suitable for low field applications (magnetic field
required is in order of several tesla)
How to increase sensitivity?
Significantly weaker field (~coercive field of the material)
required in MTJs
FM
Insulator (t = nm-Å)
FM
Tunneling current
FM
Insulator (t = nm-Å)
FM
Tunneling current
Magnetic tunnel junction (MTJ)
What are magnetic tunnel junctions (MTJs)?
FM
Insulator
FM
Tunneling current
Tunneling current
Applied field
Junc
tion
resi
stan
ce
Applied field
Magnetization
Applied field
Magnetic field required is in order of tens to hundreds of Oe instead of several Tesla as for bulk CMR low field sensors
For maximum sensitivity RA-RAP has to be maximized
Degree of spin polarization is important!
MTJ
RA(AP) Resistance in parallel (antiparallel) configurationP1,P2 Polarizations of electrodes 1 and 2
TMR
R
P
AP
1
2
R. von Helmholt APL 1993
P. M. Tedrow and R. Meservey PRB 1973
Half-metals – Because polarization does matter…
J.-H. Park Nature 1998
Half-metallicity in bulk La0.7Sr0.3MnO3
P ~ 95-100% in low T
LSMO is a good candidate material for
MTJs
Y. Lu, APL 1996
T. Obata, APL 1999
LSMO
STO
LSMO
4.2K
Tc ~ 350K
Good TMR only at low T
TMR dissappears well below Tc
Why?
Dead layer
La0.67Sr0.33MnO3 films grown on (110) NGO (NdGaO3) and (001) LAO (LaAlO3) substrates
Clear thickness dependence in resistivity
Dead (insulating) layer forms at the interface?
How can we study this?
J. Z. Sun APL 1999
Dead layer
(2-10 u.c. LSMO – 2 u.c. STO)10-20 superstructureLSMO = La1-xSrxMnO3, 0.2 x 0.4
By changing the thickness of conducting layers (LSMO) separated by the insulator (SrTiO3) we can probe the critical thickness for transition from ferromagnetic metal (FM) to antiferromagnetic insulator (AFI)
LSMO (2-10 u.c.)
STO (2 u.c.)
LSMO (2-10 u.c.)
STO (2 u.c.)
Dead layer
M. Izumi J. Phys. Soc. Jpn. 2002
For all doping doping levels, decrease in Tc and magnetization with decreasing LSMO thickness
Decrease is faster with higher x
Samples which are closer to metal to insulator-phase diagram line loose metallicity and magnetic order already in thicker films
Y. Tokura Rep. Prog. Phys. 2006
Dead layer
Same effect also observed in M-H measurements
Also, for thinner films M-H does not saturate
This indicates competing FM and AFM interactions
FM FM+AFMFM+AFM+ ext. field!
M. Izumi J. Phys. Soc. Jpn. 2002
Dead layer
From phase diagram we see transition from FM to AF state at x ~ 0.5
Is this related to the formation of dead layer at the interface?
H. Fujishiro J. Phys. Soc. Jpn 1998
Y. Tokura Rep. Prog. Phys. 2006
So how does the dead layer actually form?
LSMO (2-10 u.c.)
STO (2 u.c.)
LSMO (2-10 u.c.)
STO (2 u.c.)
So what does actually happen at the interface layer?
Dead layer
Hole-doping at La1-xSrxMnO3-STO interface x increases The properties of the interface change
M. Izumi J. Phys. Soc. Jpn. 2002
x incre
ase
s(ch
arg
e tra
nsfe
r)STO (2 u.c.)
La0.8Sr0.2MnO3 (x = 0.2)Bulk High Tc High magnetization FM
Hole-doped LSMO (x 0.2)FM+AFM
Lower Tc/magnetization
Effect is stronger when x in the original phase is higher (already closer to critical limit of x ~ 0.5)
Why does the hole-doping occur?
x incre
ase
s
STO (2 u.c.)
La0.4Sr0.4MnO3 (x = 0.4)Bulk High Tc High magnetization FM
Hole-doped LSMO (x 0.4)
Faster decrease in properties
Y. Tokura Rep. Prog. Phys. 2006
• Perovskites - Chemistry and properties
• Properties of perovskite interfaces - CMR and Magnetic Tunnel Junctions (MTJs)
• Charge transfer at perovskite interfaces
Contents
SrTiO3
SrTiO3
LaTiO3
Sr2+ and O2-
Ti4+
(2 + x + 3*(-2) = 0)
La3+ and O2-
Ti3+
(3 + x + 3*(-2) = 0)
Let’s study the following a quantum well structure…
In theory the Ti valence changes sharply at the interface between SrTiO3 (STO) and LaTiO3 (LTO)
SrTiO3
SrTiO3
LaTiO3
LaSrTiO
Ti4+
Ti3+
Ti4+
LaSrTiO
SrTiO3
SrTiO3
Ti3+ fraction
LaTiO3
Ohtomo A. et al., Nature, 2002
Ti4+
Ti3+
Ti4+
Ti3/4+
Ti3/4+
However in practice it has been found out that Ti3+ oxidation state is not limited to the LTO
layers…
… i.e. charge transfer (transfer of electrons) occurs from LTO into STO layers forming
mixed valence interface layer
LSMO
LSMO
STO
FM
Insul.
FM
Now, our ideal TMR device the
LSMO/STO/LSMO tunnel junction
LSMO TC ~ 350 K in the bulk phase
In practice, charge transfer over the interface
Strong impact on carrier density (valence of Mn) at the interface
Instead of FM, LSMO at interface either P or AF
Formation of dead layer and TC 100 K instead of 350 K!
LSMO
LSMO
STO
FM
Insul.
FM
P/AF
P/AF
Y. Tokura Rep. Prog. Phys. 2006
Alternating AO and BO2 layers
Formula: ABO3
3D structure is the problem!
So what about structures which aren’t (fully) 3D?
Perovskite - recap1 u.c.
ABO
AO
AO
AO
BO2
BO2
Closely related to perovskite structure
Alternating AO and BO2 layers
Formula: An+1BnO3n+1
(i.e. one extra AO-layer compared to perovskites, ABO3)
Ruddlesden-Popper structure
Perovskite: 3D structure
vs
Ruddlesden-Popper (RP): 2DHigh anisotropy (ab-plane vs c-axis)
AO
Perovskite (ABO3)
1 u.c.
AO
AO
AO
BO2
BO2
AO
BO2
BO2
n = 2 RP(A3B2O7)
AO 1 formula
unit
BO2
AO
BO2
AO
AO
BO2
AO
BO2
AO
AO
BO2
AO
BO2
AO
c-ax
is
La1.4Sr1.6Mn2O7
T. Kimura & Y. Tokura, Annu. Rev. Mater. Sci., 2000
AO 1 formula
unit
BO2
AO
BO2
AO
AO
BO2
AO
BO2
AO
AO
BO2
AO
BO2
AO
Charge carriers
Cha
rge
carr
iers
A = La, SrB = Mn
Perovskite
Perovskite
RP
Perovskite 1
Perovskite 2
Weak interaction
Clean interface, little or no
modulation
Perovskite 1
Strong interaction
Modulation of interface
properties
So does it actually work?
In perovskite-type interface between (La,Sr)MnO3/(La,Sr)FeO3 electrons are transferred from Mn eg states to Fe eg states
We can study the interface electronic structure in XPS…
Kumigashira et al. APL 2004
t2g
eg
LSMO
LSFO (t = 1-7 layers)
Mn3+
t2g
eg
Mn4+
t2g
eg
Itinerantelectron
Localelectrons
… to determine the occupation of eg and t2g states
As LSFO layer thickness is increased, the charge transfer increases and eg electron occupation decreases (Mn valance increases)
LSFO
LSMO
LSFO
LSMO
Weak interaction
Clean interface
Small change in LSMO valence?
Strong interaction
Large change in LSMO valence
t2g
eg
Perovskite
RP-type interface(LSMO layer thickness = 3 u.c.)
Inte
nsi
ty [
arb
. u
nits
]
-5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0Energy relative to Ef [eV]
Mn 2p - 3d resonant valence bandh = 642 eV
LSFO/LSMO (perovskite interface) LSFO/LSMO (RP-type interface) LSMO reference
t2g
eg
Conclusions
Perovskite phases exhibit interesting functional properties in bulk form
Applications, however, are often based on device structures built from functional layers at times only few atomic layers in thickness
Interface effects arising from the 3-dimensional nature of the perovskite structure dominate the behavior of the devices
Interface effects can be, at times, partially compensated for, but this leads to expensive production processes where device properties are difficult to predict and/or control
Best solutions would be based on integrating, property-wise, 2-dimensional materials into device structures to create not only structurally but also electronically sharp interface structures