performance trade-off scenarios for gaa nanosheet fets
TRANSCRIPT
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Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks
IMEC: Amita Rawat, Philippe Matagne, Bjorn Vermeersch, Geert Hellings, Julien Ryckaert
Huawei: Krishna Bhuwalka, Wu Hao, Changze LiuBelgium
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Motivation and Introduction
TCAD deck calibration
Circuit delay and RO frequency estimation methodology
RO performance comparison and design space study
Self-heating performance comparison
Conclusion
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Outline
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Motivation
Reduced stress control with introduced inner spacers
-2000
-1500
-1000
-500
0
500
1000
Top
Middle
Bottom
Str
ess
alo
ng
ch
an
nel (M
Pa)
Air-gap
horiz.
Top wire
Middle wire
Bottom wire
Air-
gap
vert.
Air-
gap
lateral
Air-gap
hor.+
vert+
lateral
(1nm)
Ref:no
air-
gap
Channel stress at end of process
Verti
cal
Cross-section
The โverticalโ interface is the most critical to maintain channel stress: stress is lost completely when epi from neighboring gates doesnโt join properly
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Introduction
SD
With Inner Spacer
SD
WithoutInner Spacer
W ISP W/O ISP
Stress engineering No Yes
Parasitic cap. Low High
Parasitic res. High Low
Self-heating High Low
Considered cases for electrical performance comparisonโช Option I: With inner spacer and 100 % stressโช Option II: With inner spacer and 0 % stressโช Option III: Without inner spacer and 100 % stress
๐ฟ = ๐. ๐ ๐ฟ = ๐๐. ๐
TCAD Deck Calibration
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NMOS: Width = 11 nm, Str: 100 %
Without With
Vths (V) 0.188 0.180
Ion-lin (uA) 15.96 16.45
Ion-sat (uA) 46.3 49.2
SS (mV/dec) 75.5 71.05
DIBL (mV/V) 35.3 30.7
PMOS: Width = 11 nm; Str = 100 %
Without With
Vths (V) -0.185 -0.178
Ion-lin (uA) 19.6 18.64
Ion-sat (uA) 54.8 55.4
SS (mV/dec) 68.8 65.98
DIBL (mV/V) 29.23 40
DOPING CONCENTRATION PROFILE
Parameters NMOS PMOS
L (nm) 15 15
TNS (nm) 11 11
HNS (nm) 5 5
Spacer (nm) 5 5
100 % Stress (GPa)
0.7 -1.7
NSD (๐๐ฆโ๐) 1e21 1e21
NSD ext (๐๐ฆโ๐) 1e17 1e17
Nchannel (๐๐ฆโ๐) 1e15 1e15
w/ ISP w/o ISP
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ISP removal decreases NMOS on-current
๐ฒ๐๐๐ = 4๐ฒ๐๐ = 7.5
Stress = 0 GPa
NMOS PMOS
Vd = 0.7 V Vd = -0.7 V
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ISP Removal increases carrier scattering
45 ๐A
64 ๐A
40 ๐A
68 ๐A
๐ฒ๐๐๐ = 4๐ฒ๐๐ = 7.5
Stress = 0 GPa
w/o ISPw ISP
Scattering: Carrier-carrier and carrier-ion
Without scattering
With scattering
x
x
Methodology to estimate RO performance using device parasitcs
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Simplified RC network of device
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D
G
S
Ceff1/Aeff
๐ถ๐ท๐บ = ๐ถ๐๐บ๐ด๐ท๐บ = ๐ด๐๐บ
In on state, D and G terminals are shorted
Effect parasitic network in on-state๐ถ๐๐๐ = ๐ถ๐๐บ + ๐ถ๐ท๐๐ด๐๐๐ = ๐ด๐๐บ + ๐ด๐ท๐
D
G
S
CSG
1/ASG
CDS1/ADS
D
G
S
CDG
1/ADG
CSG
1/ASG
CDS1/ADS
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RO frequency estimation
๐ซ๐ฐ๐๐ ๐ญ =๐
๐ ร ๐ ร ๐ซ๐ฐ๐๐
๐ถ๐๐
Charging
๐๐๐๐โ๐ง
๐/๐
๐๐๐โ๐ง
๐๐๐๐โ๐ฉ
๐/๐
๐๐๐โ๐ฉ
๐ฎ๐ต๐ซ
๐ฝ๐ซ๐ซ
Load
๐๐๐๐โ๐ง
๐/๐
๐๐๐โ๐ง
๐๐๐๐โ๐ฉ
๐/๐
๐๐๐โ๐ฉ
๐ฎ๐ต๐ซ
๐ฝ๐ซ๐ซ
Discharging
Load
Charging delay of inverter:
๐ท๐ = ๐ถ๐๐๐โ๐/๐ด๐๐๐โ๐ Discharging delay of inverter: ๐ท๐ = ๐ถ๐๐๐โ๐/๐ด๐๐๐โ๐
Inverter stage delay, ๐ซ๐ฐ๐๐ = ๐ซ๐ +๐ซ๐
On state capacitance and admittance
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ISP removal increases parasitic capacitance by 40 %
๐ฒ๐๐๐ = 4๐ฒ๐๐ = 7.5๐ฒ๐บ๐ = 11.9
~ 40 %
~ 38 %Opt. III: w/o ISP; Stress = 0.7 GPa
Opt. II: w ISP; Stress = 0.0 GPa
Opt. 1: w ISP;Stress = 0.7
GPa
Opt. III: w/o ISP; Stress = -1.7 GPa
Opt. II: w ISP;
Stress = 0.0 GPa
Opt. I: w ISP; Stress = -1.7 GPa
NMOS versus PMOS: D-G Terminals
NMOS PMOS
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ISP removal significantly increases admittance (thanks to max. stress)
NMOS PMOS
~ 6 %
~ 8
2 %
Opt. III: w/o ISP; Stress = 0.7 GPa
Opt. II: w ISP; Stress = 0.0 GPa
Opt. I: w ISP; Stress = 0.7 GPa
Opt. III: w/o ISP; Stress = -1.7 GPa
Opt. II: w ISP;
Stress = 0.0 GPa
Opt. I: w ISP; Stress = -1.7 GPa
NMOS versus PMOS: D-S Terminals
Impact of stress and device architecture on delay performance
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ISP removal increases NMOS effective delay by 15 %
Opt. II: w ISP
Opt. I: w ISP
Opt. III: w/o ISP
Process Advantage: w/o ISP
~15 %
13
5%
10
0 %
0 %
Discharging delay (๐ท๐): with and without inner spacer
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ISP removal lowers PMOS effective delay by 36 %
Opt. II: w ISP
Opt. I: w ISP
Opt. III: w/o ISP
Process Advantage: w/o ISP
~36 %
13
5%
10
0 %
0 %
Charging delay (๐ท๐): with and without inner spacer
Estimation of 9-stage RO frequency using individual device delay information
๐ซ๐ฐ๐๐ ๐ญ =๐
๐ ร ๐ ร ๐ซ๐ฐ๐๐
๐ถ๐๐
Inverter stage delay, ๐ซ๐ฐ๐๐ = ๐ซ๐ +๐ซ๐
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0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6N
orm
. Freq
uen
cy
Opt. II:w ISP
Str. = 0 %
Opt. I:w ISP
Str. = 100 %
Opt. III:w/o ISP
Str. = 100 %19
ISP removal increases RO frequency by 11 % (at realistic stress)
(143.5 GHz)
~50 %
~11 %
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0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6N
orm
. Freq
uen
cy
Opt. II:w ISP
Str. = 0 %
Opt. I:w ISP
Str. = 100 %
Opt. V:w/o ISP
Str. = 135 %20
Applying extra stress can further boost RO frequency
~18 %(143.5 GHz)
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Reducing ๐ of ISP offer minor RO frequency improvement
Normalisation Frequency = 143.5 GHz
โช The RO frequency is less sensitive to inner spacer ๐ฟ variation
~4 %
Stress = 0 %
Opt. II: w ISP
Self-heating performance comparison
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ISP Removal facilitates heat removal towards substrate
IDEAL HEAT SINK IDEAL HEAT SINK IDEAL HEAT SINK
IDEAL HEAT SINK IDEAL HEAT SINK IDEAL HEAT SINK
2 200 uW/um220
Si SiGe TiN SiN lowK highK W Ru
NS regular
NS w/o inner spacer
finFET (iN3 dim.)
10 1005 50Heat flux
Continuous Si path(inner spacer removed)allows increased heatremoval to substrate
Vertical streaks in fin= ballistic transport
100 nm100 nm100 nm100 nm100 nm100 nm
NS regular
NS w/o inner spacer
finFET (iN3 dim.)
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ISP removal lowers self-heating: NS thermal performance becomes competitive with FinFET
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
-105 -35 35 105
Longitudinal position x [nm]
Finger 1
Finger 2 Finger 3
Finger 4
NMOS side
NS regular
NS w/o inner spacer
finFET
Tem
pera
ture
ris
e [ยฐ
C/u
W]
NSregular
NS withoutinner spacer
finFET(iN3 dim.)
A Aโ A Aโ AAโ
A Aโ
IDEAL HEAT SINK IDEAL HEAT SINK IDEAL HEAT SINK
IDEAL HEAT SINK IDEAL HEAT SINK IDEAL HEAT SINK
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Conclusion
Parasitic capacitance
Admittance
Delay
RO Frequency
RO Frequency (extra stress)
ISP Dielectric
Self-heating
Effects of ISP removal
+40 %
N: +6 % P: +82 %
N: +15 % P: -36 %
+11 %
+18 %
+4 %
-7 %
(Due to increased stress)
(Due to carrier scattering)
(Due to increased stress)
(Due to improved heat removal)
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References
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