A Simple Controlled Operation

PCBRMwww.air-vac-eng.com

Removal: Any through hole component can be accurately located over a wave of molten solder, whose shape matches the lead pattern of the component. A predetermined volume of solder flows for only seconds against the bottom of the board, transmitting heat simultaneously to all the component leads. When all joints are molten, the component is lifted from the board.

Cleaning the Holes: After component removal, an air cleaning hood is lowered against the board surface. Low pressure air isapplied to the lead pattern, forcing the molten solder from all holes.

Resoldering: Replacement component is inserted and fluxed. Molten solder is then flowed against the entire lead pattern.

Selective Soldering: Components not on the board in the soldering operation may be inserted and selectively soldered without reflowing any other area of the board.

Printed Circuit Board Reflow Module for Removal & Selective Solderingof Through Hole Components

• Elimination of steel components to prevent tin/copper contamination• Cast iron and commercial pure titanium solder pump• Commercial pure titanium flow wells for long life and reduced maintenance

of Sn/Cu or tin/silver/copper alloy usage.• Exceeds temperature requirement

for higher liquidus/reflow alloys

PCBRM15

Model PCBRM12 - Standard tin/lead systemModel PCBRM15 - Lead free compatible system

• Long life cast iron solder pot• Stainless steel solder pump• Steel flow wells• Stable high mass system allows less heat exposure to assembly compared

to hand tools

PCBRM12

Pumping System & Solder Pot:• Impeller pump design, high temperature bearings and belt insure long life• Simple design - trouble-free operation• Impeller pump/baffle are mounted below surface of solder, minimizing

dross accumulation. Unique pump shaft sleeve minimizes dross migrationinto pot

• Integral cast 2500 watt heating element• Baffled solder flow to insure level solder wave

Headquarters: 30 Progress Avenue • Seymour, CT 06483Tel: 203-888-9900 • Fax: 203-888-1145 • www.air-vac-eng.com

Mid West: 8706 North Royal Lane • Irving, TX 75063 • Tel: 972-621-8686 • Fax: 972-621-8706West Coast: 2131 Las Palmas Drive • Suite D • Carlsbad, CA 92009 • Tel: 760-438-9363 • Fax: 760-438-9419

Single OpeningFlow Wells & Hoods

Multi Opening Flow Wells

Robust Features Provide Long Life and Easy Operation for High Productionfor both PCBRM12 and PCBRM15 Modules

Alignment System:X, Y, Z Board Carrier• Provides accurate board level to solder wave• Cantilever rails hold boards up to 22” x 24”• Linear bearings for precision rail movement• Y-Stop allows quick placement of board to solder wave• Entire system is mounted on rigid cast framework for continuous

industrial usageComponent Location & PCB Hole Cleaning System• Aligns component over solder wave• Positions cleaning hood to clean PCB barrels

Precise Operating Control:Solder Wave Contact• Cycle duration automatically sets time solder contacts boardSolder Wave Flow Rate• Control allows level wave for any flow well shape or size• 3 stage settings for enhanced process control

- Ramp Up Rate for uniform wave shape- Process Rate limits set time against board- Ramp Down Rate affects solder peeling

Temperature• Microprocessor provides closed loop control of set temperature.Accurate to within +/-1% of full scale. System can be set up to 615˚F (325˚C).

SafetyThermal Protection System• Independent controller & thermocouple automatically shuts downsystem if temperature exceeds preset limitEmergency Power-Off Switch• Immediately shuts down all electrical power

Flow Wells Determine the Size, Shape & Direction of Solder FlowThe solder flow matches the component lead pattern. The solder flow canbe accurately directed away from adjacent components to limit heatexposure to sensitive areas.A locating arm with air cleaning hood aligns the component over thesolder wave. The holes are cleaned with low pressure air after componentis removed.Multi Opening Flow Wells can increase production of selectively solderedcomponents. Material for standard flow wells is steel with hard chromeplating. Material for lead free flow wells is titanium.

Technical Data• Physical Dimensions: 32”W x 32”D x 26”H• X/Y Board Carrier Size: 22”W x 24”D (standard)• Solder Capacity: 35 lbs. • Total Weight with Solder: 125 lbs.• Electrical: 208/220 VAC, 15 amps, single phase• Compressed Air: 60-80 psi, clean moisture free

Options• Stand Alone Spray Fluxer • Fume Extraction Manifold• Preheater (Bottom Side) and/or System• Extended Carrier Rail