pcb design and fabrication lin zhong elec424, fall 2010
TRANSCRIPT
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PCB design and fabrication
Lin ZhongELEC424, Fall 2010
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Alternatives to PCB
• Breadboard
Breadboard prototype of the first IBM PC motherboard (1981)http://www.yourdictionary.com/computer/breadboard
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Alternative to PCB (Contd.)
• Prefabricated PCB
Digikey.com
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Outline
• Basic concepts• Introduction to EAGLE• A small design project
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PCB design concepts
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Function Design Schematic
Layout
Routing
Form factor constraints
Production
Assembly
Component library
Design tools
PCBexpress.com
Any local workshops
Design rules
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Schematic Capture
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Layout and Routing
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Layout and Routing (Contd.)
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Component Library
• Component packaging– Surface mount technology (SMT)– Through-hole packaging
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Chip packaging
• Through-hole– Dual in-line(DIP)– Pin grid array (PGA)
• Surface mount– Quad flat (QFP)– Ball grid array (BGA)
• Socket-based– Land grid array (LGA)
Core 2 Duo E6700
XC68020
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PCB design concepts
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Function Design Schematic
Layout
Routing
Form factor constraints
Production
Assembly
Component library
PCB design tool
PCBexpress.com
Any local workshops
Design rules
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Production• Patterning (etching)
– Subtractive process to remove copper cover from a preimpregnated substrate
– Silk-screen printing of etch-resistant inks• Lamination
– Multilayer PCBs• Drilling (vias and holes)• Coating (Solder and Solder mask /resist)• Printing text and symbols
12http://www.unitechelectronics.com
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Assembly• Pick & place machine
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http://www.europlacer.com
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Assembly (Contd.)
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Assembly (Contd.)• Soldering– Wave soldering– Reflow oven
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Wave soldering
• Waves of liquid solder• Board passes the waves• Large devices, high pin count, through-hole
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Reflow Oven
• Heat the board up (infrared)• Small, surface mounted components
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Further Reading
• How motherboards are made– http://www.pcstats.com/articleview.cfm?articleid=1722
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Caveats
• Locations of components• Orientation of components• Height of components• Polarity of components• SMT vs. Through-hole components
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PCB vs. IC
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Function Design Schematic
Layout
Routing
Form factor constraints
Production
Assembly
Component library
Design rules
Synthesis
Integrated
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PCB vs. IC production• Polymer composite board
• Silkscreen printing, photoengraving – Etch away copper
• Copper wires
• Place components on top of board
• Soldering
• Silicon wafer
• Photolithography
• Metallic (copper) wires
• Make devices such as transistors on the wafer
• Modification– Ion implantation, furnace anneal
• Deposition– Physical vapor deposition (PVD)– Chemical vapor deposition (CVD)
Small scale and large # of devices