patran contact

8/17/2019 Patran Contact

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MSC Nastran 비선형 해석 활용 2014 Korea Users Conference

Presented By: DK Oh ( Ahtti )

June 2, 2014

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Contents

1. Bolt결합 유형 모델링 기법

2. Glue Contact조건의 고유진동수 해석

3. SOL 400을 이용한 Forming Simulation4. SOL 400을 이용한 Rubber Seal접촉해석

5. SOL 400을 이용한 Springback해석

6. SOL 400을 이용한 Circuit Board열응력 해석

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1.Bolted Plate Analysis

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Ch.1 Bolt 합 유형 모델링 기법

1. RBE2 Bolt Model 1-1. Type 1 - Full Connection

1-2. Type 2 - Half-Half Connection

1-3. Type 3 - Head Surface Connection

2. 3D Solid Bolt Model 3-1. Type 1 - Only Contact

3-2. Type 2 - Contact and Bolt Preload

Bolt합

유형

모델링

기법

4

Object:

i) Patran에서 지원되 Bolt Modeling 방법 소

ii) Nastran Sol400으로 Bolted Plate비선형 해석 소


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5


- Overview of F.E Model

Top plateBolt

Nut

Bottom plate

1. Specification Units: mm

Top plate 55x20x6

Bottom plate 55x20x6 Bolt hole radius = 5

Bolt shaft radius = 4

Bolt head radius = 6

Bolt head thick = 2

Nut thickness = 2

Nut outer radius = 6

2. Material Properties Eplate = 210 kN/mm

2

Ebolt = Enut = 210 kN/mm2

Vplate = Vbolt,nut = 0.3

3. Boundary Conditions Top plate_Bottom plate – Touch

T,B plate_Bolt – Touch

Bottom plate_Nut – Touch Bottom Plate End - Fixed


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1-1. RBE2Type 1 : Full Connection

1-2. RBE2

Type2 : Half-Half Connection

1-3. RBE2

Type3 : Head Surface

Connection

6


2-1. 3D Solid

Type 1 : Only Contact

2-2. 3D SolidType 2 : Pre-Load


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( RBE2 )


DOF Check

Auto Create Center Node

Node List

-MPC Modeling-

Utilities >> FEM-General >> RBE2/RBE3 Spider

Load Type1 : Tension

Load Type2 : Bending Load Type3 : Torque

-Load Case-

RBE2 Usage : 1 EA

RBE2-1


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( RBE2 ,Result )


Load Type2 : Bending Load Type1 : Tension Load Type3 : Torque

Stress Max. = 47 MPa Stress Max. = 173 MPa Stress Max. = 103 MPa

Disp. Max. = 0.09 mm Disp. Max. = 0.58 mm Disp. Max. = 0.08 mm

Stress Max. Stress Max.

Stress Max.


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( RBE2 )

1. RBE2 Bolt Model 1-2. Type 2 - Half-Half Connection

DOF Check


Node List

-MPC Modeling-




-Load Case-

RBE2 Usage : 3 EA

Beam Element : 1EA

RBE2

RBE2

RBE2 and Beam


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( RBE2 ,Result )

1. RBE2 Bolt Model 1-2. Type 2 - Half-Half Connection-RBE2





Stress Max.


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( RBE2 ,Beam, Result )

1. RBE2 Bolt Model 1-2. Type 2 - Half-Half Connection-Beam Element





Stress Max.


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( RBE2 )

1. RBE2 Bolt Model 1-3. Type 3 - Head Surface Connection

DOF Check


Node List

-MPC Modeling-




-Load Case-

RBE2

RBE2

RBE2 and Beam

RBE2 Usage : 3 EA

Beam Element : 1EA


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( RBE2 ,Result )

1. RBE2 Bolt Model 1-3. Type 3 - Head Surface Connection-RBE2




Stress Max. Stress Max.Stress Max.


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( RBE2 ,Beam, Result )

1. RBE2 Bolt Model 1-3. Type 3 - Head Surface Connection-Beam Element






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( 3D-Solid Bolt Model, SOL 400 )2. 3D-Solid Bolt Model

2-1. Type 1 – Contact, No Pre_Load

-3D-Solid Modeling- -Load Case-

2-2.Bottom_Plate_Body

5-4.Nut_Body



1-1.Top_Plate_Body

3-3.Bolt_Body

T

TT

T

Top_Plate Bottom_Plate ->T

• G : Glue

• T : Touch

Top_Plate Bolt ->T Bottom_Plate Bolt ->T

Nut Bottom_PLate ->T

4-3.Bolt_Head

T

Bolt_Head Top_PLate ->T


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( 3D-Solid Bolt Model, SOL 400, Result )

)


2. 3D-Solid Bolt Model

2-1. Type 1 – Contact, No Pre_Load





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( 3D-Solid Bolt Model, SOL 400 )

-3D-Solid Modeling-

2-2.Bottom_Plate_Body


2-2. Type 2 – Contact, Pre-Load

Pre-Load Type

MPC Location :

Split the element mesh

- Geometric : Automatic

- Vectorial : Crood 기준

- Elemental : User Selection

(recommend)

Control Node Offset Vector

Offset Value

Bolt Pre-Load Value

Bolt Element List

(Split List)

- Bolt Modeling Tools -

MPC Type

- Overclosure :

Nastran Bolt Card (Marc base)

- Explicit : Nastran MPC Card

Top_Plate Bottom_Plate ->T

• G : Glue

• T : Touch

Top_Plate Bolt ->T Bottom_Plate Bolt ->T

Nut Bottom_PLate ->T

Bolt_Preload

5-4.Nut_Body

1-1.Top_Plate_Body

3-3.Bolt_Body

T

TT

T

4-3.Bolt_Head

T

Bolt_Head Top_PLate ->T


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( 3D-Solid Bolt Model, SOL 400 )2. 3D-Solid Bolt Model

2-2. Type 2 – Contact , Pre-Load

- Manual input-

BOLT 2 5001

TOP 4661 4662 4663 4664 4665 4666 4667

4668 4669 4670 4671 4672 4673 4674

생략

BOTTOM 5002 5003 5004 5005 5006 5007 5008

5009 5010 5011 5012 5013 5014 5015

생략

.

MPCADD 43 2 3 4 5 6 7 8

MPC 2 5002 1 -1. 4661 1 1.

5001 1 1.

MPC 2 5002 2 -1. 4661 2 1.

5001 2 1.

MPC 2 5002 3 -1. 4661 3 1.

5001 3 1.

생략

- Displacement

FORCE 1 5001 0. .57735 .57735 .57735

SPCD 1 5001 2 10.

- Force

FORCE 1 5001 0 250. 0. 0. 1.

- Nastran Input-

Overclosure

Explicit

Bolt Preload Case


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( 3D-Solid Bolt Model, SOL 400, Load Step )



Step 1 : Bolt Preload Step 2 : External Load


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( 3D-Solid Bolt Model, SOL 400, Result )2. 3D-Solid Bolt Model





Stress Max.Stress Max.

Stress Max.


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Ch.1 Bolted Plate Model Analysis

1. RBE2 Bolt Model-Result Summary

Stress (MPa)

Tension Bending Torque Type1

- RBE2-Full 47 173 103

Type2

- RBE2-RBE2-RBE247 173 103

Type3

- RBE2-Beam-RBE2 47 173 103

Type4

- SRBE2-RBE2-SRBE2 38 191 93

Type5- SRBE2-Beam-SRBE2 38 207 93

Displacement (mm)

Tension Bending Torque Type1

- RBE2-Full 0.09 0.58 0.08

Type2

- RBE2-RBE2-RBE20.09 0.58 0.08

Type3

- RBE2-Beam-RBE2 0.1 0.6 0.1

Type4

- SRBE2-RBE2-SRBE2 0.09 0.6 0.08

Type5- SRBE2-Beam-SRBE2 0.1 0.8 0.1

Stress (MPa)

Tension Bending Torque

Type1-Contact

- Plate 80 185 139

Type2-Contact and Preload

- Plate57 188 136

Displacement (mm)

Tension Bending Torque

Type1-Contact

- Plate 0.1 0.6 0.1

Type2-Contact and Preload

- Plate0.1 0.6 0.1


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2. Glue Contact 조건의 고유 진동수

해석

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Analysis type

- SOL 103

Material properties- E = 210×10 Pa, ν= 0.4, ρ= 1100 kg/m³

Contact properties- Glued Contact

Applied loads

- None

Element type

- Case 1 :연속체

Casing – tet10 / Shroud – tet10- Case 2 : Glue contact

Casing – hex20 / Shroud – tet10

7

Case 1연속체

Case 2Glue contact

Ch.2 Glue Contact 조 의 고유 진동수 해석


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Contact Table

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Input Data

IGLUE option

Glue Contact option

Case 2Glue contact

MASTERS

SLAVE

Ch.2 Glue Contact 조 의 고유 진동수 해석 ( Contact 설정 )


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Features Mode shape 7 Mode shape 8 Mode shape 9 Mode shape 10

Case 1 (연속체)

Runtime - 3749sec(1:02:29)

Node - 555,450

Element-434,768

298.92 Hz 298.99 Hz 315.11 Hz 486.74 Hz

Case 2 (Glue Contact)

Runtime - 2554sec(0:42:34)

Node - 431,101

Element-229,358

297.17 Hz 297.28 Hz 312.52 Hz 477.45 Hz

Ch.2 Glue Contact 조 의 고유 진동수 해석 ( Result )


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3. SOL 400을 이용한 Forming

Simulation

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Ch.3 SOL 400을 이용한 Forming Simulation

Object :

- SOL 400 ( Velocity-Controlled Rigid bodies적용 )

Description :

- Work-hardening(가공경화)의 Elasto-plastic material적용

- Reduced integration shell elements적용

- Deformable-rigid body: Friction 적용

Item Description

Solution Type SOL 400

Elements Type 4-noded reduced integration elements

Material Properties Aluminium alloy/E=70000 N/mm2, v=0.3, Thickness=1

Applied load Type Velocity-Controlled Rigid bodies

ContactRigid body: Punch, Die, Holder

Deformable body: Blank

Coefficient of friction = 0.05

PUNCH: RIGID

DIE: RIGID

HOLDER:

RIGID

BLANK:

DEFORMABLE

Symmetry displacement constraints (1/4모델)

XY SYMM[DOF 345 FIXED]

YZ SYMM[DOF 156 FIXED]

Ch3 SOL 400을 이용한 Forming Simulation


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Ch3. SOL 400을 이용한 Forming Simulation - Solution Details

Modeling : Contact :

SOL 400SUBCASE 1

SPC = 9

SPCFORCES(SORT1,PRINT,REAL)=ALL

BOUTPUT(SORT1,PRINT)=ALL

DISPLACEMENT(SORT1,PRINT,REAL)=ALL

STRESS(SORT1,PRINT,REAL,VONMISES,CORNER)=ALL

BCONTACT = 1

ANALYSIS = NLSTAT

NLSTEP = 1

BEGIN BULK

PARAM LGDISP 1

NLMOPTS ASSM ASSUMED

BCPARA 0NLGLUE 1BIAS 0.95FNTOL 50.

FTYPE 6

PARAM POST -1

PARAM,CDBMSG05,5

$! Bulk Data Model Section

MAT1 1 70000. 0.3 1.

MATEP 1 Table 1

PSHELL 1 1 1. 1 1 PSHELL_1

PSHLN1 1 ++ C4 DCT LRIH PSHELL_1

TABLES1 1 2 +

+ 0.0 191.10.033333 249.7720.066667 293.962 -생략

1. 428.752 ENDT

SPCADD 9 1 2

NLSTEP 1 +

+ FIXED 50 +

+ MECH UPV PFNT

$! Contact Body: BLANK

BCBODY 1 3D DEFORM 2 0 1

BSURF 2 1 THRU 360

$! Contact Body: PUNCH

BCBODY 101 3D RIGID 0 1 0+

+ 0.0 0.0 0.0 0.0 40. 0.0+

+ RIGID 3 PUNCH + -생략

$! Contact Body: HOLDER


+ 0.0 0.0 0.0 0.0 0.0 0.0+

+ RIGID 3 HOLDER + -생략 $! Contact Body: DIE


+ 0.0 0.0 0.0 0.0 0.0 0.0+

+ RIGID 3 DIE + -생략

$! Contact Table: BCTABLE_1

BCTABLE 1 3 +

$ Pair: BLANK / DIE

+ SLAVE 1 0.0 50. 0.05 0.0 +

+ FBSH 0.95 +

+ MASTERS 103 +$ Pair: BLANK / HOLDER

+ SLAVE 1 0.0 50. 0.05 0.0 +

+ FBSH 0.95 +

+ MASTERS 102 +

$ Pair: BLANK / PUNCH

+ SLAVE 1 0.0 50. 0.05 0.0 +

+ FBSH 0.95 +

+ MASTERS 101

Friction coefficient

Large-strain shell elements

Z velocity of +40 mmper unit time

Separation force

Separation force

bilinear Coulomb friction

Stress vs. plastic strain

Doubly-curved thick Shell &

Linear Reduced Integration

0: Velocity control

Ch3 SOL 400을 이용한 Forming Simulation


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Plastic Strain [MARC]

Von Mises Stress [MARC]

Plastic Strain [SOL 400]

Von Mises Stress [SOL 400]

MAX: 4.574-001

MAX: 4.592-001

MAX: 4.239+002

MAX: 4.238+002

Ch3. SOL 400을 이용한 Forming Simulation ( Results (SOL400 , MARC ))


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4. SOL 400을 이용한 Rubber Seal

접촉해석

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Object :

- SOL 400 ( Segment-to-Segment Contact / Small Sliding and Friction )

Description :

- Moving rigid body : -Y 방향 200 mm Position적용

- Deformable body : Bilinear Coulomb friction적용 [Coefficient of friction=0.1]

- Node-to-segment와 segment-to-segment contact status비교

Item Description

Solution Type SOL 400

Elements Type TET4 (CTETRA : 5387 EA)

Material Properties Neo-Hookean Material/Mooney : C10 = 100

Applied load Type Position-Controlled Rigid bodies

ContactMoving rigid body: Touching

Deformable body : Self touching

Fixed rigid body : Glued

Moving body :

Touching

Deformable body:

Self Touching

Fixed body :

Glued

200 mm

Ch4. SOL 400을 이용한 Rubber Seal 접촉해석

Ch4 SOL 400을이용한 R bb S l 접촉해석


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Modeling : Contact :

SOL 400

$ Bulk Data Pre Section

NLMOPTS ASSM ASSUMED

LRGSTRN 2

SPROPMAP2

BCPARA 0 BIAS 0.95 IBSEP 2 FTYPE 6+

+ NLGLUE 1 METHOD SEGSMALL

$ Bulk Data Model SectionMATHE 1 Mooney 1000000. 0.0 +

+ 100. 0.0

PSOLID 1 1 Psolid

PSLDN1 1 1 +

+ C4 ISOL L Psolid

$ Bulk Data Post Section

NLSTEP 1 +

+ GENERAL 10 1 10 ++ ADAPT 0.01 0.55 1.2 +

+ 6 +

+ MECH PVA PFNT

$ Contact Body: Deformable

BCBODY 1 3D DEFORM 2 0

BSURF 2 1 THRU 3858

$ Contact Body: Moving

BCBODY 101 3D RIGID 1 -1+

+ 0.0 0.0 1. 0.0 -200. 0.0+

+ RIGID 1 Moving +

NURBS -2 2 2 2 50 50 0 -생략

$ Contact Body: Fixed

BCBODY 102 3D RIGID 1 0++ 0.0 0.0 1. +

+ RIGID 1 Fixed +

NURBS -2 2 2 2 50 50 0 -생략

$ Contact Table: BCTABLE_1

BCTABLE 0 3 +

$ Pair: Deformable / Deformable

+ SLAVE 1 0.1 +

+ MASTERS 1 +

$ Pair: Deformable / Fixed+ SLAVE 1 1 +

+ 0 1 0

+ MASTERS 102 +

$ Pair: Deformable / Moving

+ SLAVE 1 1 +

+ 0 1 0

+ MASTERS 101

Coefficient of friction=0.1

Small sliding

Segment-to-Segment

algorithm

Bilinear Coulomb friction

-1: Position Control

Y Position of -200 mm

S-to-S with Small sliding [finite sliding] :

SEGSMALL [SEGLARGE]

Regular 3D contact (Node to surface) : NODESURF

Ch4. SOL 400을 이용한 Rubber Seal 접촉해석 - Solution Details

Large-strain solid elementsIncompressible Solid,

Linear



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Results :

Contact Status in Segment-to-Segment Case

Displacement in Node-to-Segment case

PENETRATION

Displacement in Segment-to-Segment case

Contact Status in Node-to-Segment Case

Ch4. SOL 400을 이용한 Rubber Seal 접촉해석 ( Contact Result )



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Contact Status in Node-to-Segment case

[SOL400 - NODE TO SEGMENT]

Contact Status in Segment-to-Segment case

Contact Status in Node-to-Segment case

[MARC - NODE TO SEGMENT]

Contact Status in Segment-to-Segment case

[MARC - SMALL SLIDING]

PENETRATION

PENETRATION

[SOL400 - SMALL SLIDING]

Ch4. SOL 400을 이용한 Rubber Seal 접촉해석 -( Results ( SOL400 & MARC ))


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5.SOL 400을 이용한 Springback 해석

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원통형 Rigid Body의 EnforcedMotion으로 인한 Forming단계에서

금속 구조물의 영구변형 발생.

- Step 1 : at forming

원통형 Rigid Body제거 후 금속 구조

물의 Spring back해석.

- Step 2 : at the end of forming

준 정적해석(SOL400),가공 경화

탄소성 재료.

Contact Features에 따른 비교.

i) Velocity with releaseii) Load

iii) Load with release.

Ch.5 SOL 400을 이용한 Springback 해석

36

Fig. FE Model

Constraint : x

Metal

Cylinder

Constraint : y

- Enforced motion: 0.1125 inch

Parts Contact Material Property Remarks

Metal Deformable

E = 10.6e6 psi

Nu = 0.33

Yield Stress

= 4.29e10 psi

- 2D Plane

Strain

- Friction

Coefficient =

0.2

Cylinder Rigid -

Ch 5 SOL 400 Springback


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- Solution Details

37

i) Velocity controlled rigid body- BCMOVE ii) Load controlled rigid body- without BCMOVE iii) Load controlled rigid body- BCMOVE

Contact Features

Control

: 0 for velocity

Contact Body

Release

Control Node

: 239

Contact Body

Release

Enforced Motion

: 0.1125 in

Control

: Positive number

for load

Ch 5 SOL 400 S i b k


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Deformation: 0.228 in

at Forming

Deformation: 0.182 in

at the End of Forming

38


( Results ( SOL400 & MARC))

Point A

Comparison of Marc

The Results of each Contact Feature

The Same Results

of MSC Marc.

Contact Features Deformation atForming

Deformation at

the End of

Forming

Solving Time

Velocity with

release0.228 in 0.182 in 8.619 sec

Load 0.228 in 0.182 in 11.016 sec

Load with

release0.228 in 0.182 in 10.994 sec

Point A

At Forming

At the End of Forming


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6.SOL 400을 이용한 Circuit Board

열응력 해석

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한번의 수행으로 열 / 응력 연계 해석. 비선형 열 / 응력 해석.

SOL400(Chain Analysis)과

SOL 153/101 해석의 결과 비교.

40

Fig. 1.2 Geometry of Circuit Board

Case

Fig. 1.1 Circuit Board

Paste

Leads

Chip3.80 X 3.80

0.7t

Ch.6 SOL 400을 이용한 Circuit Board 열응력 해석

C 6 SO 400 C


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대류와 복사 고려 Element type : HEX8

41

Heat Convection (top)

: 4.05e-5 W/(mm^2C)

Heat Convection (bottom)

: 2.026e-5 W/(mm^2C)

Heat Convection

(side)

: 7.00e-5 W/(mm^2C)

AmbientTemperature

: 70 CRadiation (top)

- Ambient Temperature : 40C

- Emissivity : 0.8

- View Factor : 1.0

Heat Flux: 0.025 W/(mm^2C)

Constraint

: Fixed

Material

Young’s

Modulus

[ N/mm^2 ]

Thermal

Conductivity

[ kW/(mm/C ]

Thermal

Expansion

[ 1/C ]

Stefan-

Boltzmann

[ W/(mm^2K) ]

Lead

Frame6.9e4 0.14700 1.0e-6

1.7140e-9Chip 5.52e4 0.16800 1.0e-5

Case 4.5e4 0.07140 1.0e-6

Paste 2.0e3 0.02016 1.0e-5


Ch 6 SOL 400 Ci it B d


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Solution Type

STEP SOL Name Description

1 HSTAT Steady State Heat Transfer

2 NLSTAT Nonlinear Static

SOL Description

153 Steady State Heat Transfer

101 Linear Static

SOL400 – Chain Analysis

SOL153 & SOL101

STEP 1

: Heat Transfer

STEP 2

: Nonlinear Static

Temperature Load


Ch 6 Thermal Stress Analysis


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Temperature: 87.8 C

Displacement: 0.00294 mm

Stress – Von Mises: 89.1 MPa

Ch.6 Thermal Stress Analysis

of an Integrated Circuit Board - Result

• The Same Results of Sol400 & Sol153/101 !

Solution Type Temperature DisplacementStress

: Von MisesSolving Time

SOL400 87.8 C 0.00294 mm 89.1 MPa 9.931 sec

SOL153 87.8 C - - 1.711 sec

SOL101 - 0.00294 mm 89.1 MPa 5.957 sec

patran contact

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