8/16/2012

This presentation to be used in

conjunction with:

Spec Sheets: SA-GRSP10, SA-GRSP09, SA-GRSP11

Samples in DC-GROUND-KIT

1

8/16/2012

Network Bonding and Grounding: TIA-607-B Generic Telecommunications Bonding and

Grounding (Earthing) for Customer Premises

2

Tom Turner

Product Manager, Power & Grounding

tom.turner@panduit.com

800-777-3300 x88290

Presentation objectives

Topics

Scope of TIA-607-B, Generic Telecommunications Bonding and Grounding (Earthing) for Customer Premises

Grounding and bonding system implementation according to TIA-607-B, including:

Data centers

Telecommunications closets

Throughout the presentation

Requirements from TIA-607-B and products that solve issues identified in the standard

Common problems and how to avoid those issues

Order of presentation: start at equipment and work out to earth

3

BICSI credits available for this presentation

Qualifies for one credit:

RCDD CEC

Installer

Technician

Certified Trainer

Please make sure we have your:

Name, as you want it to appear on your certificate of course completion

Name of the company you work for

Your E-mail address (so we can send you the certificate)

4

Purpose and scope of TIA-607-B

TIA-607-B grounding is normative

and applies to entire building, not

just data center

TIA-607-B, Generic Telecommunications

Bonding and

Grounding (Earthing)

for Customer

Premises, is now approved!

Scope now

includes

grounding of

ITE

What is TIA-607-B?

Scope: Specifies requirements for a generic telecommunications bonding and grounding infrastructure, and its interconnection to other systems, for locations where telecommunications equipment will be or are installed

Major revision of J-STD-607-A:

Includes G&B of telecommunications spaces (distributors and computer rooms)

Continued harmonization efforts (as practicable) on terminology and practices with international standards

Scope of TIA-607-B

TBB

Distributors

Computer

Rooms

TGB

TMGB

Implementation of a telecommunications grounding and

bonding system per TIA-607-B

Bond the equipment to the racks/cabinets

Ensure that the racks/cabinets have electrical continuity

Bond the racks/cabinets back to the electrical panel

Bond nearby conductive items such as pathways and building steel to the telecommunications

grounding and bonding system

Equipment in cabinets and racks

Rather than relying on the ac power cord

ground wire, it is

desirable that

equipment be

grounded in a

verifiable manner as

described in this

Standard.

Figure 7Example of three methods to bond equipment and racks to ground

TIA-607-B:

Implementing the equipment

grounding requirement

Bond equipment

with a jumper

when possible

Bonding screws have thread-

forming threads and

serrations under the head

that remove the paint off

mounting flanges and patch

panels (RGTBSG-C)

Bonding cage nuts have

teeth that cut paint when

installed (CBN4K)

9

Some equipment isnt designed for a supplemental bonding system

Cant add a jumper

Cant add a bonding screw or a bonding cage nut

Thats OK. So long as the AC power system and the telecom bonding system are bonded together, no safety issues result

Most servers cannot be

grounded directly to the

telecommunications

grounding system

Ground strip kits

Ground strips have same x-sectional area as #6 AWG wire

Strips also future-proof against a future installer bonding to the rack

without thread-forming screws

RGS Family

Install the

strip on the

vertical rail

and bond all

other

jumpers to it

TIA-607-B requires racks and cabinets to

be electrically continuous

Electrical continuity must be confirmed through the use of

bonding jumpers, bonding

hardware, or the removal of paint

Bonding jumpers must be a minimum of #12 AWG

Bare metal bonding tabs that automatically create electrical

continuity when cabinet is assembled

All Panduit racks and

cabinets are electrically

continuous, eliminating the

need for jumpers

If the rack/cabinet is not electrically continuous, use a

busbar

Bond busbar to rack/cabinets with thread-forming screws to

create electrical continuity

between the equipment

mounting rails

Bond to busbar with 2-hole lug tongues for long-term

connection reliability

Thread-

forming

screws

2-hole lug

mounting

New terminology introduced by TIA-607-B:

Telecommunications Equipment Bonding

Conductor (TEBC)

The TEBC connects the

TMGB/TGB to

equipment

racks/cabinets

Minimum separation from

power and

telecom cables is

50 mm (2 in)

Example TEBCs routed along auxiliary cable brackets (which help to maintain 50 mm separation)

TEBCs

TEBCs are bonded to the TGB

Acceptable telecommunications equipment bonding

conductor topologies for the telco closet, per TIA-607-B

Rack

bonding

conductor

(RBC)

Telecommunications

equipment bonding

conductor (TEBC)

Use two-hole lugs to bond to busbars and racks &

cabinets. Compression is required on busbars

One hole mechanical lug

Two hole compression lug

Connector considerations TIA-607-B

Mechanical connectors are

allowed for bonding the

TEBC/RGB to racks, but

Panduit recommends

compression to prevent

loosening

Mesh-BN: a collection of components (As per CENELEC documents, includes

TIA-942s Data Center Grounding Infrastructure as the Supplemental Bonding Network and IEEE Std 1100 calls the MCBN), per TIA-607-B

Information technology

equipment (ITE)

Racks and cabinets

Cabling pathways

(not shown)

Building steel

Supplemental bonding grid

(SBG)

Conduits

Rack bonding conductor

(RBC)

Watch for this common problem

Common Bonding Network Jumper Kit (RGCBNJ660P22)

When you see a supplemental bonding grid (SBG) with nothing attached to it, the customer intended to have grounding but got nothing!!! Making this

bond was in no ones scope of work...

(20% of the data centers have this problem)

Specify who

bonds the racks

to the SBG!

HTAP Crimping

HTCT HTAPs require 12 tons of compression

CT-2930/L is recommended

Can use other manufacturers tools and retain UL

Listing/CSA Certification

Must use Panduit locator dies

Patented

locating rib

guarantees full-

width crimp 1st

time, every

time!

HTCT HTAP

CD-930H-250 Locator Die

CT-2930/L

Conductor sizing isnt only about electrical issues

Size matters!

Standards call for a minimum #6

AWG for mechanical strength

Source: Picture from Internet

Supplemental bonding grid construction per TIA-607-B

#6 AWG round wire or 2 wide copper strips bonded at intersections

Minimum grid density is 3 m (10 ft) centers

Minimum 1/0 bond to TGB/TMGB

Example supplemental bonding grid

Example SBG construction

Make aisle grounds

convenient to racks

and cabinets

Cross aisle grounds

every 10 feet

Use #6 AWG wire Use pedestal grounding clamps at

conductor

intersections

Bond to AC power ground through a

local TGB

GPQC family of access floor grounding (Mesh-BN)

products

Up to two each of #6 AWG-2/0 conductors

Rated for fault current (not all commonly installed access floor

connectors are)

Models for access floor pedestals from to 2 diameters

Hinged U-bolt design allows

for no look installationsaving 67% of installation

time

Preventing loose busbar connections 25

Two-hole

compression

lugs required

on TGB &

TMGB

(Type LCC-W)

Telecommunications

Grounding Busbar

(TGB), BICSI/TIA-607

hole pattern

(Type GB2B, or Part GB2B0306TPI-1)

BICSI-607 stainless

steel TGB hardware

stack-up

(Parts HDW1/4-KT, HDW3/8-KT)

Operability testing of power

connectors

UL 486A, CSA 22.2 4 samples must pass all tests

Wire secureness test

Static heating test

Wire pull-out test

NEBS Level 3 Must be UL Listed

9 samples must pass all tests

Vibration test Wire pull-out Temp & humidity cycle Hydrogen sulfide corrosion 30 day salt fog corrosion Wire pull-out AC fault current Lightning test Wire pull-out test Stress corrosion cracking

Do you already own the tools?

Panduit lugs can be crimped with select competitors tools and dies and still retain UL/CSA approvals and NEBS Level 3

performance

ASTM 545-97: Electroplated Coatings of Tin

Panduit doesnt restwhile others are cheapening their lugs to compete

with foreign competition, Panduit is

improving quality by moving to Class

C plating as a standard offering*

28

* Running change, in process

Others

Panduit

What else needs to be bonded?

IEEE studies have indicated that the point of diminishing financial returns with respect to lightning strikes is 2 meters

(6 feet)

Bond anything that could become charged that a person could bump while working on a rack/cabinet for safety

Therefore, bond any conductive path within six feet of your racks/cabinets

Bond cable tray and ladder rack sections

Split bolts use tin plated if outdoors (Panduit SBC &

SBCT, respectively)

#6 AWG conductor,

green w/yellow jacket

OR

PANDUIT Wyr-Grid and GRIDRUNNER hardware automatically bonds sections,

eliminating the need for jumper

wires

Specify systems that

automatically bond to

reduce chances of error

Armored fiber cables per TIA-607-B

Armored fiber optic

cable To grounding

system

Armored fiber grounding cable clamp

Mechanical clamp design is entirely external to armorno risk of damage to fibers

Clamp assembly has more current-carrying capability

than the armor it attaches to

Mechanical

clamp

assembly

Cover protects

clamp and

provides neat

appearance

Telecommunications Bonding Backbone (TBB)

Purpose of TBB is to reduce potential differences between

interconnected

telecommunications systems

on different floors

Originates at TMGB and extends throughout building

using telecom pathways

Connects TGBs that exist in each distributor

TBB and its bonds, adapted from Figure 32, TIA-607-B

34 TIA-607-B TBB sizing

Specify current-rated connectors (access floor)

Specify compression connectors rather than mechanical

connectors (connections to

racks)

Panduit builds features into its products that facilitate grounding

Panduit has a broad line of power and grounding

connectors that are tested to the

most rigorous reliability

assurance standards. Specifying

these standards minimizes your

risk

35 Summary

Thank you! Questions?