packaging solutions christian ganninger product manager microtca, backplanes and psu emea :...
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PACKAGING SOLUTIONS
Christian GanningerProduct Manager MicroTCA, Backplanes and PSUEMEA : +49-7082-794-633@ : [email protected]
Rugged MicroTCARugged MicroTCA
2 19.10.2008
Agenda
Rugged MicroTCA: Introduction, explanation of MicroTCA.1 & MicroTCA.3, StatusupdatePresented by Christian Ganninger, Schroff GmbH
Rugged MicroTCA Connector testsPresented by Michael Burger, ept Gmbh & Co. KG
Rugged MicroTCA ApplicationsPresented by Irene Hahner, Kontron AG
3 19.10.2008
MicroTCA.0 (Micro Telecommunications Computing Architecture Base Specification)
MicroTCA.0 as defined provides support for requirements such as NEBS, ETSI and ITUspecifications, which are focused on the central office telecommunication environment.
Shock & Vibration requirements:
Item Vibration Shock Specification
Connector Contact Only 10-500 Hz, 10g, 3x 8 hours 30g, 11ms, 18 shocks GR-1217-CORE
With Module 5-100Hz, 1g, 3x 8 hours 15g, 11ms, 3 shocks/axis GR-1217-CORE
Shelf, Cube, Pico
Subrack / Module
2-9 Hz / 9-200 Hz, 0,5g sinusodial, > 10 min / axis
7g, 11ms, 18 shocks IEC 61587-1
Subrack / Module
NEBS Zone 4 IEC 61587-2 / ANSI T1.329
4 19.10.2008
Rugged MicroTCA
The Rugged Micro Telecommunications Computing Architecture specifications defines the requirements for a System that meets more stringent levels and cycles of temperature, shock, vibration, and humidity than those defined in MicroTCA.0.
MicroTCA.1 (Air Cooled Rugged MicroTCA): this first sub-specification of MicroTCA describes rugged air-cooled systems for industrial applications.
MicroTCA.2 (Hardened Air Cooled MicroTCA): the second sub-specification of MicroTCA; it describes rugged air-cooled systems for military applications.
MicroTCA.3 (Hardened Conduction Cooled MicroTCA): the third sub-specification of MicroTCA; it describes rugged conduction-cooled systems for military applications
Adopted 19-Mar-09
Not started
In work
5 19.10.2008
MicroTCA.1 (Air Cooled Rugged MicroTCA)
Shock & Vibration requirements :Item Vibration Shock Module Retention Specification
Connector Contact Only XR1 XR1 - EIA-364-28D
XR2 XR2 - EIA-364-28D
With Module XR1 XR1 AMC.0 Locking Latch IEC 61587-1
XR2 XR2 Additional Retention Device mandatory ANSI/VITA 47
Shelf, Cube, Pico
Subrack with Plug-in Unit
XR1 XR1 AMC.0 Locking Latch IEC 61587-1 DL3
XR2 XR1 Additional Retention Device mandatory ANSI/VITA 47 V2 & DL3
XR1: Vibration 3g Sinusoidal (MicroTCA.0 = 0,5g) (2-9 Hz, amplitude 10 mm, 9-200 Hz, acceleration 30 m/s², 1 octave/min, 3 axes / 10 cycles each axis)
Shock 25g (MicroTCA.0 = 7g) (250 m/s² / 18 ms half-sine, 3 axes, 3 shocks, two directions each axis (18 shocks)
In accordance to IEC 61587-1:2007 Performance level DL3
XR2: Vibration 8g Random (5-2000 Hz, 0.04 g²/Hz, 3x1h)
In accordance to VITA 47 Class V2
Shock 25g (250 m/s² / 18 ms half-sine, 3 axes, 3 shocks, two directions each axis (18 shocks))
In accordance to IEC 61587-1:2007 Performance level DL3
Resistance shall not increase more than 10 Ohms for longer than 10 ns per contact pair. See GR-1217-CORE section 5.4.4, objective O5-81
6 19.10.2008
MicroTCA.1 (Air Cooled Rugged MicroTCA)
Thermal requirements :
3 different Levels: Ambient (MicroTCA.0) and 2 Extended Temperature ranges XT1 & XT1L
MicroTCA.0: - 5°C to + 55°CXT1L: - 40°C to + 55°CXT1: - 40°C to + 70°C
Additional requirements: Drop test, RoHS, Acoustic, Surface temperature are defined as application specific
For other requirements like Earthquake, Flammability, Atmospheric, Module insertion cycles, ESD, EMC, Safety MicroTCA.1 refers to the MicroTCA.0 base specification
-> actions: Electronic parts with enhanced temperature range, System cooling has to be adopted
7 19.10.2008
MicroTCA.1 (Air Cooled Rugged MicroTCA)
Shock & Vibration requirements :Item Vibration Shock Module Retention Specification
Connector Contact Only XR1 XR1 - EIA-364-28D
XR2 XR2 - EIA-364-28D
With Module XR1 XR1 AMC.0 Locking Latch IEC 61587-1
XR2 XR2 ANSI/VITA 47
Shelf, Cube, Pico
Subrack with Plug-in Unit
XR1 XR1 AMC.0 Locking Latch IEC 61587-1 DL3
XR2 XR1 ANSI/VITA 47 V2 & DL3
Additional Retention Device mandatory
Additional Retention Device mandatory
Rugged MicroTCA Retention Device
8 19.10.2008
Rugged MicroTCA Retention Device
AdvancedMC.0front panel
MicroTCA.1front panel( XR2 )
MicroTCA.1 (Air Cooled Rugged MicroTCA)
front panel with flange
additionalretention
screw
9 19.10.2008
Why is a special Retention Device needed?
Gap between Faceplate / attachment plane due to tolerances of the module and the subrack
0,0mm min.
MicroTCA.1 (Air Cooled Rugged MicroTCA)
1,6mm max.
10 19.10.2008
Why is a special Retention Device needed?
Standard AdvancedMC Module
Is plugged into the slot until the module is seated on the bottom of the backplane connector body
Fixed in this position by the locking mechanism of the handle.
Rugged AdvancedMC Module
Inserted into the slot until the module is seated on the bottom plate of the backplane connector
Fixed in this position by the locking mechanism of the handle.
Gap between the front panel flange and the subrack, worst case: 1.6 mm
MicroTCA.1 (Air Cooled Rugged MicroTCA)
11 19.10.2008
Why is the Retention Device needed?
F
Face plate deflection
F
F
When the Rugged MicroTCA Module is screwed to the subrack…
… the face plate will be deflected…
… and the force will be applied to the connector. The module bare board and the connector bottom side will be stressed.
Conclusion:A locking method is needed, that fixes the module in the chassis in position without applying force into direction of the connector.
MicroTCA.1 (Air Cooled Rugged MicroTCA)
12 19.10.2008
Solution (patented, part of the MicroTCA.1 specification):
Gap 0.0 mm Maximum gap ( 1.60 mm )*
µTCA chassisµTCA chassis Front panel flangeFront panel flange µTCA chassisµTCA chassis Front panel flangeFront panel flange
1.60
* Based on 185,85 subrack depth* Based on 185,85 subrack depthCollet
Screw M3
MicroTCA.1 (Air Cooled Rugged MicroTCA)
Welded sleeve
13 19.10.2008
Solution for Rugged MicroTCA & AdvancedTCAMicroTCA.1 (Air Cooled Rugged MicroTCA)
Easily exchangeable! Only the stainless steel front panel is different from a standard AMC.0 module. Bare board, die cast parts and handle are the same.
With a special Rugged AdvancedMC Carrier the MicroTCA.1 Modules can also be used in a AdvancedTCA environment
14 19.10.2008
Result:Force max. = 1,3 N
TestScrew fasteners tightened using a torque screwdriver to the DIN prescribed 0,67Nm (for an M3 screw).
Three front panel flange to chassis distances were tested: 0.5mm, 1.0mm and 1.5mm. The measurement was repeated for the three distances, a minimum of five times each.
0.5; 1.0; 1.5
Verifications: Test 1: Force effect to backplane and connector cont.MicroTCA.1 (Air Cooled Rugged MicroTCA)
IssueTest to determine if loads are transferred through the AMC Module PCB to the chassis backplane and connector when fixing an AMC module with the SCHROFF supplemental RµTCA screw fastener in a µTCA chassis.
15 19.10.2008
ResultF
Face plate
deflection
Face plate deflection in mm
0,0 0,5 1,0 1,5 2,00
200
400
600
800
Weg in mm
Kra
ft in N
For
ce in
N
0.1 0.2
100
175
0.14
Verifications: Test 2: Face plate stiffeness cont.MicroTCA.1 (Air Cooled Rugged MicroTCA)
16 19.10.2008
Verifications: Test 3: Shock and VibrationMicroTCA.1 (Air Cooled Rugged MicroTCA)
Standard Schroff MTCA.0 guide rails and die-cast latch retainer
Test Jig for Multiple Slots (3 x Mid-size AdvancedMC.0 Double Modules)
Backplane with ConCardMicroTCA connectors
AdvancedMC.0Mid-size Module, Double height, 700g
Result: Passed! (Electrically and mechanically)
17 19.10.2008
MicroTCA.3 (Hardened Conduction Cooled MicroTCA)
Shock & Vibration requirements :
Test 1:Random vibration - 50 Hz to 100 Hz increasing at 6 dB/octave - 100 Hz to 1000 Hz PSD = 0.2 g²/Hz
- 1000 Hz to 2000 Hz decreasing at 6 dB/octave - 3 axis each axis 60 minsNo contact discontinuity exceeding 10Ω/10 ns
Mechanical shock - 40g/11 ms half sine - 3 axis/two directions each 3 shocks
No contact discontinuity exceeding 10 Ω/10 ns
Test 2:Random vibration - 50 Hz to 100 Hz increasing at 6 dB/octave
- 100 Hz to 1000 Hz PSD = 1.5g²/Hz - 1000 Hz to 2000 Hz decreasing at 6 dB/octave
- 3 axis each axis 60 minsNo contact discontinuity exceeding 10Ω/10 ns
Mechanical shock - 50g/11 ms half sine- 3 axis/two directions each 3 shocks No contact discontinuity exceeding 10 Ω/10 ns
preliminary
18 19.10.2008
MicroTCA.3 (Hardened Conduction Cooled MicroTCA)
Demands other kind of chassis
The AdvancedMC Module must be secured with a Wedge-LOK to the chassis
The Wedge-LOK has two tasks:- Securing the AdvancedMC module in extreme conditions- Transfering the heat from the hot spots to the outer side of the chassis
19 19.10.2008
MicroTCA.3 (Hardened Conduction Cooled MicroTCA)
Intention is: don‘t change the AMC module
The module will be inserted into a clamshell
The Clamshell will be special for the different AdvancedMC modules
The Clamshell will contect the hot spots (with thermal paste)
20 19.10.2008
MicroTCA.3 (Hardened Conduction Cooled MicroTCA)
Intention is: don‘t change the AMC module
The module will be inserted into a clamshell
The Clamshell will be special for the different AdvancedMC modules
The Clamshell will contect the hot spots (with thermal paste)
Heat transfer will be from the hot spot through the clampshell and the Wedge-LOK to the chassis
The chassis might have heat sinks, cold plates or forced air cooling.
21 19.10.2008
MicroTCA.3 (Hardened Conduction Cooled MicroTCA)
Status:
The PICMG is planing shock & vibrational tests to proof this concept!!!
Rugged MicroTCA
Thank you for your attention!
PACKAGING SOLUTIONS
Christian GanningerProduct Manager MicroTCA, Backplanes and PSUEMEA : +49-7082-794-633@ : [email protected]
Rugged MicroTCARugged MicroTCA