package substrate jan. 2010. 2 business confidential top metallization 18.30 mm 18.30 mm bottom...
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Package Substrate
Jan. 2010
2 Business Confidential
Top Metallization 18.30 mm
18.30mm
Bottom Metallization
Beryllium Oxide ORAlumina
We should see the multiple vias on the back also, for the Option 1
3 Business Confidential
Top Metallization 18.30 mm
18.30mm
Bottom Metallization
Beryllium OxideNow, with this design is possible to have less than 300 vias total and then the price in 50k quantity may be $11.00/ea. Please see my
message Dec.17, 09
4 Business Confidential
Option 1 - Ceramic Substrate with Vias
100 Signal Vias6 mil
Beryllium Oxide ORAlumina
13 mil
750 Ground Vias 6 mil
In the case of ROGERS material, that has low thermal conductivity, it was necessary to have as many copper
vias as possible; However, when switching to BeO substrate, so may vias are no longer necessary. Since we still need to connect back of the die to the ground plane,
we accomplish this with a reduced number of vias. Please see next slide .
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Option 1A - Ceramic Substrate with LESS Vias
100 Signal Vias6 mil
Beryllium Oxide ONLY, NOT Alumina
13 mil
Fewer Ground Vias 6 mil
In the case of ROGERS material, that has low thermal conductivity, it was necessary to have as many copper
vias as possible; However, when switching to BeO substrate, so may vias are no longer necessary. Since we still need to connect back of the die to the ground plane, we accomplish this with a reduced number of vias. See
next slide .
6 Business Confidential
Option 2 - Ceramic Substrate with Conductive buttons
13 mil Copper Button Copper Button
100 Signal Vias6 mil
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FRAME (Stiffener)
Can you cut the Ceramic substrates out of a panel and put them on anadhesive plastic foil (same as sawed wafer) in a matrix of 2 x 5 or 2 x 10 ?
Adhesive plastic foil (same as sawed wafer)
Yes. It is a common practice for USM. We call this –FF, i.e. Film Frame.; HOWEVER, our standard is a 5inch or 6inch diameter or more, circular frame.
Does it have to be rectangular frame? Please provide info about minimum spacing between Substrates.
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General Info:Application: Communication deviceAmbient Temp: -45 to 85 °CNumber of Layers 2
General Requirements:RoHS CompliantOperating temperature 125 °CFlammability UL94 V-0