npi operation methodupdated

Foxconn International Holdings Ltd.

CMOAG-0015

PAGE

Content

Revision

1

Purpose

2

Scope

3

Responsibility

4

Flow Description

5

Basic Terminology Introduction

6

Application And Revision

7

Procedure Flow Chart

8

Appendix

APPROVED CHECKED PREPARED

BY 張光美DATE 2005.03.14

系統名稱(SYSTEM): 主題(SUBJECT): 文件編號(DOCUMENT NO)

產品開發作業系統Product Development Procedure

新產品Pilot Run作業辦法New Product Pilot Run Procedure

**** 目錄 ****

項目 ITEM 內容 DESCRIPTION 頁次 PAGE

目錄

修訂履歷

目的

范圍

職責

流程說明

基本術語介紹

實施與修訂

流程圖

附頁

※ ※ PROPRIETARY INFORMATION OF FOXCONN INTERATIONAL HOLDINGS LTD. ※ ※

CMOAG-0015

1 OF 7 REV B

1

2

3

3

3~4

4

5

5

6

7~8

ISSUED BY:

文件編號(DOCUMENT NO):

頁次 PAGE

PROPRIETARY INFORMATION OF FOXCONN INTERATIONAL HOLDINGS LTD. ※ ※

Foxconn International Holdings Ltd

CMOAG-0015

PAGE

Revision History

REV ECN NO

A

B




* * * * * 修訂履歷 * * * * *

修訂頁次 Revision Pages

系統文件整合,初版發行

1. 修改5.10初件試產方式 2. 更新NPI check list


CMOAG-0015

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Remarks



CMOAG-0015

PAGE

To establish samples control procedure to ensure process quality of new samples before mass production

Control the problems that may happen in the process of new products in time and improve ASAP to meet the need of customers

Production of samples of new products and NPI control procedure

Engineering Chart and document change (ECN) Fill Description CQOAG-0008

Coresponding related departments principal and making up NPI team.

4.2.9 NPI Report

4.3.1 SIP

4.3.2 ESD Check

4.3.3 SMD Process and FAI Check




1. 目的 Purpose: 旨在建立一個新產品量產前樣品制作的管制作業程序,以保証新產品樣品的制作品質.

及時掌握新產品作業時可能發生的問題,並及早作出改善,以滿足客戶需要.

2. 範圍 Scope: 本辦法適用於WLBG主机板制造處新產品樣品制作及NPI管制作業.

3. 參考文件 Reference :

3.1 工程圖面與文件變更(ECN)填寫說明 CQOAG-0008

3.2 SMT製程品管作業辦法 CQOAG-0012 SMT Quality Control ProcedureCQOAG-0012

3.3 不合格品管制作業辦法 CQOAG-0010 Defect Quality Control Procedure CQOAG-0010 4. 職責 Responsibility 4.1 市場單位 MP Department 4.1.1 從客戶段獲取NPI Get NPI from customers

4.1.2 客戶認可通知或客戶認可書之取得 Gain the Customers Acceptance Inform or Customers Acceptance

4.2 產品設計/制造工程單位 Product Design/ Prodcution Engineering Department 4.2.1主導NPI Lead NPI. 4.2.2 确定NPI進度,制定Pilot Run schedule. Confirm NPI Schedule and make Pilot Run schedule

4.2.3 產品說明會Product Introduction Meeting

4.2.4協調各單位負責人組成 NPI team

4.2.5 CQP文件主導及完成 CQP Document Introduction and Finish

4.2.6 治工具准備 Fixture Preparation

4.2.7 相關工程文件制作與Update.Making and update of related engineering document

4.2.8 新產品教育訓練 New Products Education Training

4.3 品管單位 QA Department


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CMOAG-0015

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4.3.4 Program and parameter Check:

Related inspection fixture making and supply. Samples procedure quality status collection and

quality information supply

Confirm the quality, function status of first product and supply the related inspection document(FAI test list) and report

Corresponding related departments to handle quality problems

Materials procurement and perparation

NPI work order for issuing materials to product lines

4.5.2 Barcode label ready

Support of haman power, fixture, and production equipment when samples trial run

4.6.1 SFC ready

MP get the new products request and NPI from customers, and convey NPI to Product Engineer of Engineering Dep.

send the electronic file of customer data to DCC.

Product engineers get the related specification and documents of process (BOM, DWG,CAD data) form customers after possibility

evaluation is OK. Send the Eng. documentation of new product to the Quality Dept. and Quality Dept. will check

those with the original customer data.

Product engineers make the NPI schedule, hold the New Product Description Meeting to trace and

supervise the process of related departments

Product engineers lead to finish CQP documents (PMP,Process flow chart,Tooling Plan) and make

the related engineering documents (such as Barcode description)

Product engineers confirm the preparation of materials, tools and human power.

Engineering Dep. is responsible for samples making after the preparation of SMT program, materials and tools

Do the tape board first & take to measure the FAI, after tape board start the 1st piece production. The 1st pcs must be checked by microscope

& X-ray & get approval by Engineering/ QA dept. After 1st piece passed , then can start below quantity: 1st pcs-->5pcs-->10pcs-->50pcs

( every stage must 100% X-ray checking & Engineering/QA/Technician call a meeting to review the quality, to determine to re-start this stage

or continue next stage ). After 50 panel production & no defect happened, then we can start the mass production.

Remark: If there are any difference in Golden sample and 1st picec, must double confirm with the customer before NPI continue.

系統名稱(SYSTEM): 主題(SUBJECT): 文件編號(DOCUMENT NO):



4.3.5 相關檢驗量治具的制作與提供及樣品制作製程品質狀況之收集與品質資料之提供

4.3.6 确認初件之品質,功能狀況,並提供相關檢驗文件(FAI 測試表)與檢驗報告.

4.3.7 協調相關單位對各項品質問題之處理事宜.

4.4企劃單位 Planning Department

4.4.1 物料采購,准備.

4.4.2 NPI派工令發料至產線.

4.5制造單位 Production Department

4.5.1 SMT程式制作 SMT Program Making

4.5.3 試產時提供人力,治工具,維修﹐生產設備的支援.

4.6 資訊單位 IT Department

5. NPI流程說明 NPI Process Flow Description

5.1市場單位從客戶段獲取新產品需求及NPI,並將NPI轉達給工程部產品工程師.

5.2產品工程師獲取NPI后,將客戶文件(電子檔)交于資料中心,並就現有狀況初步評估新產品制作的可行性.

Product engineers make the first evaluation on the possibility of new products manufacturing after receiving NPI notice and

5.3 可行性評估OK以后,產品工程師著手從客戶段獲取新產品的相關規格以及新產品制作所必須的工程文件如(BOM,DWG,CAD data,Gerber file等),同時將新產品之工程文件發于品工.品工依客戶提供之資料確認,工程BOM

5.4產品工程師召開新產品說明會,制定NPI進度表, 組織NPI team,並對相關單位的具体工作進行跟催監督.

5.5NPI team對製程及設備進行FMEA失效模式分析.Making the FMEA of process and equipment by NPI team

5.6產品工程師主導完成CQP文件(PMP,Process flow chart,Tooling Plan等),並制作相關工程文件(如Bar-

-code說明等)

5.7產品工程師确認物料治工具人力准備情況.

5.8生技制作SMT程式Equipment engineers make the SMT program

5.9SMT程式,物料及治工具准備好以后由工程部負責主導樣品制作

5.10首先進行雙面膠板制作, 以作為FAI檢驗依據。雙面膠板打完後, 開始進行初件生產, 初件需在顯微鏡下進行檢驗 , 在工程/ 品保確認無不良, 並且X-ray檢驗無不良下, 方可進行下面數量的生產 : 初件-->5panel-->10 panel-->50 panel (每個階段都須100%由生產單位照X-ray , 並由工程/ 品保/ 生技召開檢討,

如有不良發生 , 則該階段重新生產 ; 如無不良方可進行下一階段 ), 在50 panel生產無不良後, 方可進行量產。注:若客戶有提供Golden Sample, 初件與Golden Sample比對有不同時,需經客戶確認無誤后方可繼續NPI

CMOAG-0015

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CMOAG-0015

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After NPI, Planning responsible for out-going of new products. QA and Engineering trace NPI quality status. And after Pilot Run, engineering hold the review meeting on Pilot Run

Engineer Dept is responsible for collecting all the NPI record and trimming NPI Report which mainly includes: 5.12.1 Project Name 5.12.2 NPI plan: Date and Qty 5.12.3· HWID 5.12.4 Project Team 5.12.5 First article report summary: Critical components and LCR parts summary 5.12.6 Production yield: each inspection station and composite yield 5.12.7 DOA result 5.12.8 Corrective action report 5.12.9 Capacity estimation 5.12.10 Ramp up plan 5.12.11Review meeting minutes

DOA SMD Result<= 7000PPM, DOA Mat. Result<=10000PPM. Mass production can proceed

If DOA Result is higher than the above datas

Lodge the related improvement measure. After judged by customers, mass production can proceed

Production is changed from trial run to mass prodcution according to customers' request of out-going ways and 6.1

After approved, the file is in operation. Revised as well.

Appendix: NPI CHECK LIST (CMOAG-0015-01B)

PILOT RUN report (CMOAG-0015-02B)




5.11 NPI以后,企劃部負責新產品出貨.品保,工程負責跟催NPI品質狀況,並在Pilot Run后由工程召開 Pilot Run檢討會

5.12工程單位負責匯整所有NPI紀錄並整理NPI Report.NPI Report主要內容包括:

6.量產放行條件 Mass Prodcution Discharge Condition 6.1.DOA SMD Result<= 7000PPM, DOA Mat. Result<=10000PPM.即可量產.

6.2 若DOA Result高于上述數据,

6.2.1 提出相應改善措施,經客戶裁定后方可正式量產.

6.2.2 按客戶制定出貨方式出貨並達到6.1之要求,則試產轉為量產.

7.基本術語介紹 Basic Terminology Introduction

7.1 FMEA(Failure mode effect analysis):失效模式分析 7.2 CQP:Component Quality Plan,主要包括PMP,Process flow chart,Tooling plan,FMEA等.

7.3 NPI:New Product Introduction ,新產品導入.

8.實施與修訂 Implementation and Revision

本文件呈制造處主管核准后,即可實施修訂亦同.

8.附頁 : NPI CHECK LIST (CMOAG-0015-01B)

PILOT RUN總結報告(CMOAG-0015-02B)


CMOAG-0015

5 OF 7 REV B




CMOAG-0015

PAGE 6 OF 7

PROPRIETARY INFORMATION OF FOXCONN INTERATIONAL HOLDINGS LTD. ※ ※ ※ ※


產品開發作業系統 Product Development Procedure

新產品Pilot Run作業辦法 New Product Pilot Run Procedure

NPI 流程圖

客戶Customer

市場 PM 工程 ME 企劃 PMC 品管 QA

NPI

Delivery

客戶產品

無庫存

有庫存

NG

OK

OK

NG

采購

LCR Meter

獲取 NPI

獲取新產品規格及相關工程資料

新產品說明會並制定 NPI Schedule

CQP 及相關工程文件制定

OK

NG

治工具准備

V/I

OK

物料准備

IQC

NG

新產品制作可行性确認

協調各單位負責人組成 NPI team

檢查 ESD

SMD 制程檢查

程式參數檢查

SIP

教育訓練

NPI report

組織 NPI team

Kick-off meeting

OK

檢查工程文件

比對樣品板

獲取新產品規格及相關工程資料

OK

NG反饋客戶確認

反饋客戶確認OK

NG

CMOAG-0015

6 OF 7 REV B

制造

PROPRIETARY INFORMATION OF FOXCONN INTERATIONAL HOLDINGS LTD. ※ ※ ※ ※


流程圖

資訊 IT

領出並上料

新產品說明會並制定 NPI Schedule

初件制作

Pilot Run

V/I

維修

Discarding

Unrepairable

Repairable

OK

SMT 程式制作

雙面膠板制作

SMT 程式修訂

Kick-off meeting

SFC ready


CMOAG-0015

PAGE 7OF 7

NPI flow chart


產品開發作業系統 Product Development Procedure

新產品Pilot Run作業辦法 New Product Pilot Run Procedure

客戶Customer

市場 PM 工程 ME 企劃 PMC 品管 QA


NPI

Delivery

Customer production

Empty

Inventory

NG

OK

OK

NG

Buyer

LCR Meter

Receive NPI

Get the related specification and documents of process

Product Introduction Meeting and make NPI schedule

Making CQP and related engineering document

OK

NG

Fixture Preparation

V/I

OK

Material preparation

IQC

NG

Make the first evaluation on the possibility of new products

manufacturing

Coresponding related departments principal and making up NPI team

ESD check

SMD Process Check

Program and parameter Check

SIP

Training

NPI report

Make up NPI team

Kick-off meeting

OK

Check Engineering documents

Compare with golden sample


OK

NGConfirm

OK

NG

Notice custormer

Confirm Notice custormer

CMOAG-0015

7OF 7 REV B

NPI flow chart

制造


資訊 IT


Feeding

Product Introduction Meeting and make NPI schedule

First production making

Pilot Run

V/I

Repair

Discarding

Unrepairable

Repairable

OK

SMTprogram making

Double sides board making

SMTprogram revising

Kick-off meeting

SFC ready


NPI CHECK LISTProject name: ENO P/N : PCBA P/N:

HWID: SWID : 3.10 PCB P/N:

N0 CHECK ITEMSchedule ( March)

Responsible Person1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

1

Customer Doc.:

Gerber file

CAD Data

Component vendor list

Packing spec.

PCB & PCA Golden Sample

2

Documentation:

BOM

SAP system key in

SOP

CQP (Tooling plan,Flow chart,FMEA ,PMP)

Inspection Drawing

POP

Component feeding list

MHS&ESD component list

SIP

3

Tool:

Stencil

Printer (Vacuum Support)

PCBA Rework & V/I Fixture

De-panel mold

Profile measuring board

Special fixture

4

Chemical:

Paste(Type)

Cleaner(Multicore prozone SC-01)

Wipe paper

Flux(Multifix 450-01)

Solder wire (Multicore Solders Crystal 502 Sn62)

5

Solder Paste Printer

Chip Shooter(feeder,nozzle)

AOI

IC Mounter(feeder,nozzle)

Reflow Oven

Router

BGA rework station

Customer BOM(final version)

Others：

Others：

Others：

Equipment：

5

Others：

6

Solder Paste Printer

Mounterr(feeder,nozzle)

AOI

Reflow Oven

Router

Barcode Label

7

Material preparation:

PCB

Component preparation

Package material

Get some scarp component for FA training

8

Back End (Testing) :

White box

Adaptor

FA tooling

Test plan readiness

FA layout

Depanelling program in Router

Others :

9

Manpower review

SMT Training

FA training

Testing training

10

Diagnostic training

SFC ready

Quality Acceptance Requirement

Others

11

Internal Audit:

FAI check list

ESD & SMT Process Check

Program and parameter Check:

12

Tape board / First article

FAI

Pilot run

Quality & yeild rate data

Cycle Time Measurement

Line Capacity Calculation

NPI Report

Program and parameter：

Others：

Others：

Production：

Others：

Pilot Run：

Others：

NPI CHECK LISTPCBA P/N:

PCB P/N: PCB REV:

Due Date Status

CMOAG-0015-01B

****PILOT RUN REPORT **** PILOT RUN DATE:

Items Reasons Principal Provisional solution Long-term solution

1

2

3

4

5

6

7

8

9

10

11

12

CMOAG-0015-02B

Project name:

****PILOT RUN REPORT ****(Appendix2)

Long-term solution

CMOAG-0015-02B

npi operation methodupdated

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