novel thermal analysis tool for altium designer powerpoint 1/novel... · • 3d ic and...

AltiumLive 2017:

Novel Thermal Analysis Tool for Altium Designer

Bernd SchröderFraunhofer IZM, Berlin

MunichOctober 24-25, 2017

IZM Research Group Physical Design Tools

1

Altium DXP Developer

Software Demo

Fraunhofer Institute for Reliability and Microintegration IZM

Thermal Analysis Tool

2

3

4

5

Agenda


1


Software Demo

Fraunhofer IZM


2

3

4

5

Agenda

Bernd Schroeder

Fraunhofer IZM – Facts

Fraunhofer Institute for Reliability and Microintegration IZM

From Wafer to Product

• Fraunhofer IZM specializes in industry-oriented applied research

• Non-profit organization

• Founded in 1993

• 2 sites: Berlin and Dresden

• Staff of over 350

• Turnover of approx. 28,1 million Euros

• 76.6 % contract research

Berlin-

Wedding

Photonics

Automotive/ Transportation

Medical Engineering

Semiconductors & Sensors

Energy

Industrial Engineering

Application Adapted Multifunctional Electronics

Bernd Schroeder

Fraunhofer IZM - Mission

Bringing Microelectronics into Application

Bernd Schroeder

Fraunhofer IZM – Departments

Wafer Level System Integration

• 3D IC and heterogeneous integration

• Silicon & glass interposer

System Integration & Interconection Technologies

• Ultra thin and nano interconnects

• Innovative interconnection processes

Environmental and Reliability Engineering

• Ageing phenomena on micro- and nano-scales

• Ecodesign of products

RF & Smart Sensor Systems

• Antenna design

• Low power systems

• Technology-oriented system design

Bernd Schroeder

Fraunhofer IZM – Department RF & Smart Sensor Systems

Physical Design Tools

Micro Energy Storage &

Smart Power

RF ModulesRF Materials &

Components

Department

RF & Smart

Sensor

Systems

Sensor Nodes &

Embedded Microsystems


1


Software Demo

Fraunhofer IZM


2

3

4

5

Agenda

Bernd Schroeder


Design Tools at Fraunhofer IZM

• Altium Designer is the most widely used PCB design

tool at the Fraunfofer IZM

• 3 commercial licenses

• 15 academic licenses (non-profit and research)

• Our unique requirements are driven by very specialized

research projects. Corresponding functionalities are not

part of the current Altium Designer implementation.

Development of smart design tools

Fraunhofer IZM Power Electronics

Highly integrated driver for loss

minimized control of high speed

semiconductors

Bernd Schroeder


Design Tool for Power Electronics

Efficient 3D modelling of critical paths

• Layouts provided as an image file

• Computation of electro-magnetic coupling effects

Effort reduction for modelling of up to 80%!

Bernd Schroeder


System Planner

Multi-Board design from scratch with 3D DRC for components and housing geometries

Bernd Schroeder


Assistance of 3D CSP Technology

• Partitioning of components into subsets

• Placement of subsets on virtual layers

• Different optimization criteria considered


1


Software Demo

Fraunhofer IZM


2

3

4

5

Agenda

Bernd Schroeder


Current Situation

• Thermal analysis tools are used in post-layout-phase – redesigns could be required

• Finite element methods (FEM) used for thermal analysis – usually time consuming

• Complex expert knowledge is required to handle FEM based analysis tools

• Market-leading tools:

Our Intention

• Consideration of thermal aspects during design process as early as possible

• Identification of „Hot Spots“ during component placement and avoidance of redesigns

www.mentor.com

Flowtherm Suite

www.ansys.com

Icepak

Bernd Schroeder


Our Approach

• Online computation of a thermal map based on power dissipation values of components

• Power dissipation values are specified in related datasheets of components

• Approximation of the real temperature-profile for each component and computation of

interactions among the component system

• Simplifications as basis for approximation

• Board lies in x-y-plane

• Heat transfer coefficient for free convection

• Currently no consideration of routing or other copper structures

• Application of a „semi-analytic“ approach for computation of the thermal map based on

temperature values of componentsbefore after

Bernd Schroeder


Multiple Heat Sources

• For the computation of multiple heat sources all position-dependent temperature profiles for

each heat source are computed and super positioned

𝑇 𝑟 = 𝑇𝑎𝑚𝑏 +

𝑖

∆𝑇𝑚𝑎𝑥,𝑖 ∙ 𝑒−𝑟𝑖𝑅𝑖

• We have validated our approach using FEM-simulations with ANSYS Icepak

0

20

40

60

80

100

120

140

160

180

200

-0.04 -0.03 -0.02 -0.01 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09

ANSYS 0.6 W Abstand 0.04

Fit 0.6 W 10W/m²K

Fit 0.6 W 10W/m²K

Fit 2Chips

ANSYS Icepak Thermal Tool

Bernd Schroeder


Online Thermal Analysis

• Detection and avoidance of thermal issues

(Hot Spots) during component placement by

simultaneous computation of a thermal map

• Computation of approximated temperature-

profiles for each component based on power

dissipation value

• DXP Developer API is used to access the

required Altium Designer data and to re-

position the components after optimization

in the thermal tool

Specification of required parameter

power dissipation in schematic

Bernd Schroeder


Online Thermal Analysis

Altium Designer IZM Thermal Analysis Tool


1


Software Demo

Fraunhofer IZM


2

3

4

5

Agenda

Bernd Schroeder


http://www.altium.com/altium-dxp/overview

Bernd Schroeder

Available SDKs

• C++, C#, Delphi

Workspace API

• Iterating through project documents

PCB API

• Access to complete PCB document data

Schematic API

• Match schematic components to PCB components

• Relevant schematic parameters for given PCB

components

Extension integrable into ALTIUM Designer menu


Bernd Schroeder


XML File

• Board outline

• Components

• Netlist

• …

AltiumDXP Developer

C++ Extension DLL


1


Software Demo

Fraunhofer IZM


2

3

4

5

Agenda

Thanks for your Attention!

Questions?

novel thermal analysis tool for altium designer powerpoint 1/novel... · • 3d ic and...

Documents