north american company profiles - smithsonian...

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-1

North American Company Profiles 8x8

8X8

8x8, Inc.2445 Mission College Boulevard

Santa Clara, California 95054Telephone: (408) 727-1885

Fax: (408) 980-0432Web Site: www.8x8.com

Fabless IC Supplier

Regional Headquarters/Representative Locations

Europe: 8x8, Inc. • Bucks, EnglandTelephone: (44) (1628) 890984 • Fax: (44) (1628) 890938

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996

Sales 36 31 34 20 29Net Income 5 (1) (0.3) (6) (3)R&D Expenditures 7 7 7 8 8

Employees 114 100 105 110 81

Company Overview and Strategy

8x8, Inc. was founded originally as Integrated Information Technology, Inc. (IIT) in 1987 to supply mathcoprocessors for 286 and later 386 microprocessor chips. Since June 1995, the company has beendiscontinuing all efforts unrelated to video conferencing, including dropping product lines and developmentefforts in math coprocessors, x86-compatible microprocessors, graphics ICs, and MPEG decoders.

Along with the new business strategy came the new name, 8x8 Inc., in early 1996. The 8x8 name reflects thecompany’s focus on programmable integrated circuits for video conferencing applications in a wide range ofconsumer and PC multimedia products. An 8x8 block of picture elements (pixels) is the basis of many videocompression algorithms. 8x8 continues to place greater emphasis on its video compression semiconductors, which for fiscal year 1996represented 63 percent of total sales, compared to only 12 percent in 1994. The company is planning reliance ona new line of cost effective VideoCommunicators for the consumer video conferencing market.

The company launched its initial public offering in November of 1996. Export sales accounted for almost half of8x8’s revenue in fiscal 1996.

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INTEGRATED CIRCUIT ENGINEERING CORPORATION

8x8 North American Company Profiles

Management

Joseph L. Parkinson Chairman and Chief Executive OfficerY. W. Sing Vice ChairmanKeith Barraclough President and Chief Operating OfficerPaul Voois Executive Vice PresidentSandra Abbott Vice President, Finance and Chief Financial OfficerDavid Harper Vice President, European OperationsBryan Martin Vice President, Engineering and Chief Technical OfficerChris McNiffe Vice President, Sales and MarketingMichael Noonen Vice President, Business DevelopmentSamuel Wang Vice President, Process TechnologyDoug Bailey Director, Worldwide SalesKevin Deierling Director, Marketing

Products and Processes

8x8 Inc. develops highly integrated programmable single-chip compression and decompression ICs and relatedsoftware for video phone and video conferencing equipment.

The company’s family of processors include the following:

• Video Communications Processor (VCP) is a single-chip programmable video subsystem and multimediacommunications processor for conferencing over ISDN telephone lines. In early 1997, the companyintroduced a simple and inexpensive video phone, dubbed ViaTV Phone, that contains the VCP device.

• Low-bit-rate Videophone Processor (LVP) is a single-chip programmable video-phone processor forconferencing over ordinary telephone lines.

• Multimedia Encode Processor (MEP) for powering a PCI video capture and compression board using Intel’swavelet-based Indeo interactive video compression technology.

The company’s video compression semiconductors are based on its proprietary architecture, which combines aRISC microprocessor, an advanced DSP core, specialized video processing circuitry, and SRAM technology.


North American Company Profiles ACC Micro

ACC MICRO

ACC Microelectronics Corporation2500 Augustine Drive


Fax: (408) 980-0626

Fabless IC Supplier


ACC Microelectronics Corporation (ACC Micro™) was established in 1987 to design, develop, and market a varietyof VLSI circuit devices for computer system control, computer system board integration, and communicationapplications. The company's flagship products are a line of single-chip solutions targeted at the desktop,notebook, and subnotebook computer industries.

Management

Wei-Tau Chiang, Ph.D. President and Chief Executive OfficerMark Shieu Vice President, Engineering


ACC Micro supplies chipsets and controller chips for 386/486-based and Pentium-based computers. Otherproducts include buffer chips, power management chips, and single-device floppy-disk controllers.

Semiconductor Fabrication Facilities

ACC Micro has second-source licensing agreements with Motorola to support delivery schedules.

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Actel North American Company Profiles

ACTEL

Actel Corporation955 East Arques Avenue

Sunnyvale, California 94086-4533Telephone: (408) 739-1010

Fax: (408) 739-1540Web Site: www.actel.com

Fabless IC Supplier


Europe: Actel Europe Ltd. • Basingstoke, Hampshire, EnglandTelephone: (44) (1256) 29209

Financial History ($M), Fiscal Year Ends December 31

1992 1993 1994 1995 1996

Sales 41 56 76 109 149Net Income (0.3) 5 8 (1) 15R&D Expenditures 9 11 14 21 24Foundry Fab Investment — — 4 3 4

Employees 168 211 245 320 356


Founded in 1985, Actel Corporation designs, develops, and markets field programmable gate arrays (FGPAs) andassociated software development systems and programming hardware. Its products are used by designers ofcomputer and computer peripheral, telecommunications, military, aerospace, industrial control, and otherelectronic systems.

Communications/Networking

46%

1996 Sales by End-Use Market

Industrial Control22%

Computers/Peripherals

21%

Military/Aerospace11%

United States67%

1996 Sales by Geographic Region

Europe18%

Japan10%

ROW5%


North American Company Profiles Actel

Actel is a leader in the development of antifuse-based FPGAs and believes it was the first company to achievevolume production of such devices. The company's objective is to become the leading supplier of FPGAs by fullyexploiting the capabilities of its proprietary antifuse and circuit architectures.

In April 1995, Actel completed the acquisition of the antifuse FPGA business of Texas Instruments, which was theonly second-source supplier of Actel’s products.

FPGAs97%

1996 Sales by Product Type

Development Systems3%

Management

John C. East President and Chief Executive OfficerEsmat Z. Hamdy Senior Vice President, Technology and OperationsJeffrey M. Schlageter Senior Vice President, EngineeringDavid M. Sugishita Senior Vice President, Finance and Administration, and Chief Financial OfficerMichelle A. Begun Vice President, Human ResourcesDouglas D. Goodyear Vice President, Worldwide SalesDennis F. Nye Vice President, MarketingRobert Smith, Ph.D. Vice President, SoftwareDavid L. Van De Hey Vice President and General CounselWarren Miller Director, Silicon Planning and Strategic ApplicationsRobert Nalesnik Director, Product MarketingDavid Stieg Director, North American Distribution Sales


Value Series

• The ACT1 family consists of two devices, a 1,200-gate part and a 2,000-gate (6,000 PLD equivalent gates)part, and offers system performance of up to 25MHz. This family of circuits utilizes 1.0µm or 0.9µm CMOStechnology.

• The ACT2 family consists of three devices ranging from 2,500 to 8,000 gates (20,000 PLD equivalent gates)and offers system performance of up to 50MHz. This family of circuits utilizes 1.0µm CMOS technology.

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Actel North American Company Profiles

Accelerator Series

• The ACT3 family consists of devices ranging from 1,500 to 10,000 gates (25,000 PLD equivalent gates) andon-chip performance of up to 250MHz (system performance up to 75MHz). This family of circuits is based on0.8µm double-level-metal CMOS technology.

• The ACT3 PCI family consists of fully PCI-compliant devices with 4,000 to 10,000 usable gates and on-chipperformance of up to 250MHz. This family of circuits is based on 0.6µm double-level-metal CMOS technology.

Integrator Series

• The 1200XL family features parts ranging from 2,500 to 8,000 gates and offers system performance of up to60MHz. This family of circuits is based on 0.65µm CMOS technology.

• The 3200DX family is Actel’s newest series of FPGAs with capacities ranging from 6,500 gates to 40,000 gatesand offering system performance of up to 100MHz. These high-performance FPGAs offer fast dual-portSRAM, fast decode, and data path circuitry based on 0.65µm double-level-metal CMOS technology.

Reprogrammable SPGAs

• Actel’s ES family of system programmable gate arrays (SPGAs) are non-antifuse PLDs designed to address thesystem-on-a-chip market. The fine-grained array of logic module blocks enables gate counts from 50,000gates up to 400,000 gates. The SRAM-based SPGAs permit the integration of complex intellectual property(IP) cores and support in-system programmability (ISP). Actel jointly developed the SPGA technology with theSilicon Architects Group of Synopsys.

Radiation-Hardened FPGAs

• Actel’s RadHard family of FPGAs currently consists of radiation-hardened versions of its 2,000-gate ACT1device and its 8,000-gate ACT2 device. These devices were first shipped in 1996 and ramped more quicklythan any other product in the company’s history. The RadHard family is based on 0.8µm double-level-metalepitaxial bulk CMOS technology jointly developed with Lockheed-Martin Federal Systems.

Mask Programmed Gate Arrays (MPGAs)

• Offered as an alternative to traditional gate array conversions, Actel’s MPGAs provide significant costreductions for high-volume applications. An Actel FPGA used for prototyping and initial production can bereplaced by a corresponding MPGA (masked version of the device).

To support its FPGA products, Actel offers software products, including its CoreHDL IP portfolio consisting oftelecommunications cores, industrial cores, a Universal Serial Bus (USB) interface, and Actel-developed CorePCImodels, as well as proprietary and third-party design automation software. In addition, Actel provides programmingand test hardware and a diagnostic option that provides special in-circuit debug and diagnostic capabilities.


North American Company Profiles Actel


Actel's FPGAs are manufactured by Chartered Semiconductor, Lockheed-Martin Federal Systems, Matsushita,Texas Instruments, and Winbond.

The company’s first foundry suppliers were Matsushita and TI. As part of the 1995 acquisition of TI’s FPGAbusiness, Actel signed a three-year manufacturing agreement (1.0µm design rules).

Also in 1995, Actel and Matsushita extended their five-year manufacturing relationship (0.8µm, 0.9µm, and 1.0µmdesign rules). In addition, Matsushita is assisting Actel in developing next-generation antifuse technology.

Actel’s relationship with Chartered began in 1994 when the company purchased a minority equity interest inChartered. In return, Actel is guaranteed access to Chartered’s advanced 200mm wafer capacity (0.6µm designrules).

Since being signed on in 1994, Winbond has become one of Actel’s largest fab partners, providing the companywith advanced wafer production services (0.8µm and 0.6µm design rules).

Lockheed-Martin Federal Systems is the sole source of Actel’s rad-hard FPGAs, which are being jointly developedby the two companies (0.8µm design rules).

Key Agreements

• In 4Q96, Actel signed a multi-year agreement with Swiss IP provider, Inicore AG, for severaltelecommunications and industrial control cores. The cores have been optimized for Actel’s ACT3, ACT3 PCI,1200XL, and 3200DX families of FPGAs, as well as the ES family of SPGAs.

• Actel and Synopsys announced an agreement in mid-1996 to jointly develop Actel’s SPGAs, which combinethe features of FPGAs and mask programmed ASICs in a single chip. Under the agreement, Actel licensed thecell-based array (CBA) architecture of the Silicon Architects Group of Synopsys for use in the mask-programmed portion of the SPGAs.

• In 2Q96, Actel signed an agreement with IP provider, Technical Data Freeway, Inc., giving Actel and itscustomers access to over 90 synthesizable DSP, telecommunications, multimedia, and MCU cores.

• Actel completed an agreement with Lockheed-Martin Federal Systems Company in Manassas, Virginia, in 1H95to jointly develop radiation-hardened FPGAs. Lockheed Martin FSC is manufacturing the devices.

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Allegro MicroSystems North American Company Profiles

ALLEGRO MICROSYSTEMS

Allegro MicroSystems, Inc.115 Northeast Cutoff

Worcester, Massachusetts 01615-0036Telephone: (508) 853-5000

Fax: (508) 856-7434Web Site: www.allegromicro.com

IC Manufacturer


Europe: Allegro MicroSystems Europe Ltd. • Annecy, FranceTelephone: (33) (4) 50-51-2359 • Fax: (33) (4) 50-51-2083

Financial History ($M)

1992 1993 1994 1995 1996

Sales 115 124 161 181 201Capital Expenditures 13 10 14 61 n/a

Employees 2,000


Allegro MicroSystems is the former semiconductor branch of Sprague Technologies, Inc. In 1990, Sprague waspurchased by Japan's Sanken Electric and renamed Allegro MicroSystems. Today, Allegro is functionally andstructurally an independently operating organization as a wholly owned subsidiary of Sanken Electric.

Allegro MicroSystems specializes in the design, manufacture, and marketing of advanced mixed-signal ICs. Thecompany is the world leader in Hall-effect sensor ICs and a prominent supplier of power and smart power ICs.Allegro's customers are OEM's primarily serving the automotive and industrial markets, but also the consumer,telecommunications, computer mass storage, and printer markets.


North American Company Profiles Allegro MicroSystems

Industrial47%

Automotive26%

EDP 8%

Consumer14%


Telecommunications5%

United States52%

Far East15%

Europe19%

Japan14%


Management

Allan S. Kimball PresidentDan Ax Vice President, Business DevelopmentDennis Fitzgerald Vice President, Quality SystemsJohn Kokulis Vice President, Finance and Chief Financial OfficerAndy Labrecque Vice President, OperationsJohn MacDougell Vice President, Research and DevelopmentSteven W. Miles Vice President, Product DevelopmentFred Windover Vice President and General CounselMarybeth Perry Director, Human Resources


Allegro's product offering is outlined below by end-use market segment.

Automotive Market EDP Printer and Communication MarketsMagnetic field sensors Printer head driverPower driver ICs Paper transport motor driverSignal processing ICs Battery managementRadio components

Computer Mass Storage Market Industrial and Consumer MarketsSpindle motor controller/driver Chip supply for hybridsServo/voice-coil motor driver Smoke detector electronicsCombination drivers

Switch Mode Power Supply MarketAC-DC converter (>10W to <250W)Universal input switching (<1kW)

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Allegro MicroSystems North American Company Profiles

Allegro exited the discrete market in December 1996 and sold its inventory of discrete semiconductor diodes andtransistors. In recent years, sales of discrete products has represented about 6 percent of Allegro’s totalrevenues.

The semiconductor processes used by Allegro range from standard bipolar to CMOS, power DMOS (double-diffused MOS), and combinations of all of them.


Allegro MicroSystems, Inc. Allegro MicroSystems, Inc.115 Northeast Cutoff 3900 Welsh Grove RoadWorcester, Massachusetts 01615-0036 Willow Grove, Pennsylvania 19090Cleanroom size: 20,000 square feet Cleanroom size: 15,000 square feetCapacity (wafers/week): 5,000 Capacity (wafers/week): 3,000Wafer size: 100mm Wafer size: 100mmProcesses: Bipolar, CMOS, BiCMOS, DMOS Processes: Bipolar, CMOS, BiCMOS, DMOSProducts: Power and smart power ICs, Products: Power and smart power ICs,

signal processing ICs, sensors ASICs (mixed-signal), sensorsFeature sizes: 1.5µm-8.0µm Feature sizes: 1.5µm-8.0µm

Allegro plans to invest $80 million to expand wafer capacity at its Worcester fab facility. A 150mm wafer line will beadded to support 1.5µm production of its power and smart power ICs and sensor products. Allegro is alsoplanning to double the capacity at its Willow Grove facility.


North American Company Profiles Alliance Semiconductor

ALLIANCE SEMICONDUCTOR

Alliance Semiconductor Corporation3099 North First Street

San Jose, California 95134-2006Telephone: (408) 383-4900

Fax: (408) 383-4999Web Site: www.alsc.com

Fabless IC Supplier


1993 1994 1995 1996 1997

Sales 22 55 119 201 83Net Income 2 9 24 11 (17)R&D Expenditures 2 4 8 15 n/aFoundry Fab Investment — — 7 95 n/a

Employees 35 40 74 130 150


Founded in 1985, Alliance Semiconductor designs, develops, and markets memory products and memoryintensive logic products for high-performance applications. Such applications are in the desktop and portablepersonal computer, networking, telecommunications, and instrumentation markets.

The company originally manufactured its own devices in a fab facility near Kansas City, Missouri, leased from AT&T.However, high overhead costs and low demand in its product markets caused the plant to operate at a significantloss until its closure in February 1990. The company filed for Chapter 11 bankruptcy protection in March 1991 andthen emerged with a new business strategy to operate as a fabless supplier of high-performance SRAMs andother memory products.

The majority of Alliance’s revenues historically have been from sale of fast SRAMs in the PC marketplace.Recently, the company has placed greater emphasis on diversifying its product offerings. Its newest product linesinclude high-performance DRAMs, flash memories, and multimedia user interface (MMUI) accelerators.

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Alliance Semiconductor North American Company Profiles

SRAMs95%

MMUI Accelerators5%


North America57%

Europe18%

Asia25%


In 1995, Alliance abandoned its “fabless” IC supplier strategy, to a certain extent. The company announced plansin that year calling for a substantial portion of the company’s future wafer capacity to come from fabs in which it haspartial ownership. As a result, Alliance made a number of substantial investments in wafer manufacturing facilities,including an equity investment in Chartered Semiconductor (see Semiconductor Fabrication Facilities below).

Management

N. Damodar Reddy Chairman, President, and Chief Executive OfficerC.N. Reddy Senior Vice President, Engineering and OperationsCharles Alvarez Vice President, Finance and Administration, and Chief Financial OfficerKamal Gunsagar Vice President, Contract ManufacturingAngela Kupps Vice President, Human ResourcesKen Poteet Vice President, Integrated Memory ProductsPhil Richards Vice President, SalesSunit Saxena Vice President, Product EngineeringBharat Shastri Vice President, Systems EngineeringRitu Shrivastava Vice President, Technology DevelopmentDatar Lalvani Director, Marketing


SRAMs

Alliance Semiconductor offers a variety of high-speed asynchronous and synchronous CMOS SRAMs fornetworking, telecommunications, modem, and mainframe computer applications. Its asynchronous SRAMproducts range from 5V 64K devices with speeds as fast as 8ns to 3.3V 1M and 4M devices with speeds as fast as12ns. Its 3.3V synchronous SRAM products include 1M (32K x 32) and 2M (64K x 32) pipeline burst SRAMsdesigned for high-performance Pentium applications with access times as low as 5ns.

DRAMs

Volume production of a new line of high-speed fast page mode and EDO 4M and 16M DRAMs began in mid- andlate-1996, respectively.


North American Company Profiles Alliance Semiconductor

Flash Memories

Alliance’s flash memory products include 1M and 2M 5.0 volt-only NOR-type devices that are compatible with AMDand Intel flash chips, and 4M 5.0 volt-only devices that are compatible with AMD and Atmel flash chips.

MMUI Accelerators

The company's first foray beyond memory chip markets came in late 1994, when it unveiled its line of ProMotion™MMUI accelerators. The ProMotion line includes the ProMotion-6410 64-bit MMUI accelerator, the ProMotion-6422 MMUI accelerator with integrated DAC, and the ProMotion-AT24 128-bit accelerator with integrated DAC.

The fourth-generation ProMotion device, the AT3D chip, was introduced in late 1996. The AT3D is a 3D/2D/videoaccelerator that integrates a 128-bit internal drawing engine, DVD, and live video input port with support for varioussoftware drivers.

Currently, most of Alliance’s products are manufactured using 0.45µm CMOS technology, with many of its newestproducts being developed using a 0.35µm process. The company’s SRAMs are based on a two-poly, one-metalCMOS process and its DRAMs on a three-poly, one-metal CMOS process.


Alliance’s IC products are manufactured through a combination of independent foundry suppliers and jointventure facilities. The independent foundry suppliers Alliance uses for the manufacture of its ICs include Rohmand TSMC.

In October 1995, Alliance entered an agreement with UMC and other parties to form a separate Taiwanesecompany, United Silicon Inc. (USI), for the purpose of building and managing a semiconductor manufacturingfacility in Taiwan. The investment by Alliance will total approximately $60 million, representing an initial equityownership of about 10 percent. In return for its investment, Alliance will receive 12.5 percent of the manufacturingcapacity in the USI fab, which is expected to move into production in 1Q98.

Earlier in 1995, Alliance entered into a partnership with UMC and S3 Incorporated to establish a new jointly ownedwafer foundry company in Taiwan called United Semiconductor Corporation (USC). Alliance’s investment in USCwill total approximately $70 million, representing an equity ownership of 19 percent. In return for its investment,Alliance will receive 25 percent of the manufacturing capacity in the USC fab. The fab will be a 200mm wafer,0.35µm plant capable of producing 5,000 to 6,250 wafers per week. The fab started manufacturing wafers forAlliance, S3, and other semiconductor companies in 3Q96.

Also in 1995, Alliance announced a $52 million investment in Chartered Semiconductor to obtain a minorityownership stake in the company and a guaranteed portion of the capacity in Chartered’s Fab II facility that beganproduction of 200mm wafers in 4Q95.

Alliance’s equity investments in UMC and Chartered so far total about $200 million. By the end of 1997, thecompany expects wafers from the UMC and Chartered fabs it has invested in will represent more than 50 percentof its capacity.

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Alliance Semiconductor North American Company Profiles

Key Agreements

• Alliance and UMC signed an agreement in 4Q95 calling for UMC to expand allocation of wafer fabricationcapacity to Alliance for the manufacture of Alliance’s DRAM products. In return, Alliance granted UMC a licenseto produce for itself a certain number of Alliance DRAM products. As discussed above, UMC and Alliance arealso cooperating in the manufacture of ICs through two new IC foundry companies in Taiwan.

• Alliance signed an agreement with 3Dfx Interactive, Inc. in late 1995 to work together on ensuring compatibilitybetween Alliance’s ProMotion multimedia chips and 3Dfx Interactive’s Voodoo Graphics three dimensionalgraphics accelerator designed for 3D entertainment applications.

• Alliance licensed Aspec Technology's Portfolio™ family of ASIC design tools in 2Q95. These tools will allowthe company to create low-cost ASIC gate array and embedded memory array products.

• Alliance entered into a joint development, manufacturing, and marketing agreement with Japan's Rohm Co.,Ltd. in mid-1994 calling for Rohm to furnish Alliance with fab capacity for the production of SRAMs. Rohm willalso help Alliance sell and market the products in Japan; Alliance will, in turn, assist Rohm in developing high-performance, low-power SRAMs.


North American Company Profiles Altera

ALTERA

Altera Corporation2610 Orchard Parkway


Fax: (408) 435-1394Web Site: www.altera.com

Fabless IC Supplier


Japan: Altera Japan Ltd. • Shinjuku-ku, Tokyo, JapanTelephone: (81) (3) 3340-9480 • Fax: (81) (3) 3340-9487

Europe: Altera U.K. Limited • Buckinghamshire, United KingdomTelephone: (44) (1494) 602000 • Fax: (44) (1494) 602001

Asia-Pacific: Altera Hong Kong • Kowloon, Hong KongTelephone: (852) 2538-6895 • Fax: (852) 2538-6896


1992 1993 1994 1995 1996

Sales 101 140 199 402 497Net Income 12 21 15 87 109R&D Expenditures 16 17 22 34 50Foundry Fab Investment 4 — 1 1 93

Employees 477 527 667 881 918


Altera Corporation, founded in 1983, is a leading supplier of high-performance, high-density CMOSprogrammable logic devices (PLDs) and associated development tools. Its broad line of "off-the-shelf" user-configurable chips, together with Altera-developed software, enable system manufacturers to create custom logicfunctions in-house for a wide variety of applications. Altera believes its products and services provide itscustomers with faster time-to-market than custom (ASIC) solutions. The company's name was derived from theword Alterable.

Altera products are used in a variety of applications, including telephone switching systems, computer networking,multimedia boards, broadcast video and video conferencing, and medical instrumentation.

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Altera North American Company Profiles

Development Softwareand Hardware

6%


CMOS ProgrammableLogic Chips

94%

Communications58%

Industrial14%

Other1%


Computer19%

Military4%

Consumer4%

North America53%

Asia-Pacific 7%


Europe21%

Japan19%

Management

Rodney Smith Chairman, President, and Chief Executive OfficerDenis Berlan Executive Vice President and Chief Operating OfficerClive McCarthy Senior Vice President, Development EngineeringErik Cleage Vice President, MarketingJack Fitzhenry Vice President, Human ResourcesThomas J. Nicoletti Vice President, Business Development and Investor RelationsNathan Sarkisian Vice President, FinancePeter Smyth Vice President, SalesChris Henry Director, Customer Marketing


Altera's PLD products extend from 24 to 599 pins with usable gate counts up to 130,000 gates and processtechnologies advancing to 0.35µm through its fabrication partners. The company has released some detailsregarding its next major family of PLDs. Code-named Michelangelo, the new family of devices will be pincompatible with the MAX 7000 Family, Altera’s most popular line. Michelangelo PLDs, ranging from 32 macrocellson the low end to 1,008 on the high end, will start shipping in the first half of 1998.


North American Company Profiles Altera

FLEX 10K Family FLEX 10KA Family• 10,000-100,000 usable gates • 10,000-250,000 usable gates• In-circuit reconfigurable • In-circuit reconfigurable• 84-503 pins • 84-599 pins• Performance: 104MHz • Performance: 104MHz• SRAM-based CMOS technology • SRAM-based CMOS technology• 5V operation • 3.3V operation• MultiVolt interface supports 3.3V • MultiVolt interface supports 5V and 2.5V• 0.5µm • Megafunction support

• 0.35µm

FLEX 8000 Family MAX 9000 Family• 2,500-16,000 usable gates • 6,000-12,000 usable gates• In-circuit reconfigurable • In-system programmable• 84-304 pins • 84-356 pins• Performance: 125MHz • Performance: 125MHz• SRAM-based CMOS technology • EEPROM-based CMOS technology• MultiVolt interface supports 3.3V • MultiVolt interface supports 3.3V• 0.5µm • 0.5µm-0.65µm

MAX 7000/E Family MAX 7000/S Family• 600-5,000 usable gates • 600-5,000 usable gates• High pin-to-gate ratio • In-system programmable• 44-208 pins • High pin-to-gate ratio• Performance: 178MHz • 44-208 pins• In-system programmable • Performance: 178MHz• EEPROM-based CMOS technology • EEPROM-based CMOS technology• 0.65µm-0.8µm • 0.5µm-0.65µm

MAX 5000 Family Classic Family• 600-3,750 usable gates • 200-900 usable gates• High register count • Zero-standby power• 24-100 pins • 24-68 pins• Performance: 83.3MHz • Performance: 100MHz• 0.65µm • 0.65µm

The company also offers 64K, 213K, and 1M EPROMs designed to configure its FLEX devices, as well as mask-programmed logic devices (MPLDs) for high-volume applications. MPLDs are pin-, function-, and timing-compatible with Altera’s PLDs and are available for all families.

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Altera North American Company Profiles

Coinciding with the company’s migration from 0.8µm to 0.6µm in 1993, Altera moved from two to three layers ofmetal. Today, the FLEX10KA Family is based on a 0.35µm triple-layer metal process, and is expected to add afourth layer of metal in 1997. The Michelangelo PLDs will be implemented in a 0.35µm EEPROM-based CMOSprocess with four-layers of metal. For future products with gate densities reaching 250,000 usable gates andabove, Altera is developing a 0.25µm, five-layer metal process.

Altera supplies proprietary software development systems (MAX+PLUS II™) to support its PLD products.


Altera has foundry agreements with Sharp, TSMC, Cypress, and Intel. It owns 17 percent of CypressSemiconductor's wafer fab in Round Rock, Texas. Through this ownership, Altera has the right to buy apercentage of the wafers produced by Cypress approximately equal to the percentage of its ownership.

In November 1995, Altera signed a letter of intent for joint ownership of a TSMC joint venture fab facility, located inCamas, Washington. Under the terms, Altera will invest $140 million to take an 18 percent equity stake in, and alsogain the rights to 27 percent of the output from the new fab. Construction on the facility, called WaferTech, beganin July 1996. Potential output from the plant is expected to be 7,500 200mm wafers per week, with productionscheduled to start in 1998. Design rules will start at 0.35µm and migrate to 0.25µm.

Key Agreements

• In February 1996, Altera purchased a minority stake in I-Cube Inc., a privately held supplier of programmableswitching and interconnect devices (PSIDs).


North American Company Profiles AMCC

APPLIED MICRO CIRCUITS (AMCC)

Applied Micro Circuits Corporation6195 Lusk Boulevard

San Diego, California 92121-2729Telephone: (619) 450-9333

Fax: (619) 450-9885Web Site: www.amcc.com

IC Manufacturer


Europe: Applied Micro Circuits Corporation • Munich, GermanyTelephone: (49) (89) 92404-136 • Fax: (49) (89) 81213-180


1992 1993 1994 1995 1996

Sales 39 47 50 51 60

Employees 275 300 310 270 255


Established in 1979, Applied Micro Circuits Corporation (AMCC) develops, manufactures, and markets standardand application-specific high-speed, high-performance interface ICs for the communications, computer,instrumentation, and military markets. The privately-held company also offers a comprehensive line of low EMI, lowskew precision clock products.

AMCC is a leader in bipolar manufacturing and bipolar ECL logic arrays, the company’s focus in recent years hasbeen shifting from ASICs to standard products, particularly chips for the telecommunications and networkingmarkets, areas where bipolar’s high frequency characteristics can be exploited.

Management

David Rickey President and Chief Executive OfficerJoel O. Holliday Chief Financial OfficerAnil Bedi Vice President, MarketingLaszlo Gal Vice President, EngineeringDarwin Slindee Vice President, OperationsThomas Tullie Vice President, SalesBrent Little Director, ASIC ProductsCarol Oster Director, Quality Assurance

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AMCC North American Company Profiles


AMCC produces and sells bipolar and BiCMOS gate array and standard cell ASICs, custom bipolar IC products, andstandard bipolar and CMOS products.

The company’s portfolio of ASSPs for high-performance networking, clock/timing, and bus interface applications,and ASICs include the following:

Sonet/SDH Interface Circuits PCI Bus ControllersFibre Channel Interface Circuits Crosspoint SwitchesHiPPI Source and Destination Interface Circuits Clock Generators/SynthesizersGigabit Ethernet Interface Circuits Clock DriversATM Interface Circuits ECL TerminatorQ20000 Series ECL/TTL “Turbo” Logic ArraysMicroPower 3V, low power, bipolar, standard cell ASICs

As part of its push into communications markets, AMCC redesigned its G3.0 bipolar process, obtained through atechnology alliance with Plessey, to allow for 3.3V operation. Parts derived from the 1.0µm process can beoperated at up to 2.4GHz.


AMCC operates from a 120,000 square foot facility in San Diego, California, that includes a design center forcustomer design use and training, a Class 10 cleanroom for bipolar IC production, and an assembly and test facility.The company has established strategic foundry partners to augment its wafer supply.

Applied Micro Circuits Corporation6195 Lusk BoulevardSan Diego, California 92121Cleanroom size: 10,000 square feet (Class 10)Capacity (wafers/week): 1,200Wafer size: 100mmProcesses: Bipolar, BiCMOSProducts: ASICs, ASSPs, custom ICsFeature sizes: 1.0µm, 2.0µm, 3.0µm

AMCC's capacity is only about half utilized and the company expects its current manufacturing resources to reachmaximum levels in a few years.


North American Company Profiles AMD

ADVANCED MICRO DEVICES (AMD)

Advanced Micro Devices, Inc.One AMD PlaceP.O. Box 3453


Fax: (408) 774-7216Web Site: www.amd.com

IC Manufacturer


Europe: Advanced Micro Devices (UK) Ltd. • Firmley, United KingdomTelephone: (44) (1276) 803100 • Fax: (44) (1276) 803102

Japan: Advanced Micro Devices • Shinjuku-ku, Tokyo, JapanTelephone: (81) (3) 3346-7550 • Fax: (81) (3) 3342-5685

Asia-Pacific: Advanced Micro Devices Far East Ltd. • Kowloon, Hong KongTelephone: (852) 2956-0388 • Fax: (852) 2956-0588


1992 1993 1994 1995 1996

Sales 1,514 1,648 2,155 2,468 1,953Net Income 234 208 271 216 (69)R&D Expenditures 238 279 295 416 401Capital Expenditures 224 390 586 650 494

Employees 11,674 12,203 11,994 12,981 12,181


Advanced Micro Devices (AMD) was founded in 1969 and is today one of the largest U.S.-based merchantmanufacturers of integrated circuits. With a focus on the personal and networked computing and communicationsmarkets, the company produces microprocessors and related peripherals, flash memories, programmable logicdevices, and circuits for telecommunications and networking applications.

AMD’s strategy is to be competitive only in those markets where it can be a leading factor. The company has beena major supplier of microprocessors since 1975, it is a leading supplier of non-volatile memories, a leader in ICs forlocal area networks and linecards for public communications applications, and is one of the largest suppliers ofprogrammable logic devices.

1-22


AMD North American Company Profiles

In a move to significantly enhance its core competency in advanced microprocessor design, AMD acquiredNexGen, Inc. for nearly $1 billion in early 1996. The acquisition brought together the engineering resources ofNexGen and AMD’s sub-0.35µm process technology and manufacturing capability to enable AMD to offer futuregenerations of microprocessors in a competitive timeframe.

To address the unique requirements of the market for programmable logic devices (PLDs), AMD spun off its PLDoperations in the second half of 1996 to form a new subsidiary business unit called Vantis Corporation (a separateprofile of Vantis is included in this publication). Vantis will continue to rely on AMD for manufacturing services andplans to eventually become an independent company.

AMD is organized into three product groups: the Communications and Components Group (CCG), theComputation Products Group (CPG), and Vantis Corporation. CCG products include flash memory devices,EPROMs, voice and data communications products, embedded processors, I/O devices, and network products.CPG products include microprocessors. Vantis products are high-speed PLDs.

ComputationProducts

17%

Communicationsand Components

70%

Vantis13%

1996 Sales by Product Group

North America47%

Europe27%


Asia-Pacific26%

Management

W.J. Sanders III Chairman and Chief Executive OfficerRichard Previte President and Chief Operating OfficerMarvin Burkett Senior Vice President, Chief Financial and Administrative Officer and TreasurerGene Conner Senior Vice President, OperationsS. Atiq Raza Senior Vice President and Chief Technical OfficerStanley Winvick Senior Vice President, Human ResourcesStephen Zelencik Senior Vice President and Chief Marketing ExecutiveDonald M. Brettner Group Vice President, Manufacturing Services DivisionVinod Dham Group Vice President, Computation Products GroupRichard Forte Group Vice President, Communications and Components Group, and

President and Chief Executive Officer, VantisGary O. Heerssen Group Vice President, Wafer Fabrication GroupWilliam Siegle Group Vice President, Technology Development Group, and Chief ScientistTerryll R. Smith Group Vice President, Sales and MarketingBenjamin M. Anixter Vice President, External AffairsGary Ashcraft Vice President and GM, Communication Products DivisionKathryn Brandt Vice President, Business SystemsRandy Burdick Vice President, Information Technology Management



Susan T. Daniel Vice President, Human Resource OperationsJames Doran Vice President, Technical OperationsTom Eby Vice President, Strategic Marketing, Communications and Components GroupCurt Francis Vice President, Corporate Planning and DevelopmentRobert R. Herb Vice President, Strategic Marketing, Computation Products GroupLarry Hollatz Vice President and GM, Texas Microprocessor DivisionMike Johnson Vice President, Advanced Research and DevelopmentRobert M. Krueger Vice President and GM, Network Products DivisionGerald A. Lynch Vice President, Sales and Marketing, Asia/Pacific-JapanWalid Maghribi Vice President and GM, Non-Volatile Memory Products DivisionRobert McConnell Vice President and GM, Logic Products DivisionThomas M. McCoy Vice President, General Counsel, and SecretaryGiuliano Meroni Vice President, Sales and Marketing, EuropeDaryl Ostrander Vice President, Austin Wafer FabricationGeoff Ribar Vice President, Finance, and Corporate ControllerJack Saltich Vice President and GM, European Microelectronics Center, DresdenDanne Smith Vice President, Corporate QualityTom Stites Vice President, CommunicationsMichael Van Buskirk Vice President, Engineering, Non-Volatile Memory Products DivisionJerry Vogel Vice President and GM, California Microprocessor Division


MOS MEMORY ANALOG

DRAM Amplifier

SRAM ✔ Interface

✔ Flash Memory Consumer/Automotive

✔ EPROM Voltage Regulator/Reference

ROM ✔ Data Conversion

EEPROM ✔ Comparator

✔ Other (Including Non-Volatile RAM) Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR

✔ General Purpose Logic ✔ Bipolar Memory

Gate Array ✔ General Purpose Logic

Standard Cell Gate Array/Standard Cell

✔ Field Programmable Logic ✔ Field Programmable Logic

Other Special Purpose Logic Other Special Purpose Logic

✔ MPU/MCU/MPR

MOS MICROCOMPONENT

✔ MPU OTHER

✔ MCU Full Custom IC

✔ MPR Discrete

DSP Optoelectronic

1-24



Microprocessor Products

AMD-K6™ MMX Microprocessors—Shipments of AMD’s sixth-generation K6 MMX microprocessor, the secondmember of AMD’s K86 family of superscalar RISC MPUs, began in the second quarter of 1997. The K6 has beendesigned to be competitive in performance with Intel’s forthcoming single-chip version of its Pentium Promicroprocessor, which is expected to be introduced in 1997. The 8.8-million-transistor device is based on AMD’s0.35µm five-layer-metal CMOSCS34 technology. The first versions in the K6 family operate at 166MHz, 200MHz,and 233MHz. A 266MHz version is expected in 2H97. In order to reach 300MHz, AMD plans to migrate the K6 toa 0.25µm process by the end of 1997, at the earliest.

AMD-K5™ Microprocessors—The first member of AMD’s K86 family, the K5 is a fifth-generation alternative toIntel’s Pentium. It is based on 0.35µm CMOS technology and is offered in five speed versions, the PR75, PR100,PR133, PR150, and PR166. The PR nomenclature suggests which specific higher-clock-rate Intel Pentium eachof the members best compete with. Unfortunately, AMD was late in getting its K5 processor to market, and thusdoes not expect it to generate the levels of revenues achieved by the Am486 microprocessor over its product life.

Am5x86 Microprocessors—The 5x86 is said to offer Pentium-class performance using a fourth-generationarchitecture. It is based on a 0.35µm CMOS process and runs at a quadrupled clock rate of 133MHz.

Am486 Microprocessors—AMD’s 486DX4 microprocessors offer clock-tripled performance speeds of up to120MHz and feature “enhanced” power management capabilities.

Embedded Processor Products

For processing/control applications in communications, mobile computing, networking, mass storage, or industrialcontrol systems, AMD offers its E86™ Family of x86-compatible embedded processor products. The E86 familyranges from 16-bit MCUs to 32-bit MPUs, general purpose processors to “PCs on a chip.” The E86 family includesseveral versions of Am186/188 16-bit microcontrollers, Am386SX/DX and AM486DX 32-bit microprocessors,ElanSC300/310 32-bit microcontrollers based on a 386 core, and ElanSC400/410 32-bit microcontrollers basedon a 486 core.

With the success of its E86 family, AMD is putting less emphasis on its venerable 29K™ family of embedded RISCprocessors. AMD will continue to support current product designs and customers using its 29K products.However, development of new 29K devices has been discontinued. AMD cited the high cost of supporting theproprietary architecture as the reason for putting an end to the product line.

Communications, Network, and I/O Products

AMD’s communications and networking products include ICs for public infrastructure, including subscriber lineinterface circuits (SLICs), subscriber line audio-processing circuits (SLACs™), and ISDN controllers; ICs fornetworking, including FDDI chips and PCnet™ Ethernet LAN devices; ICs for data communications, including PCIsmall computer systems interface (SCSI) circuits, serial communications controllers (SCCs), and TAXIchip™devices; and ICs for wireless communications, including CT2 PhoX™ controllers for digital cordless telephonesand PCnet-Mobile devices for wireless LANs.



Non-Volatile Memory Products

Am29Fxxx Flash Memories—5.0V-only sector-erase flash memory devices available in densities ranging from 1Mto 16M. Some devices are available in bare die form.

Am29LVxxx Flash Memories—2.7V-only sector-erase flash memory devices available in densities ranging from 2Mto 8M. Some devices are available in bare die form.

Am29LLxxx Flash Memories—AMD’s new family of “zero-power” flash chips that incorporate new powermanagement circuitry to lower current consumption in sleep mode to only 75nA. The first member of the 2.2V-only sector-erase flash family is an 8M part.

Am28Fxxx Flash Memories—This is the company’s first generation family of 5.0V/12.0V bulk-erase flash memorydevices. They are available in densities ranging from 256K to 2M.

EPROM Products—AMD’s CMOS UV and OTP EPROMs are offered in densities ranging from 64K to 4M. Low-voltage versions are available in 1M and 2M densities.

ExpressROM Products—These are standard EPROM die that are pre-programmed and then encapsulated inplastic packaging before delivery. They are offered in densities ranging from 64K to 8M.

Programmable Logic Products

The PLD products of Vantis include a variety of CMOS and bipolar programmable array logic (PAL) devices and itsline of MACH (Macro Array CMOS High-Density) advanced complex PLDs (CPLDs). See individual profile of VantisCorporation.

Other IC Products

The company’s other IC products include bipolar PROMs and RAMs, FIFO memories, high-performance CMOSand bipolar bus interface devices, transmission line drivers and receivers, and dynamic memory managementcircuits.


AMD is building a $1.9 billion sub-half-micron semiconductor manufacturing facility in Dresden, Germany, for themanufacture of its K86 microprocessors. Groundbreaking took place in the fourth quarter of 1996, withproduction scheduled to start by the end of 1998.

AMD and Fujitsu broke ground in late 1995 on their second joint-venture manufacturing facility in Japan, a $1.2billion fab for the production of flash memories. Initial output is expected in early 1998.

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Advanced Micro Devices Advanced Micro Devices5204 East Ben White Boulevard 5204 East Ben White BoulevardAustin, Texas 78741 Austin, Texas 78741Telephone: (512) 385-8542 Telephone: (512) 385-8542Fab 10 Fab 14Cleanroom size: 22,000 square feet (Class 100) Cleanroom size: 22,000 square feet (Class 10)Capacity (wafers/week): 4,500 Capacity (wafers/week): 3,500Wafer size: 125mm Wafer size: 150mmProcess: CMOS Process: CMOSProducts: PLDs Products: Flash memories, EPROMsFeature size: 0.9µm Feature size: 0.8µm

Advanced Micro Devices Advanced Micro Devices5204 East Ben White Boulevard 901 Thompson PlaceAustin, Texas 78741 Sunnyvale, California 94088Telephone: (512) 385-8542 Telephone: (408) 732-2400Fab 15 Fab 17 and Submicron Development CenterCleanroom size: 22,000 square feet (Class 10) Cleanroom size: 42,500 square feet (Class 1)Capacity (wafers/week): 3,500 Capacity (wafers/week): 2,000Wafer size: 150mm Wafer size: 150mmProcess: CMOS Process: CMOSProducts: Logic, telecom, and network ICs; Products: R&D, MPUs, flash memories MPUs; microperipheral ICs Feature sizes: 0.35µm-0.8µmFeature size: 0.7µm

Advanced Micro Devices AMD Saxony Manufacturing GmbH5204 East Ben White Boulevard Dresden, Saxony, GermanyAustin, Texas 78741 Fab 30Telephone: (512) 385-8542 Cleanroom size: 90,000 square feetFab 25 Capacity (wafers/week): 6,000Cleanroom size: 86,700 square feet (Class 1) Wafer size: 200mmCapacity (wafers/week): 6,000 Process: CMOSWafer size: 200mm Products: MPUs, logic ICs, R&DProcess: CMOS Feature size: 0.25µm (0.18µm capability)Products: MPUs, logic ICs, flash memories (Expected to start production by the end of 1998.)Feature sizes: 0.35µm, 0.5µm (0.25µm capability)



Fujitsu AMD Semiconductor Ltd. (FASL) Fujitsu AMD Semiconductor Ltd. (FASL)Aizuwakamatsu, Fukushima Prefecture, Japan Aizuwakamatsu, Fukushima Prefecture, JapanFASL I FASL IICleanroom size: 69,900 square feet (Class 1) Cleanroom size: 88,000 square feetCapacity (wafers/week): 5,000 Capacity (wafers/week): 6,000Wafer size: 200mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: Flash memories Products: Flash memoriesFeature sizes: 0.35µm, 0.5µm Feature sizes: 0.25µm, 0.35µm (upgrading 0.5µm lines to 0.35µm) (Expected to start production in early 1998.)

AMD’s back-end manufacturing facilities are located in Penang, Malaysia; Bangkok, Thailand; and Singapore. In1996, AMD began the construction of a new assembly and test facility in Suzhou, China.

Key Agreements

• Micron, Motorola, and AMD joined together with DuPont Photomasks Inc. (DPI) in 1996 to form a technologyventure, called DPI Reticle Technology Center, to develop advanced mask technology and provide pilot linefabrication of leading-edge reticles.

• AMD and Intel signed a new five-year cross-licensing agreement in early 1996 that gives the two companiesrights to use each other’s patents and certain copyrights, excluding microprocessor microcode beyond the 486generation.

• Fujitsu and AMD opened a large flash memory fabrication facility, called Fujitsu-AMD Semiconductor Ltd.(FASL), in Japan in September 1994. Production of flash memory chips began in 1Q95. FASL is currentlybuilding its second fab, also to be dedicated to flash memory production. The partnership also involves jointdevelopment of flash devices.

1-28


AMI North American Company Profiles

AMERICAN MICROSYSTEMS (AMI)

American Microsystems, Inc.2300 Buckskin Road

Pocatello, Idaho 83201Telephone: (208) 233-4690

Fax: (208) 234-6795Web Site: www.amis.com

IC Manufacturer


Japan: AMI-Japan • Nerima-ku, Tokyo, JapanTelephone: (81) (3) 5399-7831 • Fax: (81) (3) 5399-7834

Europe: AMI-GmbH • Dresden, GermanyTelephone: (49) (351) 31-99-1500 • Fax: (49) (351) 31-99-1501


1992 1993 1994 1995 1996

Sales 135 150 171 221 256

Employees 1,685 1,657 1,265 1,265 1,439


Established in 1966, American Microsystems Inc. (AMI) was a pioneer in the development of application specificICs (ASICs). Today, the company's products and services range from digital and mixed-signal ASICs, to CMOSfoundry services, application-specific standard products (ASSPs), and high-level integrated solutions throughmultichip modules. AMI currently specializes in producing both digital and mixed-signal systems on a chip and isthe number one U.S. manufacturer of mask ROMs.

The company is comprised of three business units and two divisions: the Mixed-Signal Business Unit, the DigitalASIC Business Unit, the Foundry Business Unit, the Standard Products Division, and the Multichip ProductsDivision, which specializes in contract manufacturing solutions utilizing multichip modules. Each of the five unitshas the responsibility, along with the marketing and engineering resources needed, to sell its respective productsand services.

Recently, AMI's sales strategy underwent a significant shift from a primary focus on direct sales to increasedreliance on the company's growing international network of manufacturer's representatives, distributors, anddesign centers. This network markets AMI's cell-based and gate array ASICs as well as its ROMs.


North American Company Profiles AMI

Foundry34%

Gate Array31%

StandardProducts

9%

Mixed Signal16%

Multichip Products

1%

1996 Sales by Business Segment

Standard Cell9%

In 1997, AMI released several wireless IC devices targeting the direct sequence spread spectrum (DSSS) ICmarket. The three devices include a transceiver, receiver-only, and a transmit-only device, and are designed forvarious applications including security systems and remote medical devices.

Also during 1997, AMI acquired Focus Semiconductor, which is located in Gwynedd, Pennsylvania. FocusSemiconductor is a mixed-signal IC vendor who has used AMI as a foundry in the past. Focus will be folded intoAMI as a separate business unit and remain in Pennsylvania.

AMI's products serve markets such as telecommunications, consumer electronics, computer peripherals, military,industrial, and automotive equipment.


Communications32%Consumer

11%EDP23%

Military14%

Automotive6%

Industrial9%

Other1%

Medical4%

North America95%

Japan1%Europe

3%

ROW1%


1-30


AMI North American Company Profiles

Management

Gerald "Jerry" E. Homstad President and Chief Executive OfficerHarold Blomquist Senior Vice President, Business OperationsRandy Cook Vice President, Multichip Products DivisionPaul Pimentel Vice President, Finance/PurchasingTom Schiers Vice President, Digital ASICsDan Schroeder Vice President, OperationsBob Smith Vice President, Standard Products DivisionGrant Hulse Director, New Business DevelopmentChris Laytun Director, Mixed-SignalAl Morrison Director, FoundryTroy Murray Manager, Site ServicesJohn Rankin Manager, Japanese and Southeast Asian SalesMarv Yancey Manager, Sub-Micron Program


AMI offers the following products and services:

• Standard-cell and gate array digital ASICs• Mixed-signal ASIC development services• Mask programmable ROMs (16K to 16M density)• Digital and mixed-signal ASIC design software• Wireless ICs (include mask programmable system devices)• Foundry services• Contract design and manufacturing• Multichip modules• Custom packaging

AMI's digital ASIC standard library, which supports both gate arrays and standard cells, contains over 500 cells andoperates from 2.5V to 5.5V. The company’s arrays have up to 464,000 usable gates.

AMI's mixed-signal processes allow the analog voltage to run from –5V to +5V or from 0V to 12V, and willaccommodate a wide range of functions.

The company's semiconductor products are fabricated using CMOS and NMOS process technologies, withgeometries as fine as 0.35µm.


North American Company Profiles AMI


AMI AMI2300 Buckskin Road Pocatello, IdahoPocatello, Idaho 83201 Fab 10Cleanroom size: 33,000 square feet (Class 10) Cleanroom size: 40,000 square feet (Class 1)Capacity (wafers/week): 6,500 Capacity (wafers/week): 5,000Wafer size: 125mm Wafer size: 200mmProcesses: CMOS, NMOS Process: CMOSProducts: ASICs, ROMs, telecom and datacom ICs, Feature sizes: 0.35µm-0.8µm

MCMs, foundry services (Operations began in mid-1997)Feature sizes: 0.6µm-5.0µm CMOS;

3.0µm-5.0µm NMOS

AMI's facility in the Philippines performs sort and final testing, while assembly work is contracted out.

Key Agreements

• AMI has an alliance with WSI Inc. to jointly develop mask-programmable versions of WSI's line of microcontrollerperipherals and both companies are separately marketing the complete range of devices. AMI is manufacturingthe parts.

1-32


Anadigics North American Company Profiles

ANADIGICS

Anadigics, Inc.35 Technology Drive

Warren, New Jersey 07059-5197Telephone: (908) 668-5000

Fax: (908) 668-5068Web Site: www.anadigics.com

IC Manufacturer


Europe: Anadigics, Inc. • Somerset, EnglandTelephone: (44) (1935) 822611 • Fax: (44) (1935) 826696


1992 1993 1994 1995 1996

Sales 20 29 35 51 69Net Income (2) 2 2 7 12R&D Expenditures 5 7 9 12 12Capital Expenditures 2 5 9 16

Employees 115 200 270 320 430


Anadigics was founded in 1985 when it initiated macrocell development. A year later, it completed construction ofits wafer fab, and in 1987, started GaAs IC production with the introduction of both MMIC and fiber optic ICproducts. Today, the company is a leading designer and producer of GaAs ICs for high-volume, high-frequencyreceiver applications. The company launched its initial public offering in April 1995.

The company had originally relied on defense contracts to survive. However, with lucrative military pacts becomingmore of a rarity, Anadigics looked to the commercial and consumer electronics marketplaces to sell its products.Today, Anadigics has established itself as a leading supplier of high-volume, low-cost, high-performance analogGaAs ICs for applications including direct broadcast satellite (DBS) systems, cable TV systems, cellular phones,fiber optic communications, and personal communication systems (PCS).


North American Company Profiles Anadigics

Fiber Optics/ATM17%

Engineering Services5%

Cable TV20%


Wireless35%

DirectBroadcast Systems

23%

Europe36%

Asia-Pacific29%

North America 35%


Management

Ron Rosenzweig President and Chief Executive OfficerGeorge Gilbert Executive Vice President and Chief Operating OfficerCharles Huang, Ph.D. Executive Vice President, Market Research and Business DevelopmentJohn F. Lyons Senior Vice President and Chief Financial OfficerRobert Baytuns Vice President, Research and TechnologySheo Khetan Vice President, ManufacturingJaved S. Patel Vice President, Marketing and SalesPhillip Wallace Vice President, Product Development


Among the company's GaAs IC products are low-noise block converters and tuners for DBS systems, upconverterchips for use in cable TV converters, cellular telephone power amplifiers and receivers, and fiber optic (SONET)transimpedence amplifiers. Anadigics produces all of its ICs using its GaAs MESFET process.


In October 1996, the company began to convert its existing fab from 3in to 100mm wafers and expects tocomplete the conversion by the end of 1997. The company is also in the process of constructing an additionalfacility for both manufacturing and administration purposes. The building, also located in Warren, New Jersey, willhouse a 12,000 square-foot Class 100 cleanroom that will manufacture 100mm GaAs wafers. Production at thenew facility is not expected to begin before 4Q97.

Anadigics, Inc. Anadigics, Inc.35 Technology Drive 141 Mt. Bethel RoadWarren, New Jersey 07059-5197 Warren, New Jersey 07059Cleanroom size: 8,000 square feet (Class 100) Cleanroom size: 12,000 square feet (Class 100)Capacity (wafers/week): 500 Capacity (wafers/week): 500Wafer size: 100mm Wafer size: 100mmProcess: GaAs MESFET Process: GaAs MESFETFeature size: 0.5µm (Production to begin in late 1997 or early 1998.)

1-34


Analog Devices North American Company Profiles

ANALOG DEVICES (ADI)

Analog Devices, Inc.One Technology Way

P.O. Box 9106Norwood, Massachusetts 02062-9106

Telephone: (617) 329-4700Fax: (617) 326-8703

Web Site: www.analog.com

IC Manufacturer


Europe: Analog Devices, GmbH • Munich, GermanyTelephone: (49) (89) 57005-0 • Fax: (49) (89) 57005-527

Japan: Analog Devices, K.K. • Minato-ku, Tokyo, JapanTelephone: (81) (3) 5402-8210 • Fax: (81) (3) 5402-1063

Asia-Pacific: Analog Devices Hong Kong, Ltd. • Hong KongTelephone: (852) 2506-9336 • (852) 2506-4755

Financial History ($M), Fiscal Year Ends October 31

1992 1993 1994 1995 1996

Sales 567 666 773 942 1,194Net Income 15 44 74 119 172R&D Expenditures 88 94 107 134 178Capital Expenditures 66 67 91 213 234Foundry Fab Investment — — — 14 49

Employees 5,200 5,300 5,400 6,000 6,900


Analog Devices, Inc. (ADI) was founded in 1965 and is today a leading designer and manufacturer of high-performance linear, mixed-signal, and digital integrated circuits that address a wide range of real-world signalprocessing applications.

The company's products are typically incorporated by OEMs in equipment and systems for a variety ofapplications, including communications equipment; computers and computer peripherals; engineering, medical,and scientific instruments; factory automation equipment; military/aerospace systems; high-end consumerelectronic products; and automotive equipment.


North American Company Profiles Analog Devices

North America42%

Europe31%

Japan14%


ROW13%

Analog Devices’ products can be divided into three groups: general purpose, standard-function linear and mixed-signal ICs (SLICs), including amplifiers and data converters; system-level ICs, including general-purpose digitalsignal processors (DSPs), special-purpose linear and mixed-signal ICs, and hard disk drive ICs; and assembledproducts such as hybrids and multichip modules. Integrated circuits accounted for 95 percent of the company'stotal revenues in fiscal 1996.

StandardLinear ICs

57%

System-Level ICsand DSP ICs

38%

Assembled Products5%


ADI's strategy is to focus on major opportunities for DSPs and system-level ICs as its primary sources of revenuegrowth, while at the same time, continuing its efforts to sell traditional SLIC product lines. Revenues from thecompany’s assembled products group has been declining for several years, primarily due to shrinking demand forhybrid devices.

In addition, the company plans to continue to extend its core technologies to include new technologies, such asRF/IF signal processing for wireless communications applications and surface micromachining for automobile airbag system accelerometers. To support its move into the wireless communications market, Analog Devicesacquired RF/IF circuits designer Mosaic Microsystems Ltd. of Kent, England, and its U.S. subsidiary Mosaic, Inc. inmid-1996.

1-36



Management

Ray Stata ChairmanJerald G. Fishman President and Chief Executive OfficerRoss Brown Vice President, Human ResourcesDennis Buss Vice President, Technology DevelopmentDavid D. French Vice President and General Manager, Computer Products DivisionRussell K. Johnsen Vice President and General Manager, Communications DivisionRobert R. Marshall Vice President, Worldwide ManufacturingRobert McAdam Vice President and General Manager, Standard Linear Products DivisionBrian P. McAloon Vice President, SalesJoseph E. McDonough Vice President, Finance, and Chief Financial OfficerJoe Reichbach Vice President, Sales, North AmericaVolkmar Schaldach Vice President, Sales and Marketing, EuropeShozo Sugiguchi Vice President, Sales and Marketing, JapanH. Goodloe Suttler Vice President, Marketing, Quality, and PlanningGeoffrey R.M. Thomas Vice President and Manufacturing General Manager, ADSCFranklin Weigold Vice President and General Manager, Transportation and

Industrial Products Division


Analog Devices offers high-performance linear, digital, and mixed-signal ICs such as data converters, amplifiers,voltage references and comparators, signal processors and conditioners, application-specific ICs for theconsumer, disk drive, telecommunications, and automotive industries, and temperature and accelerometersensors.

SLICsAnalog Devices principal SLIC products are high-performance amplifiers and data converters. Other SLICproducts include analog signal processing devices, voltage references, and comparators. High-speedproducts introduced in 1996 included the company’s first RF and IF SLICs, which operate at up to 2GHz. Thecompany continues to expand its SLIC product line to include offerings in areas where it traditionally has hadlimited focus, primarily interface circuits and power management ICs, and to include a much larger number ofproducts designed to operate from single-supply 3-volt or 5-volt power sources.

System-Level ICsADI’s system-level ICs include general-purpose DSPs and multi-function devices that feature high levels offunctional integration on a single chip. All of the company’s DSPs share a common architecture and codecompatibility. The company is aggressively pursuing the 32-bit floating-point DSP market with its line ofSHARC™ products. In early 1997, its first low-priced SHARC DSP was announced. The ADSP-21061features high performance of 120 MFLOPS, 1M of on-chip dual-port SRAM, and 240 Mbytes/sec I/Obandwidth.

Most of the company’s other system-level ICs are mixed-signal devices (with some incorporating a DSP core)and special-purpose linear ICs generally designed to meet the needs of a specific application. The companyalso offers sensors and surface micromachined ICs.



Assembled ProductsThe company’s assembled products consist of hybrids, multichip modules (MCMs), and printed-board modules(primarily I/O modules used in industrial control and factory automation equipment).

In addition to utilizing standard bipolar and CMOS process technologies, ADI employs a number of proprietaryprocesses specifically tailored for use in manufacturing high-performance linear and mixed-signal SLICs andsystem-level ICs.


Analog Devices meets most of its need for wafers fabricated using linear and mixed-signal processes withcompany-owned production facilities and uses third-party wafer fabricators for most wafers that can be producedon industry-standard digital processes. Its two principal foundries are Taiwan Semiconductor Manufacturing(TSMC) and Singapore’s Chartered Semiconductor Manufacturing.

During 1995 and 1996, Analog Devices expanded its relationships with TSMC and Chartered in response to therapid growth of its systems IC business. These transactions included an equity investment in Chartered,advanced payments to both Chartered and TSMC in order to secure access to future wafer capacity, and mostsignificantly, the announcement of a joint venture agreement with TSMC and other investors to construct andoperate a fab facility in Camas, Washington. ADI agreed to invest $140 million in the joint venture, calledWaferTech, in return for an 18 percent equity ownership and up to 27 percent of the plant’s total output.

Recent expansions of company-owned fabs have included the conversion of its Wilmington, Massachusetts,fabrication facility from 100mm to 150mm wafer production for high-speed linear devices. In addition, ADI isupgrading and modernizing the fab in Sunnyvale, California, it acquired from Performance Semiconductor in1995. Production at the fab was scheduled to begin in late 1996, but was delayed because of the slowdown inthe market.

In 1996, Analog Devices established a wafer fabrication facility in Cambridge, Massachusetts, dedicated to thedevelopment and production of the company’s surface micromachined ICs. The fab is located in a buildingpreviously used by Polaroid Corporation as an R&D fab.

Analog Devices, Inc. Analog Devices, Inc.Semiconductor Division PMI Division804 Woburn Street 1500 Space Park DriveWilmington, Massachusetts 01887 Santa Clara, California 95052Cleanroom size: 34,000 square feet Capacity (wafers/week): 1,750Capacity (wafers/week): 2,500 Wafer size: 100mmWafer sizes: 100mm, 150mm Processes: CMOS, BiCMOS, bipolarProcesses: CMOS, BiCMOS, bipolar Products: Linear and mixed-signal ICsProducts: Linear and mixed-signal ICs, DSPs, ASICs Feature size: 1.5µmFeature sizes: 1.0µm CMOS

1.5µm BiCMOS, bipolar4.0µm BiCMOS, complementary bipolar

1-38



Analog Devices, Inc. Analog Devices Ireland, Ltd.610 East Weddell Drive Bay F-1, Raheen Industrial EstateSunnyvale, California 94089 Limerick, IrelandCleanroom size: 20,000 square feet Cleanroom size: 15,000 square feetCapacity (wafers/week): 3,500 Capacity (wafers/week): 7,000Wafer size: 150mm Wafer sizes: 100mm, 150mmProcesses: BiCMOS, complementary bipolar Processes: CMOS, BiCMOSProducts: Linear ICs Products: Linear and mixed-signal ICs, ASICs(Acquired from Performance Semiconductor in 1995) Feature sizes: 0.6µm, 1.0µm, 2.0µm

WaferTech, LLCCamas, WashingtonCapacity (wafers/week): 7,500Wafer size: 200mmProcess: CMOSProducts: FoundryFeature sizes: 0.25µm, 0.35µm(Joint venture between TSMC, Analog Devices, Altera,and ISSI. ADI owns 18 percent. Scheduled to beginoperations in late 1998.)

Analog Devices has its own test and assembly facilities located in California, Massachusetts, North Carolina,Ireland, the Philippines, and Taiwan.

Key Agreements

• In early 1997, Analog Devices licensed TEMIC Semiconductors its ADSP-21020 DSP architecture. TEMIC willbuild radiation-tolerant versions of the high-performance 32-bit floating-point DSP.

• ADI licensed its ADSP-21xx 16-bit digital signal processor core to AMD and Acer Laboratories (Taiwan) in early1996. AMD will embed the core in communications-related ICs and Acer Labs will use it for future PC telephonyand telephone-answering devices.

• Analog Devices announced a license agreement with Hitachi in February 1996 for Hitachi’s 16-bitmicroprocessor H8/300H core. ADI also has the option of licensing Hitachi’s next-generation H8S/2000 core.The core will be used by ADI’s Wireless Communications Division.

• In early 1996, Aspec Technology licensed to Analog Devices its high-density ASIC architectures. Theagreement includes Aspec’s family of embedded array and standard cell architectures, as well as associateddesign tools.

• Analog devices entered an agreement with Noise Cancellation Technologies Inc. (NCT) to provide design andfoundry services for NCT's first line of custom chipsets.



• Analog Devices is working with DSP Group to provide DSP Group's TrueSpeech voice compressiontechnology on ADI's digital signal processors.

• Analog Devices has an alliance with IBM in the joint design, production, and marketing of mixed-signal and RFICs based on IBM's silicon-germanium (SiGe) process technology.

• Analog Devices is developing surface micromachined accelerometers with Delco Electronics and Lockheed-

Martin for both defense and commercial applications.

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Array Microsystems North American Company Profiles

ARRAY MICROSYSTEMS

Array Microsystems, Inc.1420 Quail Lake Loop

Colorado Springs, Colorado 80906Telephone: (719) 540-7900

Fax: (719) 540-7950

Fabless IC Supplier

Employees 41


Array Microsystems, a privately-held company, was founded in 1990 to design, develop, and market high-performance digital signal processing (DSP) products with a focus on video compression technologies andsystem level designs for multimedia applications. Array’s mission is to become the leading supplier of optimumperformance, low-cost digital video chipset solutions for consumer and professional markets.

Management

Surendar S. Magar, Ph.D. President and Chief Executive OfficerTom Kopet Vice President, Systems TechnologyMatt Ready Vice President, SalesE. Flint Seaton Vice President and Chief Financial OfficerShannon Shen, Ph.D. Vice President, IC TechnologyDavid W. Still Vice President, EngineeringRoger Westberg Vice President, Marketing


Array Microsystems has developed a complete line of processor and controller ICs, SRAM memory modules,software simulators, and processor boards. The company's first product family, the a66, includes proprietary VLSIchipsets, development tools, and array processor boards that set industry performance standards for frequencydomain processing. Array's two-chip video compression chipset, based on unique vector data flow architecture,forms the core of the VideoFlow product family. One of the chips is called an image compression coprocessor(ICC) and the other a motion estimation coprocessor (MEC).


Array Microsystems is a fabless IC supplier. The company's devices are produced by other companies, includingSamsung and Atmel.


North American Company Profiles Array Microsystems

Key Agreements

• Array Microsystems has a technology development pact with Samsung that provides Array with a strongfoundry partnership. The two companies codeveloped the initial VideoFlow video compression technology.The deal provides Array with access to Samsung's advanced 0.5µm and 0.35µm CMOS fab capacity for themanufacture of its products. In 1993, Samsung secured a 20 percent equity ownership position in ArrayMicrosystems, and in mid-1995, Samsung increased its stake to 37 percent.

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Atmel North American Company Profiles

ATMEL

Atmel Corporation2325 Orchard Parkway

San Jose, California 95131Telephone: (408) 441-0311

Fax: (408) 436-4200Web Site: www.atmel.com

IC Manufacturer


Japan: Atmel Japan K.K. • Chuo-ku, Tokyo, JapanTelephone: (81) (3) 5641-0211 • Fax: (81) (3) 5641-0217

Europe: Atmel U.K. Ltd. • Camberley, Surrey, EnglandTelephone: (44) (1276) 686677 • Fax: (44) (1276) 686697

Asia-Pacific: Atmel Asia, Ltd. • Kowloon, Hong KongTelephone: (852) 2721-9778 • Fax: (852) 2722-1369


1992 1993 1994 1995 1996

Sales 140 222 375 634 1,070Net Income 14 30 59 114 202R&D Expenditures 18 26 43 70 110Capital Expenditures 14 74 183 270 400

Employees 998 1,250 1,900 2,900 3,900


Atmel designs, manufactures, and markets a broad array of high-performance CMOS memory, logic, and analogintegrated circuits. Founded in 1984, the company serves the manufacturers of communications equipment,computers, and computer peripherals as well as producers of instrumentation, consumer, automotive, military, andindustrial equipment. Much of Atmel's ICs are based on its proprietary non-volatile memory technology. Thecompany's name was derived from Advanced technology: memory and logic.


North American Company Profiles Atmel

Telecommunications40%Consumer

15%Computer

Peripherals25%


Networking10%

Military10%

NorthAmerica

39%

Asia22%

Europe20%


Japan19%

Atmel is a leading supplier of EPROM, EEPROM, and flash memory components. Nevertheless, the company isshifting its focus away from being primarily a memory company toward having a balanced portfolio of memory andlogic products. Still, the company hopes to continue expanding its share of the memory market even as logicproducts take over a larger share of its production capacity.

EPROM21%

MPR15% In-System

ProgrammableNon-VolatileMemories*

42%Logic(PLD, FPGA, ASIC)

22%

1996 Sales by Device Type*Flash and EEPROMs

Atmel has made several acquisitions over the past few years in support of its core product lines, non-volatilememory and logic ICs. The company bought out FPGA supplier Concurrent Logic in 1993, acquired SeeqTechnology's EEPROM product line in early 1994, and made a minority investment in SRAM producer ParadigmTechnology in 1995 in return for certain SRAM product rights. In 1996, Atmel acquired an 8-bit RISCmicrocontroller architecture and design team from Nordic VLSI in Trondheim, Norway. Also in 1996, the companyacquired DSP architecture and development from an organization called TSMC in Berkeley, California.

The company’s most substantial acquisition came in April 1995, when it purchased a majority interest (75 percent)in the French IC manufacturer ES2. By the end of 1995, Atmel increased its ownership of the company to morethan 90 percent and renamed it Atmel-ES2. Atmel is expanding Atmel-ES2’s existing fab facility and isconstructing a new 0.35µm, 200mm wafer fab at the site that will be operational by late 1997.

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Management

George Perlegos Chairman, President, and Chief Executive OfficerGust Perlegos Executive Vice President and General ManagerTsung-Ching Wu Executive Vice President, TechnologyBernard Pruniaux Chief Executive Officer, Atmel-ES2 OperationsChih Jen Senior Vice President and General Manager, Asian OperationsRalph Bohannon Vice President, ManufacturingKris Chellam Vice President, Finance and Administration, and Chief Financial OfficerJames Hu Vice President, Process DevelopmentB. Jeffrey Katz Vice President, MarketingKen Kwong Vice President, North American SalesKrish Panu Vice President, MCU, PLD, FPGA OperationsJack Peckham Vice President and General Manager, ASIC OperationsSteve Schumann Vice President, Non-Volatile ProductsMikes Sisois Vice President, Planning and Information SystemsGraham Turner Vice President, European OperationsTashiki Wada Vice President, Atmel Japan


Atmel's products are outlined below.

NonVolatile Memory ICs• EPROMs—Standard, high-speed, and low-voltage parts ranging in density from 256K to 8M.• EEPROMs—Serial-interface parts ranging in density from 1K to 256K.

—Parallel-interface parts ranging in density from 4K to 4M.• Flash memories—Single voltage supply (5V or 2.7V) parts ranging in density from 256K to 8M.

Programmable Logic Devices and Field Programmable Gate Arrays• PLDs—Generic PAL-type ICs including fast, low-power, and 3V flash-based versions of the standard

22V10, 16V8, and 20V8. —Complex PLDs with densities to 5,000 gates.

• FPGAs—SRAM-based devices with 2,000 to 40,000 usable gates and very low power. Partial or full reconfiguration, in system, during normal operation.

ASIC Devices• Gate arrays—High speed with up to 1.2 million routable gates.• RFID ASICs—Analog, digital, and memory on a single-chip ASIC.• Cell based ASICs—Mixed-technology.

Other Products• Microcontrollers—Combine Intel's 80C51 core logic or Atmel’s proprietary AVR 8-bit RISC core logic with 1K, 2K, 4K or 8K of Atmel's flash memory.

• Standard logic devices—Multimedia system, controllers/chipsets.• Flash memory cards.• Spread spectrum cordless phone chipset.


North American Company Profiles Atmel


Atmel announced plans to build its next sub-half micron CMOS wafer fab facility, to be called Fab 8, adjacent to itsexisting Colorado Springs, Colorado facilities. The facility will house a 75,000 square-foot cleanroom.

Atmel Corporation Atmel Corporation1150 East Cheyenne Mountain Boulevard 1150 East Cheyenne Mountain BoulevardColorado Springs, Colorado 80906 Colorado Springs, Colorado 80906Telephone: (719) 567-3300 Telephone: (719) 567-3300Fab 3 Fab 5Cleanroom size: 33,900 square feet (Class 10) Cleanroom size: 43,000 square feet (Class 1)Capacity (wafers/week): 5,000 Capacity (wafers/week): 9,000Wafer size: 150mm Wafer size: 150mmProcesses: CMOS, BiCMOS Process: CMOSProducts: EEPROMs, EPROMs, flash memories, Products: EEPROMs, flash memories, EPROMs

PLDs, FPGAs, ASICs, MCUs, linear ICs Feature size: 0.4µmFeature sizes: 0.6µm, 0.8µm, 1.0µm

Atmel-ES2 Atmel-ES2Zone Industrielle Zone Industrielle13106 Rousset Cedex 13106 Rousset CedexFrance FranceTelephone: (33) (4) 42-33-40-0 Telephone: (33) (4) 42-33-40-0Fab 6 Fab 7Cleanroom size: 15,000 square feet Cleanroom size: 60,000 square feetCapacity (wafers/week): 2,000 Capacity (wafers/week): 7,000Wafer size: 150mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: Cell-based ASICs, MCUs Products: Cell-based ASICs, MCUsFeature sizes: 0.6µm, 0.8µm, 1.0µm Feature sizes: 0.35µm, 0.6µm

(Scheduled to start production by 3Q97)

Atmel maintains a facility for IC test and qualification at its headquarters in San Jose and assembly work isperformed offshore.

Atmel uses proprietary CMOS and BiCMOS technologies for the processing of its chips. Most products areproduced with 0.6µm and 0.5µm line widths. The company's newest Colorado Springs fab facility is capable ofproducing ICs with 0.35µm feature sizes, as is the not yet commissioned fab in Rousset, France.

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Key Agreements

• Atmel licensed “Oak” and “Pine” DSP core logic and development tools from DSP Group in 1996.

• Atmel-ES2 licensed from Advanced RISC Machines in mid-1995, the ARM7DMI 32-bit RISC processor coreand associated software tools. The company will develop standard Flash-based MCUs using this architecture.

• Atmel and Paradigm Technology formed an alliance in May 1995 concerning Paradigm's SRAM products.Atmel provides manufacturing capacity for Paradigm's SRAMs in exchange for product rights. Atmel alsopurchased approximately 19 percent of Paradigm. The companies are developing new-generation SRAMswith speeds below 8ns.

• Atmel has a cross-licensing and product exchange agreement with Philips Semiconductors covering several ofeach company's proprietary PLDs.

• Atmel established an agreement with Wireless Logic Inc. of Hong Kong in 1994 that calls for thecodevelopment and joint marketing of special-purpose DSP and microcontroller chipsets for the spread-spectrum wireless communications market.

• Fuji Film Microdevices and Atmel are collaborating in the development of flash memory-based products such asATA-interface memory cards.


North American Company Profiles Austin Semiconductor

AUSTIN SEMICONDUCTOR

Austin Semiconductor, Inc.8701 Cross Park Drive

Austin, Texas 78754-4566Telephone: (512) 339-1188

Fax: (512) 339-6641Web Site: austinsemi.com

Fabless IC Supplier


1993 1994 1995 1996

Sales 7 14 19 21

Employees 60 110 114 150


Austin Semiconductor, Inc. (ASI) was founded in 1988 to supply high-reliability semiconductors and microcircuitdevices to the military and aerospace industries. In 1993, privately-held ASI acquired the Micron SemiconductorMilitary Products Group, and now supplies standard memory chips to those industries.

The company's business is currently divided into two distinct groups: a custom product line and a standardproduct line (consisting primarily of the former Micron products). At the end of 1996, about 70 percent of ASI'sbusiness was in memory products, with the balance in custom products.

Management

Roger C. Minard President and Chief Executive OfficerH. Donald Ludwig Vice President and General Manager, OperationsMarty Lanning Vice President, MarketingEd Walker Director, Sales


ASI's standard IC products include: 64K to 16M DRAMs, 64K to 4M SRAMs, and 1M VRAMs, as well asEEPROMs, flash memories, and SCSI interface processors. ASI also has the right to introduce military-gradeversions of Micron's new products as they are brought out.

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Austin Semiconductor North American Company Profiles

ASI's custom product capabilities include testing and packaging of a wide array of custom memory products,including DRAMs, SRAMs, EEPROMs, and flash memories, interface devices, and analog/digital communicationsproducts. ASI also offers devices manufactured using a silicon-on-sapphire (SOS) process.


ASI is a fabless IC supplier, but maintains a Class 100 assembly, packaging, and test facility on site. As part of itspurchase of Micron's military products group, ASI receives wafers from Micron. The firm also uses other majormanufacturers for the fabrication of its product wafers.


North American Company Profiles Benchmarq

BENCHMARQ MICROELECTRONICS

Benchmarq Microelectronics, Inc.17919 Waterview Parkway

Dallas, Texas 75252Telephone: (972) 437-9195

Fax: (972) 437-9198Web Site: www.benchmarq.com

Fabless IC Supplier


1994 1995 1996

Sales 23 29 40Net Income 2 4 7R&D Expenditures 2 3

Employees 180 235


Benchmarq Microelectronics, founded in 1989, has a worldwide presence in the power-sensitive and portableelectronic systems marketplace. It provides integrated IC and module solutions that address real-world problemsin managing battery-operated, low-power, and power-sensitive equipment. Benchmarq's products are adoptedby companies producing PCs, cellular phones, telecommunications equipment, and portable electronics systems.

In 1996, international sales accounted for approximately two-thirds of total sales.

Management

Derrell Coker ChairmanAl Schuele President and Chief Executive OfficerWallace E. Matthews Chief Technical OfficerWill Davies Vice President, Manufacturing and Product DevelopmentReginald McHone Vice President, Finance and Administration, and Chief Financial OfficerJim Vernon Vice President, SalesGene Armstrong Director, Product Development—Communication and Consumer ComponentsDavid Freeman Director, Product Development—Industrial and Intelligent PeripheralsDavid Heacock Director, Marketing and Corporate CommunicationsLoren Reifsteck Director, Quality Technology and AssuranceEric Smith Director, Manufacturing Operations

1-50


Benchmarq North American Company Profiles


Benchmarq's product portfolio consists of CMOS and BiCMOS mixed-signal circuits. The focus is on low-power,battery-backed ICs and ICs for battery management. Geometries on its devices range from 0.8µm to 1.2µm.

Benchmarq’s IC product families include:• Battery management ICs and modules that provide fast charge control, sophisticated battery conditioning, and

“gas gauge” capacity monitoring of many different types of battery-operated systems.• Real-time clock ICs and modules, which provide highly integrated clock/calendar solutions for microcomputer-

based designs. The RTCs are available with 3V or 5V operation.• Nonvolatile SRAM (nvSRAM) and PSRAM (nvPSRAM) ICs in densities ranging from 64K to 16M.• Nonvolatile controller ICs and modules that provide power monitoring, write protection, and supply switching to

convert standard SRAM and a battery backup into a reliable, predictable nonvolatile memory.


The company is fabless, relying instead on domestic and overseas foundries for wafer fabrication. Burn-in and testof ICs and value-added assembly of hybrid circuits is performed at the company's headquarters in Texas.


North American Company Profiles Burr-Brown

BURR-BROWN

Burr-Brown CorporationP.O. Box 11400

Tucson, Arizona 85734-1400Telephone: (602) 746-1111

Fax: (602) 889-1510Web Site: www.burr-brown.com

IC Manufacturer


Japan: Burr-Brown Japan Ltd. • Atsugi-shi, Kanagawa, JapanTelephone: (81) (4) 6248-4695


1992 1993 1994 1995 1996

Sales 163 169 194 269 220Net Income 1 3 6 29 30R&D Expenditures 18 20 22 26 28Capital Expenditures 5 7 12 18 32

Employees 1,566 1,547 1,825 1,900 1,400


Founded in 1956, Burr-Brown Corporation is primarily engaged in the design, manufacture, and marketing of abroad line of proprietary standard high-performance analog and mixed-signal ICs used in the processing ofelectronic signals. The company’s products are used in applications such as electronic and medicalinstrumentation, process and industrial control, communications, manufacturing automation, automatic testequipment, consumer audio, computer peripherals, and multimedia.

Burr-Brown is moving away from its traditional focus on older IC processing technologies—primarily linear bipolar—and instead going in new directions such as CMOS and BiCMOS technologies. The company has also beenstrategically shifting some of its production to outside foundries, a trend that is expected to continue in order toaccess sub-micron CMOS technology.

In early 1996, Burr-Brown sold its interest in Power Convertibles Corporation (PCC). PCC, formerly a majority-owned affiliate of Burr-Brown, manufactures DC-to-DC converters and battery chargers used in cellular telephoneapplications. The divestiture of PCC is part of Burr Brown’s strategic plan to build a stronger focus on its analogand mixed-signal IC business. New product development will focus on developing standard linear ICs (SLICs) aswell as application-specific standard products (ASSPs).

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Burr-Brown North American Company Profiles

Digital Audio andVideo20%

Test andInstrumentation

25%

Industrial andProcess Control

30%

1996 Sales by Application

Communications15%

Computer andMultimedia

6%

Other4%


Analog ICs47%Data Conversion ICs

46%

Other 7%

In 1995, Burr-Brown set new directions for its foreign operations. Burr-Brown’s Japanese development subsidiaryis now concentrating primarily on the digital audio and other consumer markets, while the company’s LivingstonScotland operations has been re-directed from subcontract manufacturing to in-house product R&D.

North America34%

Europe26% Asia

40%


Management

Thomas R. Brown, Jr. ChairmanSyrus P. Madavi President and Chief Executive OfficerScott Blouin Vice President and Chief Financial OfficerMichael Paugh Vice President, QualityMichael M. Pawlik Vice President, MarketingPaul Prazak Vice President, Data Conversion DivisionRobert E. Reynolds Vice President, OperationsBryan Rooney Vice President, Worldwide SalesR. Mark Stitt Vice President, Linear DivisionCharles Lewis General Manager, Scotland DivisionToshiyuki Yamasaki President, Japan Operations


North American Company Profiles Burr-Brown


Burr-Brown's product portfolio includes operational, instrumentation, power, and isolation amplifiers,optoelectronic ICs, digital audio devices, digital-to-analog and analog-to-digital converters, data communicationsproducts, LAN products, microterminals, design and development software, and board-level microcomputersubsystems. The company’s products are manufactured using processes that include bipolar, complementarybipolar, CMOS, and BiCMOS.

The following describes the various processes that Burr-Brown utilizes in the manufacture of its ICs.

40 Volt Bipolar Process:This is a high-voltage (40V) bipolar process (±15V or 36V power supplies) used to make high-voltageoperational and instrumentation amplifiers. High precision in these products is made possible by the capabilityof ion implanted JFETs and trimmable resistors. Other typical products made from this process are universalactive filters, isolation amplifiers, and high-voltage power amplifiers.

20 Volt Bipolar Process:This is a lower voltage (20V) bipolar process especially suited for data acquisition and PCM components.These are faster circuits utilizing smaller devices with lower Rc. Trimmable resistors allow high precisionproducts.

Dielectrically Isolated Bipolar Process:This is a dielectrically isolated high-voltage bipolar (40V) process used for low noise, high precision, and lowdrift. Very high-performance amplifiers are built using this process where the noise and drift characteristics areimportant, especially in the medical equipment markets that it serves.

Complementary Bipolar Dielectrically Isolated Process:This is a dielectrically isolated process with complementary NPN and PNP bipolar transistors. It is used tomanufacture high-voltage operational amplifiers, voltage-to-frequency converters, and sample/hold circuits.

CMOS Double-Level Metal Poly-Poly Process:This is a 3.0µm double-level metal CMOS process that also makes use of parasitic bipolar devices. This is a ±5Vprocess with compatible thin-film resistors and very high quality poly-poly capacitors. It produces high density,high precision (16-bit and 18-bit) single and dual analog-to-digital and digital-to-analog converters.

BiCMOS Process:This double-poly, double-metal 3.0µm process is optimized for analog circuitry including critical thin-film resistorcapability. The process is primarily used for data conversion products.

Processes not available internally are sourced from various foundries, including Lucent Technologies, MitelSemiconductor, Oki, Hualon Microelectronics, and Taiwan Semiconductor Manufacturing Co. (TSMC). Suchprocesses include 2.0µm, 1.2µm, and 0.6µm BiCMOS and CMOS processes, and a very high-frequency bipolarprocess for products such as video amplifiers.

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Burr-Brown North American Company Profiles


Burr-Brown Corporation6730 South Tucson BoulevardTucson, Arizona 85706Cleanroom size: 30,000 square feetCapacity (wafer/week): 4,200Wafer size: 100mm (Planning conversion to 150mm wafers)Processes: CMOS, Bipolar, BiCMOSProducts: Digital and linear ICs, monolithic and hybrid assemblyFeature sizes: 2.0µm-3.0µm

Burr-Brown has IC assembly facilities in Tucson and Scotland. The company also incorporated plastic multichipmodule (MCM) assembly capability in its Tucson facility in 1995.

Key Agreements

• Burr-Brown is jointly developing with Oki, 20-bit BiCMOS A/D and D/A converter chips for business digital audioequipment.


North American Company Profiles C-Cube Microsystems

C-CUBE MICROSYSTEMS

C-Cube Microsystems Inc.1778 McCarthy BoulevardMilpitas, California 95035Telephone: (408) 944-6300

Fax: (408) 944-6314Web Site: www.c-cube.com

Fabless IC Supplier


Japan: C-Cube Japan • Yokohama, Kanagawa, JapanTelephone: (81) (45) 474-7571 • Fax: (81) (45) 474-7570

Europe: C-Cube Microsystems • Crawley, West Sussex, United KingdomTelephone: (44) (1293) 651100 • Fax: (44) (1293) 651119

Asia-Pacific: C-Cube Microsystems International Inc. • Wanchai, Hong KongTelephone: (852) 2511-6683 • Fax: (852) 2511-6939


1992 1993 1994 1995 1996

Sales 14 24 45 124 320Net Income (5) (1) 5 25 (73)R&D Expenditures 7 7 10 14 44

Employees 112 140 254 669


Founded in 1988, C-Cube Microsystems is a provider of highly integrated, standards-based, programmable digitalvideo and still image compression products and systems. The company's innovative encoder, decoder, andcodec products bring full motion video and still image capabilities to a broad range of end-user products in theconsumer electronics, computer, and communications markets. Such products include video CD players,interactive game equipment, and computer add-in cards that allow full-motion video, desktop video conferencingsystems, interactive digital cable TV systems, and direct broadcast satellite (DBS) systems.

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C-Cube Microsystems North American Company Profiles

In 1995, C-Cube acquired Media Computer Technologies (MCT), a supplier of PC-based digital video processingand video-windowing technology. As a subsidiary of C-Cube, MCT is responsible for developing ASICs,reference designs, and application software, and contributing to development projects of C-Cube’s PCcustomers. In 1996, C-Cube acquired DiviCom Inc., a digital video networking company that designs, integrates,and markets complete systems for the delivery of broadcast video networks. DiviCom will operate as a whollyowned subsidiary of C-Cube.

International67%


U.S.33%

Management

Alexandre A. Balanski, Ph.D. President and Chief Executive OfficerMark K. Allen Vice President, OperationsJames G. Burke Vice President, Finance and Administration, and Chief Financial OfficerBrian T. Conners Vice President, SalesAlex Daly Vice President, MarketingRichard Foreman Vice President and Chief Information OfficerSai-Wai Fu Vice President, Hardware EngineeringDidier Le Gall, Ph.D. Vice President, Research and DevelopmentRichard S. Rasmussen Vice President and General Manager, JPEG DivisionSenjeev Renjen, Ph.D. Vice President, Decoder EngineeringNolan Daines President and Chief Executive Officer, DiviCom Inc.


C-Cube's single-chip and chipset products include: MPEG 1 video and audio/video encoders and decoders forconsumer electronics applications; highly integrated MPEG 1 video and audio/video decoders, JPEG codecs,multistandard codecs, video conferencing codecs, and multimedia video processors for computer applications;and MPEG 2 video encoders and decoders and MPEG 2 transport demultiplexers for communicationsapplications. In February 1997, C-Cube introduced the ZiVA family of single-chip DVD products, which includedecoders, encoders, and system-level solutions for consumer and multimedia OEMs.

C-Cube’s IC products are currently manufactured using two- or three-layer metal CMOS process technology with0.65µm, 0.5µm, or 0.35µm feature sizes.

The company also markets a line of design example boards and demonstration systems products.


North American Company Profiles C-Cube Microsystems


C-Cube does not manufacture its own ICs; it uses independent foundries. The company’s principal IC foundry isTexas Instruments. Other foundry partners include Matsushita, Yamaha, TSMC, and Samsung. AMD is also afoundry partner, but it is not presently manufacturing products for C-Cube. Assembly, test, and packaging of itsdevices is also subcontracted to third parties.

In 2Q96, C-Cube signed an agreement with foundry partner TSMC. As part of the agreement, C-Cube agreed tomake advanced payments to secure wafer production capacity through 2001.

Key Agreements

• In October 1995, C-Cube licensed Sun Microsystems’ MicroSPARC processor core technology for use in amultifunction chip, to be introduced in 1997, intended for digital compression and decompression.

• C-Cube entered into an agreement with Matsushita, JVC, and Sharp to jointly develop MPEG 1 and MPEG 2decoders. Matsushita also provides C-Cube with preferential access to its 0.5µm and 0.35µm manufacturingprocesses. In return, Matsushita has the rights to use and sell a limited amount of the decoders.

• C-Cube has an agreement with TI under which TI provides C-Cube with foundry services in exchange foraccess to its core technology for use in creating derivative products. In addition, C-Cube has access to TI’sMPEG audio decoding technology on a reciprocal basis. C-Cube has a similar agreement with AMD.

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California Micro Devices North American Company Profiles

CALIFORNIA MICRO DEVICES (CMD)

California Micro Devices Corporation215 Topaz Street

Milpitas, California 95035-5430Telephone: (408) 263-3214

Fax: (408) 942-9505

IC Manufacturer


1993 1994 1995 1996 1997

Sales 30 27 36 40 33Net Income 1 (7) (31) 5 1R&D Expenditures 4 3 4 3 4Capital Expenditures 3 1 4 n/a

Employees 247 273 229 297 300


Founded in 1980, California Micro Devices (CMD) is a designer, manufacturer, and marketer of integrated thin-film,silicon-based termination and filtering passive components and active electronic circuitry. These products aretargeted primarily at applications in the computer, networking, and communications industries. CMD exited themilitary market in 1996.

Instruments6%


Other3%

Communications/Networking30%

Workstations16%

Medical4%

PCs/Peripherals36%

Military2%Auto

3%

SemiconductorProducts

33%


Thin Film Products64%

Technology3%


North American Company Profiles California Micro Devices

In 1996, CMD introduced its new line of thin-film P/Active™ devices, which combine the company’s thin-filmtechnology with active semiconductor components and techniques to create enhanced passive networks calledapplications specific passive network (ASPN™) products. With these products, CMD is striving to become anexpert in the matters of high-performance termination systems for PCs, workstations, and networking equipment,as well as in the filtering and complimentary functions necessary in both computers and mobile communications.

Foreign sales, primarily in Europe, Canada, and Asia, accounted for approximately 31 percent of net product salesin fiscal 1996.

Management

Wade Meyercord ChairmanJeffrey C. Kalb President and Chief Executive OfficerNick Bacile Vice President, MarketingRobert Filiault Vice President, Worldwide SalesJohn Jorgensen Vice President, EngineeringRao R. Penumarty Vice President and General Manager, Milpitas OperationsBasker B. Rao, Ph.D. Vice President and General Manager, Tempe OperationsArieh Schifrin Vice President, OperationsJohn E. Trewin Vice President and Chief Financial Officer


CMD's thin-film products use silicon-based thin-film materials and process technology to combine multiple passiveelements in a single package. They fall into two categories: the traditional IPEC™ family, consisting of custom andgeneral purpose devices; and the new P/Active ASPN components, which use semiconductor techniques anddevices to enhance the performance and functionality of its traditional thin-film passive technologies. Its firstP/Active devices include termination devices for the Intel Pentium and Pentium Pro and Motorola Power PCprocessor buses, bias networks for Linear Technology’s and Harris’ PC voltage regulators, special diode clampingcircuits for second-generation PCI, memory, and other computer buses, and filter circuits for parallel ports in PCs.

CMD also offers a variety of precision and non-precision thin-film resistors and capacitors as well as combinations ofthose elements with and without semiconductor devices. The company has particular strength in the area ofresistor-capacitor filters.

The company's semiconductor products include analog and mixed-signal integrated circuits, such as datacommunications and interface devices and telecommunication dual tone multi-frequency (DTMF) receiver andtransceiver products. These products are used in personal computers, answering machines, portabletelephones, and switching systems. They are manufactured in 1.25µm through 3.0µm BiCMOS and CMOSprocessing technologies.

CMD also offers the use of its Tempe fabrication facility as a foundry and test service.

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California Micro Devices North American Company Profiles


CMD plans to convert certain of its fabrication facilities from 125mm to 150mm wafers during the next couple ofyears.

California Micro Devices, Microcircuits Division California Micro Devices2000 West 14th Street 215 Topaz StreetTempe, Arizona 85281 Milpitas, California 95035-5430Telephone: (602) 921-6000 Telephone: (408) 263-3214Cleanroom size: 16,000 square feet (Class 1) Cleanroom size: 10,000 square feetCapacity (wafers/week): 1,000 Capacity (wafers/week): 750Wafer size: 125mm Wafer sizes: 125mm, 4.5in squareProcesses: CMOS (SM/DP, DM/SP, DM/DP); Products: Thin-film discretes BiCMOS (SM/DP, DM/DP)Products: Linear and mixed-signal ICs, thin-film devices, foundry servicesFeature sizes: 1.25µm-3.0µm CMOS; 1.25µm, 1.5µm BiCMOS

The company uses subcontractors in Asia, primarily Thailand and the Philippines, for the assembly and packagingof most of its products. Most of its product testing is done in-house, but its assembly partners are increasinglybeing used for testing purposes.

Key Agreements

• California Micro Devices has a comprehensive strategic alliance with Hitachi Metals, Ltd. (HML), a subsidiary ofHitachi, Ltd., that involves joint IPEC product development, manufacturing, marketing, and worldwidedistribution. Also under the alliance, HML holds a 10 percent stake in CMD.


North American Company Profiles Calogic

CALOGIC

Calogic Corporation237 Whitney Place

Fremont, California 94539Telephone: (510) 656-2900

Fax: (510) 651-3025

IC Manufacturer

Employees 200


Calogic is a privately held company, founded in 1983. The company offers a line of standard and full customsemiconductor products made using several technologies including CMOS/DMOS and bipolar. Its product line isspecifically designed for high-performance applications. The company strives to form relationships with itscustomers by offering technical expertise from design to processing to final test.

Management

Manny Del Arroz PresidentCharlie Bevivino Director, SalesBrenda Hill Director, Marketing


Calogic offers bipolar standard products (e.g., switches, multiplexers, and op amps) and CMOS, DMOS, and JFETfull custom ICs. Calogic acquired a small signal discrete line from Harris and now offers one of the broadest smallsignal FET product lines in the industry. In addition, Calogic offers its production facilities as a foundry service.

CRT Related Products : Video Products :

CRT driver amplifiers (30MHz to 185MHz) Widebank buffers and amplifiersPre-amplifiersBuffers

Instrumentation Products : Full Custom and Semicustom Capabilities :

Op amps Design, layout, manufacturing, and testReferencesAnalog switches

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Calogic North American Company Profiles

Discretes :

High-speed lateral DMOS FET switch and switch arrays (switching speeds under 1ns)Vertical MOS FET switchesJFETsMOSFETsDiodes

Calogic’s process technologies include a dielectrically isolated (DI) complementary bipolar process, a highfrequency (1GHz), low-noise bipolar process, and a medium-voltage, medium-frequency, bipolar process forsupply voltages up to ±20 volts.


Calogic Corporation237 Whitney PlaceFremont, California 94539Cleanroom size: 10,000 square feetCapacity (wafers/week): 900Wafer size: 100mmProcesses: CMOS, DMOS, bipolarProducts: ASICs (gate arrays, full custom ICs); peripheral, linear, and logic ICs; discretesFeature sizes: 1.5µm-5.0µm


North American Company Profiles Catalyst

CATALYST SEMICONDUCTOR

Catalyst Semiconductor, Inc.1250 Borregas Avenue

Sunnyvale, California 94089Telephone: (408) 542-1000

Fax: (408) 542-1200

Fabless IC Supplier


Japan: Nippon Catalyst K.K. • Tokyo, JapanTelephone: (81) (3) 5340-3781 • Fax: (81) (3) 5340-3780

Europe: Catalyst Semiconductor, Inc. • Oxford, EnglandTelephone: (44) (1865) 481-411 • Fax: (44) (1865) 481-511

Asia-Pacific: Catalyst Semiconductor, Inc. • Taipei, TaiwanTelephone: (886) (2) 345-6192 • Fax: (886) (2) 729-9388

Financial History ($M), Fiscal Year Ends April 30

1992 1993 1994 1995 1996 *

Sales 29 33 54 49 60Net Income (7) (2) (22) 2 4 R&D Expenditures 7 5 7 7 9

Employees 100 90 60 65 82

*In February 1996, fiscal year changed from ending March 31 to April 30.


Catalyst Semiconductor, established in 1985, designs, develops, and markets a broad range of nonvolatilememory IC products that have applications in the computer, consumer electronics, wireless communications,network, automotive, industrial, and instrumentation markets.

The company's strategy is to become a leading supplier of flash memory devices while maintaining its position as aleading supplier of EEPROM products. The company’s development efforts are focused on improving itsfabrication processes and the development of advanced products. During 1996, development work began onnext-generation versions of its flash memory and EEPROM products.

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Catalyst North American Company Profiles

United States40%Europe

21%

Far East23%

Japan16%


Management

C. Michael Powell Chairman, President, and Chief Executive OfficerChris Carstens Vice President, Quality and ReliabilityHeber Clement Vice President, OperationsScott Parker Vice President, Sales and MarketingAlan Renninger Vice President, Technology DevelopmentDaryl Stemm Vice President, Finance and Administration, and Chief Financial OfficerRadu Vanco Vice President, EngineeringFred Leung Director, Strategic MarketingRichard Palm Director, Marketing


Catalyst's family of nonvolatile devices includes flash memories (512K, 1M, 2M, 4M, and 8M), serial EEPROMs (1Kto 64K), parallel EEPROMs (16K to 256K), battery-backed SRAMs, and NVRAMs (i.e., shadow RAMs and devicesthat combine EEPROM with SRAM). Catalyst also offers a line of BiCMOS data converters and other specializedproducts such as its application-specific electrically erasable devices (ASEEDs™).

Most of the company's products are designed and manufactured using a 1.0µm CMOS EEPROM process or a0.7µm flash memory process, however, the move to a 0.8µm CMOS EEPROM process and a 0.5µm flash memoryprocess are currently under way.


Through the establishment of long-term licensing agreements, Catalyst has contracts with Oki, Seiko Epson,Chartered Semiconductor, UMC, and Newport Wafer-Fab Ltd. for the fabrication of its devices.


North American Company Profiles Catalyst

Key Agreements

• In 1996, Catalyst announced an agreement with United Microelectronics Corp. (UMC). As part of theagreement, UMC will take a 10 percent equity stake in Catalyst and will provide significant wafer foundrycapacity. Also, UMC and Catalyst will jointly develop 0.5µm and 0.35µm process technologies, geared for flashmemory products.

• In November 1995, Catalyst signed a cross-licensing agreement with Intel. The agreement provides Catalystwith the right to utilize all of Intel’s flash memory patents.

• Catalyst signed on Wales, U.K.-based Newport Wafer-Fab Ltd. in May 1995 for the manufacture of itsEEPROMs and for process technology development.

• Catalyst formed an alliance with Zilog that calls for the joint development of 20M and 40M 2.5-inch solid-statedisk drives merging Catalyst's flash memory devices with Zilog's compression and controller technology. Thetwo companies are also developing other devices combining flash and microcontroller technology.

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Cherry Semiconductor North American Company Profiles

CHERRY SEMICONDUCTOR

Cherry Semiconductor Corporation2000 South County Trail

East Greenwich, Rhode Island 02818-0031Telephone: (401) 885-3600

Fax: (401) 885-5786Web Site: www.cherrysemiconductor.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends February 28

1992 1993 1994 1995 1996

CorporateSales 229 266 275 339 425Net Income 5 10 11 15 11

SemiconductorSales 36 45 56 75 99Net Income 3 5 7 11 5Capital Expenditures 1 4 7 17 20

Employees 415 450 500 550 975


Formed in 1972 as Micro Components Corporation, Cherry Semiconductor originally manufactured linear bipolarICs with a focus on the photography market. In 1977, MCC was acquired by The Cherry Corporation and renamedCherry Semiconductor Corporation (CSC). The market orientation of CSC began to include more automotivebusiness as the photo market began to sag. In 1985, the company committed to two major market focuses:automotive and computer. Within these two markets, CSC focused further on four applications areas: dedicatedautomotive, power supply control, motor control, and memory management (high-performance disk drive circuits).

In 3Q95, CSC was organized into three business groups: automotive OEM, automotive electronics, andcomputer and industrial. The companies global customer base includes automotive equipment manufacturersand suppliers, power systems suppliers and resellers, computer OEMs, and telecommunications systemsmanufacturers.


North American Company Profiles Cherry Semiconductor

Automotive68%

Computer16%

1996 Semiconductor Salesby End-Use Market

Telecom16%

United States81%

Asia-Pacific14%

Europe5%

1996 Semiconductor Salesby Geographic Region

Management

Alfred S. Budnick President, Cherry SemiconductorAndrew F. Durette Executive Vice PresidentWalter E. McMann Vice President, Finance and AdministrationDennis Gaetano Director, Worldwide Sales and Marketing


Cherry Semiconductor designs and builds standard linear and mixed-signal ICs and semicustom and full-customICs (ASICs). The company’s automotive ICs are most often custom designs, while its standard ICs are usuallytargeted at the computer market.

CSC developed its high-performance PowerSense™ BiCMOS process for automotive circuits. It is a mixed-signalprocess that allows analog power functions and compact digital logic to be combined on a single chip. It uses 15masks and has five critical alignments. In addition, CSC has developed a 16-volt BiCMOS process for disk driveapplications and a 2.5MHz bipolar process for computer applications. The firm’s bipolar processes feature verticaland lateral PNP transistors, up-down isolation, and low leakage diodes.


Cherry Semiconductor Corporation2000 South County TrailEast Greenwich, Rhode Island 02818Cleanroom size: 24,000 square feetCapacity (wafer/week): 2,500Wafer sizes: 100mm, 150mmProcesses: Bipolar, BiCMOSProducts: Linear and mixed-signal ICs and ASICsFeature size: 1.4µm

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Cherry Semiconductor North American Company Profiles

Key Agreements

• Cherry Semiconductor works with Motorola to develop ASICs for the automotive industry. The two companiesstruck their first agreement in the late 1980's.


North American Company Profiles Chip Express

CHIP EXPRESS

Chip Express Corporation2903 Bunker Hill Lane, Suite 105


Fax: (408) 988-2449Web Site: www.chipexpress.com

Fabless IC Supplier


Europe/Middle East: Chip Express Ltd. • Haifa, IsraelTelephone: (972) (4) 855-0011 • Fax: (972) (4) 855-1122


1994 1995 1996

Sales 10 18 28

Employees 80 110 140


Chip Express started its operations in 1990 when it was spun out from Elron Electronics Industries Ltd. (an Israelihigh technology holding company). The company provides a complete “Time-to-Market Solution™” featuringrapid turn application-specific integrated circuit (ASIC) products and services. The company offers flexible ASICproduction with a seamless migration path for transferring a logic design from netlist to fast-turn prototypes andthen to volume production. The company’s product, called LPGA (laser programmable gate array), is a customizedgate array fabricated with a patented technology.

The company’s product offering includes 24 hour laser prototypes, one week pre-production/low-volumequalities, and one month high-volume ASIC production. Rapid prototyping service is provided utilizing itsproprietary QuICk® laser micro-machining system to personalize one die at a time in less than two hours. Low-volume production is provided using the OneMask® technology to personalize a single wafer at a time with a singlemask, in a single etch process of multi-layers. Cost-effective mass production is provided by implementing thesame layout, using the TwoMask® personalization technology at conventional fabs.

Chip Express believes its ASIC design methodology combined with easy re-spin and fast turnaround timesignificantly reduces the product development cycle. The company provides complete design kits supportingpopular EDA design environments, including Cadence, Viewlogic, and Synopsys.

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Chip Express North American Company Profiles

Management

Zvi Or-Bach President and Chief Executive OfficerHoward Brodsky Chief Financial OfficerPaul Indaco Vice President, SalesUzi Yoeli Vice President, Research and Development (Chip Express Israel)Meir Janai Chief Scientist


Chip Express offers CMOS gate arrays with densities that range from 4K to 125K gates. In 2Q96, the companyintroduced the new CX2000 gate array family, which features a 0.6µm triple metal device with approximately 200Kgates plus configurable embedded memory of up to 128K bits. In 1Q97, the company introduced the nextgeneration CX2001 product family with added features such as analog PLL, ATPG, and better access to memory.In addition, in 2Q97, the company developed a 0.5µm device.

Planned for release during 1997 is the CX3000 product family featuring a 0.35µm triple-level-metal processtechnology, which is being co-developed with foundry partners.


Chip Express provides prototyping and production services with on-site manufacturing. The company has a37,000 square foot facility that provides gate array prototyping and low volume production services. The laser-based QuICk System operates in a computer room, but the production areas within the machine are cleanroomenvironments. The prototype is personalized in a self-contained Class 100 laminar air flow cell. Chip Express usesbase arrays that are manufactured by international gate array vendors and are compatible with their gate arrayfamilies. For ASIC prototyping, the QuICk System disconnects the predefined links of multi-layer metal in a singleoperation with 20,000 per second. A real time computer and image processing system use the Cut-List to controlthe automatic laser cutting process.

For low-volume ASIC production, Chip Express employs its OneMask technology. The OneMask operation is in aClass 10 cleanroom environment, processing a single wafer at a time, in a single etch step using only a single maskfor personalization.

The LPGA fabrication is provided by Tower Semiconductor and Yamaha. Additional foundry partners for the LPGAdevelopment include Sony, Seiko Epson, and Chartered Semiconductor Manufacturing.


North American Company Profiles Chips and Technologies

CHIPS AND TECHNOLOGIES

Chips and Technologies, Inc.2950 Zanker Road


Fax: (408) 894-2082Web Site: www.chips.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends June 30

1992 1993 1994 1995 1996

Sales 141 98 73 105 151Net Income (64) (49) 3 9 26R&D Expenditures 46 23 12 13 20

Employees 400 220 180 185 209


Chips and Technologies (also known as Chips) supplies advanced semiconductor devices to the worldwidepersonal computer industry. The company has a product portfolio that includes display controllers, graphicsaccelerators, video devices, communications ICs, and system logic chipsets. These products are built into a widerange of systems from compact portables to high-performance desktop computers.

Chips’ product strategy has taken several turns since it was founded in 1984. The company initially placed itsprimary focus on system logic chipsets and built up this particular business to represent 87 percent of totalrevenues in fiscal 1989. Chips’ annual sales in 1990 grew over 100 percent from that in 1988. However, thecompany’s logic chipset business took a turn for the worst and the company reported a net loss in 1991, the firstsince its inception.

In an effort to move the company out of the red, Chips sold off several product lines in 1993 and implemented aplan to reorganize the company’s strategy. With its new objectives—to provide highly-integrated silicon andsoftware solutions to the PC industry by creating unique, high-quality products—the company slowly turnedaround.

Today, the focus of Chips is on single-chip systems for emerging markets such as graphics controllers fornotebook PCs. Chips’ has been successful in building this business; its flat panel display graphics controllersrepresented 84 percent of total revenues in fiscal 1996. Future plans are to move beyond graphics, core logic,and I/O to add multimedia products, as well as more communications-related devices.

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Chips and Technologies North American Company Profiles

Asia and Europe67%


North America33%

Management

James F. Stafford President and Chief Executive OfficerMorris E. Jones, Jr. Senior Vice President and Chief Technical OfficerKeith Angelo Vice President, MarketingLee J. Barker Vice President, OperationsTimothy R. Christofferson Vice President, Finance, and Chief Financial OfficerRichard E. Christopher Vice President, SalesLawrence A. Roffelsen Vice President, EngineeringJeffery Anne Tatum Vice President, General Counsel


Chips' product line includes CRT and flat-panel graphics controller ICs, graphical user interface (GUI) accelerators,PC video circuits, I/O and peripheral controllers, and system logic chipsets. The company's LCD controllers havebeen well received by makers of industry-leading products in the laptop, notebook, and sub-notebook industries.

In 1996, Chips’ introduced a line of LCD flat panel/CRT controllers and accelerators, called the HiQVideo™ family,which are based on a new 64-bit display graphics engine architecture and feature multiple window display,zoomed video, and full-motion video acceleration and scalability.

Planned for release in 1997 is portable graphics controller chips with embedded DRAM, designed with foundrypartner Samsung Semiconductor. The two companies announced in mid-1996 a plan to jointly developintegrated memory products as part of a plan by Chips to introduce a new generation of low-power, high-bandwidth, and high-performance products that are software-compatible with its HiQVideo product family.

The majority of Chips’ products are built using 0.6µm and 0.5µm triple-layer-metal CMOS processes. Thecompany plans to utilize 0.5µm and 0.35µm process technology for many of its future products.


North American Company Profiles Chips and Technologies


Chips and Technologies uses subcontractors for the fabrication and assembly of its semiconductor components.Currently its foundry partners include Chartered Semiconductor, IBM, NEC, Samsung, LG Semicom, and TSMC.

Key Agreements

• Chips and Technologies signed a production agreement with Chartered Semiconductor. Chips agreed to payChartered $20 million for guaranteed production capacity support of 200mm wafers through 2000.

• In fiscal 1996, Chips and Technologies established a long-term foundry agreement with TSMC. Theagreement called for Chips to make deposits totaling $23.5 million to TSMC in exchange for a guaranteed wafersupply through 2000.

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Cirrus Logic North American Company Profiles

CIRRUS LOGIC

Cirrus Logic, Inc.3100 West Warren Avenue

Fremont, California 94538-6423Telephone: (510) 623-8300

Fax: (510) 226-2240Web Site: www.cirrus.com

IC Manufacturer


Japan: Cirrus Logic K.K. • Tokyo, JapanTelephone: (81) (3) 3340-9111


1993 1994 1995 1996 1997

Sales 355 557 889 1,147 917Net Income 21 45 61 (36) (46)R&D Expenditures 73 127 166 239 231Capital Expenditures 27 36 47 128 n/aJoint Venture Investment — — 64 45 n/a

Employees 1,353 1,854 2,331 3,500 2,600


Cirrus Logic, founded in 1984, is a leading supplier of advanced integrated circuits for multimedia (graphics, video,audio), communications (modems, networking, high-speed I/Os), mass storage (magnetic hard disk and CD-ROM),and data acquisition. The company’s products and technologies focus on desktop, portable, and handheldcomputing systems, as well as industrial and consumer electronics.

Cirrus Logic targets both emerging high growth markets and large existing markets that are undergoing majorproduct or technology transitions. Cirrus Logic’s major customers consist of original equipment manufacturers(OEMs) of personal computers and PC add-in boards, as well as disk drive manufacturers.


North American Company Profiles Cirrus Logic

Mass Storage21%

CrystalSemiconductor

26%

1997 Sales by Product Group (est)

Graphics29%

Communications24%

Europe 7%

Asia-Pacific34%

1997 Sales by Geographic Region (est)

North America40%

Japan19%

From its initial public offering in 1989 through its fiscal year 1995, Cirrus Logic posted record revenue growth andwas consistently profitable year after year. During this period, the company set industry growth records as itquickly reached the billion dollar revenue run rate. This rapid growth was challenged in fiscal year 1966, as thecompany faced a combination of softening market conditions, a delayed transition to new products, and adiversion of engineering resources to support manufacturing at a dozen foundries around the world. As a result,Cirrus Logic posted its first-ever losses in fiscal 1996. This prompted the company to streamline operations andintensify its focus on key product development within its core competencies of multimedia, communications, andmass storage. A workforce reduction and the divestiture of non-core businesses was also included in itsstreamlining efforts.

Cirrus Logic has invested substantially in R&D and in the acquisition of key technologies to develop its “systems insilicon’’ expertise. Past acquisitions include Pixel Semiconductor (1991), Crystal Semiconductor Corporation(1991), Acumos Inc. (1992), Pacific Communication Sciences, Inc. (1993), PicoPower Technology, Inc. (1994),the 3D graphics chip technology of Austek Microsystems (1994), and the graphics and disk interface ICbusinesses of Appian Technology (1994). The intellectual property gain from these acquisitions, combined withCirrus Logic’s on-going research and development, have enabled the company to broaden and deepen itstechnology portfolio in the areas of mixed-signal design, digital audio, graphics acceleration,modulation/demodulation algorithms, and digital wireless communications.

As part of the company’s streamlining efforts in fiscal 1996, certain acquisitions were divested, includingPicoPower Technology (sold to National Semiconductor in May 1996), PCSI’s Wireless Infrastructure EquipmentGroup (sold to ADC Telecommunications in December 1996), and PCSI’s Wireless Semiconductor Group (sold toRockwell Semiconductor Systems in January 1997).

In early 1997, Cirrus Logic set up a new organizational structure under which came the establishment of the Officeof the President and the integration of the company’s product operations into four divisions: Personal ComputerProducts—which includes all graphics/video products from the former Graphics Company, the PC audio productsfrom Crystal Semiconductor, and the PC modem chipsets from the former Personal Systems Division;Communications Products—which includes the WAN and LAN networking products from Crystal Semiconductor,and adds enterprise networking and Internet access chip solutions from the former Personal Systems Division;Mass Storage Products—which includes magnetic hard disk and CD-ROM products; and Crystal SemiconductorProducts—which includes products from the former Industrial Products Division of Crystal.

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Management

Michael L. Hackworth President and Chief Executive OfficerSuhas S. Patil Chairman and Executive Vice President, Products and TechnologyGeorge Alexy Chief Products and Marketing Officer, and Office of the PresidentThomas F. Kelly Chief Operating Officer and Office of the PresidentMichael L. Canning President, Mass Storage Products CompanyWilliam W.Y. Chu President, Graphics CompanyJames H. Clardy President, Crystal Semiconductor CorporationRobert V. Dickson President, Graphics CompanyEdward Ross President, Worldwide ManufacturingWilliam D. Caparelli Senior Vice President, Worldwide SalesKenyon Mei Senior Vice President and GM, Personal Systems Business UnitRobert F. Donohue Vice President and Chief Legal OfficerPatrick Boudreau Vice President, Human ResourcesThomas P. Rigoli Vice President, Corporate CommunicationsHalappa Ravindra Vice President, Research and DevelopmentRon Shelton Vice President, Finance, and Chief Financial Officer


Multimedia Graphics/VideoCirrus Logic’s graphics/video chip solutions provide high-performance 2D/3D acceleration and full-motionvideo for mainstream personal computing for both desktop and portable applications. During fiscal 1997, thecompany introduced its Laguna3D™ graphics accelerator, the industry’s first graphics chip solution to employthe Rambus memory architecture. Cirrus Logic was also one of the first to sample and demonstrate a 3Dgraphics chip solution incorporating Intel’s AGP (accelerated graphics port). As Cirrus Logic continues toexpand its family of Rambus-based Laguna3D chips, the company is also working closely with Microsoft on the“Talisman” initiative, which will result in a DirectX, Rambus-based, hardware reference design for 2D and 3Dgraphics, video, and advanced audio functionality. This reference design is expected to facilitate thedeployment of Talisman-driven motherboard implementations and graphics accelerator cards beginning incalendar year 1998.

Multimedia AudioCirrus Logic offers one of the industry’s most advanced audio chip solutions for multimedia PCs through itsCrystal Semiconductor subsidiary in Austin, Texas. Crystal has distinguished itself as a leading supplier of 16-bit stereo codecs for PCs, pioneering the use of delta sigma technology in 1988, and enabling 16-bit PCaudio with a single-chip codec in 1991. In 1995, Crystal developed the first single-chip audio solution thatcomplied with Windows 95, and in 1996 its leadership continued with the integration of 3D sound into asingle-chip solution for PC motherboards. Crystal recently announced the PC industry’s first single-chipsolution integrating PCI-compliant 3D audio acceleration and Dolby AC-3 decoding. The company’s portfolioof multimedia audio chips include solutions for audio processing for consumer products such as digital audiotape, digital compact cassettes, and automotive sound systems.


North American Company Profiles Cirrus Logic

CommunicationsCirrus Logic launched the industry’s first two-chip intelligent fax/data/voice modem in 1992. More recently,the company introduced a high-performance, three-chip version as part of its FastPath™ Telephony Platform.The chipset, which employs a 32-bit Advanced RISC Machines (ARM) processor, is software configurable toaccommodate high-speed 56 Kbps Internet access, using the x2 protocol from U.S. Robotics. By simplydownloading software, the FastPath platform can be upgraded to conform to the worldwide 56 Kbps standardwhen it is established. In addition to its powerful family of modem chips, Cirrus Logic also offers high-speedserial and parallel I/O devices for multi-channel, multi-protocol communications. Moreover, through its CrystalSemiconductor subsidiary, the company is a leading supplier of monolithic T1/E1 line interface circuits, CMOSEthernet LAN line interface circuits, and infrared interface circuits.

Mass StorageCirrus Logic is a leading supplier of chips that perform the key control function in the most advanced hard diskdrives. The company’s controllers comply with AT (IDE), PCMCIA, SCSI, and high-speed SCSI2 standards.Cirrus Logic began offering read-write electronics for disk drives in 1993, and was the first supplier to providePartial Response Maximum Likelihood (PRML) data-detection technology in its ICs. The company’s mostrecent PRML chip solutions enable 3.5-inch hard disk drives to achieve more than 1G per platter area densityusing thin-film read heads. The company’s line of hard-drive controller chips also features “ID-less”technology that can increase the capacity of a hard-disk drive by up to 10 percent. In 1996, Cirrus Logicintroduced high-speed encoder/decoder chips for next generation CD-ROM applications. These newencoders support CD-Recordable/Erasable (CD-R/E) capabilities, which lets the end-user record, erase, andre-use the CD. Available in SCSI interface and ATAPI interface versions, the encoders also support theindustry’s fastest 18x read and 8x record speeds.

Data AcquisitionThrough its Crystal Semiconductor subsidiary, Cirrus Logic has established a broad line of analog-to-digitalconverters consisting of general-purpose and low-frequency measurement devices. The family includesmore than twenty products used in industrial automation, instrumentation, medical, military, and geophysicalapplications.

The majority of Cirrus Logic's IC products are manufactured using 0.8µm, double-layer-metal CMOS and 0.6µm,triple-layer-metal CMOS process technologies, although some use other CMOS processes (high and low voltage),while others use BiCMOS or GaAs processes (for RF chips).


In 1994, Cirrus Logic made a move to abandon its completely fabless approach by forming a joint venture with IBMto manufacture ICs for both companies at one of IBM's East Fishkill, New York, fab facilities. The venture isoperating as a separate company, named MiCRUS (see Key Agreements).

In late 1995, Cirrus Logic announced a program to expand its manufacturing infrastructure, emphasizing both fabownership and foundry relationships that target 0.35µm and 0.25µm process capabilities. The program called forthe company to invest approximately $2 billion over a five-year period. In early 1997, the amount was reduced byhalf.

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The initial phase of the program resulted in the expansion of MiCRUS and the formation of Cirent Semiconductor,a new joint venture with Lucent Technologies, that operates within an existing Lucent wafer manufacturing facilityin Orlando, Florida. Cirent is 40 percent owned by Cirrus Logic and 60 percent by Lucent Technologies. The twofirms will equally split the production output of the new 200mm wafer facility, which is initially focusing on 0.35µm,with plans to migrate to 0.25µm processing in 1998.

With both of its joint manufacturing ventures now in production, Cirrus Logic has reduced its dependence onfoundries. Whereas the company used a dozen foundries before the joint ventures, the company now dependson less than half that number to meet its production needs. Cirrus Logic continues to nurture its foundryrelationships, which include long-standing relationships with TSMC and UMC.

Under a foundry venture agreement with UMC and two other U.S. semiconductor companies, a new company,United Silicon, Inc., has been formed in Hsinchu, Taiwan. Production at the new fab is scheduled to commence in1Q98. Meanwhile, Cirrus Logic will expand its current relationship with TSMC to include a long-term purchaseagreement.

MiCRUS Cirent Semiconductor1580 Route 52 9333 South John Young ParkwayHopewell Junction, New York 12533 Orlando, Florida 32819Telephone: (914) 892-2121 Telephone: (407) 345-6000Capacity (wafers/week): 9,000 Capacity (wafers/week): 2,500Wafer size: 200mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: DRAMs, MPRs Products: ASICs, MPRsFeature sizes: 0.35µm-0.6µm Feature sizes: 0.35µm, 0.5µm(Joint venture with IBM Microelectronics. (See Key Agreements.)See Key Agreements.)

Key Agreements

• In 1996, Cirrus Logic entered into a licensing agreement with U.S. Robotics that gave the company rights touse U.S. Robotics’ x2 protocol for high-speed (56 Kbps) access. Cirrus Logic’s proprietary line of FastPathmodem chipsets is software configurable.

• Cirrus Logic licensed the Rambus high-performance DRAM interface architecture in early 1995. The licensegives Cirrus the right to use the Rambus interface in its graphics controllers.

• Cirrus Logic is licensed to embed Advanced RISC Machines' ARM processor in its future ICs forcommunications, computer, consumer, and other applications.

• IBM and Cirrus Logic formed a joint manufacturing venture called MiCRUS in 1994. IBM and Cirrus Logic own52 percent and 48 percent of MiCRUS, respectively. Volume production of logic chips for Cirrus and memoryICs for IBM began in mid-1995. The agreement does not include product and/or technology exchange. In1996, Cirrus Logic entered into a similar joint venture agreement with Lucent Technologies to form CirentSemiconductor in Orlando, Florida. In each joint venture, Cirrus Logic has rights to 50 percent of themanufacturing output.


North American Company Profiles Crosspoint Solutions

CROSSPOINT SOLUTIONS

Crosspoint Solutions, Inc.694 Tasman Drive

Milpitas, California 95035Telephone: (408) 324-0200

Fax: (408) 324-0123

Fabless IC Supplier


With equity funding from ASCII Corporation, Crosspoint Solutions was founded in 1989 to develop a field-programmable replacement for standard gate arrays. A proprietary cell and routing architecture, coupled with aunique interconnect technology, enables Crosspoint to meet the performance and density demands of themainstream CMOS gate array market. Crosspoint was one of the first companies offering a field-programmablechallenge to gate arrays.

Management

Robert N. Blair President and Chief Executive OfficerThomas Chan Vice President, ManufacturingJohn Daws Vice President and Chief Financial OfficerScott Graham, Ph.D. Vice President, Technology DevelopmentMichael Levis Vice President, Business Development and Product Marketing


The gate array granularity and transistor-level interconnect of Crosspoint's FPGA are made possible by thecompany's proprietary cell and routing architecture and a unique antifuse technology. An antifuse is aprogrammable switch that has a very high impedance initially, but exhibits a low resistance after programming.

Crosspoint's unique antifuse fabrication technique provides antifuse elements with very low capacitance and low"on" resistance. This translates directly to higher operating speed. The programming is permanent and non-volatile, resulting in one-time-programmable (OTP) devices.

In 1996, Crosspoint unveiled its CP20K CrossFire™ family of FPGAs. The CP20K series consists of six gatedensity options covering the 2.2K to 20K range with I/O counts ranging from 91 to 250. The FPGAs aremanufactured using a high-performance 0.6µm two-layer-metal CMOS process and are architecturally compatiblewith standard mask-programmable gate arrays.

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Crosspoint Solutions North American Company Profiles

Also in 1996, Crosspoint announced its CoreBank™ program for realizing system-level FPGAs. CoreBankcomprises a rich library of systems building blocks developed by Crosspoint Solutions and its CoreBank programpartners. CoreBank includes digital signal processing, communications, computer, and networking cores, as wellas a large selection of functions ranging from register files to interface circuits.


Crosspoint has a long-standing foundry partnership with Hitachi. LG Semicon was added on in 1996 as a foundrypartner (see Key Agreements).

Key Agreements

• In 1Q96, Crosspoint gave LG Semicon limited licensing, manufacturing, and marketing rights to its CP20KFPGA architecture in exchange for foundry access to LG’s 0.8µm and 0.6µm two- and three-layer-metal ICtechnology.


North American Company Profiles Cypress Semiconductor

CYPRESS SEMICONDUCTOR

Cypress Semiconductor Corporation3901 North First Street


Fax: (408) 943-2796Web Site: www.cypress.com

IC Manufacturer


Japan: Cypress Semiconductor Japan K.K. • Shinjuku-ku, Tokyo, JapanTelephone: (81) (3) 5296-0781 • Fax: (81) (3) 5269-0788

Europe: Cypress Semiconductor International • Waterloo, BelgiumTelephone: (32) (2) 357-02-20 • Fax: (32) (2) 357-02-30

Asia-Pacific: Cypress Semiconductor Singapore • SingaporeTelephone: (65) 735-0338 • Fax: (65) 735-0228


1992 1993 1994 1995 1996

Sales 272 305 406 596 528Net Income (21) 8 50 102 53R&D Expenditures 65 50 53 72 84Capital Expenditures 32 56 112 195 195

Employees 1,529 1,262 1,423 1,859 2,171


Founded in 1983, Cypress Semiconductor is a designer, developer, and manufacturer of high-performance digitalintegrated circuits for a variety of markets including networking, military, computers, telecommunications, andinstrumentation. Cypress’ product offerings include SRAMs, EPROMs, specialty memories, programmable logicdevices (PLDs), data communications products, PC chipsets, timing devices, and USB microcontrollers.

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Cypress Semiconductor North American Company Profiles

Suffering its first revenue decline in 1992, Cypress initiated a restructuring program. From the company'sbeginning, it had been known for its niche-market strategy of acquiring and managing smaller autonomousbusinesses. That approach, however, has been modified to take advantage of Cypress' lowered manufacturingcosts, allowing the company to compete effectively in high-volume markets such as the PC market. Cypress hasalso turned to a more market-driven focus.

Restructuring activities included the selling of its SPARC processor subsidiary, Ross Technology, to Fujitsu andthe realignment of its subsidiaries Aspen Semiconductor and Multichip Technology under the company's fourbusiness units (today there are five): the Memory Products Division (MPD), the Programmable Products Division(PPD), the Data Communications Division (DCD), and the Computation Products Division (CPD). Cypress alsomade a few strategic acquisitions, including Seattle-based IC Designs, Inc., a supplier of clock-frequencysynthesis chips for the PC market, and the high-speed FCT logic product line from Performance Semiconductor.

North America73%


International27%

1996 Sales by Product Division

MemoryProducts

51%Data Communications

and ComputationProducts 30%

ProgrammableProducts

19%

During 1996, Cypress experienced a decline in sales due to price erosion in the memory market, but still had aprofitable year. Cypress entered 1997 with a reinforced strategy to continue developing new products andprocesses utilizing its proprietary technologies to address the needs of its target markets as well as enter newmarkets in order to reduce its dependence on specific markets.

Several strategic activities took place at Cypress during the late-1996 to early-1997 timeframe. Cypress enteredthe microcontroller market in late 1996 with its first 8-bit RISC-based family of universal serial bus (USB)microcontrollers. Designed for use in peripherals and hub products, the MCUs integrate digital logic, analog,PROM, SRAM, and microcontroller logic.

In early 1997, Cypress announced the creation of the Non-Volatile Memory Division that will focus directly on theEPROM market. The creation of this business unit reinforces the company’s commitment to remain a key player inthe EPROM market.

Also in early 1997, Cypress announced that it would no longer market its FPGA products. As part of a newagreement with QuickLogic (see Key Agreements), Cypress will no longer be a second-source for QuickLogic’sFPGA products and will only produce FPGA devices for QuickLogic. Cypress will redirect its efforts toward its PLDproducts. For 1997, the company plans to reach the 20,000 gate level.



Another market Cypress entered in the first part of 1997 was the slow-speed SRAM market. In March 1997,Cypress rolled out a family of ultra-low power, slow asynchronous SRAM devices that feature access times of 70nsand range from 1.65V to 5V. The devices are manufactured using Cypress’ proprietary six-transistor (6T), 0.5µmRAM3 process technology.

Management

Pierre Lamond ChairmanT.J. Rodgers President and Chief Executive OfficerAntonio Alvarez Vice President, Research and DevelopmentDan Barrett Vice President, European Sales and MarketingLou Chetaud Vice President, Worldwide ManufacturingBernard Glasauer Vice President, Quality and Reliability AssuranceEmmanuel Hernandez Vice President, Finance, and Chief Financial OfficerLarry Jordan Vice President, MarketingJeff Kaszubinski Vice President, Memory Products DivisionPaul Keswick Vice President, New Products DivisionJim Kupec Vice President, Products DivisionJeff Linden Vice President, Non-Volatile Memory DivisionLothar Maier Vice President, Worldwide Wafer ManufacturingJ. Daniel McCranie Vice President, Sales and MarketingChristopher Norris Vice President, Programmable Logic DivisionRich Parker Vice President, North American DistributionJohn Ramacciotti Vice President, ProcurementSean Salehi Vice President, Management Information Systems and

Chief Information OfficerR. Michael Starnes Vice President, Process TechnologyJoyce Sziebert Vice President, Human ResourcesBruce Threewit Vice President, Systems DevelopmentJohn Torode Vice President, Computer Products DivisionRon Treadway Vice President, Data Communications DivisionWilliam Verde Vice President, Strategic AccountsMichael Villott Vice President, North American Sales


Highlights of Cypress Semiconductor's product portfolio are given below. Its integrated circuits are fabricatedusing proprietary 0.5µm, 0.65µm, and 0.8µm CMOS and BiCMOS technologies.

SRAMs Specialty Memories and Memory Modules• 4K to 1M CMOS SRAMs • Industry-standard FIFOs• 64K and 256K BiCMOS SRAMs • Bidirectional FIFOs• 1K and 16K ECL SRAMs • Clocked FIFOs• 64-bit x 18 cache tag RAMs • Asynchronous FIFOs• 128K and 256K cache RAMs • Dual-port RAMs

• Memory accelerator MCMs

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Cypress Semiconductor North American Company Profiles

UltraLogic PLDs/Tools Industry-Standard PLDs• Flash370 CPLDs (44-288 pins) • 20-pin CMOS/BiCMOS PLDs• Development tools • 16V8 GAL-compatible PLDs

• 22V10 flash/BiCMOS PLDs• MAX CPLDs (28-84 pins)

PROMs/EPROMs Data Communications• 4K to 512K CMOS PROMs • HOTLink point-to-point communications• 4K-1M CMOS EPROMs • Fast Ethernet, Fibre Channel, and ATM/ SONET transceivers/receivers

Timing Technology Products Logic and Bus Products• Motherboard frequency synthesizers • FCT logic chips• Low-power system logic devices • VMEbus controllers• Graphics frequency synthesizers • ECL-TTL translators• Programmable products • Bit slice/multipliers• Custom oscillators • Programmable skew clock buffers• Pentium clock synthesizers/drivers • Low-skew clock buffers


In 3Q96, Cypress announced its decision to restructure its Fab I facility. Previously, Fab I was used for low-production but now is used for research and development purposes only. Also during 3Q96, Cypress putconstruction of Fab V, which began in 1995, on hold until market conditions look more favorable.

Cypress Semiconductor Inc. Cypress Semiconductor (Texas) Inc.3901 North First Street 17 Cypress DriveSan Jose, California 95134 Round Rock, Texas 78664Telephone: (408) 943-2653 Telephone: (512) 244-7789Fab I Fab II (17 percent owned by Altera)Cleanroom size: 12,000 square feet Cleanroom size: 25,000 square feetCapacity (wafers/week): 1,000 Capacity (wafers/week): 2,700Wafer size: 150mm Wafer size: 150mmProcesses: CMOS, BiCMOS Processes: CMOS, BiCMOSProducts: R&D Products: SRAMs, PLDs, FPGAs, EPROMs,Feature sizes: 0.35µm-0.8µm datacom ICs

Feature sizes: 0.5µm-1.2µm



Cypress Semiconductor (Minnesota) Inc. Cypress Semiconductor (Minnesota) Inc.2401 East 86th Street 2401 East 86th StreetBloomington, Minnesota 55425 Bloomington, Minnesota 55425Telephone: (612) 851-5100 Telephone: (612) 851-5100Fab III Fab IVCleanroom size: 20,000 square feet Cleanroom size: 30,000 square feetCapacity (wafers/week): 2,400 Capacity (wafers/week): 3,000Wafer size: 150mm Wafer size: 200mmProcesses: CMOS, BiCMOS Processes: CMOS, BiCMOSProducts: SRAMs, PLDs, FPGAs, logic chips, Products: SRAMs, specialty memories

datacom ICs Feature size: 0.5µmFeature sizes: 0.5µm-1.2µm

Cypress SemiconductorRound Rock, TexasFab VCleanroom size: 35,000 square feetCapacity (wafers/week): 5,000 (when fully equipped)Wafer size: 200mmProcesses: CMOS, BiCMOSProducts: SRAMs, EPROMs, Logic ICsFeature sizes: 0.25µm-0.5µm(Production tentatively scheduled for 1998)

Key Agreements

• In February 1997, Cypress and QuickLogic announced the cancellation of a previous joint-develop, licensing,and foundry agreement for high-performance FPGA products and released plans for establishing a newfoundry alliance. As part of a new five-year agreement, Cypress will no longer market and sell antifuse FPGAproducts, but will continue to serve as a foundry for QuickLogic’s FPGAs. In addition, QuickLogic agreed topurchase all of Cypress’s existing FPGA inventory. Cypress holds a stake of less than 10 percent inQuickLogic.

• In 2Q96, Cypress settled its PLD litigation with AMD with a cross-licensing agreement.

• Cypress expanded its agreement with Altera Corporation regarding Altera's MAX 5000 EPLD line to bring afamily of smaller, faster devices to market.

1-86


Cyrix North American Company Profiles

CYRIX

Cyrix Corporation2703 North Central ExpresswayRichardson, Texas 75080-2010

Telephone: (214) 994-8388Fax: (214) 699-9857

Web Site: www.cyrix.com

Fabless IC Supplier


Japan: Cyrix K.K. • Kohoku-ku, Yokohama, JapanTelephone: (81) (45) 471-1661 • Fax: (81) (45) 471-1666

Europe: Cyrix International, Ltd. • Swindon, Wiltshire, United KingdomTelephone: (44) (1793) 417777 • Fax: (44) (1793) 417799

Asia-Pacific: Cyrix International, Ltd. • Hong KongTelephone: (852) 2485-2285 • Fax: (852) 2485-2920


1992 1993 1994 1995 1996

Sales 73 125 246 228 184Net Income 8 20 38 16 (26)R&D Expenditures 8 16 25 29 32Capital Expenditures* 7 15 24 80 13

Employees 150 220 309 400 391

*As part of the agreement made with IBM in early 1994, Cyrix purchases substantially all of the equipment requiredby IBM to manufacture Cyrix products.


Founded in 1988, Cyrix Corporation designs, develops, and markets high-performance x86 software-compatiblemicroprocessors for the desktop and mobile computer markets. The company seeks to serve the needs of the PCmarketplace as an alternative source for x86 microprocessors of original design with competitiveprice/performance characteristics.


North American Company Profiles Cyrix

Fiscal 1996 was a difficult year for Cyrix financially. The transition from the old 486 product line to the 6x86™processor did not occur as quickly as expected. The 6x86 was recognized with numerous awards for itsexceptional processing power, but it did not gain broad market acceptance until late in the year. Significantdemand for the 6x86 was experienced in 4Q96.

Plans for 1997 include a focus on promoting the company’s 6x86 while managing a transition to a successorproduct, code-named M2. The M2 will feature significant architectural enhancements and will be fully compatiblewith multimedia extension (MMX) technology. In addition, Cyrix has developed a new product called theMediaGX™ processor that is targeted at the sub-$1,000 consumer PC market. The MediaGX™ integrates audio,video, and certain system functions within the processor unit, providing a complete system solution. Cyrix alsodesigned the entire reference system for the MediaGX to accelerate market acceptance and enable quick time-to-market for manufacturers.

North America46%

Asia-Pacific24%


Europe30%

Cyrix has strategic alliances with IBM Microelectronics and SGS-Thomson Microelectronics for the production of itshigh-performance microprocessors. These agreements support the company's current strategy to focus itsresources on product design, market development, and customer support.

Management

Harvey B. Cash ChairmanJames W. Swent* Chief Financial Officer and Acting Chief Executive OfficerKenneth B. Edoff Senior Vice President, SalesKevin C. McDonough* Senior Vice President, EngineeringMark W. Bluhm Vice President, Strategic Planning and Business DevelopmentNancy B. DeChaud* Vice President, ManufacturingRussell N. Fairbanks, Jr. Vice President and General CounselRobert D. Maher Vice President, EngineeringLewis R. Paceley Vice President, MarketingRichard Rippeteau Vice President, Sales, AmericasEverett J. Roach Vice President, Sales, Asia-PacificStephen A. Tobak Vice President, Corporate and Channel Marketing

*Office of the President

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Cyrix North American Company Profiles


Cyrix’s first products were math coprocessors. The company delivered its first x86 microprocessors in 1992. Itthen moved quickly to develop a full line of 486 processors with advanced power management, clock-doublingcapabilities, integrated math coprocessors, and write-back cache. In 1995, Cyrix introduced its fifth-generation5x86 and sixth-generation 6x86 high-performance processors (the 486 products are no longer in production).

Cyrix’s 6x86 (formerly called the M1) is based on a superscalar, superpipelined architecture and a RISC core. The6x86 is offered at several performance levels ranging from PR133+ to PR200+. The PR+ nomenclature suggestswhich specific higher-clock-rate Intel Pentium each of the members best compete with.

Launching of the company’s M2 processor was scheduled to occur in May 1997. Building on the 6x86 core, thesix-million-transistor M2 features Cyrix’s fully compatible MMX technology, a quadrupled (64KByte) internal cache,enhanced memory management, and other architectural and performance innovations. The M2 is claimed todeliver up to twice the performance of the 6x86 processors on 32-bit applications. Meanwhile, the developmentof the seventh-generation processor, called the M3 or 7x86, is under way.

Cyrix began shipping its first MediaGX processors in early 1997. Due to the number of functions integrated on-chip, the MediaGX eliminates the need for L2 cache, memory controller, graphics controller, graphics memory, andaudio card. Although not socket compatible with competing Pentium processors with MMX, Cyrix’s 120MHz and133MHz MediaGX processors have equivalent Winstone 97 performance to Intel 120MHz and 133MHzprocessors. The MPU interfaces with the Cyrix-designed Cx5510 core logic chipset that provides a PCI-ISAbridge. By the end of 1997, the MediaGX is expected to reach 200MHz.

The company currently uses 0.35µm five-layer-metal CMOS technology for its 6x86 products. The initial MediaGXprocessor is being produced with IBM’s 0.44µm three-layer-metal CMOS process, with a 0.4µm processscheduled for implementation by the end of 1997. The M2 is being produced with IBM’s 0.33µm five-layer-metalCMOS process.


Cyrix currently has relationships with IBM Microelectronics and SGS-Thomson for the manufacture of its ICs. SGS-Thomson has been a manufacturing partner of Cyrix since October 1990. In early 1994, their pact was extendedand is now valid through the end of 1997. The two companies are said to be negotiating another extension.Most, if not all, the 6x86 production by SGS-Thomson is currently being sold under the ST name and not soldback to Cyrix.

Cyrix's agreement with IBM Microelectronics was established in April 1994 and is good through the end of 1999.As part of the agreement, Cyrix made a capital equipment investment of about $88 million in an IBM fab in 1995.Cyrix expanded its partnership with IBM in May 1996 to increase the quantity of wafers supplied by IBM throughthe end of 1997.


North American Company Profiles Cyrix

To complement its partnerships with SGS-Thomson and IBM, Cyrix is negotiating to sign up a third manufacturingpartner. However, the arrangement will likely be for foundry supply only. IBM and SGS-Thomson are licensed toalso produce Cyrix-designed x86 processors under their own names.

The construction of its own fabrication facility is not part of the company’s current business plan. However, theoption is not being ruled out. A jointly owned fab is a more likely option.

Key Agreements

• In 1Q96, Cyrix announced an agreement with Cadence Design Systems. Under the agreement, Cadence willprovide a broad range of technologies and services to Cyrix, and work together in designing Cyrix’s seventh-generation x86 microprocessor, called the M3.

• Cyrix extended its wafer supply agreement with SGS-Thomson in 1994. Under the new arrangement, SGS-Thomson increased the number of wafers it produces for Cyrix and is allowed to make a certain percentage ofthose same wafers for itself. In addition, Cyrix granted SGS-Thomson the right to use certain Cyrix-designedchips as part of SGS-Thomson’s ASIC libraries. SGS-Thomson is allowed to produce and sell such ASICproducts under its own name in unlimited quantities, with Cyrix receiving royalties from the sale of the devices.Also, Cyrix has the right to sell the SGS Thomson-designed ASICs under its own name.

• Cyrix and IBM announced a five year agreement in early 1994 under which IBM is manufacturing Cyrix's x86-compatible microprocessors. The agreement calls for the two companies to equally share the output of theCyrix-designed chips.

1-90


Dallas Semiconductor North American Company Profiles

DALLAS SEMICONDUCTOR

Dallas Semiconductor Corporation4401 South Beltwood Parkway

Dallas, Texas 75244-3292Telephone: (972) 371-4000

Fax: (972) 371-3715Web Site: www.dalsemi.com

IC Manufacturer


Europe: Dallas Semiconductor • Birmingham, EnglandTelephone: (44) (121) 782-2959 • Fax: (44) (121) 782-2156

Asia-Pacific: Dallas Semiconductor Taiwan • Taipei, TaiwanTelephone: (886) (2) 698-3940 • Fax: (886) (2) 698-3941


1992 1993 1994 1995 1996


Employees 696 748 850 1,000 1,300


Founded in 1984, Dallas Semiconductor designs, manufactures, and markets high performance CMOS ICs andsemiconductor-based systems that provide innovative and cost-effective solutions to electronic design problemsin a wide range of markets. The company's continuous new product development strategy serves as a means toincrease future revenues and avoid dependence upon a single industry, market, or customer. Its products aresold to OEMs in the personal computer and workstation, scientific and medical equipment, industrial control,automatic information, telecommunications, and other markets.


North American Company Profiles Dallas Semiconductor


Computing33%

Communications33%

Industrial34%

North America51%


Europe19%

Asia30%

Management

Charles Vincent Prothro Chairman, President, and Chief Executive OfficerChao C. Mai, Ph.D. Senior Vice PresidentMichael L. Bolan Vice President, Marketing and Product DevelopmentAlan P. Hale Vice President, FinanceF.A. Scherpenberg Vice President, Computer Products


Dallas Semiconductor's product groups include:

• Timekeeping circuits • Microcontrollers (8-bit)Commercial Secure MCUsComputing High-speed MCUs

• Non-volatile RAMs (16K to 4M) • Automatic InformationIntegrated battery backup Cryptographic iButton™Intelligent sockets iButton™

• Telecommunications ICs • System extension circuitsT1 and E1 circuits CPU supervisorsSCSI terminators Digital potentiometers

Thermal and battery management• Silicon timed circuits

In 1996, Dallas’ Automatic Information product division introduced a device called the Cryptographic iButton. Thedevice is said to provide safer transfer of sensitive information such as credit card numbers or electronic transfer offunds. The device consists of a processor, an arithmetic accelerator, a true time clock, a random numbergenerator, and 8K of SRAM.

1-92


Dallas Semiconductor North American Company Profiles


Dallas Semiconductor4401 South Beltwood ParkwayDallas, Texas 75244-3292Cleanroom size: 17,000 square feet (Class 1)Capacity (wafers/week): 2,500Wafer size: 150mm (2 lines)Process: CMOSFeature sizes: 0.35µm-0.6µm


North American Company Profiles Digital Semiconductor

DIGITAL SEMICONDUCTOR

Digital Equipment CorporationDigital Semiconductor

77 Reed RoadHudson, Massachusetts 01749

Telephone: (508) 568-6868Web Site: www.digital.com/semiconductor

Captive IC Manufacturer


1992 1993 1994 1995 1996

CorporateSales 13,931 14,371 13,451 13,813 14,563Net Income (2,796) (251) (2,156) 122 (112)

Semiconductor*Sales 230 240 270 305 375 Internal Sales 230 235 245 255 290 External Sales — 5 25 50 85

Employees 2,500

*Calendar year


Digital Equipment Corporation (DEC) is one of the world's largest manufacturers of computers and computer-related products. The company provides network computer systems, systems integrator, computer peripheralequipment, software, and associated computer accessory equipment to customers in more than 100 countries.

DEC began developing semiconductor products in 1975 for use in its electronic systems. In 1993, Digitalexpanded its semiconductor charter to become a merchant vendor. As part of its push into the merchant market,DEC spun out its semiconductor operation in mid-1994 to become an autonomous business unit, called DigitalSemiconductor. For the past several years, Digital Semiconductor has worked to establish itself as anindependent semiconductor vendor, but its largest customer always has been Digital Equipment, which bases itsworkstations and servers on its proprietary high-performance RISC microprocessor, called Alpha. Still, thecompany desires to expand its merchant focus.

Digital Semiconductor designs, manufactures, and markets a broad portfolio of semiconductor products includingits Alpha processor and PCI-based networking, bridge, and graphics/multimedia devices.

1-94


Digital Semiconductor North American Company Profiles

Management

Robert B. Palmer President and Chief Executive OfficerCharles F. Christ Vice President and General Manager, Components DivisionR.E. Caldwell Vice President, Digital SemiconductorWilliam N. Johnson Vice President, Marketing, Digital Semiconductor


Digital Semiconductor’s IC products include its Alpha 64-bit RISC microprocessors with speeds as fast as 533MHz;the high-performance, low-power StrongARM 32-bit RISC microprocessor; PCI-compliant system and peripherallogic chipsets; PCI-PCI bridge devices; Ethernet and Fast Ethernet LAN controller ICs; and graphics andmultimedia coprocessors.

Digital’s Alpha 21164 microprocessor is available in speed grades ranging from 366Hz to 533Hz. It is designed foruse in high-performance computing systems like network servers and workstations. A 600MHz version of the21164 entered the sampling stage in early 1997. Also in early 1997, Digital announced its first Alpha chipdesigned for use in a desktop PC. The 21164PC die is 34 percent smaller than its big brother 21164 and requires86 fewer pins. The result is a high-performance 533MHz RISC microprocessor for systems that sell for as little as$2,500.

Digital's IC products are built using primarily CMOS and bipolar technologies, with all advanced processdevelopment centered on CMOS technology. Its leading-edge 0.35µm, four-level interconnect, CMOS-6process technology is being used to manufacture the latest versions of the Alpha 21164.


In 1995, Digital Semiconductor sold to Motorola its South Queensferry, Scotland, fabrication facility.

Digital Semiconductor75 Reed RoadHudson, Massachusetts 01749Telephone: (508) 568-4000Fab 6Cleanroom size: 64,000 square feetCapacity (wafers/week): 5,000Wafer size: 200mmProcess: CMOSProducts: MPUs, MPRs, ASICs, logic ICs, custom ICsFeature sizes: 0.35µm, 0.5µm (eventually, 0.18µm)


North American Company Profiles Digital Semiconductor

Key Agreements

• Samsung Electronics became a licensee of the Alpha architecture in 1996 and is manufacturing and sellingAlpha microprocessors to its customers as an independent alternate source of Alpha technology.

• Mitsubishi agreed to be both a second source for Digital's Alpha MPUs and a development partner. TheJapanese company began producing Alphas for Digital at its Saijo facility in late 1994. Subsequently,Mitsubishi began designing and fabricating its own versions of the RISC architecture for use in its own systemsand for sale to its own customers.

• In 1995, Advanced RISC Machines Ltd. began jointly developing with Digital and Apple Computer a family ofhigh-performance microprocessors compatible with the ARM RISC line. The 32-bit processor, calledStrongARM, is being produced by Digital using its 0.35µm CMOS-6 process. Volume shipments began in thefirst half of 1996 and are targeted at applications in digital imaging, multimedia, set-top boxes, handheldcomputers, and communications products, as well as Apple's Newton line.

1-96


Dionics North American Company Profiles

DIONICS

Dionics Inc.65 Rushmore Street

Westbury, New York 11590-4839Telephone: (516) 997-7474

Fax: (516) 997-7479

IC Manufacturer

Employees 35


Established in 1969, Dionics is a developer, manufacturer, and marketer of innovative high-quality integratedcircuits and discrete products. It targets these devices at areas of the industrial and military markets where highvoltage, high frequency, and unusual structures are required.

Using a dielectric isolation process, Dionics has evolved from a supplier of discrete components to a manufacturerof hybrid circuits and photovoltaic ICs, solid-state relays (SSRs), and MOSFET-drivers. The products were initiallytargeted for use in digital watches but have since made their way to markets that require high reliability that isinherent to the dielectric isolation process.

Management

Bernard L. Kravitz PresidentSherman Gross Vice President


Photovoltaic ICs, SSRs, and MOSFET-drivers.


Dionics Inc.65 Rushmore StreetWestbury, New York 11590-4839Cleanroom size: 3,000 square feetCapacity (wafers/week): 400Wafer size: 100mmProcess: Dielectric isolation bipolarProducts: Photovoltaic ICs, SSRs, and MOSFET-driversFeature sizes: 2.0µm-5.0µm


North American Company Profiles DSP Group

DSP GROUP

DSP Group, Inc.3120 Scott Boulevard


Fax: (408) 986-4323Web Site: www.dspg.com

Fabless IC Supplier


Japan: DSP Group Japan • Tokyo, JapanTelephone: (81) (3) 5496-1611

Europe: DSP Group Europe • Massy, FranceTelephone: (33) (2) 47-68-67-54


1992 1993 1994 1995 1996

Sales 9 12 29 50 53Net Income (6) (0.4) 4 7 6R&D Expenditures 4 2 4 8 8



DSP Group, Inc. develops, licenses, and markets digital signal processing (DSP) ICs, cores, and related softwaretargeted at digital speech applications in the multimedia personal computer, consumer telephony, and computertelephony markets.

DSP Group began business in 1987 with the purchase of a small design house that was involved in paramilitaryDSP-related design for applications such as noise cancellation and eavesdropping. The company begandeveloping its own DSPs and established a design center in Israel in 1990.

The company’s strategy is to combine three key technologies—speech processing algorithms, telephonyalgorithms, and digital signal processors—to deliver a wide range of enabling application-specific DSPs to its targetmarkets.

1-98


DSP Group North American Company Profiles

DSPs77%

Royalties/Licensing/Other

23%


Much of DSP Group’s revenues are generated in international markets, primarily in Europe and Asia.

Management

Igal Kohavi ChairmanEli Ayalon President and Chief Executive OfficerMartin Skowron Senior Vice President, OperationsAvi Basher Vice President, Finance, and Chief Financial OfficerIrving Gold Vice President, DSP Core TechnologyMoshe Shahaf Chief Technology OfficerGideon Wertheizer Vice President, VLSI Design CenterSerdar Yurdakul Vice President, PC Telephony and TrueSpeech Licensing


DSP Group has developed a family of low-power consumption, low-cost DSP core architectures that are suitablefor consumer, mobile computer, and wireless communications products. The company’s products aremanufactured using 0.6µm-0.8µm CMOS technologies.

SmartCores Products• The company’s SmartCores products are a family of standard DSP macrocells for use in standard cell ASIC

libraries. The SmartCores are designed for speech/audio processing, telecommunications, digital cellular, andembedded control applications. The first two members of the family are the PineDSPCore™ and theOakDSPCore™, both of which are 16-bit general-purpose, low-power, low-voltage, and high-speed DSP corearchitectures. The PineDSPCore is based on 0.8µm or 0.6µm double-level-metal CMOS technology (scalableto 0.5µm and below). The OakDSPCore is based on 0.6µm double-level-metal CMOS technology (scalable to0.5µm and below).

TrueSpeech Software• TrueSpeech® is a proprietary software-based digital speech compression technology. It is designed for a wide

range of applications, including video conferencing, computer telephony, the Internet, and personalrecorders.


North American Company Profiles DSP Group

CT Products• DSP Group’s CT products are coprocessors that implement real-time TrueSpeech compression and

decompression functions. They are available for Windows 95 messaging, DSVD (digital simultaneous voiceand data) modem, video conferencing, and multimedia visual telephony applications.

TAD Products• The company’s D6000 family of products are for digital telephone answering device (TAD) and voice recorders.

They implement all functions of TrueSpeech compression and decompression, voice prompts, telephone linesignal processing, and memory management.

Current licensees of the PineDSPCore and OakDSPCore architectures include Adaptec, Asahi KaseiMicrosystems, Atmel-ES2, DSP Communications, GEC Plessey Semiconductors, Harris, Hyundai/Symbios Logic,Integrated Circuit Systems, LSI Logic, NEC, Rohm, Samsung, Siemens, TI/Silicon Systems, TEMIC, TSMC, VLSITechnology, and Xicor.

Licensees of DSP Group’s TrueSpeech technology include Atmel, Cirrus Logic, Creative Labs, Intel, LSI Logic,Lucent Technologies, Microsoft, Siemens, Sierra Semiconductor, U.S. Robotics, and VLSI Technology.


As a fabless supplier, DSP depends on foundries for the manufacturing of its devices. The company hasestablished foundry relationships with several companies, including TSMC and Samsung.

1-100


EDI North American Company Profiles

ELECTRONIC DESIGNS (EDI)

Electronic Designs, Inc.One Research Drive

Westborough, Massachusetts 01581Telephone: (508) 366-5151

Fax: (508) 836-4850Web Site: www.electronic-designs.com

Fabless IC Supplier


Europe: Electronic Designs Europe Ltd. • Surrey, United KingdomTelephone: (44) (1276) 472637 • Fax: (44) (1276) 473748

Financial History ($M), Fiscal Year Ends September 30

1995 * 1996

Sales 40 59Net Income (3) 4R&D Expenditures 3 3

Employees 85 125

*Pro forma data. Electronic Designs, Inc. was acquired by Crystallume in October 1995 and the entire companywas renamed Electronic Designs, Inc. in March 1996.


Electronic Designs, Inc. was originally established in 1984 under the name of Crystallume. From 1984 to October1995, the company had been primarily engaged in research and development of diamond coatings using CVDtechnologies. In October 1995, Crystallume acquired Electronic Designs, Inc., a fifteen-year-old privately heldMassachusetts-based company involved in the manufacture of high density memory components and active-matrix LCDs. As a result of the acquisition, the company has shifted its emphasis from diamond coatings to thedesign, manufacture, and sale of semiconductor and flat panel display products. To reflect this shift in businessfocus, the company changed its name from Crystallume to Electronic Designs, Inc. (EDI) in March 1996.


North American Company Profiles EDI

Memory Products92%


Displays6%

Diamond Products2%

EDI’s memory products are used in many segments of the electronic equipment industry, including computersystems and peripherals, telecommunications, medical equipment, and military systems. The companyemphasizes a time-to-market advantage for its high-speed SRAM modules. Other memory products incorporateSRAM, DRAM, flash, and EEPROM technologies. The company recently announced the release of a line ofPCMCIA memory cards. Memory product development is currently focused on the design and prototyping of newmodule and monolithic products based on 4M SRAM, as well as on new MCM-L, flash memory, and high-densityDRAM designs.

EDI’s offering of AMLCDs includes various sizes of ruggedized panels for use in display heads, monitors, andcomputer systems. The company is developing technology for a PC system incorporating its displays, in additionto electronic circuit boards for “smart” displays.

The company’s diamond research is focused on improving tooling products and related diamond coatingprocesses as well as developing numerous other applications for its diamond coating process. Furthermore, EDIis developing a semiconductor product incorporating diamond as a heat spreader to significantly improve heatremoval and thus improve device performance and reliability in heat sensitive applications.

In fiscal 1996, approximately 34 percent of EDI’s revenues were represented by export sales to customersprimarily in Europe.

Management

Don McGuinness Chairman, President, and Chief Executive OfficerFrank Edwards Senior Vice President, Finance, and Chief Financial OfficerKen Buckley Vice President, Marketing and SalesDaniel R. Doyle Vice President, Display ProductsFrank Muscolino Vice President and General Manager, Display ProductsRichard J. Sawers Vice President

1-102


EDI North American Company Profiles


EDI's products include the following:

• High-speed monolithic 1M and 4M CMOS SRAMs (industrial or military)• High-density CMOS SRAM modules (1M to 32M) with speeds of 8ns-70ns (commercial, industrial, or military)• JEDEC pinout super high-density DRAM modules (64MB to 288MB; commercial or industrial)• JEDEC pinout flash SIMM modules (4M to 64MB; commercial or industrial)• Active-matrix LCDs for avionics and other specialty applications


EDI handles assembly, test, and QCI at its headquarters in Westborough. For the production of its memoryproducts in wafer, die, and component form, the company has partnerships with major semiconductormanufacturers in the U.S. and the Far East, including Micron, Mitsubishi, Samsung, and Sharp.

Key Agreements

• EDI formed an agreement with Atmel in 1994 calling for EDI to design, manufacture, and market high-densitymemory modules using Atmel's flash memory devices.

• EDI signed a licensing agreement with Thomson-CSF that enables EDI to make and market products using theFrench company's technology for 3D stack memory products.


North American Company Profiles EG&G Optoelectronics

EG&G OPTOELECTRONICS

EG&G, Inc.Optoelectronics Group

2175 Mission College BoulevardSanta Clara, California 95054

Telephone: (408) 565-0700Fax: (408) 565-0777

IC Manufacturer


Europe: EG&G, Inc., Reticon Division • Munich, GermanyTelephone: (49) (89) 92692-666 • Fax: (49) (89) 911-008


1992 1993 1994 1995 1996

CorporateSales 1,320 1,319 1,333 1,420 1,427Net Income 88 59 (6) 68 60

OptoelectronicsSales 210 201 213 259 270


EG&G Optoelectronics is one of three product groups within EG&G, Inc., a $1.4 billion company involved indiversified technology markets. The EG&G Optoelectronics business segment consists of eight autonomousdivisions, including EG&G Amorphous Silicon, EG&G Canada Ltd., EG&G Electro-Optics, EG&G HeimannOptoelectronics, EG&G IC Sensors, EG&G Judson, EG&G Reticon, and EG&G Vactec. These businessesspecialize in photonic products that are sensitive in the X-ray and ultraviolet to far infrared region of the lightspectrum.

Technical Services39%

Instruments23%

MechanicalComponents

19%

Optoelectronics19%


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EG&G Optoelectronics North American Company Profiles

The divisions involved in the production of integrated circuit-related devices are EG&G Reticon and EG&G ICSensors. Reticon was founded in 1971 and became a subsidiary of EG&G in 1976. From its start, Reticon hasbeen a leader in image sensing and signal processing technology. It was among the first semiconductorcompanies to specialize in solid-state imaging components and vision system products. IC Sensors was formedoriginally as a spin-off from Foxboro/ICT in 1982 and was acquired by EG&G in 1994. It is a leading developer andmanufacturer of pressure sensors, accelerometers, valves, and custom microstructures utilizing advanced siliconmicromachining technology.

Management

Richard Brownhill General Manager, EG&G IC SensorsChris Raanes General Manager, EG&G Reticon


EG&G Reticon Products• Image sensing products—character scan devices, instrumentation devices, multiplexer array chips,

photodiode arrays, pinned photodiode arrays, and CCDs.• Solid state camera products.

EG&G IC Sensors Products• Microelectromechanical system (MEMS) devices, such as pressure sensors, accelerometers, precision

microvalves, and custom microstructures for a broad range of applications, including medical, industrial,automotive, consumer, and aerospace.


EG&G Reticon EG&G IC Sensors345 Potrero Avenue 1701 McCarthy BoulevardSunnyvale, California 94086 Milpitas, California 95035Telephone: (408) 738-4266 Telephone: (408) 432-1800Fax: (408) 738-3832 Fax: (408) 434-6681Capacity (wafers/week): 625 Cleanroom size: 10,000 square feetWafer size: 100mm Wafer size: 100mmProcesses: CMOS, PMOS, CCD Process: BipolarProducts: Linear ICs and image sensing devices Products: MEMS devices and sensorsFeature size: 2.0µm


North American Company Profiles Elantec Semiconductor

ELANTEC SEMICONDUCTOR

Elantec Semiconductor, Inc.1996 Tarob Court


Fax: (408) 945-9305Web Site: www.elantec.com

IC Manufacturer


Europe: Elantec Semiconductor, Inc. • Wokingham, United KingdomTelephone: (44) (1189) 776080


1992 1993 1994 1995 1996

Sales 15 18 23 27 37Net Income 0.3 1 1 3 4R&D Expenditures 4 4 5 6Capital Expenditures 1 1 2 2

Employees 110 120 125 155 162


Elantec Semiconductor, Inc., founded in 1983, designs, manufacturers, and markets high-performance analogand mixed-signal integrated circuits for the video/multimedia, data processing, instrumentation, andcommunications markets. The company serves these markets with standard products and application-specificstandard products (ASSPs), using primarily high-speed complementary bipolar and advanced CMOStechnologies.

Elantec has transformed itself from a military hybrid IC supplier to a company focused on providing high-performance analog intensive functions for growing commercial markets. At one time, military hybrid salesaccounted for 90 percent of the company's total sales, versus about nine percent in 1996.

In October 1995, the company completed its initial public offering.

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Elantec Semiconductor North American Company Profiles

North America48%


Europe13%

Asia39%

Management

Donald T. Valentine ChairmanDavid O'Brien, Ph.D. President and Chief Executive OfficerRichard E. Corbin Vice President, Bipolar DesignRalph S. Granchelli, Jr. Vice President, Marketing and SalesTerrence W. Plette Vice President, Finance, and Chief Financial OfficerBarry L. Siegel Vice President, Engineering


Elantec's analog and mixed-signal ICs for commercial markets include the following:

• Op amps • H-sync Genlock-computer video circuits• Video circuits • DC restore subsystems• Analog buffers • Fader circuits• Fully integrated DC/DC converters • MOSFET drivers• Comparators and ATE pin drivers • PWM controllers• IGBT drivers • Laser diode drivers

Elantec has developed and used a variety of technologies for its products. In particular, Elantec has focused ondeveloping advanced complementary bipolar technology, using dielectric isolation and silicon-on-insulator (SOI)techniques, and advanced CMOS technology. The company utilizes external foundries for other technologiessuch as ultra high-speed bipolar and BiCMOS.


Elantec Semiconductor, Inc.1996 Tarob CourtMilpitas, California 95035Cleanroom size: 4,000 square feetCapacity (wafers/week): 300Wafer size: 100mmProcesses: Complementary bipolar, complementary bipolar dielectric isolation (DI), JI bipolar, CMOSProducts: Analog ICsFeature sizes: 5.0µm (bipolar); 1.2µm, 2.0µm (CMOS)


North American Company Profiles ESS Technology

ESS TECHNOLOGY

ESS Technology, Inc.48401 Fremont BoulevardFremont, California 94538Telephone: (510) 492-1088

Fax: (510) 492-1098Web Site: www.esstech.com

Fabless IC Supplier


Asia-Pacific: ESS Technology, Inc. • Taipei, TaiwanTelephone: (886) (2) 346-5300 • Fax: (886) (2) 346-1698


1992 1993 1994 1995 1996

Sales 24 15 33 106 227Net Income 5 0.2 8 30 22R&D Expenditures 4 3 4 9 20

Employees 145 253


ESS Technology, founded in 1984, designs, develops, and markets highly integrated mixed-signalsemiconductor solutions for multimedia applications in the PC and consumer markets, primarily to multimediadesktop and notebook computer manufacturers. ESS is a leading supplier of mixed-signal PC audio solutions thatintegrate all essential audio components on a single chip. In 1996, PC audio products represented 92 percent ofsales.

In an effort to broaden its product offerings, ESS made two company acquisitions in 1Q96. The companyacquired VideoCore Technology, Inc., a developer of digital video technology, and OSEE Technology, Inc., adeveloper of fax/modem technology.

Current development is focused on new PC audio and multimedia products for the PC and consumer markets thatprovide video and fax/modem/voice capabilities.

In 1996, 92 percent of ESS Technology’s total sales were to international customers.

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ESS Technology North American Company Profiles

Management

Fred S.L. Chan Chairman, President, and Chief Executive OfficerRobert L. Blair Executive Vice President, OperationsNicholas A. Aretakis Vice President, SalesJohn H. Barnet Vice President and Chief Financial OfficerHoover J. Chen Vice President, EngineeringJohnston Chen Vice President, Asia-Pacific SalesJan Fandrianto Vice President, Video GroupHadi Ibrahim Vice President, Engineering, Multimedia Technology Design (Austin, Texas)Robert S. Plachno Vice President, Research and DevelopmentRoger K. Shum Vice President, ManufacturingChi-Shin Wang Vice President and Chief Technical OfficerGary Breeding Director, Marketing Communications


ESS Technology has three principal product lines: the AudioDrive™ family, which targets the PC digital audiomarket; the VideoDrive™ family, which targets MPEG-1 and MPEG-2 decompression-based consumer products,such as DVD, video compact disk players, and set-top boxes; and the TeleDrive™ family, which focuses onintegrated audio-fax/modem applications, including full duplex speakerphone, digital simultaneous voice anddata, and videoconferencing.

ESS Technology’s audio chips have migrated from 12-bit to 16-bit and from mono to stereo sound. The companyhas also developed a core library of audio semiconductor designs, including microcontroller, bus interface, codec,mixer, filter and FM synthesizers, and device drivers, as well as application software.

The company’s chips are manufactured using mixed-signal 0.5µm and 0.6µm CMOS process technologies.


ESS has contracts with several independent foundries for the manufacture of its products. The majority of itsdevices are currently manufactured by Taiwan Semiconductor Manufacturing Company (TSMC), its primarysupplier since 1989. The company also uses UMC, Sharp Corporation, and IC Works.

In December 1995, ESS announced a wafer supply program to commit approximately $62 million, and an option tocommit another $31 million, over a three year period for expanding manufacturing capacity and developingadvanced technology. The company expanded its relationship with TSMC by entering into a long term agreementfor an increased amount of wafer capacity. ESS agreed to pay approximately $32 million to TSMC in exchange forwafer supply through 1999. ESS also obtained an option to further expand this agreement for additional capacity.

ESS also entered into a joint venture agreement with United Microelectronics Corporation (UMC) of Taiwan. ESSagreed to invest $30 million for a five percent equity ownership in UMC’s new 200mm wafer joint manufacturingfacility, United Integrated Circuits Corporation (UICC). The wafer fab, located in Taiwan, was expected to beginproduction by mid-1997.


North American Company Profiles Exar

EXAR

Exar Corporation48720 Kato Road


Fax: (510) 668-7017Web Site: www.exar.com

Fabless IC Supplier


Japan: Exar Japan Corporation • Kawasaki-shi, Kanagawa, JapanTelephone: (81) (44) 922-9411 • Fax: (81) (44) 922-9368

Europe: Exar, Ltd. • Crowborough, East Sussex, United KingdomTelephone: (44) (1892) 665718 • Fax: (44) (1892) 664354


1993 1994 1995 1996 1997

Sales 146 162 159 126 92Net Income 14 16 (11) 14 (9)R&D Expenditures 11 11 14 16 14

Employees 500 525 468 447 325


Founded in 1971, Exar Corporation is involved primarily in the design and marketing of analog and mixed-signalapplication-specific standard products, primarily for use in communications, consumer electronics, and computerproducts. Nearly 80 percent of the company’s revenues are generated from sales to these three markets. Othermarkets served by Exar include automotive, industrial, and medical. The company also produces digital ICs andgeneral-purpose analog ICs that are used primarily to complement its other products.

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Exar North American Company Profiles


1996 Sales by Product Line

Industrial,Automation,

and Specialty14%

Data Converter31%

Consumer11%

Sensor and Accelerometer1%

PC11%

Japan32%

ROW1%


North America45%

Europe12%

Asia10%

Exar’s business strategy has changed significantly in recent years. Before 1990, Exar was a wholly ownedsubsidiary of Rohm in Japan. As of January 1994, Rohm was no longer an affiliate of the company and today,holds less than one percent ownership in Exar. In April 1994, Exar transferred its epitaxial and bipolar wafermanufacturing operations to Rohm, thereby making Exar a fabless IC supplier.

In mid-1995, Exar withdrew from two long-standing businesses, mass storage ICs and Rohm-designed consumerelectronics IC products. Its departure from the hard disk drive market was involuntary, a result of actions taken bySGS-Thomson, its foundry supplier of wafers for mass storage ICs.

To counter its discontinued businesses, Exar has made a series of acquisitions. In 2Q94, the company acquiredOrigin Technology, Inc. for its automatic speech recognition technology and products, and Micro Power Systems,Inc. for its data acquisition technology and access to the document imaging market. In 1995, Exar acquiredStartech Semiconductor, Inc., a supplier of ASSPs for a variety of markets, and Silicon Microstructures, Inc., acompany involved in silicon sensors for the medical, automotive, and consumer markets. These acquisitionscomplement the company’s strategy to apply its mixed-signal technology expertise to niche segments within theautomotive, industrial, and medical markets.

Although Exar’s total revenues have been on the decline for the past few years, its core business has beengrowing. Its core business represented nearly all of total revenues in fiscal 1996 versus about 45 percent in fiscal1993.

Management

Donald L. Ciffone President and Chief Executive OfficerRonald W. Guire Executive Vice President and Chief Financial OfficerAurelio E. Fernandez Senior Vice President, Worldwide SalesRoubik Gregorian Vice President, Chief Technical Officer, and General Manager,

Communications and Computer DivisionJim Knutti Vice President and General Manager, Silicon Microstructures DivisionJohn Sramek Vice President and General Manager, Video and Imaging DivisionSuhas "Sid" Bagwe Vice President, Strategic Planning and Long Range DevelopmentThomas W. Jones Vice President, Reliability and Quality AssuranceStephen W. Michael Vice President, Operations Division


North American Company Profiles Exar


Exar’s IC products can be divided into five major market groups: communications, data communications, video andimaging, silicon microstructures, and other products.

• For the communications market, the company offers T1/E1 and T3/E3/STS1 line interface circuits, networkinterface circuits, speech recognition devices through its Origin Technology subsidiary, speakerphone andother telephony-oriented components, PLLs, and tone decoders.

• For the data communications market, Exar supplies UARTs/DUARTs/QUARTs, clock oscillators/clockmultipliers, line drivers/receivers, frequency timing generators and Super I/O devices through its StartechSemiconductor subsidiary, and fax/data/voice modem chipsets.

• For video and imaging applications, Exar supplies A/D and D/A converters, CCD analog signal processors andconditioners, automatic track finding (ATF) circuits, switched capacitor filters, and BBE® sound enhancementcircuits.

• Subsidiary Silicon Microstructures currently offers high-precision pressure sensors for applications such asengine control and tire pressure in automobiles, angioplasty and inter uterine pressure in medical instruments,and HVAC and pressure transducers in industrial equipment. Silicon Microstructures also suppliesaccelerometers for automotive applications.

• Other products include general purpose analog-to-digital and digital-to-analog converters for a wide variety ofapplications, including pace makers, handheld digital voltmeters, and high-speed digital communications.

Through several foundry partnerships, Exar has access to a multitude of process technologies, including bipolar,silicon gate and moly gate CMOS, and BiCMOS. The design rules of its bipolar processes range from 2.0µm to6.0µm. The CMOS processes in use include 0.6µm 2P3M, 0.8µm 2P2M, 1.2µm 2P2M, and 1.6µm 2P2M(5V/18V). Exar plans to implement a 3.3V 0.5µm 1P3M CMOS process in 1997 and a 0.35µm 1P2M process in1998. For BiCMOS, the company uses a 0.8µm process and plans to move to a 0.6µm process in 1997.


Exar obtains approximately half of its wafer requirements from Rohm. Its other foundry partners are AmericanMicrosystems, Nippon Precision Circuits, TSMC, and Chartered Semiconductor.

In 1995, Exar announced an agreement with IC Works calling for Exar to invest $15 million to help upgrade ICWorks’ fab from 125mm to 150mm wafers and improve its process technology. In return, Exar was to receive aguaranteed portion of the fab output over a five-year period. In early 1997, it was announced that the agreementwas terminated as a result of dramatically changed market conditions for wafer pricing and availability, the recentbusiness redirection of Exar, and delays in the commencement of anticipated production by the foundry.

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Fairchild Semiconductor North American Company Profiles

FAIRCHILD SEMICONDUCTOR

Fairchild Semiconductor Corporation333 Western Avenue

South Portland, Maine 04106Telephone: (207) 775-8100

Fax: (207) 761-6027Web Site: www.national.com/fairchild

IC Manufacturer

Employees 6,400


Fairchild Semiconductor was relaunched in March 1997 when the combined logic, memory, and discretebusinesses of National Semiconductor were purchased by private investors. Fairchild Semiconductor originallyemerged in the late 1950’s when the late Sherman Mills Fairchild sponsored a small group of scientists—amongthem Robert Noyce and Gordon Moore—in the development of a new process for the manufacturing oftransistors. The team reached their goal in 1959 with the introduction of the Planar process. A facility wasestablished in 1962 in South Portland, Maine, for the manufacture, test, and assembly of transistors.

Beginning in 1978, Fairchild became a major force in the development and production of logic circuits. Its firstinnovation was the FAST® (Fairchild Advanced Schottky Technology) family of advanced Schottky TTL logiccircuits. Next came the invention of the FACT™ (Fairchild Advanced CMOS Technology) family of logic circuits in1985. Still today, Fairchild is the leading supplier of FAST and FACT, as well as LCX, logic products.

In 1987, National Semiconductor purchased Fairchild from Schlumberger Ltd., a French conglomerate that hadacquired the company in 1979. National dropped the Fairchild name, but resurrected it in mid-1996 when its logic,memory, and discrete businesses were combined to form the Fairchild Semiconductor Division. The division wassold in March 1997. National retains a 16 percent stake in Fairchild.

Together with its advanced logic IC products, Fairchild’s high-performance non-volatile memory and discretesemiconductor technologies form the foundation of the new company’s product portfolio. The fiscal 1996 (endedMay 31) revenues from these products were approximately $600 million.

Fairchild is investing in research and development to enhance its portfolio in the fast-growth areas of CMOS, low-voltage logic, power and small-signal discretes, and non-volatile standard and application-specific memories.Applications for Fairchild’s products include automotive entertainment systems, communications products,desktop and portable computers, security, consumer products, and satellites and aerospace systems.


North American Company Profiles Fairchild Semiconductor

Management

Kirk Pond Chairman, President, and Chief Executive OfficerColin Cohen Vice President, Finance, and Chief Financial OfficerStephen Hamilton Vice President and General Manager, Memory Products GroupDarrell Mayeux Vice President, Sales and Marketing


MOS MEMORY ANALOG

DRAM Amplifier

SRAM Interface

✔ Flash Memory Consumer/Automotive

✔ EPROM Voltage Regulator/Reference

ROM Data Conversion

✔ EEPROM Comparator

✔ Other (Including Non-Volatile RAM) Other (Includes Telecom)


General Purpose Logic Bipolar Memory


Standard Cell Gate Array/Standard Cell

Field Programmable Logic ✔ Field Programmable Logic

Other Special Purpose Logic ✔ Other Special Purpose Logic

MPU/MCU/MPR

MOS MICROCOMPONENT

MPU OTHER

MCU Full Custom IC

MPR ✔ Discrete

DSP Optoelectronic

Logic Products

Fairchild offers 17 families of standard logic devices utilizing CMOS, bipolar, and BiCMOS process technologies.The company claims to be the world’s third-largest supplier of standard logic ICs.

Its logic products include FAST® high-speed, low-power bipolar devices; FACT™ high-performance advancedCMOS devices; FACT QS™ low-noise, high-performance advanced CMOS devices; LVQ low-voltage CMOSdevices, LCX/LVX high-performance, low-voltage CMOS devices with over-voltage protection; and VHC HC-replacement, low-noise, high-speed CMOS devices.

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Fairchild Semiconductor North American Company Profiles

Memory Products

Fairchild’s memory products include several varieties of non-volatile memory ICs. It is among the world’s leadingsuppliers of serial EEPROMs and EPROMs. Its EEPROM product group includes several families of standarddevices as well as application-specific devices such as a Plug-and-Play controller for ISA cards, a serial presencedetect (SPD) device for the memory module market, and the HiSEC™ family of products for remote keyless entryapplications. The company’s EPROM products include 5V devices with densities ranging from 16K to 4M and low-voltage 1M parts.

Through an alliance formed originally by National and Toshiba in 1992, Fairchild also offers flash memory devicescompatible with Toshiba’s NAND and NOR architectures.

Discrete Products

Fairchild’s principal discrete products are DMOS power MOSFETs. Its other discrete products are small-signalcomponents such as small-signal transistors, JFETs, and diodes.


Fairchild Semiconductor Corp. Fairchild Semiconductor Corp.333 Western Avenue 3333 West 9000 SouthSouth Portland, Maine 04106 West Jordan, Utah 84088Telephone: (207) 775-8100 Telephone: (801) 562-7000Fax: (207) 761-6027 Fax: (801) 562-7500Cleanroom size: 51,000 square feet Cleanroom size: 86,000 square feetCapacity (wafers/week): 12,350 Capacity (wafers/week): 8,000Wafer sizes: 100mm, 125mm, 150mm Wafer size: 150mmProcesses: CMOS, bipolar, BiCMOS Processes: CMOS, DMOSProducts: Logic ICs, discretes Products: EPROMs, EEPROMs, logic ICs, discretesFeature sizes: 0.8µm-2.5µm Feature size: 0.8µm

Some of Fairchild’s IC products continue to be produced at fabs owned by National Semiconductor and vice versa.Fairchild’s semiconductor assembly and test plants are located in Penang, Malaysia, and Cebu in the Philippines.

Key Agreements

• National and Fairchild remain closely linked through a long-term agreement to make the transition as smooth aspossible. The two companies also share and swap fab capacity.

• Motorola, Toshiba, and Fairchild Semiconductor announced in early 1997 they would jointly develop next-generation high-speed CMOS logic ICs. The three companies will work to develop 2.5V and 3.3V devices witha propagation delay time of 2ns.

• Fairchild has a long-term partnership with Toshiba for the development, licensing, design, and manufacture ofNAND and NOR flash memories. The agreement was signed by Toshiba and National Semiconductor in 1992.


North American Company Profiles Genesis Microchip

GENESIS MICROCHIP

Genesis Microchip Inc.200 Town Centre Boulevard

Suite 400Markham, OntarioCanada L3R 8G3

Telephone: (905) 470-2742Fax: (905) 470-2447

Web Site: www.genesis-video.com

Fabless IC Supplier

Employees 70


North America: Genesis Microchip Corporation • Mountain View, CaliforniaTelephone: (415) 428-4277 • Fax: (415) 428-4288


Founded in 1987, Genesis Microchip is a technology leader in digital video/image manipulation. The companydesigns, develops, and markets leading-edge ICs targeted at both existing and emerging applications demandinghigh-quality video/image processing. Genesis sets the standard in video/image resizing. Markets are divided intohigh-end chips (gm865 class), middle tier (gm833 class), and commodity, low-cost, high-performance cores.

Management

Paul M. Russo President and Chief Executive OfficerPeter Dakin Vice President, Manufacturing OperationsEric Erdman Vice President, Finance and AdministrationHamid Farzaneh Vice President, Worldwide SalesLance Greggain Vice President, Product Development OperationsStephen Solari Vice President, Marketing and Business DevelopmentScott Baker Director, Product Development OperationsPerry Chappell Director, SalesJordan Du Val Director, MarketingShyam Nagrani Director, SalesJay Giblon Manager, Information SystemsDavid Green Manager, SalesGraham Loveridge Manager, Customer and Product SupportPeter Mandl Manager, Video DSP Technology

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Genesis Microchip North American Company Profiles


Genesis' products include the Genesis Scaling™ series of video/image resizing ICs (gm865x1, gm833x2,gm833x3, gm833x3F), the gm2242B half-band filter, and the gmVLD family of video line doublers plus supportingevaluation boards and software. The patented algorithms and architectures provide improvement incomputational efficiency over traditional finite impulse response (FIR) filter structures. All of Genesis' designefforts currently employ 0.8µm (and below) CMOS technology. Several products are described below.

• gm865x1—This is the first of the Genesis Scaling chip series. The gm865x1 IC is a single-channel devicethat provides high-quality video/image processing technology for medical imaging, broadcast equipment,and projection systems.

• gm833x2—This is the second of the Genesis Scaling chip series and first in the mid-range family ofGenScale chips. The gm833x2 is a dual-channel device for use in workstation, projection systems, andmultimedia applications.

• gm833x3—This is a triple-channel version in the 833 class designed for use in projection systems,videographic workstations, and scan conversion equipment.

• gm833x3F (fast) “Bullet”—This is a 68MHz version of an RGB scaler, featuring low power and an advanced0.35µm, 3.3V CMOS process.

• gm2242B Half-Band Filter—This is a decimating/interpolating digital filter for use in applications requiringpre- or post-filtering of digital video signals. The gm2242B supports NTSC, PAL, SECAM, and square pixelvideo standards.

• gmVLD8/gmVLD10 Video Line Doublers—This is a single-chip de-interlacing device for use in equipmentsuch as large screen televisions, video walls, projection systems, video-in-a-window workstations, and hometheater screens.


North American Company Profiles Gennum

GENNUM

Gennum CorporationP.O. Box 489, Station A

Burlington, OntarioCanada L7R 3Y3

Telephone: (905) 632-2996Fax: (905) 632-2055

Web Site: www.gennum.com

IC Manufacturer


Japan: Gennum Japan K.K. • Suginami-ku, Tokyo, JapanTelephone: (81) (3) 3334-7700 • Fax: (81) (3) 3247-8839

Financial History ($M), Fiscal Year Ends November 30

1992 1993 1994 1995 1996


Employees 233 240 247 255 300


Gennum Corporation, formed in 1973, is a Canadian high technology company that designs, manufactures, andmarkets electronic components, primarily silicon integrated circuits and thick-film hybrid circuits, for specialapplications in the information world.

The company's products include low-voltage audio electronic amplifiers and analog signal processing circuitssupplied to the world hearing instrument industry; video signal distribution and processing components sold tothe professional video and broadcast television markets; and user specific ICs for a wide variety of specificapplications where information is being conditioned, transmitted, or interpreted.

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Gennum North American Company Profiles

United States42%

Canada 9%

Pacific Rim20%

1996 Sales By Geographic Region

Europe29%

Hearing InstrumentComponents

55%

User-Specific ICs3%

1996 Sales By Product Type

Video/BroadcastComponents

42%

Management

H. Patrick Thode ChairmanH. Douglas Barber, Ph.D. President and Chief Executive OfficerMichael R. Fielding Vice President, Marketing and SalesDavid L. Lynch Vice President, Research and DevelopmentIan L. McWalter, Ph.D. Vice President, Manufacturing OperationsC. Timothy Zahavich Vice President, Finance and Administration, and Chief Financial Officer


Gennum produces analog arrays, linear ICs, and thick-film hybrid circuits using bipolar process technology. Thecompany has developed a DMOS process, though it has not put it into production, and CMOS designs arecontracted out for manufacture by external foundries.


Gennum Corporation3435 Landmark RoadBurlington, Ontario L7M 1T4Cleanroom size: 18,000 square feetCapacity (wafers/week): 350Wafer size: 100mmProcess: BipolarProducts: Linear ICs, ASICs, thick-film hybrid circuitsFeature sizes: 1.5µm-4µm


North American Company Profiles Harris Semiconductor

HARRIS SEMICONDUCTOR

Harris Semiconductor2401 Palm Bay Road Northeast

Palm Bay, Florida 32905Telephone: (407) 724-7000

Fax: (407) 729-5691Web Site: www.semi.harris.com

IC Manufacturer


Europe: Harris Semiconductor • Brussels, BelgiumTelephone: (32) (2) 724-2111 • Fax: (32) (2) 724-2205

Asia-Pacific: Harris Semiconductor China Ltd. • Shanghai, ChinaTelephone: (86) (21) 6247-7923 • Fax: (86) (21) 6247-7926


1992 1993 1994 1995 1996

CorporateSales 3,004 3,099 3,336 3,444 3,621Net Income 75 111 112 155 178

SemiconductorSales 585 591 635 659 708Net Income (20) 17 31 42 52Capital Expenditures 22 27 44 80 140

Employees 8,000 8,100 8,100


Harris Semiconductor is one of the four major business sectors of Harris Corporation, a worldwide manufacturer ofelectronic systems, semiconductors, communications products, and office systems with sales of over $3.6 billionand more than 26,000 employees.

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Harris Semiconductor North American Company Profiles

Electronic Systems26%

Communications23%

1996 Corporate Sales by Business Sector

Semiconductor20% Lanier Worldwide

31%

Harris Semiconductor originated as the Microelectronics Division of Radiation, Inc. in 1962. It became HarrisSemiconductor in 1967 through the merger of Harris and Radiation. Then in 1988, Harris Semiconductor nearlytripled in size through the acquisition of the General Electric Solid State semiconductor business.

Harris Semiconductor manufactures and markets advanced analog, digital, power, and mixed-signal integratedcircuits and discrete semiconductors for power, signal-processing, data-acquisition, and logic applications. Plansfor 1997 include a focus on its wireless communications and multimedia technologies. Products recently broughtto market in these areas include its Prism line of RF integrated devices for communications and a videoencoder/decoder chipset for multimedia applications.

Plans for 1997 also include decreasing emphasis on its military product business and maximizing its discreteproduct sales.

Digital20%

Data Acquisition8%

1996 Semiconductor Salesby Application

Power30%

Mixed-Signal16%

Signal Processing14%

Intelligent Power12%

Integrated Circuits71%

Discretes29%

1996 Semiconductor Salesby Device Type

Below are applications served by Harris’ semiconductor products.

Automotive—multiplexing systems, antilock braking systems, engine controls, emission controls, engine knocksensing, air bag systems, and entertainment systems. This is Harris' largest commercial end market.

Communications—wireless local area network (LAN) systems, cellular base stations, satellite communicationssystems, set-top boxes, and PBX, central office, wireless local loop, and fiber-in-the-loop equipment.



Video/Multimedia—video and image processing systems, video teleconferencing, and multimedia systems. Inearly 1997, the company released the first of many planned multimedia devices. The device was an HTSC/PALvideo encoder/decoder chipset. The device is designed for use in VCR-to-PC editing systems, PC video capture,teleconferencing systems, DVD players, and digital VCRs. The device is manufactured by foundry partner, TSMC,using 0.6µm technology.

Power and Load Control—motor controllers, disk drives, power supplies, distributed power systems, and powerswitching.

Power Protection—surge suppression equipment, uninterruptible power supplies, house electrical panelprotection, and on-board electronic circuit protection.

Other Applications—test equipment, industrial controls, consumer electronics, medical imaging, computerperipherals, hand-held portable equipment, and military and aerospace equipment.

Management

Harris CorporationPhillip W. Farmer Chairman, President and Chief Executive OfficerBryan R. Roub Senior Vice President and Chief Financial Officer

Harris Semiconductor SectorJohn C. Garrett PresidentF. Scott Moody Vice President, Military and Aerospace Products DivisionW. Russell Morcom Vice President and GM, Semiconductor Products DivisionDyer Matlock Vice President, EngineeringBill McLean Vice President (North America), SalesCarleton Smith Vice President (Asia), SalesRon Van Dell Vice President and GM, Worldwide Sales and MarketingEdward Verbeek Vice President (Europe), Sales


Harris offers a broad range of standard, semicustom, and custom ICs and discrete semiconductors, includingintelligent power devices, data acquisition and signal processing circuits, digital microprocessor, peripheral, andlogic ICs, as well as radiation-hardened circuits for spacecraft and satellite applications.

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Harris Semiconductor North American Company Profiles

MOS MEMORY ANALOG

DRAM ✔ Amplifier

✔ SRAM ✔ Interface

Flash Memory ✔ Consumer/Automotive

EPROM ✔ Voltage Regulator/Reference



✔ Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)


✔ General Purpose Logic Bipolar Memory

✔ Gate Array General Purpose Logic

✔ Standard Cell ✔ Gate Array/Standard Cell

Field Programmable Logic Field Programmable Logic

✔ Other Special Purpose Logic Other Special Purpose Logic

MPU/MCU/MPR

MOS MICROCOMPONENT

✔ MPU OTHER

✔ MCU ✔ Full Custom IC

✔ MPR ✔ Discrete

✔ DSP ✔ Optoelectronic

Process technologies used by Harris Semiconductor include: CMOS, BiCMOS, power BiMOS, high-frequencybipolar/power MOS, high-voltage bipolar/power MOS, complementary bipolar dielectric isolation (bonded wafer),CMOS/SOI (silicon-on-insulator), CMOS/SOS (silicon-on-sapphire), and radiation hardening.


Harris supplements its internal semiconductor production capabilities with foundry agreements with externalsemiconductor manufacturers. For example, the company uses foundries for the fabrication of triple-layer-metalCMOS devices like signal processing ICs.

Harris Semiconductor (Ohio), Inc. Harris Semiconductor (Florida), Inc.1700 Fostoria Road P.O. Box 883Findlay, Ohio 45840 Palm Bay, Florida 32905Telephone: (419) 423-0321 Telephone: (407) 724-7000Cleanroom size: 57,500 square feet Cleanroom size: 53,000 square feetCapacity (wafers/week): 15,000 Capacity (wafers/week): 7,000Wafer sizes: 100mm, 125mm Wafer sizes: 3in, 100mm, 125mmProcesses: CMOS, bipolar, BiCMOS Processes: CMOS, PMOS, bipolarProducts: Custom digital, linear, logic, and Products: MPUs, SRAMs, linear and digital ICs, mixed-signal ICs discretesFeature sizes: 1.2µm, 1.5µm, 2.0µm Feature sizes: 0.8µm, 1.0µm, 2.0µm, 4.0µm



Harris Semiconductor (Pennsylvania), Inc. Harris Semiconductor (Pennsylvania), Inc.Crestwood Industrial Park Mountaintop, Pennsylvania125 Crestwood Road Cleanroom size: 25,000Mountaintop, Pennsylvania 18707-2189 Capacity (wafers/week): 5,000Telephone: (717) 474-6761 Wafer size: 200mmCleanroom size: 74,000 square feet Process: MOSCapacity (wafers/week): 4,000 Products: Discretes, smart power ICsWafer sizes: 100mm, 125mm, 150mm Feature size: 1.0µmProcesses: MOS, bipolar, BiCMOSProducts: Discretes, hybrids, ASICsFeature sizes: 1.0µm, 2.0µm, 5.0µm

In early 1996, Harris began building a new IC assembly and test facility in Suzhou, China. The company expectsconstruction to be completed by summer of 1998. The new facility will assemble and test digital logic,microperipheral, and analog and mixed-signal devices. Harris has existing semiconductor assembly factories inKuala Lumpur, Malaysia, and Dundalk, Ireland.

Key Agreements

• In 4Q95, Harris announced a license agreement with DSP Group Inc. Harris licensed DSP Group’s Oak andPine DSP cores for use in devices for audio-band signal processing applications.

• Harris has a product agreement with Sony. Under the agreement, Harris expanded its line of 10-bit, 12-bit, and14-bit data converters to include Sony’s 6-bit and 8-bit converters.

• Harris has a second-source agreement with Xilinx for radiation-hardened FPGAs.

• Harris formed an agreement with Noise Cancellation Technologies to develop and manufacture proprietarychips for application of NCT's active noise reduction technology.

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Honeywell North American Company Profiles

HONEYWELL SSEC

Honeywell, IncorporatedSolid State Electronics Center (SSEC)

12001 Highway 55Plymouth, Minnesota 55441Telephone: (612) 954-2301

Fax: (612) 954-2504Web Site: www.ssec.honeywell.com

IC Manufacturer


1992 1993 1994 1995 1996


SemiconductorIC Sales 53 45 45 58 60



Founded in 1885, Honeywell is an international company that provides control components, products, systems,and services for the home and building, industrial, space and aviation, and defense and marine markets.

Home andBuilding Control

46%

Space andAviation Control

22%

Industrial Control30%

Other*2%

1996 Corporate Sales by Business Segment*Includes sales from the SSEC


North American Company Profiles Honeywell

Honeywell established its Solid State Electronics Center (SSEC) in 1965 to support the high technologydemands in the markets served by the parent company. This growing reliance on microelectronics led SSEC tobecome a niche market manufacturer of specialized ICs and solid-state sensors.

Over the years, Honeywell SSEC has taken on numerous military contracts. Two of the more well known programsare the Very High Speed Integrated Circuit (VHSIC) program and the Enhanced Modular Signal Processor (EMSP)program. These programs helped position SSEC for its future in control, memory, and spaceborne applications.

The SSEC's mission is to develop and produce niche semiconductor technologies and products which arefocused in the market areas of sensors, radiation-hardened space components, and specialized ICs for its parent'sneeds and select external markets. SSEC is the world’s leading supplier of SOI CMOS ICs for space and industrialapplications. Approximately 50 percent of the SSEC's IC production is sold to external customers.

Management

Michael R. Bonsignor Chief Executive OfficerD. Larry Moore President and Chief Operating OfficerLarry C. Welliver Vice President, SSECLou Del Monte Director, Business Management, SSECBryan Johnson Director, Human Resources and Facilities, SSECPravin Parekh Director, Operations, SSECJay Schrankher Director, Quality and Information Systems, SSECJim Becker Manager, Material Management, SSECPeggy Kvam Manager, ASIC Products, SSEC


Honeywell SSEC's key business areas are outlined below.

Space components (for commercial, military space, and tactical and strategic missile applications).• SRAMs• ROMs (SOI and bulk)• Gate arrays (SOI and bulk) with ultra low power options• Bus interface products (1773 and 1553)

Sensors (for industrial control, automotive, medical, and aircraft applications).• Precision pressure• High-accuracy magnetic

High-temperature products (for oil service industry, industrial control, and gas turbine control applications).All SOI devices.

• Op amps• Switches• A/D converters and controllers

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Honeywell North American Company Profiles

About 90 percent of Honeywell's ICs are manufactured using CMOS or radiation-intensive CMOS (RICMOS™)processes and 10 percent using an advanced bipolar process.


Honeywell, IncorporatedSolid State Electronics Center12001 Highway 55Plymouth, Minnesota 55441Cleanroom size: 16,750 square feetCapacity (wafers/week): 1,250Wafer size: 100mmProcesses: CMOS, bipolarProducts: Rad-hard memories, ASICs, analog ICs, digital ICs, sensors, foundry servicesFeature sizes: 0.5µm, 0.7µm, 0.8µm, 1.2µm, 0.3µm, 0.4µm, 4.5µm

Key Agreements

• Honeywell SSEC licensed Micron Technology's Softool known-good die technology. It plans to use the testmethod to provide known-good die to the military and commercial markets, primarily for space applications.


North American Company Profiles HP

HEWLETT-PACKARD (HP)

Hewlett-Packard Company3000 Hanover Street

Palo Alto, California 94304-1112Telephone: (415) 857-1501

Fax: (415) 857-5518Web Site: www.hp.com



Europe: Hewlett-Packard Company • Geneva, SwitzerlandTelephone: (41) (21) 780-8111

Asia-Pacific: Hewlett-Packard Company • Causeway Bay, Hong KongTelephone: (852) 2599-7777

Financial History ($M), Fiscal Year Ends October 31

1992 1993 1994 1995 1996

CorporateSales 16,410 20,317 24,991 31,519 38,420Net Income 549 1,177 1,599 2,433 2,586

Semiconductor*Sales 745 880 1,085 1,250 1,420

IC Sales 400 475 585 655 740 Internal Sales 350 410 540 615 705 External Sales 50 65 45 40 35Discrete Sales** 345 405 500 595 680

*Calendar year**Includes internal and external sales


Hewlett-Packard (HP) is one of the world's leading designers and manufacturers of electronic, medical, analytical,and computing instruments and systems. HP divides its business into five product categories: computerproducts, electronic test and measurement instruments and systems, medical electronic equipment, analyticalinstruments, and electronic components.

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HP North American Company Profiles

Test/MeasurementInstruments

10%

ElectronicComponents

2%

1996 Corporate Sales byProduct Group

MedicalElectronics

4%

AnalyticalInstruments

2%

Computers82%

U.S.44%

Europe35%

Asia21%

1996 Corporate Sales byGeographic Region

Hewlett-Packard's Components Group is a leading supplier of microwave semiconductors and optoelectronicdevices for the fiber-optic, wireless and visual communications, computer equipment, industrial, and automotivemarkets.

In 1992, HP completed the acquisition of Avantek, Inc. Through Avantek, HP gained a wider customer base in thecomponents market. Those Avantek products targeted for commercial markets became part of theCommunications Components Division. Those products whose main applications are defense-related make upthe Avantek subsidiary of the Components Group.

Also under the wings of Hewlett-Packard is HP Labs, which is one of the world's leading electronic researchcenters.

Management

Lewis E. Platt Chairman, President, and Chief Executive OfficerRichard W. Anderson Vice President and GM, Microwave and Communications GroupWilliam F. Craven Vice President and GM, Components GroupAlan Marty Vice President and GM, Integrated Circuits Business DivisionFrederic N. Schwettmann Vice President and GM, Circuit Technology GroupRich Sevcik Vice President and GM, Systems Technology GroupNeal Carney Manager, Marketing, IC Business DivisionLance Mills Manager, Research and Development, IC Business Division


HP's semiconductor products range from analog and high-speed digital ICs to RF, microwave, and optoelectronicsemiconductors. The company also offers motion control devices, solid-state relays, and millimeter-wavecomponents. In addition, HP manufactures RISC MPUs that are designed using what it calls PrecisionArchitecture-RISC (PA-RISC).


North American Company Profiles HP

In early 1997, HP introduced the latest product from its PA-8000 RISC microprocessor family of 64-bit MPUs forhigh-end systems—the 12-million transistor PA-8500. Claiming to be HP’s most powerful microprocessor, the PA-8500 incorporates 1.5MB of memory on chip and was designed on a 0.25µm process. Target applications for thedevice include Internet access, database access and management, computer-aided design and manufacturing(CAD/CAM), and communications.

HP uses sophisticated semiconductor technologies based on silicon, GaAs, and InP materials.


In April 1997, Hewlett-Packard announced the development of a new joint venture foundry company with foundrycompany, Chartered Semiconductor, and the Economic Development Board (EDB) of Singapore. This is thesecond fab facility investment HP has made in Singapore.

The new venture, called Chartered Silicon Partners, will be located adjacent to Chartered’s exiting facilities in theWoodlands Industrial Park in Singapore. Construction of a 200mm wafer manufacturing facility is expected tobegin in September 1997 with production beginning in mid-1999. HP will receive a specified amount of wafers(0.35µm and 0.25µm ASICs) from the venture in exchange for its investment, while the remaining capacity will beoffered as part of Chartered’s usual foundry services. Chartered will hold the majority interest of the venture whileHP and the EDB will hold minority positions.

Hewlett-Packard Hewlett-Packard350 West Trimble Road 39201 Cherry StreetSan Jose, California 95131-1008 Newark, California 95131Telephone: (408) 435-7400 Telephone: (408) 435-6765Capacity (wafers/week): 1,100 Cleanroom size: 13,000 square feetWafer sizes: 3in, 100mm Capacity (wafers/week): 1,250Processes: Bipolar, GaAs Wafer size: 100mmProducts: ASICs, optoelectronics, discretes Process: BipolarFeature sizes: 0.5µm-5.0µm Products: Analog ICs, RFICs

Hewlett-Packard Hewlett-Packard3404 East Harmony Road 1050 Northeast Circle BoulevardFort Collins, Colorado 80525 Corvalis, Oregon 97330Telephone: (303) 229-3800 Capacity (wafers/week): 5,600Capacity (wafers/week): 1,250 Wafer sizes: 100mm, 150mmWafer sizes: 100mm, 150mm Process: CMOSProcesses: CMOS, bipolar Products: ASICs, MPUs, MPRs, DSPsProducts: RFICs, microwave ICs, MPUs, ASICs Feature sizes: 0.5µm-1.0µmFeature sizes: 0.35µm-1.0µm

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HP North American Company Profiles

Hewlett-Packard Avantek, Inc.Santa Rosa, California Santa Clara, CaliforniaCapacity (wafers/week): 1,000 Cleanroom size: 17,000 square feetWafer size: 2in Capacity (wafers/week): 225Process: Bipolar Wafer size: 3inProducts: Discretes Process: GaAs Products: ICs and discretes

TECH Semiconductor Singapore Pte. Ltd.P.O. Box 2093, SE 9040990 Bendemeer RoadSingapore 1233Telephone: (65) 298-1122Cleanroom size: 40,000 square feetCapacity (wafers/week): 6,250 Wafer size: 200mmProcess: CMOSProducts: DRAMsFeature sizes: 0.35µm, 0.5µm(Joint venture with Texas Instruments, the Economic DevelopmentBoard of Singapore, and Canon.)

Key Agreements

• AT&T Microelectronics (now Lucent Technologies) and Hewlett-Packard signed an agreement in early 1995 todevelop and dual-source fiber-optic transceivers for SONET/SDH and ATM applications.

• To promote and coordinate the use of its PA-RISC architecture, Hewlett-Packard formed PRO, the PrecisionRISC Organization. Some of the founding members are Convex Computer, Hitachi, Oki, Hughes Aircraft, andMitsubishi. Other members include Sequoia Systems and Winbond Electronics.

• Although not a PRO member, Samsung has the right to manufacture PA-RISC ICs to sell on the merchantmarket and use in its own workstations.

• HP formed an alliance with Analog Devices for the joint development of advanced mixed-signal processesbased on HP's submicron CMOS and BiCMOS technologies.

• Hewlett-Packard and Intel announced a wide ranging joint research and development alliance in 1994 underwhich the partners are seeking to design a superior next-generation 64-bit microprocessor by 1999, a year laterthan originally planned. The processor will be binary-compatible with both Intel x86 code and HP PA-RISCcode.


North American Company Profiles Hughes Electronics

HUGHES ELECTRONICS

Hughes Electronics Corporation

Delco Electronics Corporation Hughes Aircraft CompanyOne Corporate Center Microelectronics Division

Kokomo, Indiana 46904-9005 500 Superior AvenueTelephone: (317) 451-5700 Newport Beach, California 92663

Fax: (317) 451-5426 Telephone: (714) 759-2411Web Site: www.delco.com Fax: (714) 759-2986

Web Site: www.hughes.com



1992 1993 1994 1995 1996

CorporateSales 12,297 13,518 14,099 14,772 15,918

Net Income (922) 922 1,049 1,108 1,151

SemiconductorSales 341 350 360 340 330

Delco Electronics 205 220 235 240 250Internal Sales 195 205 215 215 215External Sales 10 15 20 25 35

Hughes Aircraft 136 130 125 100 80Internal Sales 81 72 64 45 30External Sales 55 58 61 55 50


Hughes Electronics Corporation (HE), known as GM Hughes Electronics Corporation prior to March 1995, is asubsidiary of General Motors Corporation. HE's principal operating organizations are Delco ElectronicsCorporation and Hughes Aircraft Company. Its other business units are Hughes Telecommunications and SpaceCompany, DirecTV, Inc., and Hughes Network Systems, Inc.

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Hughes Electronics North American Company Profiles

Aerospace andDefense Systems

40%AutomotiveElectronics

33%

Telecommunicationsand Space

26%

1996 Corporate Sales by Business Segment

Other1%

Delco Electronics (DE) is a world leader in the development, manufacture, and marketing of vehicle and driversystems for the global automotive market, and Hughes Aircraft, acquired by GM in 1985, is a world leader inaerospace, defense electronics, and information systems.

Delco Electronics, alone, is the third largest captive IC manufacturer. Its fabrication facilities produce about 40percent of its semiconductor needs. The company produces advanced ICs that perform a variety of functions,such as deciphering radio frequency signals for audio systems, controlling the release of an airbag, suspensionsystem control, and fuel, electrical, and ignition management. Some of its new technologies include night visionsystems, collision avoidance systems, navigation systems, keyless start systems, tire pressure warning systems,and reconfigurable LCD head-up displays.

Hughes Aircraft continues to restructure its business to adapt to severe cuts in U.S. defense spending. Thecompany intends to maintain its leadership in key defense markets, while at the same time, explore newmarketplaces and exploit new technologies. Some commercial ventures the company is involved in include:digital cellular communications systems, advanced acoustic technologies, light projection systems, digital signalcompression, character recognition, and airport integration systems.

In January 1997, GM and Hughes Electronics announced a series of strategic transactions designed tostrengthen the position of GM in two key areas—telecommunications and space, and automotive electronics. GMhas a definitive agreement with Raytheon to spin off Hughes Aircraft from Hughes Electronics and then merge theoperation into Raytheon. Separately, Delco Electronics will be transferred from Hughes Electronics to GM’s DelphiAutomotive Systems. Both of these transactions are expected to take place in 3Q97.

Management

C. Michael Armstrong Chairman and Chief Executive Officer, Hughes Electronics CorporationMichael J. Burns Executive Vice President, Hughes Electronics Corporation;

General Manager, Delco Electronics CorporationJohn C. Weaver Senior Vice President, Hughes Electronics Corporation;

President, Hughes Aircraft Company


North American Company Profiles Hughes Electronics


IC Delco, DE's automotive semiconductor unit, designs and manufactures custom analog and digital ICs forspecific automotive applications such as anti-lock brake systems, engine controllers, suspension control systems,communications, and instrumentation. IC Delco also produces silicon-based electronic sensors.

Among the semiconductor devices Hughes Aircraft designs and manufactures are ASICs, memory devices,microcomponents, rad-hard circuits, monolithic microwave integrated circuits (MMICs), and millimeter-wave devicesusing a variety of process technologies including CMOS, BiCMOS, GaAs, and InP.


Delco Electronics Corporation Hughes Aircraft CompanyIC Delco Business Unit Microelectronics Division700 East Firmin Street 500 Superior AvenueKokomo, Indiana 46902-2340 Newport Beach, California 92663-3627Cleanroom size: 125,000 square feet (3 fabs) Telephone: (714) 759-2411Capacity (wafers/week): 12,000 Capacity (wafers/week): 1,600Wafer sizes: 100mm, 125mm Wafer sizes: 100mmProcesses: NMOS, CMOS, BiCMOS, bipolar Processes: CMOS, BiCMOS, SOS, CryoCMOSProducts: MPUs, MCUs, ASICs, logic and Products: ASICs, memories, MCUs, LCD drivers, linear ICs, discretes linear ICs, rad-hard ICs, foundry servicesFeature sizes: 1.0µm-2.0µm Feature sizes: 1.25µm-5.0µm

Hughes Aircraft Company Hughes Microelectronics Europa, Ltd.Hughes Communications Products Fullerton Road3100 Lomita Boulevard Queensway Industrial EstateTorrance, California 90509 Glenrothes, Fife, Scotland KY7-5PYTelephone: (310) 517-6880 Telephone: (44) (1592) 754-311Fax: (310) 517-6883 Fax: (44) (1592) 610-186Capacity (wafers/week): 250 Capacity (wafers/week): 1,600Wafer size: 3in Wafer size: 100mmProcesses: GaAs, InP Processes: CMOS, MOSProducts: MMICs, MM-wave devices, discretes Products: ASICs, memories, custom ICsFeature sizes: 0.25µm-0.5µm Feature size: 3.0µm

Key Agreements

• Delco Electronics and Texas Instruments jointly developed a new methodology, called Prism, that is claimed tocut the high cost and long lead time of taking complex mixed-technology designs from concept to silicon.Prism is being used by DE to produce configurable 16-bit microcontrollers for GM cars.

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IBM Microelectronics North American Company Profiles

IBM MICROELECTRONICS

IBM Microelectronics1580 Route 52, Building 504

Hopewell Junction, New York 12533Telephone: (914) 894-2121

Fax: (914) 894-6891Web Site: www.chips.ibm.com

IC Manufacturer


Europe: IBM Microelectronics Europe • Geneva, SwitzerlandTelephone: (41) (22) 918-4600 • Fax: (41) (22) 918-4650

Asia-Pacific: IBM Singapore Pte., Ltd., Microelectronics • SingaporeTelephone: (65) 320-1000 • Fax: (65) 227-8721


1992 1993 1994 1995 1996

Corporate (IBM Corp.)Sales 64,523 62,716 64,052 71,940 75,947Net Income (4,965) (8,101) 3,021 4,178 5,429

Semiconductor Sales 3,775 3,885 4,575 5,705 5,100

Internal Sales 3,725 3,510 3,605 4,020 3,550 External Sales 50 375 970 1,685 1,550

Capital Expenditures 650 1,000 1,500

Employees (IBM Microelectronics) 22,000


International Business Machines (IBM) was founded by Thomas J. Watson in 1924. Since then, IBM has growninto one of the world's largest corporations that sells in over 140 countries. IBM develops, manufactures, and sellsadvanced information processing products, including computers and microelectronics technology, software,networking systems, and information technology-related services.


North American Company Profiles IBM Microelectronics

Software17%

Services21%

1996 Corporate Sales byProduct/Service Group

InformationTechnology

Products44%

OEM Hardware*4%

Maintenance9%

Finance and Other5%

*Includes external sales of semiconductors.

Europe/Middle East/Africa

33%

Asia-Pacific19%


North America39%

Latin America9%

The Microelectronics Division of IBM develops, manufactures, and markets a wide range of integratedmicroelectronic products and technologies. Products and services range from semiconductor design andfabrication to fully assembled and tested functional assemblies.

Prior to 1992, IBM Microelectronics supplied its products and services exclusively to one customer—IBMCorporation. Spurred by both a comprehensive restructuring of IBM into independent business units and thehigh cost of developing advanced semiconductor technologies, IBM Microelectronics launched a worldwidemicroelectronics merchant market effort in 1992 by offering to sell virtually every product and service in itstechnology portfolio. Its products and services are targeted at manufacturers of computers, communications, andconsumer electronics systems.

IBM Microelectronics’ strategic products are its PowerPC RISC microprocessors and embedded controllers, x86microprocessors, memory ICs, ASICs, and leading-edge packaging services. Other important microelectronicproducts include analog and mixed-signal ICs, digital signal processors, and graphics chips. By combining severalof its chips to form system solutions, IBM is seeking to strengthen its presence in the data processing, consumerelectronics, and communications markets.

To bolster its technological leadership, IBM has entered into several major alliances. Examples of these alliancesare Toshiba, Siemens, and Motorola in process technology, the PowerPC microprocessor alliance with Motorolaand Apple Computer, and work in the area of X-ray lithography with Lucent Technologies, Motorola, andLockheed-Martin Federal Systems.

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Management

IBM CorporationLouis V. Gerstner, Jr. Chairman and Chief Executive OfficerJ. Thomas Bouchard Senior Vice President, Human ResourcesNicholas M. Donofrio Senior Vice President and Group Executive, Server GroupJ. Bruce Harreld Senior Vice President, StrategyPaul M. Horn Senior Vice President, ResearchNed C. Lautenbach Senior Vice President and Group Executive, Sales and ServiceLawrence R. Ricciardi Senior Vice President and General CounselRobert M. Stephenson Senior Vice President and Group Executive, Personal Systems and

Technology GroupG. Richard Thoman Senior Vice President and Chief Financial OfficerJohn M. Thompson Senior Vice President and Group Executive, Software GroupDavid B. Kalis Vice President, CommunicationsAbby F. Kohnstamm Vice President, Corporate Marketing

IBM Microelectronics DivisionMichael J. Attardo General Manager, IBM Microelectronics DivisionOrest Bilous General Manager, Manufacturing and Process DevelopmentJames K. Picciano General Manager, Applications and Solutions DevelopmentJohn C. Gleason Vice President and Assistant GM, Worldwide Sales and MarketingJohn Kelly Vice President, Strategy and TechnologyPeter Draheim Chief Executive Officer, SubMicron Semiconductor Technologies GmbHStanley J. Grubel Chief Executive Officer, MiCRUS


IBM Microelectronics offers the following products:

Memory Products• 4M, 16M, and 64M DRAMs (standard and low power versions). The company announced in April 1997 that it

was halting production of 4M DRAMs to make more room for ASIC production.• 16M and 64M synchronous DRAMs (SDRAMs).• 8M and 16M synchronous graphics RAMs (SGRAMs).• 4M enhanced DRAMs (EDRAMs) through its partnership with Enhanced Memory Systems Inc.• 4M VRAMs.• 1M and 4M high-performance CMOS synchronous SRAMs (250MHz and 225MHz, respectively).


North American Company Profile IBM Microelectronics

ASIC Products• CMOS digital ASICs—gate arrays and standard cells with gate counts ranging from 50,000 to 3.2 million gates

(max.). IBM’s system cores include PowerPC and x86 MPUs, DSPs, peripheral circuits, I/O circuits, USBdevices, audio/video/graphics components, and communications interfaces.

• Bipolar analog and mixed-signal ASICs.• CMOS analog and mixed-signal ASICs.• BiCMOS analog and mixed-signal ASICs.• High-performance BiCMOS analog and mixed-signal ASICs.• IBM abandoned its FPGA development and production program in 1996.

Microprocessors and Controllers• 6x86, 5x86C, 486 DX4, and 486 DX2 microprocessors (the 5x86C and 6x86 are designed by Cyrix).• PowerPC™ 600 Series 32-bit and 64-bit RISC microprocessors (clock speeds of up to 250MHz).• PowerPC™ 400 Series 32-bit RISC embedded controllers.• MC196 16-bit microcontrollers (compatible with Intel’s MCS-96 16-bit architecture).• Mwave™ digital signal processor (DSP) products for multimedia and communications applications.

Communications, Networking, Interface, and Graphics Products• PCI core logic chipsets and PCI-to-PCI bridge chips.• Firewire (IEEE 1394) high-speed (200Mbps) serial bus transceiver chips.• High-end RGB series of palette digital-to-analog converters for 2D and 3D graphics.• Adaptive Lossless Data Compression (ALDC) ICs and MPEG-2 digital video encoders and decoders.• High-performance ATM, Ethernet, and Token Ring networking chips and ASIC cores (made available to the

merchant market in 3Q96).• Silicon-germanium-based wireless communications and data-conversion devices.• Infrared transceivers and communications controllers.

Other Products and Services• Semiconductor contract manufacturing services for advanced ICs. Process technologies offered through

IBM’s foundry services include the CMOS 5S1 0.5µm process, the CMOS 5SF 0.35µm SPQM process, andthe CMOS 6SF 0.25µm SPQM process, which will be available for volume production in 2Q98.

• Deep-UV photoresists.• Semiconductor test equipment.• Semiconductor packaging services for single or multiple chip applications.• Printed circuit boards and cards.• PCMCIA infrared wireless and data/fax modem products and solid state file storage products.

IBM has developed and uses some of the industry's most advanced CMOS processing technologies including thefollowing: 0.35µm, 0.5µm, and 0.6µm CMOS with up to five layers of metal. The company unveiled its 0.25µmCMOS 6S process technology in mid-1996. While digital CMOS is the company's principal technology, variousother processes are used, including bipolar, analog CMOS, BiCMOS, complementary BiCMOS, and silicon-germanium (SiGe).

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IBM Microelectronics IBM MicroelectronicsEast Fishkill Facility 1000 River Street1580 Route 52 Essex Junction, Vermont 05452Hopewell Junction, New York 12533 Telephone: (802) 769-0111Telephone: (914) 894-5647 Capacity (wafers/week): 15,000Cleanroom size: 230,000 square feet Wafer size: 200mmCapacity (wafers/week): 16,750 Processes: CMOS, BiCMOS, bipolarWafer sizes: 125mm, 200mm Products: DRAMs, SRAMs, logic ICs, mixed-signal ICs,Processes: CMOS, BiCMOS, SiGe linear ICs, ASICs, MPUs, foundry servicesProducts: Logic ICs, linear ICs, mixed-signal ICs, Feature sizes: 0.25µm-1.0µm memories, R&DFeature sizes: 0.25µm-0.8µm(IBM's ASTC—Advanced SemiconductorTechnology Center is located here)

IBM Microelectronics IBM United Kingdom Labs Ltd.Thomas J. Watson Research Center Hursley ParkRoute 134 North WinchesterYorktown Heights, New York 10598 Hampshire SO21 2JNTelephone: (914) 945-3000 EnglandCapacity (wafers/week): 1,500 United KingdomWafer size: 100mm Telephone: (44) (962) 84-4433Process: CMOS Wafer size: 200mmProducts: R&D Processes: Bipolar, MOSFeature size: 0.25µm Products: R&D

IBM France IBM/Siemens224 Bd. John Kennedy Corbeil-Essonnes CedexP.O. Box 58 FranceF-91102 Corbeil Essones-Cedex Cleanroom size: 116,000 square feetFrance Capacity (wafers/week): 3,000Telephone: (33) (1) 60-88-51-51 Wafer size: 200mmCleanroom size: 390,000 square feet Process: CMOSCapacity (wafers/week): 10,750 Products: DRAMs (logic ICs in future)Wafer sizes: 125mm, 200mm Feature sizes: 0.35µm-0.5µmProcess: CMOSProducts: MPUs, MCUs, ASICs, DRAMs, SRAMsFeature sizes: 0.35µm-0.8µm



IBM Duetschland GmbH IBM Japan Ltd.Werk Singdelfingen 800 Ohaza Ichimayake, Yasu-MachiPostfach 266 Yasu-gun, Shiga-ken 520-23, JapanSingdelfingen, Germany Telephone: (81) (755) 88-2511Telephone: (49) 7031-910 Capacity (wafers/week): 10,000Capacity (wafers/week): 18,750 Wafer sizes: 125mm, 200mmWafer sizes: 125mm, 200mm Process: CMOSProcesses: Bipolar, CMOS Products: MPUs, DSPs, ASICs, logic ICsProducts: DRAMs, SRAMs, ASICs, DSPs, MPUs Feature sizes: 0.6µm, 0.8µmFeature sizes: 0.8µm-2.0µm (DRAM production discontinued here in 1996.)

MiCRUS SubMicron Semiconductor Technologies GmbH (SMST)1580 Route 52 Schoenaicherstrasse 220Hopewell Junction, New York 12533 Boeblingen Hulb, GermanyTelephone: (914) 892-2121 Cleanroom size: 107,640 square feet (Class 1)Capacity (wafers/week): 9,000 Capacity (wafers/week): 4,000Wafer size: 200mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: DRAMs, MPRs Products: DRAMs, logic ICsFeature sizes: 0.35µm-0.6µm Feature size: 0.65µm(Joint venture with Cirrus Logic. (Joint venture with Philips. The partners planSee Key Agreements.) to upgrade the fab to handle 0.5µm line

widths. See Key Agreements.)

Dominion Semiconductor LLC9600 Godwin DriveManassas, Virginia 22110Telephone: (703) 367-3280Fax: (703) 367-3271Cleanroom size: 90,000 square feetCapacity (wafers/week): 7,500Wafer size: 200mmProcess: CMOSProducts: DRAMsFeature size: 0.35µm(Joint venture with Toshiba. Scheduled to beginproduction in early 1998. See Key Agreements.)

Key Agreements

• In mid-1996, IBM announced an agreement with Mitsubishi that allows the Japanese company to sell IBMPowerPC embedded controller chips under the Mitsubishi brand name.

• IBM and Synopsys announced a six-year R&D agreement in February 1996 to jointly develop tools andmethodologies for designing complex ICs with as many as 10 million gates.

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• IBM licensed the Rambus ASIC Cell (RAC) high-bandwidth interface technology in early 1996 from Rambus touse in its SystemCore ASIC megacell library.

• IBM granted licensing rights to Exponential Technology, Inc. to develop and market a new ultra-high-performance BiCMOS microprocessor based on the PowerPC architecture. Volume shipments ofExponential’s MPU are expected to begin in early 1997.

• In late 1995, IBM and Toshiba began building a new 64M DRAM plant at the site of a closed IBM fab inManassas, Virginia. IBM and Toshiba will each own 50 percent of the facility, which will operate under the nameDominion Semiconductor. First silicon is expected from the fab in late 1997 with production beginning in1998.

• Ramtron signed a manufacturing agreement with IBM in May 1995 for EDRAM production. Under theagreement, IBM is serving as a foundry for the production of Ramtron-subsidiary Enhanced Memory Systems'EDRAMs, and IBM has a non-exclusive license to sell the devices.

• In 1994, Philips agreed with IBM Microelectronics to form a joint venture to manufacture ICs at IBM's fab facility inBoeblingen Hulb, Germany. Philips holds 51 percent and IBM 49 percent of the new company, calledSubMicron Semiconductor Technologies GmbH (SMST). SMST is supplying products solely to IBM andPhilips, manufacturing DRAMs for IBM and logic ICs for Philips. Separately, Philips acquired the rights to IBM’s16M DRAM technology for embedded applications. Embedded DRAM products will also be produced bySMST.

• IBM and Cirrus Logic formed a joint manufacturing venture called MiCRUS in 1994. MiCRUS fabricates wafersfor both companies in a former IBM plant in East Fishkill, New York. IBM and Cirrus Logic own 52 percent and 48percent of MiCRUS, respectively. For the time being, the agreement does not include product and/ortechnology exchange.

• S3 Incorporated signed an agreement with IBM for the production of S3's graphics accelerators at IBM's fab inEssex Junction, Vermont.

• The PowerPC RISC architecture has been, and continues to be, codeveloped by IBM, Motorola, and AppleComputer. The trio of companies are also working on combining the PowerPC technology with an openhardware platform supporting a range of operating systems.

• IBM is jointly developing with Siemens and Toshiba, 0.25µm technology for shrink-version 64M DRAMs and256M DRAMs. Additionally, in 3Q96, Toshiba, IBM, and Siemens agreed to jointly develop system-on-a-chipdevices. As part of a separate agreement, Siemens and IBM are jointly producing 16M DRAMs in Corbeil-Essonnes, France.

• Toshiba licensed the PowerPC microprocessor technology from IBM Microelectronics. Although Toshiba wasnot given the right to sell PowerPC MPUs on the merchant market, it does have the right to develop andmanufacture its own derivatives of the processor. For now, IBM will produce the MPUs for Toshiba.



• IBM and Cyrix announced a five-year agreement in early 1994 calling for IBM to manufacture Cyrix's 486, 5x86,and 6x86 MPUs. The two companies equally share the output of the Cyrix-designed chips.

• IBM and Analog Devices announced in late 1993 plans to jointly design, produce, and market mixed-signal andRF chips based on IBM's silicon-germanium (SiGe) process technology. In 1996, Hughes Electronics joinedIBM in a program to develop SiGe chips for commercial communications applications.

• IBM is working with Motorola, Lockheed-Martin Federal Systems, and Lucent Technologies to establish amanufacturing infrastructure for X-ray lithography. The team hopes to have a manufacturing capability by theend of 1997.

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IC Works North American Company Profiles

IC WORKS

IC Works, Inc.3725 North First Street


Fax: (408) 922-0833

IC Manufacturer


1994 1995 1996 1997

Sales 21 26 41 47

Employees 125 150 200 250


IC Works was established in June 1992 when it acquired the San Jose fabrication facility, process technology, andengineering and manufacturing staff of Samsung Semiconductor, the U.S. business of Korea’s Samsung.

As an independent company, IC Works designs, manufactures, and markets mixed-signal products using itsdesign and in-house facility, and provides quick-turn, submicron foundry services to selected mixed-signalsemiconductor companies.

IC Works operates three complementary mixed-signal businesses—clock products, wireless communicationsproducts, and submicron foundry services.

Management

Ilbok Lee, Ph.D. President and Chief Executive OfficerJohn Hagedorn Vice President and Chief Financial OfficerJohn Kelly Vice President, Fab OperationsRichard Miller Vice President, MarketingChen Wang Vice President, Engineering


North American Company Profiles IC Works


IC Works' product and services include high-performance clock generator ICs, wireless communication circuits,and foundry services. New products for the computer and data communications markets are being developed.

Foundry ServicesIC Works’ in-house foundry provides special services to mixed-signal semiconductor companies for thedevelopment, prototyping, and early production of new products.

Clock ProductsIC Works offers a wide range of high performance phase-locked-loop (PLL)-based clock ICs for systemmanufacturers in a variety of markets. The main applications within the clock market include PC motherboards,communications, mass storage, multimedia, and workstations. Products include clock buffers and single anddual PLL clocks.

Wireless CommunicationsUtilizing its PLL and BiCMOS process technologies, IC Works is developing RF solutions for the wirelessmarketplace, focusing on data communications. This product strategy includes development of componentlevel functional block products and ASSPs.

As part of the buyout, Samsung licensed IC Works to use its scaleable submicron CMOS and BiCMOS processtechnologies. Currently, the majority of IC Works’ production wafer output is processed to 0.7µm design rules witha migration to 0.6µm under way. Future plans include development of finer geometry processes down to 0.35µm.


IC Works, Inc.3725 North First StreetSan Jose, California 95134-1700Cleanroom size: 15,000 square feet (Class 1)Capacity (wafers/week): 1,200 (expanding)Wafer size: 125mm (upgrading to 150mm)Processes: CMOS, BiCMOSProducts: Mixed-signal ICs, foundry servicesFeature sizes: 0.5µm, 0.7µm (0.35µm under development)

IC Works is in the process of expanding its fab capacity with financial support from its fab partners, which includeSierra Semiconductor and TelCom Semiconductor Inc. The $50 million expansion, which includes moving from125mm to 150mm wafers, is scheduled to be completed in 1997.

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IC Works North American Company Profiles

Key Agreements

• In 1996, IC Works and Motorola announced a second-source agreement for the development and manufactureof CMOS and BiCMOS-based mixed-signal timing circuits. Motorola will contribute high-performance timingsolutions targeted at workstations, servers, and network applications, while IC Works will provide “clock”solutions targeting personal computers and peripheral applications.

• IC Works has a foundry agreement with TelCom Semiconductor. Under the agreement, TelCom will invest $10million in equipment and the expansion of IC Works’ submicron wafer fabrication facility, in return for wafercapacity. The agreement covers a five-year period which is expected to begin in late 1997.


North American Company Profiles ICS

INTEGRATED CIRCUIT SYSTEMS (ICS)

Integrated Circuit Systems, Inc.2435 Boulevard of the Generals

P.O. Box 968Valley Forge, Pennsylvania 19482-0968

Telephone: (610) 630-5300Fax: (610) 630-5399

Web Site: www.icst.com

Fabless IC Supplier


1992 1993 1994 1995 1996

Sales 37 78 94 104 100Net Income 4 11 12 5 4R&D Expenditures 7 9 10 11 12

Employees 224 314 336 219 206


Founded in 1976, Integrated Circuit Systems (ICS), designs, develops, and markets mixed-signal integratedcircuits primarily for data communications, clock, and multimedia applications. The company also provides customapplication specific ICs (ASICs) for the consumer, medical, telecommunications, and aerospace industries.

ICS’s primary focus is to combine its innovation, market position, and competency in mixed-signal and phaselocked-loop technology to capitalize on the trend convergence of computer, communications, and consumerapplications, especially in the LAN/WAN communications marketplace.

For most of its formative years ICS concentrated on supplying its mixed-signal technology in custom ASIC designsfor OEMs. In the late 1980’s, ICS began to develop proprietary standard products. ICS entered the frequencytiming generator (FTG) business in 1989 with a pioneering FTG for video clocks.

In 1992, ICS completed the acquisition of the Avasem Corporation, the leader in motherboard clocks. Together,ICS and Avasem offer a breadth of clock products unequaled by any other company.

In April 1995, ICS purchased a majority interest in ARK Logic Inc., a Santa Clara, California-based developer ofgraphical user interface (GUI) accelerator devices. ARK Logic's graphics controller technology was merged withICS's audio and mixed-signal RAMDAC and video clock generator technologies to provide complete PCmultimedia solutions.

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ICS North American Company Profiles

In 1995, ICS introduced a line of high-performance transceiver chips designed for international use in the latestnetwork systems. These devices work in local area networks (LANs) and wide area networks (WANs), includingthe newest technologies such as Sonet/SDH fiber optic systems, asynchronous transfer mode (ATM)copper/fiber systems, and fast Ethernet systems.

In December 1996, ICS sold its subsidiary, Turtle Beach Systems Inc., in an effort to focus on its core businesses.In a separate move, ICS sold its battery charge controller business.

Clock ICs49%

ASICs17%


Multimedia/ARK Logic

13%

Turtle Beach 21%

Sales outside of the United States, primarily to the Pacific Rim, reached approximately 48 percent of total sales in1996.

Management

Henry I. Boreen Chairman and Interim Chief Executive OfficerStavro Prodromou President and Chief Executive OfficerHock E. Tan Senior Vice President, Finance and Administration,

Chief Financial Officer, and Chief Operating OfficerGregory J. Richmond Vice President, FTG Business Group (San Jose, CA)William H. Weir Vice President, Data Communications Business GroupRonald J. Wenger Vice President, SalesEdward Christiansen Director, OperationsJohn Klein Director, Custom ProductsAllan Havemose President, ARK Logic, Inc.


ICS's products are outlined below. The products are designed and produced using CMOS processingtechnologies ranging from 0.35µm to 3.0µm.

Data Communications Products Multimedia Audio Products• Fast Ethernet LAN • Music synthesizers• ATM • Audio codecs (coders and decoders)• Sonet/SDH • Software for wavetable music synthesis


North American Company Profiles ICS

Clock Products ARK Logic• Motherboard timing generators • GUI controller chips and software drivers• Video timing generators • Multimedia accelerators• Graphics timing for workstations• Special-purpose FTGs for Pentium Pro and Custom ICs

PowerPC microprocessors and chipsets • Mixed-signal ICs for a broad range of applications


All of ICS's wafers are currently manufactured by outside foundries, two of which meet a substantial majority of thecompany's wafer needs. ICS’s foundry partners include AMI and Chartered Semiconductor.

Key Agreements

• During fiscal year 1996, ICS established an agreement with Chartered Semiconductor to secure a minimumwafer supply from Chartered covering a five year period.

• ICS acquired a 51 percent interest in ARK Logic, Inc. in 3Q95. ICS plans to combine its audio design specialtywith ARK’s video graphics expertise to develop a chip that handles 3D graphics, VGA control, and audio andvideo processing. ICS may purchase the remaining 49 percent of ARK Logic.

• In October 1992, ICS entered into an alliance with American Microsystems Inc. under which ICS secured waferprocessing capacity through the year 2000.

• ICS licensed DSP Group’s Pine digital signal processing and TrueSpeech voice compression technologies foruse in its next-generation audio components.

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ICT North American Company Profiles

ICT

ICT Inc.2123 Ringwood Avenue


Fax: (408) 434-0688Web Site: www.ictpld.com

Fabless IC Supplier


ICT Inc., founded in November 1991, designs, manufactures, and markets programmable logic devices (PLDs) fora variety of applications such as PCs, telecommunications, industrial, medical, and consumer electronics. Thecompany was originally established in 1983 by International CMOS Technology.

ICT is organized into two divisions: the Programmable Logic Division (PLD) and the Personal Computer ProductsDivision (PCPD). The PLD designs, develops, and markets user-programmable integrated circuits specializing inprogrammable logic devices (PLDs). The PCPD designs and markets PC core logic chipsets and peripheralcontroller products.

Management

David Sears, Ph.D. Chairman and acting Chief Executive OfficerEdward D. Barnett President and Chief Operating OfficerVolker Cathrein Chief Financial Officer and SecretaryDonald E. Robinson Vice President, Special ProductsBeverly Schirl Director, Marketing


ICT's programmable logic product line consists of two families of CMOS PLDs—PEEL (Programmable ElectricallyErasable Logic) Devices and PEEL Arrays—in addition to supporting development tools. PEEL Devices aresimple PLDs designed as replacements for standard 20-pin and 24-pin PAL/GAL devices with speed gradesranging from 5ns to 25ns. PEEL Arrays are complex PLDs (CPLDs) that combine a non-segmented PLA withFPGA-like logic cells with wide single-level delays as fast as 9ns/15ns (internal/external). PEEL Arrays are used forcombinatorial logic, with clocking frequencies running up to 80MHz for sequential functions.


North American Company Profiles ICT

PEEL Devices PEEL Arrays

PEEL 16V8 PA7024PEEL 18CV8 PA7128PEEL 20V8 PA7140PEEL 22CV8PEEL 22CV10APEEL 22CV10AZPEEL 22LV10AZPEEL 22V10

ICT's PLDs are designed and manufactured using proprietary 0.8µm CMOS EEPROM technology.

The company's PC product line consists of Pentium and 486 portable and desktop core logic chipsets,programmable peripheral interface ICs, and peripheral controller ICs.


As with other fabless IC suppliers, ICT utilizes external fabrication and assembly facilities. ICT wafers are currentlyfabricated by two companies: Chartered Semiconductor Manufacturing of Singapore and Rohm Co. of Japan.Assembly and test work is handled by multiple vendors in the Philippines, Thailand, and Taiwan.

Key Agreements

• ICT has a license agreement with AMD involving PLD products.

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IDT North American Company Profiles

INTEGRATED DEVICE TECHNOLOGY (IDT)

Integrated Device Technology, Inc.2972 Stender Way


Fax: (408) 727-8043Web Site: www.idt.com

IC Manufacturer


Japan: Integrated Device Technology–Nippon–K.K. • Chiyoda-ku, Tokyo, JapanTelephone: (81) (3) 3221-9821 • Fax: (81) (3) 3221-9824

Europe: Integrated Device Technology, Ltd. • Leatherhead, Surrey, United KingdomTelephone: (44) (1372) 363339 • Fax: (44) (1372) 378851

Asia-Pacific: Integrated Device Technology, Asia, Ltd. • Tsimshatsui, Hong KongTelephone: (852) 2736-0122 • Fax: (852) 2375-2677


1993 1994 1995 1996 1997

Sales 236 330 422 680 537Net Income 5 40 78 120 (42)R&D Expenditures 54 64 78 133 151Capital Expenditures 28 38 95 287 201

Employees 2,414 2,615 2,965 3,875 4,380


Integrated Device Technology, Inc. (IDT), founded in 1980, designs, manufactures, and markets high-performance integrated circuits and modules that are used in products serving its targeted markets segments:personal computing (desktop and portable PCs), distributed computing systems, communications equipment,and office automation. IDT enhances its customers’ ability to optimize the cost and performance of theirmicroprocessor-based systems by providing innovative solutions based on four product groups: high-speedSRAMs; communications products including FIFOs, multi-port memories and ATM products; high-performancelogic products; and RISC microprocessors.

In an effort to diversify its products and reduce its reliance on one particular market, IDT is moving towards othergrowth areas of SRAMs such as the communications market.


North American Company Profiles IDT

SRAMs32%

Fiscal 1997 Sales by Product Group

CommunicationsProducts

36%

RISC MPUs12%

LogicProducts

20%

PersonalComputing

22%

Fiscal 1997 Sales by End-Use Market

DataCommunications

28%

OfficeAutomation

7%DistributedComputing

10%

Other10%

Telecom23%

United States63%

Fiscal 1997 Sales by Geographic Region

Europe17%

Asia7%Japan

13%

Management

D. John Carey ChairmanLeonard C. Perham President and Chief Executive OfficerRay Famham Executive Vice PresidentStuart Bardach Vice President, QualityCharles R. Clark Vice President, Subsystems Products/SRAM ProductsWilliam B. Cortelyou Vice President, Wafer OperationsDave Côté Vice President, MarketingRandy Frederick Vice President, Logic ProductsRobin H. Hodge Vice President, Assembly and TestJimmy Lee Vice President, FIFO ProductsDaniel L. Lewis Vice President, Worldwide SalesChuen-Der Lien Vice President, Technology DevelopmentJohn R. Mick Vice President, Applications EngineeringDaniel R. Morris Vice President, ATM ProductsTom North Vice President, DRAM ProductsBob Phillips Vice President, Worldwide ManufacturingRobert Proebsting Vice President, Advanced Design ConceptsChristopher P. Schott Vice President, Specialty Memory ProductsWilliam D. Snyder Vice President, Finance, and Chief Financial OfficerJerry Taylor Vice President, Memory ProductsThomas B. Wroblewski Vice President, Human Resources

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IDT North American Company Profiles


IDT produces SRAMs, logic products, communications products, and RISC microprocessors. These products aredesigned and manufactured using proprietary advanced submicron CMOS and BiCMOS process technologies,including the company's CMOS VIII 0.5µm process and its next-generation 0.35µm process. IDT's product groupsare outlined below.

SRAMs• Fast CMOS asynchronous SRAMs with 16K to 1M densities and access times as fast as 10ns; 4M density

devices will be available in 1998.• Fast CMOS ZBT™ synchronous SRAMs that optimize system performance in applications that frequently turn

the data bus around between reads and writes. Available in 1M density with 4M density devices that willsupport clock speeds up to 133MHz planned for 1998.

• Fast CMOS synchronous pipelined burst SRAMs (PBSRAMs) in 1M to 2M densities with clock speeds up to100MHz to support zero wait state performance in cache applications.

• BiCMOS cache tag SRAMs for Pentium and PowerPC processors with high speed address-to-match times upto 8ns.

• Ultra low-power CMOS SRAMs in 1M density with competitive standby and active supply current specifications.• High-speed industry-standard and custom CMOS SRAM modules.

Communications Memory Products• High-speed CMOS multi-port SRAMs in densities from 8K to 512K with both synchronous and asynchronous

interfaces.• High-density CMOS first-in, first-out memories (FIFOs) in synchronous unidirectional or bidirectional and

asynchronous unidirectional or bidirectional versions, covering depths from 64K to 64K bytes and widths from4 to 36 bits.

• Low-cost Asynchronous Transfer Mode (ATM) 25 to 155 Mbps segmentation and reassembly (SAR) controllersand physical layer (PHY) transceivers for use in network interface cards.

Logic Products• High-speed FCT CMOS logic devices.• High-speed 3.3V CMOS FCT logic devices.• Low skew clock drivers.• High-speed error detection and correction devices.• Zero delay bus switch devices.

RISC Microprocessors• R3000- and R4000-based 32-bit microprocessors, as well as the fourth generation R4700 and R5000 Orion

64-bit microprocessors.• RISC subsystems.


North American Company Profiles IDT


Integrated Device Technology Integrated Device Technology1566 Moffett Street 2670 Seeley RoadSalinas, California 93905 San Jose, California 95134Fab 2 Telephone: (408) 944-0114Cleanroom size: 24,000 square feet (Class 3) Fab 3Capacity (wafers/week): 2,050 Cleanroom size: 24,000 square feet (Class 1)Wafer size: 150mm Capacity (wafers/week): 2,050Process: CMOS Wafer size: 150mmProducts: SRAMs, FIFOs, MPUs Processes: CMOS, BiCMOSFeature sizes: 0.5µm-0.8µm Products: SRAMs, FIFOs, RISC MPUs, logic ICs, R&D


Integrated Device TechnologyHillsboro, OregonFab 4Cleanroom size: 48,000 square feet (Class 1)Capacity (wafers/week): 1,875 (3,000 when fully outfitted)Wafer size: 200mmProcesses: CMOS, BiCMOSFeature sizes: 0.35µm, 0.5µm(Began operations in 1Q96)

Key Agreements

• IDT gained the right to make, market, and distribute multi-banked DRAM (MDRAM) memory architecturethrough a licensing agreement with MoSys Inc. The agreement also serves to expand the existing foundryagreement between the two companies. IDT plans to introduce a 9M MDRAM chip in mid-1997, using 0.35µmprocess technology at its Hillsboro facility. IDT is a minority investor in MoSys, Inc.

• IDT codesigned its Mips-based Orion 64-bit RISC microprocessor with its partner, Quantum Effect Design.

• IDT signed an alternate source agreement with Texas Instruments for logic products. TI and IDT are also jointlydeveloping FIFO memory devices.

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IMI North American Company Profiles

INTERNATIONAL MICROCIRCUITS (IMI)

International Microcircuits Inc.525 Los Coches Street


Fax: (408) 263-6571Web Site: www.imicorp.com

IC Manufacturer

Employees 80


International Microcircuits Inc. (IMI) was formed in 1972 to manufacture high quality chrome photomasks. In theearly 1990's IMI began developing niche application-specific standard products (ASSPs), building on its years ofexperience in ASICs. The company has a particular strength in the area of frequency synthesis using phase-locked loop (PLL) techniques.

IMI has positioned itself as a leading supplier of clock circuits and is focusing its efforts on the consumer,computer, and wireless communications markets. The company is expanding its frequency timing generatortechnology to include other markets such as high-speed modems, digital video disks (DVDs), and printerapplications. In the area of wireless communications, IMI is developing integrated solutions for the ISM and DECTwireless communications applications.

Export sales accounted for almost 80 percent of total revenue in fiscal 1996.

Europe4%


Asia68%

North America21%

Japan7%


North American Company Profiles IMI

Management

Frank Deverse Chairman and Chief Executive OfficerIlhan Refioglu President and acting Chief Financial OfficerOrhan Tozun Vice President, EngineeringEd Walsh Vice President, ManufacturingGeorge Gary Director, Computer ProductsRick Reifer Director, Marketing and SalesKazuo Tomari Drector, Wireless Communications and New Business DevelopmentLarry Zuckerman Director, Wireless Communications


IMI's products are focused on two major applications: frequency synthesis for telecommunications and clockgeneration for digital systems. These products include clock generation devices for PC motherboards (includingthose based on the latest CISC and RISC processors) and PLLs and phase detectors for cellular phones, cordlessphones, satellite receivers, and cable TV boxes. IMI is also a pioneer in the integration of spread spectrumtechnology for reducing EMI.


To supplement its own wafer production capacity, IMI has foundry agreements with IBM, GMT Microelectronics,and Seiko.

International Microcircuits Inc.525 Los Coches StreetMilpitas, California 95035-5423Cleanroom size: 2,000 square feet (Class 10)Wafer size: 150mmProcess: CMOSProducts: ASSPsFeature sizes: 0.35µm, 0.8µm

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IMP North American Company Profiles

IMP

IMP, Inc.2830 North First Street


Fax: (408) 434-0335Web Site: www.impweb.com

IC Manufacturer


1993 1994 1995 1996 1997

Sales 56 48 60 77 65Net Income (2) 0.4 1 5 (12)R&D Expenditures 10 9 9 10 10Capital Expenditures 2 5 5 7 n/a

Employees 324 340 400 425 200


IMP was founded in 1981 as International Microelectronic Products, but changed its name to IMP, Inc. in 1993.Originally in the custom IC business, IMP began marketing its silicon foundry in 1987 and exited the custom ICbusiness in 1990 with the introduction of its first standard product. IMP is a supplier of high-integration andprogrammable, analog and mixed-signal ICs and wafer manufacturing services to the computer, communications,and control markets. The company is a technology leader in analog signal processing and programmable analogdesign techniques.

IMP is comprised of two business groups, the Application-Specific Standard Products group and the Customer-Specific Products group (wafer foundry). The company's ASSP group designs, manufacturers, and markets aproprietary line of value-added ICs for tape and disk drive manufacturers. The CSP group provides a wide range ofCMOS IC manufacturing processes (specializing in mixed-signal) to companies in the computer and computerperipherals markets, as well as to fabless semiconductor companies and IMP's own ASSP group. Value-addedprocesses include 0.8µm CMOS, EECMOS, 3-volt, and BiCMOS.


North American Company Profiles IMP

CSP52%


ASSP48%

North America70%


Europe and Pacific Basin

30%

To address the need for wafer capacity by small fabless startup companies, IMP announced the establishment ofits Silicon Venture Partners (SVP) program in May 1995. Under the SVP program, IMP provides access to waferfabrication capabilities to fabless semiconductor startups. This includes absorbing some of the expenses ofdeveloping and producing a new IC in exchange for product, marketing, and/or technology rights, a share offuture profits, or other compensation.

Management

David A. Laws President and Chief Executive OfficerGeorge Rassam Chief Financial OfficerRuss Almand Vice President, SalesTarsaim Batra Vice President, ManufacturingRobert J. Crossley Vice President, AdministrationJerry L. DaBell Vice President, Product PlanningMoiz B. Khambaty, Ph.D. Vice President, TechnologyGregory Koskowich Vice President, Product Development


Application-Specific Standard Products• High-frequency programmable filters for tape and disk drives.• Read channel ICs with both 3V and 5V operation for tape and disk drives.• Electrically programmable analog circuits (EPAC™)—Analog counterparts to digital FPGAs that are designed

for signal conditioning applications in the sensor, instrumentation, and industrial control markets. TheEPACs are based on IMP's mixed-signal 1.2µm EECMOS process.

Customer-Specific Products—IMP provides specialized or value-added foundry services. The firm is capable ofrunning multiple processes in the same fab. • CMOS Analog Processes: For analog and mixed-signal applications in mass storage products, fax modems,

local area networks, cellular phones, and computers.• EECMOS Process: Suitable for customization or personalization of customer designed circuits through on-

chip electrical programming.• High-Voltage Processes: Allows a chip to be designed with some sections functioning up to 18 volts and

other sections at the typical 5 volts.• 3-volt Processes: To be used with circuits designed for portable system applications.

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IMP North American Company Profiles

IMP's process technologies include: 0.8µm double-poly/double-metal CMOS, 1.0µm single- and double-poly/double-metal CMOS, 1.2µm low-voltage and high-voltage CMOS, 1.2µm double-poly/double-metalBiCMOS, and 1.2µm double-poly/double-metal EECMOS.


IMP, Inc.2830 North First StreetSan Jose, California 95134Cleanroom size: 16,000 square feet (Class 10)Capacity (wafers/week): 3,000Wafer size: 125mmProcesses: CMOS, BiCMOS, EECMOSProducts: ASSPs, ROMs, foundry servicesFeature sizes: CMOS: 0.8µm, 1.0µm, 1.2µm, 2.0µm, 3.0µm, 5.0µm

BiCMOS: 1.2µmEECMOS: 1.2µm

Key Agreements

• In July 1995, IMP signed a five-year foundry agreement with Rockwell Semiconductor Systems for thefabrication of Rockwell’s mixed-signal modem ICs.

• IMP joined with Zilog and Allegro MicroSystems in a marketing alliance. The team is marketing what they call aZIA disk drive chipset, with ZIA standing for Zilog, IMP, and Allegro. IMP's contribution to the ZIA chipset are theread channel ICs and ROMs.

• In 1992, IMP signed a technology and distribution agreement with Asahi Kasei Microsystems (AKM) coveringASSPs.

• IMP has a design and process technology transfer agreement with South African Microelectronic Systems(SAMES). SAMES purchased the rights to IMP's 1.2µm and 2.0µm mixed-signal process technologies and hasbeen qualified as a second source for IMP’s high-volume manufacturing processes.


North American Company Profiles Infinite Technology

INFINITE TECHNOLOGY

Infinite Technology Corporation2425 North Central Expressway, Suite 323

Richardson, Texas 75080Telephone: (972) 437-7800

Fax: (972) 437-7810Web Site: www.infinite-tech.com

Fabless IC Supplier

Employees 30


Established in 1991, Infinite Technology Corporation (ITC) is involved in the research, design, development, andmarketing of high-performance reconfigurable function and application specific semiconductor products andtechnology. It also provides design support and design services.

ITC has developed a field-programmable, in-system reconfigurable architecture that efficiently addresses theneed for high performance arithmetic datapath functionality required to accelerate data stream algorithms for imageprocessing in video editing, digital still cameras, broadcast video, pattern recognition, medical instrumentation,and virtual reality. Other applications for the company’s products include robotics, communications, satellites, datastorage, and military equipment.

Management

Tim Smith Chairman and Chief Executive OfficerLavelle Gibson President and Chief Operating OfficerArt Berger Chief Financial OfficerGlen Haas, Jr. Vice President, EngineeringGeorge Landers Vice President, Sales and MarketingMark R. Smith Vice President, Business ServicesRobert L. (Les) Veal Manager, Business Development


ITC’s products and services include: reconfigurable arithmetic datapath (RAD™) IC products, which are essentiallyreconfigurable DSPs; technology license agreements for programmable logic, reconfigurable arithmetic datapath,and digital signal processing architectures; ASIC design services, including custom macrocell development; andsoftware development services.

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Infinite Technology North American Company Profiles

ITC’s RAD5A4 device features four 100MHz 16-bit MacroSequencer processors, a built-in dual PLA, and five databuses. The company believes the RAD5A4 offers concurrent parallel processing performance (up to 3.2 billionoperations per second) for less than the cost of a single-chip DSP.

The company’s ASIC design services cover custom development of ICs and design cell libraries specializing indigital, analog, and mixed-signal devices, as well as memories. Design libraries include a range of custom I/Os(including SCSI and PCI), dense RAMs, PLLs, oscillators, and high-speed multipliers.

The company also offers its Cheetah high-performance hard datapath core for complex system-level ASICs. TheCheetah datapath generator core required no synthesis, is software configurable, and can be integrated withpopular microprocessor cores. The Cheetah core can also be used to design custom RAD ICs.

ITC’s architecture features single-poly, double-level-metal 0.5µm or 0.6µm CMOS technology. A 0.35µm processis under development.

Infinite Technology also functions as the U.S. representative for Nippon Precision Circuits and has a closerelationship with the Japanese company involving technology and design.


ITC’s RAD devices are manufactured by TSMC through Nippon Precision Circuits.


North American Company Profiles Integrated Silicon Solution

INTEGRATED SILICON SOLUTION (ISSI)

Integrated Silicon Solution Inc.2231 Lawson Lane


Fax: (408) 588-0806Web Site: www.issiusa.com

Fabless IC Supplier


Europe: ISSI Europe • Planegg, GermanyTelephone: (49) (89) 899-30193 • Fax: (49) (89) 899-0399

Asia-Pacific: ISSI Taiwan • Taipei, TaiwanTelephone: (886) (2) 397-9070 • Fax: (886) (2) 394-4024


1992 1993 1994 1995 1996


Employees 190 228 311 385


Integrated Silicon Solution, Inc. (ISSI), founded in 1988, designs and markets high-performance SRAM and non-volatile memory ICs. The company’s initial development efforts were focused on high-performance SRAMs forcache memory applications and introduced its first SRAM products in 1990. ISSI has since expanded its productoffering to include high-speed EPROMs, serial EEPROMs, and flash memory devices, and has expanded itsmarkets to include networking applications, telecommunications, office automation, instrumentation, andconsumer markets.

To date, SRAM sales have accounted for substantially all of ISSI's product sales. In an effort to reduce itsdependency on the memory market, ISSI entered the microcontroller market in early 1997 with the introduction ofa microcontroller family.

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Integrated Silicon Solution North American Company Profiles

Networks10%


Modem40%

Disk Drives5%

Computers22%

Telecom2%

Distributors13%

Other 8%

Japan3%


United States52%

Europe10%

Taiwan24%

Asia/Other11%

Management

Jimmy S.M. Lee Chairman, President, and Chief Executive OfficerGary L. Fischer Executive Vice President, Finance and Administration,

and Chief Financial OfficerKong-Yeu Han Executive Vice President and General Manager, ISSI-TaiwanMo Bandali Vice President, Test and Product EngineeringRobert G. Cushman Vice President, Corporate MarketingThomas Doczy Vice President, Memory Marketing Business UnitRobert Shen Vice President, Corporate PlanningPaul Song Vice President, Design EngineeringJohn Unger Vice President, Quality AssuranceChung Wang Vice President, Technology


ISSI designs and markets a family of high-performance SRAMs, as well as several families of non-volatile memoryproducts, such as high-speed, high-density EPROMs, serial EEPROMs, and flash memories. In early 1997, ISSIintroduced the first products in a new family of microcontrollers with integrated non-volatile memory.

SRAM Products• 5V SRAMs in 64K, 256K, 512K, and 1M density levels with access speeds as low as 10ns.• 3.3V SRAMs in 256K, 512K, and 1M density levels with access speeds as low as 12ns.• 3.3V 1M and 2M synchronous SRAMs with access speeds as low as 4ns for Pentium and PowerPC cache

applications.

EPROM Products• 5V EPROMs in 256K, 512K, and 1M density levels with access speeds of 30ns to 90ns.• 3.3V EPROMs in 512K and 1M density levels with 90ns access times.• 2.4V voice EPROMs with embedded speech algorithm technology.


North American Company Profiles Integrated Silicon Solution

EEPROM Products• 3.3V and 5V serial EEPROMs in 1K, 2K, and 4K density levels.

Flash Memory Products• 1M Intel-compatible bulk-erase flash memories. The company plans to introduce a 2M bulk-erase and 1M, 2M,

and 4M boot block flash chips in 1996.

Microcontroller Products• The company offers variations on the industry-standard 8051 and 8031 8-bit MCUs with embedded ROM. A

flash version, as well as 16-bit and 32-bit parts, are planned for introduction in 3Q97.

Other Products• ISSI entered the voice-chip market in 1996 with the introduction of a one-time programmable (OTP) voice chip.

The device features ADPCM compression and pop noise reduction and is the first in a planned product line ofOTP voice devices.

ISSI develops its advanced CMOS process technology in collaboration with its Asian manufacturing partners.Through these alliances, ISSI has jointly developed and taken into production six generations of CMOS memorytechnology with 1.2µm, 1.0µm, 0.8µm, 0.6µm, 0.5µm, and 0.35µm feature sizes. The company currently hasseveral development programs with Taiwan Semiconductor Manufacturing Company (TSMC), including a programbased on a 0.35µm design for advanced SRAM applications and a 0.5µm design for a high-speed flash memoryproduct. ISSI is currently in the process of developing 0.3µm and 0.25µm SRAM processes.

The company also has collaborative programs with Chartered Semiconductor Manufacturing (CSM) in Singaporefor 0.5µm SRAM process technology and with Belling Semiconductor in China for EEPROM design and processtechnology.


ISSI’s principal manufacturing partner is TSMC, with whom it also jointly develops process technology. Since1993, ISSI has also used Chartered as a foundry for some SRAM and flash products.

In addition to securing capacity with independent foundries, ISSI has invested in several joint ventureagreements, further guaranteeing capacity. In June 1996, ISSI entered into a joint venture with TSMC, along withAltera, Analog Devices, and other investors, to create a wafer fabrication facility, called WaferTech LLC, to belocated in Camas, Washington. ISSI also has a similar agreement with United Microelectronics Corporation (UMC),located in Taiwan, for additional supply of wafers. (see Key Agreements below).

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Integrated Silicon Solution North American Company Profiles

Key Agreements

• In July 1996, ISSI signed a manufacturing and joint venture agreement with TSMC, along with other investors.The agreement calls for ISSI to receive a minimum wafer capacity from TSMC in return for a four percent equitystake in the new venture. Construction of WaferTech LLC began in June 1996 with production expected tostart in 2Q98 (see separate profile of TSMC).

• In early 1996, ISSI announced an agreement with Intel. ISSI licensed flash-related patents from Intel and willpay royalty fees to Intel for the revenues generated from certain flash-based products.

• In fiscal 1995, ISSI and UMC signed a manufacturing and joint venture agreement. Under terms of theagreement, ISSI agreed to invest $30 million for an equity stake in a joint manufacturing venture (UICC) that willprovide ISSI with an additional supply of wafers beginning in 2H97.


North American Company Profiles Intel

INTEL

Intel CorporationRobert Noyce Building

2200 Mission College BoulevardP.O. Box 58119

Santa Clara, California 95052-8119Telephone: (408) 765-8080

Fax: (408) 765-1821Web Site: www.intel.com

IC Manufacturer


Europe: Intel Corporation (UK) Ltd. • Swindon, Wiltshire, United KingdomTelephone: (44) (1793) 403-000

Japan: Intel K.K. • Tsukuba-shi, Ibaraki, JapanTelephone: (81) (289) 47-8522

Asia-Pacific: Intel Semiconductor Ltd. • Hong KongTelephone: (852) 2844-4555


1992 1993 1994 1995 1996

Sales 5,844 8,782 11,521 16,202 20,847IC Sales 4,950 7,550 9,850 13,590 17,870

Net Income 1,067 2,295 2,285 3,566 5,157R&D Expenditures 780 970 1,111 1,296 1,808Capital Expenditures 1,228 1,933 2,441 3,550 3,024

Employees 25,800 29,500 32,600 41,600 48,500


Intel Corporation was established in 1968 to pursue the potential of integrating large numbers of transistors intosilicon chips. The company created the first DRAM, the first EPROM, and the first microprocessor, revolutionizingthe electronics industry by making possible small and powerful computing systems. Intel originally flourished as aMOS memory supplier. However, in 1985 Intel abandoned the DRAM business, in favor of microprocessors.

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Intel North American Company Profiles

Today, Intel is by far the world's leading supplier of MOS microprocessors. The company's other principal productsare microprocessor-related board-level products, core-logic chipsets, embedded processors and microcontrollers,flash memory devices, network and communications products, and conferencing products. Its IC products aresold to manufacturers of computer systems and peripherals, automotive equipment, industrial systems, andtelecommunications products.

Microcomponents80%

Systems/Other15%

Flash Memories5%


North America42%

Europe28%

Asia-Pacific18%


Japan12%

Thanks to strong demand for its microprocessors, Intel grew to become the world's largest semiconductormanufacturer in 1993. Part of Intel's strategy to maintaining momentum and supporting demand for its products isheavy reinvesting with its profits. Since 1991, Intel has invested more in new plants and equipment each yearthan any other semiconductor company in the world. The company expects to expend approximately $4.5 billionfor capital additions in 1997.

Intel believes that communications and multimedia will be decisive areas for the PC industry in the next decade.For this reason, the company continues to introduce new hardware and software products for local area network(LAN) management and personal computer conferencing systems. Intel is also pushing its MMX™ mediaenhancement technology, which the company says speeds up the execution of multimedia-related functions byrouting compute-intensive code to the central processor, rather than through dedicated silicon. The firstprocessors to use the MMX instruction set were introduced in January 1997. Intel’s other chips are expected togain MMX capability in 1997.

Due to the growth of Pentium microprocessor-based systems, Intel has become a major supplier of core-logicchipsets. The company’s Intel430 PCIset products, designed for desktop and mobile Pentium processors, werethe first chipsets to support the Universal Serial Bus (USB) high-performance bus architecture.

In flash memories, Intel has dominated the market essentially from the beginning. However, its share of the markethas dropped from 75 percent or more in the early 1990’s to about 44 percent in 1996 as several other playershave aggressively pursued the market.



Over the past couple of years Intel has stepped up its strategy of investing in other companies, typically startups,to help facilitate new application software content and hardware. The company investments number in the“hundreds,” and are not limited to chip companies. Companies in which it has recently invested include I/O chipspecialist Standard Microsystems Corp.; Avid Technology Inc., which makes digital content-creation products;Case Technology, a Denmark-based company that makes Fast Ethernet products; and Xircom Inc., a PC-Cardmodem vendor.

Management

Gordon E. Moore Chairman EmeritusAndrew S. Grove Chairman and Chief Executive OfficerCraig R. Barrett President and Chief Operating OfficerFrank C. Gill Executive Vice President and GM, Internet and Communications GroupPaul S. Otellini Executive Vice President and Director, Sales and Marketing GroupGerhard H. Parker Executive Vice President and GM, Technology and Manufacturing GroupLeslie L. Vadasz Senior Vice President and Director, Corporate Business DevelopmentRonald J. Whittier Senior Vice President and GM, Content GroupAlbert Y.C. Yu Senior Vice President and GM, Microprocessor Products GroupMichael A. Aymar Vice President and GM, Desktop Products DivisionAndy D. Bryant Vice President and Chief Financial OfficerLouis J. Burns Vice President and Director, Information TechnologyDennis L. Carter Vice President and Director, Sales and Marketing GroupSunlin Chou Vice President and Director, Components Technology DevelopmentRichard A. DeLateur Vice President, Finance, Intel Architecture GroupF. Thomas Dunlap, Jr. Vice President, General Counsel, and SecretaryCarlene M. Ellis Vice President and Director, Information TechnologyPatrick P. Gelsinger Vice President and GM, Desktop Products GroupHans G. Geyer Vice President and GM, European OperationsThomas L. Hogue Vice President and Director, MaterialsHarold E. Hughes, Jr. Vice President and Director, Planning and LogisticsJames W. Jarrett President, Intel PRC CorporationRobert T. Jenkins Vice President and Director, Corporate LicensingPatrick S. Jones Vice President, Finance, and Corporate ControllerD. Craig Kinnie Vice President and Assistant GM, Internet and Communications GroupMichael C. Maibach Vice President, Government AffairsEdward A. Masi Vice President, Enterprise Server GroupAvram C. Miller Vice President and Director, Business DevelopmentJohn H.F. Miner Vice President and GM, Enterprise Server GroupPatricia Murray Vice President and Director, Human ResourcesStephen P. Nachtsheim Vice President and GM, Mobile/Handheld Products GroupRobert H. Perlman Vice President, Finance and Director, Tax, Customs, and LicensingRonald J. Smith Vice President and GM, Computing Enhancement GroupArvind Sodhani Vice President and TreasurerMichael R. Splinter Vice President and Assistant GM, Technology and Manufacturing Group

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Microprocessor Products GroupMichael J. Fister Vice President and General Manager, Microprocessor Division 6Dov Frohman Vice President and General Manager, Israel OperationsDavid Perlmutter Vice President and General Manager, Israel Development CenterStephen L. Smith Vice President and General Manager, Santa Clara Processor DivisionRobert P. Colwell Director, IA-32 ArchitectureJohn H. Crawford Director, Microprocessor ArchitecturePaul D. Madland Director, Circuit TechnologyFrederick J. Pollack Director, Measurement, Architecture, and PlanningUri C. Weiser Director, Israel Development Center, ArchitectureRobert B. Wirt Director, Microcomputer Labs

Internet and Communications GroupMark A. Christensen Vice President and General Manager, Network Products DivisionKirby A. Dyess Vice President and Director, New Business DevelopmentEdward D. Ekstrom Vice President and General Manager, Systems Management DivisionJames B. Johnson Vice President and General Manager, Internet Services OperationSteven D. McGeady Vice President and Director, StrategyKevin C. Kahn Director, Communications Infrastructure Lab

Technology and Manufacturing GroupFrank Alvarez Vice President and General Manager, Strategic Components ManufacturingRobert J. Baker Vice President and GM, Microprocessor Components ManufacturingLuther G. Disney Vice President and Director, Corporate ServicesYoussef A. El-Mansy Vice President and Director, Portland Technology DevelopmentRobert M. Jecmen Vice President and Director, California Technology and ManufacturingBruce H. Leising Vice President and General Manager, Peripheral Components ManufacturingDavid B. Marsing Vice President and General Manager, Assembly/Test ManufacturingFrank A. McCabe Vice President and General Manager, Ireland OperationsBoon Chye Ooi Vice President and General Manager, Systems ManufacturingJacob A. Peña, Jr. Vice President and General Manager, Philippine OperationsJohn F. Slusser Vice President and Director, Corporate Quality NetworkWilliam M. Siu Vice President and Director, Assembly Technology DevelopmentKenneth M. Thompson Vice President and GM, Technology Manufacturing EngineeringKeith L. Thomson Vice President and Manager, Oregon SiteGregory E. Atwood Director, Flash Memory ArchitectureMark T. Bohr Director, Process Architecture and IntegrationPaolo A. Gargini Director, Technology StrategyEugene S. Meieran Director, Manufacturing Strategic SupportLeo D. Yau Director, Innovative Technology ModelsIan A. Young Director, Advanced Circuit and Technology Integration



Desktop Products GroupJohn E. Davies Vice President and Director, Consumer Desktop MarketingWilliam A. Swope Vice President and Director, Business Desktop MarketingJames H. Yasso Vice President and General Manager, Reseller Products DivisionRichard L. Coulson Director, I/O ArchitecturePeter D. MacWilliams Director, Platform Architecture

Computing Enhancement GroupWilliam O. Howe Vice President and General Manager, Memory Components DivisionWilliam B. Pohlman Vice President and General Manager, Central Logic Engineering

Sales and Marketing GroupEdwin G. Bauer Vice President and Director, Americas Sales and MarketingNobuyuki Denda Vice President and Executive Vice President, Japan OperationsSean M. Maloney Vice President and General Manager, Asia-Pacific OperationsIkuo Nishioka Vice President and President, Japan OperationsPamela L. Pollace Vice President and Director, Worldwide Press RelationsEarl L. Whetstone Vice President and General Manager, European OperationsEllen R. Konar Director, Corporate Strategic Marketing

Content GroupClaude M. Leglise Vice President and Director, Entertainment/Education Developer Relations


Intel's principal products are microprocessors, core logic chipsets based on the PCI bus, embedded processorsand microcontrollers, flash memory chips, computer modules and boards, network and communications products,personal conferencing products, and scalable parallel processing computers. Some of these products aredescribed in more detail below.

• Microprocessors—Intel's 32-bit microprocessors include the fifth-generation Pentium family and the sixth-generation Pentium Pro family. The company significantly expanded its Pentium family in 1996, introducingnew versions operating at 150, 166, and 200MHz. The 120 and 133MHz versions of the Pentium havebecome the company’s entry-level processors. In January 1997, Intel introduced versions of the Pentiumincorporating MMX media enhancement technology, which is said to significantly enhance media-rich andcommunications applications. Also in early 1997, the company introduced the Intel Mobile Module, anintegrated Pentium-based module that plugs into a mobile system’s motherboard. The Mobile Module isthought to be the kick off of Intel’s planned sales shift from processors to processor modules.

The Pentium Pro, which is available in 150MHz, 166MHz, 180MHz, and 200MHz speed grades, makes use ofRISC-like techniques that Intel has chosen to call "dynamic execution.” To date, the Pentium Pro has beendesigned primarily into servers and workstations. In early 1997, Intel named its new Pentium Pro processor withMMX technology the Pentium II processor. Initially, the Pentium II will be targeted at business desktop PCapplications.

Intel’s microprocessor products also include OverDrive processors, a family of upgrade MPUs. OverDriveprocessors allow users to upgrade their Intel486 or older Pentium processors to newer versions of the Pentium(120MHz to 166MHz). A Pentium MMX version will be introduced in 1997.

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Intel announced in early 1996 that it would phase out its commercial-grade 486SX2 and DX processor lines bythe end of 1997. The company will continue to offer 486SX, DX2, and DX4 MPUs, as well as its new ultra-low-power 486SX, but only for embedded applications.

• Chipsets—Based on the Peripheral Components Interconnect (PCI) bus, Intel’s core-logic chipsets include theIntel430 PCIset family for desktop and mobile Pentium microprocessors and the Intel440 and 450 PCIsetfamilies for the Pentium Pro microprocessors.

• Embedded Processors and Microcontrollers—This product group includes the company's i960 family of 32-bitRISC processors, the embedded Intel386 and Intel486 processor families, the 16-bit 80C186 processor family,8-bit MCS 51 and MCS 251 microcontrollers, and 16-bit MCS 96 microcontrollers. These products are targetedat a variety of applications, such as automobile engine and braking systems, hard disk drives, laser printers,input/output control modules, cellular phones, home appliances, factory automation control products,commercial and military avionics, and medical instrumentation.

On December 24, 1997, Intel will stop taking orders for mil-spec versions of its i960 MPU and i860 DSPproducts. Intel has said it is exiting the market for military ICs because parts for the commercial market are farmore lucrative than mil-spec parts. Other military-grade products to be discontinued include SRAMs, EPROMs,flash memories, and x86 and Pentium processors.

• Flash Memory Chips—Intel continues to be the largest flash memory producer. In early 1996, Intel announcedthat it was scaling back production of low-density (256K and 512K) flash parts to open up capacity for higherdensity devices. The company provides a broad line of flash memory devices, with densities ranging from 1Mto 32M. Included are the 2.7V High-Integration Boot Block flash devices (1M to 8M) that are targeted at wirelesscommunications applications; the High Performance Fast Flash devices (16M) that have either a synchronousburst-read interface or a DRAM system read interface; the High Value FlashFile™ Memory products (8M to 32M)that are partitioned into independently erasable 64K blocks, making them optimal for partial code updates or filestorage applications; and the first-generation bulk erase flash memories (1M and 2M) that were designed forEPROM-type replacement applications.

In April 1997, Intel introduced its newest family of flash memories—the Smart3 Advanced Boot Block family ofdevices. The new flash architecture, in conjunction with a new software program called Flash Data Integrator(FDI), allows for the storage of both code and data on a single flash IC. Intel expects the Smart3 flash chips willeliminate the need for EEPROMs in cellular phone applications.

Intel uses advanced CMOS and BiCMOS process technologies in the manufacture of its integrated circuits. In1996, most of Intel’s IC products were manufactured using 0.35µm and 0.4µm process technologies. During1997, the company will migrate its microprocessor production to the 0.25µm level. At 0.25µm, the companybelieves it will be able to surpass the 400MHz mark for its MPU speeds. Some of Intel’s products are stillmanufactured with 0.6µm, 0.8µm, and 1.0µm process technologies.




Intel Corporation Intel CorporationRonler Acres 3601 Juliet LaneHillsboro, Oregon 97007 Santa Clara, California 95050Telephone: (503) 681-8080 Telephone: (408) 496-9023Fab D1B Fab D2Cleanroom size: 70,000 square feet Cleanroom size: 60,000 square feet (Class 1)Capacity (wafers/week): 1,000 (6,250 in 1998) Capacity (wafers/week): 5,000Wafer size: 200mm Wafer size: 200mmProcess: CMOS Processes: CMOS, BiCMOSProducts: MPUs, R&D Products: MPUs, flash memories, R&DFeature sizes: 0.18µm, 0.25µm Feature sizes: 0.25µm-0.8µm

Intel Corporation Intel Corporation2111 Northeast 25th Avenue 5000 West Chandler BoulevardAloha, Oregon 97124 Chandler, Arizona 85226-3699Telephone: (503) 681-8080 Telephone: (602) 554-8080Fab 5 (former Fab D1 R&D fab) Fab 6Cleanroom size: 10,000 square feet Cleanroom size: 35,000 square feetCapacity (wafers/week): 500 Capacity (wafers/week): 5,375Wafer size: 150mm Wafer size: 150mmProcesses: CMOS Processes: CMOSProducts: Logic and memory ICs, MPUs, R&D Products: MPUs, MCUsFeature sizes: 0.6µm, 0.8µm, 1.0µm Feature sizes: 0.8µm, 1.0µm

Intel Corporation Intel Israel, Ltd.4100 Sara Road SE Jerusalem, IsraelRio Rancho, New Mexico 87124 Fab 8Telephone: (505) 893-7000 Cleanroom size: 10,000 square feetFab 7 Capacity (wafers/week): 3,500Cleanroom size: 60,000 square feet Wafer size: 150mmCapacity (wafers/week): 8,000 Process: CMOSWafer size: 150mm Products: MPUs, MCUs, logic ICsProcess: CMOS Feature sizes: 0.6µm-1.0µmProducts: Flash memoriesFeature sizes: 0.4µm, 0.6µm, 0.8µm

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Intel Corporation Intel Ireland, Ltd.4100 Sara Road SE Collinstown Industrial ParkRio Rancho, New Mexico 87124 Leixlip, County Kildare, IrelandTelephone: (505) 893-7000 Telephone: (353) (1) 707-7000Fab 9 Fab 10Cleanroom size: 60,000 square feet Cleanroom size: 60,000 square feet (Class 1)Capacity (wafers/week): 7,000 Capacity (wafers/week): 6,000Wafer size: 150mm Wafer size: 200mmProcess: CMOS Process: BiCMOSProducts: Flash memories Products: MPUsFeature sizes: 0.4µm, 0.6µm Feature size: 0.6µm

Intel Corporation Intel Corporation4100 Sara Road SE Chandler, ArizonaRio Rancho, New Mexico Fab 12Telephone: (505) 893-7000 Cleanroom size: 160,000 square feet (Class 1)Fab 11 Capacity (wafers/week): 12,000Cleanroom size: 185,000 square feet (Class 1) Wafer size: 200mmCapacity (wafers/week): 10,000 Processes: CMOS, BiCMOSWafer size: 200mm Products: MPUsProcesses: BiCMOS, CMOS Feature size: 0.35µm (0.25µm capable)Products: MPUs, logic ICsFeature sizes: 0.35µm-0.6µm

Intel Ireland, Ltd. Intel CorporationCollinstown Industrial Park 3585 Southwest 98th AvenueLeixlip, County Kildare, Ireland Aloha, Oregon 97007Telephone: (353) (1) 707-7000 Telephone: (503) 681-8080Fab 14 (Startup in 1998) Fab 15 (former D1A R&D fab)Cleanroom size: 75,000 square feet (Class 1) Cleanroom size: 20,000 square feetCapacity (wafers/week): 7,000 Capacity (wafers/week): 3,225Wafer size: 200mm Wafer size: 200mmProcesses: CMOS, BiCMOS Process: CMOSProducts: MPUs Products: MPUsFeature size: 0.25µm (0.18µm capable) Feature sizes: 0.35µm-0.6µm

Intel Corporation Intel Israel, Ltd.Fort Worth, Texas Kiryat Gat, IsraelFab 16 (Startup in 1999) Fab 18 (Startup in 1998)Cleanroom size: 75,000 square feet Cleanroom size: 86,000 square feet (Class 1)Wafer size: 200mm Capacity (wafers/week): 7,500Process: CMOS Wafer size: 200mmProducts: MPUs Process: CMOSFeature sizes: 0.18µm, 0.25µm Products: Flash memories

Feature sizes: 0.25µm, 0.4µm



The majority of Intel’s semiconductor assembly and testing takes place at the company’s facilities in Penang,Malaysia, and Manila, the Philippines. Some assembly and testing is performed in the U.S. In addition, thecompany is building new assembly and test factories in Shanghai, China, and San Jose, Costa Rica, bothscheduled for completion in 1998.

Key Agreements

• Moving to ensure itself a steady supply of high-density DRAMs, Intel in early 1997 purchased an equity stake inSamsung’s new $1.3 billion fab in Austin, Texas. The fab is expected to begin production of 64M DRAMs inlate 1997 or early 1998. Separately, Intel has made a move to back Rambus Technology in the development ofvery-high bandwidth Direct Rambus DRAMs. Intel has been given the option to purchase $10 million worth ofRambus stock after the technology for Direct RDRAMs, which will link directly to Intel’s chipsets, is developed.

• Integrated Silicon Solution Inc. (ISSI) licensed flash memory-related patents from Intel in early 1996.

• Intel and AMD signed a five-year patent cross-licensing agreement near the end of 1995 giving the twocompanies rights to use each other’s MPU-related patents and certain copyrights—excluding microprocessorcode. AMD agreed not to use Intel microcode beyond the 486 MPU generation.

• In October 1995, Intel and flash memory card maker SanDisk agreed to cross-license the full inventory of theirrespective flash memory patent portfolios. The deal does not include a physical exchange of technology.

• Micron signed a cross-licensing agreement with Intel in 1995 covering flash memory ICs, making Micron a truealternate source for Intel’s flash devices.

• Intel and Hewlett-Packard announced a wide ranging joint research and development alliance in 1994 underwhich the partners are seeking to design a superior next-generation 64-bit microprocessor by 1999, a year laterthan originally planned. The processor will be binary-compatible with both Intel x86 code and HP PA-RISCcode. As part of a separate agreement made in November 1996, Intel and HP are codeveloping computerencryption chips for use in PCMCIA cards.

• In 1992, Intel and Sharp signed an agreement to develop their flash memory business jointly. Sharp is currentlyshipping Intel's 32M and smaller flash devices on an OEM basis, and the two firms have developed parts thatSharp markets under its own brand name. In 1995, Sharp was able to expand into the lucrative U.S. marketafter its initial licensing agreement with Intel, which restricted it to the flash market in Japan, expired.

• Intel and Philips extended a patent cross-license agreement they made in 1977 to include all of each other'ssemiconductor devices except certain proprietary Intel MPUs and Philips video products. The agreement isnow valid until the year 2000.

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Interdesign North American Company Profiles

INTERDESIGN

Interdesign Custom Arrays Corporation525 Del Ray Avenue


Fax: (408) 749-1718

Fabless IC Supplier


Founded in 1984, Interdesign is a member of the ELEX Group of companies headquartered in Belgium. Throughits association with ELEX, Interdesign offers mixed-signal CMOS custom and standard cell ASICs in addition to itsown MM and MV bipolar arrays.

The ELEX Group also has a wafer foundry, X-FAB, located in Germany with technologies that include N-well and P-well CMOS, vertical DMOS, MOS analog to 40V, and micro sensors. Foundry services are available to U.S.semiconductor and sensor companies, through Interdesign acting as an interface between the foundry and thecustomers.

"Interdesign" has been registered as a trademark and the company has commenced doing business asInterdesign.

Management

Robert W. Townley PresidentWilliam H. Hass Vice President, Finance


Interdesign supplies mixed-signal CMOS ASICs, both custom and standard cell.


Interdesign occupies an 8,000-square-foot facility devoted to assembly, test, and engineering.


North American Company Profiles International Rectifier

INTERNATIONAL RECTIFIER (IR)

International Rectifier Corporation233 Kansas Street

El Segundo, California 90245Telephone: (310) 322-3331

Fax: (310) 322-3332Web Site: www.irf.com

IC Manufacturer


Japan: International Rectifier Far East Co., Ltd. • Toshima-ku, Tokyo, JapanTelephone: (81) (3) 3983-0641 • Fax: (81) (3) 3983-0642

Europe: International Rectifier Company (Great Britain) Ltd. • Oxted, Surrey, United KingdomTelephone: (44) (1883) 713215 • Fax: (44) (1883) 714234


1992 1993 1994 1995 1996

Sales 265 282 329 429 577IC Sales* 15 17 22 29 40

Net Income 9 (3) 16 39 66R&D Expenditures 9 14 16 20 27Capital Expenditures 35 17 25 107 112

Employees 3,000 2,700 3,100 3,310 3,915

*Calendar year


International Rectifier (IR) was founded in 1947 and is today a major worldwide manufacturer of powersemiconductors with applications in the automotive, consumer electronics, computer/peripheral, industrial,lighting, telecommunications, and government/space markets.

The company's growth products recently have been HEXFET® power MOSFETs, insulated gate bipolar transistors(IGBTs), control ICs, and high-performance diodes. In control ICs, new development efforts concentrate ondevices tailored to specific applications. New control ICs are tuned to specific power levels, features, and circuittopologies in motor control, lighting, and power supply applications. During 1996, IR’s focus was in the area of“solution” products that combine multiple components and technologies to benefit the customers’ overall circuitsize, cost, and performance.

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International Rectifier North American Company Profiles

North America46%


Europe28%

Asia26%

Management

Eric Lidow Chairman and FounderAlexander Lidow Chief Executive OfficerDerek B. Lidow Chief Executive OfficerRobert J. Mueller Executive Vice President, External Affairs and Business DevelopmentMichael P. McGee Vice President and Chief Financial Officer


IR manufactures power semiconductors, including HEXFET power MOSFETs, IGBTs, high-voltage control ICs,diodes, rectifiers, thyristors, and standard and custom power modules.

IR’s high-voltage control ICs combine power MOSFETs with analog and digital control circuitry on a single chip.They are used in a wide variety of power supply, motor, and lighting control applications, including motor controls,solenoid drivers, welding equipment, telecom switches, computer peripherals, instrumentation and testequipment, electronic lighting ballasts, and compact fluorescent light bulbs.

In late 1995, IR introduced its next-generation manufacturing technology, a four-step mask, low-voltage processcalled Gen5. By the end of fiscal 1996, IR had over 200 Gen5 HEXFET devices in volume production.


International Rectifier International Rectifier(HEXFET America) 233 Kansas Street41915 Business Park Drive El Segundo, California 90245Temecula, California 92390 Telephone: (310) 322-3331Telephone: (714) 676-7500 Capacity (wafers/week): 3,250Cleanroom size: 45,000 square feet Wafer size: 100mmCapacity (wafers/week): 13,100 Processes: CMOS, BCDMOSWafer sizes: 125mm, 150mm Products: Discretes, power ICsProcesses: CMOS, BCDMOS Feature size: 5.0µmProducts: Discretes, power ICsFeature sizes: 1.0µm-5.0µm


North American Company Profiles International Rectifier

International Rectifier Italiana, S.p.A.Via Privata Liguria 4910071 Borgoro, Turin, ItalyTelephone: (39) (11) 470-14-84Capacity (wafers/week): 6,250Wafer size: 100mmProducts: Discretes

Key Agreements

• International Rectifier signed a cross-licensing and alternate-source agreement with Motorola covering powerICs and power discretes.

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ISD North American Company Profiles

INFORMATION STORAGE DEVICES (ISD)

Information Storage Devices, Inc.2045 Hamilton Avenue


Fax: (408) 369-2422Web Site: www.isd.com

Fabless IC Supplier


1992 1993 1994 1995 1996

Sales 5 23 39 55 41Net Income (3) — 4 6 (9)R&D Expenditures 1 2 3 7 12



Information Storage Devices, Inc. (ISD), designs, develops, and markets integrated circuits for voice recording andplayback using the company’s proprietary ChipCorder™ storage technology. The company’s ChipCorderproducts are targeted at the consumer, communications, and industrial market segments.

In 1991, ISD introduced its first commercially available products—non-volatile chips that store analog signals inanalog form. From its inception in December 1987, ISD's charter has been to develop such devices for storage ofvoice, music, and other forms of analog information on a single chip.

In early 1997, ISD purchased National’s CompactSpeech processor product line. The purchase enables ISD toadd long duration record and playback chips to its ChipCorder product line. The CompactSpeech product lineincludes a family of RISC-based speech processors that feature advanced DSP technology designed for voiceapplications in the communications market.

ISD's storage technology is adaptable to a variety of small form factor applications, such as hand-held products,alarms, answering machines, cellular phones, greeting cards, and implantable medical devices. The firm's originalchips were capable of storing up to 20 seconds of information. However, ISD’s newest devices are able to storeup to four minutes of information. The company has received twelve patents with several others pending. ISDbecame a public company in February 1995.


North American Company Profiles ISD

Consumer21%


Industrial7%

Communications72%

United States35%


Europe11%

Asia54%

Management

David L. Angel Chairman and Chief Executive OfficerEric J. Ochiltree President and Chief Operating OfficerJames Brennan Vice President, Technology and DevelopmentMichael Geilhufe Vice President, Quality and ReliabilityPaul Ross Hayden Vice President, SalesCarl R. Palmer Vice President, EngineeringFelix J. Rosengarten Vice President, Finance and Administration, and Chief Financial OfficerAl Woodhull Vice President, ManufacturingKarin Bootsma Managing Director, Marketing


ISD's ChipCorder™ products are solid-state memory devices based on flash technology that store analog signalsin a multilevel format. The company currently offers six product families incorporating its ChipCoder technology.All of the company’s ChipCoder products feature an on-chip oscillator, microphone preamplifier, automatic gaincontrol, anti-aliasing filter, smoothing filter, and speaker amplifier. The devices are being built using 0.8µm CMOStechnology.

Its most recent product family, the 33000 series is based on the company’s multilevel storage methodology thatstores 256 distinct voltage levels in each memory cell. The series operates at 3 volts and extends voice storagecapacity up to four minutes, making it possible to have an answering machine built into a digital or analog cellularphone.


ISD currently has foundry agreements with Rohm, Sanyo, and Samsung.

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IXYS North American Company Profiles

IXYS

IXYS Corporation3540 Bassett Street


Fax: (408) 435-0670Web Site: www.ixys.com

Fabless IC Supplier


IXYS Corporation designs, develops, and markets a broad spectrum of power semiconductors, integrated circuits,and modules for the global power market. IXYS products are incorporated into various industrial, commercial, andmilitary systems.

Founded in 1983, IXYS has been an innovator in power MOS semiconductor products and technologies since itsinception. However, it has differentiated itself by focusing on the higher voltage and higher power end of theMOSFET and IGBT spectrum. The company's strategy is to provide cost-effective systems solutions for its targetmarkets. To that end, it provides several lines of low-cost chipsets for various applications.

In April 1989, IXYS acquired the Asea Brown Boveri (ABB) power semiconductor operation in Lampertheim,Germany. Now called IXYS Semiconductor GmbH, the firm is recognized for pioneering direct copper bonding-to-ceramic packaging technology and provides IXYS with a strong foothold in the European market.

Management

Nathan Zommer, Ph.D. President and Chief Executive OfficerPeter Ingram Managing Director, IXYS Semiconductor GmbHArnold Agbayani Vice President, FinanceRich Fassler Vice President, Sales and Marketing


The IGBT discrete and IGBT module product lines are the company's flagship products. They are targeted at theAC motor drive market first and at electric vehicles for the long-term market.


North American Company Profiles IXYS

IXYS's key product lines include:

Modules• IGBT modules• High current thyristor and rectifier modules• Rectifier bridges• Custom (customer-specific) power modules

Discretes• Ultra-fast and short circuit-rated IGBTs• MegaMOSFET™ devices• HiPer FET™ power MOSFETs• High-voltage BiMOSFET™ devices• Ultra-fast recovery epitaxial diodes (FREDs)• High-current rectifiers and switching current regulators• High-power thyristors and rectifiers

Smart Power ICs• High-voltage current regulators• Half-bridge (high side/low side) smart power ICs• Pulse width modulation controllers

Direct Copper Bond (DCB) Ceramic Substrates

For the design of its products, IXYS uses a proprietary HDMOS (high performance DMOS) technology, which iscompatible with standard bulk CMOS.


The company’s semiconductor products are fabricated in external wafer fabrication facilities through technologyand foundry relationships with a number of semiconductor companies throughout the world.

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Lansdale Semiconductor North American Company Profiles

LANSDALE SEMICONDUCTOR

Lansdale Semiconductor, Inc.2502 West Huntington Drive

Tempe, Arizona 85282Telephone: (602) 438-0123

Fax: (602) 438-0138Web Site: ssi.syspac.com/~lansdale

IC Manufacturer

Employees 50


Founded in 1964, Lansdale Semiconductor is a semiconductor life cycle extender dedicated to manufacturingpast and present technologies as long as the market requires them. The privately-held company is a strategicresource for critical military programs, telecommunications systems, and semiconductor OEMs wishing to offertheir products longer than the normal lifecycle dictates.

The company purchases lines as they are discontinued by large semiconductor companies such as Intel,Signetics, Harris, National, and Motorola. It actively seeks new product licenses from semiconductormanufacturers as part of its niche strategy and supports OEM semiconductor companies by manufacturing waferson a foundry basis to extend their product lifecycles.

Military weapons systems typically operate for approximately 25 years while the commercial lifecycle of asemiconductor chip is about seven years. Lansdale manufactures and supports these products on a continuingbasis making it possible to extend the lifecycles of the system and its products.

Management

R. Dale Lillard Owner and President


Lansdale's current product lines (about 2,600 parts) include NMOS 8-bit MPUs and bipolar general purpose logic,MPU, SRAM, PROM, and linear ICs, as well as bipolar full custom devices.


North American Company Profiles Lansdale Semiconductor

Original Manufacturer Product Line

AMD Digital Bipolar ICsRaytheon DTL 200 Series ICsSignetics DTL, TTL ICs, 54LS, 82S, 54S, 54H, LSI, 8XMotorola SUHL ICs, 5400 TTL, 3000 TTL, 900 DTE, RTL, LinearHarris 0512 Bipolar PROMs, 7600 Bipolar PROMs/Diode MatricesNational PMOS ICsIntel 8080A and peripherals, 828x Peripherals


Lansdale Semiconductor, Inc.2502 West Huntington DriveTempe, Arizona 85282Cleanroom size: 10,000 square feet (Class 100)Capacity (wafers/week): 2,000Wafer sizes: 100mm, 3inProcesses: Bipolar, LS, Linear, TTLProducts: Foundry service, bipolar ICsFeature size: 3µm, two-layer metal

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Lattice Semiconductor North American Company Profiles

LATTICE SEMICONDUCTOR

Lattice Semiconductor Corporation5555 Northeast Moore Court

Hillsboro, Oregon 97124-6421Telephone: (503) 681-0118

Fax: (503) 681-0347Web Site: www.latticesemi.com

Fabless IC Supplier


Japan: Lattice Semiconductor K.K. • Taito-ku, Tokyo, JapanTelephone: (81) (3) 5820-3533 • Fax: (81) (3) 5820-3531

Europe: Lattice Semiconductor Ltd. • Waybridge, Surrey, United KingdomTelephone: (44) (1932) 831180 • Fax: (44) (1932) 831181

Asia-Pacific: Lattice Semiconductor Asia, Ltd. • Kowloon, Hong KongTelephone: (852) 2319-2929 • Fax: (852) 2319-2750


1993 1994 1995 1996 1997


Employees 352 394 438 450 500


Lattice Semiconductor, founded in 1983, is a leader in the design, development, and marketing of high-densityand low-density programmable logic devices (PLDs) and related software development systems. Its proprietaryGeneric Array Logic (GAL®), pLSI®, and ispLSI® devices are sold worldwide, primarily to OEMs in the fields ofcommunications, industrial control, and military systems. In 1992, the company pioneered the development of afamily of in-system programmable products called Lattice ISP. Lattice ISP products give customers the ability toprogram a PLD without removing it from the circuit board, subsequently increasing the PLD’s flexibility. ISPproducts have emerged as the de facto standard in the high density PLD market.


North American Company Profiles Lattice Semiconductor

Lattice's strategy is to offer a full line of high-performance in-system programmable devices based on innovativearchitectures. The company supports its products with sophisticated logic development tools providing highfunctionality at low cost that can be easily adopted and fully integrated with common third-party CAE developmentsystems.

International sales represented 48 percent of the company’s total sales in fiscal 1996.

Management

Cyrus Y. Tsui Chairman, President, and Chief Executive OfficerSteven A. Laub Senior Vice President and Chief Operating OfficerSteven A. Skaggs Senior Vice President, Chief Financial Officer, and SecretaryJonathan K. Yu Corporate Vice President, Business DevelopmentMartin R. Baker Vice President and General CounselRandy D. Baker Vice President, ManufacturingAlbert L. Chan Vice President, California Product DevelopmentStephen M. Donovan Vice President, International SalesPaul T. Kollar Vice President, SalesRodney F. Sloss Vice President, FinanceKenneth K. Yu Vice President and Managing Director, Lattice Asia


Lattice entered the high-density complex PLD (CPLD) market in 1992 and currently offers four families of ispLSI®

products. The ispLSI 1000E family incorporates familiar GAL-like logic building blocks and offers performance upto 125MHz (7.5ns) and densities of 2,000 to 8,000 gates. The ispLSI 2000 family provides speeds of up to180MHz (5.0ns) and 3.3V and 5V operating voltages. The ispLSI 3000 family offers densities of 7,000 to 14,000gates, while retaining performance up to 125MHz (7.5ns). The ispLSI 6000 family extends the company’s CPLDdensity range to 25,000 gates and enables integration of complete logic subsystems. The family utilizes aninnovative cell-based architecture that combines a general-purpose high-density CPLD with memory and otherfunction specific circuit blocks.

Lattice offers one of the industry’s high performance and broadest line of low density CMOS PLDs. The companysells the industry standard GAL16V8, GAL20V8, GAL22V10, GAL20RA10, and GAL20XV10 architectures in avariety of speed grades (as fast as 3.5ns), with 5V or 3.3V signal compatibility. Lattice also offers severalproprietary architectures, the GAL26CV12, GAL18V10, GAL16VP8, GAL20VP8, and GAL6001/2, each of whichis optimized for specific applications. In 1994, the company extended its GAL line by introducing theispGAL22V10, bringing the advantages of in-system programmability to the low density market.

In April 1997, Lattice unveiled its ispGDX™ product family designed primarily for routing applications. According tothe company there is no control logic on the chips, allowing them to operate faster than conventional PLDs. Thefamily includes four devices with 64, 80, 120, and 160 programmable I/Os, with input-to-output delays of 5ns,clock-to-output delays of 5ns, and operating frequencies of 111MHz.

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Lattice Semiconductor North American Company Profiles

Lattice also offers its ispGDS™ (Generic Digital Switch) family of in-system programmable switching matricestargeted at mechanical dip switch replacement and connectivity applications.

The company's products are based on a proprietary EECMOS process technology, called UltraMOS®. The currentmainstream processes, UltraMOS V (0.65µm) and UltraMOS VI (0.5µm) are advanced double-metal CMOStechnologies.


Most Lattice Semiconductor products are produced by Seiko Epson in Japan. In 1994, Lattice advanced to SeikoEpson $42 million for the expansion of Seiko’s submicron wafer fab in Sakata, Japan. The investment will provideLattice with additional submicron manufacturing capacity through 1997. The foundry relationship between Latticeand Seiko Epson was further strengthened in early 1997. As part of their latest agreement, Lattice agreed toinvest up to $150 million in Seiko Epson’s Sakata, Japan, wafer fab facility in exchange for a production linededicated to Lattice.

Lattice added Taiwan’s United Microelectronics Corporation (UMC) as a foundry partner in 1995. In October 1995,Lattice said it would invest $60 million over a two and a half year period for a 10 percent equity stake in one ofUMC’s joint-venture fabs that will come on-line in mid-1997. Additionally, UMC agreed to provide Lattice withinterim wafer capacity from one of its existing fabs.

In December 1996, Lattice secured additional future capacity by signing a foundry and technology developmentagreement with Taiwan-based Holtek Microelectronics (see Key Agreements below).

Key Agreements

• Lattice signed a foundry and technology agreement with Holtek Microelectronics in December 1996. Underthe agreement, Lattice will make an equity investment in Holtek’s 200mm wafer facility that is currently underconstruction in Taiwan. In return, Holtek will provide Lattice with foundry capacity from the facility, which isexpected to be operational by January 1998. Additionally, Holtek plans to develop non-volatile memoryproducts for Lattice.

• Lattice entered into a joint venture with UMC and other US-based fabless IC companies. Lattice will invest $60million to gain a 10 percent equity stake in a new joint-venture wafer fab UMC is building in Taiwan. The jointventure fab, called United Integrated Circuits Corporation (UICC), was expected to begin production in mid-1997.

• In 1994, Lattice signed a production agreement with Seiko Epson. As part of the agreement, Lattice advancedSeiko $42 million to finance additional submicron wafer capacity at its fab in Sakata, Japan. In 1995, Latticeinvested an additional $2 million for the development of submicron process technology. In early 1997, Latticesigned an agreement to advance up to $150 million to Seiko Epson, in return for a dedicated production line inSeiko Epson’s Sakata wafer fab that was expected to begin production in mid-1997.

• Lattice has a cross-licensing agreement with AMD under which patents for AMD's PALs have been exchangedfor Lattice's GAL patents.


North American Company Profiles Level One Communications

LEVEL ONE COMMUNICATIONS

Level One Communications Inc.9750 Goethe Road

Sacramento, California 95827Telephone: (916) 855-5000

Fax: (916) 854-1101Web Site: www.level1.com

Fabless IC Supplier


1992 1993 1994 1995 1996


Employees 70 139 221 300 408


Level One Communications, Inc., founded in 1985, is a leading supplier of silicon connectivity solutions forcomplex mixed-signal communications and networking applications. The company name “Level One” refers tothe company’s initial focus on the physical layer, “layer one”, of the seven layer network model developed by theInternational Standards Organization (ISO).

The company specializes in the development of ASSPs and custom derivatives, such as transceivers, repeaters,and related devices used in two key areas of the telecommunications and data communications industry: interfacesolutions for digital transmission systems; and local and wide area networking (LAN/WAN) solutions, includingEthernet LAN, datacom, and digital modems. Most of Level One’s ICs feature complex functions incorporated ona single silicon chip for applications formerly requiring multiple chips.

In June 1995, the company acquired San Francisco Telecom, which operates as a wholly owned subsidiary anddevelops products for the Sonet/SDH, wireless, and cable modem communications markets. In 4Q96, Level Oneacquired Silicon Design Experts Inc. (SDE) to accelerate its development of Gigabit Ethernet and xDSL products.

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Level One Communications North American Company Profiles

Management

Robert D. Pepper, Ph.D. Chairman, President, and Chief Executive OfficerJ. Francois Crepin Vice President, Business DevelopmentJohn Kehoe Vice President, Finance and Chief Financial OfficerDaniel S. Koellen Vice President, Quality and Reliability AssuranceManuel Yuen Vice President, Operations


Level One’s semiconductor products include T1/E1 transceivers, receivers, repeaters, and clock adapters; digitalsubscriber line (DSL) chipsets; PDM multiplexers; and Ethernet transceivers and repeaters.


Level One utilizes several foundries in the U.S., Europe, and the Far East for the fabrication of its ICs, but does allits chip testing in-house.

Key Agreements

• In 1995, Level One entered into a technology agreement with Maker Communications Inc. for thedevelopment of asynchronous transfer mode (ATM) products.


North American Company Profiles Linear Systems

LINEAR SYSTEMS

Linear Integrated Systems, Inc.4042 Clipper Court


Fax: (510) 353-0261

Fabless IC Supplier


Linear Integrated Systems (LIS), a.k.a. Linear Systems, was formed in 1987 with the goal of establishing a marketniche by taking advantage of refractory-metal interconnect technology. Most firms have stayed away fromrefractory metals and instead prefer to use CVD and silicon-gate technologies.

Linear Systems specializes in developing integrated circuits for applications in systems where obsolete devices orprocesses are no longer available or require upgrading. Existing IC products include operational amplifiers,voltage references, and multiplexers. Besides proprietary products, Linear Systems also supplies a broad rangeof second source and obsolete devices manufactured to customer's requirements.

In addition to semiconductor design and custom manufacturing services, state-of-the-art precision thin-filmservices are also offered.

Management

John H. Hall PresidentDon Howland Manager, Eastern U.S. MarketingPaul Norton Manager, Western U.S. Marketing


Linear Systems’ proprietary product line includes bipolar linear ICs (e.g., amplifiers, voltage references,multiplexers) and discretes, as well as full custom bipolar, CMOS, and BiCMOS ICs.

Using CMOS, bipolar, and dielectric isolation processes, Linear Systems offers a family of second-source productsincluding multiplexers, monolithic dual N-channel JFETs, monolithic dual PNPs and NPNs, switches, andamplifiers.

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Linear Technology North American Company Profiles

LINEAR TECHNOLOGY

Linear Technology Corporation1630 McCarthy Boulevard


Fax: (408) 434-0507Web Site: www.linear-tech.com

IC Manufacturer


Japan: Linear Technology K.K. • Shinjuku-ku, Tokyo, JapanTelephone: (81) (3) 3267-7891 • Fax: (81) (3) 3267-8570

Europe: Linear Technology SARL • Chantenay Malabry, FranceTelephone: (33) (1) 41-07-95-55 • Fax: (33) (1) 46-31-46-13

Asia-Pacific: Linear Technology Pte., Ltd. • SingaporeTelephone: (65) 753-2692 • Fax: (65) 754-4133


1992 1993 1994 1995 1996


Employees 800 870 1,000 1,350 1,650


Linear Technology Corporation (LTC) was founded in 1981 to design, manufacture, and market a broad line ofhigh-performance standard linear integrated circuits. Its devices monitor, condition, amplify, or transformcontinuous analog signals associated with such physical properties as temperature, pressure, weight, position,light, sound, or speed.

The company targets its product and marketing efforts toward the high-performance segments of the linear circuitmarket. Applications for its products include telecommunications; notebook and desktop computers;video/multimedia; computer peripherals; cellular telephones; industrial, automotive and process controls; networkand factory automation products; and satellites.


North American Company Profiles Linear Technology

U.S.48%

Japan16%

Other13%


Europe23%

Management

Robert H. Swanson, Jr. President and Chief Executive OfficerPaul Chantalat Vice President, Quality, Reliability, and ServicePaul Coghlan Vice President, Finance, and Chief Financial OfficerTimothy D. Cox Vice President, North American SalesClive B. Davies, Ph.D. Vice President and Chief Operating OfficerRobert C. Dobkin Vice President, Design and EngineeringSean T. Hurley Vice President, OperationsLouis Di Nardo Vice President, MarketingHans J. Zapf Vice President, International Sales


Linear Technology products include: operational, instrumentation, and audio amplifiers; voltage regulators, powermanagement devices, references, comparators, and data converters; switched-capacitor filters; communicationsinterface circuits; single-chip data acquisition sub-systems; pulse width modulators; and sample-and-hold devices.The company markets approximately 5,000 finished part types, of which more than 80 percent are proprietary.

Linear Technology uses a variety of process technologies in the design and fabrication of its chips, includingstandard bipolar, CMOS, BiCMOS, and complementary bipolar, as well as thin-film and laser trimming technologies.


Linear Technology Corporation Linear Technology Corporation1630 McCarthy Boulevard Camas, WashingtonMilpitas, California 95035-7487 Fab 3Fabs 1 and 2 Capacity (wafers/week): 2,500Cleanroom size: 170,000 square feet Wafer size: 150mmCapacity (wafers/week): 4,500 Processes: CMOS, bipolarWafer size: 100mm Products: Linear ICsProcesses: CMOS, BiCMOS, bipolar Feature sizes: ≤2.0µmProducts: Linear ICs (Began production in early 1997.)Feature sizes: 2.0µm-3.0µm

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Linfinity Microelectronics North American Company Profiles

LINFINITY MICROELECTRONICS

Linfinity Microelectronics Inc.11861 Western Avenue

Garden Grove, California 92641-2119Telephone: (714) 898-8121

Fax: (714) 898-2781

IC Manufacturer


1992 1993 1994 1995 1996

CorporateSales 69 88 98 103 106Net Income 2 6 7 10 7

SemiconductorSales 27 31 39 40 38Capital Expenditures 1 2 2 5 5


Linfinity Microelectronics Inc. (LMI) is a wholly owned subsidiary of Symmetricom, Inc. (formerly Silicon General,Inc.). It was founded in 1968 as Silicon General Semiconductors and adopted its current name in 1993. LMIdesigns, manufactures, and markets linear bipolar, CMOS, and BiCMOS integrated circuits for industrial,commercial, automotive, and military applications. Linfinity's special area of expertise is in power management withan emphasis on mixed-signal technology. Sales from power supply products, represented over 50 percent oftotal sales in fiscal 1996.

The company is expanding the value-added products and services it currently provides for power supply systems,while adding product lines to serve new areas such as signal conditioning and motion control systems. Thecompany currently offers about 400 standard products.

Management

James Peterson President (acting)Ralph Brandi Vice President, SalesShufan Chan Vice President, DevelopmentMark Granahan Vice President, MarketingJames Hartman Vice President, Manufacturing


North American Company Profiles Linfinity Microelectronics


Linfinity's products generally address four main markets: power supply systems, motion control, analog signalconditioning, and data communications.

Power SupplyLinfinity is a leading supplier of a wide variety of power management products, including pulse widthmodulators (PWMs), voltage regulators, supervisory circuits, and power factor conversion chips. Typicalapplications for these products include desktop and portable computers, portable communicationsequipment, video monitors, automotive entertainment, HVAC products, satellites, and lighting. The newproduct focus in this area includes controllers, linear regulators, DC-DC converters, FET drivers, and voltagesupervisors.

Motion ControlLinfinity makes two kinds of motion control integrated circuits: one that controls the spin motor in computerdisk drives and another that controls the position of the read-write head. The new product focus in this areaincludes sensorless spindle controllers, voice coil controllers, and brushless DC motor controllers.

Analog Signal ConditioningLinfinity's signal conditioning circuits include operational amplifiers, comparators, and voltage references.Typical applications include instrumentation, industrial controls, telecommunications, and audio equipment.

Data CommunicationsA relatively new product area for Linfinity, the company’s data communications ICs include small computersystems interface products and high speed, parallel communications buses, which permit high data transferrates between computers and various peripheral devices.

Linfinity uses a wide range of process technologies that address linear and mixed-signal product requirements.

BipolarTwo main process flows are available in this technology. Option A provides a rugged, high-voltage (60V),high-power process for applications such as off-line power supplies and motor drivers. Option B provides ahigh-performance, low-voltage (20V) process for applications in high-speed, low-noise signal conditioningequipment.

CMOSExhibiting all the characteristics of a good analog CMOS process it provides 18V MOS transistors coupled withhigh density 3.0µm feature sizes for optimal packing density. Limited logic capability is available at this featuresize.

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Linfinity Microelectronics North American Company Profiles

BiCMOSThe BiCMOS process combines the Option B bipolar and CMOS processes into a single flow. The process isidealized for mixed-signal applications requiring excellent analog performance in conjunction with logiccapability. A double-level metal option is available for optimum packing density. Applications include powersupply controllers and high-performance disk drive motor controllers.


Linfinity Microelectronics Inc.11861 Western AvenueGarden Grove, California 92641Capacity (wafers/week): 1,700Wafer size: 100mmProcesses: Bipolar, CMOS, BiCMOSProducts: Linear ICs, ASICsFeature size: 3.0µm


North American Company Profiles Logic Devices

LOGIC DEVICES

Logic Devices Incorporated1320 Orleans Drive


Fax: (408) 542-0080Web Site: www.logicdevices.com

Fabless IC Supplier


Europe: Logic Devices Incorporated • Warminster, Wiltshire, United KingdomTelephone: (44) (1985) 218699


1992 1993 1994 1995 1996

Sales 12 13 13 17 13Net Income 0.1 0.3 1 1 1R&D Expenditures 1 1 1 1 1

Employees 61 49 44 49 58


Logic Devices Incorporated was founded in 1983. It develops and markets high-performance digital integratedcircuits for applications requiring high operating speeds and low operating power. Such applications includecomputers, workstations, video image processing, medical instrumentation, telecommunications, and militarysignal processing.

Logic Devices was founded as a supplier of building-block DSPs, but later entered the growing 1989 SRAMmarket. It was driven from the SRAM market in 1992 due to cost and quality problems with its then supplier ofSRAM wafers. Sales of the company’s SRAM products rebounded in 1994 and 1995, but then suffered priceerosion during 1996. SRAM products fell from representing 45 percent of the company’s sales in 1995 to 14percent in 1996. While the company plans to remain a player in fast SRAMs and other niche SRAM markets, it hasalso placed a greater emphasis on DSP devices, which grew to represent 86 percent of sales in 1996, up from 55percent in 1995.

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Logic Devices North American Company Profiles

1996 Sales by Device Type

DSP Devices86%

SRAMs14%

Europe19%

Far East 8%


North America73%

In April 1995, Logic Devices acquired Star Semiconductor, which developed the Sproc programmable digitalsignal processor architecture. The Sproc architecture enables multiple processors to efficiently share data via acommon memory array, resulting in high processing throughput.

Research efforts during 1997 will focus on DSP circuits to address broadcast, studio, and audio and video imageprocessing applications, and new products utilizing the company’s SRAM technology.

Management

Howard L. Farkas ChairmanWilliam J. Volz PresidentTodd J. Ashford Chief Financial OfficerAnthony G. Bell Vice President, TechnologyWilliam L. Jackson Vice President, Manufacturing


High-speed, low-power CMOS SRAMs and DSP circuits are Logic Devices' principal product lines. Its DSPsprimarily target video editing, broadcast special effects, and studio production applications, where losslessmanipulation of very high bandwidth data is required. The company also offers specialty memories, registerproducts, and high-performance CMOS SCSI controllers.

Ultrafast SRAM Fast Logic Specialty Memory

16K family Pipeline registers Cache-tag memories64K family Register files Resettable memories256K family Shadow registers Cache-data memories1M family FIFOs

Computational Interface

Multipliers SCSI bus controllersMultiplier-accumulatorsFiltersArithmetic logic unitsDigital correlatorsBarrel shifters


North American Company Profiles Logic Devices

The company's chips are produced using 0.5µm, 0.8µm, and 1.0µm CMOS technologies, and a sub-half-micronCMOS process is expected to be implemented in 1997.


Logic Devices has teamed with three foundry partners to manufacture its products: Oki in Japan, TSMC in Taiwan,and Zentrum Mikroelektronik Dresden (ZMD) in Germany.

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LSI Computer Systems North American Company Profiles

LSI COMPUTER SYSTEMS

LSI Computer Systems, Inc.1235 Walt Whitman Road

Melville, New York 11747-3086Telephone: (516) 271-0400

Fax: (516) 271-0405

Fabless IC Supplier


LSI Computer Systems, Inc. (LSI/CSI) began operations in 1969 and is thought to be the world’s first “fabless”semiconductor company. The privately held company utilizes a broad array of LSI process technologies in thedesign of full custom and standard ICs for products in applications ranging from consumer and industrial to militaryand aerospace.

LSI Computer Systems is recognized as one of the leading suppliers of lighting control ICs and full custom ICs,and was the first company to develop and market ICs for brushless DC motors.

Management

Al Musto Chief Executive Officer


LSI Computer Systems supplies both standard and full custom ICs. Its standard ICs include programmable digitaldelay timers, CMOS dividers, incremental encoder interface chips, counters, melody generators, lighting controlICs, AC and brushless DC motor controllers, LCD drivers, telephone line switch controllers, programmable digitallock circuits, and PIR detection circuits.

The company’s analog and digital full custom IC service is called Extra-Custom. The use of several external maskand wafer foundries that offer a broad range of process technologies makes the Extra-Custom service flexible inmeeting the needs of a variety of applications and provides automatic second-sourcing of product. LSI ComputerSystems custom designs every detail of each Extra-Custom IC thereby providing protection of the customer’sproprietary product techniques.


North American Company Profiles LSI Logic

LSI LOGIC

LSI Logic Corporation1551 McCarthy BoulevardMilpitas, California 95035

Telephone: (408) 433-8000Fax: (408) 433-7715

Web Site: www.lsilogic.com

IC Manufacturer


Japan: LSI Logic K.K. • Minato-ku, Tokyo, JapanTelephone: (81) (3) 5463-7811 • Fax: (81) (3) 5463-7825

Europe: LSI Logic Europe, Ltd. • Bracknell, Berkshire, United KingdomTelephone: (44) (1344) 426544 • Fax: (44) (1344) 481039

Asia-Pacific: LSI Logic Hong Kong, Ltd. • Hong KongTelephone: (852) 2405-8600 • Fax: (852) 2412-7820


1992 1993 1994 1995 1996

Sales 617 719 902 1,268 1,239Net Income (110) 54 109 238 147R&D Expenditures 79 79 99 124 184Capital Expenditures 143 88 166 233 362

Employees 3,400 3,370 3,750 3,750 3,910


LSI Logic is a leading designer and manufacturer of high-performance ASICs and related products and services.Founded in 1981, the company uses advanced process technology and design methodology to design anddevelop highly complex ASICs and other integrated circuits. Customers of LSI Logic are primarily originalequipment manufacturers (OEMs) in the electronic data processing, consumer electronics, telecommunications,and certain office automation industries. Within these industries, the company emphasizes digital video, digitalbroadcasting, networking and wireless communications, desktop and personal computing, and office automationapplications.

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LSI Logic North American Company Profiles

Component Products94%

1996 Sales by Business

ASIC Design and Services6%

North America58%

Japan21%


Europe17%

Pacific Rim4%

As process technology becomes more sophisticated, allowing greater density and increased functionality, the"system-on-a-chip" is becoming the foundation of LSI Logic's business. In fact, the company has trade markedthe term “The System on a Chip Company™.” Its product libraries, including its CoreWare® libraries, combined withits deep submicron process technologies provide the company with the ability to combine microprocessor"engines", logic blocks (including industry standard functions, protocols, and interfaces), and memory with acustomer’s proprietary logic on a single chip.

LSI Logic’s CoreWare technology is at the center of its shift toward more consumer and communications products.In 1996, these two segments accounted for 60 percent of the company’s revenue, versus 44 percent in 1995.New industry-standard cores added to the CoreWare library in 1996 included those for the GSM wireless market,Internet and Intranet applications, satellite set-top boxes, networking, and DVD products. In 1H97, the companyentered the cable modem market with the introduction of its Cablestream™ QAM Receiver core.

Computers34%

1996 Sales by End-Use Application

Consumer32%

Communications28%

Other6%



Management

Wilfred J. Corrigan Chairman and Chief Executive OfficerMoshe N. Gavrielov Executive Vice President, LSI Logic ProductsCyril F. Hannon Executive Vice President, Worldwide OperationsW. Richard Marz Executive Vice President, Geographic MarketsR. Douglas Norby Executive Vice President and Chief Financial OfficerJoseph M. Zelayeta Senior Vice President, Research and Development, and General Manager,

U.S. Wafer Fab OperationsManiam B. Alagaratnam Vice President, Product DevelopmentElias J. Antoun Vice President and President, LSI Logic K.K.Ronald K. Bell Vice President and General Manager, Computer and Advanced ArchitectureJean-Louis Bories Vice President, ASIC TechnologyJohn P. Daane Vice President and General Manager, Communication ProductsJohn J. D’Errico Vice President and General Manager, Pan AsiaSimon P. Dolan Vice President, Strategic MarketingBruce L. Entin Vice President, Worldwide Customer Marketing, Geographic MarketsDonald J. Esses Vice President, U.S. ManufacturingAmnon Fisher Vice President and General Manager, Consumer ProductsJeffrey L. Hilbert Vice President, Worldwide Customer Engineering, Geographic MarketsJames W. Hively Vice President, ASIC Product DevelopmentCharles E. Laughlin Vice President and General Manager, LSI Logic Japan Semiconductor, Inc.Theodore Leno Vice President, Assembly and Test OperationsBryon Look Vice President, Corporate DevelopmentR. Gregory Miller Vice President, Corporate ControllerPierre Nadeau Vice President and General Manager, LSI Logic Europe Ltd.Willsie H. Nelson Vice President, LogisticsDavid E. Sanders Vice President, General Counsel, and SecretaryRichard D. Schinella Vice President, Wafer Process R&D and Santa Clara OperationsChiaki Terada Vice President, Industrial EngineeringFrank Tornaghi Vice President, North America SalesShubha S. Tuljapurkar Vice President, Business and Personal SystemsLewis C. Wallbridge Vice President, Human ResourcesEdward K. Wan Vice President, North America Engineering

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LSI Logic's broad product line includes high-performance gate array, cell-based, and embedded array ASICs withup to five million gates. The company's CoreWare library contains cells and cores based on industry-standardfunctions, interfaces, and protocols. Example cores from the CoreWare library include Ethernet controllers, theATMizer™ II segmentation and reassembly engine, and the GigaBlaze G10™ SeriaLink 1.25-gigabit/secondtransceiver for communications applications; PCI and USB bus interfaces and Fibre Channel protocol circuits forcomputer applications; MPEG-2 and DVD decoders for digital video applications; and a GSM baseband processorfor GSM mobile phones. In addition, cores such as these may be combined with LSI Logic’s MiniRISC™ family ofMips-based RISC microprocessor cores, including the TinyRISC™ 16-/32-bit compressed-code MPU, and/orspecial-purpose memory circuits to realize system-level applications on a single chip.

In addition, LSI Logic offers a family of application-specific standard product (ASSP) high-speed digital signal andimage processing devices that handle many common digital signal processing functions. Some of the ASSPsdesigned by LSI Logic are included in the company’s CoreWare library. The company also sells stand-aloneSPARC- and Mips-based RISC microprocessors.

The company has developed and uses advanced CMOS technologies to manufacture its IC products. Its G10™0.35µm (0.25µm, Leff) 3-volt CMOS process, introduced in 1995, allows for up to 49 million transistors (or up to fivemillion usable gates) on a single chip. In early 1997, LSI Logic formally announced its next-generation G11™process technology featuring a 0.25µm (0.18µm, Leff) gate length, providing up to 64 million transistors (or up to8.1 million usable gates) and allowing greater density and increased functionality on a single chip. Devices in theG11 ASIC family will operate on 1.8V, 2.5V, or 3.3V, and consume one-fourth of the power of the G10 devices.Initial production of G11 ASICs is due to begin in 4Q97.

In a significant step to increase yields and allow for greater chip customization, LSI Logic during 1996 installedchemical mechanical polishing (CMP) equipment in its Japanese fabrication facilities. In addition, the companystarted using flip-chip interconnect package technology for its most complex chips.


Most of LSI Logic's wafers are manufactured by its Japanese subsidiary, LSI Logic Japan Semiconductor, Inc.,(JSI) which prior to January 1995 was jointly owned by LSI Logic (55 percent) and Kawasaki Steel Corporation (45percent). LSI Logic is now the sole owner of JSI, as a result of the purchase of Kawasaki Steel's interest.

LSI Logic also obtains wafers from Chartered Semiconductor in Singapore. In 1995, LSI Logic made a $20 millionequity investment in Chartered, in exchange for guaranteed wafer capacity for products based on 0.6µmtechnology and smaller for a period of 10 years.



In 1996, the company closed its aging fab in Milpitas, California, and delayed by six months the launch of its new200mm wafer fab under construction in Gresham, Oregon. The Gresham facility is now scheduled to beginproduction at the beginning of 1998.

LSI Logic Corporation LSI Logic Corporation3115 Alfred Street Gresham, OregonSanta Clara, California 95054 Capacity (wafers/week): 4,000Telephone: (408) 433-6666 Wafer size: 200mmCapacity (wafers/week): 250 Process: CMOSWafer size: 150mm Products: ASICs, ASSPsProcesses: CMOS, BiCMOS Feature sizes: 0.25µm, 0.35µmProducts: R&D, ASICs (Operations to begin in 1Q98.)Feature sizes: 0.25µm-0.5µm

LSI Logic Japan Semiconductor, Inc.(formerly known as Nihon Semiconductor)10 Kitahara, Tsukuba-shiIbaraki-ken 300-32, JapanTelephone: (81) (298) 64-7229Fax: (81) (298) 64-33362Fabs I and IICleanroom size: 50,000 square feetCapacity (wafers/week): 10,000Wafer size: 150mmProcesses: CMOS, BiCMOSProducts: ASICs, MPUs, MPRsFeature sizes: 0.35µm-1.0µm

Key Agreements

• In early 1997, LSI Logic licensed the ARM 32-bit RISC microprocessor core of Advanced RISC Machines.

• In 3Q96, LSI Logic and Mips Technologies, Inc. extended and expanded the scope of the architecture licensethat allows LSI Logic to produce Mips-based RISC microprocessors and microprocessor cores. The newlicense will expire in the year 2004.

• LSI Logic joined Mentor Graphics to form a 10-year alliance that couples Mentor’s open design tools within LSILogic’s submicron design and manufacturing environment to ensure “right-first-time” ASICs.

• The company formed a five-year alliance with Argonaut Software to develop a family of 3D graphicsaccelerators. Incorporating LSI’s system-on-a-chip, the companies will develop upgradeable 3D graphics coresfor LSI’s ASIC library.

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• LSI Logic entered into an agreement with InterDigital Communications Corporation that calls for LSI Logic todevelop and produce custom chips for InterDigital to use in Personal Communications Services (PCS)handsets and Wireless Local Loop equipment. The cores that LSI Logic will use in the design are based on thecompany’s G10 0.35µm process technology.

• LSI Logic established a joint development agreement with Sanyo Electric to design the core of an HDTVsystem.

• LSI Logic signed an agreement with Philips to collaborate on developing video compression ICs for HDTVapplications.


North American Company Profiles Lucent Technologies

LUCENT TECHNOLOGIES

Lucent Technologies Inc.Microelectronics Group

Two Oak WayBerkeley Heights, New Jersey 07922-2727

Telephone: (800) 372-2447Web Site: www.lucent.com/micro

IC Manufacturer


Japan: Lucent Technologies, Microelectronics Group • Shinagawa-ku, Tokyo, JapanTelephone: (81) (3) 5421-1600 • Fax: (81) (3) 5421-1700

Europe: Lucent Technologies, Microelectronics Group • Bracknell, Berkshire, United KingdomTelephone: (44) (1344) 865900 • Fax: (44) (1344) 865990

Asia-Pacific: Lucent Technologies, Microelectronics Group • SingaporeTelephone: (65) 778-8833 • Fax: (65) 777-7495


1992 1993 1994 1995 1996

Sales (Lucent Technologies) 17,312* 17,734* 19,765* 20,258 23,286Net Income (3,778)* 482* (867)* 553 1,054

Semiconductor**Sales 1,018 1,186 1,463 1,836 2,312Capital Expenditures 105 143 170 259 498

Employees (Microelectronics) 20,000 20,000 18,500 18,000 18,000

*Data for fiscal years ended December 31. In 1996, the fiscal year was changed to start in October.**Calendar year

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Lucent Technologies North American Company Profiles


Lucent Technologies Microelectronics Group (formerly AT&T Microelectronics) designs and manufacturesadvanced integrated circuits, power systems, and optoelectronic components. Its product line is built uponstrengths in digital signal processing, networked computing, and communications technologies. The company'sproducts are used in applications such as personal computers/multimedia systems, local-area networks (LANs),cellular base stations, TV set-top boxes, telephones, and answering machines. It is a leader in digital signalprocessors (DSPs), cell-based ASICs, video conferencing ICs, and telecommunication power systems.

AT&T Corporation’s restructuring began with an announcement on September 20, 1995, to separate the $80billion corporation into three independent companies: AT&T Corporation (communications), LucentTechnologies (systems and technology), and NCR Corporation (business computing).

The company name, Lucent, was chosen for its meaning “marked by clarity” or “glowing with light” to distinguishitself from AT&T. Lucent Technologies is made up of five business groups: Network Systems, BusinessCommunications Systems, Microelectronics, Consumer Products, and Bell Laboratories.

Network Systems57%

Consumer6%

Microelectronics10%


CommunicationsSystems

24%

Other3%

Lucent’s semiconductor roots stretch back to the late 1940's, when Bell Labs, the research and development armof Lucent Technologies, was credited with the invention of the transistor. Bell Labs was given the Nobel Prize forits invention in 1956. After nearly three decades of supplying its parent with chips, AT&T Microelectronics, as itwas then known, decided to offer its products on the merchant market. Today, only about 15 to 20 percent of thecompany’s output goes to Lucent customers, versus about 70 percent in 1990.

Lucent Technologies’ Microelectronics Products business can be divided into three product groups: integratedcircuits for use in communications and computing products and systems; energy systems, electronic powersupplies, and associated magnetic components for the telecommunications and electronic data processingindustries; and optoelectronic products for the telecommunications, cable television, and network computingmarkets. The company sold its interconnect products, Paradyne subsidiary, and custom manufacturing systemsbusinesses in 1996.



Much of Lucent’s recent growth in sales of Microelectronic Products have been due to higher sales of DSPs andASICs to OEMs, particularly in the Asia-Pacific region. International revenues represented approximately half ofthe Microelectronic Products Group’s sales in fiscal 1996.

Communications56%

Consumer6%

1996 Semiconductor Sales byEnd-Use Market

Data Processing38%

North America50%

Japan6%

1996 Semiconductor Sales byGeographic Region

Europe26%

Asia-Pacific18%

Management

Lucent TechnologiesHenry B. Schacht Chairman and Chief Executive OfficerRichard A. McGinn President and Chief Operating OfficerCurtis J. Crawford President, Microelectronics GroupWilliam T. O’Shea President, Bell LaboratoriesPatricia F. Russo President, Business Communications SystemsDaniel C. Stanzione President, Network Systems and Bell Laboratories

Lucent Technologies Microelectronics GroupCurtis J. Crawford PresidentJohn T. Dickson Vice President, Integrated CircuitsKenneth W. Dorushka Vice President, SalesPeter R. McCarthy Vice President, Sales Development and OperationsPeter T. Panousis, Ph.D. Vice President, Silicon Manufacturing and Development,

and President, Cirent SemiconductorJohn V. Pilitsis Vice President, OptoelectronicsWilliam R. Spivey Vice President, Systems and ComponentsJay A. Walters Vice President and Chief Operating Officer, Power Systems


Lucent utilizes CMOS, BiCMOS, and bipolar processes in the manufacture of its integrated circuits. The followingare Lucent’s primary semiconductor products: 16-bit and 32-bit DSPs (including modem DSPs), ASICs (digital andmixed-signal standard cells, gate arrays), FPGAs, MPEG-2 digital TV devices, and communication ICs (e.g.,network interface ICs, transceivers, and line card ICs).

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Recent new product unveilings have included the new ORCA 3 series of FPGAs that will carry the ORCA™ familyinto 0.25µm processes and 320,000 vendor-defined gates, a 56-Kbps modem chipset, and a DSP with 120MIPSperformance (claimed to be the first to exceed 100MIPS).

The company also provides bipolar IC foundry services to outside companies. The Bipolar Foundry utilizes twoindustry leading advanced complementary bipolar process technologies, called CBIC-U2 and CBIC-V2.

MOS MEMORY ANALOG

DRAM ✔ Amplifier

SRAM ✔ Interface


EPROM Voltage Regulator/Reference

ROM Data Conversion


Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)


General Purpose Logic ✔ Bipolar Memory



✔ Field Programmable Logic Field Programmable Logic


MPU/MCU/MPR

MOS MICROCOMPONENT

MPU OTHER

MCU ✔ Full Custom IC

MPR Discrete



Lucent Technologies Inc. Lucent Technologies Inc.Allentown Works Reading Works555 Union Boulevard P.O. Box 13396Allentown, Pennsylvania 18103 Reading, Pennsylvania 19612Telephone: (610) 712-6011 Telephone: (610) 939-7011Cleanroom size: 80,000 square feet Cleanroom size: 70,000 square feetCapacity (wafers/week): 15,000 Capacity (wafers/week): 5,000Wafer sizes: 125mm, 150mm Wafer sizes: 100mm (2in for optoelectronics)Processes: NMOS, CMOS, bipolar Processes: Bipolar, HVCMOS, BCDMOSProducts: Linear and logic ICs, DSPs, ASICs, Products: Linear ICs, optoelectronics,

FPGAs foundry servicesFeature sizes: 0.5µm-2.5µm Feature sizes: 1.5µm-3.5µm



Lucent Technologies Inc. Lucent Technologies Microelectronica S.A.Orlando Plant Poligono Industrial de Tres Cantos9333 South John Young Parkway S/N (Zona Oeste), 28770 Colmenar ViejoOrlando, Florida 32819 Madrid, SpainTelephone: (407) 345-6000 Cleanroom size: 20,000 square feetCleanroom size: 35,000 square feet Capacity (wafers/week): 5,000Capacity (wafers/week): 8,250 Wafer size: 150mmWafer size: 150mm Process: CMOSProcess: CMOS Products: ASICs, FPGAs, communications ICs, DSPsProducts: ASICs, FPGAs, DSPs, R&D Feature sizes: 0.35µm, 0.45µm, 0.9µm, 1.25µmFeature sizes: 0.35µm-1.25µm

Lucent Technologies Inc. Cirent SemiconductorOptoelectronics Center 9333 South John Young Parkway9901 Hamilton Boulevard Orlando, Florida 32819Breiningsville, Pennsylvania 18031-9359 Telephone: (407) 345-6000Telephone: (610) 391-2000 Capacity (wafers/week): 2,500Cleanroom size: 10,000 square feet Wafer size: 200mmWafer size: 2in Process: CMOSProcess: LPMDCVD Products: ASICs, MPRsProducts: Optoelectronics Feature sizes: 0.35µm, 0.5µmFeature sizes: 0.1µm-5.0µm (Joint venture with Cirrus Logic.

See Key Agreements.)

Key Agreements

• In April 1997, Lucent announced it had licensed Advanced RISC Machines’ high-performance, low-power RISCmicroprocessor core technology (ARM7TDMI) for integration with Lucent’s ASIC library.

• Lucent and Mitsubishi established an alliance in mid-1996 to jointly develop a set of ICs that together willperform all of the functions needed for next-generation HDTV sets for the U.S. market. The first samples of thechipset are expected to become available in early 1998.

• In October 1995, Lucent signed an agreement with Cirrus Logic to form a $600 million joint manufacturingventure in Orlando, Florida. The new company, called Cirent Semiconductor, is 60 percent owned by Lucentand 40 percent by Cirrus. Production began in early 1997, beginning with a 0.35µm process (with plans tomove to 0.25µm in the future). Lucent and Cirrus equally share Cirent’s output.

• Lucent signed an agreement with Hewlett-Packard in 1995 to develop and dual-source fiber-optic transceiversfor SONET/SDH and ATM applications.

• Lucent (then AT&T Microelectronics) struck an agreement with Standard Microsystems Corp. (SMC) in 1994under which SMC agreed to buy equipment for installation in Lucent's fab in Spain in return for a guaranteedportion of the fab output for a period of five years.

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• Lucent is working with IBM, Lockheed-Martin Federal Systems, and Motorola to establish a manufacturinginfrastructure for x-ray lithography. The team hopes to have a manufacturing capability by the end of 1997.

• Lucent has been collaborating with NEC on the development of advanced CMOS process technologies since1991. The team completed development of a 0.25µm process flow in early 1997 and are currently working on asuccessor 0.18µm program, which is targeted for completion in 1999.

• Lucent has several agreements with TriQuint Semiconductor involving the development, manufacture, andmarketing of GaAs ICs for high-performance wireless and telecommunications systems. As part of the deal,Lucent discontinued its production of GaAs wafers and now relies on TriQuint for the manufacture of its GaAswafers. The two companies are developing an epitaxial process based on Lucent's GaAs intellectual property.

• Lucent is teamed with Sandia National Laboratories to develop new lithography patterning technologies for theproduction of high-density ICs with geometries below 0.2µm.


North American Company Profiles Maxim Integrated Products

MAXIM INTEGRATED PRODUCTS

Maxim Integrated Products, Inc.120 San Gabriel Drive


Fax: (408) 737-7194Web Site: www.maximic.com

IC Manufacturer


Japan: Maxim Japan Co., Ltd. • Tokyo, JapanTelephone: (81) (3) 3232-6141

Europe: Maxim Integrated Products (UK), Ltd. • United KingdomTelephone: (44) (1734) 303388

Asia-Pacific: Maxim Integrated Products Inc. • Hong KongTelephone: (852) 2376-3000


1992 1993 1994 1995 1996


Employees 554 638 1,016 1,552 1,987


Established in 1983, Maxim Integrated Products is a leading designer, developer, and manufacturer of linear andmixed-signal integrated circuits. Maxim's products are the interface between the real, analog world and the worldof digital processing. They detect, measure, amplify, and convert real world signals, such as temperature,pressure, or sound, into the digital signals necessary for computer processing. Its circuits are used in a widevariety of microprocessor-based equipment, including PCs and peripherals, test equipment, handheld products,wireless communicators, and video displays. The company also provides a range of high-frequency designprocesses and capabilities that can be used in custom design.

Maxim’s main objective is to actively develop and market both proprietary and industry standard analog integratedcircuits that meet the increasing quality standards demanded by customers.

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Maxim Integrated Products North American Company Profiles

In mid-1994, Maxim acquired substantially all of the assets of the Tektronix's Integrated Circuits Operation inBeaverton, Oregon, for about $22 million. The acquisition provided Maxim with additional wafer productioncapacity, leading-edge high-frequency bipolar technologies that have broadened the firm's presence in thewireless and optic communications markets, as well as in high-speed data acquisition, RF signal processing, andvideo products.

Europe andPacific Rim

57%


United States43%

Management

Jack F. Gifford Chairman, President and Chief Executive OfficerFrederick G. Beck Vice President, Marketing and SalesZiya G. Boyacigiller Vice PresidentMichael J. Byrd Vice President and Chief Financial OfficerStephen R. Combs, Ph.D. Vice President, OperationsTunc Doluca Vice President, Research and DevelopmentDave J. Fullager Vice President, Research and DevelopmentAnthony C. Gilbert Vice President, and SecretaryKenneth J. Huening Vice PresidentWilliam N. Levin Vice PresidentRobert F. Scheer Vice President, Wafer OperationsRichard E. Slater Vice President and Chief Accounting OfficerVijay Ullal Vice President


Maxim Integrated Products offers a broad range of linear and mixed-signal ICs, including data converters, interfacecircuits, microprocessor supervisory circuits, operational amplifiers, power control circuits, timers and counters,display circuits, multiplexers and switches, battery chargers, voltage detectors, filters, comparators, and voltagereference circuits.


North American Company Profiles Maxim Integrated Products


During fiscal year 1996, Maxim converted over half of its wafer fabrication capacity from 100mm to 150mm wafers.To supplements its own IC production capacity, Maxim has foundry agreements with independent foundrycompanies.

Maxim Integrated Products Maxim Integrated Products430 West Maude Avenue 14320 Southwest JenkinsSunnyvale, California 94086 Beaverton, Oregon 97005Telephone: (408) 746-2650 Telephone: (503) 641-3737Cleanroom size: 15,000 square feet (Class 10) Cleanroom size: 60,000 square feetCapacity (wafers/week): 3,000 Capacity (wafers/week): 2,000Wafer sizes: 100mm, 150mm Wafer size: 100mmProcesses: CMOS, BiCMOS, bipolar Process: BipolarProducts: Linear and mixed-signal ICs Products: Mixed-signal ICsFeature sizes: 1.2µm-3.0µm Feature sizes: 0.8µm-2.0µm

(purchased from Tektronix in mid-1994)

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Micrel Semiconductor North American Company Profiles

MICREL SEMICONDUCTOR

Micrel Semiconductor, Inc.1849 Fortune Drive


Fax: (408) 944-0970

IC Manufacturer


1992 1993 1994 1995 1996


Employees 150 160 180 345 400


Micrel Semiconductor, founded in 1978, designs, develops, and manufactures a range of high-performanceanalog ICs targeting the communications, computer, and industrial markets. In 1982, Micrel acquired an ICfabrication facility in Sunnyvale, California, from Siemens Components and began acting as a silicon foundry. Thisled to the company's development of semicustom and standard linear smart power ICs. In early 1993, Micrelmoved its headquarters and manufacturing operations from Sunnyvale to San Jose. The new fab, formerly ownedby Seeq Technology, tripled Micrel's fab capacity.

The company’s products are divided into three key areas: standard ICs, custom ICs, and foundry services. In1996, the majority of the company’s revenues were from sales of standard products. The company’s standardproducts have grown from representing 14 percent of total revenues in 1992 to 66 percent in 1996. Micrelcurrently offers over 800 standard products.

Standard ICs66%

1996 Sales by Product

Custom ICs/Foundry Services

34%


North American Company Profiles Micrel Semiconductor

In addition to standard products, the company manufactures custom analog and mixed-signal circuits and provideswafer foundry services for customers who produce electronic systems for communications, consumer, and militaryapplications.


Military/Other7%

Industrial29%

Computer42%

Consumer8%

Telecom14%

North America59%


Europe11%

Asia30%

Micrel is focusing its efforts on the design and marketing of its high-performance analog power ICs to become astrong force in portable computing, desktop computing, communications, and automotive and aviationelectronics. Future plans include a continued transition toward standard products, while maintaining its presencein the custom IC and foundry business.

Management

Raymond D. Zinn President and Chief Executive OfficerGeorge T. Anderl Vice President, Sales and MarketingRobert J. Barker Vice President, Finance, and Chief Financial OfficerJohn D. Husher Vice President, Fabrication DivisionWarren H. Muller Vice President, Test OperationsLarry R. Sample Vice President, Design


Micrel supplies both standard and custom products. The company's key standard product lines include high-current low-side power MOSFET drivers, high-side power MOSFET drivers, low dropout (LDO) linear regulators,high-efficiency switching regulators, PCMCIA power control matrices, power latched drivers, display drivers, P-channel MOSFETs, and open drain power switches. Micrel also continues to offer the use of its fabricationfacilities as a foundry source.

Micrel uses and offers a full range of processes: CMOS, DMOS, bipolar, BiCMOS, and BCDMOS. The company’sfab is capable of handling metal-gate, silicon-gate, double-metal and double-poly architectures with feature sizesdown to 1.0µm.

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Micrel Semiconductor North American Company Profiles


Micrel Semiconductor, Inc.1849 Fortune DriveSan Jose, California 95131Cleanroom size: 24,000 square feet (Class 10)Capacity (wafers/week): 5,000Wafer size: 100mm (moving to 150mm)Processes: CMOS, bipolar, DMOS, BiCMOS/DMOS, BCDProducts: Linear ICs, custom ICs, foundry servicesFeature sizes: 1.0µm-2.0µm


North American Company Profiles Micro Linear

MICRO LINEAR

Micro Linear Corporation2092 Concourse Drive


Fax: (408) 432-0295Web Site: www.microlinear.com

Fabless IC Supplier


1992 1993 1994 1995 1996

Sales 37 34 42 57 54Net Income 3 — 3 11 7R&D Expenditure 7 8 9 10 11

Employees 210 210 225 251 251


Established in 1983, Micro Linear designs, develops, and markets analog and mixed-signal ICs for a broad rangeof applications within the communications, computer, and industrial markets. Such applications include local-areanetworks (LANs), mass storage, personal computers, notebook computers, personal digital assistants (PDAs),voice-band telecommunications, data acquisition, motor control, and power management.

Micro Linear targets high growth applications that require substantial analog and mixed signal content. Using itsdesigns, the company integrates electronic subsystems or several analog building block circuits into a singlecircuit or chipset. Current development projects include the development of new standard and semi-standardproducts

In 1991, Micro Linear implemented a strategy to diversify its business and lessen its dependence on the hard diskdrive industry. As a result, hard disk drive product sales in 1996 represented only six percent of total revenues,compared to 81 percent in 1990. Micro Linear expects that sales of hard disk products will continue to representless than 10 percent of total revenues.

International sales represented approximately 38 percent of total revenues in 1996.

1-218


Micro Linear North American Company Profiles

ComputerNetworking ICs

57%

HardDisk Drive ICs

6%1996 Sales by Device Type

Other ICs37%

Management

Arthur B. Stabenow Chairman, President, and Chief Executive OfficerRobert Whelton Executive Vice PresidentCarlos A. Laber Vice President, EngineeringChris A. Ladas Vice President, OperationsMarty Levy Vice President, SalesRay A. Reed Vice President, Business DevelopmentJ. Philip Russell Vice President, Finance and Administration, and Chief Financial OfficerPaul E. Standish Vice President, Marketing and Applications


Micro Linear provides second-source products and proprietary standard products as well as semi-standard partsand ASICs using bipolar, CMOS, and BiCMOS processes, with a particular emphasis placed on its 1.5µm BiCMOStechnology. Its product offerings are broken down by market application below.

Mass storage (HDD, MOD, and tape):Pulse detectors Data separatorsRead/write amplifiers Frequency synthesizersMotor, servo controllers Trajectory generatorsServo demodulators Voice coil driversRead channel FiltersSCSI terminators BuffersClock generators

LANs:Data quantizer Transceivers for ATMTransceivers for MPR, FOIRL Fiberoptic LED driversTransceivers for AUI/FDDI

Voiceband telecommunications:Gain/attenuators EqualizersTone detectors Dual filtersSine-wave generators


North American Company Profiles Micro Linear

Power and motion control:Motor controllers Synchronized power supply chipsPower factor correctors Resonant controllersBattery—DC/DC converters Phase modulation controllersPWM controllers LCD backlight IC

Data conversion:12-bit ADCs 8-bit ADCs10-bit ADCs 8-bit DACs


Micro Linear utilizes wafer foundries for the production of its ICs.

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Micro Networks North American Company Profiles

MICRO NETWORKS

Micro Networks CorporationMicroelectronics Business Unit

324 Clark StreetWorcester, Massachusetts 01606

Telephone: (508) 852-5400Fax: (508) 853-8296

Fabless IC Supplier


Micro Networks Corporation designs and manufactures custom and semi-custom data acquisition products, clockoscillators, application-specific ICs (ASICs), and custom hybrid microcircuits for worldwide high reliabilityaerospace/defense, industrial, and commercial applications.

MNC was established in 1969 as a hybrid producer and quickly became a dominant player in data conversionproducts. A second product line, frequency control products, was added in 1991. Micro Networks also designsand manufactures custom microelectronics products including thick- and thin-film substrates, hybrids, andmultichip modules. Typical applications for its custom microelectronics products are avionics, imaging, portablesatellite terminals, military electronics equipment and submarine communications receivers.

In September 1996, MNC acquired the assets of GTE Microelectronics from GTE Corporation, one of the world'slargest suppliers of communications systems, equipment, and services for commercial and government/defenseapplications. GTE Microelectronics was an organization within the Communications Systems Division of GTEGovernment Systems, one of GTE Corporation's two operating groups. With the assets of GTE Micro, MNCexpanded its monolithic capabilities and its custom microelectronics product line to include capabilities in ASICdesign, manufacture, and test. With regard to ASICs, MNC specializes in the conversion of ASIC designs and themanufacture of secure ASIC products.

Approximately 60 percent of MNC’s sales, which are forecast to be about $15 million for 1997, are from military-related products. Commercial-related products make up the remaining 40 percent.

Management

Debbie Cremin Director, Microelectronics Business UnitJohn Condon Sales Manager, Custom Microelectronics Business Unit


North American Company Profiles Micro Networks


Micro Networks’ custom microelectronics products include ASICs, FPGAs, multichip modules, and hybrid circuits.The company specializes in rapid prototyping, small production runs, custom packaging, and conversion ofhybrids to ASICs.

The companies’ ASIC offerings include a variety of standard cell and gate array technologies down to submicronCMOS, BiCMOS, and bipolar for digital, analog, and mixed-signal circuits.

Micro Networks also provides custom test services for test development and production of analog, digital, andmixed-signal circuits including temperature testing, characteristics, and qualification.


For the production of its ICs, MNC works with a number of wafer foundries including National Semiconductor,Symbios Logic, and Mitel Semiconductor.

Key Agreements

• As part of the acquisition of GTE Microelectronics in September 1996, MNC established an alliance with GTEGovernment Systems that calls for MNC to supply GTE Government Systems with custom ASICs, which werepreviously supplied by GTE Micro.

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Microchip Technology North American Company Profiles

MICROCHIP TECHNOLOGY

Microchip Technology Inc.2355 West Chandler BoulevardChandler, Arizona 85224-6199

Telephone: (602) 786-7200Fax: (602) 899-9210

Web Site: www.microchip.com

IC Manufacturer


Japan: Microchip Technology International Inc. • Yokohama, Kanagawa, JapanTelephone: (81) (45) 471-6166 • Fax: (81) (45) 471-6122

Europe: Arizona Microchip Technology Ltd. • Bourne End, Buckinghamshire, EnglandTelephone: (44) (1628) 851077 • Fax: (44) (1628) 850259

Asia-Pacific: Microchip Technology, Inc. • Kwai Fong, Hong KongTelephone: (852) 2401-1200 • Fax: (852) 2401-3431


1993 1994 1995 1996 1997

Sales 89 139 208 286 334Net Income 4 19 36 52 57R&D Expenditures 9 14 21 27 32Capital Expenditures 3 35 71 115 n/a

Employees 1,070 1,260 1,430 1,665 1,900


Microchip Technology was organized in 1989 by a group of venture capital investors to acquire General InstrumentCorporation's Microelectronics division, which was established in 1960. Since the acquisition, MicrochipTechnology has shifted its focus from commodity memory and logic products to embedded control systemproducts.

The company is now a leading manufacturer of highly integrated, field-programmable RISC microcontrollers,complementary ASSPs, and related specialty memory products for high-volume embedded control applications.Microchip sells its products to a broad and diverse customer base in the consumer, automotive, communications,office automation, and industrial markets.


North American Company Profiles Microchip Technology

Microcontrollersand associated

development systems59%

Commodity Memoriesand Logic Products

7%

1996 Sales by Product Category

EEPROMs andSpecialty EPROMs

34%

Other(primarily Asia,

Europe, and Japan)65%

United States35%


Microchip's embedded control products (microcontrollers, serial and parallel EEPROMs, and high-speed and low-power EPROMs) represented 93 percent of total product sales in fiscal 1996 compared to only eight percent oftotal product sales in fiscal 1990. The remaining 7 percent in fiscal 1996 was represented by the company’scommodity memory and logic products.

In 1995, Microchip acquired the “KeeLoq” hopping code and secure smart card technology and patentsdeveloped by Nanoteq of South Africa. The $10 million acquisition also provided Microchip with worldwidemarketing rights to the technology. New products have been, and continue to be, developed that combine theKeeLoq and smart card technology with Microchip’s 8-bit MCUs and serial EEPROMs for enhanced securityapplications in wireless/remote controlled systems.

Management

Steve Sanghi Chairman, President, and Chief Executive OfficerTimothy B. Billington Vice President, Manufacturing OperationsFrederick J. Bruwer Vice President, Secure Data ProductsC. Philip Chapman Vice President, Chief Financial Officer, and SecretarySteve Drehobl Vice President, ASIC Products DivisionHarold R. Fischer Vice President, Far East SalesLanny Fleesas Vice President, Worldwide Distribution SalesFranc C. Guerrini Vice President, Europe SalesMichael J. Jones Vice President, Human Resources and Information SystemsAdrian Kuzdas Vice President, Advanced Microcontroller and Technology ProductsDavid S. Lambert Vice President, Process Development and Manufacturing EngineeringRobert A. Lanford Vice President, Worldwide SalesMitchell R. Little Vice President, Standard Microcontroller and ASSP DivisionRobert J. Lloyd Vice President, Facilities ManagementSumit K. Mitra Vice President, Systems and ApplicationsJohn F. Oatley Vice President, Manufacturing Operations-Pacific RimGordon W. Parnell Vice President, Controller, and TreasurerGeorge P. Rigg Vice President, Advanced Microcontroller and Technology DivisionRichard J. Simoncic Vice President, Memory and Specialty Products DivisionHoward C. Teeter Vice President, Americas SalesErnest M. Villicaña Vice President, Advanced Microcontroller and Technology Division MarketingWilliam Yang Vice President, Finance-Pacific Rim

1-224


Microchip Technology North American Company Profiles


During the 1970's and 1980's, a high-volume ROM and EPROM business was then-General Instrument's primaryrevenue generator. Since then, however, Microchip has placed designs derived from microcontrollers at theforefront of its strategy, and has limited nonvolatile offerings to specialty areas such as serial EEPROMs. Althoughcommodity EPROM shipments will continue to decrease as a percentage of total sales, the company intends tomanage EPROM production levels to maintain optimal manufacturing capacity utilization.

Microchip's integrated circuit products are outlined below. These products are based on CMOS processtechnology with lithography dimensions down to 0.7µm.

Microcontroller Products• PIC16/17 8-bit microcontrollers that combine a high-performance RISC processor with one-time-programmable

(OTP) EPROM technology or reprogrammable EEPROM or flash memory technology. Current PIC16/17microcontroller product families include advanced features such as sophisticated timers, embedded A/Dconverters, extended instruction/data memory, inter-processor communication (I2C/Microwire/SPI™ bus portsand USARTs), and ROM, RAM, EPROM, EEPROM, and flash memories. Some of Microchip’s MCUs operatefrom power supplies as low as 2.0V.

• In 1996, Microchip unveiled the industry’s first 8-pin MCU family of devices—the PIC12. The PIC12 packs the8-bit high-speed RISC architecture of the PIC16/17 families into the smallest footprint microcontroller. TheMCU also integrates a 10-bit A/D converter without increasing the pin count.

Application-Specific Standard Products (combinations of PIC16/17 MCU architecture, non-volatile memory, andselected application-specific software technologies)

• TrueGauge™ intelligent battery capacity monitoring and charge controller IC.• Mouse and trackball controller IC for all Apple Computer- and IBM PC-compatible formats.• Energy management controller IC for reducing power consumption of AC induction motors.• Cost effective PICSEE PIC16/17 MCUs with 1K of on-chip serial EEPROM for applications such as automotive

security, keyless entry, remote control, telecommunications, and data acquisition.

QuickASIC™ Products• In 1996, Microchip acquired quick-turn ASIC specialist ASIC Technical Solutions, Inc. Through the acquisition,

Microchip now offers the QuickASIC family, which replace standard FPGAs and CPLDs with a lower-cost mask-programmed gate array ASICs. The QuickASIC business includes what the company calls a Zero-NRE™program. Microchip is developing the technology to allow the combination of the company’s PIC16/17 MCUcore with configurable gate arrays, thereby providing a wider range of flexibility, power ranges, and customfunctionality.

EEPROM Products• Serial CMOS EEPROMs with densities ranging from 1K to 64K and featuring data transfer rates up to 1MHz and

a 10 million erase/write cycle endurance. The company’s serial EEPROMs are offered with a wide operatingvoltage range (1.8V to 6.0V). Microchip also developed the world’s first 64K smart serial EEPROM.

• Parallel CMOS EEPROMs available in 4K, 16K, and 64K densities with 10,000 to 100,000 erase/write cycles(typ).


North American Company Profiles Microchip Technology

EPROM Products• Standard CMOS EPROMs with densities ranging from 64K to 512K.• Low-voltage (as low as 3.0V) CMOS EPROMs with densities ranging from 64K to 512K.• High-speed 256K CMOS EPROMs with access times as fast as 55ns.

Secure Data Products• KeeLoq family of secure data products. The encoder and decoder devices, which feature Microchip’s

patented KeeLoq code hopping technology, are suitable for remote keyless entry, logical/physical accesscontrol systems, alarm and immobilizer systems, garage door openers, and home security systems.


Microchip plans to install a 200mm wafer pilot line in its Fab 2 facility in 1997, and will completely convert the fabover to 200mm wafers over time. Construction of the company’s Fab 3, 200mm wafer fab is expected to begin in1998.

Microchip Technology Inc. Microchip Technology Inc.2355 West Chandler Boulevard 1200 South 52nd StreetChandler, Arizona 85224 Tempe, Arizona 85281Fab 1 Fab 2Cleanroom size: 24,000 square feet (Class 10) Cleanroom size: 25,000 square feet (Class 10)Capacity (wafers/week): 4,500 Capacity (wafers/week): 8,000Wafer sizes: 125mm, 150mm Wafer size: 150mmProcess: CMOS Process: CMOSProducts: MCUs, EEPROMs, EPROMs, ASSPs Products: MCUs, EEPROMs, ASSPs, ASICsFeature sizes: 0.7µm-1.5µm Feature sizes: 0.7µm-0.9µm

Microchip’s IC products are assembled and tested primarily at a subsidiary in Kaohsiung, Taiwan, and by a third-party contractor in Bangkok, Thailand. Other third-party assembly and test suppliers used by Microchip are locatedin the Philippines and other Asian countries.

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Micron Technology North American Company Profiles

MICRON TECHNOLOGY

Micron Technology, Inc.8000 South Federal Way

P.O. Box 6Boise, Idaho 83707-0006

Telephone: (208) 368-4000Fax: (208) 368-4435

Web Site: www.micron.com

IC Manufacturer


Japan: Micron Technology Japan, K.K. • Minato-ku, Tokyo, JapanTelephone: (81) (3) 3436-5666 • Fax: (81) (3) 3436-1444

Europe: Micron Europe, Ltd. • Crowthorne, Berkshire, United KingdomTelephone: (44) (1344) 750750 • Fax: (44) (1344) 750710

Asia-Pacific: Micron Semiconductor Asia Pacific Pte. Ltd. • SingaporeTelephone: (65) 841-4066 • Fax: (65) 841-4166

Financial History ($M), Fiscal Year Ends August 31

1992 1993 1994 1995 1996

Sales 506 828 1,629 2,953 3,654IC Sales 455 737 1,368 2,287 2,210

Net Income 7 104 401 844 594R&D Expenditures 48 57 83 129 192Capital Expenditures 102 163 377 961 1,699

Employees 4,300 4,900 5,400 8,080 9,900


Micron Technology, Inc. (MTI) was founded in 1978 as a semiconductor design consulting firm. In 1981, thecompany opened its first fabrication facility, and in late 1982, entered the memory market with a 64K DRAM, whichhad a significantly smaller die size than competing products.

Today, Micron is a leading developer and manufacturer of DRAMs, very fast SRAMs, flash memories, and othersemiconductor memory components, as well as personal computer systems, RF identification chips and systems,and complex printed circuit board assemblies. Its memory products continue to feature some of the smallest diesizes in the industry.


North American Company Profiles Micron Technology

MTI is comprised of several operating companies. Among them are Micron Semiconductor Products, Inc., which isresponsible for the sales and support of MTI’s semiconductor products; Micron Electronics, Inc., which develops,manufactures, markets, and supports PC systems, workstations, and custom-manufactured printed circuit boards;Micron Display Technology, Inc., which develops and manufactures small-area field emission displays (FEDs);Micron Communications, Inc., which develops and manufactures a line of MicroStamp™ remote intelligentcommunications (RIC) products; Micron Quantum Devices, Inc., which designs, develops, and markets flashmemory IC products and systems; and Micron Construction, Inc., which provides customized constructionservices for customers in the microelectronics, industrial, commercial, and institutional industries.

DRAMs/Specialty DRAMs

57%

1996 Corporate Sales by Product Type

SRAMs2% Other

10%

PCs31%

North America74%

Japan2%

1996 Corporate Sales by Geographic Region

Asia Pacific9%

Other5%

Europe10%

MTI’s customers are primarily computer and computer peripheral manufacturers. Other customers represent theconsumer electronics, CAD/CAM, telecommunications, office automation, data processing, and graphics displayindustries.

Management

Steven R. Appleton Chairman, President, and Chief Executive OfficerDonald D. Baldwin Vice President, SalesKipp A. Bedard Vice President, Corporate AffairsEugene H. Cloud Vice President, MarketingRobert M. Donnelly Vice President, Memory ProductsD. Mark Durcan Vice President, Process Research and DevelopmentJay L. Hawkins Vice President, Manufacturing Administration and Back EndEdward J. Heitzeberg Vice President, EngineeringLeo B. Jurica Vice President, Lehi OperationsRoderic W. Lewis Vice President, Legal Affairs, General Counsel, and Corporate SecretaryJames E. O’Toole Vice President, Product DevelopmentNancy M. Self Vice President, AdministrationSteven L. Stout Vice President, FacilitiesW. G. Stover, Jr. Vice President, Finance and Chief Financial OfficerMark E. Tuttle Vice President, Manufacturing

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Micron Technology North American Company Profiles


Micron's semiconductor product strategy is focused on the design, development, and manufacture of memoryproducts, primarily DRAMs, for standard and custom memory applications. In recent years, the company has beenapplying its core semiconductor technology in other areas, such as RFID products and flat panel displays, in orderto diversify its business.

Standard and Specialty DRAMs• 4M, 16M, and 64M standard DRAMs—fast page, extended data-out (EDO), and burst EDO modes.• 16M synchronous DRAMs (SDRAMs)—offered in speed grades of 12ns/83MHz or 10ns/100MHz.• 4M EDO DRAMs for graphics applications—x16 configuration and access times as low as 40ns.• 8M synchronous graphics RAMs (SGRAMs)—x32 configuration, with speed grades of 15ns/66MHz,

12ns/83MHz, and 10ns/100MHz.• DRAMs are also offered in bare-die form or module form.

Synchronous SRAMs• 1M and 2M flow-through or pipelined burst SRAMs—the flow-through devices support bus frequencies up to

67MHz and the pipelined devices up to 125MHz.• SRAMs are also offered in bare-die form or module form.

Flash Memories• 2M, 4M, and 8M NOR-type boot block flash memories using Intel-licensed SmartVoltage technology.• 8M and 16M NOR-type sector erase flash memories using Intel-licensed SmartVoltage technology.• Micron introduced a line of solid-state flash memory cards in 2H96.

Communications ICs• The MicroStamp Engine™ is a single-chip device that integrates an 8-bit microcontroller, 256 bytes of SRAM,

and a microwave radio to produce a stamp size remote intelligent communications (RIC) product. TheMicroStamp unit can be encoded with information and attached to almost any object. The stored data can thenbe retrieved or modified remotely at distances of 10-20 feet.

Micron’s semiconductor products are based on CMOS process technology, with the majority of chip designs at the0.43µm and 0.35µm geometry levels. The company’s research and development efforts are focused on shrinkversions of its 16M DRAMs, 64M synchronous DRAMs, and a move from 0.35µm to 0.25µm and 0.18µm processtechnologies. Other development efforts are devoted to 64M, 256M, and 1G DRAMs, and the design of newflash memory and RIC products.


North American Company Profiles Micron Technology


Micron recently completed the conversion of its 150mm wafer lines (Fabs I/II and III) to 200mm wafers.Furthermore, in mid-1995, the company began construction of a new $2.5 billion 200mm wafer fab complex inLehi, Utah. However, Micron announced in early 1996 that it would complete only the shell of the fab, and hold offon outfitting and equipping the facility until market conditions warrant. When completed, the new plant will becapable of processing 10,000 wafers per week, utilizing 0.25µm technology.

Micron Technology, Inc. Micron Technology, Inc.8000 South Federal Way 8000 South Federal WayBoise, Idaho 83707-0006 Boise, Idaho 83707-0006Fab I/II Fab IIICleanroom size: 32,400 square feet Cleanroom size: 32,000 square feetCapacity (wafers/week): 6,500 Capacity (wafers/week): 7,000Wafer size: 200mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: DRAMs, SRAMs, RFID ICs Products: DRAMs, SRAMs, flash memoriesFeature sizes: 0.35µm-0.7µm Feature sizes: 0.35µm, 0.43µm

Micron Technology, Inc.8000 South Federal WayBoise, Idaho 83707-0006Fab IVCapacity (wafers/week): 700Wafer size: 200mmProcess: CMOSProducts: Memory R&DFeature sizes: 0.25µm, 0.35µm

Micron’s ICs are tested and assembled at its own facilities located at the site of its headquarters and fabs in Boise,Idaho.

Key Agreements


• Micron signed a cross-licensing agreement with Intel in 1995 covering flash memory ICs, making Micron a truealternate source for Intel’s flash devices.

• Micron announced in 1992 a memorandum of understanding with NEC on the mutual OEM sales of eachother's semiconductor memory products.

• Micron has made a number of agreements to license its known-good die (KGD) technology. Licensees includeHoneywell SSEC, Chip Supply, nChip, and Cybex Technologies.

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Mitel Semiconductor North American Company Profiles

MITEL SEMICONDUCTOR

Mitel Semiconductor360 Legget DriveP.O. Box 13089Kanata, Ontario

Canada K2K 1X3Telephone: (613) 592-2122

Fax: (613) 592-4784Web Site: www.semicon.mitel.com

IC Manufacturer


North America: Mitel Semiconductor • Mt. Dora, FloridaTelephone: (352) 383-8877 • Fax: (352) 383-8822

Financial History ($M, Canadian)

1992 1993 1994 1995 1996

Sales* 45 69 80 110 197R&D Expenditures 8 6 7 9 17

Employees 529 552 564 633 1,061

*External sales only. Mitel Semiconductor also supplies ICs and hybrids to its parent Mitel Corporation.


Mitel Semiconductor, founded in 1976, designs, manufactures, and markets ICs, hybrids, and optoelectroniccomponents. It supplies analog and digital telecommunications ICs, thick-film hybrids, and board-level products todesigners of products such as PBXs, EDs, MUXs, and computer/telephony systems. These products are used intelecommunications, data communications, video, aerospace, industrial, instrumentation, and medicalapplications. Mitel Semiconductor also offers a high-quality custom wafer fabrication service.

In March 1996, Mitel Semiconductor acquired Swedish semiconductor manufacturer ABB Hafo.


North American Company Profiles Mitel Semiconductor

ICs68%

Hybrids11%


Wafers 9%

Opto11%

Thermal Print Heads1%

United States34%

ROW18%


Europe35%

Canada5%

Japan 8%

Management

John Millard President and Chief Executive Officer, Mitel CorporationKirk Mandy Vice President and General Manager, Semiconductor Division


Mitel Semiconductor's product line includes analog and digital switches; DTMF and caller-ID devices; subscriberline circuits (SLICs); telephone-set, ISDN, and line interface devices; and broadband ISDN primary rate and ATMproducts. Mitel Semiconductor also offers a custom wafer foundry service.


Mitel Semiconductor is in the process of upgrading its Bromont fabrication facility to 150mm wafers. Additional100mm capacity is also being added to the Järfälla facility in Sweden.

Mitel Semiconductor Mitel Semiconductor AB18 Airport Boulevard Bruttovägen 1, P.O. Box 520Bromont, Quebec, Canada J0E 1L0 S-175 26 Järfälla, SwedenTelephone: (514) 534-2321 Telephone: (46) (8) 580 24500Fax: (514) 534-3201 Fax: (46) (8) 580 20190Cleanroom size: 18,000 square feet Cleanroom size: 13,000 square feetCapacity (wafers/week): 2,700 Capacity (wafers/week): 750Wafer size: 100mm Wafer size: 100mmProcesses: CMOS, double poly/triple metal, Processes: CMOS, DMOS, SOS CCD, metal gate Feature sizes: 1.25µm, 1.5µm, 2.0µm, 3.0µmFeature sizes: 0.8µm, 1.2µm, 1.5µm, 2.0µm,

3.0µm, 4.0µm, 5.0µm, 9.0µm

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Mosaic Semiconductor North American Company Profiles

MOSAIC SEMICONDUCTOR

Mosaic Semiconductor, Inc.7420 Carroll Road, Suite 300


Fax: (619) 271-6058

Fabless IC Supplier

Employees 25


Founded in 1988, Mosaic Semiconductor is a supplier of high reliability memory components and subsystems formilitary, aerospace, industrial, and medical markets. Mosaic's customers are mainly in the U.S. and Canada.European customers are serviced by the England-based operation, HMP.

Management

David Armstrong President and Chief Executive OfficerAnthony Swaddle Executive Vice President and General ManagerJaime Conde Manager, North American Sales


Mosaic’s memory products include EPROM, EEPROM, flash and SRAM in 8, 16, and 32-bit widths, and areavailable in both ceramic and hi-rel plastic packages. Screening levels available range from commercial to MIL-STD883C screen.


Mosaic's ICs are currently manufactured by various North American and off-shore semiconductor manufacturers.The company maintains an assembly, test, and package design facility in San Diego.


North American Company Profiles MOSAID Technologies

MOSAID TECHNOLOGIES

MOSAID Technologies IncorporatedP.O. Box 13579Kanata, Ontario

Canada K2K 1X6Telephone: (613) 836-3134

Fax: (613) 831-0796Web Site: www.mosaid.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends April 30

1992 1993 1994 1995 1996

Sales 7 10 15 24 38Net Income (1) 2 3 4 8R&D Expenditures 2 2 3 5 7

Employees 61 58 74 93 132


MOSAID Technologies was founded in 1975 to provide MOS memory design and consulting services. Today, thecompany is a recognized leader in the design of memory chips and a leading supplier of engineering memory testsystems. The company operates from two divisions: the Semiconductor Division, which designs advancedmemory chips for both standard memory and application-specific memory (ASM) requirements, and the SystemsDivision, which designs, manufactures, markets, and services memory test systems focused primarily onengineering testing requirements. Approximately 93 percent of MOSAID's sales revenue is generated outside ofCanada.

Japan34%


North America21% Korea

23%

Taiwan11%

Other11%

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MOSAID Technologies North American Company Profiles

Management

Richard C. Foss, Ph.D. ChairmanGeorge J.J. Cwynar President and Chief Executive OfficerRobert C. Albrow Vice President, Strategic and Technical DevelopmentRichard D. Broadway Vice President, Finance and Administration, and Chief Financial OfficerG. Glenn Evans Vice President and General Manager, Systems Division


MOSAID has experience in nine generations of DRAM designs, from 4K to 256M. Some recent memory chipdesigns include: a 143MHz, four-bank, 64M SDRAM supporting x4, x8, and x16 configurations, a high-performance 16M synchronous DRAM supporting data transfer rates of up to 200Mbps, a low-voltage 16M DRAMupgrading the capabilities of portable computers, a low-voltage word-wide 4M DRAM, and a low-power SRAM.

Macrocell designs intended for use as blocks within ASICs include high-speed pipelined SRAMs and DACs forRAMDAC function, high-performance embedded DRAM, and HDRAM™ (high-density DRAM)—MOSAID’sproprietary DRAM technology for single poly logic processes. A yield enhancement vehicle closely integratedwith MOSAID’s engineering testers is also available.

Key Agreements

• MOSAID announced in February 1997 that its HDRAM embedded memory technology would be ported toTSMC’s 0.35µm logic process.

• MOSAID signed a distribution agreement with Synopsys Inc. in February 1997 for the integration of thecompany’s HDRAM technology into Synopsys’ cell-based array technology.

• MOSAID is involved in the SLDRAM Consortium (formerly the SyncLink Consortium). Its role is to examine thefeasibility, chip architecture, and bus interface of the new SLDRAM standard, as well as provide thedemonstration design.

• MOSAID announced a cooperative development agreement with Oki Electric Company in July 1996, for thedevelopment of an advanced 16M SDRAM and a 64M Outer Data Inner Control SDRAM.

• In November 1995, MOSAID acquired 12 percent of Edge Semiconductor Inc, a designer and supplier of ICsfor the automatic test equipment (ATE) market, based in San Diego, California.

• In 1994, MOSAID teamed up with Symbionics Ltd., Standard Microsystems Corp., and three venture capitalfirms to form the joint venture company Accelerix, which is developing a single-chip graphics accelerator.


North American Company Profiles Motorola

MOTOROLA

Motorola, Inc.Semiconductor Products Sector (SPS)

3102 North 56th StreetPhoenix, Arizona 85018

Telephone: (602) 952-3000Fax: (602) 952-6100

Web Site: motserv.indirect.com

IC Manufacturer


Europe: Motorola, European Semiconductor Group • Geneva, SwitzerlandTelephone: (41) (22) 7991-1111 • Fax: (41) (22) 7341-086

Asia-Pacific: Motorola Silicon Harbor Centre • Tai Po, Hong KongTelephone: (852) 2666-8333 • Fax: (852) 2666-6123


1992 1993 1994 1995 1996

CorporateSales 13,303 16,963 22,245 27,037 27,973Net Income 453 1,022 1,560 1,781 1,154

SemiconductorSales 4,470 5,800 6,960 8,540 7,858 IC Sales 3,606 4,825 5,600 6,850 6,379 Discrete Sales 864 975 1,360 1,690 1,479Capital Expenditures 666 1,120 1,640 2,530 1,400

Employees (SPS) 41,000 44,000 46,000 52,000 52,000


Established in 1928, Motorola's first products were battery eliminators and private label radio sets. Shortly afterWWII Motorola entered the television and semiconductor businesses. Today, Motorola, Inc. (based inSchaumburg, Illinois) supplies a wide range of electronic products, including cellular telephones, semiconductors,two-way radios, paging and data communications products, defense and space electronics, computers, and otherelectronic components, modules, and systems for automotive, industrial, transportation, navigation,communication, energy systems, consumer, and lighting markets.

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Motorola North American Company Profiles

Semiconductor26%

Messaging,Information,and Media

13%

1996 Corporate Sales byProduct Group/Sector

Land Mobile13%

General Systems37%

Other11%

In 1949, Motorola set up a solid-state research laboratory in Phoenix, Arizona, and then established itssemiconductor products sector in 1954. The company has since continued to be one of the world’s largestproducers of semiconductors. It offers one of the industry's broadest portfolios of semiconductor products,including high-performance microprocessors and microcontrollers, digital signal processors, memories, mixed-signal components, programmable logic devices, advanced CMOS ASICs, customizable standard products, RFand microwave devices, sensors, optoelectronics, and discretes. Applications for these products are primarily inthe communications, computer, and industrial markets, but also in the automotive and consumer markets.

Communications34%

Computing24%

1996 Semiconductor Sales byEnd-Use Market (est)

Consumer10%

Industrial17%

Automotive15%

Americas51%

Europe23%

1996 Semiconductor Sales byGeographic Region

Asia/Pacific18%

Japan8%

Motorola Semiconductor Products Sector (SPS) is organized into five product groups:

Communications and Advanced Consumer Technology Group (based in Austin, Texas)Advanced Digital Consumer DivisionWireless DivisionImaging and Storage DivisionWireline Division

Communications, Power, and Signal Technologies Group (based in Phoenix, Arizona)RF Semiconductor DivisionPower Products DivisionSensor Products DivisionOptoelectronic and Signal Products Division



Logic and Analog Technologies Group (based in Phoenix, Arizona)Analog IC DivisionLogic IC Division

Microcontroller Technologies Group (based in Austin, Texas)Advanced Microcontroller DivisionMotorola Segments DivisionCISC Automotive and Industrial DivisionCustom Microcontroller Solutions DivisionCISC Consumer, Communications, and Smartcard Division

Microprocessor and Memory Technologies Group (based in Austin, Texas)RISC Microprocessor DivisionDynamic Memory Products DivisionFast Static RAM Division

It is estimated that Motorola SPS sells approximately 20 percent of its semiconductor output to other Motorolagroups and sectors.

Management

Motorola, Inc.Gary L. Tooker ChairmanChristopher B. Galvin Chief Executive OfficerRobert L. Growney President and Chief Operating OfficerCarl F. Koenemann Executive Vice President and Chief Financial Officer

Motorola Semiconductor Products SectorHector Ruiz President and General ManagerBertrand Cambou Senior Vice President and Director, TechnologyLarry L. Gartin Senior Vice President and Director, FinanceGary M. Johnson Senior Vice President and GM, Service, Panning, and LogisticsPaul J. Shimp Senior Vice President and Director, Quality and Support OperationsFred Shlapak Senior Vice President and GM, Communications and Advanced

Consumer Technologies GroupC.D. Tam Senior Vice President and GM, Microcontroller Technologies GroupBarry Waite Senior Vice President and GM, Microprocessor and Memory

Technologies GroupPete Bingham Vice President and GM, Wireline IC DivisionJim George Vice President and GM, Imaging and Storage DivisionSteve Hanson Vice President and GM, European Semiconductor GroupBill Seiferth Vice President and GM, Communications, Power, and Signal

Technologies GroupGeorge Turner Vice President and GM, Logic and Analog Technologies GroupPeter Gill Vice President and Director, Manufacturing TechnologyBrian Hilton Vice President and Director, World Marketing

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L.J. Reed Vice President and Director, Application Specific IC DivisionBud Broeker Corporate Vice President and GM, Dynamic Memory Products DivisionCarlos Genardini Corporate Vice President and GM, Asia-Pacific Semiconductor GroupThomas Gunter Corporate Vice President and GM, RISC Microprocessor DivisionGreg White Corporate Vice President and GM, Custom Microcontroller Solutions DivisionBrian Wilkie Corporate Vice President and GM, Advanced Microcontroller Division


MOS MEMORY ANALOG

✔ DRAM ✔ Amplifier

✔ SRAM ✔ Interface

✔ Flash Memory ✔ Consumer/Automotive







✔ Gate Array ✔ General Purpose Logic

Standard Cell ✔ Gate Array/Standard Cell

✔ Field Programmable Logic Field Programmable Logic


MPU/MCU/MPR

MOS MICROCOMPONENT

✔ MPU OTHER




MOS Micro36%

Discrete/Opto19%

1996 Semiconductor Sales byDevice Type

Analog13%

MOS Memory10%

MOS Logic15%

Digital Bipolar7%



Provided below are details concerning Motorola’s semiconductor products.

Analog ICs

Motorola offers an extensive line of linear ICs, including amplifiers and comparators, power supply circuits, powerand motor control devices, voltage references, data converters, interface circuits, communications circuits,consumer electronics ICs, automotive ICs, and other special purpose linear ICs like RF circuits. These devices aremanufactured using bipolar or MOS technology. In early 1997, the company introduced a 1.0V rail-to-rail dual opamp.

Application-Specific ICs (ASICs)

Motorola’s ASIC products include CMOS, bipolar, and BiCMOS gate arrays and FPGAs. Its most advanced digitalgate arrays (M5C Series) are based on three-layer-metal 0.45µm (Leff) CMOS process technology, which allows forup to 557,000 available gates and 556 I/Os.

The company’s programmable logic products include its Motorola Programmable Arrays (MPAs), which are SRAM-based fine-grain FPGAs. Based on technology from U.K.-based Pilkington Microelectronics, which Motorolaacquired in March 1997, the MPA devices are built using a 0.6µm triple-level-metal CMOS process and areavailable with gate densities ranging from 8,000 to 22,000 gates. Motorola and Pilkington have had a workingrelationship since 1992 (see Key Agreements).

Customizable Standard Products (CSPs)

The company launched its Customizable Standard Product (CSP) program in June 1995, following two years ofdevelopment. Motorola currently offers CSPs for asynchronous transfer mode (ATM) local and wide area networkapplications in its MC92000 Series.

Discretes, Optoelectronics, and Sensors

These products include a variety of bipolar and MOS transistors, diodes, RF and microwave devices, thyristors,optoelectronics, pressure and temperature sensors, fiber optic devices, and power modules.

Logic ICs

From the beginning, Motorola has been a leader in the market for digital logic devices. Its product line includes abroad range of bipolar MECL (Motorola emitter-coupled logic), MECL10K, MECL10KH, MECL III, ECLinPS (ECL inpicoseconds), ECLinPS Lite, low-power TTL, and fast TTL logic IC families, as well as CMOS high-speed, low-voltage, and metal-gate logic IC families.

Memory ICs

Motorola manufactures and markets dynamic and fast static RAMs, including processor-specific SRAMs,synchronous SRAMs, and BurstRAM devices. Its fast SRAMs are based on 0.8µm to 0.4µm BiCMOS and high-performance CMOS technologies with access times as low as 4.5ns and operating frequencies greater than200MHz.

The company’s DRAMs include 4M and 16M parts designed using 0.6µm and 0.5µm high-performance CMOStechnologies. 64M DRAMs will be available in late 1997.

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In late 1996, Motorola added flash memory products to its portfolio through an alliance with Mitsubishi (see KeyAgreements). The first MobileFlash product to be offered by Motorola was an 8M 3.3V-only boot-block DINORflash memory device for portable and handheld equipment applications.

Microcontrollers and Digital Signal Processors

Motorola offers one of the most comprehensive selections of high-performance single-chip microcontrollers,ranging from industry-standard 8-bit controllers to state-of-the-art 16-bit and 32-bit modular controllers.

The company’s 68HC05 and 68HC08 families of 8-bit MCUs are part of the Motorola Customer Specific IC (CSIC)program, which is targeted for high-volume projects that require the cost-efficiency of standard devices, but haverequirements that cannot be met by “off-the-shelf” components.

Motorola’s 16-bit MCUs include the 68HC11 controller family and the 68HC16 modular controller family. Its 32-bitMCUs include the 6833x controller family and the PowerPC-based MPC5xx controller family.

Motorola’s digital signal processor products include the 56100 and 56800 families of 16-bit general-purposeDSPs, the 56000, 56300, and 56800 families of 24-bit general-purpose DSPs, and the 96002 family of 32-bitgeneral-purpose floating-point DSPs. The company is working to regain a dominant position in the merchantdigital signal processor market by developing new DSPs for the personal and wireless communicationsapplications.

Microprocessors and Embedded Processors

Motorola manufactures and markets high-performance microprocessors for computer applications and embeddedprocessors for a variety of applications, including communications, imaging, office peripherals, multimediasystems, games, and industrial controls.

The PowerPC RISC microprocessor family has replaced the 680x0 family of CISC MPUs as Motorola’s mainstreamprocessors for computer applications. However, the 680x0 MPUs still have a strong presence in the market forembedded processors.

• PowerPC 601 Microprocessor—The first member of the PowerPC family, the 2.8-million-transistor 32-bit 601 isdesigned for application in desktop computers. The newest 100MHz version (601v) is based on a 0.5µm(0.25µm Leff) CMOS process.

• PowerPC 602 Microprocessor—The 1-million-transistor 32-bit 602 is intended for use in portable and smallform factor equipment, such as PDAs.

• PowerPC 603/603e Microprocessors—The 32-bit 603 is a 1.6-million-transistor high-performance RISC MPUwith integrated power management features for the notebook and energy-sensitive desktop PC markets. In4Q96, Motorola (and its partner IBM) introduced 225MHz and 240MHz versions of the 603e, and set a goal ofreaching 300MHz by the end of 1997.

• PowerPC 604/604e Microprocessors—The 32-bit 604 and 604e processors are targeted at mainstreamdesktop PC and server applications. The 604e is expected to surpass its current 200MHz clock rate toeventually exceed 300MHz.



• PowerPC 620 Microprocessor—The 620 is the first 64-bit implementation of the PowerPC RISC architecture. Itis intended for use in server and high-end workstation computers. The 133MHz 620 is based on a four-level-metal 0.5µm CMOS process and has about 7 million transistors.

• PowerPC G3 Series—The new G3 Series are the initial products in a line of next-generation PowerPCs. Basedon enhanced 603, 604, and 620 processor cores, the G3 processors are expected to deliver about twice theperformance of the earlier PowerPC chips. Initially the G3 PowerPCs will be built using a 0.35µm CMOSprocess and will move, during 1997, to a 0.25µm process, giving the processors on-chip speed of 300MHz to400MHz. The G4 Series, expected to be in systems in 1999, will feature a completely new microarchitecturefor the PowerPC and will take the product line to the 0.18µm process level.

Motorola’s embedded processor products include: the 680x0 family, the ColdFire (MCF51xx and MCF52xx)processors, the Embedded PowerPC (MPC8xx and MPC6xx) processors, the FlexCore products, the 683xxfamily of integrated microprocessors, data communications controllers and peripherals, and physical interfaceproducts. Motorola is attempting to drive the ColdFire line into emerging applications areas such as DVD and CD-ROM players, cable modems, HDTV, and digital cameras.

Mixed-Signal ICs

The company’s mixed-signal ICs are targeted at applications including wireless and wireline communications,multimedia systems, automotive equipment, and control networks.


Motorola has several fab facility projects underway, including the construction of a new 200mm wafer fab (MOS 17)in Tianjin, China, where CMOS and BiCMOS ICs will be produced. Other projects include the construction of anew fab facility (MOS 19) near Richmond, Virginia, for the production of PowerPC chips; and an expansion of theNippon Motorola fab in Aizu, Japan. In addition, Motorola and Siemens are building a jointly owned DRAM plant inRichmond, Virginia. Construction of the joint venture, which goes by the name White Oak Semiconductor, beganin 1996, with initial production of 64M parts scheduled to start in 1998.

Motorola, Ltd. Motorola, Inc.Colvilles Road 3501 Ed Bluestein BoulevardKelvin Estate, East Kilbride Austin, Texas 78721Glasgow G75 0TG, Scotland Telephone: (512) 928-6000United Kingdom MOS 2Telephone: (44) (35) 52-39101 Cleanroom size: 30,000 square feetMOS 1 Capacity (wafers/week): 10,000Cleanroom size: 30,000 square feet Wafer size: 100mmCapacity (wafers/week): 11,000 Process: CMOSWafer size: 150mm Products: Logic ICs, ASICsProcesses: CMOS, HMOS Feature sizes: 1.2µm-2.0µmProducts: MCUs, linear and logic ICsFeature sizes: 0.8µm, 1.2µm

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Motorola, Inc. Motorola, Inc.3501 Ed Bluestein Boulevard 5005 East McDowell RoadAustin, Texas 78721 Phoenix, Arizona 85008Telephone: (512) 928-6000 Telephone: (602) 244-6900MOS 3 MOS 4Cleanroom size: 20,000 square feet Capacity (wafers/week): 3,000Capacity (wafers/week): 12,000 Wafer size: 150mmWafer size: 100mm Process: MOSProcesses: CMOS, MOS Products: Power MOS discretesProducts: MCUs Feature sizes: 0.5µm-5.0µmFeature size: 1.2µm

Motorola, Inc. Motorola, Inc.2200 West Broadway Road 2200 West Broadway RoadMesa, Arizona 85202 Mesa, Arizona 85202Telephone: (602) 962-2011 Telephone: (602) 962-2011MOS 5 MOS 6Cleanroom size: 48,000 square feet Cleanroom size: 150,000 square feetCapacity (wafers/week): 6,000 Capacity (wafers/week): 3,500Wafer size: 125mm Wafer size: 150mmProcesses: CMOS, MOS, bipolar Processes: CMOS, BiCMOS,Products: MCUs, logic, linear, and digital ICs Products: SRAMs, ASICsFeature size: 1.0µm Feature sizes: 0.8µm-1.2µm

Nippon Motorola, Ltd. Motorola, Inc.Aizu Facility 3501 Ed Bluestein Boulevard1 Oyagi, Kofune Austin, Texas 78721Shiokawa-machi, Yama-gun Telephone: (512) 928-6000Fukushima-ken 969-35, Japan MOS 8Telephone: (81) (241) 27-2231 Cleanroom size: 100,000 square feetMOS 7 Capacity (wafers/week): 7,000Cleanroom size: 30,000 square feet Wafer size: 125mmCapacity (wafers/week): 10,000 Process: CMOSWafer size: 150mm Products: MCUs, MPUs, SRAMs, DSPsProcess: CMOS Feature sizes: 0.7µm-1.5µmProducts: MCUs, logic and smart power ICsFeature sizes: 1.0µm, 1.2µm(This fab is being upgraded to produce logic ICswith 0.5µm to 0.65µm feature sizes on 200mmwafers. Operations are planned to start in 1999.)



Motorola, Ltd. Motorola, Inc.Colvilles Road 8105 Irvine Center DriveKelvin Estate, East Kilbride Irvine, California 92718Glasgow G75 0TG, Scotland, UK Telephone: (714) 932-5000Telephone: (44) (35) 52-39101 MOS 10MOS 9 Capacity (wafers/week): 1,500Cleanroom size: 30,000 square feet Wafer size: 150mmCapacity (wafers/week): 7,500 Process: CMOSWafer size: 150mm Products: DSPs, linear ICsProcesses: CMOS, BiCMOS Feature size: 0.65µmProducts: MPUs, MCUs, DSPs, SRAMs (Acquired from Western Digital)Feature sizes: 0.5µm, 0.65µm, 0.8µm, 1.0µm

Motorola, Inc. Motorola, Inc.6501 William Canon Drive West 1300 North Alma School RoadAustin, Texas 78735-8598 Chandler, Arizona 85224Telephone: (512) 891-2000 Telephone: (602) 814-4691MOS 11 MOS 12Cleanroom size: 70,000 square feet Cleanroom size: 40,000 square feet (Class 1)Capacity (wafers/week): 4,000 Capacity (wafers/week): 4,000Wafer size: 200mm Wafer size: 200mmProcesses: CMOS, BiCMOS Process: CMOSProducts: MCUs, MPUs, SRAMs, DSPs Products: MCUs, DSPs, linear ICsFeature sizes: 0.5µm-0.8µm Feature sizes: 0.5µm-0.65µm

Motorola, Inc. Motorola, Inc.3501 Ed Bluestein Boulevard 3026 Cornwallis RoadAustin, Texas 78721 Research Triangle Park, North Carolina 27709Telephone: (512) 928-6000 Telephone: (919) 549-3100MOS 13 MOS 15Cleanroom size: 45,000 square feet Cleanroom size: 29,800 square feet (Class 10)Capacity (wafers/week): 5,000 Capacity (wafers/week): 5,000Wafer size: 200mm Wafer size: 150mmProcess: CMOS Process: CMOSProducts: MPUs, SRAMs Products: MCUs, logic ICsFeature sizes: 0.35µm-0.5µm (0.25µm capable) Feature sizes: 0.8µm, 1.0µm

(Acquired from Harris Semiconductor)

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Motorola, Ltd. MotorolaHeadrig Road XiQing, Tianjin, ChinaSouth Queensferry MOS 17West Lothian EH 30 9SH, Scotland Capacity (wafers/week): 3,500MOS 16 Wafer size: 200mmCapacity (wafers/week): 5,000 Processes: CMOS, BiCMOSWafer size: 150mm Products: MCUsProcesses: BiCMOS, CMOS Feature sizes: 0.5µm-1.0µmProducts: MPUs, logic ICs (Scheduled to begin production in 1998)Feature sizes: 0.5µm-0.75µm (Acquired from Digital Equipment Corporation)

Motorola, Inc. Motorola, Inc.West Creek, Virginia DevelopmentMOS 19 5005 East McDowell RoadWafer size: 200mm Phoenix, Arizona 85008Process: CMOS Center for Integrated Systems (formerly COM 1)Products: MPUs Wafer size: 150mmFeature sizes: 0.35µm, 0.25µm Process: CMOS(Currently on hold. Construction may start in Products: Communications ICs, MCUs, DSPslate 1997 or early 1998.) Feature size: 0.65µm

Motorola, Inc. Motorola, Inc.2200 West Broadway Road 2200 West Broadway RoadMesa, Arizona 85202 Mesa, Arizona 85202Telephone: (602) 962-2011 Telephone: (602) 962-2011BP 1 BP 2Cleanroom size: 20,000 square feet Cleanroom size: 80,000 square feetCapacity (wafers/week): 10,000 Capacity (wafers/week): 10,000Wafer size: 100mm Wafer size: 100mmProcesses: Bipolar, BiCMOS Processes: Bipolar, BiCMOSProducts: Linear and smart power ICs Products: Linear ICs, ASICsFeature size: 3.0µm Feature sizes: 1.0µm-2.0µm

Motorola, Inc. Motorola Semiconducteurs2200 West Broadway Road 126 Avenue du General EisenhowerMesa, Arizona 85202 Le Mirail BP 1029Telephone: (602) 962-2011 31023 Toulouse Cedex, FranceBP 3 Telephone: (33) (5) 61-41-11-88Cleanroom size: 20,000 square feet BP 4/Bipolar Power FabCapacity (wafers/week): 5,000 Cleanroom size: 40,000 square feetWafer size: 100mm Capacity (wafers/week): 7,500Processes: Bipolar, BiCMOS` Wafer size: 100mm (moving to 150mm in 1995)Products: ASICs, logic and linear ICs Processes: Bipolar, MOSFeature size: 1.0µm Products: Linear, smart power, RF ICs, discretes/opto




Motorola, Inc. Tohoku Semiconductor Corporation5005 East McDowell Road Izumi-ku, Sendai-shi,Phoenix, Arizona 85008 Miyagi Prefecture, JapanTelephone: (602) 244-6900 Capacity (wafers/week): 13,750RF Power and Rectifier Fabs Wafer sizes: 150mm, 200mmCleanroom size: 80,000 square feet Process: CMOSCapacity (wafers/week): 18,000 Products: DRAMs, SRAMs, MPUs, MCUs, MPRsWafer sizes: 100mm, 125mm Feature sizes: 0.5µm-0.8µmProcesses: Bipolar, GaAs (Joint venture with Toshiba.)Products: Discretes, RF MMICs, optoelectronicsFeature sizes: 1.5µm-10.0µm

White Oak SemiconductorWhite Oak Technology ParkRichmond, VirginiaCapacity (wafers/week): 5,000Wafer size: 200mmProcess: CMOSProducts: DRAMsFeature sizes: 0.25µm, 0.35µm(Joint venture with Siemens. Currently underconstruction. Operations are planned to beginin the spring of 1998.)

Key Agreements

• Motorola licensed the SRAM-based FPGA technology of Pilkington Microelectronics Ltd. (PMeL) of the UnitedKingdom in 1992. Motorola's first FPGAs were announced in 1995. In late 1995, Motorola also licensedPilkington’s field programmable analog array (FPAA) technology. In March 1997, Motorola acquired the PMeLbusiness from Pilkington plc., a world leader in glass products. PMeL was absorbed into Motorola’sProgrammable Logic division and was renamed the Motorola Programmable Technology Center (MPTC).


• Motorola, Toshiba, and Fairchild Semiconductor announced in early 1997 they would jointly develop next-generation high-speed CMOS logic ICs. The three companies will work to develop 2.5V and 3.3V devices witha propagation delay time of 2ns.

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• Motorola and Mitsubishi announced a couple of joint cooperation agreements in 1996. In October, Motorolaagreed to exchange its 32-bit ColdFire RISC and 68EC000 embedded MPU technologies for Mitsubishi’sM32R microprocessor with embedded DRAM technology. In December, the two companies agreed to jointlymarket MobileFlash™ memory devices based on the DINOR flash technology developed by Mitsubishi.Motorola and Mitsubishi have said that their alliance in flash memories may be expanded in the future to includea joint venture fab dedicated to the manufacture of flash chips.

• In mid-1996, Motorola signed a nonexclusive agreement with Hewlett-Packard’s IC Business Division to licenseMotorola’s 68000, 68020, and 68030 microcontrollers, as well as the ColdFire RISC microprocessor cores.

• In early 1996, Motorola and IC Works entered into an agreement under which IC Works became an authorizedsecond source of selected Motorola CMOS and BiCMOS mixed-signal timing circuits. Moreover, the twocompanies will work together to broaden their existing lines with complementary timing-circuit devices.

• International Rectifier signed a cross-licensing and alternate-source agreement with Motorola in early 1995covering power ICs and power discretes.

• Motorola and IBM are jointly developing, producing, and marketing the PowerPC family of RISCmicroprocessors (Apple Computer also plays a part in the design of the MPUs).

• Motorola and Cherry Semiconductor have an agreement to develop mixed-signal ASICs for the automotivemarket.

• Motorola has an RFID product agreement with Matsushita and ferroelectric memory pioneer Symetrix Corp.Motorola's subsidiary Indala Corp. agreed to jointly produce a family of read/write RFID chips with Matsushitaincorporating Symetrix's ferroelectric memory technology (Matsushita has an equity stake in Symetrix and hasthe right to relicense its technology).

• Motorola is working with IBM, Lockheed Martin Federal Systems, and Lucent Technologies to establish amanufacturing infrastructure for X-ray lithography. The team hopes to have a manufacturing capability by theend of 1997.


North American Company Profiles National Semiconductor

NATIONAL SEMICONDUCTOR

National Semiconductor Corporation2900 Semiconductor Drive

P.O. Box 58090Santa Clara, California 95052-8090

Telephone: (408) 721-5000Fax: (408) 739-9803

Web Site: www.national.com

IC Manufacturer


Japan: National Semiconductor Ltd. • Tokyo, JapanTelephone: (81) (43) 299-2308 • Fax: (81) (43) 299-2408

Europe: National Semiconductor GmbH • Fürstenfeldbruck, GermanyTelephone: (49) (180) 532-7832 • Fax: (49) (180) 530-8586

Asia-Pacific: National Semiconductor HK Ltd. • Kowloon, Hong KongTelephone: (852) 2737-1600 • Fax: (852) 2736-9960

Financial History ($M), Fiscal Year Ends May 31

1992 1993 1994 1995 1996

Sales 1,718 2,014 2,295 2,374 2,623Net Income (120) 130 264 264 185R&D Expenditures 208 229 256 283 361Capital Expenditures 189 235 271 479 628

Employees 27,200 23,400 22,300 22,400 20,300


National Semiconductor was established in Danbury, Connecticut, as a manufacturer of transistors in 1959. In1967, the company moved to Santa Clara, California, where it began producing proprietary ICs.

National has since remained a leading supplier of analog and mixed-signal semiconductor products. The companyfocuses on four strategic markets: communications, personal systems, industrial, and consumer. Systemapplications within these four markets include computers and computer peripherals, cellular phones, faxmachines, local and wide area networks, telecommunications equipment, automotive electronics, industrialcontrols, and military and aerospace products. National is also a leader in power management solutions.

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National Semiconductor North American Company Profiles

At the beginning of fiscal 1997, National reorganized into four operating divisions: the Analog Division, theCommunications and Consumer Division, the Personal Systems Division, and the Fairchild SemiconductorDivision. In March 1997, as part of its effort to focus on systems solutions, National divested itself of its FairchildSemiconductor business, which consisted of National’s family logic, non-volatile memory, and discretesemiconductor product lines. The high-volume, manufacturing intensive business model of Fairchild differssignificantly from National’s business of providing highly integrated system chip solutions for specific applications.For fiscal 1996, the Fairchild product lines represented approximately $600 million of the consolidated revenuesof the two companies.

Non-Volatile Memory6%


Analog andMixed-Signal

60%Digital and Other

13%

Bipolar Logic7%

CMOS Logic7%

Discretes7%

Americas42%

Southeast Asia24%


Europe24%

Japan10%

Management

Brian Halla President and Chief Executive OfficerKamal Aggarwal Executive Vice President, Central Technology and ManufacturingPatrick J. Brockett Executive Vice President, International Sales and MarketingDonald Macleod Executive Vice President, Finance, and Chief Financial OfficerMichael Bereziuk Senior Vice President and GM, Personal Systems DivisionJohn M. Clark III Senior Vice President, General Counsel, and SecretaryDouglas M. McBurnie Senior Vice President and GM, Communications and Consumer DivisionGobi Padmanabhan Senior Vice President, Process TechnologyEdgar R. Parker Senior Vice President, Quality and ReliabilityRobert M. Penn Senior Vice President and GM, Analog DivisionRichard L. Sanquini Senior Vice President, Strategic Business and TechnologyRoland Anderson Vice President, European DivisionMichael D. Burger Vice President and GM, Southeast Asia DivisionGordon C. Chilton Vice President, Asia Pacific OperationsDavid S. Dahmen Vice President and TreasurerRich Freeman Vice President, Worldwide Wafer Fab OperationsTatsuo Ishihara Vice President, Japan DivisionKeith M. Kolerus Vice President, Americas DivisionMark Levi Vice President, Corporate Marketing and CommunicationsRobert B. Mahoney Vice President and ControllerPrem Nath Vice President and President, Mediamatics Inc.Richard A. Wilson Vice President, Human Resources




MOS MEMORY ANALOG

DRAM ✔ Amplifier

SRAM ✔ Interface





Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)


General Purpose Logic Bipolar Memory

✔ Gate Array General Purpose Logic

✔ Standard Cell Gate Array/Standard Cell

Field Programmable Logic Field Programmable Logic

Other Special Purpose Logic Other Special Purpose Logic

MPU/MCU/MPR

MOS MICROCOMPONENT

✔ MPU OTHER

✔ MCU ✔ Full Custom IC

✔ MPR Discrete

DSP Optoelectronic

Analog Products

Analog products and technology has been one of National’s core competencies since its inception. The companycontinues to be a leader in the analog IC industry. Its analog products include operational amplifiers and buffers,power management circuits, data acquisition circuits, voltage regulators and references, motor control ICs, audioICs, custom linear ASICs (CLASICs), and other general and special purpose linear devices.

Comlinear Corporation, acquired by National in 1995, operates as a separate business unit within the AnalogDivision. Fort Collins, Colorado-based Comlinear is a supplier of high-frequency amplifiers, current-feedbackdevices, analog-to-digital converters, and other analog signal processing circuits.

Communications Products

National is one of the world’s leading suppliers of LAN Ethernet and Fast Ethernet controller chipsets. Thecompany also offers FDDI circuits.

For telecommunications applications, National offers ATM, ISDN, and Sonet/SDH families of networking devices,as well as single-chip Digital European Cordless Telephone (DECT) radio transceivers. In 1996, National’sComlinear business unit released a new family of serial digital video chipsets for transmitting high-speed videosignals through cable networks.

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For wireless communications applications, National offers its line of PLLatinum™ RF chips. In 1996, Nationalintroduced its Fast IR product family of wireless data communications chips using fast infrared technology.

Personal Systems Products

National’s personal systems products consist of peripheral function devices that work in tandem with the hostmicroprocessor in desktop and notebook computer systems. These products include its family of Super I/O™products that consolidate many dependent functions on the motherboard, high-performance disk drive ICs, businterface circuits (including USB types), data transmission chips, display drivers, clocks and clock support circuits,DRAM management ICs, and UARTs. National added low-power system logic ICs to its product portfolio in 1996when it acquired PicoPower Technology from Cirrus Logic.

Consumer Products

National’s IC products for consumer applications include audio control circuits, audio noise reduction devices, andaudio amplifiers. The company’s Boomer™ series of single-chip CMOS audio amplifiers is used in wirelesstelephones and multimedia computers, as well as CD players, video players, and VCRs.

In March 1997, National acquired Mediamatics Inc., an MPEG audio/video decoder firm, for approximately $100million. Mediamatics is operating as a wholly owned subsidiary based in Fremont, California. The two companiesare working to incorporate National’s tuner, demodulator, A/D and D/A conversion, and other technologies withMediamatics’ software and hardware MPEG audio/video and Dolby AC-3 audio products to create new products, orcores, for the consumer electronics market.

Also in early 1997, National sold to ISD its CompactSpeech line of RISC-based speech processors for voiceapplications in products such as answering machines and cordless phones.

Embedded Technologies Products

This product line includes 4-bit, 8-bit (COP8 Family), and 16-bit microcontrollers and 16-bit and 32-bitmicroprocessors (including its NS486 embedded processor). National is also a licensee of the Advanced RISCMachines ARM 32-bit processor core.

Military and Aerospace Products

National is the second largest supplier of military/aerospace-related semiconductors. It is driving advances inavionics, telecommunications, cryptography, navigation systems, and displays.

National Semiconductor's primary process technology, M2CMOS, is built around a core double-level-metal CMOSprocess. To this core, modules are added to provide a third level of metallization for analog, EEPROM, andBiCMOS applications. Optimized for analog and mixed-signal applications, the M2CMOS process is used by themajority of the communications and computing group product lines. A wide range of design rules (down to0.55µm) are supported by the M2CMOS process. Plans are to further shrink the process to 0.35µm by the end of1997.



In addition to its family of M2CMOS processes, National also utilizes a high-performance core VLSI bipolar processnamed ASPECT, which stands for Advanced Poly Emitter-Coupled Technology. ASPECT and its BiCMOSmodule, ABiC, are used for high-performance gate arrays, customer-owned designs, and wirelesscommunications. ASPECT has been scaled from 2.0µm to 0.8µm and will be replaced with BiCMOS at 0.5µm andbeyond. The current versions of ASPECT and ABiC offer up to four-layers of metallization in addition to a levelzero local interconnect.

A variety of analog processes are used to produce a broad line of linear products. Notable process technologiesare VIP, a high speed complementary bipolar process for operational amplifiers, LB, a medium voltage automotivemarket oriented process, LMDMOS, a high power mixed-signal process, and LFAST and LCMOS, which are usedfor CLASICs.


National is installing a 200mm wafer line at its fab in Maine for the fabrication of ICs with 0.35µm geometries. Thenew $830 million facility will include 40,000 square feet of Class 1 cleanroom and is scheduled to be ready forproduction in 4Q97.

National Semiconductor Corp. National Semiconductor Corp.2900 Semiconductor Drive 2900 Semiconductor DriveSanta Clara, California 95012 Santa Clara, California 95012Telephone: (408) 721-5000 Telephone: (408) 721-5000Cleanroom size: 20,000 square feet Cleanroom size: 20,000 square feetWafer size: 150mm Wafer size: 200mm Process: CMOS Processes: CMOS, BiCMOSProducts: Linear ICs, ASICs, R&D Products: R&DFeature sizes: 0.55µm-0.8µm Feature sizes: 0.35µm, 0.5µm

National Semiconductor Corp. National Semiconductor Corp.1111 West Bardin Road 1111 West Bardin RoadArlington, Texas 76017 Arlington, Texas 76017Telephone: (817) 468-6400 Telephone: (817) 468-6400Fab 1 Fab 2Cleanroom size: 33,000 square feet Cleanroom size: 72,000 square feetCapacity (wafers/week): 4,500 Capacity (wafers/week): 9,850Wafer size: 150mm Wafer size: 150mmProcess: CMOS Processes: CMOS, BiCMOSProducts: Logic ICs, EEPROMs, EPROMs, Products: Logic, linear, and mixed-signal ICs, ASICs microcomponents, ASICs Feature sizes: 0.35µm-0.65µmFeature size: 1.0µm

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National Semiconductor Corp. National Semiconductor (UK) Ltd.333 Western Avenue Earnhill Road, Larkfield Industrial EstateSouth Portland, Maine 04106 Greenock PA16 OEQ, Scotland, UKTelephone: (207) 775-8100 Telephone: (44) (1475) 633733Cleanroom size: 40,000 square feet Fab 1Wafer size: 200mm Cleanroom size: 40,300 square feetProcesses: CMOS, BiCMOS Capacity (wafers/week): 10,000Products: Linear and mixed-signal ICs Wafer size: 100mmFeature size: 0.35µm Process: Bipolar(Operations to begin in 4Q97) Products: Logic and linear ICs


National Semiconductor (UK) Ltd. National Semiconductor (UK) Ltd.Earnhill Road, Larkfield Industrial Estate Earnhill Road, Larkfield Industrial EstateGreenock PA16 OEQ, Scotland, UK Greenock PA16 OEQ, Scotland, UKTelephone: (44) (1475) 633733 Telephone: (44) (1475) 633733Fab 2 Fab 3Cleanroom size: 18,400 square feet Cleanroom size: 30,100 square feetCapacity (wafers/week): 2,500 Capacity (wafers/week): 7,500Wafer size: 150mm Wafer size: 150mmProcesses: Bipolar, CMOS Processes: CMOS, BiCMOSProducts: Linear ICs Products: Linear and logic ICs, MCUs, ASICsFeature sizes: 1.2µm-2.0µm Feature sizes: 0.8µm-1.2µm

Some of National’s IC products continue to be produced at the fabs now owned by Fairchild Semiconductor andvice versa.

National’s semiconductor assembly and test plants are located in Toa Payoh, Singapore, and Malacca, Malaysia.

Key Agreements

• National and Fairchild remain closely linked through a long-term agreement to make the transition as smooth aspossible. The two companies also share and swap fab capacity.

• In early 1996, National joined up with the Belgian research firm IMEC to develop process technology for the0.25µm and 0.18µm generations.

• National signed a three-year agreement in mid-1995 with Tower Semiconductor Ltd. under which Tower was toincrease its wafer production commitment to National. Tower’s fab in Israel was originally owned by National,which retains a 3.5 percent interest in the foundry.

• In November 1994, National formed a long-term alliance with Synaptics Inc. to jointly develop computer controlsbased on human senses (sight, touch, and sound).



• National formed an alliance with 8x8 Inc. (formerly Integrated Information Technology) in 1993. The partners aredeveloping embedded processor, video, and data compression technologies.

• National entered a resale and joint-development agreement with NEC for Ethernet ICs in 1993.

• National entered a cooperative relationship with Matsushita, including joint development and manufacturing(1992).

• National signed a 10-year semiconductor patent cross-licensing agreement with Hitachi in 1991.

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Oak Technology North American Company Profiles

OAK TECHNOLOGY

Oak Technology Inc.139 Kifer Court


Fax: (408) 737-3838

Fabless IC Supplier


Japan: Oak Technology, K.K. • Musashino-shi, Tokyo, JapanTelephone: (81) (422) 56-3761

Asia-Pacific: Oak Technology, Taiwan • Taipei, TaiwanTelephone: (886) (2) 784-9123


1992 1993 1994 1995 1996

Sales 43 30 46 111 248Net Income (3) (5) 4 21 37R&D Expenditures 5 6 15 31

Employees 225 370


Oak Technology Inc. designs, develops, and markets high-performance integrated semiconductors and relatedsoftware solutions for OEMs worldwide who serve the multimedia PC, digital video consumer electronics, anddigital office equipment markets. The company targets these markets through five core technologies: opticalstorage, video/graphics (2D and 3D), MPEG imaging, audio/communications, and digital imaging.

Founded in 1987, Oak’s initial product offerings were PC graphics chips. In 1988, the company expanded intoSuper VGA graphics controllers and grew to become a unit volume leader in the SVGA market segment between1989 and 1991. Furthermore, Oak developed the first commercially available CD-ROM controller in 1990 andpioneered the development of an IDE/ATAPI (integrated drive electronics/AT attachment packet interface) CD-ROM controller in 1993. With the IDE/ATAPI established as an interface standard for CD-ROM drives, Oak is oneof the largest merchant suppliers of CD-ROM controllers.


North American Company Profiles Oak Technology

In October 1995, Oak Technology acquired Pixel Magic, a leader in image processing technology. Pixel Magic’sstrengths in compression and image enhancement technology are expected to play a key role in the newgeneration of digital office equipment.


CD-ROM Controllers91%

Other 9%

Oak plans to continue designing and developing new CD-ROM controllers, while moving aggressively into newmarkets to diversify its business. Oak plans to continue development of optical storage technology to address theCD-R (Recordable), CD-RW (ReWritable), and DVD-ROM markets. Oak’s other product developments includeMPEG video decoders, such as the company’s MPEG-2/Dolby Digital decoder for DVD players.

Virtually all of Oak’s revenues in 1996 were from international sales, principally in Japan, Singapore, and Taiwan.

Management

David D. Tsang Chairman, President, and Chief Executive OfficerSidney Faulkner Vice President, Finance, and Chief Financial OfficerKenji Fujimoto Vice President, Oak Technology; General Manager, Oak Technology, K.K.Aydin Koc Vice President, Optical Storage Business UnitAbel Lo Vice President, Oak Technology; General Manager, Oak Technology, TaiwanBen T. Taniguchi Vice President, SalesMou Hsin Yang , Ph.D. Vice President, Operations


Oak’s products include CD-ROM controllers, MPEG video decoders, video compression/expansion processors(VCEPs), 64-bit multimedia video/graphics accelerators, and 16-bit digital audio controllers.

Recent product announcements include the OTI-975 CD-R/CD-RW controller for CD-R/CD-RW drives, the OTI-64217 Eon™ 64-bit DirectX accelerator for video/graphics applications, and an audio/communications acceleratorcalled the OTI-611 TelAudio 3D™.

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Oak Technology North American Company Profiles


Oak Technology is a fabless IC supplier. The company's devices are produced by wafer foundry companies.

In 1995, Oak Technology entered into several long-term agreements with TSMC and Chartered Semiconductor,securing additional wafer capacity through 2001. Also in 1995, the company entered into agreement with UMC toform, along with other investors, a separate Taiwanese company called United Integrated Circuits Corporation(UICC), for the manufacture of ICs. Oak agreed to invest approximately $60 million for a 10 percent equity positionin UICC. UICC began manufacturing 200mm wafers in mid-1997.


North American Company Profiles OPTi

OPTI

OPTi Inc.888 Tasman Drive


Fax: (408) 486-8001Web Site: www.opti.com

Fabless IC Supplier


Japan: OPTi Japan K.K. • Tokyo, JapanTelephone: (81) (3) 5454-0178 • Fax: (81) (3) 5454-0168

Europe: OPTi Inc. • Oxon, United KingdomTelephone: (44) (1869) 369161

Asia-Pacific: OPTi Inc. • Taipei, TaiwanTelephone: (886) (2) 325-8520 • Fax: (886) (2) 325-6520


1992 1993 1994 1995 1996

Sales 98 85 134 164 119Net Income 9 9 15 11 (14)R&D Expenditures 6 7 9 11 14



OPTi Inc. was spun out from Chips and Technologies in 1989 to focus on developing and supplying core logicchipsets to the personal computer industry. The company’s products are divided into three core areas within thePC industry: notebook products, desktop products, and multimedia products. In addition to its core logicchipsets, OPTi supplies peripheral and multimedia chipsets as well as custom ICs for audio/telephone, powermanagement, graphics/video, and storage control applications. The company’s chipsets provide in one or a fewsemiconductor devices the core logic functions of a PC as well as the multimedia-related functions.

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OPTi North American Company Profiles

OPTi’s core logic chipset sales shifted in 1996. In 1995, its core logic chipset sales were largely made up ofdesktop logic chipsets. However, due to Intel’s aggressive moves to gain marketshare in the desktop core logicmarket, OPTi shifted to notebook logic chipsets, which represented 59 percent of core logic chipset revenues in1996, up from 14 percent in 1995.

Core Logic Chipsets71%


Audio/Graphics Chips

29%

North America14%


Far East80%

Europe/Other6%

Management

Jerry Chang Chairman and Chief Executive OfficerStephen Dukker PresidentDavid Zacarias Chief Financial OfficerPatrick Ang Vice President, Multimedia ProductsJun-Wei Chen Vice President, Foundry and Technology ServicesRichard D’Sa Vice President, North America and Europe SalesGeorge Fang Vice President, Asia-Pacific SalesSteve Wu Vice President, Mobile Products


OPTI’s product offering includes multimedia and peripheral chipsets, core logic chipsets, and audio controllers, aswell as custom ICs.

The initial member of its Viper family of Pentium-class chipsets was unveiled in 1994. The second member of thefamily, the Viper-N, is designed for Pentium PCI-based portable computers, and the third member, the Viper-M, isa multimedia-enhanced chipset for Pentium PCI-based desktop computers. In addition to the Pentium, the Viperproducts will support compatible AMD and Cyrix microprocessors.

In the first part of 1997, OPTi introduced two 64-bit single-chip core logic devices, the Vendetta for Pentiumdesktop computers and the Firestar for Pentium notebook computers. The Vendetta is the first core logic productto incorporate SoundBlaster audio functionality for higher integration and lower cost solutions, and featuresauxiliary 66MHz PCI for support of Intel’s new accelerated graphics port architecture. Vendetta features an array ofcontrol and monitoring options and can be scaled to work in entry level to high-end workstations and servers.Firestar combines high performance features with space saving design capabilities and power management formobile and embedded applications.


North American Company Profiles OPTi

In addition to Vendetta and Firestar, OPTi introduced the Discovery chipset for Pentium Pro-based desktopsystems. The chipset is a 64-bit core logic product that features an integrated PCI and unified memoryarchitecture.

In 1993, OPTi began to broaden its product line to include peripheral chips. In the fourth quarter of that year, thecompany acquired MediaChips Inc., a designer of audio chips. Through the MediaChips acquisition, OPTi begansupplying 16-bit audio controller ICs featuring an on-chip sigma-delta audio codec/mixer. That move was followedby an entrance into the graphics chip market with an LCD controller for notebook computers in early 1994. Itsother peripheral ICs include IDE disk drive controllers and bus-interface bridge chips.

The process technologies used by OPTi in the design and manufacture of its semiconductors include 0.6µm and0.8µm CMOS.


Fabless OPTi has three principal foundry partners, IBM Microelectronics, Ricoh, and UMC. The company alsouses, to a certain extent, Chartered Semiconductor, TSMC, Samsung, Winbond, and Toshiba for the fabrication ofits wafers.

In 1995, OPTi signed a manufacturing and foundry venture agreement with United Microelectronics Corporation(UMC). Under the agreement, OPTi agreed to make a $30 million equity investment in UMC’s joint venture ICfoundry, called United Integrated Circuits Corporation (UICC), located in Taiwan. The fab began producing 200mmwafers in mid-1997.

Key Agreements

• In July 1996, OPTi licensed its super VGA LCD controller to NEC Electronics who planned to integrate thedevice into embedded applications such as handheld terminals and PDAs.

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Orbit Semiconductor North American Company Profiles

ORBIT SEMICONDUCTOR

Orbit Semiconductor, Inc.116 Java Drive


Fax: (408) 747-1263Web Site: www.orbitsemi.com

IC Manufacturer


Europe: Orbit Europe • Surrey, EnglandTelephone: (44) (1932) 346288 • Fax: (44) (1932) 347110

Asia-Pacific: DII Group • SingaporeTelephone: (65) 298-0866 • Fax: (65) 298-3689


1992 1993 1994 1995 1996

Corporate (DII Group)Sales 258 397 459Net Income 9 23 10


Employees (Orbit) 120 154 184 278 400


Orbit Semiconductor specializes in semiconductor design, manufacturing, and engineering support services thatallow system designers to manage application-specific integrated circuit (ASIC) development, production,scheduling, and inventory control. In August 1996, Orbit Semiconductor was acquired by DII Group, Inc., whoserves as a global network of companies that provide design, manufacturing, product development, and supportservices to the electronics industry. Orbit operates as a wholly-owned subsidiary of DII Group.

Orbit's customers include companies that design various electronic systems and products for application in themedical, communications, consumer, aerospace and military, computers and peripherals, and other industries.


North American Company Profiles Orbit Semiconductor

MPRs13%

1996 Corporate Sales byEnd-Use Market

Medical24%

PCs2%

Communications16%

ConsumerProducts

6%Military

10%

Other15%

Industrial14%


North America78%

Europe14%

Asia-Pacific8%

In October 1992, Orbit introduced its Encore! program that converts FPGAs and other IC designs into Orbit digitalgate arrays for more cost-effective solutions or accelerated delivery. Orbit also offers a mixed-signal (analog/digital)design service that provides rapid development of custom mixed-signal ASICs. A shared wafer-processingprogram, Foresight, is provided for cost-effective prototyping of mixed-signal ASICs. In addition, Orbit offerscontract manufacturing programs including hi-rel manufacturing, a low-cost prototyping service, and chargecoupled device (CCD) fabrication.

Management

DII GroupRonald R. Budacz Chairman and Chief Executive OfficerCarl R. Vertuca, Jr. Senior Vice President and Chief Financial OfficerC.Y. Cheong Vice President and Managing Director, Asia-Pacific

Orbit SemiconductorGary P. Kennedy President and Chief Executive Officer, Orbit SemiconductorSteve Kam Executive Vice President, Technology and Chief Technology OfficerRichard B. Kash Executive Vice President, Mixed-Signal DesignJoseph K. Wai Executive Vice President, Chief Operating Officer, and SecretaryEdward Rodriguez Group Vice President, Sales, Marketing, Engineering, and Customer ServiceFernando A. Bettencourt Vice President, OperationsBrian Gillings Vice President, MarketingGeorge W. Lewicki Vice President, Software EngineeringBetty Y. Newkirk Vice President, Foundry Business Unit and Customer Service


Orbit's manufacturing services include several IC fabrication programs. The most popular program, Encore!, is aservice that converts netlists for gate arrays or FPGAs into Orbit gate arrays with 270 to 37,000 usable gates. Theresulting circuits are functionally equivalent, but lower in price. Another program, Foresight, supports multi-project, multi-technology runs and reduces NRE charges. Subscribers of Foresight's processes see lower costsbecause they share space on masks and wafers.

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Orbit Semiconductor North American Company Profiles

Both Encore! and Foresight users have access to all of Orbit's processes. They include: 1.0µm and 1.2µm N-welland P-well CMOS processes with various options such as a second poly layer for capacitors and gates, NPNbipolar transistors with high or low collector resistances, classical EEPROM, imaging buried channel CCDs with anoxide nitride gate insulator to maintain low leakage on large arrays, and conventional N-channel and P-channeltransistors to allow on-chip digital logic.

Orbit offers additional programs based on its independent manufacturing capabilities. Its low-volumemanufacturing programs include a "High Reliability Manufacturing Program" in support of medical companies andmilitary contractors and a low-cost prototyping service, typically used by fabless semiconductor companies.


In late 1996, Orbit purchased Paradigm’s 0.6µm, 150mm wafer production facility for $20 million. Orbit plans tomove all existing property from its Sunnyvale facility to the San Jose fab by the end of 1997.

Orbit also maintains a relationship with Chartered Semiconductor to supplement its wafer production capabilities.

Orbit Semiconductor, Inc. Orbit Semiconductor, Inc.169 Java Drive 71 Vista MontanaSunnyvale, California 94089 San Jose, California 95134Cleanroom size: 12,500 square feet Cleanroom size: 18,000 square feetCapacity (wafers/week): 2,400 Capacity (wafer/week): 1,250Wafer size: 150mm Wafer size: 150mmProcesses: CMOS, CCD Process: CMOSProducts: ASICs, foundry services Products: ASICs, foundry servicesFeature sizes: 0.8µm, 1.0µm, 1.2µm, 2.0µm Feature sizes: 0.6µm, 0.8µm (0.5µm in future)(Will be closed by end of 1997) (Purchased from Paradigm in 1996)


North American Company Profiles Paradigm Technology

PARADIGM TECHNOLOGY

Paradigm Technology, Inc.694 Tasman Drive


Fax: (408) 954-8913Web Site: www.prdm.com

Fabless IC Supplier


1992 * 1993 * 1994 * 1995 1996

Sales 15 25 32 52 36Net Income (9) (18) (4) 5 (36)R&D Expenditures 1 2 1 5 6

Employees 140 190 205 244 85

*Data for fiscal years ended March 31. In 1994, the company changed its fiscal year ending date to the end ofDecember. For the period April 1 to December 31, 1994, Paradigm’s sales totaled $26 million and net income was$11 million.


Paradigm Technology designs and markets high-speed, high-density SRAMs and SRAM modules. Targetmarkets for its SRAM products include telecommunications, networks, workstations, high-performance PCs,advanced modems, and complex military/aerospace systems. The company focuses on the high-performance,10ns and faster, segment of the SRAM industry. In 1996, 10ns and faster SRAMs accounted for approximately 36percent of the company’s sales.

When established in 1987, Paradigm Technology initially focused on the development of high-speed 256K and1M SRAMs. In 1989, the company opened a wafer fabrication facility in San Jose, California. Costs associatedwith operating the fab and developing its technology, coupled with a less than optimal sales mix, drove thecompany to bankruptcy in 1994. The majority of Paradigm’s high-performance SRAM products were being soldinto lower margin commodity markets. As part of the restructuring in 1994, Paradigm’s new management teamadopted a strategy of focusing on emerging markets for higher performance asynchronous and synchronousSRAMs and specialty products. With the help of investments from Singapore-based AMCA Limited and NationalSemiconductor, the company emerged with record sales in the quarter ended September 1994. Unfortunately,the weakness in the SRAM market that began in late 1995 has had an adverse effect on Paradigm’s revenues.

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Paradigm Technology North American Company Profiles

In 2Q96, Paradigm made a move to expand its product line beyond SRAMs by acquiring startup NewLogicCorporation, a developer of logic designs with large memory arrays. However, in early 1997, the NewLogicoperation was closed down so that Paradigm could focus on its core SRAM products and markets. In November1996, Paradigm adopted a fabless supplier strategy by selling its fab to Orbit Semiconductor, thereby gaininggreater flexibility and lowering it fixed costs. Orbit purchased Paradigm’s fab, which was newly converted from125mm to 150mm wafers, for $20 million.

Approximately 25 percent of Paradigm’s sales in 1996 were attributable to sales outside the U.S., primarily in Asiaand Europe.

Management

Michael Gulett President and Chief Executive OfficerJames H. Boswell Vice President, Sales and MarketingDavid G. Campbell Vice President, Finance and Chief Financial OfficerDennis McDonald Vice President, Human ResourcesRichard Morley Vice President, OperationsPhilip Siu Vice President, Engineering


Paradigm Technology’s products include high-performance 256K, 1M, and 4M asynchronous SRAMs, 100MHzFIFO buffer-memory chips, high-speed processor-specific synchronous burst SRAMs, pipelined burst SRAMs,and high-speed cache RAM modules. Paradigm’s most recent product announcements include a 256K CMOSSRAM featuring an access time of 7ns.

The proprietary technology of Paradigm involves a 0.6µm dual-well CMOS process consisting of two polysiliconlayers and two metal layers, with three of the four layers fully configurable. The company has also developed a0.35µm process.


In November 1996, Paradigm sold its wafer manufacturing facility to Orbit Semiconductor and therefore, nowoperates as a fabless IC supplier. Paradigm has established foundry agreements with Orbit and Atmel in the U.S.,NKK Corporation in Japan, and UMC in Taiwan.

Key Agreements

• In November 1996, Paradigm sold its wafer fab facility to Orbit Semiconductor for $20 million. After thepurchasing agreement was complete, the two companies entered into an agreement that calls for Paradigm toreceive a supply of wafers from Orbit over a specified timeperiod.


North American Company Profiles Paradigm Technology

• Paradigm and Atmel signed a five-year manufacturing, product, and technology agreement in May 1995.Terms of the agreement include guaranteed wafer supply from Atmel to Paradigm for a five year period.Moreover, Paradigm transferred its 0.6µm SRAM process to Atmel, and the two companies are jointlydeveloping 0.5µm and 0.4µm technologies. Atmel also purchased a significant equity interest in Paradigm.

• Paradigm has an extensive relationship with Japan's NKK Corporation. NKK holds a 10 percent stake inParadigm as well as a technology and product license for 256K and 1M SRAMs and FIFOs. The two companiesworked together to codevelop the latest 4M technology. Paradigm also has access to NKK's state-of-the-art200mm wafer fabrication facility in Japan.

• Paradigm has a strategic alliance with National Semiconductor that provides National exclusive marketing andsales rights to Paradigm’s products for military and aerospace applications. National also made an equityinvestment in Paradigm.

1-266


Peregrine Semiconductor North American Company Profiles

PEREGRINE SEMICONDUCTOR

Peregrine Semiconductor Corporation6175 Nancy Ridge Drive

San Diego, California 92121Telephone: (619) 455-0660

Fax: (619) 455-0770Web Site: www.peregrine-semi.com

Fabless IC Supplier

Employees 25


Founded in 1990, Peregrine Semiconductor develops and markets high-performance commercial integratedcircuits based on its patented UTSi™ (ultra thin silicon) process. Initially, Peregrine focused on developing theUTSi process and today, through joint research and product development, uses this proprietary technology todevelop high-performance products targeted at specific applications such as wireless communications, portablecomputing, and high-speed memory.

Management

Ronald E. Reedy, Ph.D. Chairman, President, and Chief Executive OfficerJames S. Cable Vice President, Technology and OperationsBill Peavey Vice President and Chief Financial OfficerDavid R. Staab Vice President, Engineering and DesignMilt Mills Director ,SalesJon Siann Director, Marketing


Peregrine products include the Microcommunicator™ family of frequency synthesizers, which are capable ofoperating at frequencies as high as 2.5GHz. This family of communications products provides integrated solutionsto wireless system design problems in applications such as satellites, cellular and cordless telephones, and cableand direct broadcast satellite televisions. Other products produced by Peregrine include a Xilinx-compatibleFPGA, a 64K SRAM, and other various microwave devices. Peregrine’s UTSi FPGA chip was developed incooperation with Xilinx. Peregrine has a license to manufacture and market 3V UTSi versions of Xilinx’s XE3000family.


The company's devices are currently produced by Asahi Kasei Microsystems in Japan.


North American Company Profiles Peregrine Semiconductor

Key Agreements

• In January 1996, Peregrine signed a six-year fab agreement with Asahi Kasei Microsystems Co. (AKM) ofJapan. AKM will provide wafer fabrication to Peregrine in exchange for process technologies. The twocompanies are also negotiating a joint development agreement for future products.

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Pericom Semiconductor North American Company Profiles

PERICOM SEMICONDUCTOR

Pericom Semiconductor Corporation2380 Bering Drive


Fax: (408) 435-1100Web Site: www.pericom.com

Fabless IC Supplier


Europe: Pericom • Bridport, Corset, United KingdomTelephone: (44) (1308) 458986

Asia-Pacific: Pericom Technology (Shanghai) Co., Ltd. • Shanghai, ChinaTelephone: (86) (21) 6485-0576 • Fax: (86) (21) 6485-2181


1992 1993 1994 1995 1996

Sales 0.5 6 19 23 41

Employees 26 40 50 100 122


Pericom Semiconductor, founded in 1990, designs and markets ultra fast digital and mixed-signal CMOS andBiCMOS ICs that provide solutions to bottlenecks in high-performance computing and communications systems.The company's first products were high-performance cache SRAMs. However, its current product line includesCMOS 5V and 3V logic clock generators and drivers, networking ICs, and application-specific switching devices.Pericom's 3V, 5V, and 3V/5V products are applicable in computing, data communications, and networkingsystems.

Founded originally as Pioneer Semiconductor, the company changed its name to Pericom Semiconductor in1993 to avoid becoming confused with a number of other technology companies with "Pioneer" in their names.


North American Company Profiles Pericom Semiconductor

Management

Alex Hui President and Chief Executive OfficerPatrick Brennan Vice President, Finance, and Chief Financial OfficerJohn Chi-Hung Hui, Ph.D. Vice President, TechnologyHank O'Hara Vice President, SalesMichael Yen Vice President, Applications and Systems EngineeringVan Lewing Director, MarketingDan Wark Director, Operations


Employing proprietary 0.8µm and 0.6µm CMOS and BiCMOS technologies, Pericom provides advanced logic,clock, and mixed-signal products.

• High-speed FCT bus interface logic chips with propagation delays as low as 3.2ns• High-speed clock distribution series, including PLL implementation for high clock rates• Fast switching, low impedance bus switches and true analog switches• Wide architecture 16-bit FCT logic families• Low voltage 3.3V, high-performance 8- and 16-bit FCT, LPT, LCX, and ALVCH logic families• Frequency synthesizer ICs that provide several PLL generated output frequencies for PCs, modems, and laser

printers• Networking products for Token Ring, 100VG, and Fast Ethernet


Pericom has foundry relationships with Austria Mikro Systeme, Chartered Semiconductor, New Japan Radio, andTSMC.

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Power Integrations North American Company Profiles

POWER INTEGRATIONS

Power Integrations Inc.477 North Mathilda Avenue


Fax: (408) 523-9300

Fabless IC Supplier

Employees 90


Japan: Power Integrations, Inc. • Kohoku-ku, Yokohama-shi, JapanTelephone: (81) (45) 471-1021 • Fax: (81) (45) 471-3717

Europe: Power Integrations Europe Ltd. • Windsor, Bershire, United KingdomTelephone: (44) (1753) 622-208 • Fax: (44) (1753) 622-209


Power Integrations, founded in 1988, is a privately held company focused on the power conversion market. Thecompany designs, develops, and markets integrated circuits that combine low-voltage analog and digital controlcapability with high-voltage power output devices in monolithic form.

The company's technology is used to build innovative high-voltage products for the power supply, batterycharging, telecommunications, motor control, and lighting markets.

Management

Howard Earhart President and Chief Executive OfficerBalu Balakrishnan Vice President, Marketing and EngineeringVladimir Rumennik, Ph.D. Vice President, TechnologyDan Selleck Vice President, SalesRobert Staples Vice President, Finance and AdministrationClifford Walker Vice President, Corporate DevelopmentShyam Dujari Director, Marketing


North American Company Profiles Power Integrations


Power Integrations utilizes a standard CMOS process and adds one implant to generate high voltage MOSFETsintegrated into power supply and interface products. The process is capable of combining 1,200V N-channelMOSFETs, 700V P-channel MOSFETs, and 400V L-IGBTs with 5-15V CMOS and bipolar logic devices.

TOPSwitch®-II is the newest family of products for power conversion applications. In addition to integrationbenefits of the high voltage process technology, this family also has patented circuit and system designinnovations.

The company's power supply IC product line is targeted at the needs of portable and small form-factor productssuch as portable computers, camcorders, cellular telephones, PBX line cards, and feature phones. The high-voltage outputs of Power Integrations' power supply circuits provide universal input voltage (85-256 VAC)capability. The high-frequency switching capability and low system component count enables low-cost, smallform-factor power supply/chargers to be realized. The power supply ICs cover universal input voltage applicationsfrom 1 watts to 90 watts (1 watts to 50 watts from 100 VAC). A one-watt buck converter for non-isolated ISDNapplications is also available.

Its interface IC products are designed for use in energy-efficient, variable-speed electric motors for appliancessuch as room air conditioners. The high-voltage capability of these products provides cost-effective level shiftingcapability and control for those 110/220 VAC applications. The latest product is the INT 100 half-bridge MOSFETdriver, providing 800-volt level shifting and control for electric motors in the 50W to 3kW power range.


Foundry relationships with Panasonic Semiconductor group of Matsushita and Oki Electric have been establishedfor wafer fabrication utilizing Power Integrations' proprietary process.

Key Agreements

• Power Integrations granted Matsushita access to its technology and products for internal consumptionworldwide, and for non-exclusive distribution of the products in Japan and other selected geographical areas inreturn for providing foundry support.

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QLogic North American Company Profiles

QLOGIC

QLogic Corporation3545 Harbor Boulevard

Costa Mesa, California 92626Telephone: (714) 438-2200

Fax: (714) 668-5008Web Site: www.qlc.com

Fabless IC Supplier


1993 1994 1995 1996 1997

Sales 52 45 58 54 70Net Income 6 (5) 2 1 6R&D Expenditures 9 9 8 7 10

Employees 130 161 145 190


QLogic Corporation develops and markets a full line of host and peripheral I/O controller chips and host adaptercards used to connect hard disk drives, optical storage devices, CD-ROMs, and other peripherals to computersystems. In addition, the company develops small computer system interface (SCSI) target and disk controllerchips used in peripherals and host computers themselves.

QLogic was originally known as Emulex Micro Devices (EMD), a subsidiary of Emulex Corporation. In 1993, thesubsidiary changed its name to QLogic and became a publicly-held company in February of 1994.

To position itself as a major supplier of computer and peripheral controllers, the company is expanding its SCSItechnology. QLogic is devoted to providing its customers with products that optimize the transfer andmanagement of data between computer systems and peripheral devices, by developing IC chips, host adaptersboards, and software that combine a range of features and technologies.

In 1996, 55 percent of revenues were to foreign customers, primarily in the Pacific Rim region.


North American Company Profiles QLogic

Management

Gary E. Liebl ChairmanH.K. Desai President and Chief Executive OfficerThomas R. Anderson Vice President and Chief Financial OfficerMark Edwards Vice President, Sales and Corporate MarketingLarry Fortmuller Vice President and GM, Computer Systems GroupDavid Tovey Vice President and GM, Peripheral Products Group


QLogic’s semiconductor product families include:

• The FAS (Fast Architecture SCSI) Family of fast and wide SCSI controller ICs for host and peripheralapplications.

• The ESP (Enhanced SCSI Processor) Family of SCSI controller ICs based on the industry standard advancedSCSI core.

• The TEC (Triple Embedded Disk Controller) Family of 8-bit and 16-bit wide SCSI HDD controllers.

• The ISP (Intelligent SCSI Processor) Family of fast and wide, bus master host adapter ICs for 32-bit interfaces.

QLogic is working with Apple Computer to develop a new version of its high performance Fast!SCSI IQ PCI cardfor the Power Macintosh platform.


The company relies on outside vendors for the manufacturing of its semiconductor and circuit board products.

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Quality Semiconductor North American Company Profiles

QUALITY SEMICONDUCTOR

Quality Semiconductor, Inc.851 Martin Avenue


Fax: (408) 496-0773Web Site: www.qualitysemi.com

IC Manufacturer


Europe: Quality Semiconductor, Inc. • Hampshire, United KingdomTelephone: (44) (1420) 563333 • Fax: (44) (1420) 561142


1992 1993 1994 1995 1996

Sales 18 28 37 46 45Net Income (5) 3 3 5 (1)R&D Expenditures 5 6 7Capital Expenditures 1 2 7

Employees 100 160 160 160 197


Established in 1989, Quality Semiconductor, Inc. (QSI) is a provider of high-performance logic devices andnetworking and logic-intensive memory semiconductor products. Quality's strategy is to go after existing areaswith higher performance parts, then create new niches that can be developed. The company targets systemsmanufacturers principally in the networking, personal computer and workstation, and communications industries,but also sells devices for military and high-reliability applications.

In early 1996, Quality Semiconductor purchased AWA MicroElectronics, Pty. Ltd. (now Quality SemiconductorAustralia) from AWA Limited, acquiring AWA’s fab facility, foundry business, and design center in Australia. During1996, QSI upgraded the facility from 1.5µm to 0.8µm process technologies. The new subsidiary continues toprovide foundry services to AWA and its existing foundry customers. AWA Limited retains some ownership in thenew subsidiary and is jointly developing new products and technologies with Quality Semiconductor.


North American Company Profiles Quality Semiconductor


Europe5%

United States57%

Far East34%

Australia4%

Management

Quality Semiconductor Inc.Chun P. Chiu Chairman and Chief Technical OfficerR. Paul Gupta President and Chief Executive OfficerEdward J. Bradley, Jr. Vice President, ManufacturingAlbert R. Enamait Vice President, Sales and MarketingFarzin Firoozmand Vice President, Networking ProductsJacob H.V. Foraker Vice President, Logic and MemoryGilbert C. Jones Vice President, Marketing OperationsStephen H. Vonderach Vice President, Finance, and Chief Financial Officer

Quality Semiconductor AustraliaPhil Cavanagh PresidentAndy Brawley Manager, OperationsAndrew Greatbach Manager, MarketingClive Potter Manager, Engineering


Quality Semiconductor produces high-performance 5V and 3.3V CMOS FCT logic devices, high-speed digitallogic switches, clock management circuits, fast FIFOs, analog devices, JTAG devices, and advanced networkingproducts. Sales of interface logic devices account for a significant majority of the company’s net productrevenues.

Networking Products—QSI offers advanced CMOS Fast Ethernet transceivers for access equipment and LANapplications, as well as a 4:1 ATM multiplexer/demultiplexer with on-chip FIFO buffering for ATM switch fabricand transmission applications.

Specialty Memory Products—QSI’s memory products include a variety of asynchronous and synchronous FIFOs,as well as dual-port and shared-port RAMs.

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Quality Semiconductor North American Company Profiles

Logic Products—QSI offers a variety of standard 3.3V and 5V FCT logic devices in 8-, 16-, and 32-bitconfigurations, as well as a new line of LCX logic devices for mixed-voltage applications.

Clock Management Devices—These products include high-performance 3.3V and 5V devices with low skew, lowjitter, and low EMI-noise characteristics.

QuickSwitch® Products—The QuickSwitch product line was invented to meet the requirement for zeropropagation delay multiplexing and switching functions in high-performance computing and networkingsystems.

QuickScan™ Products—These are derived from QSI’s QuickSwitch product line and add JTAG boundary scancapabilities.

Analog Switch Devices—This is a new family of devices designed for advanced high-performance video, audio,and networking applications.

All of QSI’s products are manufactured using advanced CMOS process technologies with geometries rangingfrom 0.8µm to 1.5µm. A 0.6µm CMOS process is under development.


In addition to using its newly acquired fabrication facility in Australia, QSI has foundry partners from which itreceives fabricated wafers. Its current foundry partners include Seiko Instruments, Ricoh, Yamaha, and TSMC. In1996, approximately 85 percent of QSI’s wafers were manufactured by Seiko and Ricoh.

Quality Semiconductor Australia, Pty, Ltd. (QSA)8 Australia AvenueHomebush, NSW, 2140AustraliaTelephone: (61) (2) 763-4105Fax: (61) (2) 746-1501Cleanroom size: 5,000 square-feetCapacity (wafers/week): 1,250Wafer size: 150mmProcesses: CMOS, BiCMOSProducts: Logic and memory ICs, ASICs, foundry servicesFeature sizes: 0.8µm, 1.0µm, 1.2µm, 1.5µm (0.6µm in development)

Key Agreements

• Quality is developing new products and technologies through a strategic alliance with AWA Limited.

• Quality formed a second-source and product development alliance with Sharp Corporation in April 1995 thatcovers a variety of specialty memory products for advanced networking, multimedia data communications, andhigh-performance I/O subsystem applications.


North American Company Profiles QuickLogic

QUICKLOGIC

QuickLogic Corporation1277 Orleans Drive


Fax: (408) 990-4040Web Site: www.quicklogic.com

Fabless IC Supplier


Europe: QuickLogic Corporation • London, EnglandTelephone: (44) (181) 563-7624 • Fax: (44) (181) 563-0489


1994 1995 1996

Sales 7 15 30

Employees 40 90 115


QuickLogic was founded in 1988 by the inventors of the programmable array logic (PAL) device. Today, theprivately-held company designs and sells high density CMOS field programmable gate arrays (FPGAs) featuringhigh speeds and low power consumption, along with high productivity design software.

QuickLogic’s FPGAs compete with conventional high density programmable local devices and gate arrays inapplications such as graphics processing, high-speed memory control, video and image processing, DSP supportlogic, and data acquisition.

QuickLogic has indicated that it may announce its initial public offering sometime during 1997, depending onmarket conditions. Currently, international sales represent about 40 percent of QuickLogic’s total sales, and thecompany is working to increase that number.

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QuickLogic North American Company Profiles

Management

Irwin B. Federman ChairmanE. Thomas Hart President and Chief Executive OfficerJohn Birkner Vice President, CAEAndrew Chan Vice President, Product DevelopmentH.T. Chua Vice President, Technology DevelopmentRichard Johnson Vice President, Worldwide SalesVincent McCord Vice President, Finance, and Chief Financial OfficerPhilip Ong Vice President, OperationsRonald Zimmerman Vice President, Human RelationsEdward Smith Director, Marketing


QuickLogic's programmable ASIC (pASIC) devices are implemented in a submicron CMOS process and deliverhigh speeds and low power consumption. All of the company's existing devices are offered in both 5V and 3.3Vpower supply versions. They are based on QuickLogic's proprietary metal layer, amorphous silicon ViaLink®

antifuse programming element technology that offers high speeds and high densities (up to 20,000 usablegates). QuickLogic also supplies a comprehensive set of CAE development tools, operating on PCs and popularworkstation platforms. An open architecture approach allows popular third-party tools to interface to thecompany's development environment.

pASIC 1 FPGA Family—Consists of four parts in densities ranging from 1,000 usable gates to 8,000 usable gates(96 to 768 logic cells) and I/O pin counts ranging from 64 pins to 180 pins. The pASIC 1 devices are based onhigh-speed, low-power, two-layer-metal 0.65µm CMOS process technology.

pASIC 2 FPGA Family—Consists of seven parts in densities ranging from 3,000 usable gates to 20,000 usablegates (192 to 1,440 logic cells) and I/O pin counts ranging from 120 pins to 336 pins. The pASIC 2 devices arebased on high-speed, low-power, three-layer-metal 0.65µm CMOS process technology.

Future product development includes a hybrid PLD device that will combine FPGA and ASIC functionality. Thecompany plans to introduce this new product family during 1997.


QuickLogic does not fabricate its own ICs, it has a manufacturing and technology agreement with CypressSemiconductor. However, QuickLogic does perform all FPGA product testing for both companies. Tosupplement the capacity it receives from Cypress, QuickLogic established a foundry agreement with TSMC in1996 (see Key Agreements).


North American Company Profiles QuickLogic

Key Agreements

• In February 1997, Cypress and QuickLogic announced the cancellation of a previous joint-develop, licensing,and foundry agreement for high-performance FPGA products and released plans for establishing a newfoundry alliance. As part of a new five-year agreement, Cypress will no longer market and sell antifuse FPGAproducts, but will continue to serve as a foundry for QuickLogic’s FPGAs. In addition, QuickLogic agreed topurchase all of Cypress’s existing FPGA inventory. Cypress holds a stake of less than 10 percent inQuickLogic.

• In late 1996, QuickLogic established a foundry agreement with Taiwan foundry, TSMC. The two companies willwork together to integrate QuickLogic’s antifuse technology into TSMC’s 0.35µm process technology.Originally, the agreement called for using 0.5µm technology, however, a decision was later announced tobypass 0.5µm and move directly to a 0.35µm process. The agreement also allows QuickLogic to move from150mm to 200mm wafers.

1-280


Ramtron North American Company Profiles

RAMTRON

Ramtron International Corporation1850 Ramtron Drive


Fax: (719) 481-9170Web Site: www.csn.net/ramtron

IC Manufacturer


Japan: Ramtron K.K. • Yokohama, JapanTelephone: (81) (45) 473-9372 • Fax: (81) (45) 473-9373


1992 1993 1994 1995 1996

Sales 1 7 20 29 31Net Income (23) (27) (20) (2) (6)R&D Expenditures 15 19 16 11 13Capital Expenditures 3 3 2 1 1

Employees 129 140 121 88 105


Ramtron was established in 1984 to produce non-volatile memory products by combining the uniquecharacteristics of ferroelectric materials with conventional integrated circuitry. The company was the first tomanufacture ferroelectric memory devices. It holds 89 U.S. and international patents covering its proprietarytechnologies and products and more than 90 are pending.

Ramtron's principal business focus is directed toward the development of the commercial manufacture offerroelectric RAMs (FRAMs). The company sites benefits of FRAMs as having fast write times, high writeendurance, non-volatile retention, small form factors, and minimal power consumption. Applications for FRAMdevices include consumer electronics, business machines, communications equipment, test instruments,industrial controls, and medical equipment.

Besides ferroelectric RAMs, Ramtron is also involved in the development and sale of very high speed DRAMs thecompany calls enhanced-DRAMs (EDRAMs), that are based on standard volatile DRAM technology. In 1995,Ramtron spun off its EDRAM business into a wholly owned subsidiary called Enhanced Memory Systems, Inc.,(EMS) which has the sole responsibility of developing EDRAMs.


North American Company Profiles Ramtron

1996 Sales by Device Type

FRAMs*11%

EDRAMs*89%

*Includes license and development fee revenues.


SemiconductorDevices

57%

License andDevelopment

Fees43%

EDRAMs have been demonstrated to provide SRAM performance with DRAM density in a product thatapproaches DRAM pricing. A large portion of the company’s EDRAM business is targeted at replacement of fast(≤15ns) SRAMs in high-performance systems. As such, EDRAMs applications include a wide variety of thehighest performing systems such as personal computer motherboards, accelerator boards, multiprocessorsystems, disk controllers, embedded computer modules, digital signal processing systems, and video graphicsystems.

Ramtron's business strategy is to manufacture its own products, to license its products on a contract basis to othercompanies, and to license its proprietary technologies to a limited number of IC manufacturers in exchange forroyalties and access to advanced manufacturing capabilities. The company has forged alliances with IBMMicroelectronics, Fujitsu, Hitachi, Rohm, Toshiba, Nippon Steel Semiconductor, Samsung, and SGS-Thomson.

International sales represented 21 percent of sales in 1996.

Management

L. David Sikes Chairman and Chief Executive OfficerGreg B. Jones President and Chief Operating OfficerRichard L. Mohr Executive Vice President and Chief Financial OfficerElliot M. Philofsky, Ph.D. Senior Vice President and Chief Technical OfficerDonald G. Carrigan Vice President, Sales and MarketingCraig Rhodine General Manager, Enhanced Memory Systems, Inc.


Ramtron first demonstrated a working 256bit FRAM prototype in 1987 and in 1993, began commercial sales of 4KFRAMs. Commercial 16K and prototype 64K devices were introduced in 1994. Production of 256K FRAMsstarted in the second half of 1995. Ramtron is pursuing the development, through its strategic alliance partners,of new high-density (1M and above) FRAM products. Ramtron's FRAM products are pin compatible with manyserial and parallel EEPROMs on the market.

The nonvolatile storage element in Ramtron's FRAMs is a capacitor constructed from two metal electrodes with athin-film ferroelectric material between the transistor and metallization layers of an industry standard CMOSmanufacturing process.

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Ramtron North American Company Profiles

In addition to nonvolatile memories, Ramtron has identified other products in which ferroelectric technology maybe integrated, including microcontrollers, programmable logic devices (PLDs), and radio frequency identificationdevices (RFIDs). Ramtron's joint venture affiliate, Racom ID Systems, Inc., is engaged in the development offerroelectric RFID chips and systems.

Enhanced Memory Systems' enhanced-DRAM (EDRAM) products were developed in cooperation with UnitedMemories Inc. (UMI) and Nippon Steel Semiconductor (then NMB Semiconductor). Colorado Springs-based UMIwas formed by Ramtron and NMB in 1990 (see Key Agreements). The EDRAMs are fabricated at Nippon SteelSemiconductor's fab facility in Japan.

During 1996, EMS began development of a 133MHz, 16M enhanced synchronous DRAM (ESDRAM) based onthe company’s EDRAM technology. Sample shipments of the device are expected to begin in late 1997. In early1997, EMS introduced the Enhanced 10ns family of EDRAMs that features upgraded performance speeds up to10ns. The 10ns family is manufactured by IBM using 0.6µm process technology.


Ramtron International Corporation1850 Ramtron DriveColorado Springs, Colorado 80921Cleanroom size: 11,500 square feetCapacity (wafers/week): 1,625Wafer size: 150mmProcesses: Ferroelectric CMOS and standard CMOSProducts: Specialty memory ICsFeature size: 1.0µm

Ramtron's wafers are also manufactured by Rohm, Nippon Steel Semiconductor, IBM Microelectronics, and Hitachi(see Key Agreements).

Key Agreements

• In February 1997, Ramtron established a relationship with SGS-Thomson that will cover FRAM production. Theagreement calls for SGS-Thomson to provide CMOS wafers to Ramtron, who will return the wafers to ST asfinished 64K FRAMs. The two companies may extend this relationship in the future to include joint foundry ortechnology licensing agreements.

• Ramtron signed a non-exclusive licensing agreement with Samsung. Under the agreement, Ramtron licensedits FRAM technology to Samsung in exchange for certain licensing and royalty considerations.

• Ramtron signed a manufacturing agreement with IBM Microelectronics in May 1995 for EDRAM production.Under the agreement, IBM is serving as a foundry for the production of Enhanced Memory Systems' EDRAMs,and IBM has a non-exclusive license to sell the devices. The first products manufactured by IBM becameavailable in October 1996.


North American Company Profiles Ramtron

• Ramtron added Fujitsu to the list of companies with which it maintains joint design and licensing deals forferroelectric memories. The two firms are developing a 1M FRAM device, and in June 1996, Fujitsu completeda feasibility study for 16M FRAMs. In August 1996, the agreement was amended allowing Fujitsu to use FRAMtechnology in the development and manufacture of embedded memory FRAM products.

• In late 1994, Ramtron signed a cross-licensing deal with ferroelectric memory competitor, Symetrix, also locatedin Colorado Springs. Both companies are jointly developing a 3-volt 16K FRAM based on Symetrix's Y-1ferroelectric material technology. In addition, Ramtron's ferroelectric technology is now licensable by Symetrixto its strategic partners, which include Motorola and Matsushita, and Ramtron may license Symetrix'stechnology to its partners. The deal also called for Ramtron to purchase half of Symetrix for about $6 million.

• Ramtron and Rohm signed a joint manufacturing, development, and marketing deal in 1993 giving Rohmaccess to Ramtron's line of FRAM products. Under the agreement, Rohm is supplying Ramtron with wafers andis selling completed devices in Japan under both logos. In addition, joint development of new ferroelectric-based circuits, including microcontrollers and custom products will take place. Volume production of FRAMmemories by Rohm is expected to begin in the second half of 1997.

• A joint program to integrate Ramtron's ferroelectric technology with Hitachi's DRAM manufacturing process wasestablished in 1992. In early 1994, Hitachi indicated it was satisfied with its pilot program of testing andpackaging midrange density FRAMs. As a result, Hitachi is working with Ramtron to design and develop 256K,1M, and 4M FRAMs. Volume production of the 256K FRAM is expected to begin in the second half of 1997.Ramtron also agreed to license all its non-standard and standard FRAM products to Hitachi. Ramtron will rely onHitachi as a foundry for the devices since its own fab is not capable of the feature sizes required for the largermemories.

• Toshiba agreed to jointly develop and second-source Ramtron’s FRAMs in densities of 256K and above.

• In 1988, Ramtron and NMB Semiconductor (now Nippon Steel Semiconductor) entered into a productdevelopment and license agreement for conventional 1M and 4M DRAMs. Then, in 1990, the two companiesestablished United Memories, Inc. (UMI) to design and develop advanced memory devices (not involvingRamtron's ferroelectric technology) for both companies. In 1995, Ramtron sold all its remaining interest in UMIto Nippon Steel. Now, Nippon Steel manufactures and sells 4M EDRAM products to Enhanced MemorySystems for resale to EMS’s customers.

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Raytheon North American Company Profiles

RAYTHEON

Raytheon Company141 Spring Street

Lexington, Massachusetts 02173Telephone: (617) 862-6600

Web Site: www.raytheon.com

IC Manufacturer


1992 1993 1994 1995 1996



Employees 1,700


Founded in 1922 as the American Appliance Company, the company adopted the Raytheon name in 1925. Earlyexpertise was in the field of radio tubes and missile guidance. In 1964, Raytheon launched a diversificationprogram to broaden its business base by adding commercial operations.

Today, Raytheon consists of four major business segments: electronics, engineering and construction, aircraftproducts, and major appliances. Approximately 60 percent of its sales are from commercial customers and 40percent from government and defense electronics customers.

Electronics44%

1996 Corporate Sales by Business Segment

Engineeringand Construction

25%

MajorAppliances

12%

AircraftProducts

19%


North American Company Profiles Raytheon

In electronics, Raytheon’s principal business is the design, manufacture, and servicing of advanced electronicdevices, equipment, and systems for governmental and commercial markets. The company is seeking to greatlyenhance its defense electronics business through the acquisition of the Defense Systems and Electronicbusiness of Texas Instruments and the Hughes Aircraft business of Hughes Electronics. Both of the transactionsare expected to be completed in 3Q97. Once Raytheon, TI DS&E, and Hughes Aircraft are combined,Raytheon’s revenues with be on the order of $21 billion, more than $13 billion of which will be in defenseelectronics.

Raytheon’s commercial electronics business consists of Raytheon Marine Company, a supplier of marine-relatedelectronics and systems; Raytheon Semiconductor, which specializes in the design and manufacture ofmultimedia video circuits and analog ICs; Raytheon Microelectronics, which produces GaAs ICs for wirelesscommunications and satellite applications; Seiscor Technologies, Inc., a supplier of telephone transmissionequipment; and Switchcraft, Inc., a supplier of a wide range of electronic components.

Raytheon Semiconductor is made up of three business units. The Multimedia Business Unit, based in San Diego,California, is a leading designer and manufacturer of high-performance digital and mixed-signal ICs for computergraphics, multimedia, imaging, and communications applications. The Analog Business Unit, based in MountainView, California, provides a wide range of analog and mixed-signal IC products for PC, broadcast video, automatictest equipment (ATE), and set-top box applications. The High Speed Communications Business Unit offers ICsfor Fast Ethernet, Fibre Channel, and Fibre Distributed Data Interface (FDDI) applications. More than 90 percent ofRaytheon Semiconductor’s devices are sold to commercial customers.

Management

Dennis J. Picard Chairman and Chief Executive OfficerPeter R. D’Angelo Executive Vice President and Chief Financial OfficerChristoph L. Hoffmann Executive Vice President, Law and Corporate AffairsWilliam H. Swanson Executive Vice President and GM, Raytheon Electronic SystemsPhilip W. Cheney Vice President and Group Executive, Raytheon ElectronicsShi-Chuan Lee President, Raytheon SemiconductorJames V. DiLorenzo General Manager, Advanced Device Center, Raytheon MicroelectronicsArthur J. Hoage Manager, Manufacturing Services, Raytheon SemiconductorPeter F. Bejarano Director, VLSI Products, Raytheon SemiconductorScott Keller Director, Linear and Mature Products, Raytheon SemiconductorLes Welborn Director, Worldwide Sales, Raytheon Semiconductor


Raytheon Semiconductor's products are focused primarily on video/multimedia, ATE and instrumentation, PC,and communications applications. They include analog audio, video, and special function circuits; analog-to-digitaland digital-to-analog converters; DC/DC converters; ATE pin electronics drivers; digital video decoders, encoders,and genlocks; imaging and video processors and filters; line regulators and references; memory and storageproducts; operational amplifiers; standard PROMs and power-switched SPROMs; transceivers; and voltageregulator modules. Raytheon Semiconductor also offers IC design, test, and manufacturing foundry services.

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Raytheon North American Company Profiles

Technologies used in the manufacture of Raytheon Semiconductor’s IC products include CMOS processes, acomplementary BiCMOS process, a 5GHz high-speed complementary bipolar process, and a wide range of bipolarprocesses (up to 32V). Submicron CMOS process capabilities are obtained from contract foundry suppliers.

Raytheon Microelectronics manufactures a wide range of RF, microwave, and millimeter-wave GaAs ICs, includingcellular/PCS circuits, digital broadcast satellite (DBS) devices, and wideband circuits. Raytheon Microelectronicsalso offers custom MMIC solutions and foundry services. There are five standard GaAs processes offered throughits foundry services program, a 0.25µm power PHEMT process, a 0.25µm LN PHEMT process, a 0.5µm E/DMESFET process, a 0.5µm LN MESFET process, and a 0.5µm power MESFET process.


Raytheon Semiconductor Raytheon Semiconductor350 Ellis Street Hartwell RoadMountain View, California 94039 Bedford, Massachusetts 01730Telephone: (415) 966-7784 Telephone: (617) 274-5000Cleanroom size: 23,300 square feet Cleanroom size: 12,000 square feetCapacity (wafers/week): 2,000 Capacity (wafers/week): 1,000Wafer size: 100mm Wafer size: 100mmProcesses: Bipolar, CMOS, BiCMOS Processes: NMOS, CMOS, bipolarProducts: Linear, logic, ASICs, discretes, foundry Products: Logic and custom ICsFeature sizes: 1.0µm-5.0µm Feature sizes: 0.5µm-1.0µm

Raytheon Microelectronics Raytheon Electronic SystemsAdvanced Device Center 350 Lowell Street350 Lowell Street West Andover, Massachusetts 01810West Andover, Massachusetts 01810 Telephone: (508) 475-5000Telephone: (508) 470-5000 Cleanroom size: 17,000 square feetCleanroom size: 17,000 square feet Capacity (wafers/week): 875Capacity (wafers/week): 360 Wafer size: 125mmWafer size: 100mm Processes: NMOS, CMOS, bipolar, BiCMOSProcess: GaAs Products: Logic, custom, and linear ICsProducts: MMICs, discretes, foundry Feature size: 0.9µmFeature sizes: 0.25µm-0.5µm

Through the acquisitions of the defense electronics businesses of TI and Hughes Electronics, Raytheon may gaincontrol of the following IC fabs: a TI GaAs MMIC fab in Dallas, Texas, a Hughes silicon IC fab in Newport Beach,California, a Hughes GaAs MMIC fab in Torrance, California, and a Hughes silicon IC fab in Scotland.


North American Company Profiles Rochester Electronics

ROCHESTER ELECTRONICS

Rochester Electronics Inc.10 Malcolm Hoyt Drive

Newburyport, Massachusetts 01950Telephone: (508) 462-9332

Fax: (508) 462-9512Web Site: www.rocelec.com

Fabless IC Supplier


Europe: Rochester Electronics, Ltd. • Luton, Bedfordshire, EnglandTelephone: (44) (1582) 488680 • Fax: (44) (1582) 488681


Rochester Electronics was established in 1981 to supply discontinued semiconductors. Rochester offers entirediscontinued lines, both commercial and military, from manufacturers that reduce support for old parts to rationalizescarce manufacturing and service resources. Increased military cutbacks have also led chip makers to reduce theirsupport for military parts as they shift to more commercial offerings.

Rochester handles discontinued lines from companies such as AMD, National, Texas Instruments, Harris, Intel,AT&T/Lucent, and Raytheon.

Management

Curt Gerrish President


Rochester has more than 450 million devices in stock, some over 20 years old. Its product lines include SRAMs,DRAMs, VRAMs, PROMs, logic chips, and linear devices. The company also stocks unfinished wafers and originalmask sets.


Rochester uses more than 30 foundries to manufacture its product lines.

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Rockwell Semiconductor Systems North American Company Profiles

ROCKWELL SEMICONDUCTOR SYSTEMS

Rockwell Semiconductor SystemsRockwell International Corporation

4311 Jamboree RoadP.O. Box C

Newport Beach, California 92658-8902Telephone: (714) 221-4600

Fax: (714) 221-6544Web Site: www.nb.rockwell.com

IC Manufacturer


Japan: Rockwell International Japan Co., Ltd., Semiconductor Systems • Shibuya-ku, Tokyo, JapanTelephone: (81) (3) 5371-1520 • Fax: (81) (3) 5371-1501

Europe: Rockwell Semiconductor Systems SARL • Valbonne, Sophia Antipolis Cedex, FranceTelephone: (33) (4) 93-00-33-35 • Fax: (33) (4) 93-00-33-03

Asia-Pacific: Rockwell International Hong Kong, Ltd., Semiconductor Systems • Wanchai, Hong KongTelephone: (852) 2827-0181 • Fax: (852) 2827-6488


1992 1993 1994 1995 1996

Corporate*Sales 5,856 6,204 7,029 9,065 10,373Net Income 483 562 634 742 726

Semiconductor SystemsSales 431 530 691 875 1,593Capital Expenditures 151 175 414

Employees(Semiconductor Systems) 1,695 4,000 4,500

*Restated to reflect continuing operations. Rockwell sold its Graphics Systems and Aerospace and DefenseBusinesses in 1996.


North American Company Profiles Rockwell Semiconductor Systems


Rockwell International Corporation was incorporated in 1928 and is engaged in the research, development, andmanufacture of diversified products, including industrial automation equipment and systems, avionics productsand systems and related communications technologies primarily for commercial and military aircraft and defenseelectronics systems, system-level semiconductor chipsets for personal communication electronics markets, andautomotive components and systems.

Electronics40%

SemiconductorSystems

16%

1996 Corporate Sales byBusiness Segment

Avionics and Communications14%

Automotive30%

In 1996, Rockwell made several acquisitions and divestitures to sharpen its business focus. Its divestituresincluded the sale of its Graphics Systems business to Stonington Partners in October 1996 and the December1996 sale of its Aerospace and Defense business to Boeing for $3.2 billion. Meanwhile, Rockwell’s acquisitionswere focused on gaining semiconductor technologies. In September 1996, the company acquired BrooktreeCorporation, a supplier of high-performance chipsets for computer graphics, multimedia, imaging, andcommunications applications for $278 million, and then in December 1996 acquired the Wireless SemiconductorProducts group of the Cirrus Logic subsidiary Pacific Communications Sciences Inc. (PCSI) for $18.1 million andcertain graphics and multimedia technology assets of Weitek Corporation. As a result of these transactions,Rockwell is now predominantly an electronics company with 70 percent of 1996 sales coming from its electronicsbusiness compared to in 1984 when 63 percent of the company’s sales were aerospace- and defense-related.

The transformation of Rockwell has continued into 1997. In April 1997, the company acquired the Hi-Mediabroadband communications chipset business of ComStream Corporation for approximately $50 million. By theend of September 1997, Rockwell plans to spin-off of its Automotive business into a separate, publicly-tradedcompany.

Meanwhile, Rockwell’s sales outside the U.S. have grown to 43 percent of total sales in 1996 compared to 13percent in 1984.

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Rockwell Semiconductor Systems is the fastest-growing business segment of Rockwell and comprises theMultimedia Communications Division (MCD), the Wireless Communications Division (WCD), the Network AccessDivision (NAD), and the Digital Infotainment Division. The MCD is the world’s leading supplier of facsimile and PCmodem devices. The WCD offers semiconductor systems for advanced cordless telephony and GlobalPositioning Systems (GPS) receiver engines and is developing products and technologies to address thePersonal Communications Services (PCS) and wireless packet data markets. NAD offers a broad line of high-bandwidth communications and networking devices. The Digital Infotainment Division focuses on products for thedigital consumer electronics information and entertainment markets.

Management

Rockwell International CorporationDonald R. Beall Chairman and Chief Executive OfficerDon H. Davis, Jr. President and Chief Operating OfficerW. Michael Barnes Senior Vice President, Finance, and Chief Planning OfficerWilliam J. Calise, Jr. Senior Vice President, General Counsel, and SecretaryWilliam D. Fletcher Senior Vice President, Technology and Business DevelopmentRobert H. Murphy Senior Vice President, Organization and Human ResourcesEarl S. Washington Senior Vice President, CommunicationsLee H. Cramer Vice President and TreasurerLawrence J. Komatz Vice President and ControllerThomas A. Madden Vice President, Corporate Development

Rockwell Semiconductor SystemsDwight W. Decker, Ph.D. PresidentA.C. D’Augustine Vice President and General Manager, Digital Infotainment DivisionRaouf Halim Vice President and General Manager, Network Access DivisionVijay Parikh Vice President and General Manager, Multimedia Communications DivisionVijay Parikh (acting) Vice President and General Manager, Wireless Communications Division


Rockwell Semiconductor Systems specializes in system-level semiconductor solutions. The company has ahistory of leadership in the development and application of mixed-signal technologies. Rockwell introduced thefirst modem to the worldwide communications market in 1995 and has since played a key role in helping theindustry turn those original three-board modems into today’s low-cost single-chip devices. The company is theworld’s leading supplier of advanced voice, fax, and data modem products, with a 70 percent share of the totalmodem marketplace. Rockwell claims that its installed base of data modems is more than 150 million and that over80 percent of all fax machines use its fax-modem digital signal processors and chipsets.

Rockwell believes its core competencies in IC design include digital signal processing (DSP) architectures andalgorithms, submicron CMOS technology, application-specific IC (ASIC) design, interconnect technology,embedded memory, mixed-signal integration, and radio frequency (RF) technology. The company’s productportfolio is organized around five product platforms: personal computing products; digital infotainmentappliances; wireless devices for cordless phones, cellular/PCS handsets, and Global Positioning Systems (GPS);personal imaging systems; and network access equipment.



Personal Computing Products

Through its Multimedia Communications Division, Rockwell serves the PC market with its fax, data, and integrateddata/fax/voice modem devices with transmission speeds of up to 56Kbps. In September 1996, Rockwell was thefirst company to announce 56Kbps modem technology. Through the acquisition of Brooktree, Rockwellexpanded its product portfolio to include video encoding and decoding products, creating a complete offering ofmultimedia and connectivity products for desktop PCs, notebook PCs, and PDAs.

Digital Infotainment Products

Rockwell’s Digital Infotainment Division was formed in April 1997. Much of the products from this division stemfrom Rockwell’s Brooktree, Weitek, and ComStream Hi-Media acquisitions. The products include videodecoders/encoders and other graphics and video ICs; broadband wireless and cable demodulation products andtuners; WaverArtist PC audio system devices, WaveStream™ software synthesizers, and the EndlessWave™unlimited-capacity wavetable synthesis sampling engine; and the MediaPacket™ silicon architecture andTrueView™ video display technology for advanced multimedia applications.

Wireless Communications Products

Rockwell’s Wireless Communications Division focuses on chips, chipsets, and modules for spread-spectrumdigital cordless telephones, GPS receivers, and cellular/PCS handsets. These products are supported by a widevariety of semiconductor processes, including advanced CMOS (used for digital and mixed-signal devices), a newsilicon bipolar process for RF applications, and an HBT (heterojunction bipolar transistor) GaAs process for wirelesspower amplifiers. Rockwell is developing pager-chipset solutions for personal Air Communications Technology(pACT), a narrowband two-way messaging system.

Personal Imaging Products

At the core of Rockwell’s personal imaging platform offering is its Advanced FAX ENGINE™ family, a highlyintegrated technology featuring a digital answering machine coupled with fax functions such as modem, faxprotocols, and compression/decompression, as well as scanner and printer interfaces.

Network Access Products

Formed in April 1997, the Network Access Division is focused on the underlying infrastructure tying together all ofthe company’s other strategic product platforms. The Brooktree acquisition brought Rockwell a broad family ofhigh-speed digital data communications products spanning the company’s existing Central Site modems andBrooktree’s HDSL and other T1/E1 products, and packet-switched products for ATM and SMDS (switched multi-megabit data services).


In August 1995, Rockwell purchased the United Technologies Microelectronics Center (UTMC) wafer fab facility inColorado Springs, Colorado. The company plans to invest up to $1.3 billion to build a 450,000 square-foot fabfacility at this site to produce 7,500 wafers per week. Construction of Phase I, which began in March 1996, willinclude a 65,000 square-foot, Class 1 cleanroom. The exterior shell will be completed in 1998, but Rockwell hasdecided to hold off on starting volume production until late 1999. The company has cited the attractive cost andavailability of external resources as the reason for the delay.

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In early 1994, the company executed an agreement to acquire additional 200mm wafer capacity through a minorityequity investment in Chartered Semiconductor Manufacturing, Ltd., of Singapore. Under the agreement,Rockwell is guaranteed capacity in Chartered’s $1.3 billion Fab 2 facility in Singapore.

In early 1996, Rockwell and Submicron Technology announced a long-term technology transfer and wafer supplyagreement. Rockwell agreed to transfer its 0.5µm and 0.35µm CMOS process technologies in return forguaranteed wafer capacity (up to 25 percent) at Submicron Technology’s new $1.2 billion, 200mm fab facilitylocated near Bangkok, Thailand. Operations at the Thai fab are scheduled to begin in 1998.

Rockwell’s long-term wafer capacity target calls for a mix of about 70 percent in-house and 30 percent outsourced.

Rockwell Semiconductor Systems Rockwell Semiconductor SystemsDigital Communications Division Digital Communications Division4311 Jamboree Road 4311 Jamboree RoadNewport Beach, California 92660 Newport Beach, California 92660Fab 4 Fabs 5 and 6Cleanroom size: 15,000 square feet Cleanroom size: 40,000 square feetCapacity (wafers/week): 3,750 Capacity (wafers/week): 2,500Wafer size: 125mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: MPRs, MPUs, DSPs, ASICs, Products: MPRs, DSPs,

memory ICs, linear ICs Feature sizes: 0.35µm-0.65µmFeature sizes: 0.8µm-2.0µm

Rockwell Semiconductor Systems Rockwell Semiconductor Systems1575 Garden of the Gods Road 1575 Garden of the Gods RoadColorado Springs, Colorado 80907-3486 Colorado Springs, Colorado 80907-3486Fab 7 Fab 8Cleanroom size: 25,000 square feet Cleanroom size: 65,000 square feet (Class 1)Capacity (wafers/month): 750 Capacity (wafers/month): 3,750Wafer size: 125mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: Linear ICs, ASICs, MPRs, MPUs Products: MPRs, MPUs, DSPs, ASICsFeature sizes: 0.8µm, 1.0µm Feature size: 0.35µm(Purchased from UTMC in 1995) (Operations to start in late 1999)



Rockwell Semiconductor SystemsMicroelectronic Technology Center2427 West Hillcrest DriveNewbury Park, California 91320Telephone: (805) 375-1256Capacity (wafers/week): 400Wafer size: 100mmProcesses: HBT, MESFET GaAsProducts: ASICs, receivers, power amps, high-speed digital circuitsFeature sizes: 0.5µm-2.0µm

Key Agreements

• In early 1997, Rockwell licensed the ARM810 and the ARM7TDMI “Thumb” 32-bit RISC microprocessor coretechnologies of Advanced RISC Machines Ltd., as well as a core to be developed in the future. Rockwell willintegrate the cores into a variety of communications products.

• In 4Q96, Rockwell and Lucent Technologies jointly announced plans to make the two companies’ 56Kbpsmodem products interoperable.

• In July 1995, Rockwell signed a five-year foundry agreement with IMP, Inc. for the wafer fabrication of CMOSmixed-signal ICs.

• Rockwell is teamed with McCaw Cellular Communications to develop and provide a Cellular Digital Packet Data(CDPD) chipset that enables portable PCs to send digital data over cellular phone networks.

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Ross Technology North American Company Profiles

ROSS TECHNOLOGY

Ross Technology5316 Highway 290 West

Austin, Texas 78735Telephone: (512) 349-3108

Fax: (512) 349-3101Web Site: www.ross.com

Fabless IC Supplier


Europe: Ross Europe • La Hulpe, BelgiumTelephone: (32) (2) 652-1014 • Fax: (32) (2) 652-1062


1995 1996 1997

Sales 39 101 100Net Income (11) 18 n/aR&D Expenditures 13 16 n/a



Ross Technology is an independent wholly owned subsidiary of Fujitsu Ltd., which acquired the firm from CypressSemiconductor in mid-1993 for about $22 million. In November 1995, Ross completed its initial public offering,reducing Fujitsu’s share to 60 percent. A minority position in Ross is also held by Sun Microsystems (five percent).

Originally established in 1988, Ross is involved in the design, development, and marketing of advanced RISCmicroprocessors based on the SPARC architecture pioneered by Sun Microsystems. Besides SPARCmicroprocessors, Ross also offers a complete line of high-end motherboards and systems through its RossMicrocomputer business unit, which was established in February 1996.


North American Company Profiles Ross Technology

Sun Microsystems45%

Fujitsu19%

1996 Sales by Customer

Other OEM17%

CPU Upgrade19 %

Management

Fred T. May Chairman and Acting Chief Executive OfficerFrank A Baffi Vice President, Worldwide SalesCarter Godwin Chief Accounting Officer and ControllerJohn Rasco Vice President, MarketingFrancis A. “Kit” Webster Chief Financial Officer


Ross Technology's current family of RISC microprocessors include the 32-bit Colorado™ 2, 3, and 4hyperSPARC™ lines. The superscaler, superpipelined hyperSPARC processors are based on a 0.4µm triple-level-metal CMOS process and deliver performance of up to 200MHz. The company continues to develop itsnext-generation Viper microprocessor technology.

To support its hyperSPARC microprocessors, Ross also offers core logic chipsets.


The company's devices are manufactured by Fujitsu.

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S-MOS Systems North American Company Profiles

S-MOS SYSTEMS

S-MOS Systems, Inc.150 River Oaks Parkway


Fax: (408) 922-0238Web Site: www.smos.com

Fabless IC Supplier


1992 1993 1994 1995 1996

Sales 152 137 135 190 210

Employees 210 210 220 210 215


S-MOS Systems Inc., established in 1983, designs, develops, and markets a full line of very-low-power and low-voltage (2V) advanced CMOS integrated circuits for a variety of market applications including desktop, notebook,and palmtop computers, handheld instrumentation, data and telecommunications, and mobile and portablecommunications devices. The company is divided into four key business units: Semiconductor ContractManufacturing, Standard Products, ASICs, and Card Products. The company provides silicon foundry servicesthrough its Japanese affiliate, Seiko Epson Corporation.

SemiconductorContract

Manufacturing57%

1996 Sales by Business Unit

ASIC20%

StandardProducts

21%

Card Products2%


North American Company Profiles S-MOS Systems

Management

Tadakatsu Hayashi Chairman, President, and Chief Executive OfficerTom Endicott Vice President, Sales and MarketingEiichi Suda Vice President, Product CreationKai P. Yiu Vice President, Advanced Systems DivisionIan R. Mackintosh Executive Director, ASIC Business UnitTakami Takeuchi Executive Director, FinanceDan Beck Director, Marketing CommunicationsDev Chakravarty Manager, ASIC Marketing


Standard Products Business Unit

Memories—SRAMs, mask ROMs, EEPROMsControllers—VGA-LCD controllers, 3D graphics acceleratorsDrivers—LCD driversMicrocontrollers—low-power 4-bit and 8-bit microcontrollers

ASIC Business Unit

Gate Arrays—SLA40000 Series: 0.45µm CMOS process with two or three layers of metal, 13K to

288K raw gates, and 128 to 400 available I/Os.—SLA30000 Series: 0.6µm CMOS process with two or three layers of metal, 18K to

216K raw gates, and 128 to 376 available I/Os.—SLA20000 Series: 0.65µm CMOS process with two and three layers of metals, 12K to 200K raw gates, and 64 to 368 available I/Os.—SLA9000F Series: 0.6µm CMOS process, 3K to 44K raw gates, and 80 to 256 I/Os.—SLA9000 Series: 1.0µm CMOS process with two layers of metals, 4K to 36K raw gates, and 82 to 240 available I/Os.—SLA100X Series: 2.0µm CMOS process with two layers of metals, 1K to 8K raw gates, and 78 to 178 available I/Os.

Standard Cells—SSC5000 Series: 0.8µm CMOS process, 7K to 107K raw gates, and 112 to 432 available I/Os.—SCC2500 Series: 1.6µm CMOS process, 300 to 16K raw gates, and 44 to 256 I/Os.—SCC2000 Series: 2.0µm CMOS process, 250 to 11K raw gates, and 40 to 192 I/Os.

Embedded Arrays—SSL20000-1: RAM-DAC embedded array for PC video and graphics applications.—SSL20000-2: LAN/Ethernet embedded array for LAN controller applications.—SSL20000-3: RAM/ROM embedded array for pager, cellular phone, and PDA applications.

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S-MOS Systems North American Company Profiles

Card Products Business Unit

Subsystem design and assembly

Contract Manufacturing Services

Foundry, test, and packaging services through Japanese affiliate Seiko Epson.


Design, engineering, and marketing of S-MOS's products are handled at its San Jose headquarters.Manufacturing is done at Seiko Epson's fabrication facility in Fujimi, Nagano Prefecture, Japan.


North American Company Profiles S3

S3

S3 Incorporated2801 Mission College Boulevard


Fax: (408) 980-5444Web Site: www.s3.com

Fabless IC Supplier


Japan: S3 Japan K.K. • Tokyo, JapanTelephone: (81) (3) 3345-7360 • Fax: (81) (3) 3345-7390

Asia-Pacific: S3 Taiwan • Taipei, TaiwanTelephone: (886) (2) 757-6768 • Fax: (886) (2) 757-6880


1992 1993 1994 1995 1996

Sales 31 113 140 316 465Net Income 4 19 6 35 48R&D Expenditures 5 12 18 42 63Foundry Fab Investment — — — 36 93

Employees 68 141 230 444 678


S3 Incorporated, founded in 1989, pioneered graphics acceleration in 1991 when it introduced the industry’s firstsingle-chip graphics accelerator, significantly improving the performance of personal computers. The 16-bitaccelerator was followed by 32-bit and 64-bit families in 1992 and 1993, respectively. In addition, S3 delivered thefirst integrated 2D and 3D graphics and video accelerator designed for the mainstream PC market.

As multimedia continues to become pervasive in PCs, S3 has leveraged its expertise to accelerate 3D graphicsand video, offer optimized UMA (Unified Memory Architecture) and MPEG solutions, and introduce new products,such as an audio signal processor.

1-300


S3 North American Company Profiles

Beginning in 1997, S3 plans to bring greater technology differentiation to the PC by exploiting the best of theconsumer electronics proprietary technologies, such as compression, communications, high-quality video andaudio, and life-like 3D graphics. In addition, the company intends to further extend the capabilities of its 2D, 3D,and audio accelerators into new markets and technologies emerging from consumer electronics and the Internet.

United States39%

Asia/Europe/ROW61%


Management

Diosdado “Dado” P. Banatao ChairmanTerry N. Holdt Vice ChairmanGary Johnson President and Chief Executive OfficerG. “Ven” Venkatesh Executive Vice President, Graphics and Audio CommunicationsHarry L. Dickinson Senior Vice President, SalesPaul G. Franklin Senior Vice President, OperationsDale Lindly Controller and acting Chief Financial OfficerNeal D. Margulis Senior Vice President, Research and TechnologyRonald T. Yara Senior Vice President, Strategic MarketingEdwin DeSouza Vice President and General Manager, NetworkingCecilia Hayes Vice President, Human ResourcesWei-Chan Hsu Vice President, Analog TechnologyMichael P. Nell Vice President, Business DevelopmentGreg Paley Vice President, Central Software Engineering OperationsWerner Stahel Vice President, Central Engineering


S3 offers a variety of 32-bit and 64-bit graphics and multimedia accelerator ICs, as well as supporting softwaredrivers. In 1995 and 1996, the company significantly expanded its product offerings from 2D graphicsacceleration to video acceleration, MPEG decoding, audio processing, 3D acceleration, and mobile multimediaacceleration. S3’s IC products are listed below.


North American Company Profiles S3

Products for home PC applications• Trio32™ and Trio64™ DRAM-based integrated mixed-signal graphics accelerators for cost-sensitive users.• Trio64V+™ 64-bit, DRAM-based, multimedia accelerator with high-end video and graphics capabilities.• Trio64UV+™ 64-bit, UMA-based, video-enable graphics accelerator. Optimized for next-generation Pentium

processor designs.• ViRGE™ and ViRGE/VX™ 64-bit graphics and video accelerators, which integrate 3D rendering, 2D GUI, and

video acceleration with a RAMDAC and clock synthesizer on a single chip.• Sonic/AD™ CD-quality, programmable, sigma-delta audio DAC. S3’s first audio product.• SonicVibes™ PCI-based audio processor that integrates the capabilities of a “sound card on a chip.”• Scenic/MX2™ MPEG-1 audio/video decoder. Connects to the Trio64V+ multimedia accelerator.

Products for desktop PC applications• Vision864™ and Vision964™ graphics and video accelerators. The DRAM-based Vision864 enables 64-bit

performance in midrange PCs, while the VRAM-based Vision964 is targeted for power users that need higherresolutions, color depths, and refresh rates.

• Vision868™ and Vision968™ 64-bit multimedia accelerators with an integrated video playback engine. TheVision868 is DRAM-based and the Vision968 is VRAM-based.

• Trio32 and Trio64 graphics accelerators (see above).• Trio64V+ multimedia accelerator (see above).• Trio64V2™ graphics and multimedia accelerator that brings high-quality hardware assisted video playback to

the mainstream business desktop PC. The Trio64V2 provides an upgrade path to synchronous memorytechnologies for even higher performance.

• ViRGE/DX/GX™ 3D-enabled multimedia accelerators based on the S3d™ architecture, which significantlyincreases the performance of S3’s 3D platform. The ViRGE/DX is DRAM-based and the ViRGE/GX isSDRAM/SGRAM-based.

• Plato/PX™ Integrated Platform Accelerator™. Based on a shared memory architecture (SMA), the Plato/PXintegrates a PC’s system controller and multimedia accelerator onto a single chip, eliminating the need for aseparate graphics subsystem.

• Scenic/MX2 MPEG-1 decoder (see above).• Sonic/AD programmable audio DAC (see above).

Products for mobile PC applications• Aurora64V+™ 64-bit multimedia accelerator. The Aurora64V+ provides notebook computer users with

desktop-equivalent graphics performance and multimedia capability, as well as the industry’s first dual displaysupport.


The majority of S3's silicon products are currently manufactured by IBM Microelectronics, Hewlett-Packard, TSMC,and UMC. In 1995, S3 entered into a partnership with UMC and Alliance Semiconductor to establish a new jointlyowned wafer foundry company in Taiwan called United Semiconductor Corporation (USC). S3 enjoys 20 percentownership in USC, which began processing 200mm wafers in 3Q96. S3 has the right to purchase up to about 31percent of the USC fab’s output. See UMC’s profile for data on USC’s fab facility.

1-302


Seeq Technology North American Company Profiles

SEEQ TECHNOLOGY

Seeq Technology, Inc.47200 Bayside Parkway


Fax: (510) 657-2837Web Site: www.seeq.com

Fabless IC Supplier


1992 1993 1994 1995 1996

Sales 37 33 21 23 31Net Income (11) (4) (8) 1 3R&D Expenditures 5 3 3 3 3

Employees 190 161 67 67 74


Seeq Technology was established in 1981 to develop, produce, and market EEPROMs. Over the years thecompany has undergone a series of transitions that has created a company that is today much different than it wasfounded to be. Seeq began developing Ethernet products in 1982 and adopted a strategy to have its productsmanufactured by outside foundries in 1989. As a result of the foundry alliances that were established, thecompany shut down its wafer fab facility in 1992 and thus became a fabless IC supplier. In early 1994, thecompany abandoned the market it had itself created by selling its EEPROM business to competitor AtmelCorporation for $10 million. Additionally, the company's Ethernet adapter board product line was discontinued inearly 1994.

Seeq now focuses exclusively on local area network (LAN) communication devices and subsystems. Theseproducts are targeted at system manufacturers in the personal computer, workstation, printer, networking, andtelecommunications markets. Fast Ethernet devices accounted for 31 percent of total revenues in 1996.


North American Company Profiles Seeq Technology

U.S.75%

Asia-Pacific19%


Europe 6%

Management

Alan V. Gregory ChairmanPhillip J. Salsbury, Ph.D. President and Chief Executive OfficerStephen Dreyer Vice President, EngineeringWalter B. Gebaur Vice President, ManufacturingBarry Gray Vice President, MarketingRobert O. Hersh Vice President, Finance and Chief Financial OfficerPhilip A. Ortiz Vice President, Worldwide SalesAlbert Schadlick Vice President, Eastern Sales


Seeq supplies Ethernet data communication controllers, encoder/decoders, coaxial and unshielded twisted paircable CMOS transceivers, and networking modules. The company also sells media signaling ICs for the high-speed ATM (Asynchronous Transfer Mode) LAN market. Its products are designed using proprietary digital andmixed-signal CMOS processes, including submicron technologies (0.8µm and 0.6µm).


Seeq has established several agreements with wafer-based and ASIC-based foundry suppliers. Its volume waferprocessing partners are AMI, Hualon Microelectronics Corporation (HMC), Ricoh, and Rohm. VLSI Technologyand Samsung are used for turn-key manufacturing using either a standard cell or a gate array approach.

Key Agreements

• In 1995, Seeq re-established its foundry relationship with HMC for the manufacture of its mixed-signal productswith an agreement that guarantees foundry services through July 1998. Seeq is also sharing resources withHMC to co-develop new generations of analog circuits for Ethernet data communications products.

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Semtech North American Company Profiles

SEMTECH

Semtech Corporation652 Mitchell Road

Newbury Park, California 91320Telephone: (805) 498-2111

Fax: (805) 499-5487Web Site: www.semtech.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends January 31

1993 1994 1995 1996 1997

Sales 20 21 36 62 65Net Income 0.4 1 2 7 8R&D Expenditures 1 1 2 3 4Capital Expenditures 1 4 4

Employees 340 372 500 505


Semtech Corporation, incorporated in 1960, manufactures and markets a wide variety of semiconductor productsfocused at both commercial and military applications. Initially, Semtech only supplied semiconductor devices tothe military and aerospace industries. However, in 1990, Semtech began its migration into commercial marketswith the acquisition of Lambda Electronics. This equipped Semtech with an IC fab facility in Corpus Christi, Texas.In 1992, the company acquired Modupower Inc., a supplier of solid state modules, further moving Semtech intothe commercial marketplace. In late 1995, Semtech acquired ECI Semiconductor, an analog semiconductormanufacturer located in Santa Clara, California. From ECI, Semtech gained new process technology, additionalwafer fab capacity, and ECI’s foundry customer base.

Today, Semtech’s primary focus is on the personal computer and telecommunications markets, though it stillmaintains a presence in the military and aerospace markets. In fiscal 1997, military and aerospace revenuesaccounted for 14 percent of total revenues, down from 40 percent in 1995.


North American Company Profiles Semtech


European13%

North America54%

Far East33%

Military and Aerospace

14%


Industrial22%

Computer41%

Communications8%

Foundry15%

Management

John D. Poe President and Chief Executive OfficerRaymond E. Bregar Executive Vice President, Corporate OperationsDavid I. Anderson Vice President, IC Design and DevelopmentDavid G. Franz, Jr. Vice President, Finance, and Chief Financial OfficerJean Claude Zambelli Vice President, Sales and Marketing


Semtech offers a wide range of integrated circuits and discrete devices including transient voltage suppressors,linear and switching voltage regulators, DC-to-DC power modules, rectifiers, high voltage monolithic ceramiccapacitors, and modular assemblies.

Through its acquisition of ECI Semiconductor, Semtech now offers linear and mixed-signal CMOS arrays, linearbipolar arrays, standard analog circuits, and RF discretes, in addition to offering foundry services.


Semtech Corpus Cristi Semtech Santa Clara (formerly ECI Semiconductor)121 International Boulevard 975 Comstock StreetCorpus Christi, Texas 78406 Santa Clara, California 95054Telephone: (512) 289-0403 Capacity (wafers/week): 2,000Wafer size: 100mm Wafer sizes: 100mm, 125mmProcess: Bipolar Processes: CMOS, bipolarProducts: Linear ICs Products: ASICs, linear ICs, discretes, foundryFeature size: 3.0µm Feature sizes: 3.0µm, 4.0µm, 5.0µm

Semtech Corporation652 Mitchell RoadNewbury Park, California 91320Telephone: (805) 498-2111Products: Discretes

1-306


Sensory North American Company Profiles

SENSORY

Sensory, Inc.521 East Weddell Drive


Fax: (408) 744-1299Web Site: www.sensoryinc.com

Fabless IC Supplier

Employees 29


Founded in 1994, Sensory, Inc. is a privately held company that designs and markets high-quality low-cost ICs thatperform speech recognition, speaker verification, speech and music synthesis, audio record/playback, andgeneral purpose product control for consumer electronic applications, including telecommunications devices,interactive toys, home appliances, personal electronics, and security devices.

Management

Todd Mozer President and Chief Executive OfficerMark Frankel Vice President, SalesRobert Savoie Vice President, TechnologyKeith Kitami Director, Marketing


Sensory’s current products include the Interactive Speech™ line of integrated circuits (ICs). This family of chips isdesigned to “bring life to products” through Sensory’s speech and audio technologies. The Interactive Speechsingle-chip ICs utilize neural network technology to deliver high-quality low-cost speech recognition and speakerverification solutions to telecommunications and consumer electronic products.

Other services offered by Sensory include product specification, vocabulary development for recognition andsynthesis, circuit board design, application programming, product design consulting, and custom ICs.

Sensory’s complete product line is produced using a 0.6µm CMOS process technology.


North American Company Profiles Sierra Semiconductor

SIERRA SEMICONDUCTOR

Sierra Semiconductor Corporation2222 Qume Drive


Fax: (408) 894-0218Web Site: www.pmc-sierra.com/sierra_semi_site

Fabless IC Supplier


Europe: PMC-Sierra, Inc. • Warrington, Cheshire, United KingdomTelephone: (44) (1925) 651122 • Fax: (44) (1925) 650033


1992 1993 1994 1995 1996

Sales 92 83 105 189 188Net Income 12 (13) (9) 1 (51)R&D Expenditures 13 15 16 23 28

Employees 322 295 335 480 500


Founded in 1984, Sierra Semiconductor and its wholly owned subsidiary, PMC-Sierra, Inc., develop and markethigh-performance semiconductor system solutions for advanced communications applications. The companyparticipates in the broadband communications infrastructure and local area networking segments of thecommunications industry with its product lines of ATM (Asynchronous Transfer Mode), T1/E1, DS3/E3, andSonet/SDH ICs and subsystems developed and marketed by PMC-Sierra. Sierra also offers products formultimedia personal computers, such as highly integrated data and voice communications devices andgraphics/imaging products.

In August 1996, the company announced its decision to exit the PC modem chipset business and put the productline up for sale in an effort to focus on its networking and infrastructure semiconductor business. Also part of thiseffort was the acquisition of the Ethernet switching technology and assets of Bit, Inc., a small, fabless firm inBeaverton, Oregon. Bit was folded into PMC-Sierra and operates as a new product group focused on Ethernetapplications.

1-308


Sierra Semiconductor North American Company Profiles

Burnaby, British Columbia-based PMC-Sierra was originally established in 1992 as Pacific Microelectronics Centre,a spinoff of MPR Teltech Ltd., the research arm of the British Columbia phone company. The spinoff wassupported by a significant investment from Sierra for 61 percent of PMC’s stock. PMC was then fully acquired bySierra in the third quarter of 1994 and subsequently renamed PMC-Sierra.

International sales accounted for over 50 percent of Sierra’s total revenues in 1996.

Management

James V. Diller Chairman, President, and Chief Executive OfficerGlenn C. Jones Senior Vice President, Finance and Chief Financial OfficerGeorge D. Antenucci Vice President, Human ResourcesNaresh K. Batra Vice President and General Manager, Multimedia ProductsAlden J. Chauvin, Jr. Vice President, Worldwide SalesVictor Godbole Vice President, Strategic Planning and System EngineeringRaman K. Rao Vice President, OperationsMarc E. Robinson Vice President, Technology Development and QualityRobert L. Bailey President and Chief Executive Officer, PMC-Sierra, Inc.


Sierra's semiconductor product offerings include WAN and LAN chipsets and subsystems; audio, voice synthesis,and voice recognition circuits; and graphics and imaging products. Much of the company’s development effortsare focused on ATM and related products.

Sierra uses what it calls a "Triple Technology" process that uses its competencies in analog, digital, and EEPROMtechnologies to provide complex IC system solutions.


Sierra Semiconductor is a fabless IC operation, with the majority of its wafers (as much as 60 percent) beingmanufactured by Chartered Semiconductor. In 1987, the company formed Chartered Semiconductor as a fab-and-test joint venture with Singapore Technologies Industrial Corporation Pte. Ltd. Sierra originally held a minorityinterest in the venture and licensed Chartered Semiconductor to use its manufacturing processes and testtechnologies. In 1993, Singapore Technologies purchased all of the shares held by Sierra.

Sierra also uses Taiwan Semiconductor Manufacturing Co. (TSMC), LG Semicon, and IC Works for the fabricationof its wafers.


North American Company Profiles Signal Processing Technologies

SIGNAL PROCESSING TECHNOLOGIES (SPT)

Signal Processing Technologies, Inc.4755 Forge Road


Fax: (719) 528-2370Web Site: www.spt.com

Fabless IC Supplier

Employees 100


Signal Processing Technologies (SPT) is a supplier of high-performance data conversion and signal conditioningintegrated circuits. It was formed in 1983 as a business unit of Honeywell's semiconductor group. SPT was thenacquired in 1989 by a group of private investors and an employee team and was established as a separatecorporation. In June 1990, the company became a wholly-owned subsidiary of Japan's Toko, Inc., a worldwidesupplier of electronic components and integrated circuits.

Management

Ben Takada General ManagerRichard Mintle Director, Sales and MarketingAlfi Moscovici Director, EngineeringMike Ruebenson Director, Finance and Administration


SPT offers a portfolio of products that includes high-speed comparators and A/D and D/A converters. Thecompany's primary focus is on developing proprietary, high-performance signal conditioning and data conversionproducts. It has received funding from its parent to develop new analog products designed for a variety ofcommercial, industrial, and military applications.


Toko acts as the foundry for SPT. In late 1992, SPT purchased a former Digital Equipment Corp. R&D facility,which more than doubled the company's engineering and test area. The facility includes a 10,000 square-footspace that SPT may convert into a Class 10 or Class 1 fab in the future.

1-310


Siliconix North American Company Profiles

SILICONIX

Siliconix Incorporated(Member of TEMIC Semiconductors)

2201 Laurelwood RoadSanta Clara, California 95056-0951

Telephone: (408) 988-8000Fax: (408) 970-3950

IC Manufacturer


1992 1993 1994 1995 1996

Sales 155 171 197 250 269IC Sales 43 36 34 64 65Discrete Sales 112 135 163 186 204

Net Income 5 7 11 24 26R&D Expenditures 8 13 16 19 21Capital Expenditures 13 18 25 28 40

Employees 1,202 1,211 1,172 1,269 1,228


Founded in 1962, Siliconix designs, manufactures, and markets ICs and discrete components for switching, motorcontrol, and power management in computers, automotive, instrumentation, and telecommunicationsapplications. AEG Capital Corporation became a majority shareholder of the company in December 1990,increasing its ownership from 38 percent to 80 percent of the company's outstanding stock. In July 1992,Siliconix was joined with Telefunken Semiconductors, Matra MHS, and Dialog Semiconductor to form thesemiconductor division of TEMIC, the microelectronics group of Daimler-Benz AG, a German automotive,electronics, and aerospace conglomerate.

In 1996, Siliconix restructured its business to better reach its target markets. Power MOS, Power IC, and SignalProcessing product units were created with profit and loss responsibilities for their respective product lines. ThePower MOS and Signal Processing units report jointly to Siliconix and the Discrete Components Division of TEMICSemiconductors. The Power IC unit reports jointly to Siliconix and the Integrated Circuits Division of TEMICSemiconductors.


North American Company Profiles Siliconix

North America33%


Asia Pacific21%

Europe27%

Japan19%

Management

Richard J. Kulle President and Chief Executive OfficerKing Owyang Executive Vice President, Technology and Silicon OperationsJürgen F. Biehn Senior Vice President and Chief Financial OfficerMichael Gingrass Vice President, Environmental and Plant ServicesRod Graham Vice President, Worldwide SalesG. Thomas Simmons Vice President, Strategic Marketing and Business Development


Siliconix's power transistors and integrated circuits are mainly used for power management and motion control incomputers, hard disk drives, automobiles, and communications systems. The company's analog switches, analogmultiplexers, and low-power transistors are used to sense, switch, and route signals in video, multimedia,instrumentation, and test equipment in both industrial and hi-rel environments.

In 1996, sales of power MOSFETs, the company’s fastest growing product group, and power ICs accounted forabout 74 percent of total sales. Siliconix expects this percentage to increase as the company continues its pushinto the high-end disk drive market.

Power MOSFETsand Power ICs

74%


Analog Switch andLow-Power Discretes

26%

1-312


Siliconix North American Company Profiles

Siliconix provides products and technologies that directly answer the market's demand for smaller, more efficient,and more cost-effective components. The company's Lite Foot™ discrete power transistors are the industry'smost compact solution for motion control in hard disk drives and for load management in portable computers.These miniaturized products can be mounted directly on the printed circuit board, and are the first such powerdevices small enough to fit in a PCMCIA card. The company's Little Foot® line has been designed into telecomsystems, automotive air bag triggers, and numerous other applications where space-savings and efficiency are at apremium. In early 1997, Siliconix announced a family of specialized power MOSFETs as part of its Little Footproduct line. The devices are designed to work with most low-voltage pulse width modulation (PWM) controllers.Each of the five new devices is designed to handle a different power level, and thus each targets a differentapplication.

Siliconix's power integrated circuits combine the functions of two or more discrete transistors on one chip. A familyof high-frequency switchmode regulator and controller ICs designed for use with Lite Foot or Little Foot discretesoffers the optimal level of integration for DC-to-DC conversion in battery-operated equipment, including laptopand notebook computers. For data storage customers the company offers highly integrated chips for voice coiland spindle motor control. Other IC products include power interface devices for computers equipped with dualbattery packs or PCMCIA slots, power ICs for bus control in automobiles, and analog switches and multiplexers foruse in signal switching and routing in electronic instruments and industrial equipment.

Siliconix utilizes CMOS, DMOS, BiCMOS, and BiC/DMOS (BCDMOS) technologies in the manufacture of its ICand discrete products. The company's power ICs are manufactured using its proprietary self-isolated BCDMOStechnologies, which include the BCD15 process for producing power ICs operating from 2.5V to 15V and theBCD60 process for producing power ICs operating up to 60V.


Siliconix Incorporated Siliconix Incorporated2201 Laurelwood Road 2201 Laurelwood RoadSanta Clara, California 95056 Santa Clara, California 95056Fab 2 (Will be closed in 1997) Fab 3Capacity (wafers/week): 2,000 Capacity (wafers/week): 1,500Wafer size: 100mm Wafer size: 150mmProcesses: CMOS, DMOS, BiCMOS, BCDMOS Processes: CMOS, DMOS, BiCMOS, BCDMOSProducts: Linear and power ICs, discretes Products: Power ICs and discretesFeature size: 3.0µm Feature sizes: 0.8µm-1.5µm


North American Company Profiles Siliconix

Siliconix/TEMICItzehoe, GermanyCleanroom size: 44,000 square feet (Class 1)Wafer sizes: 150mm, 200mmProcesses: PowerMOS, BiCMOSProducts: Discretes

Siliconix also uses a foundry in Taiwan for the production of some of its cost-sensitive analog switch and low-powerdiscrete product lines.

High-volume assembly and product testing is handled at the company's facilities in Kaohsiung, Taiwan, a jointventure in Shanghai, China, called Simconix, and at subcontractors in the Philippines, India, Taiwan, and China. Alimited amount of assembly and product test is performed in Santa Clara.

1-314


Simtek North American Company Profiles

SIMTEK

Simtek Corporation1465 Kelly Johnson Boulevard


Fax: (719) 531-9481Web Site: www.csn.net/simtek

Fabless IC Supplier


1992 1993 1994 1995 1996

Sales 0.5 3 1 2 5Net Income (6) (6) (4) (3) 0.1R&D Expenditures 3 2 2 1 1

Employees 25 32 25 17 17


Simtek Corporation has designed, developed, and marketed non-volatile semiconductor memory products sinceit commenced business operations in 1987. Its concentration has been on the design and development of fastnvSRAMs (non-volatile SRAMs) and associated products and technologies.

Simtek's products are aimed at avionics subsystems, portable computers and instruments, medicalinstrumentation, navigation aids, robotics, telecommunications systems, and other high performance applications.Military product sales represented 36 percent of total sales in 1996.

North America47% International

53%



North American Company Profiles Simtek

Management

Richard L. Petritz Chairman, President, and Chief Executive OfficerJack Maxcy Vice President, ProductionAlbert S. Weiner Vice President, EngineeringSheldon A. Taylor Director


Simtek's nvSRAM product family includes 4K, 16K, 64K, and 256K devices with access speeds ranging from25ns to 45ns. The nvSRAMs utilize a unique patented memory cell technology called Novcel, which integratesfast SRAM and EEPROM elements in each cell. In late 1993, Simtek introduced its AutoStore™ nvSRAMs, whichautomatically detect power loss and transfer data from SRAM into EEPROM.

Simtek uses an advanced implementation of silicon-nitride-oxide-semiconductor (SNOS) technology in thedesign of its products. The company's Novcel technology is compatible with basic CMOS technology, allowingnvSRAM memory cells to be incorporated with other system level semiconductor products.

Simtek’s products are based on 1.2µm and 0.8µm process technologies. In 1996, products based on 1.2µmprocess technology represented 68 percent of sales, while products based on 0.8µm process technology madeup the remaining 32 percent.


Simtek has foundry agreements with Chartered Semiconductor Manufacturing (CSM) of Singapore and ZentrumMikroelektronik Dresden of Germany for the manufacture of its wafers.

Key Agreements

• Simtek signed an agreement with Zentrum Mikroelektronik Dresden (ZMD) in mid-1994 to install its 1.2µmprocess in ZMD's fab in Germany and to jointly develop 0.8µm process technology. The agreement was latermodified to bypass the installation of 1.2µm technology and instead install 0.8µm technology. ZMD alsoreceived a license to sell Simtek's 64K and 256K nvSRAMs built in the 0.8µm process.

In 1995, the two companies expanded their relationship to include the joint development of additionalnvSRAMs using the 0.8µm process. ZMD agreed to finance the development in exchange for shares inSimtek. In the second quarter of 1996, ZMD began supplying Simtek with 64K finished units based on 0.8µmprocess technology. ZMD is the largest shareholder of Simtek, owning 30 percent.

• Simtek entered into a manufacturing and development agreement with Chartered SemiconductorManufacturing (CSM) in 1992 for 64K through 1M nvSRAMs. CSM will provide Simtek with wafers at leastthrough 3Q97.

• Simtek established an agreement in 1989 with GEC Plessey Semiconductors under which GEC Plessey hasthe right to incorporate Simtek's non-volatile memory technology into its ASICs. In 1990, the agreement wasextended to grant GEC Plessey a worldwide license to manufacture and market Simtek's nvSRAM devices.

1-316


Single Chip Systems North American Company Profiles

SINGLE CHIP SYSTEMS

Single Chip Systems Corporation10905 Technology Place

San Diego, California 92127Telephone: (619) 485-9196

Fax: (619) 485-0561

Fabless IC Supplier


Single Chip Systems (formerly Instant Circuit Corporation) was established in 1992 to design and sell electricallyprogrammable integrated circuits that employ patented antifuse technology. Specifically, Single Chip Systems isdeveloping IC products for the radio frequency identification (RF/ID) market. The company also assembles its ICsinto electronic ID tags. The company has not yet sold ICs of its own, but has produced test wafers.

Management

Bruce B. Roesner, Ph.D. Chairman and Chief Technical OfficerJacob Jacobson President and Chief Executive OfficerGregory A. Bohdan Vice President and Chief Financial Officer


The company's first product is an electronic ID tag and scanner system that offers a significant increase inperformance and decrease in cost compared to existing systems.


Single Chip Systems' ICs are manufactured at independent foundries.


North American Company Profiles Sipex

SIPEX

Sipex Corporation22 Linnell Circle

Billerica, Massachusetts 01821Telephone: (508) 667-8700

Fax: (508) 667-8310Web Site: www.sipex.com

IC Manufacturer


Japan: Nippon Sipex Corporation • Chiyoda-ku, Tokyo, JapanTelephone: (81) (3) 3254-5822 • Fax: (81) (3) 3254-5824

Europe: Sipex SARL • Rungis Cedex, FranceTelephone: (33) (1) 4687-8336 • Fax: (33) (1) 4560-0784


1992 1993 1994 1995 1996

Sales 29 28 23 30 23Net Income (8) (4) (5) (2) 4R&D Expenditures 2 2 3 4 5Capital Expenditures 1 1 1 2

Employees 220 247


Sipex Corporation is a leading designer and manufacturer of high-performance, high valued-added analogintegrated circuits. The company is focused on three market areas: data communications andtelecommunications; battery powered/portable products; and industrial controls/instrumentation. Sipex servesthese market sectors with three primary product lines: interface circuits, low power application-specific analogcircuits, and data converter products. The company pioneered the design, development, and manufacture ofelectroluminescent lamp (EL) driver circuits.

1-318


Sipex North American Company Profiles

Sipex was established in 1965 under the name Hybrid Systems Inc. and until the late 1980’s focused on thedesign and manufacture of data conversion products utilizing hybrid technology, primarily for the military market.The company merged with DataLinear Corporation in 1986 and then with Dielectric Semiconductor Inc. in 1987, atwhich time the company name was changed to Sipex Corporation. Then in 1988, the company acquired BarvonBiCMOS Technology, Inc., a designer and manufacturer of custom and standard monolithic products forcommercial markets. The development of new standard hybrid products was discontinued in 1989, and while thecompany continues to support the military markets with existing hybrid products, its focus today is on commercialproducts.

Commercial80%

Military20%


International sales account for approximately 42 percent of the company’s net sales in 1996.

Management

James E. Donegan Chairman, President, and Chief Executive OfficerFrank R. DiPietro Executive Vice President and Chief Financial OfficerRaymond W.B. Chow Senior Vice PresidentSanford Cohen Senior Vice President, Technology


Sipex offers both standard and custom products. The standard products include interface (line drivers/receivers),electroluminescent lamp driver circuits, data conversion products, and other linear products, while the customproducts include full-custom monolithic ICs and custom multichip products. The company also providesdielectrically isolated silicon substrates to a broad spectrum of semiconductor manufacturers.

For interface products, Sipex offers a full line of products, including low-power single interface productssupporting RS-232 and RS-485 standards and programmable multi-mode serial interface transceivers allowingsingle chips to communicate in up to eight different standards. These products are fabricated in a high-voltageBiCMOS process technology and specialize in low-power 5V-only operation.

The low-power application-specific products utilize a proprietary dielectrically isolated (DI) BiCMOS processtechnology that allows both very low voltages (1V) and very high voltages (100V) to be used simultaneously onthe same IC. The company’s EL driver circuits are based on this specialized process.

For data converter products, Sipex specializes in high-accuracy 12-bit A/D and D/A converters.


North American Company Profiles Sipex

The broad base of semiconductor processes and technologies used by Sipex enable it to design productsoptimized for each application. Sipex focuses on leveraging its specialized dielectrically isolated BiCMOStechnology, which the company believes is particularly well suited to the low-power, low-voltage requirements ofbattery powered/portable products.

The company utilizes its own fabrication facility for producing 3.0µm to 5.0µm dielectrically isolated complementarybipolar and BiCMOS linear devices, and has strategic foundry relationships for producing 0.8µm to 4.0µmBiCMOS and CMOS linear devices.


As already mentioned, the company’s own wafer fabrication facility produces products utilizing the company’s DIcomplementary bipolar and BiCMOS processes. The company’s BiCMOS and CMOS products are manufacturedusing fully processed wafers supplied primarily by UMC, Orbit Semiconductor, and Calogic Corporation.

Sipex Corporation491 Fairview WayMilpitas, California 95035Telephone: (408) 945-9080Fax: (408) 946-6191Capacity (wafers/week): 500Wafer size: 100mmProcesses: Bipolar, BiCMOSProducts: Linear ICsFeature sizes: 3.0µm-5.0µm

1-320


Space Electronics North American Company Profiles

SPACE ELECTRONICS (SEI)

Space Electronics, Inc.4031 Sorrento Valley Boulevard


Fax: (619) 452-5499Web Site: www.newspace.com/spaceelec

Fabless IC Supplier


1995 1996

Sales 4 10


Space Electronics, Inc. (SEI) was established in 1992 as a spin-off of Science Applications InternationalCorporation (SAIC) Microelectronics Technology Center. The focus of Space Electronics is to address the nichemarket of spacecraft microcircuits. The company’s proprietary Rad-Pak™, Rad-Coat™, and LPT™ technologiesenable off-the-shelf commercial microelectronic components to survive the typical radiation levels encountered inspace.

Management

Robert Czajkowski Chief Executive OfficerDavid J. Strobel PresidentPaul Blevins Chief Financial OfficerDavid Czajkowski Manager, MarketingEdward Li Manager, SalesStuart Shanken Manager, Products


Space Electronics' products and services include power MOSFETs, A/D and D/A converters, FPGAs, logic ICs,interface ICs, memory (EEPROMs, DRAMs, SRAMs, flash memories, and FIFOs), processors, and coprocessors.

For demanding imaging requirements, Space Electronics provides high performance Megatek® 2D graphicsaccelerator cards in “S” bus and VME bus configurations.


North American Company Profiles SST

SILICON STORAGE TECHNOLOGY (SST)

Silicon Storage Technology, Inc.1171 Sonora Court


Fax: (408) 735-9036Web Site: www.ssti.com

Fabless IC Supplier


Japan: Silicon Storage Technology Asia • Yokohama, JapanTelephone: (81) (45) 471-1851 • Fax: (81) (45) 471-3285


1992 1993 1994 1995 1996

Sales 1* 4* 4 40 93Net Income 1 0.2 (5) 6 12R&D Expenditures 1 2 3 4 7

Employees 143

*Primarily license revenues


Silicon Storage Technology (SST) was founded in 1989 and is a supplier of non-volatile memories, specificallyflash memory devices. The company currently offers medium density devices ranging from 512K to 4M, for arange of applications in the computer, communications, multimedia, and video game markets.

Product development at SST is focused on developing new memory products featuring higher densities, such as16M and 32M flash memories, for use in digital cameras, memory cards, and digital cellular phones. For thecompany’s higher density products, the company is also developing advanced process technologies.

SST made its initial public offering in November 1995.

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SST North American Company Profiles

Taiwan39%


U.S.14% Japan

20%

Other27%

Management

Bing Yeh Chairman, President, and Chief Executive OfficerThomas A. Freeze Executive Vice President and Chief Operating OfficerYaw-Wen Hu Vice President, Technology Development and Wafer ManufacturingIsao Nojima Vice President, Memory Design and Product EngineeringMichael J. Praisner Vice President, Finance and Administration, and Chief Financial OfficerDavid Sweetman Vice President, Quality and Customer SupportAmy Yuen Vice President, Operations


Page Mode Flash Memories—512K Page Mode Flash Memory—2.7V-, 3V-, and 5V-only1M Page Mode Flash Memory—2.7V-, 3V-, and 5V-only2M Page Mode Flash Memory—2.7V-, 3V-, and 5V-only

Page Erase, Byte Program Flash Memories4M SuperFlash Flash Memory—2.7V-, 3V-, and 5V-only4M PCMCIA Interface Flash Memory—3V- and 5V-only

The company’s products are designed and manufactured using the company proprietary SuperFlash™ CMOStechnology.


SST is a fabless company, therefore, its uses independent foundry companies for the manufacturing of itsdevices. The company’s primary foundry partners are Sanyo and Winbond, but SST also has foundry andlicensing agreements with TSMC and Seiko Epson.


North American Company Profiles SST

Key Agreements

• In February 1997, SST signed an agreement with foundry partner TSMC for the production of its 2M products.As part of the agreement, SST licensed its SuperFlash technology to TSMC in exchange for manufacturedwafers.

• In 1996, SST licensed its SuperFlash technology to Seiko Epson and established a foundry agreement forproduction capacity.

• SST established a foundry agreement with Sanyo that provides wafer production capacity to SST through2009. SST has a similar agreement with Winbond that expires in 2008.

• SST licensed Rockwell the right to use its technology to produce and market 0.8µm embedded modem chips.The company has similar agreements with ISD and Analog Devices.

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Standard Microsystems North American Company Profiles

STANDARD MICROSYSTEMS (SMC)

Standard Microsystems CorporationComponent Products Division

80 Arkay DriveHauppauge, New York 11788-9725

Telephone: (516) 435-6000Fax: (516) 271-6004

Web Site: www.smc.com

IC Manufacturer


Japan: Toyo Microsystems Corporation (SMC Subsidiary) • Tokyo, JapanTelephone: (81) (3) 5721-2271 • Fax: (81) (3) 5721-2270

Europe: Standard Microsystems GmbH • Munich, GermanyTelephone: (49) (89) 92861170 • Fax: (49) (89) 92861190

Asia-Pacific: Standard Microsystems Corporation • Taipei, TaiwanTelephone: (886) (2) 578-7118 • Fax: (886) (2) 579-1737

Financial History ($M), Fiscal Year Ends February 28

1993 1994 1995 1996 1997

CorporateSales 251 323 379 342 354Net Income 16 20 24 12 (21)



Standard Microsystems Corporation (SMC) is comprised of two complementary business divisions: ComponentProducts and System Products. The System Products Division designs, produces, and markets hardware andsoftware products for the PC local area network (LAN) market. The Component Products Division develops,manufactures, and markets VLSI microperipheral circuits. Its products are sold chiefly in the PC market forinput/output and network control applications, and in industrial and transportation markets for network controlapplications.


North American Company Profiles Standard Microsystems

SMC was strictly a chip manufacturer when it was founded in 1971. Then, in the early 1980's, the SystemProducts Division was created and in 1991, Western Digital's LAN Products Division was acquired. The company'snetworking business grew to represent as much as 90 percent of total revenues (fiscal 1993). However, demandfor the Component Products Division’s products has been strong over the past few years, boosting its share oftotal revenues to 50 percent in fiscal 1997.

To further its advancement into the chipset market, the Component Products Division announced the acquisitionof EFAR Microsystems, Inc. in early 1996. Technologies obtained from the acquisition include the UltraCore™ PCIPC systems logic chipset for 64-bit microprocessors and the UltraCache™ PCI core logic chipset with integratedcache memory. The UltraCore was developed in cooperation with MoSys Inc. EFAR now operates as a separatebusiness unit called the Personal Computer Systems Logic Business Unit within the Component ProductsDivision of SMC.

In early 1997, SMC made its move toward the application specific memory (ASM) market by purchasing a 20percent equity stake in Ontario, Canada-based Accelerix. As part of the agreement, SMC gained rights to market,second-source, and enhance technology developed by Accelerix. SMC plans to combine its skills with those ofother companies associated with Accelerix to pursue the PC semiconductor market with “system-on-a-chip”devices that employ ASM technology.

Management

Standard Microsystems CorporationPaul Richman Chairman and Chief Executive OfficerEric M. Nowling Acting Chief Financial OfficerArthur Sidorsky Executive Vice President, Component Products DivisionLance Murrah Senior Vice President and General Manager, System Products DivisionReginald R. Maton, Jr. Vice President and Chief Information Officer

SMC’s Component Products DivisionJohn E. Burgess Vice President, SalesDouglas L. Finke Vice President and GM, Wafer Foundry Business UnitLawrence H. Goldstein Vice President, EngineeringR. Hollingsworth Vice President, MarketingPeter Ju Vice President, Personal Computer Systems Logic Business UnitDi Ma Vice President, Component Products Operations


SMC's IC product and service offerings include the following:

• Personal computer I/O devices that perform many of the basic input/output functions required in every PC,including floppy disk control, IDE hard disk interface, parallel port control, and serial port control. Included is afamily of Super I/O devices that integrate all of the above functions on a single IC. The Super I/O family includesother new products such as a single-chip PCI-to-IDE hard disk interface.

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Standard Microsystems North American Company Profiles

• Highly integrated single-chip Ethernet products such as an IC that incorporates an encoder/decoder, 10Base-Ttransceiver, AT bus interface, and memory management unit (MMU) on a single chip.

• ARCNET LAN devices for use in PCs and in industrial networking environments.

• Foundry services for customers desiring wafer fabrication capacity for 1.6µm geometries and above or forspecialized semiconductor processing requirements that require unique thin film expertise. In early 1997, SMCannounced plans to fully convert its fab to a foundry for the production of micro-electro-mechanical systems(MEMS), which are tiny systems such as sensors, motors, and valves used in a variety of applications. SMC hasbeen producing MEMS for several years.


SMC utilizes a mix of internal and external wafer fabrication sources to manufacture its products. Its more matureproducts are produced at its fab in New York, while newer products, utilizing 0.6µm and 0.5µm technologies areproduced by external wafer foundries in the U.S., Europe, and Asia. SMC’s core-logic products (acquired withEFAR) are built by TSMC in Taiwan.

In 1995, SMC made a $12 million investment in Lucent Technologies’ Madrid fab and a $20 million investment inChartered Semiconductor to enhance its external wafer supply (see Key Agreements).

Standard Microsystems CorporationComponent Products Division35 Marcus BoulevardHauppauge, New York 11788Capacity (wafers/week): 1,500Wafer size: 100mmProcesses: CMOS, MOSProducts: LAN ICs, disk controllers, discretes, foundry servicesFeature sizes: 1.6µm-3.0µm(This fab is being fully converted toa dedicated MEMS foundry.)

Key Agreements

• SMC and Intel agreed to work together to integrate new semiconductor I/O chips into selected Intel PCmotherboard designs through the end of 1997. SMC will provide Intel with the I/O devices, which have beenspecifically designed to work with Intel’s newer microprocessors and core logic chipsets. Intel holds a 10percent equity interest in SMC.


North American Company Profiles Standard Microsystems

• In 1995, SMC made a $20 million investment in Singapore-based foundry Chartered SemiconductorManufacturing (CSM) in return for guaranteed capacity from CSM's new 200mm wafer fab that came on-line in2H95.

• SMC struck a foundry deal with Lucent Technologies in 1994 under which SMC agreed to boost the capacity ofLucent's fab facility in Madrid, Spain, in return for a guaranteed portion of the fab output over a five-year period.The new equipment has the capability to produce devices with 0.9µm to 0.45µm feature sizes. SMC receivedits first wafers in 1996.

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Supertex North American Company Profiles

SUPERTEX

Supertex, Inc.1235 Bordeaux Drive


Fax: (408) 734-5247Web Site: www.supertex.com

IC Manufacturer


1993 1994 1995 1996 1997

Sales 24 26 32 43 49Net Income 2 3 5 7 9R&D Expenditures 4 4 4 6 5Capital Expenditures 1 1 2 5 n/a

Employees 240 235 265 274 280


Established in 1976, Supertex is a niche-oriented company that designs, develops, manufactures, and marketshigh voltage semiconductor products utilizing advanced DMOS and HVCMOS process technologies. Supertexmerged CMOS and DMOS processes creating its proprietary HVCMOS® technology. The company originallyconducted business as a foundry. However, starting in fiscal 1990, and through fiscal 1992, the company'sfoundry business was phased out as sales of proprietary products steadily increased.

Supertex's proprietary products are sold to electronic equipment manufacturers in the computer,telecommunications, instrumentation, defense, medical, and consumer products industries. More specifically,Supertex's products are targeted at applications in ultrasound imaging and medical electronics, flat panel displays,non-impact printers and plotters, telecommunications, and high-reliability military and commercial aerospacesystems.

United States56%


Europe andFar East

44%


North American Company Profiles Supertex

Management

Henry C. Pao, Ph.D. President and Chief Executive OfficerRichard E. Siegel Executive Vice PresidentBenedict C.K. Choy Senior Vice President, Technology Development and IC ProductsMichael V. Bond Vice President, DMOS Products


Supertex has developed advanced technologies using CMOS and DMOS (Double-diffused MOS) processes. Itpioneered the merging of CMOS and DMOS processes into its proprietary HVCMOS® (high-voltage CMOS)technology. This process allows for the combination of the high speed and low power logic circuit of CMOS andthe high voltage output drive of DMOS on the same chip, thus creating the high voltage IC, or HVIC. Supertexintends to maintain a leadership position in the HVIC segment of the semiconductor industry.

• The DMOS product line includes depletion-mode and low-threshold enhancement-mode transistors andarrays.

• The CMOS products encompass a range of offerings from microprocessor supervisory ICs to encoder/decoderand smoke detector chips.

• There are three distinct categories of HVIC products available, digital products, analog products, and BiCMOSproducts.

• The digital product family includes driver/interface ICs for flat panel displays and non-impact printers andplotters.

• The analog product family includes high voltage analog switches and multiplexers, which are used in themedical ultrasound imaging industry, and pulse width modulators (PWMs).

• The BiCMOS product family consists of DC/DC converters and power supply ICs.


Supertex, Inc.1225 Bordeaux DriveSunnyvale, California 94088-3607Cleanroom size: 13,000 square feetCapacity (wafers/week): 1,500Wafer size: 100mmProcesses: CMOS, DMOS, HVCMOS, BiCMOSProducts: High-voltage ICs, discretesFeature size: 3.0µm

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Supertex North American Company Profiles

Key Agreements

• Supertex made an agreement with Texas Instruments in 1991 that provided TI the rights to use Supertex'sHVCMOS process technologies in return for license fees and royalties, as well as access to TI's foundry andassembly services.

• Supertex has received funding from the U.S. Government's ARPA agency to research and develop dielectric-isolation (DI) technology. The goal of the project is to further raise the voltage and operating speed of ICs.


North American Company Profiles Symbios Logic

SYMBIOS LOGIC

Symbios Logic Inc.2001 Danfield Court

Fort Collins, Colorado 80525-2998Telephone: (970) 226-9550

Fax: (970) 226-9660Web Site: www.symbios.com

IC Manufacturer


Europe: Symbios Logic • Munich, GermanyTelephone: (49) (89) 547470-0 • Fax: (49) (89) 547470-39

Asia-Pacific: Symbios Logic • SingaporeTelephone: (65) 337-6323


1992 1993 1994 1995 1996

Sales 228 274 354 520 600

Employees 1,950 2,010 2,200 2,300


Symbios Logic was established in February 1995 when Hyundai completed the purchase of the NCRMicroelectronic Products Division from AT&T Global Information Solutions Co., a wholly owned subsidiary of AT&TCorporation. Originally established in 1996, NCR Microelectronic Products Division was acquired as part of NCRCorporation in 1991 by AT&T Corporation (NCR Corporation was later named AT&T Global Information Solutions).Hyundai renamed the division Symbios Logic, Symbios being a derivative from the word symbiosis, meaning amutually beneficial relationship.

Symbios Logic, now a wholly owned, independently operated subsidiary of Hyundai Electronics America,manufactures semicustom ICs including cell-based ASICs and gate arrays, as well as a family of application-specificstandard products (ASSPs). Its cell library includes extensive analog functions for cell-based mixed-signal ASICsand complex standard function macrocells (cores) for embedded SCSI, Ethernet, disk drive electronics, and serialcommunications. Symbios Logic is a leader in bus interface technology, offering high-performance application-specific SCSI (including an extensive family of PCI-SCSI I/O controllers), Ethernet parts, and RAID subsystems andcontrollers.

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Symbios Logic North American Company Profiles

Several firsts claimed by the company include the first SCSI protocol chip, the first OEM RAID chipset, and the firstFibreChannel RAID Controller board. The company believes it holds 33 percent of the worldwide SCSI chipmarket, and 15 percent of the worldwide market for disk and tape drive electronics.

Management

H. Gene Patterson (acting) President and Chief Executive OfficerC.S. Chung Vice President, Global Planning and Coordination,

and Chief Financial OfficerJeff Dumas Vice President, General Counsel, and SecretaryDan Ellsworth Vice President, TechnologyGlenn Gainley Vice President, Business UnitsTom Lagatta Vice President, World SalesAl Lofthus Vice President, MarketingTim McCarthy Vice President, Manufacturing


Symbios Logic is comprised of five business groups: Client/Server, OEM RAID, MetaStor, Drive Electronics, andASIC Solutions. Listed below are the major products of each business group.

Client/Server Products• Client and server I/O products including SCSI devices.• Communications products including LAN communications devices.• SCSI host adapter boards.

OEM RAID• RAID-related products including RAID/disk array controller boards, I/O adapter boards, and OEM storage

subsystems.

MetaStor• Storage related products including RAID/disk array subsystems and tape arrays.

Drive Electronics• Disk, tape, and CD-ROM drive electronic products, including data controllers, servo subsystems, and

peripheral interfaces.

ASIC Solutions• ASIC products include CMOS cell-based ASICs, both digital and mixed-signal, CMOS gate arrays, and complex

SYMCore™ core-related products. In November 1996, Symbios unveiled its 0.35µm, five-layer-metal, one-million-gate, cell-based ASIC family. The company’s cell and core libraries support a wide range of ASICapplications, including set-top boxes, cellular phones, PCs, workstations, telecommunications, LAN andwireless communications, and electronic data processing. Submicron mixed-signal CMOS ASICs account formore than one-third of Symbios’ cell-based ASIC sales.


North American Company Profiles Symbios Logic


Symbios Logic Inc. Symbios Logic Inc.2001 Danfield Court 1635 Aeroplaza DriveFort Collins, Colorado 80525 Colorado Springs, Colorado 80916Telephone: (970) 223-5100 Telephone: (719) 596-5795Cleanroom size: 24,500 square feet Cleanroom size: 24,500 square feetCapacity (wafers/week): 4,300 Capacity (wafers/week): 5,000Wafer size: 150mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: ASICs, ASSPs, logic ICs, foundry services Products: ASICs, ASSPs, logic ICsFeature sizes: 0.7µm-2.0µm Feature sizes: 0.35µm-2.0µm

Approximately 20 percent of Symbios Logic’s IC products are manufactured by Hyundai.

Key Agreements

• Symbios Logic Inc. formed an alliance with Hyundai Electronics Industries (HEI) and Compass DesignAutomation to develop a new deep sub-micron 0.35µm five-layer metal CMOS technology. The program wassuccessfully completed in early 1997. The partnership will likely be extended to the 0.25µm level.

• In 1995, Symbios licensed Advanced RISC Machines Ltd.’s “Thumb” 32-bit RISC processor core for use in I/Ochannel controllers and other intelligent peripheral products.

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Synergy Semiconductor North American Company Profiles

SYNERGY SEMICONDUCTOR

Synergy Semiconductor Corporation3450 Central Expressway


Fax: (408) 737-0831Web Site: www.synergysemi.com

IC Manufacturer


1993 1994 1995 1996

Sales 14 19 26 30



Founded in 1987, Synergy Semiconductor Corporation designs, develops, manufactures, and markets high-performance digital and mixed-signal integrated circuits using bipolar and BiCMOS processes. Synergy’sproducts include precision time-clock generators for computers and workstations, and communications circuits forlocal and wide area networks. Synergy’s products employ proprietary design and process technology, resulting inhigh-performance ICs. The company’s products are designed by an internal design team, and built in thecompany’s in-house wafer fabrication facility.

Management

Thomas D. Mino President and Chief Executive OfficerT. Olin Nichols Chief Financial OfficerGeorge W. Brown Vice President, New Business DevelopmentTom Lauer Vice President, SalesLarry J. Pollock Vice President, Research and DevelopmentLuke Smith Vice President, OperationsE. Marshall Wilder Vice President, Quality and AdministrationThomas S. Wong Vice President, Engineering


Synergy supplies high-speed ICs to a range of systems vendors of public network equipment, such asmultiplexers and digital access cross-connect systems (DACS); LAN and WAN private network equipment, such asadapter cards and hubs; high-performance workstations and superservers; and automatic test equipment (ATE).


North American Company Profiles Synergy Semiconductor

Synergy’s products encompass three families: the ECLinPS and Super300K family of ultra-high-speed ECL logicproducts, the ClockWorks family of clock generation and distribution devices, and the SuperCOM family of opticalfiber transceivers, copper wire transceivers, and clock recovery devices. Synergy recently introduced a family ofnetwork and communication products for Fast Ethernet, FDDI, ATM, SONET, and SDH applications utilizing itsproprietary bipolar ASSET™ (All Spacer Separated Element Transistor) technology.


Synergy Semiconductor System Microelectronic Innovation GmbH (SMI)3450 Central Expressway Wildbahn, MarkendorfSanta Clara, California 95051 O-15203 Frankfurt (Oder), GermanyTelephone: (408) 730-1313 Telephone: (49) 335-46-2200Cleanroom size: 7,000 square feet Capacity (wafers/week): 2,400 (10,500 max.)Capacity (wafers/week): 500 Wafer size: 100mmWafer size: 100mm Processes: Bipolar, BiCMOSProcesses: Bipolar, BiCMOS Products: Logic, memory, and linear ICs, ASICsProducts: Transceivers, SRAMs, logic products, Feature sizes: ≥1.2µm clock control circuits, FIFOs, translators (Joint venture between Synergy and the GermanFeature sizes: 1.2µm, 1.5µm (bipolar); government. Synergy holds a 49 percent stake.)

1.0µm (BiCMOS);submicron in development

Wafer probing and packaged product test capabilities are performed in-house.

Key Agreements

• In April 1995, Synergy entered into a technology license agreement with Linear Technology Corporation.Under the agreement, Synergy gave LTC the right to use the its bipolar ASSET technology to develop non-competitive products.

• In March of 1993, Synergy entered into a agreement with the German government to form SystemMicroelectronic Innovation (SMI). This is a joint venture which is currently 49 percent owned by Synergy and 51percent owned by the German government. As part of this agreement, Synergy transferred its ASSETtechnology to SMI, enabling it to produce Synergy's family of ECL SRAMs, logic ICs, clock control circuits,translators, and semicustom products and market them throughout Europe.

• Synergy entered into a comprehensive strategic alliance with Toshiba Corporation in November 1990. Thealliance covers foundry, joint R&D and manufacturing, technology licensing, and an equity investment inSynergy by Toshiba. Under terms of the manufacturing agreement, Toshiba is providing Synergy with the useof a high-volume (150mm, submicron) IC fabrication line, which is running Synergy's high-performance ASSETand BiCMOS technologies. This fab allows Synergy to produce its current SRAM and logic products, as well asfuture products.

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TelCom Semiconductor North American Company Profiles

TELCOM SEMICONDUCTOR

TelCom Semiconductor, Inc.1300 Terra Bella Avenue

P.O. Box 7267Mountain View, California 94039-7267

Telephone: (415) 968-9252Fax: (415) 967-1590

Web SIte: www.telcom-semi.com

IC Manufacturer


Europe: TelCom Semiconductor GmbH • Martinsried, GermanyTelephone: (49) (89) 89-56-500 • Fax: (49) (89) 89-56-5002

Asia-Pacific: TelCom Semiconductor H.K. Ltd. • Kowloon, Hong KongTelephone: (852) 2324-0122 • Fax: (852) 2354-9957


1994 1995 1996

Sales 25 39 38Net Income 1 4 (1)R&D Expenditures 1 3 4Capital Expenditures 2 4 1



TelCom Semiconductor emerged in December 1993 as a result of a management-led buy-out of TeledyneIndustries' Teledyne Components division. The operation's history stretches back to 1960 when TeledyneIndustries began Amelco Semiconductor, one of Silicon Valley's first semiconductor firms. In 1970, Amelcomerged with Continental Devices to form Teledyne Semiconductor. That company was then combined with threeother Teledyne divisions – Philbrick, Crystalonics, and TAC – in 1990 to form Teledyne Components. Prior to theformation of TelCom, Teledyne Components' management shut down parts of the company – Philbrick and TAC –and sold the Crystalonics line. TelCom made its initial public offering in July 1995.

Today, TelCom Semiconductor is building on Teledyne's strengths in analog and mixed-signal technology todevelop standard ICs for high-volume consumer and commercial markets. TelCom's future growth strategycenters on the acquisition of mixed-signal technologies addressing the portable computing, communications, andinstrumentation markets. The company has also said it will target energy management products.


North American Company Profiles TelCom Semiconductor

U.S.37%


Europe25% Asia

38%

Management

Phillip M. Drayer President and Chief Executive OfficerEdward D. Mitchell Vice President, Engineering and Chief Technical OfficerR. Michael O'Malley Vice President, Chief Operating Manager, and Chief Financial OfficerGary P. Pinelli Vice President, Sales and MarketingAli Tasdighi Vice President, New Product DevelopmentAllan I. Resnick Director, Operations


TelCom's main products are divided into three areas of focus:

• Mixed-signal ICs: includes A/D converters, V/F and F/V converters, and voltage references.• Power management ICs: includes MOSFET power drivers, PWM controllers, DC/DC converters, switching

regulators, CMOS voltage detectors, microprocessor supervisor circuits, and charge pumps.• Smart sensors: includes solid-state thermal management and battery management control ICs.


TelCom Semiconductor, Inc.1300 Terra Bella AvenueMountain View, California 94039Cleanroom size: 9,000 square feetCapacity (wafers/week): 1,000Wafer size: 125mmProcesses: Silicon- and metal-gate CMOS, BiCMOS,

CMOS/DMOS, DMOS, bipolarFeature size: 3.0µm

Key Agreements

• TelCom established a foundry agreement with IC Works (San Jose, CA) in November 1995. Under theagreement, TelCom agreed to invest $10 million in equipment and the expansion of IC Works submicron waferfabrication facility, in return for wafer capacity. The agreement covers a five-year period, which is expected tobegin in late 1997.

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Texas Instruments North American Company Profiles

TEXAS INSTRUMENTS (TI)

Texas Instruments IncorporatedSemiconductor Group

P.O. Box 655303Dallas, Texas 75265

Telephone: (214) 995-2011Fax: (214) 997-5250

Web Site: www.ti.com/sc

IC Manufacturer


Japan: Texas Instruments Japan Ltd. • Minato-ku, Tokyo, JapanTelephone: (81) (3) 3457-0972 • Fax: (81) (3) 3457-1259 • Web Site: www.tij.co.jp

Europe: Texas Instruments France S.A. • Saulnier, Velizy-Villacoublay Cedex, FranceTelephone: (33) (1) 30-70-11-65 • Fax: (33) (1) 30-70-10-32

Asia-Pacific: Texas Instruments Taiwan Ltd. • Taipei, TaiwanTelephone: (886) (2) 377-1450 • Fax: (886) (2) 377-2718


1992 1993 1994 1995 1996

CorporateSales 7,440 8,523 8,608* 11,409* 9,940Net Income 247 472 691 1,088 63R&D Expenditures 578 842 1,181

SemiconductorSales 3,080 4,100 5,550 7,850 6,750 IC Sales 3,000 4,040 5,500 7,800 6,700 Discrete Sales 80 60 50 50 50Capital Expenditures 315 525 860 1,170 1,840

Employees 60,577 59,048 56,333 59,574 59,927

*Changed to reflect discontinued operations.


North American Company Profiles Texas Instruments


Texas Instruments (TI) is one of the leading high-technology companies in the U.S. and one of the top tensemiconductor manufacturers in the world. It was founded in 1930 as Geophysical Service to provide geophysicalexploration services to the petroleum industry using reflection seismographs. In 1946, the company formallyadded electronic systems manufacturing to its operations, and in 1951, adopted its current name. Today, TI'sproducts include semiconductors, consumer electronics products, electrical controls, and metallurgical materials.

In 1996, TI sold its printed circuit board contract manufacturing operation to Solectron Corp. TI also sold its mobilecomputing business to Acer Group, its printer business to Genicom Corp., and signed a definitive agreement tosell its defense systems and electronics business to Raytheon Company. In April 1997, TI sold its softwarebusiness to Sterling Software Inc.

In mid-1996, TI acquired Silicon Systems, Inc., a company whose expertise is in mixed-signal/analog circuits.Tustin, California-based Silicon Systems is operating as a wholly owned subsidiary of TI.

Components81%

1996 Corporate Sales byBusiness Segment

Metallurgical Materials2%

Digital Products17%

North America45%


Europe21%

East Asia33%

Other1%

Texas Instruments’ business is based principally on its broad semiconductor technology and application of thattechnology to selected electronic end equipment markets. The company’s participation in semiconductors datesback to the emergence of the industry in the early 1950’s. It began the research and development ofsemiconductor devices in 1952. Two years later, the company commercialized the transistor and in 1958,invented the integrated circuit.

Although the company is a leading producer of DRAMs, much of its semiconductor emphasis is focused ondifferentiated products like digital signal processors (DSPs), microcomponents, and mixed-signal interfacedevices. Such products represented approximately 65 percent of the company’s semiconductor revenues in1996. TI is the world’s leading supplier of DSPs and the second largest supplier of analog/mixed-signal ICs. Thecompany's bipolar business, meanwhile, is shifting to advanced system logic, with new differentiated products foremerging markets in computers, consumer electronics, and telecommunications.

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The majority (about 75 percent) of the DRAMs TI sells are sourced from the joint venture companies in which itholds a majority interest, including TI-Acer in Taiwan, KTI Semiconductor in Japan, TECH Semiconductor inSingapore, and TwinStar Semiconductor Inc. in Texas. In addition, TI announced a new joint venture with theItalian government to construct a fab facility in Italy for the manufacture of flash memories and another with AnamIndustrial Co. to build DSPs at a new fab in South Korea. To date, TI and its partners have invested more than $3billion in capital expenditures in the joint ventures. See the Semiconductor Fabrication Facilities and KeyAgreements sections below for more information on these ventures.

Management

James R. Adams ChairmanWilliam P. (Pat) Weber Vice ChairmanThomas J. Engibous President and Chief Executive OfficerDavid D. Martin Executive Vice PresidentRichard K. Templeton Executive Vice President and President, Semiconductor GroupRichard J. Agnich Senior Vice President, Secretary, and General CounselWilliam A. Aylesworth Senior Vice President, Treasurer, and Chief Financial OfficerKevin McGarity Senior Vice President, Semiconductor Group and Manager, Worldwide

Semiconductor Group MarketingJohn Scarisbrick Senior Vice President, Semiconductor Group and Manager, Worldwide

Application Specific ProductsDel Whitaker Senior Vice President, Semiconductor Group and Manager, Worldwide

Mixed-Signal and Logic ProductsRick Goerner Vice President, Semiconductor Group and President, Silicon SystemsMike Hames Vice President, Semiconductor Group and Manager, Worldwide

DSP Products


TI's principal semiconductor products include DSPs, CISC and RISC microprocessors and controllers, graphicsICs, networking chips, ASICs, memory ICs, and mixed-signal devices. Details concerning these products areprovided below.

Processors

Digital Signal Processors—TI offers a variety of general-purpose DSP chips, including nine generations ofdedicated and programmable 16-bit fixed-point and 32-bit floating-point DSPs; customizable and application-specific DSPs; and the highest performance DSP on the market—the TMS326C6x at 1,600 MIPS/200MHz, 10times the MIPS performance of any DSP on the market at the time of this writing. The ‘C6x DSP is based on a very-long instruction word (VLIW) architecture and a five-layer-metal, 0.25µm CMOS process technology. By the endof 1998, TI plans to move the processor to a 0.18µm process that is expected to yield 2,000 MIPS/250MHzperformance.



Microcontrollers—TI offers an expanding family of ROM, one-time programmable, and UV-erasable 8-bitmicrocontrollers for applications in automotive, communications, computer, consumer electronics, and industrialequipment. The company’s next-generation 8-bit and 16-bit MCUs offer higher integration levels by utilizing TI’sPrism process for reconfigurable MCU libraries.

LAN Products—This group of products includes media access controllers, switches, communications processors,and physical layer interface devices.

Mixed-Signal and Analog Devices

TI offers a wide range of mixed-signal and standard analog semiconductor products, including power supplyproducts, 1394 devices, Universal Serial Bus (USB) products, fiber channel serial buses, amplifiers, comparators,data converters, RAMDACs, telecommunications ICs, power ICs, sensor signal processors, hard disk drive ICs,speech processors, digital tapeless answering devices (DTADs), and CCDs. Several of these products areavailable in low-voltage (3V) versions.

Advanced System Logic Devices

This family of products includes a full spectrum of devices in a variety of process technologies, including CMOS,bipolar, and BiCMOS. TI has second-source agreements with Philips Semiconductors and Hitachi for AdvancedBiCMOS Technology (ABT) logic devices as well as for low-voltage logic chips.

Memory ICs

TI’s extensive line of memory ICs includes a broad family of DRAMs (16M and 64M), synchronous DRAMs(SDRAMs), flash memories (512K to 4M), and FIFOs.

In non-volatile memory, TI has shifted its focus from EPROMs to flash memories. The company plans to build on itsstrength in DRAM technology to expand its capability in high-density flash products. Development plans for futurenew high-density products are being evaluated using 0.12µm-0.15µm technology derived from 1G DRAMtechnology.

Application-Specific ICs (ASICs)

TI was the third largest North American ASIC vendor in 1996. Its application-specific IC products include high-speed bipolar and CMOS PLDs and CMOS and BiCMOS gate arrays, embedded arrays, and standard cells. Thecompany’s most advanced ASICs are manufactured with a four-level-metal 0.35µm CMOS process, enablingdesigns of up to 1.7 million gates. In May 1996, TI announced its 0.18µm TImeline technology and was the first tooffer the capability to place 125 million transistors on a single chip.

Texas Instruments sold its antifuse FPGA business to Actel Corporation in 1995. TI had been a licensed secondsource of Actel's FPGAs since 1988.

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MOS MEMORY ANALOG

✔ DRAM ✔ Amplifier

SRAM ✔ Interface

✔ Flash Memory ✔ Consumer/Automotive

✔ EPROM ✔ Voltage Regulator/Reference






✔ Gate Array ✔ General Purpose Logic


✔ Field Programmable Logic ✔ Field Programmable Logic


✔ MPU/MCU/MPR

MOS MICROCOMPONENT

✔ MPU OTHER





Texas Instruments has several major wafer fab projects underway. At the company’s main campus in Dallas, Texas,$2 billion is being spent to put up a new DSP production facility (DMOS-6) and an R&D development fab (R&D-1).Both are expected to begin production by the end of 1997. The R&D-1 facility will be used for work on 0.18µmand 0.12µm device generations and for the company’s development of 300mm wafer technology.

In early 1997, TI announced that it had signed an agreement with the Italian government to build a secondfabrication facility and an R&D center in Avezzano, Italy. The $1.2 billion fab will have the capability to process ICson 300mm wafers, with geometries of 0.28µm and below, when operations start in 1999. Current plans call for theproduction of flash memories and DRAMs at the facility.

As mentioned earlier, a great deal of fab activity continues to take place at each of TI’s joint venture companies. In1996, KTI completed an expansion of its fab that doubled the facility’s wafer capacity. TI-Acer completedconstruction of its second fab in early 1997. TwinStar began production in mid-1996 at its first fab. And, TECHSemiconductor is building its second wafer fab, which will have a capacity of 10,000 200mm wafers per week andis expected to be ready for production in 1998.



In April 1997, Texas Instruments pulled out of a $1.4 billion Thailand joint DRAM venture with Charn Uswachoke,founder and CEO of Alphatec. Under the deal two companies were to be formed: Alpha-TI Semiconductor, a $1.2billion 16M and 64M DRAM fab; and Alpha Memory, a $200 million assembly and test facility. Reasons cited for TI’swithdrawal include weakness in the DRAM market and a poor Thai economy. Construction of both facility shellshas been completed, but no capital equipment orders were ever placed.

Texas Instruments Texas Instruments13500 North Central Expressway 13500 North Central ExpresswayDallas, Texas 75243 Dallas, Texas 75243Telephone: (214) 995-2001 Telephone: (214) 995-2001DMOS 4 DMOS 5Cleanroom size: 50,000 square feet (Class 1) Cleanroom size: 35,000 square feet (Class 1)Capacity (wafers/week): 21,000 Capacity (wafers/week): 6,000Wafer size: 150mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: DRAMs, EPROMs, logic ICs Products: DSPs, MPUsFeature sizes: 0.5µm-0.8µm Feature sizes: 0.35µm-0.5µm

Texas Instruments Texas Instruments13500 North Central Expressway 13500 North Central ExpresswayDallas, Texas 75243 Dallas, Texas 75243Telephone: (214) 995-2001 Telephone: (214) 995-2001DMOS 6 R&D 1Cleanroom size: 118,000 square feet Cleanroom size: 51,000 square feetCapacity (wafers/week): 7,500 Wafer size: 200mmWafer size: 200mm Process: CMOSProcess: CMOS Products: R&DProducts: DSPs Feature sizes: 0.12µm-0.25µmFeature sizes: 0.25µm, 0.35µm (Operations scheduled to begin in late 1997)(Operations scheduled to begin in late 1997)

Texas Instruments Texas Instruments13500 North Central Expressway 13500 North Central ExpresswayDallas, Texas 75243 Dallas, Texas 75243Telephone: (214) 995-2001 Telephone: (214) 995-2001DFAB DP1Cleanroom size: 60,000 square feet (Class 1) Cleanroom size: 17,000 square feet (Class 1)Capacity (wafers/week): 5,375 Capacity (wafers/week): 1,000Wafer sizes: 100mm, 150mm Wafer size: 100mmProcesses: Bipolar, MOS, GaAs Process: GaAsProducts: Analog and memory ICs, discretes Products: Analog and digital ICsFeature size: 0.8µm Feature sizes: 0.5µm-2.8µm

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Texas Instruments Texas Instruments2301 North University Highway 75 SouthLubbock, Texas 79415 Sherman, Texas 70590Telephone: (806) 741-2000 Telephone: (214) 868-5980LMOS Fab SFABCleanroom size: 45,000 square feet Cleanroom size: 50,000 square feet (Class 1)Capacity (wafers/week): 8,600 Capacity (wafers/week): 10,000Wafer size: 125mm Wafer size: 125mmProcesses: CMOS, NMOS Process: BipolarProducts: EPROMs, ASICs Products: Logic ICs, MPRsFeature sizes: 0.8µm-2.0µm Feature size: 2.0µm

Texas Instruments Texas Instruments Japan Ltd.32201 Southwest Freeway 18-36, Minami 3-chomeStafford, Texas 77477 Hatagoya-shi, Saitama Prefecture 334Telephone: (281) 274-2000 JapanHFAB Telephone: (81) (48) 282-2211Cleanroom size: 27,000 square feet HATO FabCapacity (wafers/week): 8,600 Capacity (wafers/week): 4,000Wafer size: 125mm Wafer size: 125mmProcesses: CMOS, NMOS Processes: CMOS, NMOSProducts: EPROMs, ASICs Products: Logic ICs, ASICsFeature sizes: 0.8µm-2.0µm Feature size: 1.0µm

Texas Instruments Japan Ltd. Texas Instruments Japan Ltd.2355 Kihara Miho-Mura 2355 Kihara Miho-MuraInashiki-gun, Ibaraki Prefecture Inashiki-gun, Ibaraki PrefectureMiho 300-04, Japan Miho 300-04, JapanTelephone: (81) (29) 885-3311 Telephone: (81) (29) 885-3311MIHO 5 MIHO 6Capacity (wafers/week): 5,750 Capacity (wafers/week): 6,250Wafer size: 125mm Wafer size: 150mmProcesses: CMOS, MOS Process: CMOSProducts: ASICs, ASSPs, MCUs, DSPs Products: DRAMs, MPUs,Feature sizes: 0.5µm-1.0µm Feature sizes: 0.35µm-0.5µm



Texas Instruments Japan Ltd. Texas Instruments Italia S.p.A.4260 Aza-Takao Via Antonio Pacinotti 5/7Oaza-Kawasaki Nucleo IndustrialeHiji-Machi, Hayami-gun I-67051 Avezzano, ItalyOita Prefecture 979-15, Japan Telephone: (39) 863-4321Telephone: (81) (97) 772-111 AMOS 1HIJI Fab Cleanroom size: 45,000 square feetCapacity (wafers/week): 4,500 Capacity (wafers/week): 5,000Wafer size: 150mm Wafer size: 150mm (plans for 200mm conversion)Processes: CMOS, BiCMOS, bipolar Process: CMOSProducts: Logic and analog ICs, DRAMs Products: DRAMsFeature sizes: 0.5µm-1.0µm Feature size: 0.8µm

(Joint venture with the Italian government.)

Texas Instruments Italia S.p.A. Texas Instruments Italia S.p.A.Via Antonio Pacinotti 5/7 Via Antonio Pacinotti 5/7Nucleo Industriale Nucleo IndustrialeI-67051 Avezzano, Italy I-67051 Avezzano, ItalyTelephone: (39) 863-4321 Telephone: (39) 863-4321AMOS 2 AMOS 3Capacity (wafers/week): 7000 Capacity (wafers/week): 1,650Wafer size: 200mm Wafer size: 300mmProcess: CMOS Process: CMOSProducts: DRAMs Products: Flash memories, DRAMsFeature size: 0.5µm Feature size: 0.28µm(Joint venture with the Italian government.) (Joint venture with the Italian government.

Operations scheduled to begin in 1999.)

Texas Instruments Deutschland GmbH Silicon Systems, Inc. (subsidiary of TI)Haggertystrasse 1 2300 Delaware AvenueFreising, Germany Santa Cruz, California 95060Telephone: (49) 816-1801 Cleanroom size: 52,000 square feetFFAB Capacity (wafers/week): 6,500Capacity (wafers/week): 7,500 Wafer size: 150mmWafer size: 150mm Processes: Bipolar, CMOS, BiCMOSProcesses: CMOS, BiCMOS Products: Mixed-signal ICsProducts: Logic and analog ICs, ASSPs Feature sizes: 1.0µm-3.0µmFeature sizes: 0.6µm-0.8µm

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KTI Semiconductor Ltd. TI-Acer Incorporated189-1 Hirano-cho 4F, Industry East 9th RoadNishiwaki City Science-Based Industrial ParkHyogo Prefecture 677, Japan Hsinchu, TaiwanCleanroom size: 48,400 square feet Telephone: (886) (3) 5785112Capacity (wafers/week): 6,250 Fax: (886) (3) 5782038Wafer size: 200mm Fab 1 and Fab 2Process: CMOS Cleanroom size: 97,000 square feetProducts: DRAMs, ASICs, MPUs, DSPs Capacity (wafers/week): 10,000Feature sizes: 0.35µm-0.8µm Wafer sizes: 150mm, 200mm(Joint venture with Kobe Steel) Process: CMOS

Products: DRAMsFeature sizes: 0.35µm-0.8µm

TECH Semiconductor Singapore Pte Ltd. TECH Semiconductor Singapore Pte Ltd.P.O. Box 2093, SE 9040 P.O. Box 2093, SE 9040990 Bendemeer Road 990 Bendemeer RoadSingapore 1233 Singapore 1233Telephone: (65) 298-1122 Telephone: (65) 298-1122Fab 1 Fab 2Cleanroom size: 40,000 square feet Capacity (wafers/week): 10,000 Capacity (wafers/week): 6,250 Wafer size: 200mmWafer size: 200mm Process: CMOSProcess: CMOS Products: DRAMsProducts: DRAMs Feature size: 0.25µmFeature sizes: 0.35µm, 0.5µm (Joint venture with the Economic Development(Joint venture with the Economic Development Board of Singapore, Canon, and HP. OperationsBoard of Singapore, Canon, and HP.) scheduled to begin in 1998.)

TwinStar Semiconductor Inc.500 West Penner RoadRichardson, Texas 75080Telephone: (214) 994-5800Cleanroom size: 48,000 square feetCapacity (wafers/week): 2,000Wafer size: 200mmProcess: CMOSProducts: DRAMsFeature size: 0.35µm(Joint venture with Hitachi. Began productionin mid-1996.)



Key Agreements

• It was announced in early 1997 that Hitachi, Mitsubishi, and Texas Instruments will co-develop the cellarchitecture for a 1G DRAM as well as the process technology needed to manufacture it. Hitachi has a long-standing relationship with TI to jointly develop and produce DRAMs.

• TI formed an alliance with Anam Industrial Co. in South Korea calling for Anam to build an IC fabrication facility inKorea and TI to provide technical support during construction of the fab and supply the 0.35µm CMOSmanufacturing technology. TI will receive, in return, a guaranteed portion of the wafer capacity for theproduction of DSPs. Operations at the fab are expected to begin in the first half of 1998.

• Samsung, Oki, Fujitsu, and Matsushita renewed their semiconductor patent cross-licensing agreement with TIthat expired the end of 1995 by signing a 10-year deal that extends through 2005. TI has similar existinglicensing agreements with LG Semicon, Micron, Hyundai, Mitsubishi, and Toshiba.

• TI is collaborating with IMEC of Leuven, Belgium, on the research of advanced lithography processes toachieve 0.18µm capabilities for manufacturing 1-gigabit-class semiconductors.

• Texas Instruments and Ericsson have a long-standing alliance in which TI has provided the Swedish companywith its leading edge process technologies for wireless communications.

• Hitachi joined with Texas Instruments for 16M, 64M, and 256M DRAM development and production. Thepartners have built a joint 16M and 64M DRAM manufacturing facility in Texas. The $500 million factory, calledTwinStar Semiconductor Inc., began producing 16M DRAMs in July 1996 and production of 64M parts isexpected to start in 1997. The output is shared equally between Hitachi and TI.

• TI, Philips, and Hitachi formed a pact in 1993 covering joint development and alternate sourcing of FutureBusand BiCMOS logic IC products.

• Samsung reached an agreement with Texas Instruments in 1993 to jointly improve and operate TI’s test andassembly plant in Portugal. Each company operates separate, dedicated lines.

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TLSI North American Company Profiles

TLSI

TLSI, Incorporated815 Broadhollow Road

Farmingdale, New York 11735Telephone: (516) 755-7005

Fax: (516) 755-7626

Fabless IC Supplier


TLSI designs and markets analog, digital, and mixed-signal ICs for the automotive, telecommunications, industrialprocess control, security, home appliance, and military/aerospace markets. TLSI was formed as a division ofTelephonics Corp. in 1977 to provide Telephonics with ICs needed for its military and commercial airlinecommunication systems. Today, TLSI remains a wholly owned subsidiary of Telephonics and provides ICs to thegeneral marketplace.

Management

Mort Pullman PresidentR. Hartig Vice President, Business ManagementJerry Powder Director, Sales


TLSI offers a wide range of solutions in the area of full custom MOS, cell-based, and gate array configurations. Broken down into categories, these alternatives include the following:

Full Custom:Includes transistor-level designs.

Standard Cell Library:Characterized functions with auto place-and-route using standard height and variable width cells.

Standard Cell Library with Custom Interconnect:Characterized functions with Calma operator place-and-route using standard height and variable width cells.

Minimum Area Cell Libraries with Custom Interconnect:Custom interconnect with minimum sized cells to reduce die area and development time/cost for higher-volume requirements where a full custom configuration may not be required.

Analog and Digital Functions Combined on the Same Chip:Maximizes system integration and minimizes printed circuit board area.

When design its chips, TLSI selects any of the following process technologies that best fits the customer’sspecific application: 1.5µm to 3µm CMOS, 1.5µm BiCMOS, or bipolar.


North American Company Profiles TranSwitch

TRANSWITCH

TranSwitch Corporation8 Progress Drive

Shelton, Connecticut 06484Telephone: (203) 929-8810

Fax: (203) 926-9453Web Site: www.transwitch.com

Fabless IC Supplier

Employees 100


TranSwitch Corporation designs, develops, and markets highly integrated digital and mixed-signal semiconductorproducts for broadband telecommunications and data communications applications.

The company’s product line includes very large scale integration (VLSI) devices that serve four markets:worldwide public telephone networks, local area networks (LAN), wide area networks (WAN), and cable television(CATV) systems.

Management

Santanu Das, Ph.D. President and Chief Executive OfficerMichael F. Stauff Senior Vice President, Chief Financial OfficerWilliam G. Bartholomay Vice President, EngineeringJohn Haynes Vice President, SalesMike McCoy Vice President, ControllerFrank Middleton Vice President, PLM Transmission ProductsRobert G. Pico Vice President, Business DevelopmentKandaswamy Thangamuthu Vice President, OperationsDaniel C. Upp Vice President, Technology DevelopmentJitender K. Vij Vice President, Systems Engineering


TranSwitch’s IC devices include asynchronous (PDH), synchronous (Sonet/SDH), and asynchronous transfermode (ATM) communications circuits. The asynchronous products include line interface,multiplexer/demultiplexer, framer, and data communications devices. The synchronous product line includes linetermination, overhead processor, mapper, and multiplexer/demultiplexer devices. The ATM products includephysical layer, ATM layer, and ATM adaptation layer devices that implement a variety of public and private switchingand multiplexing products.

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Trident Microsystems North American Company Profiles

TRIDENT MICROSYSTEMS

Trident Microsystems, Inc.189 North Bernardo Avenue

Mountain View, California 94043-5203Telephone: (415) 691-9211

Fax: (415) 691-9260Web Site: www.tridentmicro.com

Fabless IC Supplier


Asia-Pacific: Trident Far East Ltd. • Kowloon, Hong KongTelephone: (852) 2756-9666


1992 1993 1994 1995 1996

Sales 67 78 69 107 168Net Income 12 10 1 8 17R&D Expenditures 6 7 10 13 18Foundry Fab Investment — — — — 14

Employees 115 130 150 268 308


Founded in 1987, Trident Microsystems designs, develops, and markets very large scale integrated circuitgraphical user interface (GUI) accelerators, graphics controllers, and multimedia video processors targeting themainstream PC desktop, notebook, and multimedia markets.

Trident’s initial product offerings began with SVGA controllers in 1989 and moved toward mixed-signal controllersin 1993. The year 1994 marked a year of transition for Trident that included its entrance into the GUI acceleratormarket. Although its revenues declined in 1994, the transition to the GUI accelerator market proved successful inthe following years. Another shift in Trident’s market strategy occurred during this timeperiod. In 1994, 95percent of Trident’s sales came from non-OEMs. In a strategic move, Trident began targeting the OEM market andcurrently derives about 40 percent of its sales from OEMs such as IBM, Hewlett-Packard, NEC, and Philips.


North American Company Profiles Trident Microsystems

Trident’s product line includes a complete line of 32-bit and 64-bit integrated circuits, video accelerators, andmultimedia video processing chips that provide cost-effective easy-to-use graphics solutions based on advancedtechnology. Trident was among the first to deliver chips for the new Unified Memory Architecture (UMA), whichreduces system memory costs by efficiently using existing PC memory for the graphics frame buffer. Additionally,several of Trident’s GUI and video acceleration products include the company’s proprietary TrueVideo algorithm,the first technology to deliver horizontal/vertical interpolation and diagonal edge recovery for clearer, sharper full-motion images.

Future product development will focus on products in the high-end of the graphics market as well as the PCnotebook market. In early 1997, Trident began sampling its first 3D notebook device.

GUI AcceleratorDesktop Products

66%


NotebookProducts

15%

Other19%

Asia-Pacific78%


North America22%

Management

Frank C. Lin Chairman, President, and Chief Executive OfficerJung-Herng Chang, Ph.D. Vice President, EngineeringRichard E. Hegberg Vice President, Worldwide SalesPeter Jen Vice President, Asia OperationsJames T. Lindstrom Vice President, Finance and Chief Financial OfficerAmir Mashkoori Vice President, OperationsRichard Silverman Vice President, MarketingRichard F. Hass Director, Marketing Communications


Trident designs its products using 1.0µm, 0.8µm, and 0.6µm CMOS process technologies. The company'sproduct line includes: 3D and MPEG ICs, advanced mixed-signal GUI accelerators, high-performance SVGAcontrollers, multimedia video processing devices, and LCD/CRT controllers.

In 1Q97, Trident introduced two 3D graphics controllers dubbed the 3DImage™ 975 and 3DImage™ 975DVD.Both devices are designed for 3D applications and feature 3D and 2D graphics acceleration, TV outputtechnology, VGA imaging, and high-quality video. The 3DImage 975DVD also provides DVD playback functionsfor use with MMX-enabled Pentium 166MHz and higher MPUs.

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Trident Microsystems North American Company Profiles


Trident uses a fabless manufacturing strategy where it meets its manufacturing needs by using foundries. Prior to1996, Trident received the majority of its wafer capacity from TSMC. In 1996, in an effort to decrease itsdependence upon one foundry supplier, Trident secured additional capacity through foundry agreements withUMC and Winbond in Taiwan, and Samsung in Korea. In its agreement with UMC, Trident has purchased an equityinterest in UICC, a UMC joint venture fab facility located in Taiwan. The facility was expected to begin production inmid-1997.

Key Agreements

• In May 1996, Trident and Samsung announced a long-term partnership. Samsung will provide manufacturingcapacity to Trident in exchange for mixed-signal ASIC designs. In late 1996, the two companies announcedthe joint development of a next-generation notebook multimedia accelerator that will feature Samsung’sembedded SDRAM.

• In August 1995, Trident entered into a joint venture agreement with UMC. Under the agreement, Tridentagreed to invest $60 million for a 10 percent equity interest in a new 200mm fab facility, called United IntegratedCircuits Corporation (UICC). Production at the new facility, located in Taiwan, was expected to begin in mid-1997.

• In June 1995, Trident expanded its relationship with TSMC by signing a five-year foundry agreement. Underthe agreement, Trident will purchase a certain number of wafers each year from TSMC through 1999.


North American Company Profiles TriQuint Semiconductor

TRIQUINT SEMICONDUCTOR

TriQuint Semiconductor, Inc.2300 NE Brookwood Parkway

Hillsboro, Oregon 97124Telephone: (503) 615-9000

Fax: (503) 615-8900Web Site: www.triquint.com

IC Manufacturer


Europe: Giga A/S • Skovlunde, DenmarkTelephone: (45) (44) 92-61-00 • Fax: (45) (44) 92-59-00


1992 1993 1994 1995 1996

Sales 29 33 30 46 60Net Income 1 1 (10) 3 6R&D Expenditures 7 9 10 9 11Capital Expenditures 1 1 1 1 4

Employees 190 195 222 285 361


TriQuint Semiconductor designs, develops, manufactures, and markets a broad range of high-performanceanalog and mixed-signal gallium-arsenide (GaAs) ICs for the wireless communications, telecommunications, andcomputing markets. TriQuint's mission is to commercialize GaAs ICs for communications and computing. Thecompany’s continued focus is on achieving new designs and introducing new products in all three market areas.In 1996, TriQuint expanded its product offerings to include GaAs foundry services.



Computing17%

WirelessCommunications

49%

International30%


United States70%

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TriQuint Semiconductor North American Company Profiles

TriQuint's origin can be traced back to 1978, when researchers at Tektronix Laboratories began investigatingGaAs IC technology. Established as a majority-owned subsidiary in 1985, TriQuint Semiconductor was chargedwith developing application-specific integrated circuits (ASICs) for high-performance microwave, linear, and digitalsystems.

TriQuint became independent from Tektronix in 1991 when it completed a successful merger with GigaBit Logicand Gazelle Microcircuits to form a new privately-held TriQuint. In 1993, TriQuint became a public company.

Management

Steven J. Sharp President and Chief Executive OfficerEdward C.V. Winn Executive Vice President, Finance and Administration,

Chief Financial Officer, and SecretaryGordon Cumming, Ph.D. Vice President, TechnologyBruce R. Fournier Vice President, SalesJoseph I. Martin Vice President, Corporate DevelopmentDonald Mohn Vice President and General Manager, Telecommunications and ComputingDavid Pye Vice President, Manufacturing OperationsRon Ruebusch Vice President and General Manager, Wireless Communications


TriQuint Semiconductor's standard and customer-specific products are structured into three end-market groups:wireless communications, telecommunications, and computing.

Wireless Communications—Standard products for this market are used as building blocks for multipurposeapplications in radio frequency (RF) and microwave systems. These systems include personal communicationsnetworks, cellular telephones, satellite communications and navigation equipment, and wireless computernetworks. In 1996, TriQuint continued to add devices to its relatively new family of high-power RF amplifier ICs forthe voice and data wireless communications market.

Telecommunications—Most the company's telecommunications ICs are customer-specific, but its does offer somestandard products, such as Sonet and SDH multiplexers/demultiplexers and transceivers, ATM framers, and high-performance crosspoint switches.

Computing—Standard products for this market are concentrated on solving system timing and datacommunications performance bottlenecks in high-performance PCs, workstations, servers, and storage systems.

The company utilizes its proprietary GaAs technology for the production of its ICs. Its GaAs process features0.5µm to 0.7µm geometries, 4.0µm metal pitch, and a cutoff frequency of up to 21GHz.

TriQuint’s services include GaAs IC design, wafer fabrication, test engineering, package engineering, assembly,and testing.


North American Company Profiles TriQuint Semiconductor


TriQuint Semiconductor, Inc.2300 NE Brookwood ParkwayHillsboro, Oregon 97124Cleanroom size: 16,000 square feet (Class 10)Capacity (wafers/week): 1,000Wafer size: 100mmProcess: GaAsProducts: ASICs, standard components, foundry servicesFeature sizes: 0.5µm-0.7µm

In early 1997, TriQuint moved into its new GaAs semiconductor manufacturing facility and office complex inHillsboro, Oregon. The 165,000 square-foot site houses all of the company’s manufacturing, engineering,marketing, and administrative functions that were located in Beaverton, Oregon, with 45,000 square-feet used forthe manufacturing facility.

Key Agreements

• In April 1996, TriQuint and Philips announced a wafer sourcing agreement. Under the pact, Philips will developGaAs ICs for TriQuint to produce according to Philips’ specifications. Assembly and test will be done by Philipsat a facility in Limeil, France.

• In August 1993, TriQuint and AT&T Microelectronics (now Lucent Technologies) announced a set ofagreements involving the development, manufacture, and marketing of GaAs ICs for high-performance wirelessand telecommunications systems. As part of the deal, Lucent discontinued its production of GaAs wafers andis instead relying on TriQuint for the manufacture of its GaAs wafers. Lucent also became a minority stockholderin TriQuint. Lucent increased its stake in TriQuint to 8.2 percent in early 1995.

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Tseng Labs North American Company Profiles

TSENG LABS

Tseng Labs, Inc.6 Terry Drive

Newtown, Pennsylvania 18940Telephone: (215) 968-0502

Fax: (215) 860-7713Web Site: www.tseng.com

Fabless IC Supplier


1992 1993 1994 1995 1996

Sales 75 76 79 37 26Net Income 14 11 9 1 (14)R&D Expenditures 1 1 2 3 15

Employees 50 95 96


Tseng Labs has designed and supplied integrated circuits and board-level enhancement products for graphicsand video applications since 1983, its founding year. The company's graphics and multimedia acceleratorproducts work in conjunction with a PC’s microprocessor to enhance its overall performance by transferring thegraphics and video functions from the MPU to the accelerator chip.

Until 1996, the company had mainly focused on the development of 2D graphics accelerators. However, in late1996, the company shifted its research and development efforts away from 2D products and toward the 3Dgraphics market.

International43%


U.S.57%


North American Company Profiles Tseng Labs

Management

Jack Tseng Chairman, President, and Chief Executive OfficerJohn J. Gibbons Executive Vice President and Chief Operating OfficerDavid Kwok Ping Hui Executive Vice President, Technology OfficerJames E. Bauer Senior Vice President, Sales and MarketingMark H. Karsch Senior Vice President, Finance and Administration, and

Chief Financial OfficerBarbara J. Hawkins Vice President and Chief Administrative OfficerThomas D. Snodgrass Vice President, Product Development


The first product in the company's line of graphics accelerators, the ET4000/W32, was introduced late in 1992 andbecame one of the industry's more successful SVGA controllers. Two additional products were introduced in1993—the W32i and the W32p. The W32i upgraded the W32 system with a more powerful graphics acceleratorand added a new 32-bit interleaved memory controller. The W32p further enhanced graphics acceleration andadded support for both local bus and the PCI bus architecture.

In November 1994, Tseng Labs introduced its VIPeR f/x advanced video image processor for multimedia systems.The VIPeR f/x enables full screen, accelerated playback of .AV1 and .MPG video files as well as simultaneouscapture and display of full motion, 30 frames-per-second video.

Tseng began shipping its ET6000, the first in a family of next generation graphics controller products, in 1996. It isan advanced 128-bit graphics and multimedia engine that integrates a 2D graphics accelerator, a high qualityvideo processor, an interface to the new high-bandwidth Multibank DRAM (MDRAM) from MoSys, Inc., and a PCIbus interface. Optimized for Windows 95 graphics performance, the ET6000 is designed to offer high resolutionand color without system degradation. To complement the ET6000, Tseng also introduced the VPR6000, avideo image processor, and the MPG9920, an MPEG decoder with built-in scaling capabilities. In November 1996,the company announced its plans for the ET6300 family of 3D graphics accelerators based on its ET6000accelerator.

The company’s current products are based on CMOS process technology with line geometries as small as 0.6µm.Most of its new products are manufactured using an advanced three- or four-layer metal process and are expectedto use 0.35µm process technology in the near future.


Tseng currently has foundry agreements with Chartered Semiconductor Manufacturing in Singapore, TowerSemiconductor in Israel, and Winbond Electronics in Taiwan.

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Tundra Semiconductor North American Company Profiles

TUNDRA SEMICONDUCTOR

Tundra Semiconductor Corporation603 March Road

Ontario, Canada K2K 2M5Telephone: (613) 592-0714

Fax: (613) 592-1320Web Site: www.tundra.com

Fabless IC Supplier

Employees 60


North America: Tundra Semiconductor Corporation • San Jose, CaliforniaTelephone: (408) 258-3600 • Fax: (408) 258-3659


Located in Canada, Tundra semiconductor is a privately-held company that designs, develops, and markets PCIand VME bus-bridging components. Tundra was established originally as Newbridge Microsystems, a division ofNewbridge Networks Corporation, a leader in local and wide area networking and communications equipment, butbecame an independent company in December 1995. As an affiliate of Newbridge Networks, Tundra has accessto advanced infrastructure resources while operating as an independent corporation.

Tundra’s product strategy is to focus on the niche market of bus-bridging ICs, which control the flow of databetween different bus architectures used in computer systems. The company also designs and markets a broadline of industry standard encryption components for data security in communications networks. To address theoffice equipment, consumer electronics, and automotive markets, Tundra offers a line of Intel-compatible 8-bitmicroperipheral (MPR) devices.

Management

Adam Chowenaniec President and Chief Executive OfficerJim Roche Executive Vice President and General ManagerMichael Krause Vice President, Research and DevelopmentNorm Paquette Vice President, FinanceEd Hacker Director, SalesDave Lisk Director, OperationsRichard O’Connor Director, Marketing and Business Development


North American Company Profiles Tundra Semiconductor


Tundra offers a family of embedded PCI bus bridges, VMEbus bridges, encryption components, and standard 8-bit microperipheral ICs.

PCI Bus Bridges

QSpan™— PCI interface for Motorola embedded processors (e.g., 68K, PowerPC)Eighty-X™—PCI interface solution for Texas Instruments’ line of TMS320C8x digital signal processors

VMEbus Bridges

Universe™—VME-to-PCI bus bridgeSCV64™—High-performance VME64-to-local bus bridgeTrooper™ II—Slave only, low-cost VMEbus-to-local bus bridge

Data Security Products

Wide array of encryption chips based on the Data Encryption Standard (DES). These products are designed for abroad range of networking and communications systems such as cable modems, ATMs, fax machines, andsatellite base solutions.

8000 Microperipheral Series

Six industry standard 8-bit MPRs that support the Intel x86 microprocessor family.

Key Agreements

• Tundra has strategic technology partnerships with Motorola, Texas Instruments, and Cadence DesignSystems.

1-360


Unitrode North American Company Profiles

UNITRODE

Unitrode Corporation7 Continental Boulevard

Merrimack, New Hampshire 03054-0399Telephone: (603) 424-2410

Fax: (603) 424-3460Web Site: www.unitrode.com

IC Manufacturer


Europe: Unitrode (U.K.) Limited • London, EnglandTelephone: (44) (181) 3181431 • Fax: (44) (181) 3182548

Asia-Pacific: Unitrode Electronics Asia Ltd. • Kowloon, Hong KongTelephone: (852) 2722-1101 • Fax: (852) 2369-7596

Financial History ($M), Fiscal Year Ends January 31*

1993 1994 1995 1996 1997

Sales 50 65 87 116 134Net Income 6 9 12 18 21R&D Expenditures 4 6 9 15 18Capital Expenditures 16 12 18

Employees 300 425 514 620 562

*Results excluding disposed operations.


Unitrode Corporation was founded in 1960 as a manufacturer of electronic components and subsystems. In1994, the company divested its two remaining non-strategic businesses, Powercube Corporation and MicroNetworks Division, leaving only its IC business, which was established in 1981. Unitrode is now focused entirelyon the design and manufacture of high-performance analog/linear integrated circuits. The company's ICs are usedin a variety of applications for power management and as interface devices. For the most part, the chips are usedto control switching power supplies and small electronic motors, or as high-speed interface and communicationcircuits between various pieces of electronic equipment.

Unitrode's customers are primarily in the EDP/computer and telecommunications markets, but also in the industrialcontrol and instrumentation, defense/aerospace, automotive, and consumer markets. The company plans tofocus its new product development efforts on the communications and industrial markets.

In fiscal 1997, about 70 percent of the company's integrated circuit sales were to international customers.


North American Company Profiles Unitrode

PowerManagement

40%


Motor Control34%

Interface26%

Computer/Office60%


Communications13%

Industrial19%

Automotive/Military8%

Management

Robert L. Gable Chairman and Chief Executive OfficerEdward H. Browder PresidentCosmo S. Trapani Executive Vice President and Chief Financial OfficerAllan R. Campbell Senior Vice President and General CounselS. Kelley MacDonald Vice President, Corporate CommunicationsPatrick Moquin Vice President, Human ResourcesFrederick J. Myers Vice President, International Sales


Unitrode's product offering is comprised of analog ICs for power supply control, motor control, lighting, powerdriving, power quality, and power factoring, as well as for high-speed and high-power interface applications. Mostof the products are based upon proprietary designs utilizing enhanced bipolar, BiCMOS, and BCDMOSsemiconductor technologies and are considered application-specific standard products (ASSPs).


In mid-1997, the company expected to complete the first phase of construction of a new 150mm BiCMOS waferfacility. The facility is expected to begin production in fiscal year 1999.

Unitrode Corporation7 Continental BoulevardMerrimack, New Hampshire 03054Capacity (wafers/week): 2,000Wafer size: 100mmProcesses: Bipolar, BiCMOS, BCDMOSFeature sizes: 1.5µm-5.0µm

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Unitrode North American Company Profiles

Unitrode has agreements with four foundries to supply additional wafers, as required. In January 1995, thecompany signed an agreement with GMT Microelectronics Corporation (former Commodore Semiconductor fab inNorristown, Pennsylvania) for additional wafer capacity. Under the agreement, Unitrode made a $2 million equityinvestment in GMT, in return for up to 30 percent of GMT's capacity. In February 1996, the company made anadditional $1.5 million investment in GMT which entitles the company to favorable pricing on certain products.During fiscal year 1997, Unitrode received less than 20 percent of its output from outside foundries.

Key Agreements

• Unitrode entered into an alliance with Irvine Sensors. Under the agreement, Unitrode became a licensee andexclusive second-source for Irvine Sensors’ wireless infrared communication ICs.

• Unitrode entered into an agreement with GMT Microelectronics Corporation in early 1995 to supply wafers toUnitrode. As part of the agreement, Unitrode invested $2 million in GMT. The company made an additionalinvestment of $1.5 million in GMT which entitles the company to favorable pricing on certain products.

• Unitrode agreed with Toko Inc. (Japan) in 1993 to jointly develop power-control ICs. The deal also calls for thecross-licensing and alternate sourcing of select proprietary products.


North American Company Profiles Universal Semiconductor

UNIVERSAL SEMICONDUCTOR

Universal Semiconductor, Inc.1925 Zanker Road


Fax: (408) 436-1125

IC Manufacturer

Employees 30


Universal Semiconductor was established in 1978 to serve as a CMOS foundry offering design and manufacturingof customers' custom/semicustom devices, gate arrays (digital and mixed-signal), dielectrically isolated (DI) high-voltage ICs, linear arrays, and DMOS FETs.

Management

Vic Hejmadi President and Chief Executive OfficerTony Telesca Director, Marketing and Sales


Universal Semiconductor uses CMOS processing for all devices and offers gate arrays with up to 2,400 gates,mixed-signal gate arrays (18V breakdown), and 300V and 500V dielectrically isolated high-voltage ICs, as well asradiation-hardened devices.


Universal Semiconductor, Inc.1925 Zanker RoadSan Jose, California 95112Cleanroom size: 9,000 square feetCapacity (wafers/week): 1,500Wafer size: 100mmProcess: CMOSProducts: ASICs, linear devices, discretes, foundry servicesFeature sizes: 1.5µm, 2.0µm, 3.0µm, 4.0µm, 5.0µm

1-364


UTMC Microelectronic Systems North American Company Profiles

UTMC MICROELECTRONIC SYSTEMS

UTMC Microelectronic Systems4350 Centennial Boulevard


Fax: (719) 594-8032Web Site: www.utmc.com

Fabless IC Supplier


1992 1993 1994 1995 1996

Sales 20 27 30 30 38

Employees 350 300 300 180 170


UTMC Microelectronic Systems is a subsidiary of United Technologies Corp. (UTC), a $23 billion Hartford,Connecticut-based provider of high technology products to the aerospace, building systems, and automotiveindustries throughout the world.

Established in 1980, UTMC serves government and commercial aerospace, commercial property and residentialhousing, and automotive manufacturing customers. It was originally established to assist other UTC divisions withthe integration of custom and semicustom microelectronics into their systems. In 1985, UTMC began supplyingsemicustom and military-standard VLSI circuits to external companies in the aerospace and defense industries.Today, the majority of UTMC’s business is with external companies. The company also engages in government-and customer-funded R&D.

Up to about mid-1995, UTMC manufactured its IC products in its own fab in Colorado Springs. However, thecompany took on a fabless strategy with the sale of its fab to Rockwell Semiconductor. UTMC reportedly sold thefab because it could not be operated economically. It was underutilized due to the fact that the company sells onlya small number of wafers with relatively high value. In addition, UTMC felt that by adopting a fabless strategy, itwould be able to move to 0.8µm and smaller geometries more quickly while not incurring the large capital costsassociated with a submicron fab.

In 1996, UTMC underwent another strategic change. UTMC combined its IC business with the former CommercialAircraft Electronics (CAE) division of Hamilton Standard, moved into a former Hamilton Standard facility, andchanged its name to UTMC Microelectronic Systems. The newly acquired 104,000 square-foot facility houses thecompany’s research and development, engineering, IC assembly, test, sales and marketing, as well as the newlyacquired circuit card assembly operation. The circuit card operation is a high-mix low-volume operation focusingon high reliability for the aerospace market.


North American Company Profiles UTMC Microelectronic Systems

Management

Charles "Nick" H. Ide PresidentMike Dansby Chief Financial OfficerChuck Gregory Vice President, Business Development and EngineeringDwight Deem Director, Sales and MarketingDick Ahlquist Manager, ASIC Product Marketing


UTMC offers semicustom and military-standard products. Its semicustom products include CMOS gate arrays withdensities from 3,400 to 200,000 usable gates, CMOS cell-based ASICs, and radiation-hardened antifuseprogrammable logic arrays. The process used for the gate arrays and standard cells is a JAN-qualified low-temperature double- or triple-metal rad-hard process with 0.8µm and 1.0µm geometries.

The company also offers a large selection of radiation-hardened monolithic, ASD/ENASC-certified MIL-STD-1553products. These include bus interface and control devices, bipolar bus transceivers, 16-bit RISC MPUs and 8-bitMCUs in both rad-hard and non-rad-hard versions, mask ROMs, PROMs, dual-port RAMs, SRAMs of up to 256Kdensity, and CMOS PLD and MSI logic devices.

Radiation-hardened products accounted for about 50 percent of UTMC’s IC sales in 1996.

From its newly acquired circuit card assembly and test division, UTMC offers circuit board assembly and testservices for low volume production runs of complex board requirements. Typical applications are commercial andmilitary aircraft and environmental controls.


UTMC sold its fabrication facility to Rockwell Semiconductor in mid-1995. As part of the deal, Rockwell will supplyUTMC with wafers through 1997 as it makes the transition to a fabless operation. In March 1996, UTMCannounced a foundry deal with Lockheed-Martin Federal Systems to obtain production capacity for rad-hardproducts from Lockheed-Martin’s fab in Manassas, Virginia (see Key Agreements). Other foundries are expectedto be added in 1997 to support new semicustom and standard products with 0.6µm and 0.5µm geometries.

Key Agreements

• UTMC established a three-year foundry supply deal with Lockheed-Martin Federal Systems in March 1996.The deal makes Lockheed-Martin UTMC’s main foundry for rad-hard CMOS devices.

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Vadem North American Company Profiles

VADEM

Vadem Ltd.1960 Zanker Road


Fax: (408) 467-2199Web Site: www.vadem.com

Fabless IC Supplier

Employees 45


Vadem was established in 1983 as a design house specializing in technologies for the portable computer industrythat was emerging at the time. The name Vadem is a derivative of the Latin word, vade mecum—meaning“something that one carries around.”

Vadem’s first project was the development of hardware/firmware emulation technology to help PC makers resolvecompatibility issues raised by the use of low-power CMOS devices. Another early project was the development ofone of the world’s first laptop computers, a design that was sold to Zenith who would go on to become the first tobring a laptop into full volume production. Vadem also designed what was called a PCRadio, which was a portablesystem emphasizing communications rather than computing power.

In 1987, Vadem announced the development of its first IC for portable systems, a chipset for the 186 PCgeneration. By 1992, the company had developed a full line of chips for portable computing, including anotebook power management unit that was later sold by Intel as the 82347, a single-chip LCD VGA controller (VG-660), and a single-chip DOS-compatible computer (VG-230) for low-cost handheld systems.

Today, Vadem is building upon its established portable design experience to become a leading designer andmarketer of ICs and related software for subnotebook-size computers and personal communications productssuch as handheld data collection terminals, cellular telephones, and personal organizers.


North American Company Profiles Vadem

Management

Chikok Shing ChairmanJohn Zhao President and Chief Executive OfficerGary Rhea Chief Financial OfficerAhmet Alpdemir Vice President, MarketingHenry Fung Vice President, EngineeringJohn C. Kamps Vice President, SalesSiu-Kuen Tsang Director, ASIC DevelopmentNorman Farquhar Manager, SoftwarePhil Mitchell Manager, Single-Chip PC ProductsGeoff Teng Manager, PCMCIA Products


Vadem's IC products include display controllers, microprocessors, PCMCIA host adapters, and PC card controllersfor portable systems. Vadem’s product offerings also include software, firmware, and development tools. Someof these products are described below.

• VG-330—a 32MHz x86-compatible processor for handheld systems. This highly integrated processorincorporates an MPU core and core logic, memory and power management, a memory controller, a PCMCIAcontroller, a VGA LCD controller, a serial port with HP IR capability, an AT-style bus controller, and a serialkeypad interface or scanned keyboard matrix. The device is designed for 3.3V operation.

• VG-469—a 208-pin PCMCIA card controller that is register- and software-compatible with Intel's i82365SLcontroller ICs. The part provides a migration path for current 5V devices, emerging 3.3V, and future lower-voltage systems and is compatible with PCMCIA 2.1 ExCA (Exchangable Card Architecture) extension,Microsoft's Plug-and-Play ISA version 1.0a, and PC Card DMA operation.

• VG-660—claimed to be the industry's first LCD VGA controller. It supports small flat panel displays withenhanced features and VGA compatibility.

Future products will include highly integrated Mips-based RISC processors.


Vadem's primary foundry sources are NEC in Japan and Samsung in Korea. Atmel, Symbios Logic, and VLSITechnology are used to a lesser extent.

1-368


Vantis North American Company Profiles

VANTIS

Vantis Corporation920 DeGuigneP.O. Box 3755


Fax: (408) 774-7216Web Site: www.vantis.com

Fabless IC Supplier


Europe: Advanced Micro Devices (UK) Ltd. • Firmley, England, United KingdomTelephone: (44) (1276) 803100 • Fax: (44) (1276) 803102

Japan: Advanced Micro Devices • Shinjuku-ku, Tokyo, JapanTelephone: (81) (3) 3346-7570 • Fax: (81) (3) 3342-7606

Asia-Pacific: Advanced Micro Devices Far East Ltd. • Kowloon, Hong KongTelephone: (852) 2956-5322 • Fax: (852) 2956-0588


1994 1995 1996

Sales 187 256 248

Employees 300


Vantis Corporation was spun off from AMD in 1997 to form a wholly-owned programmable logic subsidiary of AMD.The company’s roots in programmable logic devices (PLDs) date back to 1978 when Monolithic Memories, Inc.announced the development of the PAL® device. MMI merged with AMD in 1987. Today, Vantis is the dominantsupplier of simple PLDs and the world’s third largest supplier of all PLDs.

There are six basic areas addressed by Vantis’ PLDs: high-speed PAL devices, universal PAL devices, industry-standard PAL devices, low-power PAL devices, asynchronous PAL devices, and high-density PLDs. Much ofVantis’ emphasis is being placed on the company’s mid- to high-density MACH PLD products.


North American Company Profiles Vantis

Vantis’ roadmap calls for CPLDs with up to 1,000 macrocells by 1998 and CPLDs with high-density macrocells andintegrated cores by 1999. The company will utilize AMD’s core library including its digital signal processing, PCI,and microprocessor cores. In mid-1997, Vantis plans to introduce its first FPGA product in the 30,000-gate rangeand then move into the 250,000-gate range by the year 2000. Also by 2000, Vantis wants to become anindependent, publicly held company.

Management

Richard Previte ChairmanRichard H. Forte President and Chief Executive OfficerFrank Barone Vice President and Chief Operating OfficerDavid Chavoustie Vice President, Worldwide Sales and MarketingAl F. Frugaletti Vice President, Sales, North American and Worldwide DistributionAndy Robin Vice President, Marketing


For high-performance applications in the networking, telecommunications, computing, and industrial markets,Vantis offers its MACH families of high-density EECMOS PLDs. There are five MACH families, each addressing aspecific market need and all include features such as guaranteed fixed timing, PCI compliancy, powermanagement, and 3.3V options. The MACH 5, MACH Superset, and MACH Performance Plus CPLDs come withJTAG in-system programming (ISP) support for no additional cost.

• MACH 1 and 2 Families—These families (including the MACH Performance Plus CPLD products) consistprimarily of synchronous devices for synchronous subsystem applications like memory controllers andperipheral controllers and an asynchronous device for applications having asynchronous inputs and forcollecting random glue logic. Characteristics include 900 to 3,600 PLD gates, 44 to 84 pins, and 32 to 128macrocells.

• MACH 3 and 4 Families—These MACH Superset CPLDs provide approximately three times the density (up to10,000 PLD gates), two times the number of macrocells (up to 256), and two times the amount of I/O (up to 208pins) of the original MACH 1 and 2 families.

• MACH 5 Family—This is Vantis’ newest CPLD product family with speeds as fast as 7.5ns at 512 macrocells.The MACH 5 devices feature a new hierarchical switch-matrix architecture that allows shorter design times.While a 0.35µm (effective gate length) CMOS process is currently used to manufacture the MACH 5 PLDs, a0.25µm six-layer-metal process is under development and expected to be implemented by 2000.

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Vantis North American Company Profiles

Vantis also offers one of the industry’s widest variety of PAL devices.

• High-Speed PALs—Electronically erasable (EE) CMOS and bipolar PALs with delay times as low as 5ns and4.5ns, respectively.

• Universal PALs—EECMOS PALs with user-programmable output logic macrocells.• Industry-Standard PALs—Bipolar TTL PALs in a variety of speed and power grades.• Low-Power PALs—Zero-power CMOS PALs for portable or battery-operated systems (stand-by current of less

than 15µA) and quarter-power CMOS PALs that can cut system power consumption 50 percent by replacingequivalent CMOS PALs.

• Asynchronous PALs—CMOS PALs that are optimized for asynchronous and bus interface applications.


All of the company’s products are manufactured in AMD’s wafer fabrication facilities in Austin, Texas, on processesdedicated to programmable logic. AMD’s Fab 25, where much of Vantis’ devices are manufactured, is a 200mmfab with 0.35µm line geometries.


North American Company Profiles Vitesse Semiconductor

VITESSE SEMICONDUCTOR

Vitesse Semiconductor Corporation741 Calle Plano

Camarillo, California 93012Telephone: (805) 388-3700

Fax: (805) 987-5896Web Site: www.vitesse.com

IC Manufacturer


Europe: Vitesse Semiconductor Corp. • Morainvilliers, FranceTelephone: (33) (1) 3975-6310 • Fax: (33) (1) 3975-2062


1992 1993 1994 1995 1996

Sales 37 26 36 43 66Net Income 1 (19) (4) 2 13R&D Expenditures 9 10 9 9 11Capital Expenditures 3 6 2 3 11

Employees 300 238 201 235 320


Vitesse Semiconductor, founded in 1984, is a leader in the design, development, manufacturing, and marketingof digital gallium arsenide (GaAs) ICs suitable for commercial, industrial, and military customers. The company'scustom, semicustom, and standard products are used in a wide variety of industries including telecommunications,data communications, computers, defense and aerospace systems, automatic test equipment (ATE), andinstrumentation.

Computers4%

Other 1%


Government11%

Communications60%

ATE24%

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Vitesse Semiconductor North American Company Profiles

Vitesse's mission is to be the dominant supplier of the highest performance IC solutions for communications andATE applications. As the communications market shifts from wire to optical channels, and computers undergo ashift from large proprietary central processors to open distributed processors, Vitesse is positioning itself toprovide leading high-performance digital, analog, and mixed-signal IC solutions.

Foundry6%

1996 Sales by Product

ASIC Products58%

StandardProducts

36%

North America76%

ROW 2%


Europe 10%Japan

12%

Management

James A. Cole ChairmanLouis R. Tomasetta President and Chief Executive OfficerIan Burrows Vice President, Fab OperationsRobert Cutter Vice President and General Manager, Colorado SpringsIra Deyhimy Vice President, Product DevelopmentChris F. Gardner Vice President and General Manager, ATE ProductsEugene F. Hovanec Vice President, Finance and Chief Financial OfficerJames Mikkelson Vice President, Technology DevelopmentMichael Millhollan Vice President and General Manager, Standard ProductsRobert Nunn Vice President and General Manager, ASIC ProductsNeil Rappaport Vice President, SalesRam Venkataraman Vice President, Quality


Vitesse's products are fabricated using its proprietary H-GaAs™ (high integration gallium arsenide) processtechnology. The current generation is the five-level metal, 0.5µm H-GaAs IV process, capable of integration levelsof over one million transistors. ASIC design and simulation is supported on industry standard tools from Mentor,Cadence, Viewlogic, Synopsys, and Teradyne.

Vitesse's standard products include telecommunications and data communications ICs. Its communicationsproducts address the high-speed data transmission marketplace. Most are designed to be compatible with theSonet (synchronous optical network), ATM, and Fibre Channel standards. The operating frequency of thesedevices is from 155MHz to 10GHz and they are aimed at providing physical layer solutions for copper or fiber opticscommunication lines.


North American Company Profiles Vitesse Semiconductor

Vitesse's gate array product line consists of five families: GLX, FX, Viper, SCFX, and Fury™. Aimed at thecommunication, ATE/instrumental, and computer markets, GLX arrays are suited to switching networks, serial links,high-speed data bus transfers, DSP functions, and critical timing blocks. GLX utilizes a sea-of-gates architectureand can be powered from either a single or dual power supply, depending on I/O requirements. These gate arrayscan accommodate virtually any digital application requiring up to 175,000 gates. The FX series provides solutionsin super minicomputers, high-end workstations, telecommunications systems, and high-performanceATE/instrumentation. The Viper family provides solutions in computer peripherals, medical instrumentation, andcommunications. The SCFX family is targeted at telecommunications and data communications applications,offering maximum operating frequencies beyond 3GHz. The Fury series addresses the conventional silicon ECLuser.

In early 1997, Vitesse introduced its first family of GaAs standard cell arrays targeting telecommunications andhigh-speed switching applications. Dubbed the SLX line, the family consists of five devices with gate densitiesranging from 10K to 220K gates while operating from a single 3.3V power supply. The SLX family is based on a0.4µm four-layer metal HGaAs-IV process and utilizes a standard cell architecture.


In late 1996, Vitesse began construction of what it claims will be the first 150mm GaAs VLSI fabrication facility in theindustry. The 100,000 square-foot facility will support manufacturing and test, as well as a design center forresearch and development. Initial production is expected to begin in late 1998.

Vitesse Semiconductor Vitesse Semiconductor741 Calle Plano 4323 ArrowsWest DriveCamarillo, California 93012 Colorado Springs, Colorado 80907Cleanroom size: 5,500 square feet (Class 10) Cleanroom size: 10,000 square feet (Class 1)

6,500 square feet (Class 100) Wafer size: 150mmCapacity (wafers/week): 1,700 Process: H-GaAs E/D MESFETWafer size: 100mm Products: Gate arrays, telecom and datacomProcess: H-GaAs E/D MESFET devices, microperipherals, foundry servicesProducts: Gate arrays, telecom and datacom

devices, microperipherals, foundry servicesFeature sizes: 0.4µm, 0.5µm

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Vivid Semiconductor North American Company Profiles

VIVID SEMICONDUCTOR

Vivid Semiconductor, Inc.7400 West Detroit Street

Suite 100Chandler, Arizona 85226

Telephone: (602) 961-3200Fax: (602) 961-1135

Web Site: www.vividsemi.com

Fabless IC Supplier

Employees 35


Asia-Pacific: Vivid Semiconductor Korea Inc. • Seoul, KoreaTelephone: (82) (2) 522-3175 • Fax: (82) (2) 552-3177


Vivid Semiconductor was formed in 1993 to design and market mixed-signal and analog integrated circuits forapplications requiring high voltage operation at a low cost. Currently, the company is focused on providing driveelectronics to manufacturers of flat panel displays (FPDs).

Using patented extended voltage-range CMOS technology, Vivid has developed technology that allowsdesigners to build enhanced performance flat panel displays with 24-bit color and full-motion video. The key tothis technology is that it can be fabricated on standard CMOS processes. Vivid’s process technology can beapplied not only to FPDs but also to a broad range of other markets, from automotive to telecommunications,where extended voltage-range CMOS can make a difference in product capability, power consumption, cost, andreliability.

Management

Alex Erhart President, and Chief Executive OfficerDan Clarke Vice President, Marketing and SalesGerry Harder Vice President, OperationsTim Vatuone Vice President and Chief Financial OfficerEd Fullman Director, Marketing


North American Company Profiles Vivid Semiconductor


Vivid Semiconductor offers three families of direct drive flat panel display column drivers—CRT replacementproducts, low power notebook TFT display products, and MLS/AA STN display products. Vivid’s direct drive LCDcolumn drivers are available for a wide range of panel resolutions from VGA to UXGA.

Vivid’s column drivers are based on its patented "Dual Range" design architecture, which allows high-voltagedevices to be achieved on standard, low-voltage CMOS processes. For example 10V operation on a 0.8µmprocess and 7V operation on a 0.5µm process can be easily achieved, and higher voltages are possible.


Unlike leading edge microprocessors and memories, Vivid’s silicon requirements can be fabricated in plants thatare three process generations old. Vivid’s wafer processing, packaging, and testing functions are contracted towell-established manufacturers.

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VLSI Technology North American Company Profiles

VLSI TECHNOLOGY

VLSI Technology, Inc.1109 McKay Drive


Fax: (408) 263-2511Web Site: www.vlsi.com

IC Manufacturer


Japan: VLSI Technology, Inc. • Tokyo, JapanTelephone: (81) (3) 5454-3800 • Fax: (81) (3) 5454-3801

Europe: VLSI Technology, Inc. • Palaiseau Cedex, FranceTelephone: (33) (1) 69-19-71-00 • Fax: Fax: (33) (1) 69-19-71-01

Asia-Pacific: VLSI Technology, Inc. • Taipei, TaiwanTelephone: (886) (2) 719-5466 • Fax: (886) (2) 718-3204


1992 1993 1994 1995 1996

Sales 429 516 587 720 717Net Income (32) 16 32 46 (50)R&D Expenditures 50 65 79 90 105Capital Expenditures 40 72 94 204 245

Employees 2,379 2,659 2,728 2,986 2,948


VLSI Technology is a leader in the design, manufacture, and sale of complex high-performance ASICs andASSPs. Founded in 1979, the company has been a pioneer in the cell-based ASIC business. VLSI targets high-growth markets in which it has built expertise and can use its library of proprietary cells and FSB™ functionalsystem blocks to assist customers in designing products and bringing them to market rapidly. The company'ssubsidiary, Compass Design Automation, Inc., supplies software and design libraries to the broad commercialASIC and electronic design automation (EDA) marketplaces. Design services include system definition, completelogic and circuit design, and test program generation.


North American Company Profiles VLSI Technology

VLSI’s integrated circuit business is organized in a “market-focused” structure. Its three main groups areComputing Products, Communications Products, and Consumer Digital Entertainment Products.

Communications34%


ConsumerDigital

Entertainment26%

Computing33%

Other7%

United States53%


Europe29%

Japan/Asia-Pacific

18%

The Computing Product group offers devices for the computer market, including high-end computing applicationssuch as graphics workstations and high-end storage systems. Sales from this product group declined fromrepresenting 46 percent of total revenues in 1995 to 15 percent in 1996 due to Intel’s strengthened dominancein the core logic business and a decrease in sales for Apple Computer architecture systems. The ComputingProducts group is shifting its focus away from standard core logic chipsets and toward custom products for high-end applications.

The Communications Products groups offers devices for wireless and network communications applications.Within the communications area, the company continues to develop technologies supporting GSM, PHS, andDECT standards. VLSI is also developing products targeting CDMA digital cellular applications. In 1Q96, VLSIcreated a European subsidiary called Creative Systems Solutions. Based in Munich, Germany, Creative SystemsSolutions will focus on the wireless data communications marketplace.

The Consumer Digital Entertainment Products group supplies devices for secure communications and homeentertainment applications such as interactive television, satellite and cable technology, and electronic videogame systems. Data encryption is one key area of focus due to increased security concerns as products becomemore advanced.

Future product development will include a focus on the wireless, networking, set-top box, and advancedcomputing markets.

Management

Alfred J. Stein Chairman and Chief Executive OfficerRichard M. Beyer President and Chief Operating OfficerThierry Laurent Senior Vice President and GM, Communications Product GroupPaul McLellan Senior Vice President and President, Compass Design Automation, Inc.John C. Batty Vice President and TreasurerBalakrishnan S. Iyer Vice President, Finance and Chief Financial OfficerTed Malanczuk Vice President, Operations

1-378




Using advanced design capabilities, a vast cell library of predefined cells, and advanced manufacturing processes,VLSI Technology offers highly customized, highly integrated standard cell, embedded array (FlexArray), and gatearray ASICs and ASSPs for applications such as computers, wireless communications equipment, electronicgames, and digital set-top boxes.

The VLSI Cell Library provides an extensive and growing variety of predesigned and characterized cells,macrocells, and large functional system blocks. The company’s specialized system blocks include: UART, parallelport, SCC, SCSI, PCMCIA, PCI, SSA, Fibre Channel, and graphics functions for computing applications; T1/E1,Sonet/SDH, and ATM functions for network communications applications; GSM/DCS, DECT, CT2, PHS, CDPD,and Ruby II functions for wireless communications applications; and digital demodulation, forward error correction(FEC), MPEG-2 video and MPEG audio, microcontroller, and transport for digital entertainment applications.VLSI’s cell library also includes general-purpose system blocks such as 32-bit ARM RISC processor cores, dataencryption devices, and programmable DSP cores.

In a second attempt to penetrate the data security market, VLSI has developed the GhostRider security chip forPCI-based computers, modems, web-browsers, and set-top boxes. The device is designed to protect theelectronic transfer of intellectual property by integrating an on-chip RISC processor with encryption/decryptionengine-functional system blocks.

In April 1997, VLSI introduced a gigabit MAC controller device, the VNS67500. The device is available as astandard product, operating at 3.3V, or may be embedded in a submicron CMOS ASIC. The device is designedfor high-speed networking applications.

VLSI manufactures its ASICs and ASSPs in CMOS technology with geometries ranging from 0.35µm to 0.6µmand with up to five layers of interconnect metal. In April 1997, VLSI introduced its 0.25µm (drawn) and 0.2µm(drawn) standard-cell ASIC families, dubbed the VSC9 and VSC10 lines. Each family will have six layers of metal, adensity of up to 18 million raw (14 million usable) gates, and utilize the company’s trench architecture. Volumeproduction of the VSC9 family, which will not include gate arrays, is expected to begin in late 1997, followed by theVSC10 family in 1Q98.

Through its subsidiary, Compass Design Automation, VLSI provides IC design software (design tools and libraries)to a broad range of system and semiconductor customers.


In previous years, VLSI Technology enhanced its manufacturing capacity through wafer manufacturingrelationships, primarily with Chartered Semiconductor. However, by the end of 1996, VLSI shifted substantially allits wafer manufacturing to its own facilities.


North American Company Profiles VLSI Technology

During 1996, VLSI completed the majority of its expansion plans of its San Antonio fab, including the conversionto 0.6µm and smaller processes. In late 1996, VLSI announced plans to close its San Jose facility, citing itstechnology limitations as a contributing factor in the decision. The company expects to close the San Jose facilityby the end of 1997.

Addressing future capacity needs beyond 1997, VLSI signed a memorandum of understanding with theMalaysian Government that covers a site in Malaysia. However, VLSI indicated that it has no plans to construct anew facility before 2000.

VLSI Technology, Inc. VLSI Technology, Inc.1109 McKay Drive 9641 Westover Hills BoulevardSan Jose, California 95131 San Antonio, Texas 78251Telephone: (408) 434-3000 Telephone: (210) 522-7000Fab 1 Fab 2Cleanroom size: 47,000 square feet Cleanroom size: 50,000 square feet (Class 1)Capacity (wafers/week): 3,400 Capacity (wafers/week): 7,400Wafer size: 150mm Wafer size: 150mmProcess: CMOS Process: CMOSProducts: ASICs, ASSPs Products: ASICs, ASSPsFeature sizes: 0.6µm, 0.8µm, 1.0µm Feature sizes: 0.35µm, 0.5µm, 0.6µm(Will be closed by the end of 1997.)

VLSI subcontracts all of its IC packaging and approximately half of its final test needs. Its in-house final testfunctions are performed at its factories in California and Tempe, Arizona.

Key Agreements

• In November 1996, VLSI signed a memorandum of understanding with the Government of Malaysia. Thememo covers the construction of a 200mm wafer fabrication facility in Malaysia. To date, the company has notannounced any decision or timeframe for the facility.

• VLSI entered into an agreement with Digital Semiconductor that covers the design and manufacture of systemlogic devices. The devices are for use in future Alpha-based systems.

• VLSI and Hitachi renewed and expanded their 1988 standard cell and process technology exchangeagreement. The new pact added gate array technology, and the two companies will develop compatible gatearray families. In July 1996, Hitachi licensed its SuperH-3 RISC MPU core to VLSI, who plans to offer it as a CPUcore in ASICs and ASSPs for applications such as handheld computing devices, navigation systems, digitalentertainment, and multimedia peripherals.

• The DSP Group licensed its Pine™ digital signal processing core technology and its TrueSpeech™ speechcompression technology to VLSI Technology in 1994. The new technologies were added to VLSI's FSBlibrary for design in wireless communications applications.

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• In late 1994, VLSI licensed Santa Clara, California-based Mediametrics Inc.'s MPEG-1 and MPEG-2 videodecompression technology, supporting the company's drive into the set-top box and direct broadcast satellitemarkets.

• VLSI announced its intention to jointly develop and market fuzzy logic-based ASIC technology for chip designand development capabilities with Togai InfraLogic, Inc. of Irvine, California.

• In February 1994, VLSI and Advanced RISC Machines, Ltd. renewed their agreement to expand marketopportunities for the ARM 32-bit architecture in embedded control and portable applications.


North American Company Profiles VTC

VTC

VTC Inc.2800 East Old Shakopee Road

Bloomington, Minnesota 55425-1350Telephone: (612) 853-5100

Fax: (612) 853-3355Web Site: www.vtc.com

IC Manufacturer


Japan: VTC Japan • Tokyo, JapanTelephone: (81) (3) 3389-6016

Europe: VTC Deutschland • GermanyTelephone: (49) (8071) 95304


1992 1993 1994 1995 1996

Sales 50 75 108 166 178

Employees 300 375 480 540 600


VTC was founded in 1984 to design and manufacture VHSIC products for government markets. Within the firstyear, VTC acquired Control Data Corporation's microcircuits division (a captive chip manufacturing operation forCDC's disk drive business that had operated since 1969). VTC was privately held, but Control Data was a majorinvestor.

Control Data purchased all of VTC in 1987, making it a wholly-owned subsidiary. In 1988, the two original foundersleft CDC and the company was put up for sale. In October 1990, CDC sold the bipolar portion to a managementbuyout led by VTC's current CEO, Larry Jodsaas. Before the end of the year, CDC also sold the CMOS fab toCypress.

Today, VTC's strategy is to offer quality, high-performance ICs to the data storage (disk and optical drive) industry.The company's revenues come from bipolar read/write preamplifiers and channel electronics found in disk drivesworldwide.

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VTC North American Company Profiles

Management

Larry Jodsaas President and Chief Executive OfficerCliff Boler Vice President, EngineeringJohn Doyle Vice President, QualityDan Griffith Vice President, Sales and MarketingGreg Peterson Vice President and Chief Financial OfficerRobert Rousseau Vice President, Human ResourcesEd Schnable Vice President, Manufacturing


VTC offers a broad line of read/write preamplifier standard products and channel ASICs for use in rigid disk drives.Processes used by the company are complementary bipolar (CBP), ECL, and BiCMOS (called PolarMOS).


VTC Inc.2800 East Old Shakopee RoadBloomington, Minnesota 55425-1350Cleanroom size: 32,000 square feetCapacity (wafers/week): 5,000Wafer size: 150mmProcesses: Bipolar, complementary bipolar, BiCMOSProducts: Standard and ASIC read/write preamplifiers, servo preamplifiers, and channel electronicsFeature sizes: 1.2µm, 2.0µm, 3.0µm


North American Company Profiles WSI

WSI

WSI, Inc.47280 Kato Road


Fax: (510) 657-5916Web site: www.wsipsd.com

Fabless IC Supplier


1992 1993 1994 1995 1996

Sales 28 27 28 38 44

Employees 137 125 125 125 100


WSI, Inc. (formerly WaferScale Integration, Inc.) was founded in 1983 as a supplier of high-performanceprogrammable ICs. It serves embedded system designers who need to achieve higher system performance,reduce system size and power consumption, shorten product development cycles to achieve faster market entry,and reduce manufacturing costs. It offers field-programmable microcontroller peripherals as well as high-performance non-volatile EPROM products.

Management

Michael Callahan Chairman, President, and Chief Executive OfficerBoaz Eitan Senior Vice President, Chief Technical OfficerYoram Cedar Vice President, New Business DevelopmentHoward Gopen Vice President, OperationsRobert Hoard Vice President, Worldwide SalesReza Kazerdunian Vice President, Research and DevelopmentCarl Mills Vice President, Finance


WSI supplies several families of programmable microcontroller peripherals as well as a broad line of highperformance non-volatile PROM and EPROM devices. These products are based on the company's patentedself-aligned split-gate CMOS EPROM technology. WSI's fast EPROMs are available in densities ranging from 16Kto 1M. The programmable peripherals integrate EPROM, SRAM, PLD, and user-configurable logic.

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WSI North American Company Profiles


WSI does not have its own fabrication facility. It has foundry agreements with Sharp, National Semiconductor, AMI,SGS-Thomson, and Tower Semiconductor.

Key Agreements

• In January 1997, WSI signed a long-term technology exchange and foundry agreement with TowerSemiconductor. Under the agreement, the two companies will jointly develop manufacturing processtechnologies such as WSI’s AMG EPROM architecture using Tower’s 0.6µm technology. The agreement alsoguarantees WSI access to Tower’s wafer capacity.

• National took a 10 percent stake in WSI as part of a five-year foundry and technology exchange agreement.

• WSI formed an alliance with American Microsystems to jointly develop mask-programmable versions of WSI'sline of microcontroller peripherals. AMI is manufacturing the parts and the companies are marketing themseparately.


North American Company Profiles Xicor

XICOR

Xicor, Inc.1511 Buckeye Drive


Fax: (408) 432-0640Web Site: www.xicor.com

IC Manufacturer


Japan: Xicor Japan K.K • Shinjuku-ku, Tokyo, JapanTelephone: (81) (3) 3225-2004 • Fax: (81) (3) 3225-2319

Europe: Xicor Ltd. • Witney, Oxford, United KingdomTelephone: (44) (1993) 700544 • Fax: (44) (1993) 700533


1992 1993 1994 1995 1996

Sales 93 104 104 114 124Net Income (30) (6) 2 10 14R&D Expenditures 22 13 14 15 15Capital Expenditures 6 2 5 9 25

Employees 840 800 691 641 680


Xicor, Inc., founded in 1978, designs and manufactures a broad line of non-volatile in-the-system programmablesemiconductor ICs. In-the-system programmability enables telecommunications, consumer, computer, industrial,automotive, and military products to adapt to changing software and operating environments, and to bepersonalized by the user. Many of Xicor’s products consume little power and operate well from a battery poweredsource, making them well suited for hand-held and portable applications.

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Xicor North American Company Profiles


PCs, Peripherals& Networking

25%

Industrial, Military,& Transportation

25%

Telecom25%

Consumer25%

United States52%


Japan14%

Europe23%

ROW11%

Xicor emphasizes the development of proprietary products that incorporate its programmable technology,enabling customers to rapidly bring to market products with improved features, efficiency and maintainability. In1995, Xicor introduced its first SerialFlash™ memory product family, which operates from low voltage powersources. Xicor is a leading supplier of EEPROM memory products and EEPOT™ digitally controlledpotentiometers.

Management

Raphael Klein Chairman, President, and Chief Executive OfficerJoseph Drori Vice President, Products Design, Engineering, Quality, and ReliabilityBruce Gray Vice President, Wafer OperationsGeraldine N. Hench Vice President and Corporate ControllerKlaus G. Hendig Vice President, Finance and AdministrationTimothy D. Kanemoto Vice President, Product OperationsDennis E. Krueger Vice President, North America SalesMadga M. Madriz Vice President, Human ResourcesBruce W. Mattern Vice President, Sales and MarketingWilliam H. Owen III Vice President, Technology Development and Intellectual Properties


Xicor offers serial EEPROMs in 128-bit to 128K densities, parallel EEPROMs in 16K to 1M densities, Serial Flashmemories in 8K to 128K densities, Secure SerialFlash devices for data security applications, NOVRAMs(nonvolatile SRAMs), NOVRAMs with Autostore™ power-loss data protection, EEPOT™ digitally controlledpotentiometers, EEPROMs that interface directly with microcontrollers or microprocessor bus-based systems, andmemory subsystems.

Xicor is also a licensee of the Pine 16-bit fixed-point DSP core and related development tools from DSP Group.The firm is developing products that integrate the Pine DSP core with its EEPROM technology.


North American Company Profiles Xicor


Xicor, Inc.1511 Buckeye DriveMilpitas, California 95035-7493Capacity (wafers/week): 1,250Wafer size: 150mmProcesses: CMOS, NMOSProducts: EEPROM-based ICs and chipsetsFeature sizes: 0.6µm-1.0µm

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Xilinx North American Company Profiles

XILINX

Xilinx, Inc.2100 Logic Drive


Fax: (408) 559-7114Web Site: www.xilinx.com

Fabless IC Supplier


Japan: Xilinx K.K. • Tokyo, JapanTelephone: (81) (3) 3297-9191

Europe: Xilinx Ltd. • Surrey, United KingdomTelephone: (44) (1932) 349401

Asia-Pacific: Xilinx Asia-Pacific Ltd. • Kwai Fong, Hong KongTelephone: (852) 2424-5200


1993 1994 1995 1996 1997

Sales 178 256 355 561 568Net Income 27 41 59 102 110R&D Expenditures 24 34 45 65 71Foundry Fab Investment — — — 34 35

Employees 544 689 868 1,201 1,500


Founded in 1984, Xilinx is the leading supplier of CMOS programmable logic devices (PLDs) and relateddevelopment system software. The company’s PLD product lines include field programmable gate arrays (FPGAs)and complex PLDs (CPLDs). Xilinx is credited with the invention of the FPGA and brought the first such device tomarket in 1985. The company also markets HardWire™ devices, which are mask-programmed ICs functionallyequivalent to programmed FPGAs.

Xilinx has remained the world’s largest supplier of FPGAs from the beginning and became the largest supplier ofPLDs in general in 1994. The company ships its PLDs and related development system software to electronicequipment manufacturers in the data processing, telecommunications, networking, industrial control andinstrumentation, and military markets.


North American Company Profiles Xilinx


FPGAs85%

SystemSoftware

3%

CPLDs2%

EPROMs5%

Hardwire5%

North America65%


Europe23%

Asia-Pacific 12%

Xilinx expanded its presence in the PLD market through the 1992 acquisition of Plus Logic, Inc., a companyinvolved in electrically programmable logic devices (EPLDs). In April 1995, Xilinx acquired NeoCAD, Inc., a privateFPGA design software producer. NeoCAD’s software technology was integrated into Xilinx’s development systemsoftware.

Xilinx continues to focus its product strategy on setting new standards for lower complexity CPLDs whilemaintaining a leadership position in the FPGA market, addressing high volume applications with its HardWireproducts, and providing support for all product families with user-friendly software.

In mid-1996, the company announced its decision to withdraw from the antifuse FPGA market and discontinue itsXC8100 family of one-time-programmable antifuse devices. The company claimed the decision was based on thestrong market acceptance of its SRAM- and flash-based devices. Research and development efforts previouslyfocused on antifuse devices will be redirected toward its core FPGAs and CPLDs.

Later in 1996, Xilinx announced the formation of the Digital Signal Processing (DSP) Business Unit. The primaryfocus of the DSP Business Unit is to integrate DSPs into the company’s FPGAs. Xilinx plans to develop the toolkits, cores, and software integration for the FPGA-based DSPs, which Xilinx claims will operate 10 times faster thannormal FPGAs.

Management

Bernard V. Vonderschmitt ChairmanWillem P. Roelandts President and Chief Executive OfficerR. Scott Brown Senior Vice President, Worldwide SalesGordon M. Steel Senior Vice President, Finance, and Chief Financial OfficerWilliam S. Carter Vice President and Chief Technical OfficerLee D. Farrell Vice President, Program ManagementCharles A. Fox Vice President and GM, Hardwire Business UnitSteve Hayes Vice President, North American SalesRobert C. Hinckley Vice President, Strategic Plans and Programs, and SecretaryNicholas Kucharewski Vice President, CPLD DivisionC. Frank Myers Vice President, Operations

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Xilinx North American Company Profiles

Dennis L. Segers Vice President, FPGA Product DevelopmentRichard W. Sevcik Vice President, SoftwareSandra L. Sully Vice President and Chief Information OfficerChristine C. Taylor Vice President, Human ResourcesRoland Triffaux Vice President, European Sales and MarketingSandeep Vij Vice President, MarketingEvert A. Wolsheimer Vice President and GM CPLD Business UnitRoman Iwanczuk Director, DSP Business UnitScott Lewis Director, CPLD Marketing


Xilinx’s product line consists of FPGAs, HardWire Array products, EPROMs for external storage of FPGAconfiguration programs, and CPLDs. All of its products are manufactured using CMOS technology, with the mostadvanced chips utilizing a 0.35µm, three-layer-metal process. A 0.25µm, five-layer-metal process is expected tobe implemented in 2H97.

FPGA Products

XC2000 family—Being discontinued.XC3000 family—General-purpose architecture with usable gate densities ranging from 1,500 to 7,500 gates. The

older XC3000-70 and XC3000A products are being discontinued.XC4000 family—The company’s most successful FPGA architecture. The family consists of 13 SRAM-based

members ranging in density from 3,000 to 85,000 logic gates. The older XC4000A andXC4000H sub-families are being discontinued. At the high end, Xilinx offers the XC4000EXand XC4000XL sub-families. Introduced in early 1997, the XC4000XL series features high-performance 3.3V operation through the use of a 0.35µm CMOS process. Devices with up to125,000 usable gates are expected to sample in mid-1997 (the XC4000XZ series).

XC5200 family—With a process-optimized architecture, the XC5200 parts are the first FPGAs specificallydeveloped as a cost effective, high volume production alternative to gate arrays.

XC6200 family—Sea-of-gates FPGAs designed for reconfigurable coprocessing applications within theembedded controller market. Introduced in August 1996, the XC6200 family consists ofdevices ranging in density from 9,000 to 100,000 gates.

XC8100 family—Discontinued line of one-time programmable antifuse-based FPGAs.

HardWire Array Products

The company’s hardwire process converts a Xilinx FPGA into a HardWire mask-programmed array offering quicktime-to-market and a reduction in cost. For every Xilinx FPGA family, there is a corresponding hardwire family. In1997, Xilinx expanded its HardWire product offerings with the addition of a PCI+ conversion device featuring fullPCI compliance and up to 10,000 gates of customer specific logic.


North American Company Profiles Xilinx

CPLD Products

XC7000 family—High performance CPLDs with 400 to 3,800 usable gates and aimed at PAL replacement andlogic integration applications.

XC9500 family—Volume production of these flash memory-based CPLDs began in January 1997. The XC9500devices features in-system programmability with more than 10,000 program/erase cycles, 36 to576 macrocells with 800 to 12,800 usable gates, and pin-to-pin delays as low as 5ns. Xilinxexpects to migrate the family from a 5V 0.6µm process to a 3.3V 0.5µm process in 1997.

The company’s newest generation of XACTstep™ CAE software is based on the NeoCAD core technologies andprovides all the implementation technology required to design with Xilinx logic devices, including modulegeneration, design optimization and mapping, placement and routing, timing analysis, and program filegeneration.

In mid-1996, Xilinx introduced its LogiCore™ solutions, which are high-level functions that a designer canintegrate into FPGA designs. The first LogiCore product was a PCI interface for FPGAs, the PCI LogiCore™. Inearly 1997, the company announced a plan to broaden its core library through a partnership network programcalled AllianceCore. Xilinx and its third-party core partners (about 14 at the time of this writing) will work together todevelop products based on the cores in order to ensure that the designs work in silicon and are properly tested.The first products will be for USB peripherals and PCMCIA cards (available in 2H97).


Xilinx does not fabricate its own ICs, but has foundry agreements with Seiko Epson, Yamaha, IC Works, and UMC.

In early 1994, Xilinx provided its foundry partner Seiko Epson with $42 million to help fund a wafer fab SeikoEpson built in Sakata, Japan. In December 1996, Xilinx announced its plans to invest up to $300 million in a newsemiconductor manufacturing facility that is currently being constructed by Seiko Epson. The agreement calls forXilinx to make incremental advanced payments in return for a specified number of wafers through 2002.Production at the facility, which is located in Sakata, Japan, is expected to begin in early 1998.

Key Agreements

• Xilinx has a second-source agreement with Harris Semiconductor for rad-hard FPGAs.

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Zilog North American Company Profiles

ZILOG

Zilog, Inc.210 East Hacienda Avenue

Campbell, California 95008-6600Telephone: (408) 370-8000

Fax: (408) 370-8056Web Site: www.zilog.com

IC Manufacturer


Japan: Zilog, Inc. • Tokyo, JapanTelephone: (81) (3) 5272-0230

Europe: Zilog, Inc. • Maidenhead, United KingdomTelephone: (44) (1628) 392-00

Asia-Pacific: Zilog, Inc. • Taipei, TaiwanTelephone: (886) (2) 741-3125


1992 1993 1994 1995 1996


Employees 1,400 1,500 1,500 1,575 1,650


Zilog was founded in 1974 and became a wholly owned subsidiary of Exxon by 1980. In 1985, the companyrechartered its course to focus on application-specific market segments. In 1989, Zilog's management,employees, and a venture capitalist purchased the company from Exxon. Zilog became a public company inFebruary 1991.

Today, Zilog is a leader in the development, design, and manufacture of application specific standard products(ASSPs) for the consumer electronics, data communications, and computer peripheral markets. The companyutilizes its Superintegration™ design methodology to combine cores and cells from its extensive library ofmicroprocessors and controllers, DSPs, and memory and logic circuits.


North American Company Profiles Zilog

United States44%


Europe 9%

Far East42%

ROW 5%

Zilog maintains its strategy of addressing the needs of specific applications by utilizing its proprietary core and celldesigns, which are optimized for particular applications, to design and develop new products within its targetmarkets. During 1996, Zilog introduced 48 new products, 37 for the consumer product controller market, eight forthe computer peripheral controller market, and three for the datacommunications market.

Management

Edgar A. Sack Chairman, President, and Chief Executive OfficerMichael J. Bradshaw Senior Vice President, Worldwide OperationsThomas C. Carson Senior Vice President, Worldwide Sales, and Strategic

Marketing Manager, Wireless and Memory Business UnitSally M. Baumwell Vice President, Human ResourcesRobert E. Collins Vice President and Chief Financial OfficerJames J. Magill Vice President and General Manager, Data CommunicationsRichard L. Moore Vice President, TechnologyRichard R. Pickard Vice President, General CounselAlan Secor Vice President, Consumer/PeripheralsTom Willey Vice President, Wireless Division


Zilog's core library includes 8-bit microcontrollers, 8-bit, 16-bit, and 32-bit microprocessors, 16-bit digital signalprocessors, serial communications controllers, and peripheral circuits. These cores are available as stand-alonedevices or may be combined in Superintegration products. The company’s cell library consists of logic andmemory circuits that are generally combined in Superintegration products.

The Superintegration library and diverse product portfolio of over 800 items serve three distinct markets: datacommunications, consumer products, and intelligent peripherals.

• For data communications applications, Zilog offers ASSPs based on its Z80 microprocessor family andserial communications controllers. These ASSPs are optimized for Ethernet routers, bridges, dataswitches, modems, terminals, printers, workstations, local area networks, and wide area networks. Thecompany holds a leadership position in general purpose, multiprotocol controllers for the LAN and WANmarkets.

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Zilog North American Company Profiles

• Based on the Z8® 8-bit microcontroller, Zilog offers a family of controllers for use in consumer electronicsproducts such as cellular phones, audiovisual equipment, automobiles, telephone answering machines,household appliances, battery chargers, garage door openers, security systems, set-top boxes, interactiveTVs, and infrared remote controls.

• Zilog is an innovator in the addition of intelligence to computer peripheral chips using its line of Z80® 8-bit,Z180® 16-bit, and Z380® 32-bit microprocessors, and peripheral circuits. Adding intelligence to computerperipherals frees the central processor from micro-management tasks and upgrades the performance ofthe system. Common peripherals are printers, keyboards, monitors, pointing devices, hard disk and floppydisk controllers, modems, and PCMCIA bus interface products.


Zilog, Inc. Zilog, Inc.2601 11th Avenue, North Extension 1401 North King RoadNampa, Idaho 83651 Nampa, Idaho 83651Telephone: (208) 466-4551 Module IIIFax: (208) 467-9765 Cleanroom size: 30,000 square-feet (Class 1)Modules I and II Capacity (wafers/week): 2,500Cleanroom size: 77,000 square feet (Class 10) Wafer size: 200mmCapacity (wafers/week): 7,000 Process: CMOSWafer sizes: 100mm, 125mm Products: ASSPs, MCUs, MPUs, DSPsProcesses: NMOS, CMOS, BiCMOS Feature sizes: 0.35µm 0.6µm, 0.8µmProducts: ASSPs, MCUs, MPUs, DSPsFeature sizes: 0.6µm, 0.8µm, 1.0µm, 1.2µm

Assembly and test operations are performed in company-owned facilities in Manila and Carmona, the Philippines.Contracts with outside IC fabricators Kawasaki Steel in Japan and Thesys Microelectronics in Germany, and withassembly houses in Malaysia, Indonesia, and China are back-up sources to the company's own operations.

Key Agreements

• Zilog teamed up with Analog Devices, Inc. (ADI) in early 1997, to jointly develop a new reference design forcordless telephones. Zilog agreed to supply DSP-based software and ADI agreed to supply RF technology todesign a chipset for 900MHz spread spectrum cordless telephones. Production of the chipset/referencedesign is expected to take place in the second half of 1997.

• Zilog signed an agreement with United Kingdom-based MSU Corporation to jointly develop and manufacturechipsets targeting the low-cost TV Internet set-top applications. As part of the agreement, MSU transferred itsinternet service processor core to Zilog.

• Zilog licensed graphicTV (GTV) technology from TV graphics startup, Telecruz Technology, in a plan todevelop ICs for television with high definition graphics. Zilog will integrate the GTV architecture into its Z90700family of TV controllers.


North American Company Profiles Zilog

• Zilog purchased a license in 1995 for the design and manufacture of ASSPs using Aspec Technology's high-density array and embedded array technologies.

• Zilog joined with Allegro MicroSystems and IMP in a marketing alliance. The team is marketing what they call aZIA disk drive chipset—ZIA standing for Zilog, IMP, and Allegro.

• Oak Technology and Zilog extended a joint-development and cross-license agreement to develop integratedcircuits for mass storage applications.

• Zilog has an agreement (formed in 1993) with Kawasaki Steel under which Zilog is licensed to manufacture,use, and sell the Kawasaki KC80™, an enhanced high-performance version of the Z80™ 8-bit microprocessor.Additionally, the companies are developing new Superintegration products that use the KC80 core.

• Zilog and Catalyst entered into a cross-licensing agreement in 1993 under which Zilog gained access toCatalyst's flash technology and Catalyst gained the right to develop products using Zilog's Z8 one-time-programmable (OTP) microcontroller family. The two companies then expanded their alliance to jointly developflash memories.

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Zoran North American Company Profiles

ZORAN

Zoran Corporation2041 Mission College Boulevard, Suite 255


Fax: (408) 986-1240Web Site: www.zoran.com

Fabless IC Supplier


Asia: Zoran Microelectronics Ltd. • Haifa, IsraelTelephone: (972) (4) 854-5777 • Fax: (972) (4) 855-1550


1992 1993 1994 1995 1996

Sales 7 5 8 23 44Net Income (3) (8) (5) 1 2R&D Expenditures 5 5 4 6 9

Employees 75 135


Zoran Corporation, first incorporated in 1981, and reincorporated in 1986, develops and markets integratedcircuits and software for digital video and audio compression and decompression applications. The company’s ICsare used in a wide variety of products, such as professional and consumer video editing systems, PC-based andstand-alone video CD systems, DVD players, digital audio systems, filmless digital cameras, and printers/scanners.

Prior to 1991, Zoran derived the substantial majority of its revenues from digital filter processors (DFPs) and vectorsignal processors (VSPs), which are DSP-based ICs used for image enhancement and processing, principally inmilitary, industrial, and medical applications. In 1989, the company repositioned its business to utilize its expertisein DSP technology to develop and market video and audio compression circuits. In mid-1994, Zoran discontinuedDFP and VSP product lines.

Zoran has a strong core expertise in DSP technology, including digital filtering and frequency domain processing.Its strategy centers on building partnerships with innovative marketing and manufacturing companies andtargeting high-volume, high-performance applications, such as multimedia computing and consumer video andaudio systems.


North American Company Profiles Zoran

In October 1996, Zoran entered the software compression market through its acquisition of CompCoreMultimedia, Inc., a leading provider of digital audio and video MPEG-1 and MPEG-2 decoding technologies andproducts. The acquisition has broadened Zoran’s product offering to include MPEG cores and softwarecompression products particularly for the PC-based DVD market.

MPEG-19%


Audio34%

JPEG 39%

Software14%

Other4%

United States26%


Europe31%

Pacific Rim43%

Management

Uzia Galill ChairmanLevy Gerzberg, Ph.D. President and Chief Executive OfficerGeorge Haber Executive Vice PresidentAmi Kraft Vice President, Finance, and Chief Financial OfficerPaul Goldberg Vice President, Business SolutionsIsaac Shenberg Vice President, Sales and MarketingMeir Tsadik Vice President, Research and Development, and Chief Operating OfficerSorin Cismas Chief ScientistAlexander Sinar Director, Manufacturing


Zoran’s IC products include JPEG codecs, MPEG video decoders, Dolby AC-3 and MPEG audio decoders, andPCI multimedia controllers. The company is the leading supplier of JPEG ICs and support devices for theconsumer and PC markets.

Additionally, Zoran is the leading supplier of Dolby Digital (AC-3) devices. Its third-generation Dolby AC-3/MPEG-2digital audio processors was introduced in late 1996. The ZR38600 processor uses only 75 percent of theprocessors power for audio decoding, leaving the remaining 25 percent available for product differentiation. Thedevice is targeted at home theater, DVD, and consumer multimedia applications.

Most of Zoran’s devices are fabricated using 0.6µm and 0.8µm CMOS technologies.

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Zoran North American Company Profiles


For the fabrication of its wafers, Zoran has foundry agreements with Fujifilm Microdevices, Motorola, TSMC, andTower Semiconductor.

Key Agreements

• In late 1996, Zoran announced an agreement with Toshiba which stated that Toshiba would use Zoran’s Dolbydigital two-channel AC-3/MPEG audio processor in a DVD chipset.

• In 1995, Zoran signed a four-year agreement with Tower Semiconductor under which Tower will supplyspecified quantities of wafers to Zoran.

• Siemens and Zoran announced in 1995 they would collaborate on the development and marketing ofmultimedia ICs for PC and consumer electronics applications.

• Dolby Laboratories formed a long-term joint technology partnership with Zoran in August 1992. Thepartnership involves the development of low-cost ICs for multi-channel digital audio for motion-picturesoundtracks and consumer media.

• Zoran has the marketing rights to JPEG chips produced by the company’s Japanese partner, Fujifilm.


North American Company Profiles

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