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Smart Structures + Nondestructive Evaluation

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spie.org/ssncall

CALL FORPAPERS

Submit abstracts by 16 October 2019

26–30 April 2020Anaheim MarriottAnaheim, California, USA

Present your work at Smart Structures + Nondestructive EvaluationThe leading event for advanced materials, sensor systems, and structural health monitoring.

Technologies• Nondestructive Characterization

and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation

• Health Monitoring of Structural and Biological Systems

• Smart Structures and NDE for Industry 4.0, Smart Cities, and Energy Systems

• Smart Materials and Nondestructive Evaluation for Energy Systems

Conferences and Courses 26–30 April 2020

Anaheim MarriottAnaheim, California, USA


• Bioinspiration, Biomimetics, and Bioreplication

• Electroactive Polymer Actuators and Devices

• Active and Passive Smart Structures and Integrated Systems

• Behavior and Mechanics of Multifunctional Materials

• Nano-, Bio-, Info-Tech Sensors and 3D Systems

• Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems

spie.org/ssncall

Symposium Chairs:

The Organizing Committee of SPIE’s 27th Annual International Symposium on Smart Structures + Nondestructive Evaluation invites you to attend this year’s meeting. This unique symposium offers many opportunities to network with colleagues from a variety of disciplines in academia, industry, and government from all over the world.

Organized in ten parallel conferences, SS/NDE brings together emerging technologies and advanced research in instrumentation, sensing, and measurement science with advanced materials, diagnostics, and smart systems. Engineers and researchers from government, military, academia and the commercial sector will discuss the current status and future directions of smart structures and materials, NDE, and health monitoring. Case studies, emerging research agendas, and innovative new technologies will be presented.

The Symposium covers all aspects of the evolving fields of materials, enabling technologies, sensor/actuator design, and applications of these technologies to cover the whole spectrum of life in the 21st century, including commercial, medical, aerospace, Smart Cities and Industry 4.0. It also includes several conferences on NDE and structural health monitoring: safety, security, characterization of materials, detection of materials defects and degradation, evaluation of the state of damage to enable reliable component failure prediction, application of micro- and nanomaterial systems, energy systems, Smart Cities, and infrastructure.

This meeting is a showcase for multidisciplinary research and provides an excellent opportunity to explore new research areas by teaming with new partners from many fields. We look forward to seeing you in Anaheim!

Plan to Participate

Symposium Co-Chairs:

Zoubeida OunaiesThe Pennsylvania State Univ. (USA)

Anastasia MulianaTexas A&M Univ. (USA)

Hoon SohnKAIST (Republic of Korea)

Wieslaw M. OstachowiczThe Szewalski Institute of Fluid-Flow Machinery (Poland)

2 SPIE SMART STRUCTURES + NONDESTRUCTIVE EVALUATION 2020 • spie.org/ssncall

Advanced technologies for nondestructive evaluation, structural health monitoring, smart materials, and engineered biorobotics

EXECUTIVE ORGANIZING COMMITTEEIain A. Anderson, The Univ. of Auckland (New Zealand)

Yoseph Bar-Cohen, Jet Propulsion Lab. (USA)

Dan Clingman, Boeing Research and Technology (USA)

Paul Fromme, Univ. College London (United Kingdom)

Kerrie Gath, Ford Motor Co. (USA)

Mariantonieta Gutierrez Soto, Univ. of Kentucky (USA)

Andrew L. Gyekenyesi, Ohio Aerospace Institute (USA)

Jae-Hung Han, KAIST (Korea, Republic of)

Ryan L. Harne, The Ohio State Univ. (USA)

Haiying Huang, The Univ. of Texas at Arlington (USA)

Ajit Khosla, Concordia Univ. (Canada)

Jaehwan Kim, Inha Univ. (Korea, Republic of)

Mato Knez, CIC nanoGUNE Consolider (Spain)

Akhlesh Lakhtakia, The Pennsylvania State Univ. (USA)

Raúl J. Martín-Palma, Univ. Autónoma de Madrid (Spain)

Theodoros E. Matikas, Univ. of Ioannina (Greece)

Christopher Niezrecki, Univ. of Massachusetts Lowell (USA)

Ilkwon Oh, KAIST (Korea, Republic of)

Shima Shahab, Virginia Polytechnic Institute and State Univ. (USA)

Herbert R. Shea, Ecole Polytechnique Fédérale de Lausanne (Switzerland)

Peter J. Shull, The Pennsylvania State Univ. (USA)

Hoon Sohn, KAIST (Korea, Republic of)

Kyo D. Song, Norfolk State Univ. (USA)

Zhongqing Su, The Hong Kong Polytechnic Univ. (Hong Kong, China)

Gang Wang, The Univ. of Alabama in Huntsville (USA)

Aimy Wissa, Univ. of Illinois at Urbana-Champaign Chapter (USA)

H. Felix Wu, U.S. Dept. of Energy (USA)

Tzu-Yang Yu, Univ. of Massachusetts Lowell (USA)

Daniele Zonta, Univ. of Strathclyde (United Kingdom)

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SSN01 Bioinspiration, Biomimetics, and Bioreplication X (Knez) . . . . . . . . . . . 4

SSN02 Electroactive Polymer Actuators and Devices (EAPAD) XXII (Bar-Cohen) . . . . . . . . . . . . . . . . . . . . . 5

SSN03 Active and Passive Smart Structures and Integrated Systems IX (Han) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

SSN04 Behavior and Mechanics of Multifunctional Materials IX (Harne) 7

SSN05 Nano-, Bio-, Info-Tech Sensors and 3D Systems (Kim) . . . . . . . . . . . . 8

SSN06 Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems (Huang) . 10

SSN07 Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation IX (Yu) . . . . . . . . . . . .12

SSN08 Health Monitoring of Structural and Biological Systems IX (Fromme) . . .13

SSN09 Smart Structures and NDE for Industry 4.0, Smart Cities, and Energy Systems (Gath) . . . . . . . . . . .14

SSN10 Smart Materials and Nondestructive Evaluation for Energy Systems V (Niezrecki) . . . . . . . . . . . . . . . . . . . . . .16

EAP-in-Action Demo Session . . . . . . . . . . . . . .17General Information . . . . . . . . . . . . . . . . . . . . . .18Submission of Abstracts . . . . . . . . . . . . . . . . . .19

Contents


CALL FOR PAPERS CALL FOR PAPERS


SMART STRUCTURES + NONDESTRUCTIVE EVALUATION 2020

Submit your abstract today: spie.org/ssncall

Bioinspiration, Biomimetics, and Bioreplication X (SSN01)Conference Chair: Mato Knez, CIC nanoGUNE Consolider (Spain)

Conference Co-Chairs: Akhlesh Lakhtakia, The Pennsylvania State Univ. (USA); Raúl J. Martín-Palma, Univ. Autónoma de Madrid (Spain)

Program Committee: Javaan S. Chahl, Univ. of South Australia (Australia); Vincenzo Fiumara, Univ. degli Studi della Basilicata (Italy); Laurent A. Francis, Univ. Catholique de Louvain (Belgium); Jae-Hung Han, KAIST (Republic of Korea); Olaf Karthaus, Chitose Institute of Science and Technology (Japan); Kwang Jin Kim, Univ. of Nevada, Las Vegas (USA); Mathias Kolle, Massachusetts Institute of Technology (USA); Bert Müller, Univ. Basel (Switzerland); Maurizio Porfiri, NYU Tandon School of Engineering (USA); Akira Saito, Osaka Univ. (Japan)

Sponsored by:

Engineered biomimicry, comprising bioinspiration, biomimetics, and bioreplication, takes ideas and concepts from nature to implement them in different fields of science and technology, ranging from engi-neering to computing, aiming at the development of novel devices with tailored functionalities. This rapidly evolving field, given the broad technological advances which allow approaching the sophistica-tion of biological systems, is highly multidisciplinary in nature. As such, it embraces aspects related to physics, chemistry, biology, materials science, nan-otechnology, neuroscience, mechanical properties, computing and control, design integration, optimiza-tion, multifunctionality, multicontrollability, and cost effectiveness.

The tenth edition of this conference welcomes con-tributions from industry, academia, and government research organizations. Topics of interest cover any relevant aspects of engineered biomimicry, from the-oretical considerations, production, and characteri-zation to practical applications.

Topics include, but are not limited to: • fundamental processes (aerodynamics,

adhesion, superhydrophobicity and self-cleaning, nano and microfluidics, structural colors, rheology, photonics, locomotion, visual systems)

• materials (biomaterials, composites, high-strength membranes, ultralightweight structures)

• detection/sensor systems (electronic noses and tongues, photonic devices)

• devices (multifunctional devices, miniature devices, neuromorphic devices and systems, polarizers)

• applications (robotics, architecture, biomedical and pharmaceutical applications, marine applications, communications and informatics, functional/decorative coatings)

• energy and resource efficiency • biobeneficial bioinspiration.

The Bioinspiration, Biomimetics, and Bioreplication X conference chairs will choose the Best Student Paper Award from their conference. This award is spon-sored by the Optical Society of Southern California. A cash prize will be given to the first, second, and third place winners.

Abstracts Due: 16 October 2019

Author Notification: 20 December 2019The contact author will be notified of acceptance by email.

Manuscripts Due: 1 April 2020

PLEASE NOTE: Submission implies the intent of at least one author to register, attend the conference, present the paper as scheduled, and submit a full-length manuscript for publication in the conference proceedings.

SAVE THE DATE


CALL FOR PAPERS

Electroactive Polymer Actuators and Devices (EAPAD) XXII (SSN02)Conference Chair: Yoseph Bar-Cohen, Jet Propulsion Lab. (USA)

Conference Co-Chairs: Iain A. Anderson, The Univ. of Auckland (New Zealand); Herbert R. Shea, Ecole Polytechnique Fédérale de Lausanne (Switzerland)

Program Committee: Barbar J. Akle, Lebanese American Univ. (Lebanon); Kinji Asaka, National Institute of Advanced Industrial Science and Technology (Japan); Pavol Bauer, Technische Univ. Delft (Netherlands); Ray H. Baughman, The Univ. of Texas at Dallas (USA); Václav Bouda, Czech Technical Univ. in Prague (Czech Republic); Suresh Chandra, Institute of Technology, Banaras Hindu Univ. (India); Hyouk Ryeol Choi, Sungkyunkwan Univ. (Korea, Republic of); Gal deBotton, Ben-Gurion Univ. of the Negev (Israel); Yahya A. Ismail, A’Shargiyah Univ. (Oman); Edwin W. H. Jager, Linköping Univ. (Sweden); Giedrius Janusas, Kaunas Univ. of Technology (Lithuania); Martin Kaltenbrunner, Johannes Kepler Univ. Linz (Austria); Christoph Keplinger, Univ. of Colorado Boulder (USA); Kwang Jin Kim, Univ. of Nevada, Las Vegas (USA); Gabor M. Kovacs, EMPA (Switzerland); Maarja Kruusmaa, Univ. of Tartu (Estonia); Jinsong Leng, Harbin Institute of Technology (China); John D. W. Madden, The Univ. of British Columbia (Canada); Toribio F. Otero, Univ. Politécnica de Cartagena (Spain); Qibing Pei, Univ. of California, Los Angeles (USA); Thelge Chaminda Peiris, MAS Innovation Ltd. (Sri Lanka); Aaron D. Price, Western Univ. (Canada); Valentin Radu, Omicron Plus S.R.L. (Romania); Mehdi Razzaghi-Kashani, Tarbiat Modares Univ. (Iran, Islamic Republic of); Jonathan M. Rossiter, Univ. of Bristol (United Kingdom); Anuvat Sirivat, Chulalongkorn Univ. (Thailand); Anne Ladegaard Skov, Technical Univ. of Denmark (Denmark); Geoffrey M. Spinks, Univ. of Wollongong (Australia); Ji Su, NASA Langley Research Ctr. (USA); I-Hsiang Tseng, Feng Chia Univ. (Taiwan); Rocco Vertechy, Univ. degli Studi di Bologna (Italy); Frédéric Vidal, Univ. de Cergy-Pontoise (France); Thomas Wallmersperger, Technische Univ. Dresden (Germany); Jian Zhu, National Univ. of Singapore (Singapore); Pawel Zylka, Wroclaw Univ. of Technology (Poland)

EAP materials have unique characteristics that are enabling many new technologies. Their character-istics include the ability to undergo larger displace-ments than almost any other class of smart materi-als, the pliability needed for biomimetic and other mechanically flexible systems, and low density. Of particular interest is their potential to augment, im-prove upon, and possibly replace biological muscles. Besides their attractive characteristics as actuators, they are also being exploited to enable new types of generators or sensors. Development of effective and robust mechanisms and devices that are actu-ated by EAP materials requires improved theoretical and empirical understanding of their behavior, de-sign concepts for efficient actuation, generation and sensing, and reliable and repeatable fabrication and characterization methods, as well as effective control algorithms and electronics. The objective of this con-ference is to identify EAP material improvements and new developments: enhance the understanding of their behavior, including effective modeling of their electro-mechanics and chemistry, cover techniques of processing and characterization, and highlight ap-plications of these materials. Further, this conference is seeking to promote the development of high per-formance EAP as smart materials and to increase the recognition of EAP as viable options for use in smart structures.

Papers are solicited on but not limited to the follow-ing EAP related topics: • advances in actuation, sensing, and

proprioception using EAP materials, as well as carbon-based and inorganic materials (namely, in addition to electric, these include materials that are driven by heat, light or other energy inputs)

• theoretical models, analysis, and simulation including computational chemistry

• measurement, testing, and characterization methods

• manufacturing technologies, including electroding, synthesis, processing, shaping, and fabrication

• design and engineering of actuators, sensors, and their integration into systems

• technology from miniature scale (MEMS, micro, and nano) to large devices

• applications in artificial muscles, robotics, biomimetics, energy harvesting, medical, industry, etc.

• driving electronics, system integration, and packaging

• control algorithms for devices and their implementation in software and hardware.

2020 Special Session: Advances in EAP Manufacturing

2020 EAPAD Keynote Presentations: “Novel Field Robots and Robotic Exoskeletons: Design, Integration, and Applications”, Pinhas Ben-Tzvi, Virginia Polytechnic Institute and State Univ. (USA); “Highlights from Chairing the EAPAD Conference for 22 Years”, Yoseph Bar-Cohen, Jet Propulsion Lab. (USA)

EAP-IN-ACTION DEMONSTRATION SESSIONThis industry session, held annually as part of the SPIE’s EAPAD conference, turns the spotlight on Electroactive Polymers (EAP) materials and applications, illustrating the state-of-the-art capabilities that make EAP one of the leading “actuators-of-choice”. New materials and application areas are continuing to emerge and this session offers up-close demonstrations of EAP materials in action. The demonstration format enables interaction between the technology developers and potential users as well as a “hands-on” experience with this emerging technology. An award certificate will also be given to the top three Best EAP-in-Action Demonstration Award winners. Details can be found online on the Awards page at spie.org/ssncall.




Active and Passive Smart Structures and Integrated Systems IX (SSN03)Conference Chair: Jae-Hung Han, KAIST (Korea, Republic of)

Conference Co-Chairs: Gang Wang, The Univ. of Alabama in Huntsville (USA); Shima Shahab, Virginia Polytechnic Institute and State Univ. (USA)

Program Committee: Mehdi Ahmadian, Virginia Polytechnic Institute and State Univ. (USA); Steven R. Anton, Tennessee Technological Univ. (USA); Andres F. Arrieta, Purdue Univ. (USA); Hiroshi Asanuma, Chiba Univ. (Japan); Diann E. Brei, Univ. of Michigan (USA); Matthew Bryant, North Carolina State Univ. (USA); Gregory P. Carman, Univ. of California, Los Angeles (USA); Eun Jung Chae, California State Univ., Long Beach (USA); Seung-Bok Choi, Inha Univ. (Korea, Republic of); Amir H. Danesh-Yazdi, Rose-Hulman Institute of Technology (USA); Carlos De Marqui Jr., Univ. de São Paulo (Brazil); Alper Erturk, Georgia Institute of Technology (USA); Alison B. Flatau, Univ. of Maryland, College Park (USA); Mehrdad N. Ghasemi-Nejhad, Univ. of Hawai’i (USA); James M. Gibert, Purdue Univ. (USA); Victor Giurgiutiu, Univ. of South Carolina (USA); Nam Seo Goo, Konkuk Univ. (Korea, Republic of); Faramarz Gordaninejad, Univ. of Nevada, Reno (USA); Nakhiah C. Goulbourne, Univ. of Michigan (USA); Ryan L. Harne, The Ohio State Univ. (USA); Daniel J. Inman, Univ. of Michigan (USA); Hyung-Jo Jung, KAIST (Korea, Republic of); M. Amin Karami, Univ. at Buffalo (USA); Jung-Ryul Lee, KAIST (Korea, Republic of); Soobum Lee, Univ. of Maryland, Baltimore County (USA); Junrui Liang, ShanghaiTech Univ. (China); Wei-Hsin Liao, The Chinese Univ. of Hong Kong (Hong Kong, China); Zhu Mao, Univ. of Massachusetts Lowell (USA); David L. Mascareñas, Los Alamos National Lab. (USA); Mostafa A. Nouh, Univ. at Buffalo (USA); Gyuhae Park, Chonnam National Univ. (Korea, Republic of); Norbert Schwesinger, Technische Univ. München (Germany); Yi-Chung Shu, National Taiwan Univ. (Taiwan); Henry A. Sodano, Univ. of Michigan (USA); Jiong Tang, Univ. of Connecticut (USA); Lihua Tang, The Univ. of Auckland (New Zealand); Serife Tol, Univ. of Michigan (USA); Dai-Hua Wang, Chongqing Univ. (China); Kon-Well Wang, Univ. of Michigan (USA); Ya S. Wang, Stony Brook Univ. (USA); Norman M. Wereley, Univ. of Maryland, College Park (USA); Jinkyu Yang, Univ. of Washington (USA); Byeng D. Youn, Seoul National Univ. (Korea, Republic of); Lei Zuo, Virginia Polytechnic Institute and State Univ. (USA)

In addition to the 250-word summary abstract, authors are welcome to submit an extended abstract (approximately 2 pages long, or 1,000 words) for review purposes.Acceptance priority will be given to authors who submit a 2-page summary of their work. The file can be submitted as a Word.doc or postscript file during the abstract submission process. The extended abstract, used for selecting the papers by session organizers, can include figures, test results, and references. The short abstract will be included in the publication that is provided to the conference attendees.

This conference, largely resulting from merge of the former ‘Damping and Isolation’ and ‘Smart Structures and Integrated Systems’ conferences, as well as a part of ‘Modeling, Signal Processing, and Control’ focuses on topics related to design, analysis, fabrication, and testing of active/passive smart dynamic structural systems. Structural vibration, damping, and acous-tic control of integrated systems can be enhanced through passive, active, and hybrid approaches. The conference emphasis is on the interplay of actuation, sensing, and processing capabilities to create active systems with new function capabilities. The goal is to create a multidisciplinary forum to bring together de-velopments in diverse application areas in aeronauti-cal, space, marine, transportation, civil applications, etc. The scope of the conference ranges from system level evaluation of smart structures to development,

modeling, and optimization of new actuation and sensing techniques for integrated systems. Authors are encouraged to describe developments in active materials, ‘smart’ structural components, and inte-gration of these and other constituent technologies into advanced systems that hold the potential for ex-panding the application of active and passive smart structures and integrated systems.

The primary topics for the conference are organized into the following ten sessions: • energy harvesting and scavenging • metamaterials and metastructures • biological-inspired systems and bio-MEMS • passive and active vibration isolation systems • magneto rheological systems • SMA- and piezo-based materials and systems • micro- and nano-integrated systems • aircraft, MAV/UAV, and morphing systems • smart sensing and signal processing for

diagnostics and prognostics • modeling, optimization, signal processing,

control, and design of integrated systems • acoustics and fluid-structure interaction.

Authors can select the session topic that best fits their work during the abstract submission process.


CALL FOR PAPERS

Behavior and Mechanics of Multifunctional Materials IX (SSN04)Conference Chair: Ryan L. Harne, The Ohio State Univ. (USA)

Conference Co-Chairs: Aimy Wissa, Univ. of Illinois at Urbana-Champaign Chapter (USA); Mariantonieta Gutierrez Soto, Univ. of Kentucky (USA)

Program Committee: Amir Ameli, Washington State Univ. Tri-Cities (USA); Gregory P. Carman, Univ. of California, Los Angeles (USA); Constantin Ciocanel, Northern Arizona Univ. (USA); Marcelo J. Dapino, The Ohio State Univ. (USA); Mohammad H. Elahinia, The Univ. of Toledo (USA); Nakhiah C. Goulbourne, Univ. of Michigan (USA); Darren J. Hartl, Texas A&M Univ. (USA); Daniel J. Inman, Univ. of Michigan (USA); Kwang Jin Kim, Univ. of Nevada, Las Vegas (USA); Dimitris C. Lagoudas, Texas A&M Univ. (USA); Hyeong Jae Lee, Jet Propulsion Lab. (USA); Donald J. Leo, Virginia Polytechnic Institute and State Univ. (USA); Jiangyu Li, Univ. of Washington (USA); Christopher S. Lynch, Univ. of California, Los Angeles (USA); Hani E. Naguib, Univ. of Toronto (Canada); William S. Oates, Florida State Univ. (USA); Zoubeida Ounaies, The Pennsylvania State Univ. (USA); Reza Rizvi, The Univ. of Toledo (USA); Ralph C. Smith, North Carolina State Univ. (USA); Vishnu Baba Sundaresan, The Ohio State Univ. (USA)

In addition to the 250-word summary abstract, authors are welcome to submit an extended ab-stract (approximately 2 pages long but no more than 9 pages), for review purposes.Acceptance priority will be given to authors who submit a supplemental file of their work. The file can be submitted as a Word.doc or postscript file during the abstract submission process. The extended abstract, used for selecting the papers by session organizers, can include figures, test results, and references. The short abstract will be included in the publication that is provided to the conference attendees.

Smart structures utilize active materials as sensors and actuators to sense and respond to the environ-ment. These may include active materials such as piezoelectrics, magnetostrictives, shape memory alloys, and many more. Development of smart struc-tures involves an integration of active and passive material systems that often cultivates unique mul-tiphysics coupling among the mechanical, electri-cal, magnetic, thermal, optical, and other physical properties. As new materials are developed, detailed characterizations are required to probe the multiple intertwined properties, while other active materials may be candidates for system integration wherein placement and deployment of the material in the application environment are essential for operational success.

This conference will bring together researchers across many disciplines to share about technical efforts advancing the materials science, mechanical principles, and application readiness of smart and active materials.

Topics of interest may include but are not limited to: • mechanics of smart and multifunctional

materials • modeling and characterization of smart and

multifunctional materials • constitutive behavior of active materials

• multifunctional materials development and characterization

• composite materials and nano-structured composite materials

• bio-functional materials and structures • soft, flexible electronic materials • shape memory alloys • shape memory polymers and ionic gels • ferromagnetic shape memory alloys • single crystal and polycrystalline ferroelectrics

and magnetostrictives • ferroelectrics and electrostrictives • magnetostrictives; galfenol • mechanics of metamaterials • bioinspired materials and structures • additive manufacturing of active materials • applications and system integrations of active

materials.





SAVE THE DATE



Nano-, Bio-, Info-Tech Sensors and 3D Systems (SSN05)Conference Chair: Jaehwan Kim, Inha Univ. (Korea, Republic of)

Conference Co-Chairs: Kyo D. Song, Norfolk State Univ. (USA); Ilkwon Oh, KAIST (Korea, Republic of); Ajit Khosla, Yamagata Univ. (Japan)

Program Committee: Amir Ameli, Washington State Univ. Tri-Cities (USA); Athanassia Athanassiou, Istituto Italiano di Tecnologia (Italy); Kean C. Aw, The Univ. of Auckland (New Zealand); Wei Chen, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO) CAS (China); Sang H. Choi, NASA Langley Research Ctr. (USA); Eugene Edwards, U.S. Army Research, Development and Engineering Command (USA); Hidemitsu Furukawa, Yamagata Univ. (Japan); Srinivasan Gopalakrishnan, Indian Institute of Science (India); Mamoru Kawakami, Yamagata Univ. (Japan); Adrian Koh, National Univ. of Singapore (Singapore); Kam K. Leang, The Univ. of Utah (USA); Yirong Lin, The Univ. of Texas at El Paso (USA); Hani E. Naguib, Univ. of Toronto (Canada); Simon Park, Univ. of Calgary (Canada); Steve Park, KAIST (Korea, Republic of); Maurizio Porfiri, NYU Tandon School of Engineering (USA); Yongrae Roh, Kyungpook National Univ. (Korea, Republic of); Debiprosad Roy Mahapatra, Indian Institute of Science (India); Ashok Srivastava, Louisiana State Univ. (USA); Kentaro Takagi, Nagoya Univ. (Japan); Hiroya Tanaka, Keio Univ. (Japan); Tauno Vaha-Heikkila, VTT Technical Research Ctr. of Finland (Finland); Vijay K. Varadan, The Pennsylvania State Univ. (USA); Wei-Chih Wang, Univ. of Washington (USA); W. Hong Yeo, Georgia Institute of Technology (USA); Hargsoon Yoon, Norfolk State Univ. (USA); Jianfeng Zang, Huazhong Univ. of Science and Technology (China); Xuanhe Zhao, Massachusetts Institute of Technology (USA)

This conference considers new ideas, technologies, and potential applications across a wide range of disciplines critical to nano-, bio-, and info-technolo-gies based sensors and systems as applied to health monitoring of human and complex systems in engi-neering and medicine. This year’s theme focuses on emerging areas of wearable technology, smart tex-tile innovation, organic thin films and printable flex electronics, thought-controlled devices and systems, mobile wearable healthcare systems, wireless power feedback routines and devices for medical technolo-gy, smart optical materials technology, long-life mi-cro-power systems, and thermoelectric energy con-version films and systems. Along with the research on sensors using nanostructures, sensor networking technology enables us to imagine a future where bil-lions of people regularly access applications in glob-al network as their daily routine. Newly developed technology of nanoscale sensors integrated with microelectronic components, especially with wireless communication devices will generate significant im-pact in broad range of applications such as human health care, national security and the environmental monitoring. The integration of the nanoscale sensors with RFID and wireless communication systems will provide vast opportunities for biological sensor ap-plications, especially for physiological monitoring of human health and bio-hazard material detection system networked with personal mobile phone and internet services. The experimental, technological, and theoretical aspects of the relevant micro and na-noscience in engineering and medicine are welcome. A special focus will be given to antiterrorist efforts, homeland defense applications, security electronics, and reliability/failure issues and human disease mon-itoring and control.

Next generation of nanosensor systems in healthcare will depend on low cost manufacturing and integra-tion of sensors by 3D printing of novel materials. 3D printing is currently one of the most emerging technologies. 3D printing implied with Internet of Things (IoT) will make 3D devices communicate each other. Our aim for introducing this important area in this conference is to visualize leading ideas for ex-changing and to make networking place with the most updated information of 3D technology among scientists, researchers, and engineers covering vast number of disciplines and develop novel knowledge

in healthcare for improving the quality of life. A smart textile innovation section will also devote new tech-nology approach using 3D printing sensors on e-bra, e-shirt, e-underwear, e-bedsheets, garments to be used in space exploration and military uniforms. A hands-on training on 3D printing will also be set up in the conference and a certificate will be given as com-pletion of the training in this emerging technology.

Organic electronics provide environmentally friendly devices and material technologies that are built on flexible and conformal substrates. The flexible elec-tronics is a key enabler for a number of platform technologies such as printed transistors, smart elec-tronic textiles, electronic papers and displays, em-bedded power sources and integrated sensing devic-es. A number of low-cost and large-area electronic applications also include smart cards, smart price, and inventory tags such as RFIDs.

The conference aims to add the following areas to promote interdisciplinary exchange in understanding engineering systems from biological ones: nanow-ires, carbon nanotubes, magnetic nanotubes, or-ganic electronics, MEMS, bioMEMS, nanostructures, nanoelectronics, microfluidics, high selectivity and sensitivity biological and chemical sensors, detec-tion of harmful chemical and biological agents, mi-crosensors for radioactivity, low power consumption physical and chemical sensors, security electronics, reliability and failure aspects, biomedical applica-tions, biomimetics, fast DNA sequencing, smart drug delivery, polymer electronics, nanooptics, analytical techniques at nanoscale, nanoassembly behavior, nanointegration, noise aspects and information tech-nology at nanoscale, multifunctional nanosystems, and nano/bio interface.

This conference will also focus on advanced methods for the testing, reliability, packaging, and metrology of micro-and nano-scale materials and devices. Pa-pers are solicited on, but not limited to, the following or related topics:

WEARABLE TECHNOLOGIES AND INTERFACING WITH INDUSTRIES • e-textile based smart garments • cardiac monitoring e-bra, e-bro, and e-band aid • monitoring neurological disorder with flexible

wireless EEG, EOG, EMG sensors


CALL FOR PAPERS

• smart communication module with smart phone, Wi-Fi, GSM, GPRS

• monitoring the on-set of sudden cardiac death of athletes, soldiers

• panel with industries pursuing the wearable technology

• organic thin film and printable electronics • integration of flex electronics for wearable

medical devices.

3D PRINTING AND SMART SENSOR SYSTEM INNOVATION • 3D printing of materials (e.g., metal, polymer,

ceramic, composites, etc.) • computer aided design (CAD) and application • Internet of Things (IoT) in 3D printing • 3D printing in biomedical and medical

applications; tissue engineering, surgery, orthopedics, healthcare

• 3D printing or additive manufacturing of EEG, ECG devices, ‘footware and shoes’, etc.

• 3D printing of nano and microsensor systems • 3D printing for space • wearable power • textile based super capacitors • 3D printing of textile garments, nanosensors and

integration.

NOVEL MATERIALS AND INTEGRATION TECHNOLOGIES • nanomaterials • carbon nanotubes • 3D nanostructures • biomaterials • nanowires • integration of nano-and micro-sensors with

microelectronics • integration of sensors with flexible organic

electronics • novel nanomaterials for display systems • materials for flexible RFID systems.

SMART OPTICAL MATERIALS AND DEVICE APPLICATIONS • candidate materials and growth • field coupling techniques for control and

operation • spectral shifters • refractive index shifters • characterization methodology of smart materials • new device concepts with smart optical

materials • bandgap energy model and restructuring • conformable physical optics • error-free temporal and spatial tenability.

ENERGETIC MATERIALS AND LONG-LASTING MICRO-POWER SYSTEM • energetic materials with quantum modification • mobilization of deep level potential-well • enhanced surface energy for artificial catalysis • micro-power device concepts for long-life

operation • emerging and nascent materials for micro-power

devices.

INTEGRATED NANO- AND MICRO- STRUCTURES • smart sensors, smart actuators • smart microsystems • nanosystems • drug delivery systems • nondestructive methods for nano-engineered

materials, nanostructures, and nano-devices.

REMOTE CONTROL AND COMMUNICATION • microantenna, rectenna • remote sensing • RF MEMS • reconfigurable antenna • microwave and millimeter wave components and

devices.

SIMULATION, MODELING, AND IT SOFTWARE • CAD/CAM for nanosystems • design tools for integrated MEMS and NEMS • electro-thermo-mechanical modeling • microfluidics modeling • IT-related software.

THOUGHT-CONTROLLED DEVICES AND SYSTEMS • EEG, EOG, EMG signal acquisition system • interfacing robot • electroactive-polymer-based artificial muscles • brain-computer interface; brain-machine

interface.

APPLICATIONS IN ENGINEERING AND MEDICINE • thermoelectric energy conversion systems • thin-film hybrid PV/thermoelectric solar panels • biomedical • pharmaceutical • bio-implantable chip for disease monitoring and

control • neurotransmitter and stimulator; neurosurgical

procedures • cardiovascular monitoring sensors and systems • nanomedicine and drug delivery • wireless communication protocols • surgical procedures and nanosystems

implementation • glucose sensor system • physiological monitoring • smart textiles • sleep apnea • wireless power feedback routines and devices

for medical applications.





SAVE THE DATE




Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems (SSN06)Conference Chair: Haiying Huang, The Univ. of Texas at Arlington (USA)

Conference Co-Chairs: Hoon Sohn, KAIST (Korea, Republic of); Daniele Zonta, Univ. of Strathclyde (United Kingdom)

Program Committee: Hiroshi Asanuma, Chiba Univ. (Japan); Chih Chen Chang, Hong Kong Univ. of Science and Technology (Hong Kong, China); Genda Chen, Missouri Univ. of Science and Technology (USA); Alison B. Flatau, Univ. of Maryland, College Park (USA); Branko Glisic, Princeton Univ. (USA); Faramarz Gordaninejad, Univ. of Nevada, Reno (USA); Benjamin L. Grisso, Naval Surface Warfare Ctr. Carderock Div. (USA); Ryan L. Harne, The Ohio State Univ. (USA); Jung-Wuk Hong, KAIST (Korea, Republic of); Neil A. Hoult, Queen’s Univ. (Canada); Ying Huang, North Dakota State Univ. (USA); Mohammad Reza Jahanshahi, Purdue Univ. (USA); Gi-Woo Kim, Inha Univ. (Korea, Republic of); Jeong-Tae Kim, Pukyong National Univ. (Korea, Republic of); Simon Laflamme, Iowa State Univ. (USA); Hui Li, Harbin Institute of Technology (China); Jian Li, The Univ. of Kansas (USA); Suyi Li, Clemson Univ. (USA); Wei-Hsin Liao, The Chinese Univ. of Hong Kong (Hong Kong, China); Chin-Hsiung Loh, National Taiwan Univ. (Taiwan); Kenneth J. Loh, Univ. of California, San Diego (USA); Bryan R. Loyola, Sandia National Labs. (USA); Theodore E. Matikas, Univ. of Ioannina (Greece); Norbert G. Meyendorf, Iowa State Univ. of Science and Technology (USA); Akira Mita, Keio Univ. (Japan); Yiqing Ni, The Hong Kong Polytechnic Univ. (Hong Kong, China); Hae Young Noh, Carnegie Mellon Univ. (USA); Irving J. Oppenheim, Carnegie Mellon Univ. (USA); Wieslaw M. Ostachowicz, The Szewalski Institute of Fluid-Flow Machinery (Poland); Kara J. Peters, North Carolina State Univ. (USA); Piervincenzo Rizzo, Univ. of Pittsburgh (USA); Donghyeon Ryu, New Mexico Institute of Mining and Technology (USA); Liming W. Salvino, Office of Naval Research Global (USA); Fabio Semperlotti, Purdue Univ. (USA); Wei Song, The Univ. of Alabama (USA); Wieslaw J. Staszewski, AGH Univ. of Science and Technology (Poland); Zhongqing Su, The Hong Kong Polytechnic Univ. (Hong Kong, China); R. Andrew Swartz, Michigan Technological Univ. (USA); Tyler N. Tallman, Purdue Univ. (USA); Jiong Tang, Univ. of Connecticut (USA); Marco Torbol, Ulsan National Institute of Science and Technology (Korea, Republic of); Ming L. Wang, Northeastern Univ. (USA); Xingwei Wang, Univ. of Massachusetts Lowell (USA); Ya Wang, Texas A&M Univ. (USA); Yang Wang, Georgia Institute of Technology (USA); Rosalind M. Wynne, Villanova Univ. (USA); Fuh-Gwo Yuan, North Carolina State Univ. (USA)

Advanced sensors, smart materials, and smart struc-tures technology represent an emerging multidisci-plinary field that has unlimited potential of broad engineering applications. This particular conference focuses on the new sensor technologies and phe-nomena that apply to the civil, mechanical, and aerospace engineering fields. To name a few, these applications include structural health monitoring (SHM), nondestructive evaluation (NDE), damage/deterioration assessment, security and emergency management, and asset management. The potential benefits of applying advanced sensors, smart mate-rials, and smart structures technology to civil, me-chanical and aerospace systems are many and they cover improved system reliability, enhanced system performance and functionality, enhanced security, decreased life cycle costs, and reduction of physical dimensions and weight.

Researchers in academia, government laboratories, and industry are making progress in advancing the state of the art of the sensor-based technologies addressed by this conference. This conference will provide a forum to bring together experts in the rel-evant but diverse fields to discuss recent advances and future challenges including international re-search collaboration.

Papers are solicited on new and emerging technolo-gies in the following areas:

NEW TECHNOLOGICAL ADVANCES • machine learning • human-centric sensing and control • low-cost smart materials • large-scale monitoring systems • multifunctional sensors sensor networks and

autonomous operation • sensors for harsh and extreme environments • sensors using wireless systems • fiber optic sensing • photonic, phononic, and phoxonic crystal

sensors • computer vision and image analysis techniques • active and semi-active control systems • wearable sensors for biomedical applications.

BIO-INSPIRED SENSING AND BIO-INSPIRED ACTUATION • functional mimicking of extreme species • organization and processing in bio-networks • biomolecular sensors and actuators • biologically mediated fabrication • bio-inspired smart sensor networks.


CALL FOR PAPERS

MODELING OF SMART MATERIALS AND SENSOR PERFORMANCE • sensor integration with structure • sensor behavior • reliability investigations • smart material response under loads and strain.

DESIGN ENGINEERING AND IMPLEMENTATION • design/characterization/creation of

multifunctional sensory systems • smart components, devices, and sub-assemblies • novel materials for sensing, actuation, and

design • smart systems for evaluation, detection,

monitoring, and control • sensor standardization.

INTEGRATION OF SMART SENSING SYSTEMS • vehicle health management • implementation of advanced technologies • big data and cloud-based analytic • cyberinfrastructure tools for data management

and curation • integrated asset management • data-driven decision making • small-scale and large-scale demonstrations • smart infrastructure security.

INTERROGATION OF STRUCTURES • aerospace structures, composites • geotechnical systems, mining/oil/gas

exploration and production • ship and offshore structures • pipelines • civil engineering structures • monuments of cultural heritage • conventional, nuclear, and alternative energy

systems • transportation systems and vehicles • chemical and biochemical systems.

SENSOR DEVELOPMENT AND APPLICATIONS





SAVE THE DATE



Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation IX (SSN07)Conference Chair: Tzu-Yang Yu, Univ. of Massachusetts Lowell (USA)

Conference Co-Chairs: H. Felix Wu, U.S. Dept. of Energy (USA); Peter J. Shull, The Pennsylvania State Univ. (USA); Andrew L. Gyekenyesi, Ohio Aerospace Institute (USA)

Program Committee: Venkat Airtharaju, General Motors Co. (USA); Christopher C. Bowland, Oak Ridge National Lab. (USA); Genda Chen, Missouri Univ. of Science and Technology (USA); Chih-Hung Chiang, Chaoyang Univ. of Technology (Taiwan); Reinhard Ebert, Fraunhofer-Institut für Optronik, Systemtechnik und Bildauswertung (Germany); Nora Dianne Ezell, Oak Ridge National Lab. (USA); Zhenhua Huang, Univ. of North Texas (USA); Dryver R. Huston, The Univ. of Vermont (USA); Xiaoning Jiang, North Carolina State Univ. (USA); Ajay M. Koshti, NASA Johnson Space Ctr. (USA); Denvid Lau, City Univ. of Hong Kong (Hong Kong, China); Xiaodong Li, Univ. of Virginia (USA); Gao Liu, Lawrence Berkeley National Lab. (USA); Kenneth J. Loh, Univ. of California, San Diego (USA); Jerome P. Lynch, Univ. of Michigan (USA); Oliver J. Myers, Clemson Univ. (USA); Piotr Omenzetter, Univ. of Aberdeen (United Kingdom); Didem Ozevin, Univ. of Illinois at Chicago (USA); Akira Sasamoto, National Institute of Advanced Industrial Science and Technology (Japan); Kevin L. Simmons, Pacific Northwest National Lab. (USA); Caesar Singh, U.S. Dept. of Transportation (USA); Yu-Min Su, National Kaohsiung Univ. of Applied Sciences (Taiwan); Yan Wan, Univ. of Texas at Arlington (USA); Ming L. Wang, Northeastern Univ. (USA); Yang Wang, Georgia Institute of Technology (USA); Tian Xia, The Univ. of Vermont (USA); Lingyu Yu, Univ. of South Carolina (USA); Fuh-Gwo Yuan, North Carolina State Univ. (USA); Haifeng Zhang, Univ. of North Texas (USA); Xiaoyu R. Zheng, Virginia Polytechnic and State Univ. (USA)

This conference creates an international forum to address the current state-of-the-art technologies in nondestructive characterization and monitoring of advanced materials and aerospace components, as well as technical challenges concerning infrastruc-ture asset management including commercial/pub-lic transportation and public utilities. The inspection technologies encompass a cradle-to-grave timeline allowing for the monitoring of the fabrication process (e.g., advanced/additive manufacturing), assessing initial component quality, in-situ monitoring and system health, as well as evaluating repairs/retrofits. The overall theme focuses on identifying and foster-ing improvements and new developments regarding theory, hardware, implementation strategies, inter-pretation of data/results, and automation.

This conference will provide a medium for communi-cation and collaborations among engineers and sci-entists in the following areas: • SHM/NDE of advanced materials (e.g.,

refractories, polymer matrix composites, metal matrix composites, ceramic matrix composites, foams, high-performance alloys)

• development of NDE and SHM tools for automotive and aerospace components/systems

• life management and system analysis/design methodologies for diagnostics and prognostics of materials and structures

• civil infrastructure management for roads, highways, rail systems, bridges, buildings, water systems, dams, levees, pipelines, tunnels, chimneys, and power generation (e.g., natural gas, coal, nuclear, wind, hydropower, geothermal, solar, etc.)

• SHM/NDE for energy infrastructure (electrical grids, power transmission, pipeline distribution systems, nuclear power plants, and/or oil and gas exploration)

• SHM/NDE sensor development, MEMS/NEMS, intelligent transportation systems, complex cyber-physical systems via control, networking, verification, and real-time systems to protect infrastructure including aeronautics, civil, materials, energy, automotive, medical, chemical, manufacturing, and agriculture

• continuous and life-cycle monitoring, predictive modeling, aging mechanisms for aeronautical, civil, mechanical, and manufacturing engineering structures

• new materials and sensors for structural repair/retrofit for cost mitigation, improving measurement accuracy, reliability, and safety

• integration and automation of multiple SHM/NDE technologies for improving interpretation of results

• SHM and NDE for additive manufacturing processes and finished parts

• modeling, simulation, and technology development at various scales ranging from nano- and micro- scale to super-large structures

• signal/image processing, data fusion, signal/image denoising, artificial intelligence, and deep learning for SHM/NDE

• augmented reality (AR), Virtual reality (VR), and mixed reality (MR) for SHM/NDE

• mitigation of man-made and natural hazards in physical infrastructure including buildings, highway infrastructure, bridges, dams, levees, and nuclear power plants

• environmental monitoring/sensing technologies and applications (e.g., unmanned aerial vehicle (UAV) monitoring)

• SHM/NDE technologies and applications in homeland security and counter-terrorism

• NDE standards, codes, regulations, and acceptance criteria

• NDE for self-healing materials, structures, and systems

• big data for vehicle health monitoring and redesign of structural components based on sensor data

• integrated in-line monitored manufacturing parameters for process-structure-property relationship

• multifunctional structural composites • innovative manufacturing of composites enabled

by machine learning and artificial intelligence.


CALL FOR PAPERS


Health Monitoring of Structural and Biological Systems IX (SSN08)Conference Chair: Paul Fromme, Univ. College London (United Kingdom)

Conference Co-Chair: Zhongqing Su, The Hong Kong Polytechnic Univ. (Hong Kong, China)

Program Committee: Sourav Banerjee, Univ. of South Carolina (USA); Yoseph Bar-Cohen, Jet Propulsion Lab. (USA); Fu-Kuo Chang, Stanford Univ. (USA); Anthony J. Croxford, Univ. of Bristol (United Kingdom); Hadi Fekrmandi, South Dakota School of Mines and Technology (USA); Victor Giurgiutiu, Univ. of South Carolina (USA); Srinivasan Gopalakrishnan, Indian Institute of Science (India); Mohammad Hadi Hafezi, The Univ. of Arizona (USA); Guoliang Huang, Univ. of Missouri (USA); Xiaoning Jiang, North Carolina State Univ. (USA); Ajay M. Koshti, NASA Johnson Space Ctr. (USA); Sridhar Krishnaswamy, Northwestern Univ. (USA); Tribikram Kundu, The Univ. of Arizona (USA); Francesco Lanza di Scalea, Univ. of California, San Diego (USA); Zhu Mao, Univ. of Massachusetts Lowell (USA); Christopher Niezrecki, Univ. of Massachusetts Lowell (USA); Mostafa A. Nouh, Univ. at Buffalo (USA); Wieslaw M. Ostachowicz, The Szewalski Institute of Fluid-Flow Machinery (Poland); Xinlin Qing, Xiamen Univ. (China); Henrique L. Reis, Univ. of Illinois at Urbana-Champaign (USA); Fabrizio Ricci, Univ. degli Studi di Napoli Federico II (Italy); Piervincenzo Rizzo, Univ. of Pittsburgh (USA); Alessandro Sabato, Univ. of Massachusetts Lowell (USA); Christoph Schaal, California State Univ., Northridge (USA); Fabio Semperlotti, Purdue Univ. (USA); Yanfeng Shen, Shanghai Jiao Tong Univ. (China); Hoon Sohn, KAIST (Korea, Republic of); Wieslaw J. Staszewski, AGH Univ. of Science and Technology (Poland); Tadeusz Stepinski, AGH Univ. of Science and Technology (Poland); Tadeusz Uhl, AGH Univ. of Science and Technology (Poland); Wei-Chih Wang, Univ. of Washington (USA); Yue-Sheng Wang, Beijing Jiaotong Univ. (China); Jinkyu Yang, Univ. of Washington (USA); Lingyu Yu, Univ. of South Carolina (USA); Andrei N. Zagrai, New Mexico Institute of Mining and Technology (USA)

Since 2001, the conference on Health Monitoring of Structural and Biological Systems has brought to-gether engineers and scientists to exchange ideas and update research findings. The emphasis of this conference is to recognize that non-destructive sens-ing, sensor array design, signal acquisition and trans-mission, signal processing, and energy harvesting are integral parts of health monitoring for both structural and biological systems.

The scope of the 2020 conference will be further expanded based on the success of previous years, including emerging and future methods of Structural Health Monitoring: modelling, sensors, signal pro-cessing, diagnosis and prognosis, inspection, system integrity and applications of engineering and biolog-ical materials and structures.

Papers are invited on topics including, but not limited to, the following:

ENGINEERING AREA: • Structural Health Monitoring (SHM) • guided waves • nonlinear ultrasonic and guided wave techniques • elastic and acoustic metamaterials • emerging and futuristic techniques • advanced modelling (FEM, FDM, BEM, semi-

analytical methods, DPSM, peri-ultrasound, etc.) • aging, new, and future aircraft structures • aircraft and aerospace hardware • civil infrastructure (bridge, buildings, roads,

pipelines etc.) • energy industry (nuclear, conventional, etc.) • renewable energy technology (wind, solar,

offshore, wave power) • composites • additive manufacturing • sensors and sensor networks • signal and data processing, imaging

• internet of things, big data • energy harvesting • microelectric and electronic components • applications of MEMS and integrated or

embedded multifunctional sensors • robotics, automation, and smart structures

(e.g., crawlers, wireless, multimedia, internet) • real-time sensing and testing at extreme

environments (temperatures, pressure and vacuum, radiation hazards, toxic and hazardous conditions, etc.)

BIODIAGNOSTIC AREA: • biomaterials and biostructures (e.g., implants,

cells, bones, tissues) • biologically inspired technologies • medical imaging methods (MRI, CAT scan,

ultrasound, radiography and others) • biomedical smart structures and devices

(e.g. smart materials, structures, micro/nanofabrication and applications in biomedical monitoring and diagnosis)

• additive manufactured implants and devices • NEMS/MEMS and emerging/futuristic

techniques.




Smart Structures and NDE for Industry 4.0, Smart Cities, and Energy Systems (SSN09)Conference Chair: Kerrie Gath, Ford Motor Co. (USA)

Conference Co-chairs: Dan J. Clingman, Boeing Research and Technology (USA); Norbert G. Meyendorf, Univ. of Dayton (USA)

Program Committee: Ali Abdul-Aziz, NASA Glenn Research Ctr. (USA); Steven R. Anton, Tennessee Technological Univ. (USA); Nicolas P. Avdelidis, Univ. Laval (Canada); George Y. Baaklini, NASA Glenn Research Ctr. (USA); Leonard J. Bond, Iowa State Univ. of Science and Technology (USA); Diann E. Brei, Univ. of Michigan (USA); Peter C. Chen, NASA Goddard Space Flight Ctr. (USA); Michael Dalichow, Quality Network Inc. (USA); Marcelo Dapino, The Ohio State Univ. (USA); Dimitrios A. Exarchos, Univ. of Ioannina (Greece); Kevin M. Farinholt, Luna Innovations Inc. (USA); Xiao-Yan Gong, Medical Implant Mechanics LLC (USA); Steven F. Griffin, The Boeing Co. (USA); Peter Heilmann, arxes-tolina GmbH (Germany); Nancy L. Johnson, General Motors Co. (USA); Vassilios Kappatos, Univ. of Southern Denmark (Denmark); Michael Kroening, Pontifícia Univ. Católica do Rio de Janeiro (Brazil); Jayanth N. Kudva, NextGen Aeronautics, Inc. (USA); Amrita Kumar, Acellent Technologies, Inc. (USA); Jay Lee, Univ. of Cincinnati (USA); Jung-Ryul Lee, KAIST (Korea, Republic of); Donald J. Leo, The Univ. of Georgia (USA); Zheng Liu, The Univ. of British Columbia Okanagan (Canada); Theodore E. Matikas, Univ. of Ioannina (Greece); Geoffrey P. McKnight, HRL Labs., LLC (USA); Tobias Melz, Fraunhofer-Institut für Betriebsfestigkeit und Systemzuverlässigkeit (Germany); Michele Meo, Univ. of Bath (United Kingdom); Alexander Michaelis, Fraunhofer-IKTS (Germany); Bernd Michel, Fraunhofer-Institut für Elektronische Nanosysteme (Germany); Pramita Mitra, Ford Motor Co. (USA); Christopher Niezrecki, Univ. of Massachusetts Lowell (USA); Piotr Omenzetter, Univ. of Aberdeen (United Kingdom); Gyuhae Park, Chonnam National Univ. (Korea, Republic of); Kara J. Peters, North Carolina State Univ. (USA); W. Lance Richards, Armstrong Flight Research Ctr. (USA); Janet M. Sater, Institute for Defense Analyses (USA); Stefano Sfarra, Univ. degli Studi dell’Aquila (Italy); Tadeusz Stepinski, AGH Univ. of Science and Technology (Poland); Bernd Valeske, Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP (Germany); Edward V. White, The Boeing Co. (USA); Mark R. Woike, NASA Glenn Research Ctr. (USA); H. Felix Wu, U.S. Dept. of Energy (USA); Christian Wunderlich, Fraunhofer-IKTS (Germany); Dong-Jin Yoon, Korea Research Institute of Standards and Science (Korea, Republic of); Lingyu Yu, Univ. of South Carolina (USA)

“Industry 4.0”, “Smart Factory”, and “factory of to-morrow” are all terms used to indicate a transition toward a smart, networked, and autonomous indus-trial ecosystem. We are in a quickly evolving industri-al revolution that is made possible by the increasing number of ”Internet of Things” devices for manu-facturing, large data acquisition, energy storage, and cloud-based optimized planning and communi-cation. This new machine to machine ecosystem is resulting in an increased efficiency in manufacturing and logistics. Industrial machinery infrastructure equipped with smart sensors, actuators, and pro-cessors is enabling the monitoring and optimizing of manufacturing facilities with a limited need for hu-man intervention.

Simultaneously, there is a paradigm shift in the way components are being manufactured and designed. Advances in additive manufacturing, including new advances in printer operation and novel materials designed for additive technologies, are enabling a plethora of new applications of embedded smart materials and structures. As additive manufacturing is incorporated into current manufacturing ecosys-tems, the design methodologies will need to evolve at an accelerated rate. Utilization of neural networks is one potential avenue. Structural health monitoring (SHM) and nondestructive evaluation (NDE) devices will be incorporated as part of the initial design of a

component and manufactured as one with multima-terial printers. The component behavior can be con-tinuously monitored to optimize maintenance and improve the design. Incorporating IoT with embed-ded smart sensors, processors, and memory modules allows real time information sharing across systems and networks resulting in increased efficiency, eco-nomic, and environmental benefits.

Additionally, cities are utilizing IoT devices to digital-ly transform infrastructure in order to improve envi-ronmental, financial, and social aspects of urban life by harnessing data from vast network of connected cameras, vehicles, and smart infrastructure. In turn, this infrastructure transformation is driving signifi-cant technology investment and furthering the ad-vancement of smart materials for sensors in SHM and NDE. The integration of information and communica-tion technology with physical devices connected to the Internet of things for networking to optimize the efficiency of city operations and services and con-nect to citizens. The machine to machine ecosystem will continue to expand throughout our cities using the internet for connecting us through our devic-es and furthering the use of NDE, SHM, blockchain, neural networks, AI, and, perhaps most importantly, cybersecurity.


CALL FOR PAPERS

Major topics of interest are: • sensors and actuation device integration for

smart and autonomous manufacturing • embedded nano and micro sensors for analysis

of structures (SHM) • multifunctional materials utilized in NDE and

SHM • data collection from embedded sensors for NDE

and SHM • application of the digital twin • cloud-based data integration, communication,

and planning • additive manufacturing as an enabler for sensor

integration • big data management and processing • real time monitoring of the smart factory

systems and subsystems • enhancing NDE and SHM for cybersecurity • blockchain for advanced manufacturing • application of neural networks for design • sensors, adaptive structures, and artificial

intelligence • smart city and intelligent transportation

ecosystem enablers • new transportation concepts supporting a

reduced carbon footprint.





SAVE THE DATE



Smart Materials and Nondestructive Evaluation for Energy Systems V (SSN10)Conference Chair: Christopher Niezrecki, Univ. of Massachusetts Lowell (USA)

Conference Co-Chair: Theodoros E. Matikas, Univ. of Ioannina (Greece)

Program Committee: Ali Abdul-Aziz, Kent State Univ. (USA); Nicolas P. Avdelidis, Univ. Laval (Canada); Leonard Bond, Iowa State Univ. (USA); Michele Meo, Univ. of Bath (United Kingdom); Norbert G. Meyendorf, Iowa State Univ. of Science and Technology (USA); Piotr Omenzetter, Univ. of Aberdeen (United Kingdom); Kara J. Peters, North Carolina State Univ. (USA); Stefano Sfarra, Univ. degli Studi dell’Aquila (Italy); Dong-Jin Yoon, Korea Research Institute of Standards and Science (Korea, Republic of); Lingyu Yu, Univ. of South Carolina (USA)

The major focus of this conference is materials, smart structures, sensor systems, NDE, and monitor-ing of renewable and conventional energy systems for energy generation, transmission, transportation, distribution, storage, and harvesting. We will bring together specialists from industry and academia to discuss topics that will help lead to a sustainable and environmentally friendly energy base for the future. Availability of energy is directly linked to well-being and prosperity across the globe. Meeting the growing demand to safely and sustainably supply more than seven billion people on earth who use energy each day is a key challenge addressed by the conference.

Our goal is to provide advanced materials and new measurement technology that can help build a re-liable, environmentally friendly, and more robust energy infrastructure. We are interested in energy systems and their NDE/SHM across a wide range of scales from nano-scale (e.g. micro Watts) to macro (e.g. utility-scale Mega Watts).

Electro mobility, wireless communication, wireless sensor networks, and Structural Health Monitoring (SHM) systems are hungry for new, highly efficient and low weight, high capacity, energy generators or energy storage systems. Increased mobility of peo-ple, next generation of fabrication, noninvasive medi-cine as well as nanotechnology require new concepts of macroscopic and microscopic energy conversion and propulsion systems. Smart and cognitive mate-rials and structures with embedded sensor/actuator systems and electronics are not possible without new solutions for energy harvesting, storage, transmis-sion, and distribution.

Limited natural resources of conventional energy, cli-mate change, and environmental problems all require new solutions for energy generation, scavenging, transportation, conservation, and storage. Reduction of the emission of greenhouse gases, exploration of new resources for sustainable and conventional en-ergy faces new challenges. Renewable energy sourc-es, such as wind and solar, create electrical energy without greenhouse gas emissions during operation. Unfortunately, the mismatch between energy gener-ation location and point of consumption as well as time of availability and time of energy need is ev-ident. New concepts for energy storage and trans-mission are necessary. Chemical, electrical, thermal, hydro power, and gravity storage technologies must be advanced to solve energy storage and transporta-tion challenges. All require new solutions that can be impacted by developing novel materials and power management and control systems. Robust NDE and SHM for wind and solar systems are still developing to make systems more reliable and robust. All of these are high priority topics for future developments.

Many offshore and subsea energy systems, such as those in the oil and gas industry, continue operating in many cases beyond their original design life. Mon-itoring the health of such aging systems is of para-mount importance. As many basins, e.g. in North Sea, are reaching the end of their life. Decommissioning is a looming challenge and efficient monitoring tech-niques are required for this market niche including also the important aspects of the interaction of man-made systems with marine and wildlife. Meanwhile, future subsea (e.g. hydro-kinetic) and offshore sys-tems will be even more complex, interdependent, and sophisticated requiring provisions for monitoring to be ready at the design stage for cradle-to-grave intelligent asset management. Likewise, safety con-siderations for nuclear power and the need for re-al-time monitoring of nuclear infrastructures have been driving the NDE and the SHM technologies for decades and continue as critical topics today.

Major topics of interest include: • NDE and SHM of energy systems • materials, NDE, and monitoring of energy

storage systems • materials, NDE, and monitoring for energy

scavenging and utility-scale harvesting systems • photonic energy harvesting, or acoustic/

vibration energy harvesting via phononic meta-materials

• materials, NDE, and monitoring of energy transmission systems

• materials, NDE, and monitoring of energy distribution systems

• development and application of smart materials for energy systems

• characterization of materials • smart sensor phenomena, technology, networks,

and systems integration • wired, wireless, optical, and other techniques for

energy transportation and distribution • green and conventional as well as nuclear

energy • photovoltaic and solar energy systems • wind energy systems • hydro power systems • chemical, electrical, thermal, kinetic, and gravity

energy storage technologies • batteries • fuel cells • macroscopic and micro propulsion systems • new materials and testing of turbines for energy

scavenging and propulsion • chemical and mechanical energy to electrical

energy conversion.

We especially encourage specialists from industry to share their needs with the research community.


EAP-IN-ACTION DEMONSTRATION SESSION

This industry session, held annually as part of the SPIE’s EAPAD conference, turns the spotlight on Electroactive Polymers (EAP) materials and applications, illustrating the state-of-the-art capabilities that make EAP one of the leading “actuators-of-choice”. New materials and application areas are continuing to emerge and this session offers up-close demonstrations of EAP materials in action. The demonstration format enables interaction between the technology developers and potential users as well as a “hands-on” experience with this emerging technology. An award certificate will also be given to the top three Best EAP-in-Action Demonstration Award winners. Details can be found online on the Awards page at spie.org/ssncall.

CALL FOR PAPERS


VENUE Anaheim Marriott700 West Convention WayAnaheim, California 92802 USA

A 4-Star hotel in the heart of Anaheim’s resort dis-trict, near the most celebrated attractions. The hotel offers a fantastic location within walking distance to Anaheim Convention Center, and Disneyland® Resort.

TECHNICAL PROGRAMAvailable January 2020The comprehensive Advance Technical Program for this symposium will list conferences, paper titles, and authors in order of presentation; an outline of all planned special events; and hotel and registration information. An email will be sent to you announcing the availability of the Advance Program in January.

HOTEL REGISTRATIONOpening of the hotel reservation process for Smart Structures + Nondestructive Evaluation 2020 is scheduled for January 2020. SPIE will arrange special discounted hotel rates and amenities for attendees that will be available when housing opens. Please do not contact SPIE directly.

REGISTRATIONSPIE Smart Structures + Nondestructive Evaluation registration will be available January 2020.

All participants, including invited speakers, contribut-ed speakers, session chairs, co-chairs, and committee members, must pay a registration fee.

Fee information for conferences, courses, a registra-tion form, and technical and general information will be available on the SPIE website in January.

STUDENT TRAVEL GRANTSA limited number of SPIE student travel grants will be awarded based on need. Applications must be received no later than 10 weeks prior to the meeting, by 17 February 2020. Eligible applicants must present an accepted paper at this meeting. Offer applies to undergraduate/graduate students who are enrolled full-time and have not yet received their PhD.

CLEARANCE INFORMATIONIf government and/or company clearance is required to present and publish your presenta tion, start the process now to ensure that you receive clearance if your paper is accepted.

IMPORTANT NEWS FOR ALL VISITORS FROM OUTSIDE THE USA Find important requirements for visiting the USA on the SPIE website. There are new steps that ALL visitors to the USA need to follow. Online at: www.spie.org/visa

LETTERS OF INVITATION FOR VISA PROCESSIndividuals requiring letters of invitation to obtain travel visas to present their papers may access and print an Invitation Letter Request Form found on the vent website. Online at: www.spie.org/visa

GENERAL INFORMATION





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SUBMISSION GUIDELINES

Present your research at SPIE Smart Structures + Nondestructive EvaluationFollow these instructions to submit an abstract and related manuscript for the conference and for publication in the Proceedings of SPIE in the SPIE Digital Library.

How to submit an abstract• Browse the conference program and select conference(s) that most closely match the topics of the work you wish to

present. Important: each abstract may be submitted to one conference only.• Go to the conferences page (link below), choose a conference, click “Submit an Abstract” from within that

conference, and you’ll be prompted to sign in to your spie.org account to complete the submission wizard.

What you will need to submitA completed electronic submission is due 16 October 2019 and should include the following:• Title• Author(s)’ information• 250-word abstract for technical review• 100-word summary for the program• Extended summary for technical review (select conferences; if summaries are required, this is indicated in the

individual conference Call for Papers)• Keywords used in search for your paper (optional)• Your decision on publishing your presentation recording to the SPIE Digital Library (slide capture and audio)• Some conferences may indicate additional requirements in the Call for Papers (for example: instructions for

competing for awards)Note: Only original material should be submitted. Commercial papers, papers with no new research/development content, and papers with proprietary restrictions will not be accepted for presentation.

Submission agreementPresenting authors, including keynote, invited, oral, and poster presenters, agree to the following conditions by submitting an abstract. An author or coauthor will:• Register and attend the meeting.• Present as scheduled.• Publish a 6-20 page manuscript in Proceedings of SPIE in the SPIE Digital Library.• Obtain funding for registration fees, travel, and accommodations, independent of SPIE, through their sponsoring

organizations.• Ensure that all clearances, including government and company clearance, have been obtained to present and publish.

If you are a DoD contractor in the USA, allow at least 60 days for clearance.

Important datesAbstracts due: 16 October 2019Author notification (by email) of acceptance and presentation details: 20 December 2019Manuscripts due: 1 April 2020

Review and program placement• To ensure a high-quality conference, all submissions will be assessed by the Conference Chair/Editor for technical

merit and suitability of content.• Conference Chair/Editors reserve the right to reject for presentation any paper that does not meet content or

presentation expectations.• Final placement in an speaker or poster session is subject to the Chairs’ discretion.

Publication of Proceedings in the SPIE Digital Library• Conference Chair/Editors may require manuscript revision before approving publication and reserve the right to

reject for publication any paper that does not meet acceptable standards for a scientific publication.• Conference Chair/Editors’ decisions on whether to allow publication of a manuscript is final.• Authors must be authorized to transfer copyright of the manuscript to SPIE, or provide a suitable publication license.• Only papers presented at the conference and received according to publication guidelines and timelines will be

published in the conference Proceedings of SPIE in the SPIE Digital Library.• Oral presentations are recorded, capturing the slides synced with the presenter’s audio. Only those with author

permission will be published in the SPIE Digital Library.• SPIE partners with relevant scientific databases to enable researchers to find the papers in the Proceedings of SPIE

easily. The databases that abstract and index these papers include Astrophysical Data System (ADS), Ei Compendex, CrossRef, Google Scholar, Inspec, Scopus, and Web of Science Conference Proceedings Citation Index.

• More publication information available on the SPIE Digital Library.

Contact informationFor questions about your presentation, submitting an abstract post-deadline, or the meeting, contact the Conference Program Coordinator, Megan Artz, at [email protected] questions about your manuscript, contact Megan Artz, [email protected].


Present your work to the world’s leading experts in smart materials and nondestructive evaluationShowcase your research at the leading event for advanced materials, sensor systems, and structural health monitoring. There are lots of opportunities for engagement and the community wants to hear from you.

• Present a paper and participate in the conference

• Obtain critical feedback and new ideas

• Hear a broad spectrum of other works in progress

• Develop new ideas for future research

• Network with your colleagues and find collaborators

• SPIE conference papers are published in the SPIE Digital Library, the world’s largest collection of optics and photonics research

• Publish your paper in an SPIE Journal

Join us in Anaheim

SPIE Proceedings and Journals are indexed in Web of Science, Scopus, Ei Compendex, Inspec, Google Scholar, Astrophysical Data System (ADS), DeepDyve, ReadCube, CrossRef, and other scholarly indexes, and are widely accessible to leading research organizations, conference attendees, and individual researchers.


Gain visibility at SPIE Smart Structures + Nondestructive Evaluation

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Conferences and Course

26–30 April 2020


spie.org/ssncall

The premier event for advanced materials, sensor systems, and structural health monitoring.

800 ATTENDEES

700 PAPERS

2 COURSES

Electroactive polymers are paving the way for advanced materials to enter commercial production and industrial application areas. This session encourages interaction between EAP developers and potential users, as well as a “hands-on” experience with this emerging technology.

Training The course program will be available January 2020.

EAP-In-Action Session

Applications of Uncertainty Analysis in Smart Materials and Adaptive StructuresThis hands-on tutorial exposes participants to statistical and numerical techniques that will allow them to quantify the accuracy of multi-physics models.

Tutorial

TECHNOLOGIES• Bioinspiration, Biomimetics, and

Bioreplication

• Electroactive Polymer Actuators and Devices

• Active and Passive Smart Structures and Integrated Systems

• Behavior and Mechanics of Multifunctional Materials

• Nano-, Bio-, Info-Tech Sensors and 3D Systems

• Smart Structures and NDE for Industry 4.0 and Smart Cities

• Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems

• Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation

• Health Monitoring of Structural and Biological System

• Smart Materials and Nondestructive Evaluation for Energy Systems

Conferences and Courses 26–30 April 2020


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nondestructive evaluation call for papers · nondestructive evaluation the leading event for...

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