new products brochure

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Page 1: New Products Brochure

Specification (Typical Value)

Dimension

CSP SMD LEDs 12-15W :

. Compact LEDs with high Power,narrow chips gap 0.1mm;

. Eutectic bonding on Ceramic base, high conductivity ;

. Phospher film coating on vertical chips,even light output ;

. One binning , same lighting effect;

. RoHS certified material .

Specification (Typical Value)

Dimension

CSP SMD LEDs 10-20W :

. Compact LEDs with high Power,narrow chips gap 0.1mm;

. Eutectic bonding on Ceramic base, high conductivity ;

. Phospher film coating on vertical chips,even light output ;

. One binning , same lighting effect;

. RoHS certified material .

Page 2: New Products Brochure

Specification (Typical value)

Dimension

C3535 RGBW 3-5W :

. Compact light source,only 0.1mm between chips ;

. Symmetrical package, higher color-mixing effect ;

. Eutectic bonding with vertical chips, Lower thermalresistance ;

. RoHS certified .

C2525 SMD LEDs 1-3W:

. Ceramic base with higher heat conductivity;

. . Eutectic bonding, Lower thermalresistance;

. High stablity & efficiency ;

. Smaller package size ;

. RoHS certified.

Specification (Typical value)

Dimension

C6065 SMD RGBW / White 60W:

. Compact High power SMD LEDs, Smaller LES 3.0×3.3mm;

. Eutectic bonding with thermal-electric isolation ceramic base;

. Using vertical chips covered with glass ;

. 4.5A forward current to get high lumen output & high density ;

. RoHS certified materials .

C6070 SMD 7in1 25W:. Compact high power LEDs, single control 7 chips in Dia. 4 mm ;. Eutectic bonding package on thermal-electric isolation, ceramic MCPCB, higher conductivity ;. Vertical chios covered by extra-thin glass optics ;. Homologous anode/cathod, easy for PCB designning ;. RoHS certified material .. RoHS certified material .

Specification (Typical value)

Dimension

Dual-White COB 8-50W:

. Dual CCT COB LEDs, extraordinary color-mixing & color

temperature tunning from 2700K-6500K;

. Using superconductivity Al.122W/m*k, higher stability &

lower thermal resistance;

. Eutectic bonding package with CSP chips ;

. Phospher filling to ensure uniform light effect & anti glare ;. Phospher filling to ensure uniform light effect & anti glare ;

. Binning @ 85℃, close to actual using conditions ;

. RoHS certified material .