NeSSI: Industry Vision & Gen III – what are

the next steps?

Discussion Moderator: Rob DuboisCPAC/NeSSI Workshop Seattle, Washington, USA

November 9, 2006

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Agenda

1. A recap of industry visions. Is NeSSI in alignment?

2. Gen III microAnalytical– issues and barriers

3. Gen III specification– what information is needed?

4. Gen III implementation– what could CPAC do to enable the

development of microAnalytical devices?

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1. Industry Visions – is NeSSI in alignment?

• NAMUR, VDI/VDE-GMA (Roadmap for Process Sensors 2005-2015)– All physical and chemical data

are available at any time by all equipment parts and processes

– Measurement takes place without interference in the process

– The measured values are available in real time

– Ideally sensor systems function without maintenance, calibration and adjustment

– The sensor systems are inexpensive

• NIST/ATP Vision 2020 (Process Measurement and Control 1998-2020)– Develop technology to

provide smart sensors for all process measurement

– Develop tools to diagnose faults in real-time

– …deliver modular systems both in hardware and software.

– Develop devices to minimize maintenance: including self-diagnostics, fault detection, minimized service requirements and the capability for in-situ standardization and calibration.

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Gen III Model: microAnalytical on NeSSI (power & communication on the NeSSI-bus)

Substrate Substrate

On/Off and On/Off and Modulating ValvesModulating Valves

Flow, Pressure, Flow, Pressure, Temp. SensorsTemp. Sensors

Substrate

Moisture in Moisture in Dry GasDry Gas

PHASED PHASED Micro Micro GCGC

ModValve

D/A

Network

Press/Temp

A/D

Network

NeSSI-bus

SAM

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Examples of (early) Generation III(microAnalytical)

microGCCourtesy of SLS micro technology

microGC (PHASED)Courtesy of Honeywell

Photometeric sensorCourtesy of J. Coates

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2. Gen III what are the Issues & Barriers? (notes)

• Can/should the NeSSI-bus be used to transfer high intensity data (spectra and chromatograms)?– one can send just send key information, quality factors – can be done– keep open ended – should be able to handle large

amounts information– CAN can handle high intensity data– data speed is not critical in many applications

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Different Implementation Model for microAnalytical

VP

A

F Sensor/Actuator

Manager (SAM)

NeSSI™-bus

dcs

Fluid Handling System

“B” Type-non-modular-NeSSI-bus used for communication-can use power externally or from the bus-EExd enclosure

Aux. Power (hazardous wiring methods)

“A” TYPE-modular-bus power and comm.-Intrinsically Safe

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3. What would be required in a Gen III document? (notes)

– Detailed specification is not required– Need Development phases

• macro to micro…

– Interfaces described to allow Intellectual Property to “flourish” between the rails

– Have inventors concentrate on microAnalytical measurement not packaging and communication

– Provide connectivity model

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Could we employ a phased Development?

Phase III

Phase II

Phase I

Hybrid/uses some NeSSI

on-substrate/bus powered

Throwaway

low powersmallestdisposablerobust/self-diagnosticredundant

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4. Gen III Implementation (notes)

• What could CPAC do to enable the development of microAnalytical devices?– a clearing house for microanalytical– further definition needed– use of the terms microlytics and

sensometrics for small devices