“ONE IBS”

Quality Control: Our Partnership with White Horse Laboratories

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QUALITY CONTROL

GENERAL INSPECTION STEPS

1. Upon delivery, packages are inspected for damage. Any damages are noted and photographed for the delivery

driver to sign; supplier is immediately notified.

2. If package is undamaged, an IBS employee will open it and note any loose materials (ex. Torn bags, parts out of

tubes). He or she will then take photos of any loose materials.

3. Manufacturer date and lot codes on supplier packing list are recorded to ensure they match the IBS purchase

order.

4. Then, photos are taken of part labels, supplier labels, and any supplier markings. ESD gloves will be used to

handle the part directly, if necessary.

5. This information is then sent to U.S.A. Quality Control Office before proceeding.

6. U.S.A. Quality Control Office reviews data and advises whether to proceed.

The purpose of this procedure is to describe how materials are received, verified, and shipped to customers via

IBS GlobalWarehouses.

1. If parts are not up to quality standards, they’re subject to additional testing by a lab.

• Component Body Inspection—Detects any surface defects, sanding, or remarking.

• Permanency Test Marking—Easing compounds are applied to ensure mfg. markings are original.

• Solderability Test—Exposes any oxidation or foreign residues on leads.

• Lead Free (RoHs) Testing—Subcontractor performs a lead test and data is provided.

• De-Capsulation Test—Tests for die verification and substrate inspection of part.

• X-Ray Test—Provides complete internal inspection: bonding, paddle, chip, die paddle.

2. After material passes quality inspection, an employee will check the invoice for special instructions from

customer.

3. Then, material is wrapped in a layer of bubble cushion and additional foam cushioning. IBS invoice is enclosed

in the master box.

4. Material is ready to ship.

GENERAL INSPECTION STEPS

If Parts are Inventory Items

For inventory items, an IBS employee will enter bin location and complete entire receiving process.

If Parts are Sourced from Open Market

If parts are sourced from the open market, brokers, or independent suppliers, QA will make evaluations based on

photos and notes. Outside lab testing will be performed, if necessary.

GENERAL INSPECTION STEPS

With IBS Electronics, parts are always obtained directly from factory or authorized distributor. When parts are EOL orOBSOLETED, customer’s approval is required before parts are sourced from open market.

Careful considerations are taken when obtaining parts from the open market:

1. Vendor Qualification and Evaluation

2. ERAI website review and research (for vendor and parts)

3. MFR datasheet review and comparison

4. Component Body Inspection

5. Marking Permanency or Solvent Test

6. SolderabilityTest

7. X-ray examination

8. De-cap examination

9. Deliberation by MRB (Materials Review Board)

Parts obtained from the open market with prior customers authorization, are reviewed and evaluated with

ERAI’s High Risk Parts Report & ERAI’s High Risk Company Report on ERAI’s website. (see images on next slides)

GENERAL INSPECTION STEPS

IBS Electronics is committed to provide quality parts & services that exceed customers’ expectations.

On Time, Every Time.

Incidents in the last three years: 0

The IBS Electronics Group has had NO reports of counterfeit parts delivered to any of our customers for over10+ years.

PERFORMANCE HISTORY

Founded in 2004, White Horse Laboratories is the first company in China to

specialize in counterfeit detection of electronic components. Our international

reputation for technical expertise, transparency, and uncompromising report

integrity has helped us become the pre-eminent lab in Asia and a consultant

to IDEA-STD-1010B and the G-19 DAS6171.

We provide Product Verification, Electrical Testing, Failure Analysis, and

Reliability Testing for electronic components, PCB, and PCBA in addition to

Packaging, Logistics, and Factory Auditing and Inspection serv ices.

White Horse Introduction

• The IBS Electronics Group has Partnered with WhitehorseLaboratories to ensure Quality Control.

WHITE HORSE LABS

Globally Approvedat Jabil since 2015.

Hong Kong Labgistics &

Packaging Centre. 600sqm with 6 FT

Technicians.

The widest range of electrical t est and inspection method

capabilit ies.

Laboratory Testing for Product Verificat ion,

Failure Analysis, Reliability Testing, and Factory

Auditing.

Main Lab Facility in Shenzhen. 1,200sqm with 40 FT employees including 7 Degreed

Engineers.

Companies Who Trust WHL:

Substandard and Counterfeit:

• How Counterfeit and Substandard Products Enter the SupplyChain

– Clones

– Old and PoorlyPackaged

– Remarked

– Refurbished

– Factory Reject

– “Walking Wounded”

– Poor RiskManagement

• 20% of the Product we See is Substandard down from 80% in2006

International Standards and Certifications:

• ERAI

• SAE G-19

• IDEA

• AS5553

• AS6081

• AS6171

• AS9120

• SC21

• ANSI/ESD S20.20-201

• ISO9001-2015

• ISO17025

• MedAccred

Component Condition:

• As defined within the AS6081, stemming originally from ERAI, the

following definitions are used to categorize component condition.

• Suspect

• Fraudulent

• Counterfeit

• Refinished

• Refurbished

• Unused

• Uprated

• Upscreened

• Used (Refurbished or Pulled)

Detection Methods:

• Documentation and PackagingInspection

• General Inspection and Sampling

• External Visual Inspection

• Remarking and ResurfacingTests

• Heated Chemical Testing

• X-Ray Inspection

• Delid/Decapsulation

• X-Ray Fluorescence (XRF)/EDX

• Scanning Electron Microscopy

• Scanning AcousticMicroscopy

• Electrical/Functional Testing

• Solderability Testing

Documentation & Packaging Inspection:

• Check Packing Document

• Check PackagingOuter

Condition

• VerifyQuantity

• Document with

Photograph

General Inspection & Sampling:

• Check Internal Packaging Condition

• Check the Marking and Orientation

• VerifyQuantity

• Select Sample for EVI

External Visual Inspection:

• Inspect Package Body

• Inspect Package Terminals

• Check the Marking

• Measure dimension and compare exterior configuration

Remarking and Resurfacing Tests:

2. Chemical Marking Permanency Test

1. Mechanical scraping of the surface test

• Check if there is coating on body

For Laser marked device For ink marked device

X-Ray Inspection (Radiography):

• Check the internal structure

(lead frame, wire bond

pattern, die position, etc.)

and other anomalies such

as voids.

Decapsulation:

• Check the die marking if matches with manufacture name or logo and part

number.

• Check die topography and die marking if consistent with reference sample or

previous sample.

• Check if scratches or cracks on die surface.

X-Ray Fluorescence:

• This test will show the

element PPM in test point.

Scanning Electron Microscopy:

• Provide very high-resolution images of the sam ple surface.

Scanning Acoustic Microscopy:

No anomaly during SAM

Voids

• SAM detects internal anomalies prior to destructive analysis such as delamination

and voids.

Delamination

Solderability Test:

• This test is to determine the solderability ofdevice intended to be jointed to another

surface using solder for attachment.

• There are 3 methods:

– Dip and look for non-BGA packages

– Surface Mount Process Simulation for SMT

devices

– Wetting balance test - quantitativeanalysis method of solderability

Component Categorization Matrix and Test Levels:Te s t ing P ro fi le s

C o m p o n e n t C a t e g o r y PTPR/CVP D Applicat ion Tes t Funct ional Tes t

Parametr icStat ic Dynamic Timing

Ca p a c i t o r - Ce r a m ic N N N Y Y N

Ca p a c i t o r - T a n t a lu m N N N Y Y N

Ca p a c i t o r - Ele c t r o ly t ic N N N Y Y N

Re s is t o r N N N Y N N

I n d u c t o r N N N Y Y N

Os c i l la t o r , R e s o n a t o r N Y Y N Y Y

Dio d e - Re c t i f ie r Y N Y Y Y N

Dio d e - Z e n e r , T VS , E S D Y N Y Y Y N

Dio d e - L E D Y N Y Y Y N

Dio d e - DI A C Y N Y Y Y Y

T r a n s is t o r - BJ T Y N Y Y Y Y

T r a n s is t o r - M O S F E T N N Y Y Y Y

T r a n s is t o r - I GBT N N Y Y Y Y

T h y r is t o r - S CR N N Y Y Y Y

T h y r is t o r - T r ia c N Y Y Y Y N

Lin e a r - Op - A mp N Y Y Y Y N

Lin e a r - A mp li f ie r - A u d io , I n s t r u me n t a t io n YG Y Y Y Y N

Lin e a r - Co m p a r a t o r N Y Y Y N Y

Co n v e r t e r - A n a lo g - t o - Dig i t a l YG Y Y Y Y Y

Co n v e r t e r - D ig i t a l - t o - A n a lo g YG Y Y Y Y Y

Co n v e r t e r - Vo l t a g e - F r e q u e n c y YG Y Y Y Y N

Re g u la t o r - F ixe d , R e f e r e n c e N N Y Y N N

Re g u la t o r - A d ju s t a b le N Y Y Y N N

Re g u la t o r - S wit c h in g , D C / D C YG Y Y Y N Y

A n a lo g S wit c h - Lo g ic Re la y Y Y Y Y N Y

A n a lo g S wit c h - Op t o c o u p le r N N Y Y N Y

A n a lo g S wit c h - P o we r S wit c h Y Y Y Y N Y

A n a lo g S wit c h - M u l t ip le xe r Y Y Y Y N Y

M ixe d S ig n a l - LED/ M o t o r D r iv e r Y Y Y Y N Y

Lo g ic - Ga t e s , T r a n s c e iv e r , R e g is t e r s , e t c . Y Y Y Y N Y

M e m o r y - F l a s h , O T P , E E P R O M Y Y Y Y Y Y

P r o c e s s o r s - M C U , D S P , C P U Y Y Y Y Y Y

A p p l ic a t io n S p e c i f ic I C & S y s t e m- o n - c h ip I C Y Y Y Y Y Y

• Passive components

– Resistor, Capacitor, Inductor

– Transformer,Crystal

• Active components

– Diodes, Transistors

– Optoelectronic Devices

– Integrated Circuits(IC)

Components:

Electrical Testing Levels:

• Continuity Testing

– Curve Tracer

– PTPR/CVPD

• Application Test

• Functional Test

• Static Parameter (DC)

• Dynamic Parameters (AC)

• Timing Characteristics

• Temperature Range

• Burn-In

LCR:

• L(Inductor)

– Inductance, Impedance, DCR

• C(Capacitor)

– Capacitance, DF,ESR, IR

• R(Resistor)

– Resistance

*All LCRcan be precondition (High

Temperature or humidity )

Discrete Devices:• Diode

– VF,IR

• Transistor

– ICEO,BVCEO,

– ICBO,VBE,HFE

• MOSFET

– IDSS,BVDSS,

– VGSTH,RDS(On)

Digital Program Testing:

• E(E)PROM/FRAM/NVRAM

• B/PROM

• DRAM/SRAM

• PLD

• MCU/MPU

Electrical Testing:

• Pin continuity

test

• IDcheck

• Blank-check

• Program & verify

• Read & verify

• Erase

JTAG Testing:

Programmable Logic Device &

Field Programmable Gate Array

CPLD FPGA

Xilinx, Altera, Lattice,

Microsemi(Actel)

JTAG Testing:

• Read the ID code and verify

• Loading the program

• Running on ApplicationBoard

Speed and Temperature Testing:

• Set the Temperature

• Commercial is –40C to

+85C

• Industrial is -40C to +100C

• Measure the output

frequency to compare the

Golden Sample.

Pin Continuity Testing:

• Pin-to-Pin Resistance Clampdown Voltage

of Protective Diodes

• Curve Trace

Testing Program - PTPR/CVPD:

Pin-to-Pin Resistance Clampdown Voltage of ProtectiveDiode

Pass Fail

Curve Trace:

The tracer is for one pin IC Pin-out

Bench Testing:

• Voltage

• Current

• Frequency

Recommendations By Product Type– Protocol Cheat Sheet:

I n s p e c t i o n P r o c e s s e sC o m p o n e n t C a t e g o r y V i s u a l I n s p e c t i o n D e c a p s u l a t i o n X - R a y S o l d e r a b i l i t y L e a d - fr e e

C a p a c i t o r - C e r a m i c Y N Y G

YG

YG

Y Y

C a p a c i t o r - T a n t a l u m Y N Y Y

C a p a c i t o r - E l e c t r o l y t i c Y N Y Y

R e s i s t o r Y N N Y Y

I n d u c t o r Y N YG Y Y

O s c i l l a t o r , R e s o n a t o r Y N N Y Y

D i o d e - R e c t i fi e r Y N YG

YG

Y Y

D i o d e - Z e n e r , T V S , E S D Y N Y Y

D i o d e - L E D Y N N Y Y

D i o d e - D I A C Y N YG Y Y

T r a n s i s t o r - B J T Y N YG Y Y

T r a n s i s t o r - M O S F E T Y N YG Y Y

T r a n s i s t o r - I G B T Y N YG Y Y

T h y r i s t o r - S C R Y N YG Y Y

T h y r i s t o r - T r i a c Y N YG Y Y

L i n e a r - O p - A m p Y Y Y Y Y

L i n e a r - A m p l i fi e r - A ud io , I n s t r u m e n t a t i o n Y Y Y Y Y

L i n e a r - C o m p a r a t o r Y Y Y Y Y

C o n v e r t e r - A n a l o g - t o - D i g i t a l Y Y Y Y Y

C o n v e r t e r - D i g i t a l - t o- A n a l og Y Y Y Y Y

C o n v e r t e r - V o l t a g e - F r e q u e n c y Y Y Y Y Y

R e g u l a t o r - F i x e d , R e f e r e n c e Y Y YG Y Y

R e g u l a t o r - A d j u s t a b l e Y Y YG Y Y

R e g u l a t o r - S w i t c h i n g , D C / D C Y Y Y Y Y

A n a l o g S w i t c h - L o g i c R e l a y Y Y Y Y Y

A n a l o g S w i t c h - O p t o c o u p l e r Y Y Y Y Y

A n a l o g S w i t c h - P o w e r S w i t c h Y Y Y Y Y

A n a l o g S w i t c h - M u l t ip l e xe r Y Y Y Y Y

M i x e d S i g n a l - L E D / M o t o r D r i v e r Y Y Y Y Y

L o g i c - G a t e s , T r a n s c e i v e r , R e g i s t e r s , e t c . Y Y Y Y Y

M e m o r y - F l a s h , O T P , E E P R O M Y Y Y Y Y

P r o c e s s o r s - M C U , D S P , C P U Y Y Y Y Y

A p p l i c a t i o n S p e c i fi c I C & S y s t e m - o n - c h i p I C Y Y Y Y Y

Report Examples:

• Inspections combined report

• Visual inspection (Remarked &Refurbished)

• Parametric test – Resistor (temperature range)

• Functional test –JTAG

• FailureAnalysis

Component, PCB, and PCBA Failure Analysis & Reliability Testing:

• Component and Board-level Failure Analysis to verify the reported failure

mode and the cause of it. OEM and EMS require this information to make

decisions about the reliability of the products they are providing to their

customers.• White Horse provides faster more reliable answers thanOCM or supplier direct

who have a vested interest in protection themselves.• Curve Trace Testing• Failure Mode Verification• Scanning Acoustic Microscopy• Cross Sectioning• Scanning Electron Microscopy• Liquid Crystal (Hotspot) Testing• Layered Demetalization

Product Packaging and Programming:

• Poor packaging can lead to lead oxidation,

delamination, and “popcorning” and we frequently see

good quality product del ivered in poor packaging.

• Wide range of carriers and material in stock for most

component package types

• ESD-certified facility

• Baking MSL-sensitive parts

• Tape and Reel packaging serv ice

• Dry-Pack (vacuum seal with desiccant and HIC)

• Re-boxing and labeling

• Documentation and bookings

Our Valued Customers

IBS Electronics’ Quality Policy is “committed” to provide quality parts & services that exceeds our customers’ expectations.

On Time, Every Time.

We look forward to being your strategic supply chain solutions provider.

www.ibselectronics.com