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NASA Contractor Report 198165
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Advanced Flight Computer
Special Study Final Report
Dennis Coo
Loral Federal Systems, Manassas, Virginia
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Purchase Order L-40679D
March 1995
National Aeronautics and
Space Administration
Langley Research Center
Hampton, Virginia 23681-0001
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https://ntrs.nasa.gov/search.jsp?R=19950020826 2018-05-02T12:11:22+00:00Z
TABLE OF CONTENTS
LIST OF FIGURES ...........................................................
LIST OF TABLES ............................................................
LIST OF ACRONYMS ........................................................
EXECUTIVE SUMMARY .....................................................
1. OVERVIEW ..............................................................
2. ARCHITECTURE DEFINITION ............................................
2.1 Architecture Study Concept and Approach ...................................
2.1.1 AFC System Architecture Concept .......................................2.1.2 Initial Baselines ......................................................
2.1.2. I Control / General Purpose Processor ....................................
2.1.2.2 Digital Signal Processor ..............................................
2.1.2.3 Advanced Memory Packaging .........................................
2.2 Comparison to AFC 1998 Performance Goals .................................
2.3 Description of the AFC System Architecture ..................................2.3.1 AFC Processor Module Architecture ......................................
2.3.2 AFC Global Memory Module Architecture .................................2.3.3 AFC I/O Module Architecture ...........................................
2.3.4 AFC Digital Signal Processor Module Architecture ..........................
2.3.5 Processor Comparisons ................................................
2.3.6 Node Connection Comparisons ..........................................
3. VLS! TECHNOLOGY .....................................................
3.1 Essential Parameters/Characteristics for AFC .................................
3.1.1 Feature Size .........................................................
3. ! .2 Technology Type .....................................................
3.13 Voltage Level ........................................................
3.1 4 Number of Wiring Levels ...............................................
3.1.5 Device Isolation ......................................................
3.1.6 Radiation Hardness ...................................................
3.1.7 Compatibility with Commercial VLSI Process ..............................
A VLSI Technology Roadmap for AFC .......................................
Silicon-On-Insulator (SO1) Technology ......................................VLSI PACKAGING STUDY ................................................
Packaging Approach Studies ...............................................
4.1.1 Processor Module Packaging ............................................
4.1.2 Global Memory Module Packaging .......................................
4.1.3 I/O Module Packaging .................................................
3.2
3.3
4.
4.1
4.2
5.
6.
6.1
6.2
7.
Appendix A
Packaging Study Observations ...................ISSUES and FUTURE TRADE STUDIES ..........
DEVELOPMENT PLAN ........................
Product Development at Loral ...................
Development Plan .............................
CONCLUSION ................................
BIBLIOGRAPHY ......................
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LIST OF FIGURES
Figure 1. AFC System Architecture Concept Layout Diagram ........................... 9
Figure 2. AFC Processor Module Architecture ....................................... 14
Figure 3. AFC Global Memory Module Architecture .................................. 15
Figure 4. AFC Global Memory Module Architecture .................................. 16
Figure 5. AFC Multi-Node DSP Module Architecture ................................. 17
Figure 6. AFC Node Connection Alternatives ........................................ 19
Figure 7. AFC DSP Node Connection Alternative .................................... 20
Figure 8. Loral's VLS] Technology Roadmap: A Representative Path for AFC ............. 28
Figure 9. Loral's VLSI Circuit Density Improvement .................................. 29
Figure 10. Processor Module Package Alternatives ................................... 32
Figure I I. Global Memory Module Packaging Alternatives (not shown to scale) ............ 34
Figure 12. Loral Federal Systems Manassas Space Processor Products Evolution ........... 4 I
Figure 13. High Level AFC Development Plan ...................................... 43
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LIST OF TABLES
Table 1. Advanced Flight Computer 1998 Performance Goals ...........................
Table 2. Comparison to AFC 1998 Performance Goals ................................
Table 3. Summary of AFC System Processor Features .................................
Table 4. VLSI Technology Parameters/Characteristics Essential to AFC Specification ........
Table 5. Dimensions for Core Chips Used in the AFC Study ............................
Table 6. Summary of Processor Module Package Alternatives ...........................
Table 7. Comparison of SRAM Global Memory Packaging Alternatives ..................
Table 8. Comparison of DRAM Global Memory Packaging Alternatives ..................
Table 9. Comparison of I/O Module Packaging Alternatives ............................
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!!1
AD, ADI
AFC
AISM
ASCM
ASPS
ATIM
BEOL
BiCMOS
CFP
DMA
DoD
DSP
ECC
ECL
FP
GaAs
GVSC
HD!
HMC
IBM
JTAG
LaRC
Left
LOCOS
MCM
MESI
NASA
PBEOL
PCB
PCI
POWER
PPC
PVS
QFP
LIST OF ACRONYMS
Analog Devices. Inc.
Advanced Flight Computer (NASA program)
Advanced Insertion of Standard Microelectronics (Phillips Lab program)
Advanced Spaceborne Computer Module (Phillips Lab program)
Advanced Spaceborne Processor Subassembly (Space Systems Loral)
Advanced Technology Insertion Module (ASCM follow-on)
Back-end-of-the-line VLSI fabrication phase
Bipolar-CMOS
Ceramic Flat Pack
Direct Memory Access
Department of Defense
Digital Signal Processor
Error Correction Code
Emitter-Coupled Logic
Flat Pack
Gallium Arsenide
Generic VHSIC Spacebome Computer (Phillips Lab program)
High Density Interconnect
Hermetic Memory Card
International Business Machines Corporation
Joint Test Action Group
Langley Research Center (NASA)
Effective Channel Length of a Transistor Gate
Locally Oxidized Silicon
Multi-Chip Module
Modified. Exclusive, Shared, Invalid cache coherency states
National Aeronautics and Space Administration
Planar Back-end-of-the-line VLSI fabrication method/phase
Printed Circuit Board
Peripheral Component Interconnect bus
Performance Optimized With Enhanced RISC (IBM architecture)
PowerPC
PowerPC Visual Simulator
Quad Flat Pack
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RAD6000 -SC/-MC
RHCMOS
RHSRAM
RSC
SBC
SCM
SEU
SiO2
SOA
SOG
SOl
SOP
STI
TI
TSOP
UTMC
VCOS
VLSI
XCVR
Radiation hardened RISC System/6000 CPU, -Single Chip /-Multi Chip
Radiation Hardened CMOS
Radiation Hardened SRAM
IBM RISC System/6000 Single Chip CPU
Single Board Computer
Single Chip Module
Single Event Upset
Silicon Dioxide
State-of--the--art
Sea of Gates design method
Silicon On Insulator
State-of-the--practice
Shallow Trench Isolation
Texas Instruments Corporation
Thin Small Outline Package
United Technologies Microelectronics Center
Loral VLS1 Chips On Silicon multi--chip module
Very Large Scale Integration
Transceiver
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EXECUTIVE SUMMARY
The Advanced Flight Computer (AFC) is a NASA effort to define and develop a 32--bit radiation
hardened, SEU tolerant flight computer module which significantly reduces power, weight, and vol-
ume when compared with current approaches, while maintaining or increasing throughput and
memory capacity. The AFC is intended for flight qualifiable readiness in 1998, with potential use
in missions beginning in 2000. Demonstrable prototypes would be available in 1995-96, including
full function brassboard(s) and tools, with a clearly defined low-cost, low-risk path to final packag-
ing and flight qualification.
The purpose