mxm electro spec
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Specification
MXM Graphics ModuleMobile PCI Express ModuleElectromechanical Specification
SP-01106-001_v1.0May 2004
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Document Change History
Version Date Reason for Change
1.0 05/14/04 Initial Release
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Table of Contents
Document Change History..............................................................................................iOverview .......................................................................................................................1
Key Features ..................................................................................................................... 1Configurations ................................................................................................................... 2Display Options ................................................................................................................. 2
MXM Display options...................................................................................................... 3IGP and MXM .................................................................................................................... 3
Mechanical Specifications .............................................................................................4Mechanical Description....................................................................................................... 4Mounting and Retention....................................................................................................12MXM Compatibility ............................................................................................................12Mechanical .......................................................................................................................12Keep Out Definitions.........................................................................................................12
Z-Height Restrictions ....................................................................................................13Surface Keep Outs........................................................................................................15
Mechanical Keep Out Drawings..........................................................................................16MXM Module Keep Outs................................................................................................17
Mechanical Requirements..................................................................................................30Backing Plate ...............................................................................................................30Thermal Solution Mounting ...........................................................................................30
Electrical Specifications...............................................................................................31PCI Express Support .........................................................................................................31Electrical Connector..........................................................................................................31Connector Pin Descriptions................................................................................................37Power Requirements.........................................................................................................39Power Throttling ...............................................................................................................40System Requirements .......................................................................................................40
Display Requirements ...................................................................................................40Other Requirements .....................................................................................................41
Additional Function Support...............................................................................................42
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Appendix: Support Information ..................................................................................43Configuring Notebook for MXM with IGP ............................................................................43
Configurable Option......................................................................................................43Upgradeable Option......................................................................................................44
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List of Figures
Figure 1. Display Options ................................................................................................. 3Figure 2. MXM Form Factor.............................................................................................. 5Figure 3. MXM-I Topside.................................................................................................. 6Figure 4. MXM-II Topside................................................................................................. 7Figure 5. MXM-II Backside ............................................................................................... 8Figure 6. MXM-III Topside ..............................................................................................10Figure 7. MXM-III Backside.............................................................................................11Figure 8. MXM Side View, Top and Backside Height Restrictions for MXM Modules..............16Figure 9. MXM-I Top Surface Keep Outs ..........................................................................17Figure 10. MXM-I Bottom Surface Keep Outs .....................................................................18Figure 11. MXM-II Top Surface Keep Outs .........................................................................19Figure 12. MXM-II Bottom Surface Keep Outs ....................................................................20Figure 13. MXM-III Top Surface Keep Outs........................................................................21Figure 14. MXM-III Bottom Surface Keep Outs...................................................................22Figure 15. MXM-I Z-Height Restriction Zones .....................................................................23Figure 16. MXM-II Topside Z-Height Restriction Zones........................................................24Figure 17. MXM-II Bottomside Z-Height Restriction Zones...................................................25Figure 18. MXM-III Topside Z-Height Restriction Zones ......................................................26Figure 19. MXM-III Topside Z-Height Restriction Zones (Continued)....................................27Figure 20. MXM-III Topside Z-Height Restriction Zones (Continued)....................................28Figure 21. MXM-III Bottomside Z-Height Restriction Zones .................................................29Figure 22. MXM Connector Motherboard Footprint..............................................................32Figure 23. MXM Connector Top Down and Side View..........................................................33Figure 24. MXM Card Edge Finger Pattern..........................................................................34Figure 25. Notebook Output Topology with IGP .................................................................44Figure 26. Notebook Output Topology with IGP .................................................................44
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List of Tables
Table 1. Board Configurations ......................................................................................... 2Table 2. MXM Display Options......................................................................................... 2Table 3. Height Restrictions ...........................................................................................15Table 4. Connector Pinout..............................................................................................35Table 5. Connector Pin Descriptions ...............................................................................37Table 6. Power Requirements ........................................................................................39
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Overview
The Mobile PCI Express Module (MXM) is a consistent graphics interface for PCIExpress notebooks. The specification describes the electromechanical interfacesincluding feature set, dimensions, connector pinouts and electrical interfaces foreach MXM Graphics Module. The MXM graphics modules consist of a standardsingle 230-pin edge connector in which all Input/Outputs are routed through.
Key Features
Low cost Small size Scalable performance 16 lane PCI Express support LVDS panel support Dual DVI support VGA support Video out support Upgradeable graphics
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Configurations
Table 1 lists the dimensions and maximum power for the three MXM graphicsmodule types.
Table 1. Board Configurations
MXM Type Width Length Power
MXM-I 70 mm 68 mm Up to 18 W
MXM-II 73 mm 78 mm Up to 25 W
MXM-III 82 mm 100 mm Up to 35 W
Display Options
Table 2 lists the MXM graphics boards display options.
Table 2. MXM Display Options
Display Options MXM Display Solutions
VGA Routed to either VGA or DVI-I connectors onmotherboard
Two single-link DVI orone dual-link DVI
DVI routed to connector on motherboardand/or through docking station
Video out Video out routed to connector on motherboard,
Supports Composite, S-Video and HDTV
Single dual-link LVDS LVDS routed to connector on the motherboard.
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MXM Display options
MXM is capable of supporting the following interfaces:
One dual-link LVDS panel display One TV output One VGA output One dual-link TMDS or two single-link TMDS outputs to DVIAll interfaces are routed through the MXMs connector to the motherboard(Figure 1).
LVDS
MXM
TVOut VGA
DVI (2 Single or 1 dualLink)
Figure 1. Display Options
IGP and MXM
The MXM platform has been designed to co-exist with Integrated GraphicsProcessors (IGP). An IGP notebook designed to support MXM graphics modulescan be populated with or without a MXM graphics card. If no MXM graphicsmodule is present, installation of a loop through card is required to complete circuitpaths for LVDS signals and enable panel operation.
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MechanicalSpecifications
Mechanical Description
The MXM-I and MXM-II form factors (Figure 2 through Figure 5) accommodate
GPUs up to 35 mm 35 mm in size. The four holes surrounding the GPU are usedto mount the thermal solution. The two holes on the far end of the board are forstand-offs to mount to the notebook.
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Figure 2. MXM Form Factor
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Figure 3. MXM-I Topside
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Figure 4. MXM-II Topside
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Figure 5. MXM-II Backside
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The MXM-III form factor (Figure 6 and Figure 7) will accommodate GPUs up to40 mm 40 mm in size. The four holes surrounding the GPU are used to mountthe thermal solution. The two holes on the far end of the board are for stand-offs tomount to the notebook.
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Figure 6. MXM-III Topside
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Figure 7. MXM-III Backside
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Mounting and Retention
The MXM mounts to the notebooks motherboard through a 230-pin right angle
edge connector. The connector on the MXM is a card-edge connector consisting ofonly the PCB with plated contacts. The MXM graphics module is inserted at a 20 to30 degree angle and then rotated towards the motherboard and then screwed intomechanical mounting stand-offs. The stand-offs will maintain separation from themotherboard and also assist in the retention of the MXM. The stand-off locationswill be the same for all MXM graphics modules to allow one motherboard tosupport the three MXM graphics module types.
MXM Compatibility
The MXM has been designed to allow for compatibility between the three MXM
graphics module types. The notebooks mounting holes for the MXM are in thesame location for all MXM graphics modules.
MXM-I can insert into all notebooks that support MXM graphics modules. MXM-II can insert into notebooks that support MXM-II and MXM-III modules. MXM-III modules only insert into notebooks that support a MXM-III module volumetrickeep outs.
MXM-III thermal solutions are incompatible with MXM-I and MXM-II. MXM-IIIaccommodates a maximum of a 40 mm 40 mm GPU package where as MXM-Iand MXM-II support a maximum of a 35 mm 35 mm GPU package.
Mechanical Keep OutDefinitions
Each of the three Mobile PCI Express modules (MXM) has distinct mechanicalkeep out zones. These keep out zones are a combination of z-height restrictions andsurface keep outs on the MXM PCB. The keep outs are necessary for system andthermal solution integration compatibility. These surface keep out volumes aredesigned to accommodate thermal solutions that dissipate the maximum power aparticular MXM graphics module is designed for and to allow mechanicalcompatibility between modules with an integrated thermal solution.
The rest of this section is devoted to defining the MXM-I, II, and III mechanical
restrictions in greater detail. The definitions provided are divided up into zoneson the MXM that define z-height restrictions, and surface keep outs. Writtendefinitions are followed by detailed mechanical drawings of each MXM with itsassociated restricted areas.
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Z-Height Restrictions
Topside Zone A: Maximum Z Height on Topside of PCB.
The maximum height from the surface of the MXM PCB that any surfacemounted component, or other attribute of the MXM may extend above thePCB surface. The thermal solution is not restricted by this blanket heightrestriction.
Zone C: GPU Spreader Plate.A thermal spreader plate is required to assist in cooling the GPU. Thisrestriction defines the maximum topside component height under this spreaderplate.
Zone D: Memory Area Opposite the Edge Connector.A restriction is defined on all three MXM graphics modules under memoryspreader plates. The memory spreader plates are broken into two separate keep
out regions because of unique geometric requirements for each. The D zoneis associated with the memory located directly opposite the PCBs edgeconnector. On the highest power consuming modules, the zone D memoryspreader plate will be an integral part of the GPU spreader. On the lowestpower MXM-I and II modules, the memory spreaders could be made designoptions or removable.
Zone D-IDefines the z-height restriction in the D-zone for MXM-I. This zone isdesigned to accommodate power supply components for configurations withtwo memories on the MXM PCB.
Zone D-IIDefines the z-height restriction in the D-zone for MXM-II and is equivalent
to Zone D-I in order to maintain thermal solution compatibility betweenMXM-I and MXM-II.
Zone D-IIIDefines the z-height restriction in the D-zone for MXM-III and isnotrequired to be compatible with the thermal solution for MXM-I or MXM-II,and has unique requirements.
Zone E: Memory Area on Topside to Right of the Edge ConnectorDefines the z-height restriction for all components except for memories. Thisarea is along the right-hand edge of the MCM PCB as viewed from the topsideof the MXM with the connector edge at the bottom position.
Zone F: Topside System Integration.There are two holes in each MXM graphics module set aside for mechanically
attaching the MXM to a notebook computer system. A cylindrically shaped zeroheight keep out region has been defined on the topside of the MXM in order toallow for an attachment feature from the notebook system to extend onto theMXM and in combination with a fastener to hold the MXM securely in place.
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Zone G: Topside Heat Pipe Exit RoutingIf a heat pipe(s) is (are) used as a portion of the cooling solution or some othersimilar means is used to transfer heat from the GPU spreader plate to a remoteheat exchanger, this height restriction defines the maximum component height
restriction in the three locations where the heat pipe may transition off of thePCB. The zones are oriented with the edge connector down in the 6 o-clockposition.
Zone G1Defines the maximum height of any board component in the area of theMXM and the restriction extends to the left/9-oclock of the GPU beyondthe GPU spreader plate.
Zone G2Defines the maximum height of any board component in the area of theMXM and the restriction extends to the top/12 o-clock of the GPUbeyond the memory or GPU spreader plate.
Zone G3Defines the maximum height of any board component in the area of theMXM and the restriction extends to the right/3 o-clock of the GPUbeyond the memory or GPU spreader plate.
Backside Zone B: Maximum Z-Height on Backside of the MXM PCB
The maximum height from the surface of the MXM PCB that any surfacemounted component and/or other attribute of the MXM may extend below theMXM surface with the exception of back side memory and that memory'sassociated thermal solution. Zone B defines the general z-height restriction. Forthe MXM-III only, the backing plate may exceed the 1.2 mm height restriction.
Zone H: Backside Memory Near the Edge ConnectorZ-height restriction under the thermal spreader centered on the memory on thebackside of the PCB opposite the edge connector.
Zone J: Backside Memory Opposite the Edge ConnectorZ-height restriction under the thermal spreader centered on the memory on thebackside of the PCB not opposite of the edge connector.
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Surface Keep Outs
Topside
Surface Keep Out 1: Thermal Solution Attach.Surface keep outs are defined surrounding the thermal integration through holesin the PCB in order to accommodate varied thermal solution designs andgrounding of the thermal solutions to reduce EMI.
Surface Keep Out 2: System Integration - Top.Holes in the MXM PCB have been defined for mechanical integration of theMXM into a notebook system. There are topside surface keep outs definedsurrounding these system integration through holes.
Surface Keep Out 3: Edge Connector.This is space reserved on the topside of the MXM for appropriate edgeconnector design and integration.
Backside Surface Keep Out 4: System Integration - Bottom.
Holes in the MXM PCB have been defined for mechanical integration of theMXM into a notebook system. There are bottomside surface keep outs definedsurrounding these system integration through holes
Surface Keep Out 5: Edge Connector.This is space reserved on the bottomside of the MXM for appropriate edgeconnector design and integration.
Table 3 defines the height restrictions and surface keep outs on the top and back ofMXM-I, MXM-II and MXM-III.
Table 3. Height Restrictions
MXM Z-Height Restriction Keep Out Zones
Topside (mm) Bottomside (mm)
A,F 3.5 B 1.2
C 1.84 H 0.66
D-I, D-II 2.00 J 0.66
D-III, E 0.66
G 2.64
Note: There is a 0.25 mm air gap maintained between the maximum allowed z-height from the backside of the MXM and the maximum z-height allowedon the topside of the motherboard directly under the MXM.
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Mechanical Keep OutDrawings
The mechanical drawings shown in this section explicitly define the z-heightrestricted zones and surface keep outs.
Figure 8 shows the general z-height restrictions for all MXM graphics modules.
Figure 8. MXM Side View, Top and Backside HeightRestrictions for MXM Modules
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MXM Module Keep Outs
Figure 9 through Figure 14 define the top and bottom surface keep outs for MXM-I, MXM-II and MXM-III.
Figure 9. MXM-I Top Surface Keep Outs
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Figure 10. MXM-I Bottom Surface Keep Outs
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Figure 11. MXM-II Top Surface Keep Outs
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Figure 12. MXM-II Bottom Surface Keep Outs
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Figure 13. MXM-III Top Surface Keep Outs
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Figure 14. MXM-III Bottom Surface Keep Outs
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Figure 15 through Figure 21 show the mechanical drawings of the top and back ofthe MXM-I, MXM-II, MXM-III and define the z-height restriction zones. In caseswhere z-height restriction zones overlap, the most restrictive of the overlappingzones will always take precedence.
Figure 15. MXM-I Z-Height Restriction Zones
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Figure 16. MXM-II Topside Z-Height Restriction Zones
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Figure 17. MXM-II Bottomside Z-Height Restriction Zones
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Figure 18. MXM-III Topside Z-Height Restriction Zones
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Figure 19. MXM-III Topside Z-Height Restriction Zones (Continued)
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Figure 20. MXM-III Topside Z-Height Restriction Zones (Continued)
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Figure 21. MXM-III Bottomside Z-Height Restriction Zones
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Mechanical Requirements
Backing Plate
Each MXM graphics module requires a mechanical backing plate design that shallbe implemented as needed to compensate for a warped board resulting fromthermal solution loading requirements. For MXM-I and MXM-II the backing plateis contained within the 1.2 mm universal z-height restriction. For MXM-III only, thebacking plate is allowed to exceed the 1.2 mm height restriction.
This backing plate can be unique for each MXM design. In MXM configurationsthat have memory on the backside of the PCB, the memory and the portion of thecooling solution covering the memory may exceed the Zone-C height restriction.
Thermal Solution Mounting
The thermal solution is mounted to the MXM with M2.5 screws from thebottomside of the PCB. A specific screw size is defined to ensure inter-boardcompatibility because the backing plates may be unique to each MXM.
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ElectricalSpecifications
PCI Express Support
The Mobile PCI Express Module (MXM) supports a link of up to sixteen bi-
directional PCI Express differential signaling lanes. It is compliant with PCI ExpressBase Specification 1.0a except for power delivery and power management.Notebook power requirements supercede PCI Express power specifications. TheMXM does not support Hot-Plug insertion.
Electrical Connector
The Mobile PCI Express Module (MXM) utilizes a 230 circuit card-edge connectionsystem. The contacts are rated for 0.5 A steady state current. The connectoraccommodates card thicknesses of 1.2 mm and will initially have three differentconnector height options. The connector heights are 5 mm, 2.7 mm and 1.5 mm
surface to surface spacing between the MXM and the motherboard. Differentconnector heights can be developed in the future.
All external and internal notebook interfaces are routed through the MXMsconnector and down to the motherboard. The motherboard will then connect thesesignals from the MXM to the appropriate circuitry.
Figure 22 through Figure 24 describe the MXM connector. Table 4 lists theconnector pinout.
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Figure 22. MXM Connector Motherboard Footprint
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Figure 23. MXM Connector Top Down and Side View
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Figure 24. MXM Card Edge Finger Pattern
Card Edge Finger Pattern, Topside
Card Edge Finger Pattern, Bottomside
MXM Card Edge Finger Pattern, Side View
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Table 4. Connector Pinout
Pin# Signal Name Pin# Signal Name
1 PWR_SRC 2 1V8RUN
3 PWR_SRC 4 1V8RUN
5 PWR_SRC 6 1V8RUN
7 PWR_SRC 8 1V8RUN
9 PWR_SRC 10 1V8RUN
11 PWR_SRC 12 1V8RUN
13 PWR_SRC 14 1V8RUN
15 PWR_SRC 16 RUNPWROK
17 GND 18 5VRUN
19 GND 20 GND
21 GND 22 GND
23 GND 24 GND
25 KEY 26 KEY
27 KEY 28 KEY
29 KEY 30 KEY
31 KEY 32 KEY
33 KEY 34 KEY
35 KEY 36 KEY
37 PEX_RX15# 38 PRSNT2#
39 PEX_RX15 40 PEX_TX15#
41 GND 42 PEX_TX15
43 PEX_RX14# 44 GND
45 PEX_RX14 46 PEX_TX14#
47 GND 48 PEX_TX14
49 PEX_RX13# 50 GND51 PEX_RX13 52 PEX_TX13#
53 GND 54 PEX_TX13
55 PEX_RX12# 56 GND
57 PEX_RX12 58 PEX_TX12#
59 GND 60 PEX_TX12
61 PEX_RX11# 62 GND
63 PEX_RX11 64 PEX_TX11#
65 GND 66 PEX_TX11
67 PEX_RX10# 68 GND
69 PEX_RX10 70 PEX_TX10#
71 GND 72 PEX_TX10
73 PEX_RX9# 74 GND
75 PEX_RX9 76 PEX_TX9#
77 GND 78 PEX_TX9
79 PEX_RX8# 80 GND
81 PEX_RX8 82 PEX_TX8#
83 GND 84 PEX_TX8
85 PEX_RX7# 86 GND
Pin# Signal Name Pin# Signal Name
87 PEX_RX7 88 PEX_TX7#
89 GND 90 PEX_TX7
91 PEX_RX6# 92 GND
93 PEX_RX6 94 PEX_TX6#
95 GND 96 PEX_TX6
97 PEX_RX5# 98 GND
99 PEX_RX5 100 PEX_TX5#
101 GND 102 PEX_TX5
103 PEX_RX4# 104 GND
105 PEX_RX4 106 PEX_TX4#
107 GND 108 PEX_TX4
109 PEX_RX3# 110 GND
111 PEX_RX3 112 PEX_TX3#
113 GND 114 PEX_TX3
115 PEX_RX2# 116 GND
117 PEX_RX2 118 PEX_TX2#
119 GND 120 PEX_TX2
121 PEX_RX1# 122 GND
123 PEX_RX1 124 PEX_TX1#
125 GND 126 PEX_TX1
127 PEX_RX0# 128 GND
129 PEX_RX0 130 PEX_TX0#
131 GND 132 PEX_TX0
133 PEX_REFCLK# 134 PRSNT1#
135 PEX_REFCLK 136 TV_C/HDTV_Pr137 CLK_REQ# 138 GND
139 PEX_RST# 140 TV_Y/HDTV_Y
141 RSVD 142 GND
143 RSVD 144 TV_CVBS/HDTV_Pb
145 SMB_DAT 146 GND
147 SMB_CLK 148 VGA_RED
149 THERM# 150 GND
151 VGA_HSYNC 152 VGA_GRN
153 VGA_VSYNC 154 GND
155 DDCA_CLK 156 VGA_BLU
157 DDCA_DAT 158 GND
159 IGP_UCLK# 160 LVDS_UCLK#
161 IGP_UCLK 162 LVDS_UCLK
163 GND 164 GND
165 RSVD 166 LVDS_UTX3#
167 RSVD 168 LVDS_UTX3
169 RSVD 170 GND
171 IGP_UTX2# 172 LVDS_UTX2#
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Pin# Signal Name Pin# Signal Name
173 IGP_UTX2 174 LVDS_UTX2
175 GND 176 GND
177 IGP_UTX1# 178 LVDS_UTX1#
179 IGP_UTX1 180 LVDS_UTX1
181 GND 182 GND
183 IGP_UTX0# 184 LVDS_UTX0#
185 IGP_UTX0 186 LVDS_UTX0
187 GND 188 GND
189 IGP_LCLK# /DVI_B_CLK#
190 LVDS_LCLK#
191 IGP_LCLK /DVI_B_CLK
192 LVDS_LCLK
193 DVI_B_HPD /GND
194 GND
195 RSVD 196 LVDS_LTX3#
197 RSVD 198 LVDS_LTX3
199 GND 200 GND
201 IGP_LTX2# /DVI_B_TX2#
202 LVDS_LTX2#
203 IGP_LTX2 /DVI_B_TX2
204 LVDS_LTX2
205 GND 206 GND
Pin# Signal Name Pin# Signal Name
207 IGP_LTX1# /DVI_B_TX1#
208 LVDS_LTX1#
209 IGP_LTX1 /DVI_B_TX1
210 LVDS_LTX1
211 GND 212 GND
213 IGP_LTX0# /DVI_B_TX0#
214 LVDS_LTX0#
215 IGP_LTX0 /DVI_B_TX0
216 LVDS_LTX0
217 DVI_A_HPD 218 GND
219 DVI_A_CLK# 220 DDCC_DAT
221 DVI_A_CLK 222 DDCC_CLK
223 GND 224 LVDS_PPEN
225 DVI_A_TX2# 226 LVDS_BL_BRGHT
227 DVI_A_TX2 228 LVDS_BLEN
229 GND 230 DDCB_DAT
231 DVI_A_TX1# 232 DDCB_CLK
233 DVI_A_TX1 234 2V5RUN
235 GND 236 GND
237 DVI_A_TX0# 238 3V3RUN
239 DVI_A_TX0 240 3V3RUN
241 GND 242 3V3RUN
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Connector Pin Descriptions
Table 5 contains pin descriptions for each signal type. All Input/Outputclassifications are relative to the MXM graphics module.
Table 5. Connector Pin Descriptions
Signal Name Input/Output Description
DVI_A_TX0-2,
DVI_A_TX0-2#Output, 100 Ohm Diff TMDS output for either single link DVI or dual
link DVI
DVI_A_CLK,DVI_A_CLK#
Output, 100 Ohm Diff TMDS clock for either single link DVI or duallink DVI
DVI_A_HPD Input DVI hot plug detect for DVI_A
DVI_B_TX0-2,
DVI_B_TX0-2#Output, 100 Ohm Diff TMDS output for either single link DVI or dual
link DVI, upper bits for dual-link. Note:these pins are shared with IGP LVDS loopthrough pins
DVI_B_CLK,
DVI_B_CLK#Output, 100 Ohm Diff TMDS clock, only used for second single-link
DVI. Note: these pins are shared with IGPLVDS loop through pins
DVI_B_HPD Input/GND DVI hot plug detect for DVI_B. Tie to GNDon motherboard if notebook is configured forIGP LVDS pass through
DDCA_CLK Output, 3.3 V logic levels2.2K Pull-up required onMXM graphics module
Serial link, can connect to VGA, DVI_A or
DVI_B. Configuration needs to be stored inMXM system information.
DDCA_DAT BI-Directional
3.3 V logic levels2.2K Pull-up required onMXM graphics module,
Serial link, can connect to VGA, DVI_Aor
DVI_B. Configuration needs to be stored inMXM system information.
DDCB_CLK Output, 3.3 V logic levels2.2K Pull-up required onMXM graphics module
Serial link, can connect to VGA, DVI_AorDVI_B. Configuration needs to be stored inMXM system information.
DDCB_DAT BI-Directional3.3 V logic levels2.2K Pull-up required onMXM graphics module
Serial link, can connect to VGA, DVI_AorDVI_B. Configuration needs to be stored inMXM system information.
LVDS_PPEN Output, 3.3 V logic levels LVDS Panel Power enable
LVDS_BLEN Output, 3.3 V logic levels LVDS Panel backlight enable
LVDS_BL_BRGHT PWM Output, 3.3 V logic
levels
LVSD Panel brightness control, duty cycle
determines output levelLVDS_UTX0-3,
LVDS_UTX0-3#
Output, 100 Ohm Diff LVDS output for dual link
IGP_UTX0-2,
IGP_UTX0-2#Input, 100 Ohm Diff LVDS input that loops back to LVDS_UTX0-
2, LVDS_UTX0-2#to provide path for LVDSwith IGP only.
LVDS_UCLK,
LVDS_UCLK#Output, 100 Ohm Diff LVDS clock for dual link
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Signal Name Input/Output Description
IGP_UCLK,IGP_UCLK#
Input, 100 Ohm Diff LVDS input that loops back toLVDS_UCLK,LVDS_UCLK#to provide path for LVDS withIGP only.
LVDS_LTX0-3,LVDS_LTX0-3#
Output, 100 Ohm Diff LVDS output for either single link or dual link
IGP_LTX0-2,
IGP_LTX0-2#Input, 100 Ohm Diff LVDS input that loops back to LVDS_LTX0-
2, LVDS_LTX0-2#to provide path for LVDSwith IGP only. Note: these pins are shared
with DVI_Bpins
LVDS_LCLK,
LVDS_LCLK#Output, 100 Ohm Diff LVDS clock for either single link or dual link
IGP_LCLK,
IGP_LCLK#
Input, 100 Ohm Diff LVDS input that loops back toLVDS_LCLK,LVDS_LCLK#to provide path for LVDS withIGP only. Note: these pins are shared withDVI_B pins
TV_Y/HDTV_Y Output, 37.5 Ohm +/- 2
Ohms
TV_OUTLuma/HDTV_OUT Luma
TV_C/HDTV_Pr Output, 37.5 Ohm +/- 2Ohms
TV_OUTChroma/HDTV_OUTChroma Red
TV_CVBS/HDTV_Pb Output, 37.5 Ohm +/- 2Ohms
TV_OUTComposite/HDTV_OUTChroma Blue
DDCC_CLK Output, 3.3 V logic levels2.2K pull-up required onmotherboard
Serial link, connect to EDID LVDS Panel andto MXM System Information ROM. This link isnot to be used for external interfaces
DDCC_DAT BI-Directional2.2K pull-up required onmotherboard
Serial link, connect to EDID LVDS Panel andto MXM System Information Rom. This link isnot to be used for external interfaces
VGA_BLU Output, 37.5 Ohm +/- 2Ohms
VGA Blue Output
VGA_RED Output, 37.5 Ohm +/- 2Ohms
VGA Red Output
VGA_GRN Output, 37.5 Ohm +/- 2Ohms
VGA Green Output
VGA_HSYNC Output, 3.3 V logic levels VGAHorizontal Sync
VGA_VSYNC Output, 3.3 V logic levels VGAVertical Sync
SMB_CLK Input, 5 V tolerant Serial link for thermal sensor on GPU.Connect to motherboard's SMBus Clocksignal.
SMB_DAT Bi-Dir, 5 V tolerant Serial link for thermal sensor on GPU.Connect to motherboard's SMBus Data signal.
THERM# Open Collector Output,active low, 5 V tolerant
Indicates a thermal alert. Connect tomotherboard's SMBus Alert signal.
PRSNT1# GND Card present detect, indicates if MXMgraphics module is present. Tie to pull-up onmotherboard. If high then MXM is notpresent. If low then MXM is present. Can beused to control IGP upgrade multiplexers
PRSNT2# GND Tied to Ground on both motherboard andMXM. Reserved for future functionality.
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Signal Name Input/Output Description
CLK_REQ# Output, active low Indicates need forPEX_REFCLK
PEX_RST# Input, active low PCI_Express reset
PEX_REFCLK,PEX_REFCLK#
Input, 100 Ohm Diff PCI Express reference clock.
PEX_TX0-15,
PEX_TX0-15#Input, 100 Ohm Diff PCI Express 16 lanes, output from
northbridge. DC blocking capacitiors need tobe placed on the motherboard.
PEX_RX0-15,
PEX_RX0-15#Output, 100 Ohm Diff PCI Express 16 lanes, input to northbridge.
DC blocking capacitors need to be placed onthe MXM graphics module.
RUNPWROK Input Indicates that all power to the MXM is withinthe specified tolerances
3V3RUN Power input 3.3 V run power
5VRUN Power input 5 V run power
2V5RUN Power input 2.5 V run power
1V8RUN Power input 1.8 V run power
PWR_SRC Power input Battery power
Power Requirements
The Mobile PCI Express Module (MXM) requires the following power to beprovided by the notebook (Table 6).
Table 6. Power Requirements
Voltage Rail Voltage Current Power Notes
3V3RUN 3.3 V +/- 5% 1.5 Amps 4.95 W 3.3 V run
5VRUN 5 V +/- 5% 0.5 Amps 2.5 W 5 V run
2V5RUN 2.5 V +/- 5% 0.5 Amps 1.25 W 2.5 V run
1V8RUN 1.8 V +/- 5% 3.5 Amps 6.3 W 1.8 V run
PWR_SRC 7.5 V*to 22 V Up to 4 Amps 8.9 W to 38.9 W Battery, store power capability inMXM system information.
*For a platform MXM input budget greater than 30 W, the minimum PWR_SRCvoltage is inputbudget/4A. For example, an input budget of 35 W, the PWR_SRCVmin = 8.75 V
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Power Throttling
The MXM will automatically detect power supply limitations and thermal limitationsof the notebook platform and will automatically throttle its clocks to stay within thepower and thermal limits. If the notebook platforms power supply and MXMthermal cooler are equal too or exceeds the MXMs power requirements, the MXMwill run at full speed. The MXM system information data contains the necessaryinformation for MXM throttling. This data is stored in either the SBIOS or theMXM system information ROM on the Notebooks motherboard.
System Requirements
Display Requirements
Panel Type
The MXM system only supports EDID Panels.
LVDS Panel Power
The motherboard shall provide power to the notebooks LVDS panel. The power isoptionally controlled by LVDS_PPEN.
VGA, TV_Out Impedance
The motherboard shall route all RGB signals and TV_OUTsignals with 37.5 Ohmsimpedance. A 75 Ohm termination resistor shall be placed at the end of the trace asclose as possible to the output filters which should be as close as possible to theoutput connectors. For notebooks configured to support TV_Out, 75 Ohmtermination resistors are required on any unused TV_Outsignals.
The MXM graphics module shall route all RGB signals and TV_OUTsignals with37.5 Ohms.
Output Filters
The motherboard is required to have output filters on all VGA output lines and onall TV output lines. These filters should be placed as close as possible to the externalconnectors.
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Other Requirements
MXM System Information ROM
The motherboard is required to store the MXM System Information in either theSBIOS or in the MXM System Information ROM. The implementation is a designdecision left to the system providers discretion. Information regarding the datastored in the MXM System Information is found in the MXM SoftwareSpecification.
For MXM System Information ROM implementations, the Motherboard is requiredto place a 256 Byte serial ROM that connects to DDCC_CLKand DDCC_DATwith adevice address of 0xAC. The ROM must be compatible to an Atmel 24C02 andoperate with 3.3 V signaling
5 V Tolerance
The motherboard shall provide back drive isolation and level shifting for all DDClines,VGA_HSYNCandVGA_VSYNC. The MXM graphics modules do not driveoutput signals at 5 V output levels and its inputs are not 5 V tolerant unlessspecifically stated.
DVI_B/IGP_LVDS Pin Sharing
The MXM must not power up DVI_Binterfaces until it has verified that thenotebook is configured for DVI_B. This information will be stored in the MXMsystem information ROM. IGP LVDS pass through and DVI_Bcan not co-exist inthe same notebook, they are mutually exclusive. When configured for IGP LVDSpass through, DVI_B_HPDmust be tied to GNDon the motherboard.
DVI Detection Circuitry
The motherboard is required to have input filters on both DVI_HPDlines. TheMXM graphics module is required to provide level shifting and clamping for thesesignals.
MXM Cooling Fan
If it is necessary for the MXM graphics module to have its own dedicated fan in thenotebooks chassis, the motherboard is required to provide power and speed controlfor the fan.
MXM GroundingThe MXM graphics module is grounded through the MXM connector and the twomounting holes. The thermal solution will be grounded through the thermalmounting holes and the landing area around the holes.
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Power Up Sequencing
There is no requirement for power up sequencing on the motherboard to supportMXM graphics modules. If power up sequencing is required, each MXM graphicsmodule is responsible for its own power up sequencing.
Additional FunctionSupport
In order to facilitate additional functions implemented with GPIOs not supportedin this specification, such as Japan-D connector or multiplexing TV out to separateconnectors for Component out and S-Video, the motherboard is required to place aserial link GPIO Expander that connects to DDCC_CLKand DDCC_DATwith adevice address of 0x4C. This address allows the motherboard designer to utilizeGPIO and ROM combination devices to reduce overall implementation costs. The
specific function of each GPIO shall be stored in the MXM System InformationStructure. The MXM System Information Structure is found in the MXM SoftwareSpecification.
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Appendix:Support Information
Configuring Notebook forMXM with IGP
Configurable Option
Use of the MXM platform will allow maximum flexibility in configuring differentgraphics capabilities all with the same motherboard. Through the use of zero Ohmstuffing resistors the manufacturer can easily decide if the notebook will beconfigured with an IGP or a MXM graphics module all with the same motherboardplatform.
Refer to Figure 25 for the notebook output topology with IGP.
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Figure 25. Notebook Output Topology with IGP
Upgradeable Option
To facilitate possible upgrades to the notebook a LVDS pass through feature wasadded to the MXM system. This pass through capability was needed since activedevices that work at LVDS data rates are very expensive. To support LVDS passthrough, the IGPs LVDS output signals will need to be routed over to the MXMconnector and connect to the IGP_LVDSsignals. An extremely low cost passivePCB will be inserted into the MXM connector that will complete the circuit pathbetween the IGPs output signals and the LVDS panel input signals. VGA andTV_outsignals are switched by an active device between the IGP and MXM. Whena MXM is installed at a later date the Mux will switch over to the MXM outputsignals and the MB_LVDSsignals will be interrupted by the MXM card. IfPRSNT#1is low then the MUX will connect the VGA and TV circuit paths to the MXM.
If DVI is supported on an IGP platform, the TMDS transmitter will reside on the
LVDS pass through card and drive TMDS outputs on DVI_Asignals. The IGPwould need to multiplex TMDS data over PCI Express lines. See Figure 26
Figure 26. Notebook Output Topology with IGP
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Notice
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NVIDIA, the NVIDIA logo and MXM Graphics Module, are trademarks of NVIDIA Corporation inthe United States and other countries. Other company and product names may be trademarks ofthe respective companies with which they are associated.
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