multi-layer ferrite chip beads - 達方電子 ferrite bead...multi-layer ferrite chip beads ordering...

1 Rev.201601

Multi-Layer Ferrite Chip Beads

ORDERING CODE

BP 1005 300 T T S 5

PRODUCT CODE

BF : For General Signal Lines

BP : For Power Lines

BH : For High Speed Signal Lines (10MHz~)

BS : For Higher Speed Signal Lines (50MHz~)

DIMENSION (L X W)

Code Dimension EIA Code Dimension EIA

0603 0.6 X 0.3 mm 0201 2012 2.0 X 1.2 mm 0805

1005 1.0 X 0.5 mm 0402 3216 3.2 X 1.6 mm 1206

1608 1.6 X 0.8 mm 0603

IMPEDANCE CODE

Code 300 301 302

Impedance (Ω) 30 300 3000

TOLERANCE CODE

T= ± 25%

PACKAGING CODE

T = Paper Tape P = Embossed Tape

TYPE CODE

S=Standard Type B=GHz Band Type

R=Low DCR U=High GHz Band Type

THICKNESS CODE(mm)

3=0.3 5=0.5 8=0.8 9=0.9 B=1.1

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Standard External Dimensions

Unit: mm/(inch)

Series L W A

(Min/Max)

0603 (0201)

0.60±0.03

(0.024 ± 0.001)

0.30 ± 0.03 (0.012 ± 0.001)

0.15 ± 0.05 (0.006 ± 0.002)

1005 (0402)

1.00 ± 0.10 (0.040 ± 0.004)

0.50 ± 0.10 (0.020 ± 0.004)

0.25 ± 0.15 (0.010 ± 0.006)

1608 (0603)

1.60 ± 0.20 (0.063 ± 0.008)

0.80 ± 0.20 (0.031 ± 0.008)

0.30 ± 0.20 (0.012 ± 0.008)

2012 (0805)

2.00 +/- 0.20 (0.079 +/- 0.008)

1.20 +/- 0.20 (0.047 +/- 0.008)

0.50 +/- 0.30 (0.020 +/- 0.012)

3216 (1206)

3.20 +/- 0.20 (0.126 +/- 0.008)

1.60 +/- 0.20 (0.063 +/- 0.008)

0.50 +/- 0.30 (0.020 +/- 0.012)

Recommended pad dimensions

Size mm (EIA) L x W (mm) a (mm) b (mm) c (mm)

0603(0201) 0.6*0.3 0.2 to 0.3 0.2 to 0.3 0.25 to 0.4

1005 (0402) 1.0*0.5 0.3 to 0.5 0.35 to 0.45 0.4 to 0.5

1608 (0603) 1.6*0.8 0.7 to 1.0 0.6 to 0.8 0.7 to 0.8

2012 (0805) 2.0*1.2 1.0 to 1.3 0.7 to 0.9 1.0 to 1.2

3216 (1206) 3.2*1.6 2.1 to 2.5 1.0 to 1.2 1.3 to 1.6

a b

c

Soldering resist SMD

Inductor

Land Pattern

3 Rev.201601

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Beads For Power Lines (BP series)

█Feature █Application The BP series can be used on high current circuits due to its low DC resistance. It can meet power lines to the maximum at DC.

1. This series is suitable for EMI suppression of the high DC current power line.

2. Various power lines of electronic equipment. 3. Mother board, tablet PC, notebook, desktop

computers and peripheral equipment. 4. DSC, DVC, LCD Television, Set Top Box. 5. Digital communication equipment.

█Part Numbers & Characteristic

● BP0603 series (EIA 0201 Size)

Type Ordering Code Impedance

(Ω)±25% Test Frequency

(MHz) DC Resistance

(Ω) MAX. Rated Current

(mA) MAX. Thickness

(mm) Qty

(kPcs)

Standard

BP0603100TTS3 10 100 0.030 1,300 0.30 ± 0.03

15

BP0603220TTS3 22 100 0.065 1,000 0.30 ± 0.03

BP0603330TTS3 33 100 0.070 1,000 0.30 ± 0.03

BP0603800TTS3 80 100 0.120 1,000 0.30 ± 0.03

BP0603121TTS3 120 100 0.150 850 0.30 ± 0.03

※OPERATING TEMPERATURE RANGE: -55 ℃ TO +85 ℃




(MHz) DC Resistance


(mA) MAX. Thickness

(mm) Qty

(kPcs)

Standard

BP1005100TTS5 10 100 0.030 2,000 0.50 ± 0.10

10

BP1005600TTS5 60 100 0.060 1,700 0.50 ± 0.10

BP1005800TTS5 80 100 0.070 1,500 0.50 ± 0.10

BP1005121TTS5 120 100 0.055 2,000 0.50 ± 0.10

BP1005181TTS5 180 100 0.090 1,200 0.50 ± 0.10

BP1005221TTS5 220 100 0.280 700 0.50 ± 0.10

BP1005331TTS5 330 100 0.280 700 0.50 ± 0.10

BP1005601TTS5 600 100 0.340 420 0.50 ± 0.10

Type Ordering Code

Impedance DC Resistance


(mA) MAX. Thickness

(mm) Qty

(kPcs) at 100MHZ (Ω)±25%

at 1GHZ (Ω)±40%

GHz Band

BP1005121TTB5 120 145 0.095 1,500 0.50 ± 0.10 10

BP1005221TTB5 220 270 0.280 700 0.50 ± 0.10





(MHz) DC Resistance


(mA) MAX. Thickness

(mm) Qty

(kPcs)

Standard

BP1608300TTS8 30 100 0.030 3,000 0.80 ± 0.20

4

BP1608330TTS8 33 100 0.025 3,000 0.80 ± 0.20

BP1608470TTS8 47 100 0.040 3,000 0.80 ± 0.20

BP1608600TTS8 60 100 0.040 3,000 0.80 ± 0.20

BP1608800TTS8 80 100 0.040 3,000 0.80 ± 0.20

BP1608101TTS8 100 100 0.040 3,000 0.80 ± 0.20

BP1608121TTS8 120 100 0.040 3,000 0.80 ± 0.20

BP1608151TTS8 150 100 0.040 3,000 0.80 ± 0.20

BP1608181TTS8 180 100 0.090 1,500 0.80 ± 0.20

BP1608221TTS8 220 100 0.050 3,000 0.80 ± 0.20

BP1608301TTS8 300 100 0.090 2,000 0.80 ± 0.20

BP1608331TTS8 330 100 0.080 1,700 0.80 ± 0.20

BP1608471TTS8 470 100 0.130 1,500 0.80 ± 0.20

BP1608601TTS8 600 100 0.200 1,000 0.80 ± 0.20

Low DCR

BP1608260TTR8 26 100 0.007 6,000 0.80 ± 0.15

4 BP1608300TTR8 30 100 0.010 5,000 0.80 ± 0.15

BP1608601TTR8 600 100 0.100 2,000 0.80 ± 0.15

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Type Ordering Code

Impedance DC Resistance


(mA) MAX. Thickness

(mm) Qty

(kPcs) at 100MHZ (Ω)±25%

at 1GHZ (typ.)

GHz Band

BP1608101TTB8 100 140 0.045 2000 0.80 ± 0.15 4

BP1608221TTB8 220 260 0.050 2000 0.80 ± 0.15



Type Ordering Code Impedance (Ω) ±25%

Test Frequency (MHz)

DC Resistance (Ω) MAX.

Rated Current (mA) MAX.

Thickness (mm)

Qty (kPcs)

Standard

BP2012070TTS9 7 100 0.008 6,000 0.90 ± 0.20

4

BP2012110TTS9 11 100 0.008 6,000 0.90 ± 0.20 BP2012220TTS9 22 100 0.008 6,000 0.90 ± 0.20 BP2012300TTS9 30 100 0.008 6,000 0.90 ± 0.20 BP2012500TTS9 50 100 0.020 4,000 0.90 ± 0.20 BP2012600TTS9 60 100 0.015 5,000 0.90 ± 0.20 BP2012800TTS9 80 100 0.010 5,000 0.90 ± 0.20 BP2012101TTS9 100 100 0.040 3,000 0.90 ± 0.20 BP2012121TTS9 120 100 0.020 4,000 0.90 ± 0.20 BP2012221TTS9 220 100 0.050 3,000 0.90 ± 0.20 BP2012301TTS9 300 100 0.040 3,000 0.90 ± 0.20 BP2012331TTS9 330 100 0.050 3,000 0.90 ± 0.20 BP2012601TTS9 600 100 0.100 2,000 0.90 ± 0.20

BP2012102TTS9 1000 100 0.300 1,000 0.90 ± 0.20

BP2012122TTS9 1200 100 0.300 1,000 0.90 ± 0.20


TYPICAL ELECTRICAL CHARACTERISTICS (IMPEDANCE VS FREQUENCY)



0

2

4

6

8

10

12

14

16

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP0603100TTS3

Freq.(MHz)

X

R

|Z|

0

5

10

15

20

25

30

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP0603220TTS3

Freq.(MHz)

X

R

|Z|

0

5

10

15

20

25

30

35

40

45

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP0603330TTS3

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

1 10 100 1,000

Imp

ed

ance

(o

hm

)BP0603800TTS3

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

160

180

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP0603121TTS3

Freq.(MHz)

X

R

|Z|

0

2

4

6

8

10

12

14

16

18

20

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1005100TTS5

Freq.(MHz)

X

R

|Z|

0

10

20

30

40

50

60

70

80

90

100

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1005600TTS5

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

160

180

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1005800TTS5

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1005121TTS5

Freq.(MHz)

X

R

|Z|

5 Rev.201601


0

50

100

150

200

250

300

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1005181TTS5

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

350

400

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1005221TTS5

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

350

400

450

500

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1005331TTS5

Freq.(MHz)

X

R

|Z|

0

100

200

300

400

500

600

700

800

900

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1005601TTS5

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

160

180

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1005121TTB5

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

1 10 100 1,000

Imp

ed

ance

(o

hm

)BP1005221TTB5

Freq.(MHz)

X

R

|Z|

0

10

20

30

40

50

60

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608300TTS8

Freq.(MHz)

X

R

|Z|

0

10

20

30

40

50

60

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608330TTS8

Freq.(MHz)

X

R

|Z|

0

10

20

30

40

50

60

70

80

90

1 10 100 1,000

Imp

ed

ance

(o

hm

)BP1608470TTS8

Freq.(MHz)

X

R

|Z|

0

10

20

30

40

50

60

70

80

90

100

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608600TTS8

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608800TTS8

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

160

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608101TTS8

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

160

180

200

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608121TTS8

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

160

180

200

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608151TTS8

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608181TTS8

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

350

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608221TTS8

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

350

400

450

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608301TTS8

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

350

400

450

500

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608331TTS8

Freq.(MHz)

X

R

|Z|

0

100

200

300

400

500

600

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608471TTS8

Freq.(MHz)

X

R

|Z|

0

100

200

300

400

500

600

700

800

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608601TTS8

Freq.(MHz)

X

R

|Z|

0

5

10

15

20

25

30

35

40

45

1 10 100 1,000

Imp

ed

an

ce (

oh

m)

BP1608260TTR8

Freq.(MHz)

X

R

|Z|

0

10

20

30

40

50

60

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608300TTR8

Freq.(MHz)

X

R

|Z|

0

100

200

300

400

500

600

700

800

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP1608601TTR8

Freq.(MHz)

X

R

|Z|

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0

20

40

60

80

100

120

140

1 10 100 1,000

Imp

ed

an

ce (

oh

m)

BP1608101TTB8

Freq.(MHz)

|X|

R|Z|

0

50

100

150

200

250

300

1 10 100 1,000

Imp

ed

an

ce (o

hm

)

BP1608221TTB8

Freq.(MHz)

X

R

|Z|

0

5

10

15

20

25

30

35

40

45

50

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012070TTS9

Freq.(MHz)

X

R

|Z|

0

10

20

30

40

50

60

70

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012110TTS9

Freq.(MHz)

XR

|Z|

0

5

10

15

20

25

30

35

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012220TTS9

Freq.(MHz)

X

R

|Z|

0

5

10

15

20

25

30

35

40

45

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012300TTS9

Freq.(MHz)

X

R

|Z|

0

10

20

30

40

50

60

70

80

90

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012500TTS9

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012600TTS9

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012800TTS9

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

160

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012101TTS9

Freq.(MHz)

X

R

|Z|

0

20

40

60

80

100

120

140

160

180

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012121TTS9

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

350

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012221TTS9

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

350

400

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012301TTS9

Freq.(MHz)

X

R

|Z|

0

50

100

150

200

250

300

350

400

450

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012331TTS9

Freq.(MHz)

X

R

|Z|

0

100

200

300

400

500

600

700

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012601TTS9

Freq.(MHz)

X

R

|Z|

0

200

400

600

800

1,000

1,200

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012102TTS9

Freq.(MHz)

X

R

|Z|

0

200

400

600

800

1,000

1,200

1,400

1 10 100 1,000

Imp

ed

ance

(o

hm

)

BP2012122TTS9

Freq.(MHz)

X

R

|Z|

7 Rev.201601

Testing Condition & Requirements

No. Item Test Condition Requirements

1 Appearance Ferrite Beads shall be visually inspected for visible evidence of defect. In accordance with specification.

2 Impedance

Measuring frequency:100±1MHz Applied Voltage: 500 mV Measuring equipment and fixture: 0603: HP4291A + 16193A 1005: HP4291B + 16193A 1608: HP4291B + 16192A 2012: HP4291A + 16092A 3216: HP4291A + 16092A

Within specified tolerance.

3 DC Resistance a. Temperature: 25±3℃

b. Relative Humidity: 45~75%RH c. Measuring equipment: HP 4338

In accordance with electrical specification.

4 Dimension Dimension shall be measured with caliper or micrometer In accordance with dimension specification.

5 Solder-ability

Preheat: 150℃,60 seconds

Solder temperature: 245±5℃

Flux: Rosin Dip time: 4±1 seconds

More than 75% of the terminal electrode part shall be covered with new solder.

6 Bending Strength

Solder the chip to test jig then apply a force in the direction shown in below. The soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.

No mechanical damage shall be observed.

7 Resistance to Soldering Heat

BF、BP_Series



Flux: Rosin Dip time: 10±1 seconds

The chip shall not be cracks. More than 75% of terminal electrode shall be covered with solder.

BH、BS_Series

Preheating temperature ：

150 to 180℃

Preheating time ：3 min.



Flux: Rosin Dip time: 10±0.5 seconds

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8 High Humidity Load

Life Test

Humidity: 90 to 95% RH.

Temperature: 40±2℃

BF、BP_Series

Testing time: 500±12 hours

No visible damage. Impedance: Within±30% of the initial value.

Humidity: 90 to 95% RH.


BH_Series Testing time: 500+24/-0 hours

Recovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber.

BF、BP_Series

Measurement: After placing for 24±2 hours min. BH_Series Measurement: After placing for 48±2 hours min.

9 Thermal Shock

Temperature:Maximum and Minimum ,kept stabilized for 30±3 minutes each Cycle:5 cycles

No visible damage

Impedance: Within±30% of the initial value.

BF、BP_Series

Measurement: After placing for 24±2 hours min.

BH_Series Measurement: After placing for 48±2 hours min.

10 High Temperature

Load

BF、BP_Series

Temperature:

85±3℃ (BP_0603 Series)

125±3℃

Testing time: 500±12 hours

No visible damage. Impedance: Within±30% of the initial value.

BH_Series


Testing time: 500+24/-0 hours

Recovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber.

BF、BP_Series

Measurement: After placing for 24±2 hours min.

BH_Series Measurement: After placing for 48±2 hours min.

9 Rev.201601

Soldering Profile for SMT Process with SnPb Solder Paste.

The rate of preheat should not exceed 4℃/sec and a target of 2℃/sec is preferred. Ceramic chip components

should be preheated to within 100 to 130 ℃ of the soldering.

● Soldering Profile for SMT Process with Lead Free Solder Paste.

The rate of preheat should not exceed 4℃/sec and a target of 2℃/sec is preferred. Ceramic chip components

should be preheated to within 100 to 130 ℃ of the soldering.

0

300

250

200

Soldering

240℃ to 260℃

5 ~ 10 sec.

Tem

pera

ture

(℃

)

Time (sec.)

Gradual Natural Cooling

Over 200℃,within 90sec

Preheating

0

300

250 200

Soldering

220℃ to 230℃

5 ~ 10 sec.

Tem

pera

ture

(℃

)

Time (sec.)

Gradual Natural Cooling

over 1 min

Over 200℃,within 40sec

Preheating

over 1 min

over 1 min over 1 min

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Packaging Specification

● Paper Tape

Material：Paper ( Dimensions in mm)

TYPE A B W P T CHIPS / REEL

0603 0.40 0.70 8 2 0.45 15,000

1005 0.62 1.12 8 2 0.60 10,000

1608 1.10 1.90 8 4 0.95 4,000

2012 1.50 2.30 8 4 0.95 4,000

● Embossed Tape

Material：Embossed ( Dimensions in mm)

TYPE A B W P T CHIPS / REEL

3216 1.88 3.50 8 4 1.27 3,000

Reel dimensions

Dimensions in mm

TYPE 4mm 8mm

A 178±2 178±2

B 21.0±0.8 21.0±0.8

C 13.0±0.8 13.0±0.8

G 5.0 10.0

N 75 75

T 8 12.5

multi-layer ferrite chip beads - 達方電子 ferrite bead...multi-layer ferrite chip beads ordering...

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