MTest Pixel Telescope – Status Update

David ChristianJanuary 8, 2008

Detector Status/Plan

• Hybrid development complete– 11 good hybrids in hand– Balance waiting for LANL PO to VTT

• Delivery Jan – Feb (less schedule risk than before)

• Module development– 4x HDI prototype received & tested (12 good

parts in hand).– Production purchase requisition is working its

way through the FNAL bureaucracy (Feb delivery expected).

Detector Status/Plan continued

• Plane/Station development:– First prototype plane being tested (one of

three pixel modules mounted so far). – SLINK pcb prototype has been received,

stuffed, & testing has begun (Nevis).• Box/Area:

– Mechanical design to be coordinated with needs of LHCb VELO (1st users) - waiting for MOU to be signed (momentarily).

Plane prototype on CMM

1st module ready to test

DAQ Status/Plan

• DAQ Hardware/Firmware (Nevis)– PCI interface ~90% complete (trigger/timing hooks

not written)– Router ~70% complete (trigger/timing, implementation

of merges, integration of DUT?) – SLINK

• Design complete.• Prototype fabricated; tests begun.• On the optimistic critical path - hoping to begin testing with a

prototype station (or at least a plane) ~ Feb 1.

Software Status/Plan• Online software (FNAL, Syracuse, UNM?)

– Core low level routines exist & have been tested.– Need to specify online, including online/offline

boundary, write & test code.• On the optimistic critical path

• Offline software (Syracuse, FNAL?, UNM?)– Data unpacking– Alignment– Tracking, integration of DUT

• On the optimistic critical path• This task has lagged. Strategic decisions to be

made in the next 2-4 weeks.

Schedule

• Focus on full telescope ASAP. February doesn’t look possible. March?

MTest Telescope

• Constructed using “BTeV pixels”• Pixel size = 50 x 400 (600)• Oriented to provide “precision-x” or

“precision-y” measurements.

Layout

• Aperture ~ 3.5cm x 3.5cm• 4 – 6 stations

Beam

x

y

x

y

Nomenclature

• Station = 2 planes & an SLINK• Plane = 3 modules mounted on a TPG

heat spreader• Module = hybrid pixel detector glued &

wire-bonded to a High Density Interconnect (Kapton flex circuit)

• Hybrid = pixel sensor bump bonded to 4 FPIX2.1 ASICs

DAQ Overview

SLINK ROUTERTwin-ax(sATA)

PCI Interface

Fiber

Trigger/timing signals

Trigger/timing signalsLINUX pc

Removable disk

DAQ

• SLINK communicates with 2x3x4=24 FPIX2.1 chips & with ROUTER.– Relays commands & responses– Collects data

• Deserialize (digital phase follower)• Time order & construct data blocks w/extended

time stamp & chip ID headers• Hierarchy of 2-way data merges

DAQ - continued• ROUTER communicates with PCI interface &

SLINKs and (optionally) DUTs– 12 sATA ports, 4 RJ45 ports– Relays commands & responses– Collects data

• Hierarchy of 2-way data merges (same logic as SLINK)

• PCI Interface communicates with ROUTER & pc– Relays commands & responses– Uses 3 CSRs & 3 ring buffers in the pc main memory

(64 MB)