msp430 hardware tools user guide

MSP430 Hardware Tools

User's Guide

Literature Number: SLAU278QMay 2009–Revised February 2014

Contents

Preface ....................................................................................................................................... 71 Get Started Now! ............................................................................................................... 10

1.1 Flash Emulation Tool (FET) Overview .................................................................................. 111.2 Kit Contents, MSP-FET430PIF .......................................................................................... 121.3 Kit Contents, eZ430-F2013 .............................................................................................. 121.4 Kit Contents, eZ430-T2012 .............................................................................................. 121.5 Kit Contents, eZ430-RF2500 ............................................................................................ 121.6 Kit Contents, eZ430-RF2500T ........................................................................................... 121.7 Kit Contents, eZ430-RF2500-SEH ...................................................................................... 121.8 Kit Contents, eZ430-Chronos-xxx ....................................................................................... 131.9 Kit Contents, MSP-FET430UIF .......................................................................................... 131.10 Kit Contents, MSP-FET430xx ............................................................................................ 131.11 Kit Contents, FET430F6137RF900 ..................................................................................... 141.12 Kit Contents, MSP-TS430xx ............................................................................................. 141.13 Kit Contents, EM430Fx1x7RF900 ....................................................................................... 161.14 Hardware Installation, MSP-FET430PIF ............................................................................... 161.15 Hardware Installation, MSP-FET430UIF ............................................................................... 171.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 ......... 171.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 ...... 171.18 Important MSP430 Documents on the Web ........................................................................... 18

2 Design Considerations for In-Circuit Programming ............................................................... 192.1 Signal Connections for In-System Programming and Debugging ................................................... 202.2 External Power ............................................................................................................. 242.3 Bootstrap Loader (BSL) .................................................................................................. 24

A Frequently Asked Questions and Known Issues ................................................................... 25A.1 Hardware FAQs ............................................................................................................ 26A.2 Known Issues .............................................................................................................. 28

B Hardware .......................................................................................................................... 29B.1 MSP-TS430D8 ............................................................................................................. 31B.2 MSP-TS430PW14 ......................................................................................................... 34B.3 MSP-TS430L092 .......................................................................................................... 37B.4 MSP-TS430L092 Active Cable .......................................................................................... 40B.5 MSP-TS430PW24 ......................................................................................................... 43B.6 MSP-TS430DW28 ......................................................................................................... 46B.7 MSP-TS430PW28 ......................................................................................................... 49B.8 MSP-TS430PW28A ....................................................................................................... 52B.9 MSP-TS430DA38 .......................................................................................................... 55B.10 MSP-TS430QFN23x0 ..................................................................................................... 58B.11 MSP-TS430RSB40 ........................................................................................................ 61B.12 MSP-TS430RHA40A ...................................................................................................... 64B.13 MSP-TS430DL48 .......................................................................................................... 67B.14 MSP-TS430RGZ48B ...................................................................................................... 70B.15 MSP-TS430RGZ48C ...................................................................................................... 73B.16 MSP-TS430PM64 ......................................................................................................... 76

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B.17 MSP-TS430PM64A ....................................................................................................... 79B.18 MSP-TS430RGC64B ..................................................................................................... 82B.19 MSP-TS430RGC64C ..................................................................................................... 85B.20 MSP-TS430RGC64USB .................................................................................................. 89B.21 MSP-TS430PN80 .......................................................................................................... 93B.22 MSP-TS430PN80A ........................................................................................................ 96B.23 MSP-TS430PN80USB .................................................................................................... 99B.24 MSP-TS430PZ100 ....................................................................................................... 103B.25 MSP-TS430PZ100A ..................................................................................................... 106B.26 MSP-TS430PZ100B ..................................................................................................... 109B.27 MSP-TS430PZ100C ..................................................................................................... 112B.28 MSP-TS430PZ5x100 .................................................................................................... 115B.29 MSP-TS430PZ100USB ................................................................................................. 118B.30 MSP-TS430PEU128 ..................................................................................................... 122B.31 EM430F5137RF900 ..................................................................................................... 125B.32 EM430F6137RF900 ..................................................................................................... 129B.33 EM430F6147RF900 ..................................................................................................... 133B.34 MSP-FET430PIF ......................................................................................................... 137B.35 MSP-FET430UIF ......................................................................................................... 139

B.35.1 MSP-FET430UIF Revision History .......................................................................... 144

C Hardware Installation Guide .............................................................................................. 145C.1 Hardware Installation .................................................................................................... 146

Document Revision History ........................................................................................................ 151

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List of Figures2-1. Signal Connections for 4-Wire JTAG Communication................................................................ 212-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,

MSP430G2xx, and MSP430F4xx Devices ............................................................................. 222-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and

MSP430F6xx Devices .................................................................................................... 23B-1. MSP-TS430D8 Target Socket Module, Schematic ................................................................... 31B-2. MSP-TS430D8 Target Socket Module, PCB .......................................................................... 32B-3. MSP-TS430PW14 Target Socket Module, Schematic ............................................................... 34B-4. MSP-TS430PW14 Target Socket Module, PCB ...................................................................... 35B-5. MSP-TS430L092 Target Socket Module, Schematic................................................................. 37B-6. MSP-TS430L092 Target Socket Module, PCB ........................................................................ 38B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic................................................. 40B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB ........................................................ 41B-9. MSP-TS430PW24 Target Socket Module, Schematic ............................................................... 43B-10. MSP-TS430PW24 Target Socket Module, PCB ...................................................................... 44B-11. MSP-TS430DW28 Target Socket Module, Schematic ............................................................... 46B-12. MSP-TS430DW28 Target Socket Module, PCB ...................................................................... 47B-13. MSP-TS430PW28 Target Socket Module, Schematic ............................................................... 49B-14. MSP-TS430PW28 Target Socket Module, PCB ...................................................................... 50B-15. MSP-TS430PW28A Target Socket Module, Schematic.............................................................. 52B-16. MSP-TS430PW28A Target Socket Module, PCB (Red) ............................................................. 53B-17. MSP-TS430DA38 Target Socket Module, Schematic ................................................................ 55B-18. MSP-TS430DA38 Target Socket Module, PCB ....................................................................... 56B-19. MSP-TS430QFN23x0 Target Socket Module, Schematic ........................................................... 58B-20. MSP-TS430QFN23x0 Target Socket Module, PCB .................................................................. 59B-21. MSP-TS430RSB40 Target Socket Module, Schematic .............................................................. 61B-22. MSP-TS430RSB40 Target Socket Module, PCB ..................................................................... 62B-23. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................ 64B-24. MSP-TS430RHA40A Target Socket Module, PCB ................................................................... 65B-25. MSP-TS430DL48 Target Socket Module, Schematic ................................................................ 67B-26. MSP-TS430DL48 Target Socket Module, PCB ....................................................................... 68B-27. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................ 70B-28. MSP-TS430RGZ48B Target Socket Module, PCB ................................................................... 71B-29. MSP-TS430RGZ48C Target Socket Module, Schematic ............................................................ 73B-30. MSP-TS430RGZ48C Target Socket Module, PCB ................................................................... 74B-31. MSP-TS430PM64 Target Socket Module, Schematic................................................................ 76B-32. MSP-TS430PM64 Target Socket Module, PCB....................................................................... 77B-33. MSP-TS430PM64A Target Socket Module, Schematic .............................................................. 79B-34. MSP-TS430PM64A Target Socket Module, PCB ..................................................................... 80B-35. MSP-TS430RGC64B Target Socket Module, Schematic ............................................................ 82B-36. MSP-TS430RGC64B Target Socket Module, PCB ................................................................... 83B-37. MSP-TS430RGC64C Target Socket Module, Schematic ............................................................ 86B-38. MSP-TS430RGC64C Target Socket Module, PCB ................................................................... 87B-39. MSP-TS430RGC64USB Target Socket Module, Schematic ........................................................ 89B-40. MSP-TS430RGC64USB Target Socket Module, PCB ............................................................... 90B-41. MSP-TS430PN80 Target Socket Module, Schematic ................................................................ 93B-42. MSP-TS430PN80 Target Socket Module, PCB ....................................................................... 94B-43. MSP-TS430PN80A Target Socket Module, Schematic .............................................................. 96

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B-44. MSP-TS430PN80A Target Socket Module, PCB ..................................................................... 97B-45. MSP-TS430PN80USB Target Socket Module, Schematic .......................................................... 99B-46. MSP-TS430PN80USB Target Socket Module, PCB ................................................................ 100B-47. MSP-TS430PZ100 Target Socket Module, Schematic ............................................................. 103B-48. MSP-TS430PZ100 Target Socket Module, PCB .................................................................... 104B-49. MSP-TS430PZ100A Target Socket Module, Schematic............................................................ 106B-50. MSP-TS430PZ100A Target Socket Module, PCB................................................................... 107B-51. MSP-TS430PZ100B Target Socket Module, Schematic............................................................ 109B-52. MSP-TS430PZ100B Target Socket Module, PCB................................................................... 110B-53. MSP-TS430PZ100C Target Socket Module, Schematic ........................................................... 112B-54. MSP-TS430PZ100C Target Socket Module, PCB .................................................................. 113B-55. MSP-TS430PZ5x100 Target Socket Module, Schematic .......................................................... 115B-56. MSP-TS430PZ5x100 Target Socket Module, PCB.................................................................. 116B-57. MSP-TS430PZ100USB Target Socket Module, Schematic........................................................ 118B-58. MSP-TS430PZ100USB Target Socket Module, PCB ............................................................... 119B-59. MSP-TS430PEU128 Target Socket Module, Schematic ........................................................... 122B-60. MSP-TS430PEU128 Target Socket Module, PCB .................................................................. 123B-61. EM430F5137RF900 Target board, Schematic....................................................................... 125B-62. EM430F5137RF900 Target board, PCB.............................................................................. 126B-63. EM430F6137RF900 Target board, Schematic....................................................................... 129B-64. EM430F6137RF900 Target board, PCB.............................................................................. 130B-65. EM430F6147RF900 Target Board, Schematic ...................................................................... 133B-66. EM430F6147RF900 Target Board, PCB ............................................................................. 134B-67. MSP-FET430PIF FET Interface Module, Schematic ................................................................ 137B-68. MSP-FET430PIF FET Interface Module, PCB ....................................................................... 138B-69. MSP-FET430UIF USB Interface, Schematic (1 of 4) ............................................................... 139B-70. MSP-FET430UIF USB Interface, Schematic (2 of 4) ............................................................... 140B-71. MSP-FET430UIF USB Interface, Schematic (3 of 4) ............................................................... 141B-72. MSP-FET430UIF USB Interface, Schematic (4 of 4) ............................................................... 142B-73. MSP-FET430UIF USB Interface, PCB ................................................................................ 143C-1. Windows XP Hardware Wizard ........................................................................................ 146C-2. Windows XP Driver Location Selection Folder....................................................................... 147C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010................................... 148C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 .................................... 149C-5. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF432 .................................... 150

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List of Tables1-1. Flash Emulation Tool (FET) Features and Device Compatibility.................................................... 111-2. Individual Kit Contents, MSP-TS430xx ................................................................................. 14B-1. MSP-TS430D8 Bill of Materials.......................................................................................... 33B-2. MSP-TS430PW14 Bill of Materials...................................................................................... 36B-3. MSP-TS430L092 Bill of Materials ....................................................................................... 39B-4. MSP-TS430L092 JP1 Settings .......................................................................................... 41B-5. MSP-TS430L092 Active Cable Bill of Materials ....................................................................... 42B-6. MSP-TS430PW24 Bill of Materials...................................................................................... 45B-7. MSP-TS430DW28 Bill of Materials...................................................................................... 48B-8. MSP-TS430PW28 Bill of Materials ..................................................................................... 51B-9. MSP-TS430PW28A Bill of Materials .................................................................................... 54B-10. MSP-TS430DA38 Bill of Materials ...................................................................................... 57B-11. MSP-TS430QFN23x0 Bill of Materials.................................................................................. 60B-12. MSP-TS430RSB40 Bill of Materials .................................................................................... 63B-13. MSP-TS430RHA40A Bill of Materials................................................................................... 66B-14. MSP-TS430DL48 Bill of Materials....................................................................................... 69B-15. MSP-TS430RGZ48B Bill of Materials................................................................................... 72B-16. MSP-TS430RGZ48C Revision History ................................................................................. 74B-17. MSP-TS430RGZ48C Bill of Materials .................................................................................. 75B-18. MSP-TS430PM64 Bill of Materials ...................................................................................... 78B-19. MSP-TS430PM64A Bill of Materials .................................................................................... 81B-20. MSP-TS430RGC64B Bill of Materials .................................................................................. 84B-21. MSP-TS430RGC64C Bill of Materials .................................................................................. 88B-22. MSP-TS430RGC64USB Bill of Materials............................................................................... 91B-23. MSP-TS430PN80 Bill of Materials ...................................................................................... 95B-24. MSP-TS430PN80A Bill of Materials .................................................................................... 98B-25. MSP-TS430PN80USB Bill of Materials ............................................................................... 101B-26. MSP-TS430PZ100 Bill of Materials.................................................................................... 105B-27. MSP-TS430PZ100A Bill of Materials.................................................................................. 108B-28. MSP-TS430PZ100B Bill of Materials.................................................................................. 111B-29. MSP-TS430PZ100C Bill of Materials.................................................................................. 114B-30. MSP-TS430PZ5x100 Bill of Materials................................................................................. 117B-31. MSP-TS430PZ100USB Bill of Materials .............................................................................. 120B-32. MSP-TS430PEU128 Bill of Materials ................................................................................. 124B-33. EM430F5137RF900 Bill of Materials .................................................................................. 127B-34. EM430F6137RF900 Bill of Materials .................................................................................. 131B-35. EM430F6147RF900 Bill of Materials .................................................................................. 135C-1. USB VIDs and PIDs Used in MSP430 Tools......................................................................... 146

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PrefaceSLAU278Q–May 2009–Revised February 2014

Read This First

About This ManualThis manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET).The FET is the program development tool for the MSP430™ ultra-low-power microcontroller. Bothavailable interface types, the parallel port interface and the USB interface, are described.

How to Use This ManualRead and follow the instructions in Chapter 1. This chapter lists the contents of the FET, providesinstructions on installing the hardware and according software drivers. After you see how quick and easy itis to use the development tools, TI recommends that you read all of this manual.

This manual describes the setup and operation of the FET but does not fully describe the MSP430™microcontrollers or the development software systems. For details of these items, see the appropriate TIdocuments listed in Section 1.18.

This manual applies to the following tools (and devices):• MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices)• MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices)• eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all

MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices)• eZ430-T2012 (three MSP430F2012 based target boards)• eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274 and CC2500 target, for

all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21,and MSP430G2x31 devices)

• eZ430-RF2500T (one MSP430F2274 and CC2500 target board including battery pack)• eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274 and CC2500 target

and solar energy harvesting module)• eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system

contained in a watch. Includes <1 GHz RF USB access point)

Stand-alone target-socket modules (without debug interface) named as MSP-TS430TSxx.

Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respectivetarget socket module MSP-TS430TSxx, where 'xx' is the same for both names. Following tools containalso the USB debug interface (MSP-FET430UIF):

• FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages) (green PCB)• FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages) (green

PCB)

These tools contain the most up-to-date materials available at the time of packaging. For the latestmaterials (data sheets, user's guides, software, application information, and so on), visit the TI MSP430web site at www.ti.com/msp430 or contact your local TI sales office.

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Information About Cautions and Warnings www.ti.com

Information About Cautions and WarningsThis document may contain cautions and warnings.

CAUTIONThis is an example of a caution statement.

A caution statement describes a situation that could potentially damage yoursoftware or equipment.

WARNINGThis is an example of a warning statement.A warning statement describes a situation that could potentiallycause harm to you.

The information in a caution or a warning is provided for your protection. Read each caution and warningcarefully.

Related Documentation From Texas InstrumentsMSP430 development tools documentation:Code Composer Studio v5.4 for MSP430 User's Guide (literature number SLAU157)

Code Composer Studio v5.x Core Edition (CCS Mediawiki)

IAR Embedded Workbench Version 3+ for MSP430(tm) User's Guide (literature number SLAU138)

IAR Embedded Workbench KickStart installer (literature number SLAC050)

eZ430-F2013 Development Tool User's Guide (literature number SLAU176)

eZ430-RF2480 Demonstration Kit User's Guide (literature number SWRU151)

eZ430-RF2500 Development Tool User's Guide (literature number SLAU227)

eZ430-RF2500-SEH Development Tool User's Guide (literature number SLAU273)

eZ430-Chronos Development Tool User's Guide (literature number SLAU292)

Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide (literature number SLAU371)

MSP-EXP430F5529 Experimenter Board User's Guide (literature number SLAU330)

MSP-EXP430F5438 Experimenter Board User's Guide (literature number SLAU263)

MSP-EXP430G2 LaunchPad Experimenter Board User's Guide (literature number SLAU318)

MSP Gang Programmer (MSP-GANG) User's Guide (literature number SLAU358)

MSP430 Gang Programmer (MSP-GANG430) User's Guide (literature number SLAU101)

MSP430 device user's guides:MSP430x1xx Family User's Guide (literature number SLAU049)

MSP430x2xx Family User's Guide (literature number SLAU144)



MSP430x5xx and MSP430x6xx Family User's Guide (literature number SLAU208)

CC430 Family User's Guide (literature number SLAU259)

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www.ti.com If You Need Assistance

MSP430FR57xx Family User's Guide (literature number SLAU272)

MSP430FR58xx and MSP430FR59xx Family User's Guide (literature number SLAU367)

If You Need AssistanceSupport for the MSP430 devices and the FET development tools is provided by the Texas InstrumentsProduct Information Center (PIC). Contact information for the PIC can be found on the TI web site atwww.ti.com/support. The Texas Instruments E2E Community support forums for the MSP430 provideopen interaction with peer engineers, TI engineers, and other experts. Additional device-specificinformation can be found on the MSP430 web site.

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Chapter 1SLAU278Q–May 2009–Revised February 2014

Get Started Now!

This chapter lists the contents of the FET and provides instruction on installing the hardware.

Topic ........................................................................................................................... Page

1.1 Flash Emulation Tool (FET) Overview .................................................................. 111.2 Kit Contents, MSP-FET430PIF ............................................................................. 121.3 Kit Contents, eZ430-F2013 .................................................................................. 121.4 Kit Contents, eZ430-T2012 .................................................................................. 121.5 Kit Contents, eZ430-RF2500 ................................................................................ 121.6 Kit Contents, eZ430-RF2500T .............................................................................. 121.7 Kit Contents, eZ430-RF2500-SEH ........................................................................ 121.8 Kit Contents, eZ430-Chronos-xxx ........................................................................ 131.9 Kit Contents, MSP-FET430UIF ............................................................................. 131.10 Kit Contents, MSP-FET430xx .............................................................................. 131.11 Kit Contents, FET430F6137RF900 ........................................................................ 141.12 Kit Contents, MSP-TS430xx ................................................................................ 141.13 Kit Contents, EM430Fx1x7RF900 ......................................................................... 161.14 Hardware Installation, MSP-FET430PIF ................................................................ 161.15 Hardware Installation, MSP-FET430UIF ................................................................ 171.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-

EXP430F5529 .................................................................................................... 171.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900,

EM430Fx137RF900 ............................................................................................ 171.18 Important MSP430 Documents on the Web ........................................................... 18

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www.ti.com Flash Emulation Tool (FET) Overview

1.1 Flash Emulation Tool (FET) OverviewTI offers several flash emulation tools according to different requirements.

Table 1-1. Flash Emulation Tool (FET) Features and Device Compatibility (1)

eZ43

0-F2

013

eZ43

0-R

F250

0

eZ43

0-R

F248

0

eZ43

0-R

F256

0

MSP

-WD

Sxx

Met

awat

ch

eZ43

0-C

hron

os

MSP

-FET

430P

IF

MSP

-FET

430U

IF

Laun

chPa

d(M

SP-E

XP43

0G2)

MSP

-EXP

430F

R57

39

MSP

-EXP

430F

5529

Supports all programmable MSP430 andCC430 devices (F1xx, F2xx, F4xx, F5xx, x xF6xx, G2xx, L092, FR57xx, FR59xx,MSP430TCH5E)Supports only F20xx, G2x01, G2x11, xG2x21, G2x31Supports MSP430F20xx, F21x2, F22xx, xG2x01, G2x11, G2x21, G2x31, G2x53Supports MSP430F20xx, F21x2, F22xx, x xG2x01, G2x11, G2x21, G2x31Supports F5438, F5438A xSupports BT5190, F5438A xSupports only F552x xSupports FR57xx, F5638, F6638 xSupports only CC430F613x xAllows fuse blow xAdjustable target supply voltage xFixed 2.8-V target supply voltage xFixed 3.6-V target supply voltage x x x x x x x x x4-wire JTAG x x2-wire JTAG (2) x x x x x x x x x xApplication UART x x x x x x x xSupported by CCS for Windows x x x x x x x x x x xSupported by CCS for Linux xSupported by IAR x x x x x x x x x x x

(1) The MSP-FET430PIF is for legacy device support only. This emulation tool will not support any new devices released after 2011.(2) The 2-wire JTAG debug interface is also referred to as Spy-Bi-Wire (SBW) interface.

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Kit Contents, MSP-FET430PIF www.ti.com

1.2 Kit Contents, MSP-FET430PIF• One READ ME FIRST document• One MSP-FET430PIF interface module• One 25-conductor cable• One 14-conductor cable

NOTE: This part is obsolete and is not recommended to use in new design.

1.3 Kit Contents, eZ430-F2013• One QUICK START GUIDE document• One eZ430-F2013 development tool including one MSP430F2013 target board

1.4 Kit Contents, eZ430-T2012• Three MSP430F2012-based target boards

1.5 Kit Contents, eZ430-RF2500• One QUICK START GUIDE document• One eZ430-RF2500 CD-ROM• One eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)

1.6 Kit Contents, eZ430-RF2500T• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)

1.7 Kit Contents, eZ430-RF2500-SEH• One MSP430 development tool CD containing documentation and development software• One eZ430-RF USB debugging interface• Two eZ430-RF2500T wireless target boards• One SEH-01 solar energy harvester board• One AAA battery pack with expansion board (batteries included)



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www.ti.com Kit Contents, eZ430-Chronos-xxx

1.8 Kit Contents, eZ430-Chronos-xxx'433, '868, '915• One QUICK START GUIDE document• One ez430-Chronos emulator• One screwdriver• Two spare screws

eZ430-Chronos-433:– One 433-MHz eZ430-Chronos watch (battery included)– One 433-MHz eZ430-Chronos access pointeZ430-Chronos-868:– One 868-MHz eZ430-Chronos watch (battery included)– One 868-MHz eZ430-Chronos access pointeZ430-Chronos-915:– One 915-MHz eZ430-Chronos watch (battery included)– One 915-MHz eZ430-Chronos access point

1.9 Kit Contents, MSP-FET430UIF• One READ ME FIRST document• One MSP-FET430UIF interface module• One USB cable• One 14-conductor cable

1.10 Kit Contents, MSP-FET430xx• One READ ME FIRST document• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end

of the case, and a 2×7-pin male connector on the other end of the case.• One USB cable• One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz.• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• One 14-Pin JTAG conductor cable• One small box containing two MSP430 device samples (See table for Sample Type)• One target socket module. To determine the devices used for each board and a summary of the board,

see Table 1-2. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xxkit; for example, the MSP-FET430U28A kit contains the MSP-TS430PW28A board.

Refer to the device data sheets for device specifications. Device errata can be found in the respectivedevice product folder on the web provided as a PDF document. Depending on the device, errata may alsobe found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.



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Kit Contents, FET430F6137RF900 www.ti.com

1.11 Kit Contents, FET430F6137RF900• One READ ME FIRST document• One legal notice• One MSP-FET430UIF interface module• Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137

device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB.• Two CC430EM battery packs• Four AAA batteries• Two 868-MHz or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2x4-pin headers• One USB cable• One 14-pin JTAG conductor cable

1.12 Kit Contents, MSP-TS430xx• One READ ME FIRST document• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)• One target socket module• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• MSP430 Device samples (see Table 1-2 for sample type)

Table 1-2. Individual Kit Contents, MSP-TS430xxPart Number Socket Type Supported Devices Included Devices Headers and Comment

MSP-TS430D8 8-pin D MSP430G2210, 1 x MSP430G2210 and Two PCB 1×4-pin headers (two male and(green PCB) (TSSOP ZIF) MSP430G2230 1 x MSP430G2230 two female)

MSP430F20xx,MSP430G2x01,MSP-TS430PW14 14-pin PW Four PCB 1×7-pin headers (two male andMSP430G2x11, 2 x MSP430F2013IPW(green PCB) (TSSOP ZIF) two female)MSP430G2x21,MSP430G2x31

Four PCB 1×7-pin headers (two male andtwo female). A "Micro-MaTch" 10-pinfemale connector is also present on theMSP-TS430L092 14-pin PW MSP-TS430L092 2 x MSP430L092IPW PCB which connects the kit with an(green PCB) (TSSOP ZIF) 'Active Cable' PCB; this 'Active Cable'PCB is connected by 14-pin JTAG cablewith the FET430UIF

MSP-TS430PW24 24-pin PW Four PCB 1×12-pin headers (two maleMSP430AFE2xx 2 x MSP430AFE253IPW(green PCB) (TSSOP ZIF) and two female)

MSP430F11x1,MSP430F11x2,MSP430F12x,MSP-TS430DW28 28-pin DW Four PCB 1×12-pin headers (two maleMSP430F12x2, 2 x MSP430F123IDW(green PCB) (SSOP ZIF) and two female)MSP430F21xx

Supports devices in 20- and28-pin DA packages

MSP430F11x1,MSP430F11x2,MSP-TS430PW28 28-pin PW Four PCB 1×12-pin headers (two maleMSP430F12x, 2 x MSP430F2132IPW(green PCB) (TSSOP ZIF) and two female)MSP430F12x2,MSP430F21xx

MSP430F20xx,MSP430G2xxx in 14-, 20-,MSP-TS430PW28A 28-pin PW Four PCB 1×12-pin headers (two maleand 28-pin PW packages, 2 x MSP430G2452IPW20(red PCB) (TSSOP ZIF) and two female)MSP430TCH5E in PW

package

MSP430F22xx, 2 x MSP430F2274IDAMSP-TS430DA38 38-pin DA Four PCB 1×19-pin headers (two maleMSP430G2x44, 2 x MSP430G2744IDA(green PCB) (TSSOP ZIF) and two female)MSP430G2x55 2 x MSP430G2955IDA

MSP-TS430QFN23x0 40-pin RHA Eight PCB 1×10-pin headers (four maleMSP430F23x0 2 x MSP430F2370IRHA(green PCB) (QFN ZIF) and four female)



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www.ti.com Kit Contents, MSP-TS430xx

Table 1-2. Individual Kit Contents, MSP-TS430xx (continued)Part Number Socket Type Supported Devices Included Devices Headers and Comment

MSP-TS430RSB40 40-pin RSB MSP430F51x1, Eight PCB 1×10-pin headers (four male2 x MSP430F5172IRSB(green PCB) (QFN ZIF) MSP430F51x2 and four female)

MSP-TS430RHA40A 40-pin RHA MSP430FR572x, Eight PCB 1×10-pin headers (four male2 x MSP430FR5739IRHA(red PCB) (QFN ZIF) MSP430FR573x and four female)

MSP-TS430DL48 48-pin DL Four PCB 2×12-pin headers (two maleMSP430F42x0 2 x MSP430F4270IDL(green PCB) (TSSOP ZIF) and two female)

MSP-TS430RGZ48B 48-pin RGZ Eight PCB 1×12-pin headers (four maleMSP430F534x 2 x MSP430F5342IRGZ(blue PCB) (QFN ZIF) and four female)

MSP-TS430RGZ48C 48-pin RGZ MSP430FR58xx and Eight PCB 1×12-pin headers (four male2 x MSP430FR5969IRGZ(black PCB) (QFN ZIF) MSP430FR59xx and four female)

MSP430F13x,MSP430F14x,

MSP430F14x1,MSP430F15x,MSP430F16x,

MSP430F16x1,MSP430F23x, TS Kit:MSP430F24x, 2 x MSP430F2618IPM;MSP-TS430PM64 64-pin PM Eight PCB 1×16-pin headers (four maleMSP430F24xx, FET Kit:(green PCB) (QFP ZIF) and four female)MSP430F261x, 2 x MSP430F417IPM andMSP430F41x, 2 x MSP430F169IPMMSP430F42x,

MSP430F42xA,MSP430FE42x,

MSP430FE42xA,MSP430FE42x2,MSP430FW42x

MSP-TS430PM64A 64-pin PM Eight PCB 1×16-pin headers (four maleMSP430F41x2 2 x MSP430F4152IPM(red PCB) (QFP ZIF) and four female)

MSP-TS430RGC64B 64-pin RGC Eight PCB 1×16-pin headers (four maleMSP430F530x 2 x MSP430F5310IRGC(blue PCB) (QFN ZIF) and four female)

MSP430F522x,MSP430F521x ,MSP-TS430RGC64C 64-pin RGC Eight PCB 1×16-pin headers (four maleMSP430F523x, 2 x MSP430F5229IRGC(black PCB) (QFN ZIF) and four female)MSP430F524x,MSP430F525x

MSP430F550x,MSP-TS430RGC64USB 64-pin RGC 2 x MSP430F5510IRGC or Eight PCB 1×16-pin headers (four maleMSP430F551x,(green PCB) (QFN ZIF) 2 x MSP430F5528IRGC and four female)MSP430F552x

MSP430F241x,MSP430F261x,MSP430F43x,MSP-TS430PN80 80-pin PN Eight PCB 1×20-pin headers (four maleMSP430F43x1, 2 x MSP430FG439IPN(green PCB) (QFP ZIF) and four female)MSP430FG43x,MSP430F47x,MSP430FG47x

MSP-TS430PN80A 80-pin PN Eight PCB 1×20-pin headers (four maleMSP430F532x 2 x MSP430F5329IPN(red PCB) (QFP ZIF) and four female)

MSP-TS430PN80USB 80-pin PN MSP430F552x, Eight PCB 1×20-pin headers (four male2 x MSP430F5529IPN(green PCB) (QFP ZIF) MSP430F551x and four female)

MSP430F43x,MSP430F43x1,MSP-TS430PZ100 100-pin PZ Eight PCB 1×25-pin headers (four maleMSP430F44x, 2 x MSP430FG4619IPZ(green PCB) (QFP ZIF) and four female)MSP430FG461x, MSP430

F47xx

MSP-TS430PZ100A 100-pin PZ Eight PCB 1×25-pin headers (four maleMSP430F471xx 2 x MSP430F47197IPZ(red PCB) (QFP ZIF) and four female)

MSP-TS430PZ100B 100-pin PZ Eight PCB 1×25-pin headers (four maleMSP430F67xx 2 x MSP430F6733IPZ(blue PCB) (QFP ZIF) and four female)

MSP430F645x,MSP-TS430PZ100C 100-pin PZ MSP430F643x, Eight PCB 1×25-pin headers (four male2 x MSP430F6438IPZ(black PCB) (QFP ZIF) MSP430F535x, and four female)

MSP430F533x

MSP430F543x,MSP-TS430PZ5x100 100-pin PZ Eight PCB 1×25-pin headers (four maleMSP430BT5190, 2 x MSP430F5438IPZ(green PCB) (QFP ZIF) and four female)MSP430SL5438A



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Kit Contents, EM430Fx1x7RF900 www.ti.com

Table 1-2. Individual Kit Contents, MSP-TS430xx (continued)Part Number Socket Type Supported Devices Included Devices Headers and Comment

MSP430F665x,MSP-TS430PZ100USB 100-pin PZ Eight PCB 1×25-pin headers (four maleMSP430F663x, 2 x MSP430F6638IPZ(green PCB) (QFP ZIF) and four female)MSP430F563x

MSP430F677x,MSP430F676x, Four PCB 1x26-pin headers (two maleMSP-TS430PEU128 128-pin PEU MSP430F674x, 2 x MSP430F67791IPEU and two female) and four PCB 1x38-pin(green PCB) (QFP ZIF) MSP430F677x1, headers (two male and two female)MSP430F676x1,MSP430F674x1

See the device data sheets for device specifications. Device errata can be found in the respective deviceproduct folder on the web provided as a PDF document. Depending on the device, errata may also befound in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.

1.13 Kit Contents, EM430Fx1x7RF900• One READ ME FIRST document• One legal notice• Two target socket module

MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on whichis soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also presenton the PCBMSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on whichis soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also presenton the PCBMSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on whichis soldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also presenton the PCB

• Two CC430EM battery packs• Four AAA batteries• Two 868- or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2×4-pin headers

1.14 Hardware Installation, MSP-FET430PIFFollow these steps to install the hardware for the MSP-FET430PIF tools:1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The

necessary driver for accessing the PC parallel port is installed automatically during CCS or IAREmbedded Workbench installation. Note that a restart is required after the CCS or IAR EmbeddedWorkbench installation for the driver to become active.

2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, suchas an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B.



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www.ti.com Hardware Installation, MSP-FET430UIF

1.15 Hardware Installation, MSP-FET430UIFFollow these steps to install the hardware for the MSP-FET430UIF tool:1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE

installation installs drivers automatically.2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET

should be recognized, as the USB device driver is installed automatically. If the driver has not beeninstalled yet, the install wizard starts. Follow the prompts and point the wizard to the driver files.The default location for CCS is c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, depending of firmware version ofthe tool.The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART or <Installation Root>\Embedded Workbench x.x\430\drivers\<Win_OS>, depending of firmware version of the tool.The USB driver is installed automatically. Detailed driver installation instructions can be found inAppendix C.

3. After connecting to a PC, the USB FET performs a self-test during which the red LED may flash forapproximately two seconds. If the self-test passes successfully, the green LED stays on.

4. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as anMSP-TS430xxx target socket module.

5. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with acircular indentation on the top surface) aligns with the "1" mark on the PCB.

6. Compared to the parallel-port debug interface, the USB FET has additional features including JTAGsecurity fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 60 mA.

1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529To install eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools followinstructions 1 and 2 of Section 1.15

1.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900,EM430Fx137RF900Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:1. Follow instructions 1 and 2 of Section 1.152. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC.

Use the 14-conductor cable to connect the FET interface module to the supplied target socket module.3. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a

circular indentation on the top surface) aligns with the "1" mark on the PCB.4. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrations

of the target socket modules and their parts are found in Appendix B.



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Important MSP430 Documents on the Web www.ti.com

1.18 Important MSP430 Documents on the WebThe primary sources of MSP430 information are the device-specific data sheet and user's guide. TheMSP430 web site (www.ti.com/msp430) contains the most recent version of these documents.

PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and thelibrarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) isavailable, and the Texas Instruments E2E Community support forums for the MSP430 and CodeComposer Studio v5 provide additional help besides the product help and Welcome page.

PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker,and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, thelatest information) are available in HTML format in the same directories. A IAR specific Wiki Page is alsoavailable.



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http://www.tiexpressdsp.com/index.php/Category:Code_Composer_Studio_v5

http://e2e.ti.com/

http://processors.wiki.ti.com/index.php/IAR_Embedded_Workbench_Kickstart_for_TI_MSP430_Release_Notes


Chapter 2SLAU278Q–May 2009–Revised February 2014

Design Considerations for In-Circuit Programming

This chapter presents signal requirements for in-circuit programming of the MSP430.

Topic ........................................................................................................................... Page

2.1 Signal Connections for In-System Programming and Debugging ............................ 202.2 External Power .................................................................................................. 242.3 Bootstrap Loader (BSL) ..................................................................................... 24

19SLAU278Q–May 2009–Revised February 2014 Design Considerations for In-Circuit ProgrammingSubmit Documentation Feedback



Signal Connections for In-System Programming and Debugging www.ti.com

2.1 Signal Connections for In-System Programming and DebuggingMSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-FET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. Inaddition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers,thus providing an easy way to program prototype boards, if desired.

Figure 2-1 shows the connections between the 14-pin FET interface module connector and the targetdevice required to support in-system programming and debugging for 4-wire JTAG communication.Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode issupported on most MSP430 devices, except devices with low pin counts (for example, MSP430G2230).The 2-wire JTAG mode is available on selected devices only. See the Code Composer Studio for MSP430User's Guide (SLAU157) or IAR Embedded Workbench Version 3+ for MSP430 User's Guide (SLAU138)for information on which interface method can be used on which device.

The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board(through pin 2). In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCC-sense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense featuresenses the local VCC present on the target board (that is, a battery or other local power supply) andadjusts the output signals accordingly. If the target board is to be powered by a local VCC, then theconnection to pin 4 on the JTAG should be made, and not the connection to pin 2. This uses the VCC-sense feature and prevents any contention that might occur if the local on-board VCC were connected tothe VCC supplied from the FET interface module, MSP-GANG or the MSP-GANG430. If the VCC-sensefeature is not necessary (that is, if the target board is to be powered from the FET interface module, MSP-GANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAG header, and no connectionis made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplyingVCC to the target board. If this flexibility is not required, the desired VCC connections may be hard-wired toeliminate the jumper block. Pins 2 and 4 must not be connected at the same time.

Note that in 4-wire JTAG communication mode (see Figure 2-1), the connection of the target RST signalto the JTAG connector is optional when using devices that support only 4-wire JTAG communicationmode. However, when using devices that support 2-wire JTAG communication mode in 4-wire JTAGmode, the RST connection must be made. The MSP430 development tools and device programmersperform a target reset by issuing a JTAG command to gain control over the device. However, if this isunsuccessful, the RST signal of the JTAG connector may be used by the development tool or deviceprogrammer as an additional way to assert a device reset.

20 Design Considerations for In-Circuit Programming SLAU278Q–May 2009–Revised February 2014Submit Documentation Feedback


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1

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12

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TDO/TDI

TDI/VPP

TMS

TCK

GND

TEST/VPP

JTAG

VCC TOOL

VCC TARGET

J1 (see Note A)

J2 (see Note A)

VCC

R1

47 k(see Note B)

W

C210 µF

C30.1 µF

V /AV /DVCCCC CC

RST/NMI

TDO/TDI

TDI/VPP

TMS

TCK

TEST/VPP (see Note C)

V /AV /DVSS SS SS

MSP430Fxxx

C110 nF/2.2 nF

(see Notes B and E)

RST (see Note D)

Important to connect

www.ti.com Signal Connections for In-System Programming and Debugging

A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,make connection J2.

B The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 familyuser's guide for the recommended configuration.

C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific datasheet to determine if this pin is available.

D The connection to the JTAG connector RST pin is optional when using a device that supports only 4-wire JTAGcommunication mode, and it is not required for device programming or debugging. However, this connection isrequired when using a device that supports 2-wire JTAG communication mode in 4-wire JTAG mode.

E When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 shouldnot exceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET).

Figure 2-1. Signal Connections for 4-Wire JTAG Communication



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TEST/SBWTCK

MSP430Fxxx

RST/NMI/SBWTDIOTDO/TDI

TCK

GND

TEST/VPP

JTAG

VCC TOOL

VCC TARGET

330Ω

R2

J1 (see Note A)

J2 (see Note A)


V /AV /DVCCCC CC

V /AV /DVSS SS SS

R147 kΩ

See Note B

C12.2 nF

See Note B

VCC

C210 µF

C30.1 µF

Signal Connections for In-System Programming and Debugging www.ti.com

A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,make connection J2.

B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device duringJTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection withthe device. The upper limit for C1 is 2.2 nF when using current TI tools.

C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by theTEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω)and do not connect TEST/VPP to TEST/SBWTCK.

Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,MSP430G2xx, and MSP430F4xx Devices



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RST/NMI/SBWTDIOTDO/TDI

TCK

GND

JTAG

R147 kΩ

See Note B

VCC TOOL

VCC TARGET

C12.2 nF

See Note B

J1 (see Note A)

J2 (see Note A)


V /AV /DVCCCC CC

V /AV /DVSS SS SS

VCC

C210 µF

C30.1 µF

www.ti.com Signal Connections for In-System Programming and Debugging

A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from thedebug or programming adapter.

B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device duringJTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection withthe device. The upper limit for C1 is 2.2 nF when using current TI tools.

Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx andMSP430F6xx Devices



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External Power www.ti.com

2.2 External PowerThe MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Notethat the target should not consume more than 60 mA, even as a peak current, as it may violate the USBspecification. For example, if the target board has a capacitor on VCC more than 10 µF, it may causeinrush current during capacitor charging that may exceed 60 mA. In this case, the current should belimited by the design of the target board, or an external power supply should be used.

The VCC for the target can be selected between 1.8 V and 3.6 V in steps of 0.1 V. Alternatively, the targetcan be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pinconnector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically.Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected;not both at the same time.

When a target socket module is powered from an external supply, the external supply powers the deviceon the target socket module and any user circuitry connected to the target socket module, and the FETinterface module continues to be powered from the PC through the parallel port. If the externally suppliedvoltage differs from that of the FET interface module, the target socket module must be modified so thatthe externally supplied voltage is routed to the FET interface module (so that it may adjust its outputvoltage levels accordingly). See the target socket module schematics in Appendix B.

The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirementof the MSP430, a standalone FET does not exceed the available current. However, if additional circuitry isadded to the tool, this current limit could be exceeded. In this case, external power can be supplied to thetool through connections provided on the target socket modules. See the schematics and pictorials of thetarget socket modules in Appendix B to locate the external power connectors. Note that the MSP-FET430PIF is not recommended for new design.

2.3 Bootstrap Loader (BSL)The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices,these pins are shared with the device port pins, and this sharing of pins can complicate a design (orsharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devicescontain a program (a "bootstrap loader") that permits the flash memory to be erased and programmedusing a reduced set of signals. The MSP430 Programming Via the Bootstrap Loader User's Guide(SLAU319) describes this interface. See the MSP430 web site for the application reports and a list ofMSP430 BSL tool developers.

TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggestsproviding access to these signals by, for example, a header).

See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins.



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Appendix ASLAU278Q–May 2009–Revised February 2014

Frequently Asked Questions and Known Issues

This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.

Topic ........................................................................................................................... Page

A.1 Hardware FAQs ................................................................................................. 26A.2 Known Issues ................................................................................................... 28

25SLAU278Q–May 2009–Revised February 2014 Frequently Asked Questions and Known IssuesSubmit Documentation Feedback



Hardware FAQs www.ti.com

A.1 Hardware FAQs1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information

Due to the large capacitive coupling introduced by the device socket between the adjacent signalsXIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb theLFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire(2-wire) JTAG configuration and only to the period while a debug session is active.Workarounds:• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG

configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly.• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down

menu (at top of Debug View). This prevents the debugger from accessing the MSP430 devicewhile the application is running. Note that, in this mode, a manual halt is required to see if abreakpoint was hit. See the IDE documentation for more information on this feature.

• Use an external clock source to drive XIN directly.2. With current interface hardware and software, there is a weakness when adapting target boards

that are powered externally. This leads to an accidental fuse check in the MSP430 device. This isvalid for PIF and UIF but is seen most often on the UIF. A solution is being developed.Workarounds:• Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the

RST line, which also resets the device internal fuse logic.• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down

menu. This prevents the debugger from accessing the MCU while the application is running. Notethat in this mode, a manual halt is required to see if a breakpoint was hit. See the IDEdocumentation for more information on this feature.

• Use an external clock source to drive XIN directly.3. The 14-conductor cable that connects the FET interface module and the target socket module must

not exceed 8 inches (20 centimeters) in length.4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the

USB FET.5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket

module. See the schematic of the target socket module to populate the capacitor according to the datasheet of the device.

6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed onthe target socket module. See the schematic of the target socket module to populate the capacitoraccording to the data sheet of the device.

7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module.For MSP430 devices that contain user-selectable loading capacitors, see the device and crystal datasheets for the value of capacitance.

8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger orC-SPY (as any required clocking and timing is derived from the internal DCO and FLL).

9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.For C-SPY: "Release JTAG On Go" must be selected.

10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider usingan MSP430 device that is a "superset" of the smaller device. A very powerful feature of theMSP430 is that the family members are code and architecturally compatible, so code developed onone device (for example, one without shared JTAG and port pins) ports effortlessly to another(assuming an equivalent set of peripherals).

26 Frequently Asked Questions and Known Issues SLAU278Q–May 2009–Revised February 2014Submit Documentation Feedback


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www.ti.com Hardware FAQs

11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.Customers should erase the information memory before its first use. Main memory of packageddevices is blank when the device is delivered from TI.

12. The device current is higher then expected. The device current measurement may not be accuratewith the debugger connected to the device. For accurate measurement, disconnect the debugger.Additionally some unused pins of the device should be terminated. See the Connection of Unused Pinstable in the device's family user's guide.

13. The following ZIF sockets are used in the FET tools and target socket modules:• 8-pin device (D package): Yamaichi IC369-0082• 14-pin device (PW package): Enplas OTS-14-065-01• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02• 28-pin device (DW package): Wells-CTI 652 D028• 28-pin device (PW package): Enplas OTS-28-0.65-01• 38-pin device (DA package): Yamaichi IC189-0382-037• 40-pin device (RHA package): Enplas QFN-40B-0.5-01• 40-pin device (RSB package): Enplas QFN-40B-0.4• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001• 48-pin device (DL package): Yamaichi IC51-0482-1163• 64-pin device (PM package): Yamaichi IC51-0644-807• 64-pin device (RGC package): Yamaichi QFN11T064-006• 80-pin device (PN package): Yamaichi IC201-0804-014• 100-pin device (PZ package): Yamaichi IC201-1004-008• 128-pin device (PEU package): Yamaichi IC500-1284-009PEnplas: www.enplas.comWells-CTI: www.wellscti.comYamaichi: www.yamaichi.us

27SLAU278Q–May 2009–Revised February 2014 Frequently Asked Questions and Known IssuesSubmit Documentation Feedback


http://www.ti.com

http://www.enplas.com

http://www.wellscti.com/

http://www.yamaichi.us/


Known Issues www.ti.com

A.2 Known Issues

MSP-FET430UIF Current detection algorithm of the UIF firmware

Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequentlyswitching on and off the target power supply. This power switching puts some MSP430devices such as the MSP430F5438 in a state that requires a power cycle to return thedevice to JTAG control.

A side issue is that if the UIF firmware has entered this switch on and switch off loop, itis not possible to turn off the power supply to the target by calling MSP430_VCC(0). Apower cycle is required to remove the device from this state.

Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version2.04.00.003 and higher do not show this problem. Update the software development toolto this version or higher to update the MSP-FET430UIF firmware.

MSP-FET430PIF Some PCs do not supply 5 V through the parallel port

Problem Description Device identification problems with modern PCs, because the parallel port often does notdeliver 5 V as was common with earlier hardware.1. When connected to a laptop, the test signal is clamped to 2.5 V.2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter

through pin 4 (sense).

Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to theVCC pads of the interface. The jumper on a the target socket must be switched toexternal power.

28 Frequently Asked Questions and Known Issues SLAU278Q–May 2009–Revised February 2014Submit Documentation Feedback


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Appendix BSLAU278Q–May 2009–Revised February 2014

Hardware

This appendix contains information relating to the FET hardware, including schematics, PCB pictorials,and bills of materials (BOMs). All other tools, such as the eZ430 series, are described in separate product-specific user's guides.

29SLAU278Q–May 2009–Revised February 2014 HardwareSubmit Documentation Feedback



Appendix B www.ti.com

Topic ........................................................................................................................... Page

B.1 MSP-TS430D8 ................................................................................................... 31B.2 MSP-TS430PW14 ............................................................................................... 34B.3 MSP-TS430L092 ................................................................................................ 37B.4 MSP-TS430L092 Active Cable ............................................................................. 40B.5 MSP-TS430PW24 ............................................................................................... 43B.6 MSP-TS430DW28 ............................................................................................... 46B.7 MSP-TS430PW28 ............................................................................................... 49B.8 MSP-TS430PW28A ............................................................................................. 52B.9 MSP-TS430DA38 ............................................................................................... 55B.10 MSP-TS430QFN23x0 .......................................................................................... 58B.11 MSP-TS430RSB40 ............................................................................................. 61B.12 MSP-TS430RHA40A ........................................................................................... 64B.13 MSP-TS430DL48 ................................................................................................ 67B.14 MSP-TS430RGZ48B ........................................................................................... 70B.15 MSP-TS430RGZ48C ........................................................................................... 73B.16 MSP-TS430PM64 ............................................................................................... 76B.17 MSP-TS430PM64A ............................................................................................. 79B.18 MSP-TS430RGC64B ........................................................................................... 82B.19 MSP-TS430RGC64C ........................................................................................... 85B.20 MSP-TS430RGC64USB ....................................................................................... 89B.21 MSP-TS430PN80 ............................................................................................... 93B.22 MSP-TS430PN80A ............................................................................................. 96B.23 MSP-TS430PN80USB ......................................................................................... 99B.24 MSP-TS430PZ100 ............................................................................................ 103B.25 MSP-TS430PZ100A .......................................................................................... 106B.26 MSP-TS430PZ100B .......................................................................................... 109B.27 MSP-TS430PZ100C .......................................................................................... 112B.28 MSP-TS430PZ5x100 ......................................................................................... 115B.29 MSP-TS430PZ100USB ...................................................................................... 118B.30 MSP-TS430PEU128 .......................................................................................... 122B.31 EM430F5137RF900 ........................................................................................... 125B.32 EM430F6137RF900 ........................................................................................... 129B.33 EM430F6147RF900 ........................................................................................... 133B.34 MSP-FET430PIF ............................................................................................... 137B.35 MSP-FET430UIF ............................................................................................... 139

30 Hardware SLAU278Q–May 2009–Revised February 2014Submit Documentation Feedback


http://www.ti.com


GN

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www.ti.com MSP-TS430D8

B.1 MSP-TS430D8

Figure B-1. MSP-TS430D8 Target Socket Module, Schematic



http://www.ti.com


Connector J5

External power connector

Jumper JP3 to "ext"Jumper JP2

Open to disconnect LED

D1 LED connected to P1.2

Orient Pin 1 of MSP430 device

14 pin connector for debugging only

in Spy-Bi-Wire mode (4 Wire JTAG

not available)

MSP-TS430D8 www.ti.com

Figure B-2. MSP-TS430D8 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430D8

Table B-1. MSP-TS430D8 Bill of MaterialsNo. perPosition Ref Des Description DigiKey Part No. CommentBoard

1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-23 SBW 1 10-pin connector, male, TH HRP10H-ND4 J3 1 3-pin header, male, TH SAM1035-03-ND5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 2926 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND7 R5 1 47K, 0805 541-47000ATR-ND8 C5 1 100nF, CSMD0805 311-1245-2-ND9 R2, R3 2 330R, 0805 541-330ATR-ND

DNP: headers enclosed with kit.10 J1, J2 2 4-pin header, TH SAM1029-04-ND Keep vias free of solder.DNP: receptacles enclosed with10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND kit.

11 U1 1 SO8 Socket: Type IC369-0082 Manuf.: Yamaichi12 D1 1 red, LED 0603

"DNP: enclosed with kit. Is13 MSP430 2 MSP430x supplied by TI"MSP-TS430D8 Rev.14 PCB 1 50,0mmx44,5mm 1.0



http://www.ti.com


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MSP-TS430PW14 www.ti.com

B.2 MSP-TS430PW14

Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic



http://www.ti.com


Jumper J4Open to disconnect LED

Orient Pin 1 ofMSP430 device

Jumper J6Open to measure current

Connector J3External power connectorJumper J5 to 'ext'

LED connected to P1.0

Jumpers J7 to J12Close 1-2 to debug inSpy-Bi-Wire Mode.Close 2-3 to debug in4-wire JTAG mode.

www.ti.com MSP-TS430PW14

Figure B-4. MSP-TS430PW14 Target Socket Module, PCB



http://www.ti.com



Table B-2. MSP-TS430PW14 Bill of MaterialsNo. perPosition Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP10uF, 10V, Tantal Size2 C7 1 511-1463-2-NDB

3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C34 C8 0 2.2nF, SMD0805 DNP5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder6 J1, J2 0 7-pin header, TH

SAM1029-07-ND : HeaderSAM1213-07-ND : Receptacle

J3, J5, J7, Place jumpers on headers J5, J7, J8,7 J8, J9, J10, 8 3-pin header, male, TH SAM1035-03-ND J9, J10, J11, J12; Pos 1-2J11, J128 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2

14-pin connector, male,10 JTAG 1 HRP14H-NDTHMicro Crystal MS1V-T1K

12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder12.5pF

13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND15 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas17 PCB 1 56 x 53 mm 2 layers

For example, 3MAdhesive Approximately 6mm18 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet width, 2mm height 530219 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI



http://www.ti.com


www.ti.com MSP-TS430L092

B.3 MSP-TS430L092

Figure B-5. MSP-TS430L092 Target Socket Module, Schematic



http://www.ti.com


MSP-TS430L092 www.ti.com

Settings of the MSP-TS430L092 Target SocketFigure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning isrecommended:• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device

current consumption. For default operation, they should be closed.

Figure B-6. MSP-TS430L092 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430L092

Table B-3. MSP-TS430L092 Bill of MaterialsNo. PerPos. Ref Des No. Description DigiKey Part No. CommentBoard

1 C1, C2 2 330nF, SMD06032 C5 1 100n, SMD06033 C6 1 10u, SMD08054 C10 1 100n, SMD06035 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND

DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7 J1, J2 2 7-pin header, TH


8 J3 1 3-pin header, male, TH SAM1035-03-NDDNP; Keep vias free of9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe solder.Reichelt: MicroMaTch-11 J13 1 MICRO_STECKV_10 Connector: MM FL 10G

12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-555716 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 168606517 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC18 R0, R6, R7 3 2K7, SMD060319 R1 1 1k, SMD060320 R2 1 47k, SMD0603

R4,R5, R8,21 6 10k, SMD0603R10, RC, RD22 RA 1 3.9k, SMD060323 RB 1 6.8k, SMD0603

14 Pin Socket - IC189-0142-24 U1 1 Manuf. Yamaichi146DNP: Enclosed with kit. Is22 MSP430 2 MSP430L092PWR supplied by TI.



http://www.ti.com


MSP-TS430L092 Active Cable www.ti.com

B.4 MSP-TS430L092 Active Cable

Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic



http://www.ti.com


www.ti.com MSP-TS430L092 Active Cable

Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.

Table B-4. MSP-TS430L092 JP1 Settings

Jumper 1 Jumper 2 DescriptionOff Off The active cable has no power and does not function.

The active cable receives power from target socket. For this option, theOff On target socket must have its own power supply.On Off The active cable receives power from the JTAG connector.

The JTAG connector powers the active cable and the target socket. ForOn On this option, the target socket must not have its own power source, as this

would cause a not defined state.

• JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin tohigh and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.

Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB



http://www.ti.com


MSP-TS430L092 Active Cable www.ti.com

Table B-5. MSP-TS430L092 Active Cable Bill of MaterialsNo. PerPos. Ref Des Description DigiKey Part No. CommentBoard

C1, C3, C5,1 4 100nF, SMD0603C62 C2, C4 2 1uF, SMD08053 R1, R10 2 10K, SMD06034 R2 1 4K7, SMD0603

R5, R6, R7,5 4 100, SMD0603R96 R8 1 680k, SMD06037 R11, R15 2 1K, SMD06038 R12 0 SMD0603 DNP9 R13 0 SMD0603 DNP

10 R14 1 0, SMD060311 IC1 1 SN74AUC1G04DBVR Manu: TI12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI

Reichelt: MicroMaTch-13 J2 1 MICRO_STECKV_10 Connector: MM FL 10GPut jumper on Position 1 and14 JP1 1 2x2 Header JP2Q 2. Do not mix direction.

15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header16 JTAG 1 14-pin connector, male, TH HRP14H-ND

BC817-25LT1SMD, SOT23- Digi-Key: BC817-17 Q1 1 BEC 25LT1GOSCT-ND18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI



http://www.ti.com



B.5 MSP-TS430PW24




http://www.ti.com


Jumper JP2Open to measure current



Jumper JP3Open to disconnect LED

Connector J5External power connectorJumper JP1 to "ext"

Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode





http://www.ti.com



Table B-6. MSP-TS430PW24 Bill of MaterialsNo. perPosition Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP2 C5 1 2.2nF, SMD08053 C3, C7 2 10uF, 10V, SMD08054 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND5 D1 1 green LED, SMD0805 P516TR-ND

DNP: Headers and receptacles"SAM1029-07-6 J1, J2 0 12-pin header, TH enclosed with kit. Keep vias free ofNDSAM1213-07-ND" solder. (Header & Receptacle)J5, JP1,

JP4, JP5, Place jumper on 1-2 of JP4-JP97 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, Place on 1-2 on JP1JP8, JP9

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND see Pos 7 an 8

14-pin connector, male,10 JTAG 1 HRP14H-NDTH11 Q1 0 Crystal DNP: keep vias free of solder12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND

R5, R6,13 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6R8, R9,14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND

Socket: OTS 24(28)-15 U1 1 Manuf.: Enplas065-02-0016 PCB 1 68.5 x 61 mm 2 layers

for example, 3MAdhesive Approximately 6mm17 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet width, 2mm height 530218 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI



http://www.ti.com


ML

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20

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22

23

24

25

26

27

28

J2

J1

12345678910

11

12

13

14

R2

123

J3

Q1

QUARZ3

P1

.0

P1

.0

P1

.3

P1

.3

P1

.2

P1

.2

P1

.1

P1

.1R

ST

/NM

I

RS

T/N

MI

RS

T/N

MIRS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

K

TM

S

TM

S

TM

S

TD

I

TD

I

TD

I

TD

O

TD

O

TD

O

XO

UT

XO

UT

VC

C

GN

D

GN

D

GN

D

P2

.3

P2

.3

P2

.4

P2

.4

XIN

XIN

P2

.5

P2

.5

P2

.2

P2

.2P

2.1

P2

.1

P2

.0

P2

.0

TS

T/V

PP

TS

T/V

PP

TS

T/V

PP

P3

.0

P3

.0

P3

.1

P3

.1

P3

.2

P3

.2

P3

.3

P3

.3

P3

.7

P3

.7

P3

.6

P3

.6

P3

.5

P3

.5

P3

.4

P3

.4

VC

C4

30

Ext_

PW

R

Da

te:

11

/14

/20

06

1:2

6:0

4 P

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

DW

28

+

VC

C4

30

MSP-TS430DW28 www.ti.com

B.6 MSP-TS430DW28

Figure B-11. MSP-TS430DW28 Target Socket Module, Schematic



http://www.ti.com


Jumper J4


Orient Pin 1 of

MSP430 device

Jumper J5

Open to measure current

Connector J3


Remove R8 and jumper R9


www.ti.com MSP-TS430DW28

Figure B-12. MSP-TS430DW28 Target Socket Module, PCB



http://www.ti.com


MSP-TS430DW28 www.ti.com

Table B-7. MSP-TS430DW28 Bill of MaterialsNo. perPosition Ref Des Description DigiKey Part No. CommentBoard

DNP: C1, C2, Cover holes while1 C1, C2 0 12pF, SMD0805 soldering2 C5 1 100nF, SMD08053 C7 1 10uF, 10V Tantal Elko B4 C8 1 10nF SMD08055 D1 1 LED3 T1 3mm yellow RS: 228-4991

Micro Crystal MS1V-T1K6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = DNP: Cover holes while soldering

12.5pFDNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder.7 J1, J2 2 14-pin header, TH male: Header: ReceptacleDNP: Headers and receptaclesenclosed with kit. Keep vias free of

14-pin header, TH solder.7.1 2 female : Header: Receptacle

8 J3 1 3-Pin Connector, male9 J4, J5 2 2-Pin Connector, male With jumper10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121

R1, R2,R6, R7,12 4 0R, SMD0805 DNP: R1, R2, R9, R10R8,R9,

R10, R1113 R3 1 560R, SMD080514 R5 1 47K, SMD0805

Yamaichi: IC189-0282-15 U1 1 SOP28DW socket 04216 U2 0 TSSOP DNP



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12pF

12pF

GN

D

GN

D

100nF

33

0R

10uF

/10V

-

0R

GN

D

GN

D

gre

en

2.2

nF

47

kG

ND

0R

0R

33

0R

MS

P430F

12xx

If exte

rnal s

upply

volta

ge:

rem

ove R

11 a

nd a

dd R

10 (0

Ohm

)

3.1

MS

P-T

S4

30

PW

28

:

OT

S-2

8-0

.65-0

1S

ocket: E

npla

s

Vcc

int

ext

Targ

et S

ocket B

oard

for M

SP

430

's in

PW

28 p

ackage

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

JTA

G ->

SB

W ->

JTA

G-M

ode s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mpers

JP

4 to

JP

9 to

positio

n 2

-32-w

ire "S

pyB

iWire

": Set ju

mpers

JP

4 to

JP

9 to

positio

n 1

-2

DN

P

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2C1

C4

R1

12

34

56

78

91

0

BO

OT

ST

C3

R2

R3

123

J5

JP

1

1 2 3

JP

2

1 212J

P3

D1

C5

R4

JP

4

1 2 3

JP

5

1 2 3

JP

6

1 2 3

JP

7

1 2 3

JP

8

1 2 3

JP

9

1 2 3

R5

R6

21

Q1

R7

J1

12345678910

11

12

13

14

J2

1 2 3 4 5 6 7 8 91

011

12

13

14

U1 TS

T1

VC

C2

P2

.53

VS

S4

XO

UT

5

XIN

6

RS

T7

P2

.08

P2

.19

P2

.21

0P

2.3

19

P2

.42

0P

1.0

21

P1

.12

2P

1.2

23

P1

.32

4P

1.4

25

P1

.52

6P

1.6

27

P1

.72

8

P3

.011

P3

.11

2

P3

.21

3

P3

.31

4P

3.4

15

P3

.51

6P

3.6

17

P3

.71

8

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

GN

D

VC

C430

VC

C430

P2.0

P1.1

P1.1

P3.3

P3.2

P3.1

P3.0

P2.2

P2.2

XIN

/P2.6

XIN

/P2.6

XO

UT

/P2.7

XO

UT

/P2.7

P2.1

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

P3.4

P3.5

P3.6

P3.7

P2.3

P2.4

P1.2

P1.3

P1.4

/TC

K

P1.4

/TC

K

P1.5

/TM

S

P1.5

/TM

S

P1.6

/TD

I

P1.6

/TD

I

P1.7

/TD

O

P1.7

/TD

O

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

P2.5

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

XT

LG

ND

Ext_

PW

R

+


B.7 MSP-TS430PW28




http://www.ti.com




LED D1 connected to P5.1

Jumper JP11-2 (int): Power supply via JTAG interface

2-3 (ext): External Power Supply

Jumper JP4 to JP9:Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode

Orient Pin 1 of Device





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Table B-8. MSP-TS430PW28 Bill of Materials (1)

No. perPos. Ref Des Description DigiKey Part No. CommentBoardDNP: C1, C2 , Cover holes1 C1, C2 0 12pF, SMD0805 while soldering

2 C3 1 10uF, 10V Tantal Elko B3 C4 1 100nF, SMD08054 C5 0 2.2nF, SMD0805 DNP5 D1 1 LED green SMD0603

Micro Crystal MS1V-T1K DNP: Cover holes and6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = neighboring holes while

12.5pF solderingDNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2 2 14-pin header, TH male: Header: ReceptacleDNP: headers andreceptacles enclosed withkit.Keep vias free of solder.7.1 2 14-pin header, TH female: Header: Receptacle

8 J5, IP1 1 3-Pin Connector , maleJP1, JP4,JP5, JP6,8a 7 3-Pin Connector , male Jumper on Pos 1-2JP7, JP8,

JP99 JP2, JP3 2 2-Pin Connector , male with Jumper

DNP: Cover holes while10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 soldering11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-12112 R1, R7 2 330R, SMD0805

R2, R3, R5,12 0 0R, SMD0805 DNPR614 R4 1 47K, SMD080515 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01

(1) PCB 66 x 79 mm, two layers; Rubber stand off, four pieces



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JTAG Mode selection:

4-wire JTAG: Set jumpers J4 to J9 to position 2-3

2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1

MSP-TS430PW28A www.ti.com

B.8 MSP-TS430PW28A

Figure B-15. MSP-TS430PW28A Target Socket Module, Schematic



http://www.ti.com








www.ti.com MSP-TS430PW28A

Figure B-16. MSP-TS430PW28A Target Socket Module, PCB (Red)



http://www.ti.com


MSP-TS430PW28A www.ti.com

Table B-9. MSP-TS430PW28A Bill of MaterialsNo. perPosition Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP2 C5 1 2.2nF, SMD08053 C3 1 10uF, 10V, SMD08054 C4, C6, 2 100nF, SMD0805 478-3351-2-ND5 D1 1 green LED, SMD0805 P516TR-ND

DNP: Headers and receptacles6 J1, J2 0 14-pin header, TH enclosed with kit. Keep vias free of

solder: (Header & Receptacle)J5, JP1,

JP4, JP5, Place jumper on 1-2 of JP4-JP97 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, Place on 1-2 on JP1JP8, JP9

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND see Pos 7 an 8

14-pin connector, male,10 JTAG 1 HRP14H-NDTH11 BOOTST 0 DNP Keep vias free of solder

Micro Crystal MS3V12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder

12.5pF13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND

R2, R3,R5,14 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6R6,15 R4 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas17 PCB 1 63.5 x 64.8 mm 2 layers

for example, 3MAdhesive Approximately 6mm18 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet width, 2mm height 530219 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI



http://www.ti.com


12

pF

12

pF

GN

D

GN

D

10

0n

F

560R

10

uF

/10

V

47k

10nF

-

0R

GN

D

MS

P4

30

F2

27

4ID

A

GN

D330R

GN

D

ye

llow

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R11

an

d a

dd

R1

0 (0

Oh

m)

IC1

89

-03

82

-03

7

So

cke

t:

4-w

ire J

TA

G:

2-w

ire "S

pyB

iWire

":

JTA

G-M

od

e s

ele

ctio

n:

Se

t jum

pe

rs J

P4

to J

P9

to p

ositio

n 2

-3

Se

t jum

pe

rs J

P4

to J

P9

to p

ositio

n 2

-1

JTA

G ->

SB

W ->

Ya

ma

ich

i

DN

P

DN

P

DN

PD

NP

DN

P

DN

P

DN

P

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2C1

C5

R3

12

34

56

78

910

BO

OT

ST

C7

R5

C8

R10

R11

123

J3

Q1

TE

ST

/SB

WT

CK

1

P3.5

26

P3.6

27

P1.4

/TC

K35

RS

T/S

BW

DA

T7

DV

CC

2

DV

SS

4

P4.7

24

P3.7

28

AV

SS

15

AV

CC

16

P3.0

11

P3.1

12

P3.2

13

P3.3

14

P4.0

17

P4.1

18

P4.2

19

P3.4

25

P2.5

3

P2.4

30

P2.3

29

P2.2

10

P2.1

9P

2.0

8

P1.5

/TM

S36

P1.6

/TD

I37

P1.7

/TD

O38

P2.7

5

P2.6

6

P4.6

23

P4.5

22

P4.4

21

P4.3

20

P1.0

31

P1.1

32

P1.2

33

P1.3

34

U1

JP

1

1 2 3

JP

2

1 2

12J

P3

1 2 3JP

4JP

5

1 2 3

JP

6

1 2 3

JP

7

1 2 3

JP

8

1 2 3

R1

JP

9

1 2 3

2345678910

11

12

13

14

15

16

17

18

19

1

J1

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

20

J2

D1

P1

.0

P1

.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

GN

D

GN

DV

CC

43

0

VC

C4

30

VC

C4

30

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

P2

.5

P2

.0P

2.1

P3

.0P

3.1

P3

.2P

3.3

P4

.0P

4.1

P4

.2

P1

.7/T

DO

P1

.7/T

DO

P1

.6/T

DI

P1

.6/T

DI

P1

.5/T

MS

P1

.5/T

MS

P1

.4/T

CK

P1

.4/T

CK

P1

.3P

1.2

P1

.1

P1

.1

P2

.4P

2.3

P3

.7P

3.6

P3

.5P

3.4

P4

.7P

4.6

P4

.5P

4.4

P4

.3

P2

.7/X

OU

T

P2

.7/X

OU

T

P2

.6/X

IN

P2

.6/X

IN

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

P2

.2

P2

.2

Ext_

PW

R

Date

:6/1

8/2

008 1

1:0

4:5

6A

MS

heet:

1/1 R

EV

:

TIT

LE

:

Docum

ent N

um

ber:

MS

P-T

S430D

A38

+

1.3

MS

P-T

S430D

A38:

Vcc

int

ext

Ta

rge

t So

cke

t Bo

ard

for M

SP

43

0F

22

47

IDA

www.ti.com MSP-TS430DA38

B.9 MSP-TS430DA38

Figure B-17. MSP-TS430DA38 Target Socket Module, Schematic



http://www.ti.com


Orient pin 1 ofMSP430 device


Connector J3External power connectorJumper JP1 to 'ext'



Jumpers JP4 to JP9Close 1-2 to debug inSpy-Bi-Wire Mode,Close 2-3 to debug in4-wire JTAG Mode

MSP-TS430DA38 www.ti.com

Figure B-18. MSP-TS430DA38 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430DA38

Table B-10. MSP-TS430DA38 Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 0 2.2nF, SMD0805 DNP5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2 0 19-pin header, TH


"J3, JP1, Place jumpers on headersJP4, JP5,7 8 3-pin header, male, TH SAM1035-03-ND JP1, JP4,JP5, JP6, JP7,JP6, JP7, JP8, JP9; Pos 1-2JP8, JP9"8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

Place on: JP1 - JP9; Pos 1-9 9 Jumper 15-38-1024-ND 210 JTAG 1 14-pin connector, male, TH HRP14H-ND

DNP: Keep vias free of11 BOOTST 0 10-pin connector, male, TH solderMicro Crystal MS1V-T1K DNP: Keep vias free of12 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF

13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP15 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi17 PCB 1 67 x 66 mm 2 layers

Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: enclosed with kit19 MSP430 2 MSP430F2274IDA supplied by TI



http://www.ti.com


MSP-TS430QFN23x0 www.ti.com

B.10 MSP-TS430QFN23x0

Figure B-19. MSP-TS430QFN23x0 Target Socket Module, Schematic



http://www.ti.com


LED connected

to P1.0

Connector J5


Jumper JP1 to 'ext'

Jumper JP3


Jumper JP2


www.ti.com MSP-TS430QFN23x0

Figure B-20. MSP-TS430QFN23x0 Target Socket Module, PCB



http://www.ti.com


MSP-TS430QFN23x0 www.ti.com

Table B-11. MSP-TS430QFN23x0 Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C4 1 100nF, SMD0805 478-3351-2-ND4 C5 1 10nF, SMD0805 478-1383-2-ND5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: headers andreceptacles enclosed with

J1, J2, J3, kit.Keep vias free of solder.6 0 10-pin header, THJ4 SAM1034-10-ND : HeaderSAM1212-10-ND : Receptacle

Place jumper on header7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND JP1; Pos 1-2.8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3

10 JTAG 1 14-pin connector, male, TH HRP14H-NDDNP: Keep vias free of11 BOOTST 0 10-pin connector, male, TH solder

Micro Crystal MS1V-T1K DNP: Keep vias free of12 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF13 R1 1 330 Ω, SMD0805 541-330ATR-ND14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP15 R4 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas17 PCB 1 79 x 66 mm 2 layers

Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: enclosed with kit19 MSP430 2 MSP430F2370IRHA supplied by TI



http://www.ti.com


www.ti.com MSP-TS430RSB40

B.11 MSP-TS430RSB40

Figure B-21. MSP-TS430RSB40 Target Socket Module, Schematic



http://www.ti.com








MSP-TS430RSB40 www.ti.com

Figure B-22. MSP-TS430RSB40 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430RSB40

Table B-12. MSP-TS430RSB40 Bill of MaterialsNo. PerPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2C3, C7, C10,2 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12C12C4, C6, C8,3 3 100nF, SMD0805 311-1245-2-ND DNP C11C11

4 C5 1 2.2nF, SMD08055 C9 1 470nF, SMD08056 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7 J1, J2, J3, J4 4 10-pin header, TH: Header: ReceptacleDNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7.1 4 10-pin header, TH: Header: Receptacle

JP1,JP4,JP5, Jumper: 1-2 on JP1, JP10; 2-8 JP6, JP7, 9 3-pin header, male, TH SAM1035-03-ND 3 on JP4-JP9JP8, JP9, J5,

JP109 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header

10 JTAG 1 14-pin connector, male, TH HRP14H-NDDNP. Keep vias free of11 BOOTST 0 10-pin connector, male, TH solder

QFN-40B-0.4_12 U1 1 EnplasENPLAS_SOCKETMicro Crystal MS3V-T1R DNP: Q1. Keep vias free of13 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF

Place on: JP1, JP2, JP3,15 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,

JP9, JP1016 R1,R7 2 330R SMD0805

R2, R3, R5,17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6

R1018 R4 1 47k SMD0805

DNP: enclosed with kit. Is19 MSP430 2 MSP430F5132 supplied by TIRubber stand select appropriate; for apply to corners at bottom20 4off example, Buerklin: 20H1724 side



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MSP-TS430RHA40A www.ti.com

B.12 MSP-TS430RHA40A

Figure B-23. MSP-TS430RHA40A Target Socket Module, Schematic



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www.ti.com MSP-TS430RHA40A

Figure B-24. MSP-TS430RHA40A Target Socket Module, PCB



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MSP-TS430RHA40A www.ti.com

Table B-13. MSP-TS430RHA40A Bill of MaterialsNo. perPosition Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP: C1, C22 C5 0 2.2nF, SMD0805 DNP C123 C3, C7 2 10uF, 10V, SMD0805 5 DNP C114 C4, C6 2 100nF, SMD0805 478-3351-2-ND5 C9 1 470nF, SMD08056 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers and receptaclesenclosed with kit. Keep vias free of

J1, J2, J3, solder.7 4 10-pin header, THJ4 : Header: ReceptacleDNP: headers and receptaclesenclosed with kit. Keep vias free ofsolder.7.1 4 10-pin header, TH: Header: Receptacle

J5, JP1,JP4, JP5, Place jumper on 1-2 of JP4-JP9;8 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, Place on 1-2 on JP1JP8, JP9

9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10 9 Jumper 15-38-1024-ND see Pos 8 an 9

14-pin connector, male,11 JTAG 1 HRP14H-NDTH10-pin connector, male,12 BOOTST 0 DNP. Keep vias free of solderTH

13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: EnplasMicro Crystal MS3V-T1R

14 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1. Keep vias free of solder12.5pF

15 R1,R7 2 330R SMD0805 541-330ATR-NDR2, R3,

16 R5, R6, 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6R8, R9,

17 R4 1 47k SMD080518 PCB 1 79 x 66 mm 2 layers

select appropriate; forRubber19 4 example, Buerklin: apply to corners at bottom sidestand off 20H1724DNP: enclosed with kit. Is supplied by20 MSP430 2 MSP430N5736IRHA TI



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ML

14

LE

D3 1

2p

F

12

pF

GN

D

GND

10

0n

F

560R

ML

10

JP

1Q

JP

1Q

10

uF

/10

V

47K

10nF

0R

0R

GN

D

0R

0R

10

uF

/10

V

GN

D

IC51-1

387.K

S-1

5186

100nF

1.3

MS

P-T

S430D

L48

Targ

et S

ocket D

L48

Q1

, C1

, C2

no

t asse

mb

led

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

D1

C2

C1

C5

R3

BO

OT

ST

12

34

56

78

910

1 2

J5

J4

12

C7

R5

C8

R6 R

7

123

J3

Q1

QUARZ3

J2

135

24679

810

11

13

15

12

14

16

17

19

18

20

21

23

22

24

135

24679

810

11

13

15

12

14

16

17

19

18

20

21

23

22

24

J1

R12

R4

JP

1

1 2 3

123

JP

2

C4

U1

TD

O/T

DI

1

TD

I/TC

LK

2

TM

S3

TC

K4

RS

T/N

MI

5

DV

CC

6

DV

SS

7

XIN

8

XO

UT

9

AV

SS

10

AV

CC

11

VR

EF

+12

P6.0

13

P6.1

14

P6.2

15

P6.3

16

P6.4

17

P6.5

18

P6.6

19

P6.7

20

P2.5

39

P2.4

40

P2.3

41

P2.2

42

P2.1

43

P2.0

44

CO

M0

45

P5.2

46

P5.3

47

P5.4

48

LC

DR

EF

29

LC

DC

AP

30

P5.1

31

P5.0

32

P5.5

33

P5.6

34

P5.7

35

S5

36

P2.7

37

P2.6

38

P1.7

21

P1.6

22

P1.5

23

P1.4

24

P1.0

28

P1.1

27

P1.2

26

P1.3

25

C3

P1

.0

P1

.0

RS

T/N

MI

RS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

K

TM

S

TM

S

TD

I

TD

I

TD

O

TD

O

XO

UT

XO

UT

GN

D

GN

DG

ND

XIN

XIN

BS

L_

TX

VC

C

BS

L_

RX

Ext_

PW

R

Date

:11/1

4/2

006 1

:24:4

4 P

MS

heet:

1/1 R

EV

:

TIT

LE

:

Docum

ent N

um

ber:

MS

P-T

S430D

L48

+

+

Vcc

ext

int

int

ext Vcc

www.ti.com MSP-TS430DL48

B.13 MSP-TS430DL48

Figure B-25. MSP-TS430DL48 Target Socket Module, Schematic



http://www.ti.com


Jumper J4

Open to

disconnect LED

LED connected

to P1.0

Orient pin 1 of

MSP430 device

Jumper J5


Connector J3


Jumper JP1 to ‘ext’

MSP-TS430DL48 www.ti.com

Figure B-26. MSP-TS430DL48 Target Socket Module, PCB



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www.ti.com MSP-TS430DL48

Table B-14. MSP-TS430DL48 Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND3 C3, C5 2 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2 0 24-pin header, TH


Place jumper on header7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND JP1; Pos 1-2. DNP: JP28 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J5


Micro Crystal MS1V-T1K DNP: Keep vias free of12 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF13 R3 1 560 Ω, SMD0805 541-560ATR-ND

R4, R6, R7,14 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7R1215 R5 1 47k Ω, SMD0805 541-47000ATR-ND

Socket: IC51-1387 KS-16 U1 1 Manuf.: Yamaichi1518617 PCB 1 58 x 66 mm 2 layers

Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: Enclosed with kit19 MSP430 2 MSP430F4270IDL supplied by TI



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MSP-TS430RGZ48B www.ti.com

B.14 MSP-TS430RGZ48B

Figure B-27. MSP-TS430RGZ48B Target Socket Module, Schematic



http://www.ti.com








www.ti.com MSP-TS430RGZ48B

Figure B-28. MSP-TS430RGZ48B Target Socket Module, PCB



http://www.ti.com


MSP-TS430RGZ48B www.ti.com

Table B-15. MSP-TS430RGZ48B Bill of MaterialsNo. perPosition Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP2 C3, C4 0 47pF, SMD0805 DNP

C6, C7,3 3 10uF, 6.3V, SMD0805C12C5, C11,4 4 100nF, SMD0805 311-1245-2-NDC13, C14

5 C8 1 2.2nF, SMD08056 C9 1 470nF, SMD0805 478-1403-2-ND7 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-12-ND DNP: Headers and receptaclesJ1, J2, J3,8 0 12-pin header, TH (Header) SAM1213-12- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:9 J5 1 3-pin header, male, TH

JP3, JP5, place jumpers on pins 2-3 on JP5,JP6, JP7,10 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 placeJP8, JP9, jumpers on pins 1-2 on JP3,JP1011 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11

14-pin connector, male,13 JTAG 1 HRP14H-NDTH10-pin connector, male,14 BOOTST 0 "DNP Keep vias free of solder"TH

Micro Crystal MS3V-T1R15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder

12.5pFQ2: 4MHz Buerklin:16 Q2 0 Crystal DNP: Q2 Keep vias free of solder78D134http://www.ettinger.de/ArInsulating17 0 Insulating disk to Q2 t_Detail.cfm?ART_ARTdisk to Q2 NUM=70.08.121

18 R3, R7 2 330 Ω, SMD0805 541-330ATR-NDR1, R2,R4, R6,

19 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,

R11, R1220 R5 1 47k Ω, SMD0805 541-47000ATR-ND

Socket: QFN11T048-21 U1 1 Manuf.: Yamaichi008_A101121_RGZ4822 PCB 1 81 x 76 mm 2 layers

for example, 3MAdhesive Approximately 6mm23 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet width, 2mm height 530224 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI



http://www.ti.com


DN

P

DN

P

DN

P

GN

D

GN

D

10

0n

F

330R

-0R

GN

D

GN

D

1.1

nF

47k

GN

D

0R 0R

0R

QU

AR

Z5

1u

F/1

0V

10

0n

F1

uF

/10

V

gre

en

DN

P

yello

w (D

NP

) DN

P

red (D

NP

)

0R

GN

D

DN

P

DN

P

0R0R

QUARZ5

EV

Q11

0R

DNP

DN

P

If exte

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upply

volta

ge:

rem

ove R

3 a

nd a

dd R

2 (0

Ohm

)

1.3

Ext_

PW

R

MS

P-T

S430R

GZ

48C

Vcc

int

ext

Targ

et S

ocket B

oard

for M

SP

430F

R58xx, F

R59xx IR

GZ

DN

PD

NP

DN

P

DN

P

DN

P

JTA

G ->

SB

W ->

JTA

G-M

ode s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mpers

JP

3 to

JP

8 to

positio

n 2

-32-w

ire "S

pyB

iWire

": Set ju

mpers

JP

3 to

JP

8 to

positio

n 1

-2

connectio

n b

y v

ia

DN

P

DN

P

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2

C1

C4

R1

12

34

56

78

910

BO

OT

ST

R2R3

123

J2

J1

1 2 3

JP

1

1 2

12J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R5 R6

R7

Q1

C3

C6

C7

D1

R10

12J

P10

D2

R11

12J

P11

D3

R12

JP

2

1 2

C8

C9

R8R9

Q2

SV

4

12345678910

11

12

SV1

123456789

101112

SV

2

1 2 3 4 5 6 7 8 910

11

12

SV3

123456789101112

1_P

1.0

1

2_P

1.1

2

3_P

1.2

3

4_P

3.0

4

5_P

3.1

5

6_P

3.2

6

7_P

3.3

7

8_P

4.7

8

9_P

1.3

9

10_P

1.4

10

11_P

1.5

11

12_P

J.0

_T

DO

12

13_PJ.1_TDI13

14_PJ.2_TMS14

15_PJ.3/TCK15

16_P4.016

17_P4.117

18_P4.218

19_P4.319

20_P2.520

21_P2.621

22_TEST/SBWTCK22

23_RST/SBWTDIO23

24_P2.024

25_P

2.1

25

26_P

2.2

26

27_P

3.4

27

28_P

3.5

28

29_P

3.6

29

30_P

3.7

30

31_P

1.6

31

32_P

1.7

32

33_P

4.4

33

34_P

4.5

34

35_P

4.6

35

36_D

VS

S36

37_DVCC 3738_P2.7 3839_P2.3 3940_P2.4 40

41_AVSS 4142_HFXIN 42

43_HFXOUT 4344_AVSS 4445_LFXIN 45

46_LFXOUT 4647_AVSS 4748_AVCC 48

U1

SW

1

R13

TP2TP1

SW2

R14

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

P1.1

P1.1

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IORST/SBWTDIO

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

PJ.0

/TD

O

PJ.0

/TD

O

PJ.2

/TM

S

PJ.2/TMS

PJ.3

/TC

K

PJ.3/TCK

PJ.1

/TD

I

PJ.1/TDI

P1.2

P1.2

P2.0

P2.0

P2.1

P2.1

P1.3

P1.3

P1.4

P1.5

AVCC

AV

CC

AVSS

AV

SS

AVSS

AVSS

LF

XO

UT

LF

XIN

LF

GN

DH

FG

ND

HF

XO

UT

HF

XIN

P2.4P2.3P2.7DVCC

DV

CC

DV

CC

DVCC

DV

SS

DV

SS

P4.6

P4.5

P4.4

P1.7

P1.6

P3.7

P3.6

P3.5

P3.4

P2.2

P2.6P2.5P4.3P4.2P4.1P4.0

P4.7

P3.3

P3.2

P3.1

P3.0

TE

ST

/SB

WT

CK

1

TEST/SBWTCK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

www.ti.com MSP-TS430RGZ48C

B.15 MSP-TS430RGZ48C

Figure B-29. MSP-TS430RGZ48C Target Socket Module, Schematic



http://www.ti.com


MSP-TS430RGZ48C www.ti.com

Figure B-30. MSP-TS430RGZ48C Target Socket Module, PCB

Table B-16. MSP-TS430RGZ48C Revision HistoryRevision Comments

1.2 Initial release

LFOSC pins swapped at SV1 (9-10).1.3 HFOSC pins swapped at SV1 (6-7).

BOOTST pin 4 now directly connected to the device RST/SBWTDIO pin.



http://www.ti.com


www.ti.com MSP-TS430RGZ48C

Table B-17. MSP-TS430RGZ48C Bill of MaterialsNumber

Pos Ref Des Per Description DigiKey Part Number CommentBoard

1 SV1, SV2, SV3, 4 12-pin header, TH DNP: headers and receptacles enclosed with kit.SV4 Keep vias free of solder.

SAM1029-12-ND : Header

: Receptacle

1.1 SV1, SV2, SV3, 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit.SV4 Keep vias free of solder.

: Header

SAM1213-12-ND : Receptacle

2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP

4 J1, JP3, JP4, JP5, 7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP6, JP7, JP8

5 J2 1 3-pin header, male, TH SAM1035-03-ND

6 JP1, JP2, JP9, J1, 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,JP3, JP4, JP5, JP7, JP8JP6, JP7, JP8

7 R2, R3, R5, R6, 9 DNP, 0805 DNPR8, R9, R10, R11,R14

8 R12, R13, R7 3 0R, 0805 541-000ATR-ND

9 C5 1 1.1nF, CSMD0805 490-1623-2-ND

10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND

11 R4 1 47k, 0805 541-47000ATR-ND

12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND

13 R1 1 330R, 0805 541-330ATR-ND

14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP

15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459

16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder

17 JTAG 1 14-pin connector, male, TH HRP14H-ND

18 Q1 1 DNP: MS3V-TR1 (32768kHz, depends on application Micro Crystal, DNP, enclosed in kit, keep vias20ppm, 12.5pF) free of solder

19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder

20 U1 1 Socket: QFN11T048-008 Manuf.: YamaichiA101121-001

20.1 U1 1 MSP430 DNP: enclosed with kit. Is supplied by TI.

21 D1 1 green LED, DIODE0805 P516TR-ND

22 D3 1 red (DNP), DIODE0805 DNP

23 D2 1 yellow (DNP), DIODE0805 DNP

24 TP1, TP2 2 Testpoint DNP, keep pads free of solder

25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side

26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48C 2 layers, black solder maskRev. 1.2



http://www.ti.com


ML

14

LED3

0R

12

pF

12

pF

12

pF

12

pF

GN

D

GND

0R

100nF

56

0R

ML

10

JP1Q

JP

1Q

10uF/6,3V

10uF/10V

47K10nF

0R

0R

0R

-

-

0R

-

0R

0R

FE

16

-1-1

FE16-1-2

FE

16

-1-3

FE16-1-4

PWR3

GN

DG

ND

-

MS

P6

4P

M

not assembled

not a

ssem

ble

d

not a

ssem

ble

d

not a

ssem

ble

d

enhancement

reserved forfuture

JTA

G

1 3 5 7 9 11

13

2 4 6

12

148

10

D1

R2

C2

C1

C3

C4

R1

C5

R3

BO

OT

ST

12

34

56

78

91

0

J71 2

J6

12

C6

C7

R5C8

R6

R7

R8

R9

R10

R11

R12

R13

R14

12345678910

11

12

13

14

15

16

J1

J2

17181920212223242526272829303132

J3

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49505152535455565758596061626364

J4

J5123

R4

Q1

LFXTCLK

XTCLK

U2

DV

CC

234567XIN

XO

UT

10

11

12

13

14

15

16

17181920212223242526272829303132

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

4950515253

TDOTDI

TMSTCKRST

596061

AVSSDVSSAVCC

RS

T/N

MI

TC

KT

MS

TD

IT

DO

VC

C

Da

te:

3/1

4/2

00

6 1

0:4

6:3

0A

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

PM

64

+

+

1

MS

P-T

S4

30

PM

64

Ta

rge

t So

cke

t PM

64

Ya

ma

ich

iIC

51

-06

44

-80

7

So

cke

t:

1.2

for F

14

x a

nd

F4

1x

Op

en

J6

if LC

D

is c

on

ne

cte

d

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R8

an

d a

dd

R9

(0 O

hm

)

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R11

an

d a

dd

R1

0 (0

Oh

m)

Fo

r BS

Lu

sa

ge

ad

d:

R6

R7

R1

3 R

14

MS

P4

30

F1

4x : 0

0 o

pe

n o

pe

nM

SP

43

0F

41

x : o

pe

n o

pe

n 0

0

MSP-TS430PM64 www.ti.com

B.16 MSP-TS430PM64

NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not bemade.

Figure B-31. MSP-TS430PM64 Target Socket Module, Schematic



http://www.ti.com


Connector J5

External power connection


LED connected

to pin 12

Jumper J6


Jumper J7


Orient Pin 1 of

MSP430 device

www.ti.com MSP-TS430PM64

Figure B-32. MSP-TS430PM64 Target Socket Module, PCB



http://www.ti.com


MSP-TS430PM64 www.ti.com

Table B-18. MSP-TS430PM64 Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNPDNP: Only recommendation.1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.

2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C63 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2, J3, J4 0 16-pin header, TH


8 J5 1 3-pin header, male, TH SAM1035-03-ND9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

11 2 Jumper 15-38-1024-ND Place on: J6, J712 JTAG 1 14-pin connector, male, TH HRP14H-ND

DNP: Keep vias free of13 BOOTST 0 10-pin connector, male, TH solderQ1: Micro Crystal MS1V-T1K DNP: Keep vias free of14 Q1, Q2 0 Crystal 32.768kHz, C(Load) = solder12.5pF

15 R3 1 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,R6, R7, R8, DNP: R4, R6, R7, R9, R10,16 R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND R11, R12, R13, R14R11, R12,R13, R14

17 R5 1 47k Ω, SMD0805 541-47000ATR-ND18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi19 PCB 1 78 x 75 mm 2 layers

Rubber Apply to corners at bottom20 4 select appropriatestandoff sideMSP430F2619IPM DNP: Enclosed with kit21 MSP430 22 MSP430F417IPM supplied by TI



http://www.ti.com


0R

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www.ti.com MSP-TS430PM64A

B.17 MSP-TS430PM64A

Figure B-33. MSP-TS430PM64A Target Socket Module, Schematic



http://www.ti.com





Jumper JP31-2 (int): Power supply via JTAG interface2-3 (ext): External Power Supply

Jumper JP4 to JP9:Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode


MSP-TS430PM64A www.ti.com

Figure B-34. MSP-TS430PM64A Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PM64A

Table B-19. MSP-TS430PM64A Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2, 0 12pF, SMD0805 DNP2 C3 0 2.2nF, SMD0805 DNP3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND4 C4, C5 2 100nF, SMD0805 478-3351-2-ND5 D1 1 green LED, SMD0805 P516TR-ND

DNP: Headers andreceptacles enclosed with kit.Keep vias free of solder.6 J1, J2, J3, J4 0 16-pin header, TH


J5, JP3, JP4,JP5, JP6,7 8 3-pin header, male, TH SAM1035-03-NDJP7, JP8,

JP98 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 2 Jumper 15-38-1024-ND Place on: J6, J7


Micro Crystal MS1V-T1K DNP: Keep vias free of12 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R5,R7, R9, R10, DNP: R5, R7, R9, R10, R11,14 2 0 Ω, SMD0805 541-000ATR-NDR11, R13, R13, R14

R1415 R4 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi17 PCB 1 78 x 75 mm 4 layers

Rubber stand Apply to corners at bottom18 4 select appropriateoff sideDNP: Enclosed with kit19 MSP430 2 MSP430F4152IPM supplied by TI



http://www.ti.com


MSP-TS430RGC64B www.ti.com

B.18 MSP-TS430RGC64B

Figure B-35. MSP-TS430RGC64B Target Socket Module, Schematic



http://www.ti.com






If the system shouldbe supplied via LDOI (J6),close JP4 andset JP3 to external


www.ti.com MSP-TS430RGC64B

Figure B-36. MSP-TS430RGC64B Target Socket Module, PCB



http://www.ti.com


MSP-TS430RGC64B www.ti.com

Table B-20. MSP-TS430RGC64B Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP2 C3, C4 0 47pF, SMD0805 DNP3 C6, C7, C10 3 10uF, 6.3V, SMD0805

C5, C11,4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND

C155 C8 1 2.2nF, SMD08056 C9 1 470nF, SMD0805 478-1403-2-ND7 C16 1 4.7uF, SMD08058 C17 1 220nF, SMD08059 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-16-ND DNP: Headers and receptaclesJ1, J2, J3,10 0 16-pin header, TH (Header) SAM1213-16- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:11 J5 , J6 2 3-pin header, male, TH

JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,JP6, JP7,12 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers onJP8, JP9, pins 1-2 on JP3,JP10JP1, JP2,13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4

14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 1314-pin connector, male,15 JTAG 1 HRP14H-NDTH10-pin connector, male,16 BOOTST 0 "DNP Keep vias free of solder"TH


12.5pFQ2: 4MHz Buerklin:18 Q2 0 Crystal DNP: Q2 Keep vias free of solder78D134http://www.ettinger.de/ArtInsulating19 0 Insulating disk to Q2 _Detail.cfm?ART_ARTNUdisk to Q2 M=70.08.121

20 R3, R7 2 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,

R6, R8,21 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,R11, R12

22 R5 1 47k Ω, SMD0805 541-47000ATR-NDSocket: QFN11T064-006-23 U1 1 Manuf.: YamaichiN-HSP

24 PCB 1 85 x 76 mm 2 layersfor example, 3MAdhesive Approximately 6mm25 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet width, 2mm height 5302

26 D3,D427 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI



http://www.ti.com


www.ti.com MSP-TS430RGC64C

B.19 MSP-TS430RGC64CThe MSP-TS430RGC64C target board has been designed with the option to operate with the targetdevice DVIO input voltage supplied via header J6 (see Figure B-37). This development platform does notsupply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper deviceoperation. For correct JTAG connection, programming, and debug operation, it is important to follow thisprocedure:1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully

discharged to 0 V.2. Enable the 1.8-V external DVIO power supply.3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSP-

FET430UIF JTAG debugger interface).4. Connect the MSP-FET430UIF JTAG connector to the target board.5. Start the debug session using IAR or CCS IDE.

For more information on debugging the MSP4and MSP430F525x, see the device-specific data sheets(MSP430F522x: SLAS718; MSP430F525x: SLAS903) and Designing with MSP430F522x andMSP430F521x Devices (SLAA558).

For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain,short JP4 with the jumper.



http://www.ti.com

http://www.ti.com/lit/pdf/SLAS718

http://www.ti.com/lit/pdf/SLAS903

http://www.ti.com/lit/pdf/SLAA558


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19 P1.1/TA0.0

20 P1.2/TA0.1

21 P1.3/TA0.2

22 P1.4/TA0.3

23 P1.5/TA0.4

24 P1.6/TA1CLK/CBOUT

25 P1.7/TA1.0

26 P2.0/TA1.1

27 P2.1/TA1.2

28 P2.2/TA2CLK/SMCLK

29 P2.3/TA2.0

30 P2.4/TA2.1

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55BSLEN

56RST/NMI

57P5.2/XT2IN

58P5.3/XT2OUT

59TEST/SBWTCK

60PJ.0/TDO

61PJ.1/TDI/TCLK

62PJ.2/TMS

63PJ.3/TCK

64RSTDVCC/SBWTDIO

65 THERMAL_1

66 THERMAL_2

67 THERMAL_3

68 THERMAL_4

69 THERMAL_5

70 THERMAL_6

71 THERMAL_7

72 THERMAL_8

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SS

MSP-TS430RGC64C www.ti.com

Figure B-37. MSP-TS430RGC64C Target Socket Module, Schematic



http://www.ti.com


Connector J5

External power connector for DVCC.

Set jumper JP3 to "ext".

IMPORTANT NOTE:

Rev1.0 of the board does not have

connection from pin 4 of BOOTST to

pin 64 of MCU. To use BSL, these pins

should be connected by a wire.

Jumper JP2

Open to disconnect LED.

D1


Orient Pin 1 of

MSP430 device

Jumpers JP5 to JP10

-2 to debug in

Spy-Bi-Wire mode.

Close 2-3 to debug in

4-wire JTAG mode.

Close 1

Jumper JP4

For F524x devices, close.

For F522x, F523x and F525x devices,

close only if one power supply is

used for VCC and DVIO, and if VCC is

not higher then 1.98 V. Otherwise.

supply DVIO over J6.

Do not close if VCC > 1.98 V, as it

may damage the chip.

Connector J6


to supply DVIO

www.ti.com MSP-TS430RGC64C

Figure B-38. MSP-TS430RGC64C Target Socket Module, PCB



http://www.ti.com


MSP-TS430RGC64C www.ti.com

Table B-21. MSP-TS430RGC64C Bill of MaterialsItem Qty Reference Value Description Comment Supplier No.

1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2

2 0 C3, C4 tbd CAP, SMD, Ceramic, 0805 DNP C3 C4

4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805

5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 DigiKey: 311-1245-2-ND

5 5 C8 2.2nF CAP, SMD, Ceramic, 0805

6 1 C9 470nF CAP, SMD, Ceramic, 0805 DigiKey: 478-1403-2-ND

7 1 C16 4.7uF CAP, SMD, Ceramic, 0805

8 1 D1 Green LED LED, SMD, 0805

DNP: headers andreceptacles enclosed with

Pin header 1x16: Grid: 100mil kit. Keep vias free of9 4 J1-J4 16-pin header (2.54 mm) solder.: Header SAM1029-16-ND: Receptacle SAM1213-16-ND

Pin header 1x3: Grid: 100mil10 2 J5, J6 3-pin header, male, TH SAM1035-03-ND(2.54 mm)

JP5, JP6, JP7, Pinheader 1x3: Grid: 100mil11 3-pin header, male, TH place jumpers on pins 2-3 SAM1035-03-NDJP8, JP9, JP10 (2.54 mm)

Pin header 1x3: Grid: 100mil12 JP3 3-pin header, male, TH place jumper on pins 1-2 SAM1035-03-ND(2.54 mm)

Pin header 1x2; Grid: 100mil13 JP1, JP2, JP4 2-pin header, male, TH place jumper on header SAM1035-02-ND(2.54 mm)

Place on: JP1, JP2, JP3,14 10 Jumper JP4, JP5, JP6, JP7, JP8, 15-38-1024-ND

JP9, JP10

Header, THD, Male 2x7 Pin,15 1 JTAG 2x7Pin,Wanne HRP14H-NDWanne, 100mil spacing

Header, THD, Male 2x5 Pin,16 0 BOOTST 2x5Pin,Wanne DNPWanne, 100mil spacing

CRYSTAL, SMD, 5x3MM,17 1 Q1 26MHz/ASX53 Only Kit.26MHz

CRYSTAL, SMD, 5x3MM,18 0 Q2 26MHz/ASX53 300-8219-1-ND26MHz

DIODE, SMD, SOD123,19 1 D3 LL103A Buerklin: 24S3406Schottky

20 2 R3, R7 330 Ohm, SMD0805 541-330ATR-ND

21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-47000ATR-ND

R1, R2, R4, DNP: R6, R8, R9, R10,22 R6, R8, R9, 0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-000ATR-NDR11,R12R10, R11, R12

Socket: QFN11T064-006-N-23 1 U1 Manuf.: YamaichiHSP

IC, MCU, SMD, 9.15x9.15mm24 2 MSP430 MSP430F5229IRGCR Thermal Pad with Socket

Rubber stand apply to corners at bottom25 4 Rubber stand off Buerklin: 20H1724off side

26 1 PCB 84 x 76 mm 84 x 76 mm



http://www.ti.com


www.ti.com MSP-TS430RGC64USB

B.20 MSP-TS430RGC64USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.

Figure B-39. MSP-TS430RGC64USB Target Socket Module, Schematic



http://www.ti.com


MSP-TS430RGC64USB www.ti.com

Figure B-40. MSP-TS430RGC64USB Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430RGC64USB

Table B-22. MSP-TS430RGC64USB Bill of MaterialsNo. PerPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP: C1, C21.1 C3, C4 2 47pF, SMD08052 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND

C5, C11,3 4 100nF, SMD0805 311-1245-2-NDC13, C143.1 C10, C12 0 10uF, SMD0805 DNP: C10, C124 C8 1 2.2nF, SMD08055 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7 J1, J2, J3, J4 4 16-pin header, TH


8 J5 1 3-pin header, male, TH SAM1035-03-NDJP5, JP6,

9 JP7, JP8, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP9, JP10JP1, JP2,10 3 2-pin header, male, TH SAM1035-02-ND place jumper on headerJP4

11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2Place on: JP1, JP2, JP3,

12 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,JP9, JP10

13 JTAG 1 14-pin connector, male, TH HRP14H-NDQ1: Micro Crystal MS1V-T1K DNP: Q114 Q1 0 Crystal 32.768kHz, C(Load) = Keep vias free of solder"12.5pF

15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D13416 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

R1218 R10 1 100 Ω, SMD0805 Buerklin: 07E50018 R11 1 1M Ω, SMD080518 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi20 PCB 1 79 x 77 mm 2 layers

Rubber stand apply to corners at bottom21 4 Buerklin: 20H1724off sideDNP: enclosed with kit. Is22 MSP430 2 MSP430F5509 RGC supplied by TI

http://www.ettinger.de/Art_DeInsulating23 1 Insulating disk to Q2 tail.cfm?ART_ARTNUM=70.0disk to Q2 8.12127 C33 1 220n SMD0603 Buerklin: 53D207428 C35 1 10p SMD0603 Buerklin: 56D10229 C36 1 10p SMD0603 Buerklin: 56D10230 C38 1 220n SMD0603 Buerklin: 53D207431 C39 1 4u7 SMD0603 Buerklin: 53D208632 C40 1 0.1u SMD0603 Buerklin: 53D206833 D2, D3, D4 3 LL103A Buerklin: 24S3406



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MSP-TS430RGC64USB www.ti.com

Table B-22. MSP-TS430RGC64USB Bill of Materials (continued)No. PerPos. Ref Des Description DigiKey Part No. CommentBoard

34 IC7 1 TPD4E004 Manu: TI36 LED 0 JP3QE SAM1032-03-ND DNP37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP

R13, R15,40 0 470R Buerklin: 07E564 DNPR1641 R33 1 1k4 / 1k5 Buerklin: 07E61242 R34 1 27R Buerklin: 07E44443 R35 1 27R Buerklin: 07E44444 R36 1 33k Buerklin: 07E74045 S1 0 PB P12225STB-ND DNP46 S2 0 PB P12225STB-ND DNP46 S3 1 PB P12225STB-ND47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885



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www.ti.com MSP-TS430PN80

B.21 MSP-TS430PN80

NOTE: For MSP430F47x and MSP430FG47x devices:Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1.

Figure B-41. MSP-TS430PN80 Target Socket Module, Schematic



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Connector J5



LED connected to pin 12

Jumper J6



MSP-TS430PN80 www.ti.com

Figure B-42. MSP-TS430PN80 Target Socket Module, PCB



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www.ti.com MSP-TS430PN80

Table B-23. MSP-TS430PN80 Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2DNP: Only recommendation.1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.

2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2, J3, J4 0 25-pin header, TH


7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

Place on: J6, JP2, JP1/Pos1-9 3 Jumper 15-38-1024-ND 210 JTAG 1 14-pin connector, male, TH HRP14H-ND


13 R3 1 560 Ω, SMD0805 541-560ATR-NDR1, R2, R4, DNP: R4, R6, R7, R10, R11,14 R6, R7, R10, 2 0 Ω, SMD0805 541-000ATR-ND R12R11, R12

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC201-0804-014 Manuf.: Yamaichi17 PCB 1 77 x 77 mm 2 layers

Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: Enclosed with kit19 MSP430 2 MSP430FG439IPN supplied by TI



http://www.ti.com


MSP-TS430PN80A www.ti.com

B.22 MSP-TS430PN80A

Figure B-43. MSP-TS430PN80A Target Socket Module, Schematic



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If the system shouldbe supplied via LDOI (J6),close JP4 andset JP3 to external

www.ti.com MSP-TS430PN80A

Figure B-44. MSP-TS430PN80A Target Socket Module, PCB



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MSP-TS430PN80A www.ti.com

Table B-24. MSP-TS430PN80A Bill of MaterialsNo. perPosition Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP2 C3, C4 0 47pF, SMD0805 DNP

C6, C7,3 3 10uF, 6.3V, SMD0805 DNP C10C10, C12C5, C11,

4 C13, C14, 5 100nF, SMD0805 311-1245-2-NDC15

5 C8 1 2.2nF, SMD08056 C9 1 470nF, SMD0805 478-1403-2-ND7 C16 1 4.7uF, SMD08058 C17 1 220nF, SMD08059 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-20-ND DNP: Headers and receptaclesJ1, J2, J3,10 0 20-pin header, TH (Header) SAM1213-20- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:11 J5 , J6 2 3-pin header, male, TH

JP3, JP5, place jumpers on pins 2-3 on JP5,JP6, JP7,12 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 placeJP8, JP9, jumpers on pins 1-2 on JP3,JP10JP1, JP2,13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4

14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 1314-pin connector, male,15 JTAG 1 HRP14H-NDTH10-pin connector, male,16 BOOTST 0 "DNP Keep vias free of solder"TH


12.5pFQ2: 4MHz Buerklin:18 Q2 0 Crystal DNP: Q2 Keep vias free of solder78D134http://www.ettinger.de/ArInsulating19 0 Insulating disk to Q2 t_Detail.cfm?ART_ARTdisk to Q2 NUM=70.08.121

20 D3,D4 2 LL103A Buerklin: 24S340621 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2,R4, R6,

22 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,

R11, R1223 R5 1 47k Ω, SMD0805 541-47000ATR-ND24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi25 PCB 1 77 x 91 mm 2 layers

for example, 3MAdhesive Approximately 6mm26 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet width, 2mm height 530227 MSP430 2 MSP430F5329IPN DNP: enclosed with kit, supplied by TI



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www.ti.com MSP-TS430PN80USB

B.23 MSP-TS430PN80USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.

NOTE: R11 should be populated.

Figure B-45. MSP-TS430PN80USB Target Socket Module, Schematic



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Jumper JP31-2 (int): Power supply via JTAG debug interface2-3 (ext): External power supply

Connector J5External power connectorJumper JP3 to ‘ext’

USB Connector

BSL invoke button S3

Jumper JP4Close for USB bus powereddevice




Jumper JP5 to JP10

Close 1-2 to debug in Spy-Bi-Wire mode.

Close 2-3 to debug in 4-wireJTAG mode.

MSP-TS430PN80USB www.ti.com

Figure B-46. MSP-TS430PN80USB Target Socket Module, PCB



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www.ti.com MSP-TS430PN80USB

Table B-25. MSP-TS430PN80USB Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard


C5, C11,3 4 100nF, SMD0805 311-1245-2-NDC13, C143.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C124 C8 1 2.2nF, SMD08055 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers andJ1, J2, J3, receptacles enclosed with7 4 20-pin header, TH SAM1029-20-NDJ4 kit. Keep vias free of

solder.DNP: headers andreceptacles enclosed withkit. Keep vias free of

7.1 4 20-pin header, TH solder.SAM1213-20-ND : Header

: Receptacle8 J5 1 3-pin header, male, TH SAM1035-03-ND

JP5, JP6,JP7,9 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP8,JP9,JP10

10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on headerPlace jumper only on oneJP4 1 SAM1035-02-ND pin

11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2Place on: JP1, JP2, JP3,


13 JTAG 1 14-pin connector, male, TH HRP14H-NDMicro Crystal MS1V-T1K DNP: Q1 Keep vias free of14 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF"Q2: 4MHzBuerklin:15 Q2 1 Crystal 78D134"

16 R3, R7 2 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,

17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12R12

18 R10 1 100 Ω, SMD0805 Buerklin: 07E50018 R11 0 1M Ω, SMD0805 DNP18 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi20 PCB 1 79 x 77 mm 2 layers

Rubber Apply to corners at bottom21 4 Buerklin: 20H1724standoff sideDNP: Enclosed with kit22 MSP430 2 MSP430F5529 supplied by TI

http://www.ettinger.de/Art_Insulating23 1 Insulating disk to Q2 Detail.cfm?ART_ARTNUMdisk to Q2 =70.08.12127 C33 1 220n Buerklin: 53D2074



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MSP-TS430PN80USB www.ti.com

Table B-25. MSP-TS430PN80USB Bill of Materials (continued)No. perPos. Ref Des Description DigiKey Part No. CommentBoard

28 C35 1 10p Buerklin: 56D10229 C36 1 10p Buerklin: 56D10230 C38 1 220n Buerklin: 53D207431 C39 1 4u7 Buerklin: 53D208632 C40 1 0.1u Buerklin: 53D206833 D2, D3, D4 3 LL103A Buerklin: 24S340634 IC7 1 TPD4E004 Manu: TI36 LED 0 JP3QE SAM1032-03-ND DNP37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP

R13, R15,40 0 470R Buerklin: 07E564 DNPR1641 R33 1 1k4 Buerklin: 07E61242 R34 1 27R Buerklin: 07E44443 R35 1 27R Buerklin: 07E44444 R36 1 33k Buerklin: 07E74045 S1 0 PB P12225STB-ND DNP46 S2 0 PB P12225STB-ND DNP46 S3 1 PB P12225STB-ND47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885



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www.ti.com MSP-TS430PZ100

B.24 MSP-TS430PZ100

NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not bemade.

Figure B-47. MSP-TS430PZ100 Target Socket Module, Schematic



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Connector J5



LED connected to pin 12

Jumper J6



Jumper J7


MSP-TS430PZ100 www.ti.com

Figure B-48. MSP-TS430PZ100 Target Socket Module, PCB



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www.ti.com MSP-TS430PZ100

Table B-26. MSP-TS430PZ100 Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNPDNP: Only

1b C3, C4 0 47pF, SMD0805 recommendation. Checkyour crystal spec.

2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C63 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND

DNP: Headers andreceptacles enclosed with


8 J5 1 3-pin header, male, TH SAM1035-03-ND9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header

10 2 Jumper 15-38-1024-ND Place on: J6, J711 JTAG 1 14-pin connector, male, TH HRP14H-ND

DNP: Keep vias free of12 BOOTST 0 10-pin connector, male, TH solderQ1: Micro Crystal MS1V- DNP: Keep vias free of13 Q1, Q2 0 Crystal T1K 32.768kHz, C(Load) = solder12.5pF

14 R3 1 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,

15 R8, R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12R11, R12

16 R5 1 47k Ω, SMD0805 541-47000ATR-NDSocket: IC201-1004-008 or17 U1 1 Manuf.: YamaichiIC357-1004-53N

18 PCB 1 82 x 90 mm 2 layersAdhesive for example, 3M Bumpons Apply to corners at bottom19 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 side

DNP: enclosed with kit20 MSP430 2 MSP430FG4619IPZ supplied by TI



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MSP-TS430PZ100A www.ti.com

B.25 MSP-TS430PZ100A

Figure B-49. MSP-TS430PZ100A Target Socket Module, Schematic



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Jumper JP1


Jumper JP2



Jumper JP3

1-2 (int): Power supply via JTAG interface

2-3 (ext): External Power Supply


www.ti.com MSP-TS430PZ100A

Figure B-50. MSP-TS430PZ100A Target Socket Module, PCB



http://www.ti.com


MSP-TS430PZ100A www.ti.com

Table B-27. MSP-TS430PZ100A Bill of MaterialsNo. perPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNPDNP: Only

1b C3, C4 0 47pF, SMD0805 recommendation. Checkyour crystal spec.

2 C7, C9 2 10uF, 10V, Tantal Size B 511-1463-2-NDC5, C11,3 3 100nF, SMD0805 311-1245-2-NDC14

4 C8 1 10nF, SMD0805 478-1358-1-ND5 C6 0 470nF, SMD0805 478-1403-2-ND DNP6 D1 1 green LED, SMD0805 67-1553-1-ND

DNP: Headers andreceptacles enclosed with


8 J5 1 3-pin header, male, TH SAM1035-03-ND10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-212 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP313 JTAG 1 14-pin connector, male, TH HRP14H-ND

DNP: Keep vias free of14 BOOTST 0 10-pin connector, male, TH solderQ1: Micro Crystal MS1V- DNP: Keep vias free of15 Q1, Q2 0 Crystal T1K 32.768kHz, C(Load) = solder12.5pF

16 R3 1 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,R6, R7, R8, DNP: R4, R6, R7, R8, R9,17 2 0 Ω, SMD0805 541-000ATR-NDR9, R10, R10, R11, R12R11, R12

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi20 PCB 1 90 x 82 mm 4 layers

Rubber Apply to corners at bottom21 4 Select appropriatestandoff sideDNP: Enclosed with kit22 MSP430 2 MSP430F5438IPZ supplied by TI



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www.ti.com MSP-TS430PZ100B

B.26 MSP-TS430PZ100B

Figure B-51. MSP-TS430PZ100B Target Socket Module, Schematic



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JP11, JP12, JP13Connect 1-2 to connectAUXVCCx with DVCC ordrive AUXVCCx externally



MSP-TS430PZ100B www.ti.com

Figure B-52. MSP-TS430PZ100B Target Socket Module, PCB



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www.ti.com MSP-TS430PZ100B

Table B-28. MSP-TS430PZ100B Bill of MaterialsNo. perPosition Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNPC4, C5,

2 C6 , C7, 6 100nF, SMD0805 311-1245-2-NDC8, C9

3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND4 C11, C12 1 10 uF / 6.3 V SMD0805 C12 DNP

C13, C14,5 C16, C18, 6 4.7 uF SMD0805

C19, C296 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-25-ND DNP: Headers and receptaclesJ1, J2, J3,7 0 25-pin header, TH (Header) SAM1213-25- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:8 J5 1 3-pin header, male, TH

JP3, JP5, place jumpers on pins 2-3 on JP5,JP6, JP7,9 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 placeJP8, JP9, jumpers on pins 1-2 on JP3,JP10JP1, JP2,10 3 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4

JP11,11 3 4-pin header, male, TH place jumper on header 1-2JP12, JP1312 13 Jumper 15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11

14-pin connector, male,15 JTAG 1 HRP14H-NDTH10-pin connector, male,16 BOOTST 0 "DNP Keep vias free of solder"TH

17 Q1 0 Crystal DNP: Q1 Keep vias free of solder21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2,R4, R6,22 2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11R8, R10,

R1123 R5 1 47k Ω, SMD0805 541-47000ATR-ND24 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi25 PCB 1 90 x 82 mm 2 layers

for example, 3MAdhesive Approximately 6mm26 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet width, 2mm height 530227 MSP430 2 MSP430F6733IPZ DNP: enclosed with kit, supplied by TI



http://www.ti.com


DN

PD

NP

DN

P

DN

P

DN

P

DN

P

0R

12pF

12pF

47pF

47pF

GN

D

0R

100nF

330R

10 /6.3uF V

10 /6.3uF V

2.2

nF

PWR3

GN

D

GN

D

GN

D

GN

D0R

330R

47K

100nF

100nF

PT

RN

D516

-

470nF

100nF

100nF

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0R

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0R

GN

D

VCC

100nF

GN

D

100nF

100nF

GN

D

100nF

LL

A103

GN

D

4.7n

HCTC XTL_ _4

HCTC XTL_ _4

HCTC XTL_ _4

HCTC XTL_ _4

GN

D

0R

0R

GN

DG

ND

GN

D

4.7uF

GN

D

100nF

220nF

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D

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LL A103

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P

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C2

C1

C3

C4

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C5

R3

C6

C7

C8

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J5

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75

74

73

72

71

70

69

68

67

66

65

60

59

58

57

56

55

54

53

52

51

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24

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15

16

17

18

19

20

21

22

23

24

25

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J2

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

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J3

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1 2 3

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C17

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C14

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21Q G1 $1

43Q G1 $2

2 1

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12

34

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78

910

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R10

R11

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C20

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T

XTLGND2

XTLGND1

PU.0

PU.1

P1.6P1.7

P8.0

P8.1

P8.2

VBAKVBAT

VBAT

VB

AT

P1.1

P1.1

P1.2

P1.2

LD

OI

LDOI

LD

OO

LDOO

BS

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LD

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LD

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rnal

3

MSP-TS430PZ100C www.ti.com

B.27 MSP-TS430PZ100C

Figure B-53. MSP-TS430PZ100C Target Socket Module, Schematic



http://www.ti.com


Connector J5


Jumper JP3 to "ext"

If the system should

be supplied via LDOI (J6),

close JP4 and

set JP3 to external

Jumper JP2




Jumpers JP5 to JP10

Close 1-2 to debug in Spy -Bi-Wire

mode

Close 2-3 to debug in 4-wire JTAG

modeLDOI LDOO/

14

1

2

GN

D

GN

D

VC

C

125

510

15

20

26 5030 3540 45 51

75

55

60

65

70

76100 80859095

12

3

123

123

123

123

123

1231 2 3 4

10

1

2

1 2 3

1

JTA

GS

BW

Vcc

int

ext

GN

D

VB

AT

DV

CC

JTA

G

R2

C2

C1

C3

C4

R1

C5

R3+C6

+

C7

C8

J5

U1

J1

J2

J3

J4

JP

1

JP2

R4

JP

5

JP

6

JP7

JP

8

JP

9

JP

10

R7

R5

C11

C12

D1

C9

C13

C10

R6

R8

R9

R12

JP3

C17

C18

C19

C14

D3

C16

JP11

Q1

Q2

BOOTSTR10

R11

C15

C20

C21

JP

4

D4

J6

www.ti.com MSP-TS430PZ100C

Figure B-54. MSP-TS430PZ100C Target Socket Module, PCB



http://www.ti.com


MSP-TS430PZ100C www.ti.com

Table B-29. MSP-TS430PZ100C Bill of MaterialsNumber

Pos. Ref Des Per Description Digi-Key Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNP: C1, C21.1 C3, C4 2 47pF, SMD0805 DNP: C3, C42 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND

C5, C11,3 C13, C14, 6 100nF, SMD0805 311-1245-2-ND

C19, C20C10, C12,3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C18,17

4 C8 1 2.2nF, SMD0805 Buerklin 53 D 2925 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers and receptacles enclosedJ1, J2, J3,7 4 25-pin header, TH SAM1029-25-ND with kit.J4 Keep vias free of solder.DNP: headers and receptacles enclosed

7.1 4 25-pin header, TH SAM1213-25-ND with kit.Keep vias free of solder.

8 J5, J6 2 3-pin header, male, TH SAM1035-03-NDJP5, JP6,

JP7,9 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP8,JP9,JP10

10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2

Place on: JP1, JP2, JP3, JP4, JP5, JP6,12 10 Jumper 15-38-1024-ND JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND14 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder

DNP: Q115 Q1 0 CrystalKeep vias free of solder

16 Q2 1 Crystal DNP: Q2 Keep vias free of solder17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND

R1, R2, R4,R6, R8, R9,18 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11, R12R10, R11,

R1219 R5 1 47k Ohm, SMD0805 541-47000ATR-ND20 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi

MSP-TS430PZ100C21 PCB 1 79.5 x 99.5 mm 2 layersRev 1.0Rubber22 4 Buerklin: 20H1724 apply to corners at bottom sidestand off

DNP: enclosed with kit. Is supplied by23 MSP430 2 MSP430F643xTI.

24 C16 1 4.7 nF SMD0603 Buerklin 53 D 204226 D3, D4 2 LL103A Buerklin: 24S340627 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and Pin 228 C15 1 4.7 uF, SMD0805 Buerklin 53 D 243029 C21 1 220nF, SMD0805 Buerklin 53 D 2381



http://www.ti.com


www.ti.com MSP-TS430PZ5x100

B.28 MSP-TS430PZ5x100

Figure B-55. MSP-TS430PZ5x100 Target Socket Module, Schematic



http://www.ti.com


Connector J5External power connector

Jumper J3 to ‘ext’


Jumpers JP5 to JP10Close 1-2 to debug in

Spy-Bi-Wire mode.Close 2-3 to debug in

4-wire JTAG mode.



Jumper JP31-2 (int): Power supply via JTAG debug interface2-3 (ext): External power supply

MSP-TS430PZ5x100 www.ti.com

Figure B-56. MSP-TS430PZ5x100 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PZ5x100

Table B-30. MSP-TS430PZ5x100 Bill of MaterialsNo. PerPos. Ref Des Description DigiKey Part No. CommentBoard

1 C1, C2 0 12pF, SMD0805 DNPDNP: Only recommendation.1b C3, C4 47pF, SMD0805 Check your crystal spec.

2 C6, C7 2 10uF, 10V, Tantal Size B 511-1463-2-NDC5, C10,

3 C11, C12, 4 100nF, SMD0805 311-1245-2-ND DNP: C12, C14C13, C14

4 C8 0 2.2nF, SMD0805 DNP5 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 67-1553-1-ND

DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7 J1, J2, J3, J4 0 25-pin header, TH



9 JP7, JP8, 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP9, JP10

10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2

Place on JP1, JP2, JP3, JP5,12 9 Jumper 15-38-1024-ND JP6, JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND


16 R3, R7 2 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,R6, R8, R9, DNP: R6, R8, R9, R10, R11,17 3 0 Ω, SMD0805 541-000ATR-NDR10, R11, R12

R1218 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi20 PCB 1 90 x 82 mm 2 layers

Rubber Apply to corners at bottom21 4 Select appropriatestandoff sideDNP: Enclosed with kit22 MSP430 2 MSP430F5438IPZ supplied by TI



http://www.ti.com


MSP-TS430PZ100USB www.ti.com

B.29 MSP-TS430PZ100USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.

Figure B-57. MSP-TS430PZ100USB Target Socket Module, Schematic



http://www.ti.com


www.ti.com MSP-TS430PZ100USB

Figure B-58. MSP-TS430PZ100USB Target Socket Module, PCB



http://www.ti.com


MSP-TS430PZ100USB www.ti.com

Table B-31. MSP-TS430PZ100USB Bill of MaterialsNo. PerPos. Ref Des Description DigiKey Part No. CommentBoard


C5, C11,3 C13, C14, 5 100nF, SMD0805 311-1245-2-ND

C19C10, C12,3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C18, C17

4 C8 1 2.2nF, SMD08055 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers andreceptacles enclosed with kit.

7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND Keep vias free of solder.: Header: ReceptacleDNP: headers andreceptacles enclosed with kit.

7.1 4 25-pin header, TH SAM1213-25-ND Keep vias free of solder.: Header: Receptacle


9 JP7, JP8, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP9, JP10JP1, JP2,10 3 2-pin header, male, TH SAM1035-02-ND place jumper on headerJP4

11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2Place on: JP1, JP2, JP3,


13 JTAG 1 14-pin connector, male, TH HRP14H-NDMicro Crystal MS1V-T1K DNP: Q1. Keep vias free of14 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF

15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D13416 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R12

R1218 R10 1 100 Ω, SMD0805 Buerklin: 07E50018 R11 1 1M Ω, SMD0603 not existing in Rev 1.018 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket:IC201-1004-008 Manuf.: Yamaichi20 PCB 1 79 x 77 mm 2 layers

Rubber stand apply to corners at bottom21 4 Buerklin: 20H1724off sideDNP: enclosed with kit. Is22 MSP430 2 MSP430F5529 supplied by TI

http://www.ettinger.de/Art_DeInsulating23 1 Insulating disk to Q2 tail.cfm?ART_ARTNUM=70.0disk to Q2 8.12124 C16 1 4.7 nF SMD060327 C33 1 220n SMD0603 Buerklin: 53D207428 C35, C36 2 10p SMD0603 Buerklin: 56D102



http://www.ti.com


www.ti.com MSP-TS430PZ100USB

Table B-31. MSP-TS430PZ100USB Bill of Materials (continued)No. PerPos. Ref Des Description DigiKey Part No. CommentBoard

30 C38 1 220n SMD0603 Buerklin: 53D207431 C39 1 4u7 SMD0603 Buerklin: 53D208632 C40 1 0.1u SMD0603 Buerklin: 53D206833 D2, D3, D4 3 LL103A Buerklin: 24S340634 IC7 1 TPD4E004 Manu: TI35 LED 0 JP3QE SAM1032-03-ND DNP

LED1, LED2,36 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNPLED3R13, R15,37 0 470R SMD0603 Buerklin: 07E564 DNPR16

38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E61239 R34 1 27R SMD0603 Buerklin: 07E44440 R35 1 27R SMD0603 Buerklin: 07E44441 R36 1 33k SMD0603 Buerklin: 07E74042 S1, S2, S3 1 PB P12225STB-ND DNP S1 and S2. (Only S3)43 USB1 1 USB_RECEPTACLE FARNELL: 117-788544 JP11 1 4-pin header, male, TH SAM1035-04-ND place jumper only on Pin 1



http://www.ti.com


0R

12pF

12pF

GN

D

GN

D

0R

100nF

330R

2.2

nF

0R

0R

PWR3

GN

D

330R

47K

0R

0R

100nF

4.7

uF

GN

D

GN

D

100nF470nF

0R

QUARZ5

100nF

10uF

/6,3

V

10uF

/6,3

V

100nF

4.7

uF

4.7

uF

100nF

4.7uF

4.7

uF

4.7

uF

470nF

FE

04-1

VC

C

GN

D

GN

D

100nF

4.7uF

GN

D

GN

D

GN

D

GN

D

GN

D

VCC1

VC

C1

VC

C1

VC

C1

VC

C1

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

AV

SS

AV

SS

AV

CC

DV

CC

GND

VC

C

VCC

GN

D

MS

P4

30

:Ta

rge

t-So

cke

t

MS

P-T

S4

30

PE

U1

28

for

F6

77

9

Pe

ters

en

10

80

/1/0

01

/01

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DN

P

LF

XT

CL

K

DN

P

<-

SB

W

<-

JTA

G

DN

P

Vcc

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DN

P

DN

P

DN

P

DNP

DN

P

DN

P

DN

P

DV

DS

YS

1.1

12345678910

1112

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

J1

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

J2

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

101

102

J3

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126127

128

J4

1 3 5 7 9 11 13

2 4 6

12

148

10

JTA

G

R2

C2

C1

R1

C5

R3

12

34

56

78

910

BO

OT

ST

C3

R10

R11

J51

2

3

12

JP

1

JP

2

1 2

123

JP

5123

JP

6123

JP

7123

JP

8123

JP

9123 JP

10

R7

R5

D1

R6

R8

C6

C29

C7

C10

R4

Q1

JP

12

1234

1234

JP

11

JP

13

1234

C4

C11

C12

C8

C13

C14

C9

C16

C19

C18

C26

1

2

JP

4

JP

3

1 2 3 4

C15

C17

TP1 TP2

IC1

MS

P430F

677X

IPE

U#

XIN

1

XO

UT

2

AU

XV

CC

33

RT

CC

AP

14

RT

CC

AP

05

P1.5

/SM

CLK

/CB

0/A

56

P1.4

/MC

LK

/SD

CLK

/CB

1/A

47

P1.3

/AD

C10C

LK

/TA

CLK

/RT

CC

LK

/A3

8

P1.2

/AC

LK

/TA

3.1

/A2

9

P1.1

/TA

2.1

/VE

RE

F+

/A1

10

P1.0

/TA

1.1

/TA

0.0

/VE

RE

F-/A

011

P2.4

/PM

_TA

2.0

12

P2.5

/PM

_U

CB

0S

OM

I/PM

_U

CB

0S

CL

13

P2.6

/PM

_U

SB

0S

IMO

/PM

_U

CB

0S

DA

14

P2.7

/PM

_U

CB

0C

LK

15

P3.0

/PM

_U

CA

0R

XD

/PM

_U

CA

0S

OM

I16

P3.1

/PM

_U

CA

0T

XD

/PM

_U

CA

0S

IMO

17

P3.2

/PM

_U

CA

0C

LK

18

P3.3

/PM

_U

CA

1C

LK

19

P3.4

/PM

_U

CA

1R

XD

/PM

_U

CA

1S

OM

I20

P3.5

/PM

_U

CA

1T

XD

/PM

_U

CA

1S

IMO

21

CO

M0

22

CO

M1

23

P1.6

/CO

M2

24

P1.7

/CO

M3

25

P5.0

/CO

M4

26

P5.1

/CO

M5

27

P5.2

/CO

M6

28

P5.3

/CO

M7

29

LC

DC

AP

/R33

30

P5.4

/SD

CLK

/R23

31

P5.5

/SD

0D

IO/L

CD

RE

F/R

13

32

P5.6

/SD

1D

IO/R

03

33

P5.7

/SD

2D

IO/C

B2

34

P6.0

/SD

3D

IO35

P3.6

/PM

_U

CA

2R

XD

/PM

_U

CA

2S

OM

I36

P3.7

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CA

2T

XD

/PM

_U

CA

2S

IMO

37

P4.0

/PM

_U

CA

2C

LK

38

P4.1/PM_UCA3RXD/PM_UCA3SOMI39

P4.2/PM_UCA3TXD/PM_UCA3SIMO40

P4.3/PM_UCA3CLK41

P4.4/PM_UCB1SOMI/PM_UCB1SCL42

P4.5/PM_UCB1SIMO/PM_UCB1SDA43

P4.6/PM_UCB1CLK44

P4.7/PM_TA3.045

P6.1/SD4DIO/S3946

P6.2/SD5DIO/S3847

P6.3/SD6DIO/S3748

P6.4/S3649

P6.5/S3550

P6.6/S3451

P6.7/S3352

P7.0/S3253

P7.1/S3154

P7.2/S3055

P7.3/S2956

P7.4/S2857

P7.5/S2758

P7.6/S2659

P7.7/S2560

P8.0/S2461

P8.1/S2362

P8.2/S2263

P8.3/S2164

P8.4

/S20

65

P8.5

/S19

66

P8.6

/S18

67

P8.7

/S17

68

DV

SY

S69

DV

SS

270

P9.0

/S16

71

P9.1

/S15

72

P9.2

/S14

73

P9.3

/S13

74

P9.4

/S12

75

P9.5

/S11

76

P9.6

/S10

77

P9.7

/S9

78

P10.0

/S8

79

P10.1

/S7

80

P10.2

/S6

81

P10.3

/S5

82

P10.4

/S4

83

P10.5

/S3

84

P10.6

/S2

85

P10.7

/S1

86

P11

.0/S

087

P11

.1/T

A3.1

/CB

388

P11

.2/T

A1.1

89

P11

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A2.1

90

P11

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BO

UT

91

P11

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AC

LK

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CC

LK

92

P2.0

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0.0

93

P2.1

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0.1

94

P2.2

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_TA

0.2

95

P2.3

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_TA

1.0

96

TE

ST

/SB

WT

CK

97

PJ.0

/TD

O98

PJ.1

/TD

I/TC

LK

99

PJ.2

/TM

S100

PJ.3

/TC

K101

~R

ST

/NM

I/SB

WT

DIO

102

SD0P0103

SD0N0104

SD1P0105

SD1N0106

SD2P0107

SD2N0108

SD3P0109

SD3N0110

VASYS2111

AVSS2112

VREF113

SD4P0114

SD4N0115

SD5P0116

SD5N0117

SD6P0118

SD6N0119

AVSS1120

AVCC121

VASYS1122

AUXVCC2123

AUXVCC1124

VDSYS125

DVCC126

DVSS1127

VCORE128

P1.0

P1.0

P2.0

P2.0

P2.1

P2.1

SD0P0SD0N0SD1P0SD1N0SD2P0SD2N0SD3P0SD3N0

SD4P0SD4N0SD5P0SD5N0SD6P0SD6N0

VA

SY

S1/2

VASYS1/2

VASYS1/2

VA

SY

S1/2

TM

ST

MS

TD

I

TD

I

TD

O

TD

O

TD

O

XO

UT

GN

D

GND

XIN

DVCC

AVCC

DV

DS

YS

DV

DS

YS

DV

DS

YS

DVDSYS

AVSS

AVSS

PJ.2

PJ.2

PJ.1

PJ.1

PJ.0

PJ.0

RS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

KP

J.3

PJ.3

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

RS

T

RS

T

RS

T

RS

T

LC

DC

AP

LC

DC

AP

VR

EF

VREF

VE

RE

F+

VE

RE

F+

VCORE

AU

XV

CC

2

AUXVCC2

AU

XV

CC

1

AUXVCC1

AU

XV

CC

3

AU

XV

CC

3

1 2 3 4 5 6

1 2 3 4 5 6

Tite

l:

Da

tum

:

Be

arb

.:

Se

ite1

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MS

P-T

S4

30

PE

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28

22

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12

09

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A3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Do

k:

Re

v.:

MSP-TS430PEU128 www.ti.com

B.30 MSP-TS430PEU128

Figure B-59. MSP-TS430PEU128 Target Socket Module, Schematic



http://www.ti.com


1

P1.0

SB

W

JTA

G

DVDSYS

ext

int

MSP-TS430PEU128

Rev. 1.1 RoHS

DVCC

AUXVCC

GND

AU

XV

CC

1

AU

XV

CC

2

AU

XV

CC

3

GND

GND

RST/NMI

TCK

TDI

TDO

TEST/SBWTCK

TMS

12

55

10

15

20

30

35

6040 45 50 55 64

65

90

70

75

80

85

95

10

0

125 105110115120128

14

12

10

12G

ND

GN

D

VC

C

123

123

123

123

123

123

12

34

12

34

12

34

1

J1

J2

J3

J4

JTA

G

R2

C2

C1

R1

C5R3

BOOTST

C3

R1

0R

11

J5

JP

1

JP

2

JP5

JP6

JP7

JP8

JP9

JP

10

R7

R5

D1

R6

R8

C6

C29

C7

C1

0

R4

JP

12

JP

11

JP

13

C4

C11

C1

2

C8

C1

3

C1

4

C9

C1

6

C1

9

C1

8

C2

6

JP

4

JP3

C1

5

C1

7

TP1

TP2

IC1



Orient Pin 1 ofMSP430 device


JP11, JP12, JP13Connect 1-2 to connectAUXVCCx with DVCC ordrive AUXVCCx externally



www.ti.com MSP-TS430PEU128

Figure B-60. MSP-TS430PEU128 Target Socket Module, PCB

NOTE: The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:• R7 value is changed to 0 Ω instead of 330 Ω.• JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2.• JP5 pin 2 is connected to IC1 pin 97.• BOOTST pin 7 is connected to IC1 pin 97.



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MSP-TS430PEU128 www.ti.com

Table B-32. MSP-TS430PEU128 Bill of MaterialsNo. PerPos. Ref Des Description DigiKey Part No. CommentBoard

94x119.4mm, 4 layers MSP-TS430PEU128 4 layers, green solder mask1 PCB 1 Rev. 1.1

2 D1 1 green LED, DIODE0805 516-1434-1-ND

3 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

JP5, JP6, JP7, JP8, 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW)4 6JP9, JP10

5 JP11, JP12, JP13 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC)

6 JP3 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2

JP1, JP2, JP3, JP4, Jumper WM4592-NDJP5, JP6, JP7, JP8,7 13JP9, JP10, JP11,

JP12, JP13

8 R1, R2, R4, R6, R8 5 0R, 0805 541-0.0ATR-ND

9 R10, R11 2 0R, 0805 541-0.0ATR-ND DNP

10 C3 1 2.2nF, CSMD0805 490-1628-2-ND DNP

C13, C14, C16, 4.7uF, 6.3V, CSMD0805 587-1302-2-ND11 7C17, C18, C19, C29

12 C11 1 10uF, 6.3V, CSMD0805 445-1372-2-ND

13 C12 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP

14 C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP

15 R5 1 47K, 0805 311-47KARTR-ND

C4, C5, C6, C7, C8, 100nF, CSMD0805 311-1245-2-ND16 6C15

17 C9 1 100nF, CSMD0805 311-1245-2-ND DNP

18 R3, R7 2 330R, 0805 541-330ATR-ND

19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND

20 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder

21 JTAG 1 14-pin connector, male, TH HRP14H-ND

22 IC1 Socket 1 Socket: IC500-1284-009P Manuf. Yamaichi

23 IC1 2 MSP430F67791IPEU DNP: enclosed with kit. Is supplied by TI

24 J5 1 3-pin header, male, TH SAM1035-03-ND

Crystal: MS3V-T1R 32.768kHz DNP: Crystal enclosed with kit. Keep vias25 Q1 1 12.5pF ±20ppm free of solder

26 TP1, TP2 2 Test point DNP, keep vias free of solder

26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias27 J2,J4 2 free of solder.

26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep28 J2,J4 2 vias free of solder.

38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias29 J1, J3 2 free of solder.

38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep30 J1, J3 2 vias free of solder.

31 Rubber feet 4 Rubber feet Buerklin: 20H1724 apply to bottom side corners



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PowerManagement

VCC

exte

rnalVCC

01 =

Vdd

DVCC

=

Vdda

AVDD

RF

AVCC

RF

1 =

_/

_

Vdda

AVCC

2 =

Port

connecto

rs

CON1 ..

CON

Port

Port

ofcc

3 =

1 ..

3430

CON

spare

4 =

CON

XIN

XOUT

5 =

1:

2:

CON

Vdd

GND

Vco

re6 =

,,

,COM

LCDCAP

0,

CON

Vdda

Vdda

GND

7 =

1,

2,

,AGND

CON

JTAG

BASE

8 =

_(

)JTA

GPort

CON

Vdd

GND

AGND

9 =

,,

(Maybe

addedclose

totheres

pective

pins

toreduce

emissio

ns

at

GHztolevel

5require

dbyET

SI)

www.ti.com EM430F5137RF900

B.31 EM430F5137RF900

Figure B-61. EM430F5137RF900 Target board, Schematic



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JTAG connector

External power connectorCON12

GNDGNDVCC

Open to disconnect LEDsjumper JP5/JP10

LED D2 (red) connected toP3.6 via JP10

LED D1 (green) connectedto P1.0 via JP5

RF - Crystal Q1 26 MHz

RF - Signal SMA

Reset button S1

Push-button S2connected to P1.7

Jumper JP1Close JTAGposition todebug inJTAG mode

Jumper JP2Close EXT for external supplyClose INT for JTAG supply

Close SBW positionto debug inSpy-Bi-Wire mode

Jumper JP1Spy-Bi-Wire mode

Footprint for 32kHz crystal

Use 0 resistor for R431/R441to make XIN/XOUT availableon connector port5

Ω

Open to measure currentjumper JP3

EM430F5137RF900 www.ti.com

Figure B-62. EM430F5137RF900 Target board, PCB

The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.



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Table B-33. EM430F5137RF900 Bill of MaterialsNo. per Manufacturer's PartItem Reference Description Value Manufacturer CommentBoard Number

( CUSTOMER SUPPLY ) CRYSTAL, AKER1 Q1 1 26M ASX-531(CS)SMT, 4P, 26MHz ELECTRONIC

C1-C5, C082,C222, C271, CAPACITOR, SMT, 0402, CER, 16V,2 C281, C311, 14 0.1uF 0402YC104KAT2A AVX10%, 0.1uFC321, C341,C412, C452

CAPACITOR, SMT, 0603, CERAMIC,3 C071 1 0.47uF 0603YD474KAT2A AVX0.47uF, 16V, 10%, X5R

CRCW04024702F104 R401 1 RES0402, 47.0K 47kΩ DALE0

HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm

HEADER, THU, MALE, 10P, 2X5,6 CON10 0 09 18 510 6323 HARTING DNP20.32x9.2x9.45mm

7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT

8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT

UNINSTALLED CRYSTAL, SMT, 3P, MICRO9 Q3 0 32.768k MS1V-T1K (UN) DNPMS1V (Customer Supply) CRYSTAL

HEADER, THU, MALE, 3P, 1x3,10 CON12 1 22-03-5035 MOLEX9.9x4.9x5.9mm

11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATA

12 L341 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA 1kΩ BLM15HG102SN1D MURATA

CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H101JZ13 C293 1 100pF MURATA100pF, 50V, 0.25pF, C0G(NP0) 01

INDUCTOR, SMT, 0402, 2.2nH, 0.1nH,14 L304 1 0.0022uH LQP15MN2N2B02 MURATA220mA, 500MHz

INDUCTOR, SMT, 0402, 15nH, 2%,15 L303, L305 2 0.015uH LQW15AN15NG00 MURATA450mA, 250MHz


CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H1R0W17 C291 1 1pF MURATA1pF, 50V, 0.05pF, C0G(NP0) Z01

CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H8R2W18 C303 1 8.2pF MURATA8.2pF, 50V, 0.05pF, C0G(NP0) Z01

C292, C301- CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H1R5W19 4 1.5pF MURATAC302, C304 1.5pF, 50V, 0.05pF, C0G(NP0) Z01


C282, C312, CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H2R0B21 C351, C361, 5 2.0pF Murata2pF, 50V, 0.1pF, C0G Z01C371

INDUCTOR, SMT, 0402, 6.2nH, 0.1nH,22 L1 1 6.2nH LQP15MN6N2B02 Murata130mA, 500MHz

ULTRA-SMALL TACTILE SWITCH, SMT,23 S1-S2 2 B3U-1000P OMRON2P, SPST-NO, 1.2x3x2.5mm, 0.05A, 12V

R4-R5, R051, UNINSTALLED RESISTOR/JUMPER,24 R061, R431, 0 0Ω ERJ-2GE0R00X PANASONIC DNPSMT, 0402, 0 Ω, 5%, 1/16WR441

RESISTOR/JUMPER, SMT, 0402, 0 Ω,24a R7 1 0Ω ERJ-2GE0R00X PANASONIC5%, 1/16W

RESISTOR, SMT, 0402, THICK FILM,25 R2-R3, R6 3 330Ω ERJ-2GEJ331 PANASONIC5%, 1/16W, 330

CAPACITOR, SMT, 0402, CER, 12pF,26 C431, C441 0 12pF ECJ-0EC1H120J PANASONIC50V, 5%, NPO

CAPACITOR, SMT, 0402, CER, 2200pF,27 C401 1 0.0022uF ECJ-0EB1H222K PANASONIC50V, 10%, X7R

RESISTOR, SMT, THICK FILM, 56K,28 R331 1 56kΩ ERJ-2GEJ563 PANASONIC1/16W, 5%

C081, C221, CAPACITOR, SMT, 0603, CERAMIC,29 4 10uF ECJ-1VB0J106M PANASONICC411, C451 10uF, 6.3V, 20%, X5R



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Table B-33. EM430F5137RF900 Bill of Materials (continued)No. per Manufacturer's PartItem Reference Description Value Manufacturer CommentBoard Number

RESISTOR/JUMPER, SMT, 0402, 0 Ω,30 R1 1 0Ω ERJ-2GE0R00X PANASONIC5%, 1/16W

UNINSTALLED CAP CERAMIC 4.7UF31 C041 0 4.7uF ECJ-1VB0J475K Panasonic DNP6.3V X5R 0603

32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER

33 Q2 0 Crystal, SMT, 32.768 kHz 32.768k MS3V-T1R Micro Crystal DNP

DUT, SMT, PQFP, RGZ-48, 0.5mmLS,34 U1 1 CC430F52x1 TI7.15x7.15x1mm, THRM.PAD

35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH

36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP

37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH

JP3, JP5,38 3 Pin Connector 1x2pin 61300211121 WUERTHJP10

38a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP

39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP

40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH



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PowerManagement

VCC

exte

rnalVCC

01 =

Vdd

DVCC

=

Vdda

AVDD

RF

AVCC

RF

1 =

_/

_

Vdda

AVCC

2 =

Port

connecto

rs

CON1 ..

CON

Port

Port

ofcc

5 =

1 ..

5430

CON

Vdd

GND

Vco

re6 =

,,

,COM

LCDCAP

0,

CON

Vdda

Vdda

GND

7 =

1,

2,

,AGND

CON

JTAG

BASE

8 =

_(

)JTA

GPort

CON

Vdd

GND

AGND

9 =

,,

(Maybeaddedclose

totherespectiv

epins

toreduceem

issio

ns

at

GHz

tolev

el5

require

dby

ETSI)


B.32 EM430F6137RF900

Figure B-63. EM430F6137RF900 Target board, Schematic



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JTAG connector

External power connectorCON12

GNDGNDVCC

Open to disconnect LEDsjumper JP5/JP10

LED D2 (red) connected toP3.6 via JP10

LED D1 (green) connectedto P1.0 via JP5

RF - Crystal Q1 26 MHz

RF - Signal SMA

Reset button S1

Push-button S2connected to P1.7

Jumper JP1Close JTAGposition todebug inJTAG mode

Jumper JP2Close EXT for external supplyClose INT for JTAG supply

Close SBW positionto debug inSpy-Bi-Wire mode

Jumper JP1Spy-Bi-Wire mode

Footprint for 32kHz crystal

Use 0 resistor for R541/R551to makeP5.0/P5.1 availableon connector port5

Ω

Open to measure currentjumper JP3

C392

C422

L451


Figure B-64. EM430F6137RF900 Target board, PCB

The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.



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Table B-34. EM430F6137RF900 Bill of MaterialsNo.

Pos. Ref Des per Description Part No. ManufacturerBoard

( CUSTOMER SUPPLY ) CRYSTAL, SMT, AKER1 Q1 1 ASX-531(CS)4P, 26MHz ELECTRONICC1-C5, C112,C252, C381, CAPACITOR, SMT, 0402, CER, 16V, 10%,2 C391, C421, 14 0402YC104KAT2A AVX0.1uFC431, C451,C522, C562

CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,3 C101 1 0603YD474KAT2A AVX16V, 10%, X5R4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE

HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm, 90deg7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT

HEADER, THU, MALE, 3P, 1x3,10 CON12 1 22-03-5035 MOLEX9.9x4.9x5.9mm11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA12 L451 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA BLM15HG102SN1D MURATA

CAPACITOR, SMT, 0402, CERAMIC, 100pF,13 C403 1 GRM1555C1H101JZ01 MURATA50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,14 L414 1 LQW15AN2N2C10 MURATA1000mA, 250MHzINDUCTOR, SMT, 0402, 15nH, ±5%, 460mA,15 L413, L415 2 LQW15AN15NJ00 MURATA250MHzINDUCTOR, SMT, 0402, 18nH, ±5%, 370mA,16 L402, L412 2 LQW15AN18NJ00 MURATA250MHzCAPACITOR, SMT, 0402, CER, 1pF, 50V,17 C401 1 GJM1555C1H1R0CB01D MURATA±0.25pF, NP0CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,18 C413 1 GRM1555C1H8R2CZ01 MURATA50V, ±0.25pF, C0G(NP0)

C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,19 4 GRM1555C1H1R5CZ01 MURATAC412, C414 50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,20 L401, L411 2 LQW15AN12NJ00 MURATA250MHz

C46-C48, CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,21 5 GRM1555C1H2R0CZ01 MurataC392, C422 50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH,22 L1 1 LQW15AN6N2D00 Murata700mA, 250MHzULTRA-SMALL TACTILE SWITCH, SMT, 2P,23 S1-S2 2 B3U-1000P OMRONSPST-NO, 1.2x3x2.5mm, 0.05A, 12VRESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,24 R7 1 ERJ-2GE0R00X (UN) PANASONIC1/16WRESISTOR, SMT, 0402, THICK FILM, 5%,25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC1/16W, 330CAPACITOR, SMT, 0402, CER, 2200pF,27 C511 1 ECJ-0EB1H222K PANASONIC50V, 10%, X7R

C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 10uF,28 4 ECJ-1VB0J106M PANASONICC521, C561 6.3V, 20%, X5R28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC

RESISTOR, SMT, THICK FILM, 56K, 1/16W,29 R441 1 ERJ-2RKF5602 PANASONIC1%RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,30 R1 1 ERJ-2GE0R00X PANASONIC1/16W

31 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER



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Table B-34. EM430F6137RF900 Bill of Materials (continued)No.


DUT, SMT, PQFP, RGC-64, 0.5mmLS,33 U1 1 CC430F6137 TI9.15x9.15x1mm, THRM.PAD34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH35 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH



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B.33 EM430F6147RF900

Figure B-65. EM430F6147RF900 Target Board, Schematic



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Figure B-66. EM430F6147RF900 Target Board, PCB

The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.



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Table B-35. EM430F6147RF900 Bill of MaterialsNo.


( CUSTOMER SUPPLY ) CRYSTAL, SMT, AKER1 Q1 1 ASX-531(CS)4P, 26MHz ELECTRONICC1-5 C112C252 C381 CAPACITOR, SMT, 0402, CER, 16V, 10%,2 C391 C421 14 0402YC104KAT2A AVX0.1uFC431 C451C522 C562

CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,3 C101 1 0603YD474KAT2A AVX16V, 10%, X5R4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE

HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm, 90deg7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT

HEADER, THU, MALE, 3P, 1x3,10 CON12 1 22-03-5035 MOLEX9.9x4.9x5.9mm11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA

CAPACITOR, SMT, 0402, CERAMIC, 100pF,13 C403 1 GRM1555C1H101JZ01 MURATA50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,14 L414 1 LQW15AN2N2C10 MURATA1000mA, 250MHzInductor, SMD, 0402, 15nH, 5%, 370mA,15 L413 1 LQW15AN15NJ00 MURATA250MHzINDUCTOR,SMT,0402,15nH,±5%,460mA,25015 L415 1 LQW15AN15NJ00 MURATAMHzInductor, SMD, 0402, 18nH, 5%, 460mA,16 L402, L412 2 LQW15AN18NJ00 MURATA250MHzCAPACITOR, SMT, 0402, CER, 1pF, 50V,17 C401 1 GJM1555C1H1R0CB01D MURATA±0.25pF, NP0CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,18 C413 1 GRM1555C1H8R2CZ01 MURATA50V, ±0.25pF, C0G(NP0)

C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,19 4 GRM1555C1H1R5CZ01 MURATAC412, C414 50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,20 L1, L401, L411 3 LQW15AN12NJ00 MURATA250MHz

C46-C48, CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,21 4 GRM1555C1H2R0CZ01 MURATAC392 50V, ±0.25pF, C0G(NP0)Inductor, SMD, 0805, 2.2uH, 20%, 600mA,22 L2 1 LQM21PN2R2MC0 MURATA50MHzULTRA-SMALL TACTILE SWITCH, SMT, 2P,23 S1-S2 2 B3U-1000P OMRONSPST-NO, 1.2x3x2.5mm, 0.05A, 12V

R1, R7, R551, RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,24 4 ERJ-2GE0R00X (UN) PANASONICR554 1/16WRESISTOR, SMT, 0402, THICK FILM, 5%,25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC1/16W, 330CAPACITOR, SMT, 0402, CER, 2200pF,27 C511 1 ECJ-0EB1H222K PANASONIC50V, 10%, X7R

C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 1uF,28 4 ECJ-1VB0J105K PANASONICC521, C561 6.3V, 20%, X5R28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC

RESISTOR, SMT, THICK FILM, 56K, 1/16W,29 R441 1 ERJ-2RKF5602 PANASONIC1%30 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER



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Table B-35. EM430F6147RF900 Bill of Materials (continued)No.


DUT, SMT, PQFP, RGC-64, 0.5mmLS,31 U1 1 CC430F6147 TI9.15x9.15x1mm, THRM.PADIC, Step Down Converter with Bypass Mode33 U2 1 TPS62370 TIfor Low Power Wireless

34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH

JP3, JP5, JP9,36a 4 Pin Connector 1x2pin 61300211121 WUERTHJP1038 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA

CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,38 C041 1 MURATAX5R



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www.ti.com MSP-FET430PIF

B.34 MSP-FET430PIF

Figure B-67. MSP-FET430PIF FET Interface Module, Schematic



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MSP-FET430PIF www.ti.com

Figure B-68. MSP-FET430PIF FET Interface Module, PCB



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B.35 MSP-FET430UIF

Figure B-69. MSP-FET430UIF USB Interface, Schematic (1 of 4)



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MSP-FET430UIF www.ti.com




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Figure B-73. MSP-FET430UIF USB Interface, PCB



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B.35.1 MSP-FET430UIF Revision HistoryRevision 1.3• Initial released hardware version

Assembly change on 1.3 (May 2005)• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R

Changes 1.3 to 1.4 (Aug 2005)• J5: VBUS and RESET additionally connected• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R• U1, U7: F1612 can reset TUSB3410; R44 = 0R added• TARGET-CON.: pins 6, 10, 12, 13, 14 disconnected from GND• Firmware-upgrade option through BSL: R49, R52, R53, R54 added; R49, R52 are currently DNP• Pullups on TCK and TMS: R78, R79 added• U2: Changed from SN74LVC1G125DBV to SN74LVC1G07DBV

NOTE: Using a locally powered target board with hardware revision 1.4

Using an MSP-FET430UIF interface hardware revision 1.4 with populated R62 in conjunctionwith a locally powered target board is not possible. In this case, the target device RESETsignal is pulled down by the FET tool. It is recommended to remove R62 to eliminate thisrestriction. This component is located close to the 14-pin connector on the MSP-FET430UIFPCB. See the schematic and PCB drawings in this document for the exact location of thiscomponent.

Assembly change on 1.4a (January 2006)• R62: not populated



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Appendix CSLAU278Q–May 2009–Revised February 2014

Hardware Installation Guide

This section describes the hardware installation process of the following USB debug interfaces on a PCrunning Windows XP:• MSP-FET430UIF• eZ430-F2013• eZ430-RF2500• eZ430-Chronos• eZ430-RF2780• eZ430-RF2560• MSP-WDSxx "Metawatch"• LaunchPad (MSP-EXP430G2)• MSP-EXP430FR5739• MSP-EXP430F5529

The installation procedure for other supported versions of Windows is very similar and, therefore, notshown here.

Topic ........................................................................................................................... Page

C.1 Hardware Installation ....................................................................................... 146

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C.1 Hardware InstallationTable C-1 shows the USB VIDs and PIDs used in MSP430 tools.

Table C-1. USB VIDs and PIDs Used in MSP430 ToolsTool USB VID USB PID INF File Name

eZ430-F2013 0x0451 0xF430 usbuart3410.infeZ430-RF2500 0x0451 0xF432 430CDC.infeZ430-RF2780 0x0451 0xF432 430CDC.infeZ430-RF2560 0x0451 0xF432 430CDC.infMSP-WDSxx "Metawatch" 0x0451 0xF432 430CDC.infeZ430-Chronos 0x0451 0xF432 430CDC.infMSP-FET430UIF (1) 0x2047 0x0010 msp430tools.infLaunchPad (MSP-EXP430G2) 0x0451 0xF432 430CDC.infMSP-EXP430FR5739 0x0451 0xF432 430CDC.infMSP-EXP430F5529 0x0451 0xF432 430CDC.inf

(1) The older MSP-FET430UIF used with IAR versions before v5.20.x and CCS versions before v5.1 has VID 0x0451 and PID0xF430. With the firmware update, it is updated to the 0x2047 and 0x0010, respectively.

1. Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one ofIDEs (CCS or IAR) should be installed. The IDE installation isntalls also drivers for USB DebugInterfaces without user interaction. After IDE installation the USB Debug Interface can be connectedand will be ready to work within few seconds.

2. The driver can be also installed manually. After plug in the USB Debug Interface to USB port of the PCthe Hardware Wizard starts automatically and opens the "Found New Hardware Wizard" window.

3. Select "Install from a list or specific location (Advanced)" (see Figure C-1).

Figure C-1. Windows XP Hardware Wizard

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4. Browse to the folder where the driver information files are located (see Figure C-2).For CCS, the default folder is: c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC, orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_eZ-RF depending of firmware version of the tool.For IAR Embedded Workbench, the default folder is: <Installation Root>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART, or<Installation Root>\Embedded Workbench x.x\ 430\drivers\<Win_OS>.

Figure C-2. Windows XP Driver Location Selection Folder

5. The Wizard generates a message that an appropriate driver has been found.



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6. The wizard installs the driver files.7. The wizard shows a message that it has finished the installation of the software USB Debug Interface.8. The USB debug interface is installed and ready to use. The Device Manager lists a new entry as

shown in Figure C-3, Figure C-4, or Figure C-5.

Figure C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010



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Figure C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430



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Figure C-5. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF432



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www.ti.com Document Revision History

Document Revision HistoryVersion Changes

SLAU278 Initial release

SLAU278A Updated USB driver installation according to CCE v3.1 SR1 and CCS v4.

SLAU278B Added information about MSP-FET430U80USB, MSP-TS430PN80USB, and eZ430-Chronos.

Added bills of materials and updated some PCBs in Appendix B.SLAU278CAdded information about MSP-TS430DA38, MSP-TS430DL48, MSP-TS430PW14, MSP-TS430PW28.

Added information about MSP-TS430L092, MSP-TS430RSB40, MSP-TS430RGC64USB, MSP-TS430PZ100USB, MSP-SLAU278DFET430F5137RF900

Added jumper information for MSP-TS430L092 PCBs to Appendix B.SLAU278EAdded new supported devices in Chapter 1.

Added information about MSP-TS430PW24, MSP-TS430PW28A, MSP-TS430RHA40A, MSP-TS430RGZ48B, MSP-SLAU278F TS430RGC64B, MSP-TS430PN80A, and MSP-TS430PZ100B.

Updated MSP-TS430RSB40 schematics

SLAU278G Added information for MSP-TS430PZ100C

SLAU278H Added information for MSP-TS430D8 and MSP-TS430RGC64C

Updated Table 1-1.Replaced Figure 2-2.Added Figure 2-3.SLAU278IReplaced Figure B-37 and Figure B-67.Added Table C-1.Editorial changes throughout.

SLAU278J Added EM430F6147RF900 Section B.33.

Added battery pack connection information to all EM430Fx1x7RF900 kits.SLAU278K Added information for MSP-TS430RGZ48C and MSP-TS430PEU128.

Updated Figure B-38.

Changed descriptions in Section B.19 and Section B.30.SLAU278LChanged Figure B-60.

SLAU278M Added information for MSP430G2x44 and MSP430G2x55 in Table 1-2.

Updated Table 1-1.SLAU278NUpdated Section 2.3.

Changed Table 1-1 and Table 1-2 for MSP430TCH5E.Changed Figure 2-1 through Figure 2-3.

SLAU278OChanged FAQ 12 in Section A.1.

Changed Figure B-47, Figure B-49, and Figure B-69 through Figure B-73.

Added information about F523x, F524x, and F525x to Table 1-2 and Section B.19.SLAU278P Changed Figure B-38.

Added BSL information to note on Figure B-41.

Figure B-15, Corrected JTAG mode selection jumpers (J4 to J7).SLAU278Q Section B.19, In last sentence, corrected jumper (JP4).

Removed "RF Emission Testing" section.

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

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Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gainmaximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique àl'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

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If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and

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2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to thisproduct, or

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